Top hammer polishing stress relief apparatus and method
By setting up a stirring component and a flushing interface inside the polishing cylinder, the top hammer is simultaneously polished and stress-relieved using an abrasive slurry containing metal particles. This solves the problem of needing a separate stress-relief operation after the top hammer is polished, improving efficiency and avoiding noise and oxidation.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- ZHEJIANG HENGCHENG CEMENTED CARBIDE CO LTD
- Filing Date
- 2024-07-29
- Publication Date
- 2026-08-04
AI Technical Summary
In the existing technology, the top hammer needs to be stress-relieved separately after polishing, which makes the operation troublesome and causes problems such as high noise or surface oxidation.
A top hammer polishing stress relief device is designed. By setting a stirring component and a flushing interface inside the polishing cylinder, polishing and stress relief are carried out using an abrasive liquid containing metal particles. Combined with the stirring effect of the stirring component, the top hammer can achieve simultaneous polishing and stress relief.
The polishing and stress relief processes of the top hammer are integrated, improving operational efficiency, avoiding oxidation caused by top hammer transfer and heat treatment, and reducing noise pollution.
Smart Images

Figure CN118752401B_ABST
Abstract
Description
Technical Field
[0001] This invention belongs to the field of metal polishing technology, and particularly relates to a top hammer polishing stress relief device and method. Background Technology
[0002] After sintering, the top hammer needs to be polished and stress-relieved. Conventional polishing methods include surface grinding and cylindrical grinding. After surface grinding and cylindrical grinding, the top hammer has poor surface roughness and a shorter service life compared to a polished top hammer. Therefore, polishing is necessary. For example, Chinese patent application number 202021379893.2 discloses an aluminum casting polishing machine. This patent places the workpiece in a placement cage located inside a polishing cylinder. The rotation of the stirring paddle facilitates the flow of polishing fluid, achieving a polishing effect on the workpiece.
[0003] If the above solution is adopted, the top hammer still needs to undergo stress relief treatment after polishing, which requires removing the top hammer from the mixing drum. However, the top hammer is quite heavy, making removal, unloading, and transfer troublesome. In addition, the conventional stress relief methods for the top hammer are heat treatment and vibration aging. Heat treatment is prone to causing oxidation on the surface of the top hammer during cooling; if vibration aging is used, the noise level is relatively high when processing the top hammer. Summary of the Invention
[0004] The purpose of this invention is to provide a device that can simultaneously polish and relieve stress on a top hammer.
[0005] To achieve the above objectives, the present invention adopts the following technical solution: a top hammer polishing stress relief device, comprising a polishing cylinder, wherein a stirring assembly is provided inside the polishing cylinder, and a placement platform for placing the top hammer workpiece is provided inside the polishing cylinder, wherein a plurality of top hammer placement positions are arranged in a ring at uniform intervals on the placement platform; characterized in that: a plurality of flushing ports are arranged in a ring at uniform intervals on the cylinder cover of the polishing cylinder, the flushing ports are located above the top hammer placement positions and correspond one-to-one with the top hammer placement positions, the flushing ports are used to inject polishing fluid into the polishing cylinder and simultaneously flush the top hammer, wherein the polishing fluid contains metal particles.
[0006] During use, the operator opens the cylinder cover, places the top hammer workpiece on the top hammer placement position of the placement table, then closes the cylinder cover, and injects the grinding fluid into the polishing cylinder through the flushing interface, so that the grinding fluid flushes the top hammer to achieve the effect of stress relief. When the liquid level of the grinding fluid is higher than the top surface of the top hammer workpiece, the stirring mechanism starts to stir, so that the grinding fluid in the polishing cylinder flows to polish the outer surface of the top hammer workpiece.
[0007] As for how the placement platform is supported inside the polishing barrel, it can be achieved by setting a protrusion extending radially inward inside the polishing barrel, or by setting a ring-shaped support platform inside the polishing barrel, etc.
[0008] The rinsing interface is connected to a grinding fluid tank via a pipe. The grinding fluid in the tank is injected into the rinsing interface and then into the polishing cylinder by a pump.
