An inserting device for silicon wafers of solar cells

Abstract

The present invention discloses a wafer inserting device for solar cell wafers, which relates to the technical field of photovoltaic cell wafers. It includes a support base, a feeding mechanism is arranged on one side of the support base, a material transporting mechanism is arranged on the top of the support base, a triggering mechanism is arranged on the top of the support base, a lifting mechanism is arranged on one side of the support base, and a wafer inserting basket is arranged on one side of the lifting mechanism. The triggering mechanism includes a triggering base arranged on the top of the support base, a lifting plate is movably connected to the top of the triggering base, and a triggering sliding seat is fixedly connected to the top of the bottom plate of the triggering base. For this wafer inserting device for solar cell wafers, the weight of the wafer body can drive the conductive movable block in the triggering mechanism to contact the power supply electrode plate and the output electrode plate, thereby triggering the power supply for lifting the basket to drive the basket to rise, and the power supply can be reset and cut off when the wafer is separated, so that the inserting slot is adapted to the wafer, avoiding the situation that the rising speed of the basket is not adapted to the transporting speed of the wafer and the wafer cannot be inserted accurately.

Description

Technical Field

[0001] The invention relates to the technical field of photovoltaic cell silicon wafers, and in particular to a wafer inserting device for a solar cell silicon wafer. Background Art

[0002] At present, the production of photovoltaic cell silicon wafers requires the use of a wafer inserter, which is used to insert the cell silicon wafers into the basket one by one in order to better process the cell silicon wafers. The wafer inserter has the advantages of simple structure, easy installation, convenient operation, high degree of automation, and improved work efficiency.

[0003] During the operation of the existing wafer insertion machine, the conveying mechanism conveys the battery silicon wafers and inserts the battery silicon wafers into the material basket one by one. After each insertion, the lifting mechanism drives the material basket to lift once, so that each battery silicon wafer can be inserted into the corresponding wafer slot. However, the speed of the battery silicon wafer is too fast during the insertion process, and it will collide with the inner wall at the end of the slot, which may damage the battery silicon wafer. In addition, the battery silicon wafer rubs against the bottom surface of the slot, causing wear on the bottom of the battery silicon wafer.

[0004] Chinese patent CN116995010A discloses a wafer insertion device for solar cell silicon wafers, comprising: a conveying mechanism, installed on a base frame, for conveying cell silicon wafers; a material basket, for inserting cell silicon wafers; a lifting mechanism, for driving the material basket to be lifted successively; a deceleration mechanism, arranged in the material basket, for decelerating the cell silicon wafers; the conveying mechanism conveys the cell silicon wafers into the inserting material basket, and during the process of inserting the cell silicon wafers into the material basket, the deceleration mechanism decelerates the cell silicon wafers, so that the speed of the cell silicon wafers stops when they are just completely inserted into the material basket; the device is provided with a deceleration mechanism, which decelerates the cell silicon wafers during the inserting process, thereby avoiding collision between the cell silicon wafers and the material basket, thereby achieving the purpose of protecting the cell silicon wafers.

[0005] Although the above-mentioned Chinese patent has achieved the purpose of protecting the battery silicon wafers by providing a deceleration mechanism to decelerate the battery silicon wafers during the insertion process to avoid the battery silicon wafers from colliding with the material basket; however, the device lacks an insertion trigger structure. During the transportation process, the silicon wafers on the conveyor belt are affected by the frictional wind resistance, and the transmission speed of the silicon wafers is different, which further makes the lateral transportation speed of the silicon wafers and the rising speed of the material basket not necessarily compatible, and it is easy for the silicon wafers to fail to be inserted into the material basket, affecting the overall insertion production efficiency.

[0006] Therefore, it is necessary to invent a solar cell silicon wafer inserting device to solve the above problems. Summary of the invention

[0007] The object of the present invention is to provide a chip inserting device for a solar cell silicon chip, so as to solve the problem of lack of a chip inserting triggering structure mentioned in the above background technology.

[0008] To achieve the above object, the present invention provides the following technical solutions: An inserting device for a silicon wafer of a solar cell, including a support base, on one side of the support base is provided a feeding mechanism, on the top of the support base is provided a material transporting mechanism, on the top of the support base is provided a triggering mechanism, on one side of the support base is provided a lifting mechanism, and on one side of the lifting mechanism is provided an inserting material basket; The triggering mechanism includes a triggering base provided on the top of the support base, the top of the triggering base is movably connected with a lifting plate, the bottom of the bottom plate of the triggering base is fixedly connected with a triggering sliding seat, the inside of the triggering sliding seat is movably connected with a power supply slider, the inside of the triggering sliding seat is movably connected with an output slider, the inside of the power supply slider is installed with a power supply electrode plate, the inside of the output slider is installed with an output electrode plate, and the bottom of the lifting plate is fixedly connected with a conductive movable block.

[0009] Preferably, the feeding mechanism includes a material placing seat provided on one side of the support base, the top of the material placing seat is fixedly connected with a guiding slide rail, two groups of L-shaped connecting plates are fixedly connected to the outside of the guiding slide rail, the two groups of L-shaped connecting plates are symmetrically distributed on the outside of the guiding slide rail, the guiding slide rail is fixedly connected with the material placing seat through the two groups of L-shaped connecting plates, and an I-shaped slider is movably connected inside the guiding slide rail.