[0009] This solution incorporates metal particles into the polishing slurry. When the slurry washes over the top hammer, these particles impact its top surface, releasing localized stress. This ensures the top surface remains in contact with the diamond during use, reducing the likelihood of cracking under high temperature and pressure, thus extending the hammer's lifespan. Simultaneously, after filling, the slurry is circulated via a stirring assembly, polishing the hammer's outer surface. During polishing, the metal particles in the slurry continue to gently impact the hammer's surface, alleviating internal stress. This single device can simultaneously relieve stress and polish the top hammer, eliminating the need to transfer it to heat treatment or vibration aging equipment, thus optimizing the manufacturing process.
[0010] Preferably, the metal particles are tungsten powder particles and tungsten powder particles.
[0011] Both tungsten powder particles and tungsten powder particles are materials used in the production of the top hammer and are raw material-grade metal particles. Raw material-grade metal particles have a better scouring effect on the top hammer, thereby accelerating the stress release on the top surface of the top hammer; at the same time, they can also ensure that during polishing, the tungsten and cobalt particles slightly collide with the outer surface of the top hammer, so as to slowly release the internal stress of the top hammer.
[0012] Preferably, the polishing fluid is composed of water, cobalt powder, tungsten powder, and polishing fluid, with the following mass percentages for each component: water accounts for 50%-70%, cobalt powder accounts for 8%-15%, tungsten powder accounts for 7%-15%, and polishing fluid accounts for 15%-20%.
[0013] A polishing slurry composed of water, cobalt powder, tungsten powder, and polishing fluid is used to relieve stress by polishing and rinsing the top hammer. The polishing slurry can be any existing liquid suitable for polishing the top hammer.
[0014] Preferably, the top hammer placement position is provided with an upward-opening groove, and the bottom of the groove is provided with a first through groove running vertically through the top and bottom.
[0015] The groove can prevent the top hammers from colliding during the stirring process. At the same time, the bottom of the groove has a first through groove that runs vertically through the bottom, which facilitates the flow of the grinding fluid and allows the bottom surface of the top hammers to be polished.
[0016] Preferably, the placement platform is provided with a plurality of annularly spaced second through slots, which penetrate the placement platform in the vertical direction and are located on the circumferential inner side of the top hammer placement position.
[0017] The second channel can further facilitate the vertical flow of the grinding fluid.
[0018] Preferably, the stirring assembly includes a driver, a rotating shaft, and an impeller that are detachably disposed from each other. The driver is disposed on the cylinder cover and drives the rotating shaft to rotate. The impeller is fixed on the rotating shaft and includes an upper impeller and a lower impeller, which are located on the upper and lower sides of the placement platform, respectively.
[0019] The drive enables the shaft to rotate, which in turn causes the upper and lower impellers to rotate. The rotation of the upper and lower impellers allows for better flow of the polishing slurry during agitation, thus enhancing the polishing effect. Furthermore, the drive, shaft, and impellers are all detachable, which facilitates the insertion of the top hammer.
[0020] Preferably, the bottom of the polishing cylinder protrudes downward and is arc-shaped, and the bottom of the cylinder is provided with a drain port. The drain port is connected to the flushing interface through a pipe, and the pipe is equipped with a liquid pump.
[0021] The polishing cylinder has a downward-protruding, arc-shaped bottom, which facilitates the flow of polishing slurry from the drain port at the bottom of the cylinder. After flowing out of the drain port, the polishing slurry is re-injected into the flushing interface by a pump, allowing the workpiece to undergo multiple flushing stress relief processes. Pipes are connected to the polishing slurry pool.
[0022] Preferably, when the flushing interface flushes the top hammer, the pressure on the top surface of the top hammer is 0.06Mpa-0.08Mpa.
[0023] The pressure on the top surface of the hammer is 0.06-0.08 MPa, which gives the metal particles sufficient force to impact the top surface of the hammer and release stress. For example, if the top surface area of the hammer is 50 square centimeters, the top surface of the hammer will receive a pressure of 30-40 kg.
[0024] A method for using a top hammer polishing stress relief device includes the following sequential steps:
[0025] S1: Assemble the stirring assembly with the polishing cylinder and place the top hammer in the top hammer placement position;
[0026] S2: After assembly is complete, the rinsing interface injects the polishing fluid into the polishing barrel, and the polishing fluid rinses the top surface of the top hammer workpiece.
[0027] S3: After the level of the polishing slurry is at least higher than the top surface of the top hammer, the rinsing port stops injecting polishing slurry, and the stirring component starts to stir the polishing slurry so that the polishing slurry polishes the top hammer;
[0028] S4: After polishing for a period of time, the liquid pump extracts the polishing liquid from the polishing barrel. When the liquid level of the polishing liquid is at least lower than the top surface of the top hammer, the flushing port is opened and the top surface of the top hammer is flushed.