[0010] Preferably, the feeding mechanism further includes a feeding cylinder provided on the top of the I-shaped slider, the bottom of the feeding cylinder is installed with a feeding output rod, the bottom of the feeding output rod is fixedly connected with a rubber suction cup, and the top of the bottom edge of the rubber suction cup is fixedly connected with two groups of lifting rods, and the two groups of lifting rods are symmetrically distributed on the top of the bottom edge of the rubber suction cup.

[0011] Preferably, the material transporting mechanism includes a pushing cylinder provided on one side of the support base, the side of the pushing cylinder is installed with a pushing output rod, the side of the pushing output rod is fixedly connected with a limiting pushing plate, the inside of the limiting pushing plate is installed with a rubber cushion layer, the side of the pushing cylinder is threadedly connected with multiple groups of assembly bolts, the multiple groups of assembly bolts are arranged in a rectangle on the side of the pushing cylinder, the outside of the limiting pushing plate is fixedly connected with two groups of L-shaped limiting sliders, the two groups of L-shaped limiting sliders are symmetrically distributed on the outside of the limiting pushing plate, and two groups of limiting sliding grooves are opened on the top of the side plate of the support base, the two groups of limiting sliding grooves are symmetrically distributed on the top of the side plate of the support base, and a buffer spring is installed inside the limiting sliding groove.

[0012] Preferably, the material conveying mechanism further includes a plurality of groups of guide rollers disposed inside the support base. The plurality of groups of guide rollers are linearly distributed inside the support base. A plurality of groups of rubber strips are installed on the outer side of the guide rollers. The plurality of groups of rubber strips are annularly distributed on the outer side of the guide rollers. Two groups of support bearings are installed at both ends of the guide rollers. The two groups of support bearings are symmetrically distributed at both ends of the guide rollers. A plurality of groups of bearing balls are movably connected inside the support bearings. The plurality of groups of bearing balls are annularly distributed inside the support bearings.

[0013] Preferably, the triggering mechanism further includes a damping plate disposed on the top of the lifting plate. A guiding inclined surface is provided on one side of the damping plate. A plurality of groups of damping rods are installed at the bottom of the lifting plate. The plurality of groups of damping rods are rectangularly distributed at the bottom of the lifting plate. A power spring wire is installed on one side of the power electrode plate. An output spring wire is installed on one side of the output electrode plate. Two groups of telescopic sleeves are fixedly connected to the inner wall of the triggering slide. The two groups of telescopic sleeves are symmetrically distributed on the inner wall of the triggering slide. A telescopic spring is installed inside the telescopic sleeve. Two groups of T-shaped limiting sliders are fixedly connected to the outer sides of the power slider and the output slider. The two groups of T-shaped limiting sliders are symmetrically distributed on the outer sides of the power slider and the output slider. Two groups of limiting chutes are provided on the outer wall of the triggering slide. The two groups of limiting chutes are symmetrically distributed on the outer wall of the triggering slide. Two groups of engaging edge grooves are provided on the top of the triggering slide. The two groups of engaging edge grooves are symmetrically distributed on the top of the triggering slide. Positioning inclined blocks are fixedly connected to the tops of the power slider and the output slider.

[0014] Preferably, the triggering mechanism further includes two groups of fixed clamping seats disposed on the top of the triggering slide. The two groups of fixed clamping seats are symmetrically distributed on the top of the triggering slide. An opening and closing clamping seat is movably connected to the top of the fixed clamping seat. An opening and closing rotating shaft is installed on one side of the fixed clamping seat. Clamping semi-rings are movably connected to the inner sides of the fixed clamping seat and the opening and closing clamping seat. A rubber semi-ring is installed on the inner wall of the clamping semi-ring. A plurality of groups of clamping springs are fixedly connected to the outer side of the clamping semi-ring. The plurality of groups of clamping springs are annularly distributed on the outer side of the clamping semi-ring. Locking edges are provided on the outer sides of the fixed clamping seat and the opening and closing clamping seat. Two groups of locking bolts are threadedly connected to the top of the locking edge. The two groups of locking bolts are symmetrically distributed on the top of the locking edge. Two groups of locking threaded holes are provided on the top of the other locking edge. The two groups of locking threaded holes are symmetrically distributed on the top of the other locking edge.

[0015] Preferably, the lifting mechanism includes a lifting seat disposed on one side of the support seat. A lifting slide rail is fixedly connected to the top of the lifting seat. A communicating top plate is fixedly connected to the top of the lifting slide rail. A guiding chute is formed in the top of the lifting slide rail. A double-headed servo motor is installed on the top of the lifting seat. Two driving gears are fixedly connected to the outer side of the output shaft of the double-headed servo motor. The two driving gears are symmetrically distributed on the outer side of the output shaft of the double-headed servo motor.

[0016] Preferably, the lifting mechanism further includes a fitting sleeve disposed outside the double-headed servo motor. A protective cover is fixedly connected to one side of the lifting slide rail. A plurality of ventilation holes are formed in the outer side of the protective cover. The plurality of ventilation holes are annularly distributed on the outer side of the protective cover. A support rod is fixedly connected to the bottom of the fitting sleeve.

[0017] Preferably, the insert wafer basket includes a basket body disposed on the top of the lifting seat. A plurality of insert slots are formed in the inner wall of the basket body. The plurality of insert slots are linearly distributed on the inner wall of the basket body. A structural side plate is fixedly connected to one side of the basket body. Two driven racks are fixedly connected to one side of the structural side plate. The two driven racks are symmetrically distributed on one side of the structural side plate. The two driven racks are engaged with the two driving gears.

[0018] The technical effects and advantages of the present invention:

[0019] 1. When the present invention transports silicon wafers, the lifting plate on the trigger base is stressed to drive the conductive movable block to descend into the internal gap between the power supply slider and the output slider, so that the conductive movable block contacts the power supply electrode piece and the output electrode piece, thereby connecting the power supply spring wire and the output spring wire, further realizing the power supply to the double-headed servo motor. Furthermore, the two driving gears on the double-headed servo motor rotate to drive the insert wafer basket to rise. And when the silicon wafer deviates from the lifting plate, the spring in the damping rod drives the lifting piece to reset and makes the conductive movable block deviate from the electrode piece, so that the double-headed servo motor is powered off, thereby realizing the stable adjustment of the position of the insert slot on the insert wafer basket, and further avoiding the situation that the silicon wafers cannot be inserted because their speeds are inconsistent and cannot match the lifting speed of the basket;

[0020] 2. When loading materials, the present invention uses the feeding cylinder to push the rubber suction cup to squeeze the silicon wafer on the material placing seat, thereby discharging the air in the rubber suction cup. The silicon wafer is adsorbed and fixed by the air pressure difference inside and outside the rubber suction cup. And the I-shaped slider slides on the guiding slide rail and the feeding cylinder drives the silicon wafer to realize feeding, thus greatly ensuring the stability of the silicon wafer feeding and avoiding the situation that the silicon wafer is damaged due to excessive feeding amplitude;

[0021] 3. When the present invention is transporting materials, the pushing cylinder is used to push the limiting pushing plate to move along the limiting sliding groove, thereby providing power for the movement and insertion of the silicon wafer, and guiding the silicon wafer through the rotation of the guiding roller on the supporting bearing, so as to ensure the stability of the silicon wafer transportation. At the same time, the speed difference of this transportation method is very small, further reducing the error of wafer insertion.

[0022] 4. When the triggering mechanism of the present invention is triggered, the two groups of driving gears on the double-headed servo motor engage with the driven rack on the wafer insertion basket to drive the wafer insertion basket to move along the lifting slide rail, thereby realizing the adjustment of the position of the wafer insertion slot on the wafer insertion basket. This adjustment method has high stability and is not likely to cause the wafer insertion basket to fall off. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following will briefly introduce the drawings required for the embodiments. It should be understood that the following drawings only show some embodiments of the present invention, and therefore should not be regarded as limiting the scope. For those of ordinary skill in the art, without creative efforts, other related drawings can also be obtained based on these drawings.

[0024] Figure 1 It is a schematic diagram of the overall structure of an insertion device for solar cell silicon wafers according to the present invention;

[0025] Figure 2 It is an exploded structure diagram of an insertion device for solar cell silicon wafers according to the present invention;

[0026] Figure 3 It is a schematic diagram of the feeding mechanism structure of an insertion device for solar cell silicon wafers according to the present invention;

[0027] Figure 4 It is an exploded structure diagram of the material transportation mechanism of an insertion device for solar cell silicon wafers according to the present invention;

[0028] Figure 5 It is a top view structure diagram of the material transportation mechanism of an insertion device for solar cell silicon wafers according to the present invention;

[0029] Figure 6 It is a schematic diagram of the triggering mechanism structure of an insertion device for solar cell silicon wafers according to the present invention;

[0030] Figure 7 It is a schematic diagram of the trigger assembly structure in the triggering mechanism of an insertion device for solar cell silicon wafers according to the present invention;

[0031] Figure 8 It is a schematic diagram of the wire body fixing assembly structure in the triggering mechanism of an insertion device for solar cell silicon wafers according to the present invention;

[0032] Figure 9Schematic diagram of the lifting mechanism and the wafer inserting basket structure of a wafer inserting device for a solar cell silicon wafer according to the present invention;

[0033] Figure 10 Schematic side view of the lifting mechanism of a wafer inserting device for a solar cell silicon wafer according to the present invention.

[0034] In the figure: 1, support base; 2, loading mechanism; 201, material placing base; 202, guiding slide rail; 203, L-shaped connecting plate; 204, I-shaped sliding block; 205, loading cylinder; 206, loading output rod; 207, rubber suction cup; 208, lifting rod; 3, material transporting mechanism; 301, pushing cylinder; 302, pushing output rod; 303, limiting pushing plate; 304, rubber cushion layer; 305, assembly bolt; 306, L-shaped limiting sliding block; 307, limiting sliding groove; 308, buffer spring; 309, guiding roller; 310, rubber strip; 311, support bearing; 312, bearing ball; 4, triggering mechanism; 401, triggering base; 402, lifting plate; 403, damping plate; 404, guiding inclined plane; 405, damping rod; 406, triggering sliding seat; 407, power supply sliding block; 408, output sliding block; 409, power supply electrode piece; 410, output electrode piece; 411, power supply spring wire; 412, output spring wire; 413, conductive movable block; 414, telescopic sleeve; 415, telescopic spring; 416, T-shaped limiting sliding block; 417, limiting sliding groove; 418, engaging side groove; 419, positioning inclined block; 420, fixed clamping seat; 421, opening and closing clamping seat; 422, opening and closing rotating shaft; 423, clamping semi-ring; 424, rubber semi-ring; 425, clamping spring; 426, locking edge; 427, locking bolt; 428, locking threaded hole; 5, lifting mechanism; 501, lifting seat; 502, lifting slide rail; 503, connecting top plate; 504, guiding sliding groove; 505, double-headed servo motor; 506, driving gear; 507, fitting set; 508, protective cover; 509, ventilation hole; 510, support rod; 6, wafer inserting basket; 601, basket body; 602, wafer inserting groove; 603, structural side plate; 604, driven rack. Detailed implementation manners