[0029] S5: After rinsing for a period of time, the pump stops pumping the polishing fluid from the polishing barrel, and the rinsing port continues to inject liquid. Once the liquid level of the polishing fluid is at least higher than the top surface of the top hammer, the rinsing port stops injecting liquid, and the stirring component starts to stir the polishing fluid so that the polishing fluid can polish the top hammer again.
[0030] S6: Repeat steps S4 and S5 90-100 times.
[0031] This method involves repeatedly extracting and injecting polishing fluid, thereby performing stress relief treatment on the top hammer multiple times. After stress relief, the top hammer is polished using a stirring assembly. One device can complete both processes of the top hammer, making the steps simple and more efficient.
[0032] Preferably, the polishing duration in step S4 is 1 hour, and the rinsing duration in step S5 is 3 minutes.
[0033] This process achieves polishing of the top hammer and removal of internal stress.
[0034] This invention has the advantage of simultaneously polishing and stress-relieving the top hammer. Attached Figure Description
[0035] Figure 1 This is a schematic diagram of the structure of the present invention.
[0036] Figure 2 This is a schematic diagram of the internal structure of the polishing cylinder of the present invention.
[0037] Figure 3 This is a schematic diagram of the internal structure of the polishing cylinder of the present invention.
[0038] Figure 4 for Figure 1 A sectional view.
[0039] Reference numerals: 1. Polishing cylinder; 11. Cylinder cover; 12. Cylinder bottom; 121. Drain outlet; 13. Annular support platform; 2. Bracket; 3. Flushing interface; 4. Driver; 41. Rotating shaft; 42. Upper impeller; 43. Lower impeller; 5. Placement platform; 51. Groove; 52. First through groove; 52. Second through groove. Detailed Implementation
[0040] The present invention will now be further described with reference to the accompanying drawings and specific embodiments.
[0041] like Figures 1 to 4 As shown in the figure, this embodiment discloses a top hammer polishing stress relief device and method, including a support 2 and a polishing slurry pool (not shown in the figure) located on one side of the support 2. A polishing cylinder 1 is fixed on the support 2. The polishing cylinder 1 includes a cylinder cover 11 and a cylinder bottom 12. The outer circumferential edge of the cylinder cover 11 is provided with a plurality of annularly spaced flushing ports 3. The flushing ports 3 are arranged in the vertical direction and can inject polishing slurry into the polishing cylinder 1. An annular support platform 13 is provided on the inner circumferential wall of the polishing cylinder 1. The annular support platform 13 supports a placement platform 5. The outer circumferential edge of the placement platform 5 is provided with a plurality of annularly spaced top hammer placement positions. Each top hammer placement position corresponds one-to-one with the flushing port 3 above it and is located directly below the flushing port 3. Each top hammer placement position is provided with an upward-opening groove 51. The bottom of the groove 51 is provided with a vertically penetrating first through groove 52. The first through groove 52 is cross-shaped. The placement platform 5 is also provided with several second through slots 53 that run vertically through the placement platform. The second through slots 53 are evenly spaced in a ring and located on the inner side of the top hammer placement position.
[0042] The bottom 12 of the polishing cylinder 1 protrudes downwards and is arc-shaped. A drain port 121 is located at the center of the bottom 12. The drain port 121 is connected to the flushing interface 3 on the cylinder cover 11 via a pipe (not shown in the figure). This pipe is also connected to the polishing slurry pool. A pump (not shown in the figure) is attached to the pipe. The pump draws the polishing slurry out of the polishing cylinder 1 through the drain port 121 and re-injects it into the polishing cylinder 1 through the flushing interface 3. The flushing pressure of the polishing slurry on the top surface of the top hammer of the flushing interface 3 is 0.06 MPa. The polishing slurry consists of water, cobalt powder, tungsten powder, and polishing slurry. The mass ratios of each component are as follows: water 70%, cobalt powder 8%, tungsten powder 7%, and polishing slurry 15%.
[0043] The polishing cylinder 1 is detachably equipped with a stirring assembly, which includes a driver 4 mounted on the cylinder cover 11. The driver 4 is a motor, and its output end is connected to a rotating shaft 41. An upper impeller 42 and a lower impeller 43 are fixed on the rotating shaft 41, and the upper impeller 42 and the lower impeller 43 are located on the upper and lower sides of the placement platform 5, respectively. Both the upper impeller 42 and the lower impeller 43 consist of four inclined blades.