[0035] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Therefore, the following detailed description of the embodiments of the present invention provided in the drawings is not intended to limit the scope of the claimed present invention, but merely represents selected embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0036] In the description of the present utility model, it should be noted that the orientation or positional relationship indicated by terms such as "center", "upper", "lower", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship in which the product of the present utility model is usually placed during use. It is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present utility model. In addition, terms such as "first", "second", "third", etc. are only used for distinguishing descriptions and cannot be understood as indicating or implying relative importance.

[0037] In addition, terms such as "horizontal" and "vertical" do not mean that the components are required to be absolutely horizontal or hanging vertically, but can be slightly inclined. For example, "horizontal" only means that its direction is more horizontal relative to "vertical", and does not mean that the structure must be completely horizontal, but can be slightly inclined.

[0038] In the description of the present utility model, it should also be noted that unless otherwise clearly specified and limited, the terms "set", "installed", "connected", "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected, or indirectly connected through an intermediate medium, and can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific situations.

[0039] The present invention provides as Figures 1 - 10An inserting device for a silicon wafer of a solar cell, as shown, includes a support base 1. A feeding mechanism 2 is arranged on one side of the support base 1. A material transporting mechanism 3 is arranged on the top of the support base 1. A triggering mechanism 4 is arranged on the top of the support base 1. A lifting mechanism 5 is arranged on one side of the support base 1. An inserting material basket 6 is arranged on one side of the lifting mechanism 5. The triggering mechanism 4 includes a triggering base 401 arranged on the top of the support base 1, wherein the triggering base 401 can provide support for the upper components. A lifting plate 402 is movably connected to the top of the triggering base 401, wherein the lifting plate 402 can contact the silicon wafer to traction the lower triggering components. A triggering slide 406 is fixedly connected to the top of the bottom plate of the triggering base 401, wherein the triggering slide 406 is a triggering unit. A power slider 407 is movably connected to the inside of the triggering slide 406. An output slider 408 is movably connected to the inside of the triggering slide 406, wherein the power slider 407 and the output slider 408 can freely slide within the triggering slide 406. A power electrode sheet 409 is installed inside the power slider 407. An output electrode sheet 410 is installed inside the output slider 408. When the power electrode sheet 409 and the output electrode sheet 410 contact the conductive movable block 413, the circuit is connected, further realizing the triggering of the lifting driving component. A conductive movable block 413 is fixedly connected to the bottom of the lifting plate 402.

[0040] The feeding mechanism 2 includes a material placing seat 201 arranged on one side of the support base 1. A guiding slide rail 202 is fixedly connected to the top of the material placing seat 201. Two groups of L-shaped connecting plates 203 are fixedly connected to the outside of the guiding slide rail 202. The two groups of L-shaped connecting plates 203 are symmetrically distributed on the outside of the guiding slide rail 202. The guiding slide rail 202 is fixedly connected to the material placing seat 201 through the two groups of L-shaped connecting plates 203. An I-shaped slider 204 is movably connected to the inside of the guiding slide rail 202. The material placing seat 201 is a silicon wafer placing unit, which is convenient for storing silicon wafers. The guiding slide rail 202 can allow the I-shaped slider 204 to freely slide, so as to facilitate the user to laterally move the feeding component. The use of the two groups of L-shaped connecting plates 203 greatly improves the stability of the guiding slide rail 202, further ensuring the stability when the feeding component and the silicon wafer move.

[0041] The loading mechanism 2 further includes a loading air cylinder 205 provided on the top of the I-shaped slider 204. The bottom of the loading air cylinder 205 is equipped with a loading output rod 206. The bottom of the loading output rod 206 is fixedly connected with a rubber suction cup 207. Two sets of lifting rods 208 are fixedly connected to the top of the bottom edge of the rubber suction cup 207. The two sets of lifting rods 208 are symmetrically distributed on the top of the bottom edge of the rubber suction cup 207. When the loading air cylinder 205 is powered on, it can move up and down through the rubber suction cup 207 on the loading output rod 206, and then the rubber suction cup 207 can be squeezed to adsorb and fix the silicon wafer. At the same time, after adsorption, it can drive the silicon wafer to move up and down. The use of the two sets of lifting rods 208 facilitates the user to lift the bottom edge of the rubber suction cup 207, allowing air to enter and making the air pressure inside and outside the rubber suction cup 207 the same, further facilitating the disassembly of the silicon wafer.

[0042] The material transporting mechanism 3 includes a pushing air cylinder 301 provided on one side of the support base 1. One side of the pushing air cylinder 301 is equipped with a pushing output rod 302. One side of the pushing output rod 302 is fixedly connected with a limiting pushing plate 303. A rubber cushion layer 304 is installed inside the limiting pushing plate 303. Multiple sets of assembly bolts 305 are threadedly connected to one side of the pushing air cylinder 301. The multiple sets of assembly bolts 305 are distributed in a rectangular shape on one side of the pushing air cylinder 301. Two sets of L-shaped limiting sliders 306 are fixedly connected to the outside of the limiting pushing plate 303. The two sets of L-shaped limiting sliders 306 are symmetrically distributed on the outside of the limiting pushing plate 303. Two sets of limiting sliding grooves 307 are opened at the top of the side plate of the support base 1. The two sets of limiting sliding grooves 307 are symmetrically distributed at the top of the side plate of the support base 1. A buffer spring 308 is installed inside the limiting sliding groove 307. The pushing air cylinder 301 provides power for the movement of the limiting pushing plate 303, and then it can push the silicon wafer to move stably. The rubber cushion layer 304 is made of rubber material, and this material can avoid abrasion of the silicon wafer. The multiple sets of assembly bolts 305 can be threadedly connected to the threaded holes on the side of the support base 1, thereby realizing the installation of the pushing air cylinder 301. The two sets of L-shaped limiting sliders 306 can be movably connected to the two sets of limiting sliding grooves 307, thereby realizing the guiding of the limiting pushing plate 303 and ensuring the stability of the limiting pushing plate 303 during movement. The use of the buffer spring 308 can contact the L-shaped limiting slider 306, and then the buffer spring 308 can buffer the limiting pushing plate 303 and the silicon wafer through its resilience, avoiding damage to the silicon wafer due to excessive kinetic energy during wafer insertion.

[0043] The material conveying mechanism 3 further includes a plurality of groups of guide rollers 309 disposed inside the support base 1. The plurality of groups of guide rollers 309 are linearly distributed inside the support base 1. A plurality of groups of rubber strips 310 are installed on the outer side of the guide rollers 309. The plurality of groups of rubber strips 310 are annularly distributed on the outer side of the guide rollers 309. Two groups of support bearings 311 are installed at both ends of the guide rollers 309. The two groups of support bearings 311 are symmetrically distributed at both ends of the guide rollers 309. A plurality of groups of bearing balls 312 are movably connected inside the support bearings 311. The plurality of groups of bearing balls 312 are annularly distributed inside the support bearings 311. Among them, the use of the plurality of groups of guide rollers 309 can rotate on the support bearings 311, so as to support and guide the silicon wafers. Among them, the use of the plurality of groups of rubber strips 310 increases the friction between the guide rollers 309 and the silicon wafers, thereby ensuring the stability of the silicon wafers during movement and reducing the occurrence of slipping. Among them, the use of the plurality of groups of bearing balls 312 can effectively reduce the friction between the guide rollers 309 and the support bearings 311, thereby improving the rotation efficiency of the guide rollers 309.

[0044] The trigger mechanism 4 further includes a damping plate 403 provided on the top of the lifting plate 402. A guiding inclined surface 404 is provided on one side of the damping plate 403. A plurality of damping rods 405 are installed at the bottom of the lifting plate 402. The plurality of damping rods 405 are distributed in a rectangular shape at the bottom of the lifting plate 402. A power supply spring wire 411 is installed on one side of the power supply electrode plate 409. An output spring wire 412 is installed on one side of the output electrode plate 410. Two telescopic sleeves 414 are fixedly connected to the inner wall of the trigger slider 406. The two telescopic sleeves 414 are symmetrically distributed on the inner wall of the trigger slider 406. A telescopic spring 415 is installed inside the telescopic sleeve 414. Two T-shaped limiting sliders 416 are fixedly connected to the outer sides of the power supply slider 407 and the output slider 408. The two T-shaped limiting sliders 416 are symmetrically distributed on the outer sides of the power supply slider 407 and the output slider 408. Two limiting chutes 417 are formed on the outer wall of the trigger slider 406. The two limiting chutes 417 are symmetrically distributed on the outer wall of the trigger slider 406. Two engaging edge grooves 418 are formed on the top of the trigger slider 406. The two engaging edge grooves 418 are symmetrically distributed on the top of the trigger slider 406. Positioning inclined blocks 419 are fixedly connected to the tops of the power supply slider 407 and the output slider 408. The use of the damping plate 403 can further buffer the silicon wafer and reduce the wear of the silicon wafer. The setting of the guiding inclined surface 404 facilitates the silicon wafer to climb to the top of the lifting plate 402. The use of the plurality of damping rods 405 can provide support for the lifting plate 402 to ensure the stability of the lifting plate 402. And the resilience of the spring inside it can drive the lifting plate 402 to quickly reset when the silicon wafer detaches from the lifting plate 402, which is convenient for the transportation and insertion of subsequent silicon wafers. The power supply spring wire 411 and the output spring wire 412 are conductive components, and their spring structures do not affect the movement of the electrode plates. The two T-shaped limiting sliders 416 can be movably connected with the two limiting chutes 417, so as to guide and limit the power supply slider 407 and the output slider 408 to avoid the situation of position deviation and jamming when they move. The formation of the two engaging edge grooves 418 can be engaged with the conductive movable block 413, thereby ensuring the contact stability between the conductive movable block 413 and the electrode plate. The inclined surface of the positioning inclined block 419 facilitates the conductive movable block 413 to enter the inner sides of the two sliders.

[0045] The trigger mechanism 4 further includes two groups of fixed clamping seats 420 provided on the top of the trigger slide 406. The two groups of fixed clamping seats 420 are symmetrically distributed on the top of the trigger slide 406. The top of the fixed clamping seat 420 is movably connected with an opening and closing clamping seat 421. One side of the fixed clamping seat 420 is provided with an opening and closing rotating shaft 422. The inner sides of the fixed clamping seat 420 and the opening and closing clamping seat 421 are both movably connected with clamping half-rings 423. The inner wall of the clamping half-ring 423 is provided with a rubber half-ring 424. The outer side of the clamping half-ring 423 is fixedly connected with multiple groups of clamping springs 425. The multiple groups of clamping springs 425 are annularly distributed on the outer side of the clamping half-ring 423. The outer sides of the fixed clamping seat 420 and the opening and closing clamping seat 421 are both provided with locking edges 426. The top of the locking edge 426 is threadedly connected with two groups of locking bolts 427. The two groups of locking bolts 427 are symmetrically distributed on the top of the locking edge 426. The top of the other locking edge 426 is provided with two groups of locking threaded holes 428. The two groups of locking threaded holes 428 are symmetrically distributed on the top of the other locking edge 426. Among them, the opening and closing clamping seat 421 is movably connected with the fixed clamping seat 420 through the opening and closing rotating shaft 422, which facilitates the user to install and disassemble the wire body. Among them, the use of the rubber half-ring 424 on the inner wall of the clamping half-ring 423 can effectively improve the friction between the clamping half-ring 423 and the wire body, thereby ensuring the fixing and limiting effect on the wire body, and the use of this material can avoid damage to the wire body. Among them, the resilience of the multiple groups of clamping springs 425 can be applied to the clamping half-ring 423, thereby realizing the clamping and fixing of the wire body and avoiding the situation of the wire body shaking, wearing and being damaged. Among them, the locking bolt 427 on the locking edge 426 can be threadedly connected with the locking threaded hole 428 on the locking edge 426 of the fixed clamping seat 420, thereby realizing the closing and locking of the opening and closing clamping seat 421 and avoiding the wire body from falling off.

[0046] The lifting mechanism 5 includes a lifting seat 501 provided on one side of the support seat 1. The top of the lifting seat 501 is fixedly connected with a lifting slide rail 502. The top of the lifting slide rail 502 is fixedly connected with a connecting top plate 503. The top of the lifting slide rail 502 is provided with a guiding chute 504. The top of the lifting seat 501 is provided with a double-headed servo motor 505. The outer side of the output shaft of the double-headed servo motor 505 is fixedly connected with two groups of driving gears 506. The two groups of driving gears 506 are symmetrically distributed on the outer side of the output shaft of the double-headed servo motor 505. Among them, the lifting seat 501 can provide support for the upper components. Among them, the use of the lifting slide rail 502 can limit the material basket. Among them, the use of the connecting top plate 503 improves the structural strength of the lifting slide rail 502. Among them, the double-headed servo motor 505 is powered on after the trigger structure is triggered and can drive the two groups of driving gears 506 to rotate, thereby realizing the adjustment and lifting of the material basket body 601.

[0047] The lifting mechanism 5 further includes a mounting sleeve 507 disposed outside the double-headed servo motor 505. One side of the lifting slide rail 502 is fixedly connected with a protective cover 508. A plurality of ventilation holes 509 are formed on the outer side of the protective cover 508. The plurality of ventilation holes 509 are annularly distributed on the outer side of the protective cover 508. The bottom of the mounting sleeve 507 is fixedly connected with a support rod 510. The use of the mounting sleeve 507 and the support rod 510 provides stable support for the double-headed servo motor 505, ensuring the stability of the double-headed servo motor 505. At the same time, the stable support can effectively reduce the noise generated by vibration. The use of the protective cover 508 can protect the double-headed servo motor 505 and the driving components, avoiding damage caused by accidental contact by the staff. The use of the plurality of ventilation holes 509 on its outer side facilitates the circulation of air, and thus can dissipate heat from the double-headed servo motor 505, avoiding the situation of overload damage due to the inability of the double-headed servo motor 505 to dissipate heat.

[0048] The insert wafer basket 6 includes a basket body 601 disposed on the top of the lifting seat 501. A plurality of insert slots 602 are formed on the inner wall of the basket body 601. The plurality of insert slots 602 are linearly distributed on the inner wall of the basket body 601. One side of the basket body 601 is fixedly connected with a structural side plate 603. Two driven racks 604 are fixedly connected to one side of the structural side plate 603. The two driven racks 604 are symmetrically distributed on one side of the structural side plate 603. The two driven racks 604 are engaged with the two driving gears 506. The formation of the plurality of insert slots 602 facilitates the entry and insertion of silicon wafers. The use of the structural side plate 603 improves the structural strength of the basket body 601, and the structural side plate 603 can be movably connected with the guiding chute 504 on the lifting slide rail 502, thereby ensuring the stability of the basket body 601 during movement. The two driven racks 604 can be engaged with the two driving gears 506, so as to realize the adjustment of the position of the insert slots 602 on the basket body 601.

[0049] Working principle: The user powers on the power spring wire 411, places the silicon wafer on the material placing seat 201, and then powers on the loading cylinder 205. When the loading cylinder 205 is powered on and starts, it will drive the rubber suction cup 207 to move downward through the loading output rod 206. The rubber suction cup 207 contacts the silicon wafer and is forced to squeeze out the air inside the rubber suction cup 207. Thus, due to the internal and external air pressure difference, the rubber suction cup 207 will firmly adsorb on the silicon wafer. Then, the user pushes the I-shaped slider 204 on the guiding slide rail 202 to drive the silicon wafer to move above the support seat 1. Then, the user starts the loading cylinder 205 again to drive the silicon wafer to move downward to above the guiding roller 309. Finally, the user pulls up the bottom edge of the rubber suction cup 207 through the two groups of lifting rods 208 at the bottom edge of the rubber suction cup 207 to inject external air into the rubber suction cup 207, making the internal and external air pressures consistent and enabling the silicon wafer to be removed, thus realizing the loading of the silicon wafer. Then, the user powers on the pushing cylinder 301. When the pushing cylinder 301 is powered on and starts, it will drive the limiting pushing plate 303 to move along the limiting chute 307 through the pushing output rod 302, thereby pushing the silicon wafer to move. When the silicon wafer is stressed, the guiding roller 309 can be guided to rotate on the support bearing 311 through the frictional force, thus ensuring the stability of the silicon wafer during movement. When the position of the silicon wafer moves above the lifting plate 402, the lifting plate 402 is stressed and will sink, driving the conductive movable block 413 at its bottom to move downward and insert into the power slider 407 and the output slider 408 in the trigger slide seat 406. When the conductive movable block 413 contacts the power electrode plate 409 and the output electrode plate 410, the power spring wire 411 will be connected to the output spring wire 412. Thus, the power spring wire 411 will supply power to the double-headed servo motor 505. When the double-headed servo motor 505 is powered on and starts, it will drive the driving gears 506 on the output shafts at both ends to rotate. The driven rack 604 on the basket body 601 meshes with the driving gear 506. Thus, the driving gear 506 drives the basket body 601 to rise, so that the position of the inserting slot 602 on the basket body 601 rises to accommodate the insertion of the silicon wafer. When the silicon wafer body detaches from the lifting plate 402, the resilience of the spring in the damping rod 405 at the bottom of the lifting plate 402 will drive the lifting plate 402 to rise and reset, and the conductive movable block 413 at its bottom will fall off from the trigger slide seat 406, cutting off the power supply to the double-headed servo motor 505 to fix the position of the inserting slot 602. The silicon wafer is continuously pushed by the pushing cylinder 301 and will enter the corresponding inserting slot 602. The lifting speed of the inserting slot 602 matches the moving speed of the silicon wafer. The moving speed of the silicon wafer can be adjusted by setting the pushing cylinder 301 and replacing the buffer spring 308, thus realizing the inserting function of an inserting device for solar cell silicon wafers.

[0050] The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. A solar cell silicon wafer inserting device, comprising a support seat (1), characterized in that: A loading mechanism (2) is provided on one side of the support seat (1), a material transport mechanism (3) is provided on the top of the support seat (1), a trigger mechanism (4) is provided on the top of the support seat (1), a lifting mechanism (5) is provided on one side of the support seat (1), and a sheet material basket (6) is provided on one side of the lifting mechanism (5); The trigger mechanism (4) comprises a trigger base (401) arranged on the top of the support base (1); the top of the trigger base (401) is movably connected to a lifting plate (402); the top of the bottom plate of the trigger base (401) is fixedly connected to a trigger slide (406); the inside of the trigger slide (406) is movably connected to a power slider (407); the inside of the trigger slide (406) is movably connected to an output slider (408); the inside of the power slider (407) is installed with a power electrode sheet (409); the inside of the output slider (408) is installed with an output electrode sheet (410); and the bottom of the lifting plate (402) is fixedly connected to a conductive movable block (413); The trigger mechanism (4) further comprises a damping plate (403) arranged on the top of the lifting plate (402); a guide inclined surface (404) is arranged on one side of the damping plate (403); a plurality of groups of damping rods (405) are installed on the bottom of the lifting plate (402); the plurality of groups of damping rods (405) are distributed in a rectangular shape on the bottom of the lifting plate (402); a power supply spring wire (411) is installed on one side of the power supply electrode sheet (409); an output spring wire (412) is installed on one side of the output electrode sheet (410); two groups of telescopic sleeves (414) are fixedly connected to the inner wall of the trigger slide (406); the two groups of telescopic sleeves (414) are symmetrically distributed on the inner wall of the trigger slide (406); and a telescopic spring (412) is installed inside the telescopic sleeve (414). 415), two groups of T-shaped limiting sliders (416) are fixedly connected to the outer sides of the power slider (407) and the output slider (408), and the two groups of T-shaped limiting sliders (416) are symmetrically distributed on the outer sides of the power slider (407) and the output slider (408), the outer wall of the trigger slider (406) is provided with two groups of limiting slide grooves (417), and the two groups of limiting slide grooves (417) are symmetrically distributed on the outer wall of the trigger slider (406), the top of the trigger slider (406) is provided with two groups of engaging side grooves (418), and the two groups of engaging side grooves (418) are symmetrically distributed on the top of the trigger slider (406), and the tops of the power slider (407) and the output slider (408) are fixedly connected with positioning inclined blocks (419); The trigger mechanism (4) further comprises two groups of fixed clamping seats (420) arranged on the top of the trigger slide (406), the two groups of fixed clamping seats (420) being symmetrically distributed on the top of the trigger slide (406), the top of the fixed clamping seat (420) being movably connected to an opening and closing clamping seat (421), one side of the fixed clamping seat (420) being equipped with an opening and closing rotating shaft (422), the inner sides of the fixed clamping seat (420) and the opening and closing clamping seat (421) being movably connected to a clamping half ring (423), the inner wall of the clamping half ring (423) being equipped with a rubber half ring (424), the outer side of the clamping half ring (423) being fixed A plurality of groups of clamping springs (425) are connected, and the plurality of groups of clamping springs (425) are distributed in a ring shape on the outer side of the clamping half ring (423); locking edges (426) are provided on the outer sides of the fixed clamping seat (420) and the opening and closing clamping seat (421); two groups of locking bolts (427) are threadedly connected to the top of the locking edge (426); the two groups of locking bolts (427) are symmetrically distributed on the top of the locking edge (426); two groups of locking threaded holes (428) are provided on the top of another group of locking edges (426); the two groups of locking threaded holes (428) are symmetrically distributed on the top of the other group of locking edges (426); The lifting mechanism (5) comprises a lifting seat (501) arranged on one side of the supporting seat (1), the top of the lifting seat (501) is fixedly connected with a lifting slide rail (502), the top of the lifting slide rail (502) is fixedly connected with a connecting top plate (503), the top of the lifting slide rail (502) is provided with a guide slide groove (504), the top of the lifting slide rail (502) is installed with a double-headed servo motor (505), the outer side of the output shaft of the double-headed servo motor (505) is fixedly connected with two groups of driving gears (506), and the two groups of driving gears (506) are symmetrically distributed on the outer side of the output shaft of the double-headed servo motor (505); The lifting mechanism (5) also includes an assembly sleeve (507) arranged on the outside of the double-head servo motor (505), a protective cover (508) is fixedly connected to one side of the lifting slide rail (502), a plurality of groups of air holes (509) are provided on the outside of the protective cover (508), and the plurality of groups of air holes (509) are distributed in a ring shape on the outside of the protective cover (508), and a support rod (510) is fixedly connected to the bottom of the assembly sleeve (507).

2. The solar cell silicon wafer inserting device according to claim 1, characterized in that: The loading mechanism (2) comprises a material placement seat (201) arranged on one side of the support seat (1); the top of the material placement seat (201) is fixedly connected to a guide rail (202); the outer side of the guide rail (202) is fixedly connected to two groups of L-shaped connecting plates (203); the two groups of L-shaped connecting plates (203) are symmetrically distributed on the outer side of the guide rail (202); the guide rail (202) is fixedly connected to the material placement seat (201) via the two groups of L-shaped connecting plates (203); and the interior of the guide rail (202) is movably connected to an I-shaped sliding block (204).

3. The solar cell silicon wafer inserting device according to claim 2, characterized in that: The feeding mechanism (2) further comprises a feeding cylinder (205) arranged at the top of the I-shaped slider (204), a feeding output rod (206) being installed at the bottom of the feeding cylinder (205), a rubber suction cup (207) being fixedly connected to the bottom of the feeding output rod (206), two groups of lifting rods (208) being fixedly connected to the top of the bottom edge of the rubber suction cup (207), and the two groups of lifting rods (208) being symmetrically distributed at the top of the bottom edge of the rubber suction cup (207).

4. The solar cell silicon wafer inserting device according to claim 1, characterized in that: The material transport mechanism (3) comprises a push cylinder (301) arranged on one side of the support seat (1), a push output rod (302) is installed on one side of the push cylinder (301), a limiting push plate (303) is fixedly connected to one side of the push output rod (302), a rubber cushion layer (304) is installed on the inner side of the limiting push plate (303), and a plurality of groups of assembly bolts (305) are threadedly connected to one side of the push cylinder (301), and the plurality of groups of assembly bolts (305) are fixedly connected to the push cylinder (301). One side of the limiting push plate (301) is arranged in a holding pattern, the outer side of the limiting push plate (303) is fixedly connected with two groups of L-shaped limiting slide blocks (306), and the two groups of L-shaped limiting slide blocks (306) are symmetrically distributed on the outer side of the limiting push plate (303), and the top of the side plate of the support seat (1) is provided with two groups of limiting slide grooves (307), and the two groups of limiting slide grooves (307) are symmetrically distributed on the top of the side plate of the support seat (1), and a buffer spring (308) is installed inside the limiting slide groove (307).

5. The solar cell silicon wafer inserting device according to claim 1, characterized in that: The material transport mechanism (3) further comprises a plurality of groups of guide rollers (309) arranged inside the support seat (1), the plurality of groups of guide rollers (309) being linearly distributed inside the support seat (1), a plurality of groups of rubber strips (310) being installed on the outer sides of the guide rollers (309), the plurality of groups of rubber strips (310) being annularly distributed on the outer sides of the guide rollers (309), two groups of support bearings (311) being installed at both ends of the guide rollers (309), the two groups of support bearings (311) being symmetrically distributed at both ends of the guide rollers (309), a plurality of groups of bearing balls (312) being movably connected inside the support bearings (311), the plurality of groups of bearing balls (312) being annularly distributed inside the support bearings (311).

6. The solar cell silicon wafer inserting device according to claim 1, characterized in that: The insert sheet material basket (6) includes a material basket body (601) arranged on the top of the lifting seat (501), and the inner wall of the material basket body (601) is provided with a plurality of groups of insert sheet grooves (602), and the plurality of groups of insert sheet grooves (602) are linearly distributed on the inner wall of the material basket body (601), and one side of the material basket body (601) is fixedly connected to a structural side plate (603), and one side of the structural side plate (603) is fixedly connected to two groups of driven racks (604), and the two groups of driven racks (604) are symmetrically distributed on one side of the structural side plate (603), and the two groups of driven racks (604) are engaged with the two groups of driving gears (506).

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