[0044] A method for using a top hammer polishing stress relief device includes the following sequential steps:
[0045] S1: Place the lower impeller and the rotating shaft into the polishing cylinder; place the placement table on the rotating shaft and into the polishing cylinder, so that the placement table is supported on the annular support platform; place the top hammer workpieces one by one on the top hammer placement position of the placement table; connect the upper impeller to the rotating shaft, install the driver on the cover plate, and connect the output end of the driver to the rotating shaft.
[0046] S2: After assembly is complete, the rinsing interface injects the polishing fluid into the polishing barrel, and the polishing fluid rinses the top surface of the top hammer workpiece.
[0047] S3: After the level of the polishing slurry is higher than the top surface of the top hammer, the stirring component starts to stir the polishing slurry so that the polishing slurry polishes the top hammer; the flushing port will continue to inject polishing slurry at this time until the level of the polishing slurry is higher than the upper impeller, then the flushing port will stop injecting polishing slurry to ensure that the level of the polishing slurry is always higher than the top surface of the top hammer when the stirring component is stirring the polishing slurry.
[0048] S4: After polishing for 1 hour, the pump extracts the polishing liquid from the polishing barrel. When the level of the polishing liquid is lower than the small inclined surface on the underside of the top surface of the top hammer, the flushing port is opened and the top surface of the top hammer is flushed. At this time, the polishing liquid is extracted and injected by flushing.
[0049] S5: After rinsing for 3 minutes, the pump stops drawing polishing fluid from the polishing cylinder. Once the level of the polishing fluid is higher than the top surface of the top hammer, the stirring assembly starts stirring the polishing fluid to polish the top hammer. The rinsing port continues to inject polishing fluid until the level of the polishing fluid is higher than the upper impeller. Then, the rinsing port stops injecting polishing fluid to ensure that the level of the polishing fluid is always higher than the top surface of the top hammer when the stirring assembly is stirring the polishing fluid.
[0050] S6: Repeat steps S4 and S5 100 times.
Claims
1. A method of using a top hammer polishing stress-relieving device, characterized in that, The device includes a polishing cylinder, which is equipped with a stirring assembly. The polishing cylinder is provided with a placement platform for placing the top hammer workpiece. The placement platform is provided with a plurality of top hammer placement positions arranged in a ring at uniform intervals. The cylinder cover of the polishing cylinder is provided with a plurality of flushing ports arranged in a ring at uniform intervals. The flushing ports are located above the top hammer placement positions and correspond one-to-one with the top hammer placement positions. The method includes the following sequential steps: S1: Assemble the stirring assembly with the polishing cylinder and place the top hammer in the top hammer placement position; S2: After assembly is completed, the rinsing interface injects the grinding fluid into the polishing barrel. The grinding fluid rinsing the top surface of the top hammer workpiece allows the grinding fluid to rinsing the top hammer to achieve a stress relief effect. S3: After the level of the polishing slurry is at least higher than the top surface of the top hammer, the rinsing port stops injecting polishing slurry, and the stirring component starts to stir the polishing slurry so that the polishing slurry polishes the top hammer. At the same time as polishing, the metal particles along with the flow of polishing slurry can produce slight impact on the outer surface of the top hammer, thereby slowly releasing the internal stress of the top hammer. S4: After polishing for a period of time, the liquid pump extracts the polishing liquid from the polishing barrel. When the liquid level of the polishing liquid is at least lower than the top surface of the top hammer, the flushing port is opened and the top surface of the top hammer is flushed. S5: After rinsing for a period of time, the pump stops pumping the polishing fluid from the polishing barrel, and the rinsing port continues to inject liquid. Once the liquid level of the polishing fluid is at least higher than the top surface of the top hammer, the rinsing port stops injecting liquid, and the stirring component starts to stir the polishing fluid so that the polishing fluid can polish the top hammer again. S6: Repeat steps S4 and S5 90-100 times; The grinding fluid contains metal particles; the metal particles are tungsten powder particles and cobalt powder particles, both of which are materials used in the manufacture of the top hammer; the grinding fluid is composed of water, cobalt powder, tungsten powder and polishing fluid, with the following mass proportions for each component: water accounts for 50%-70%, cobalt powder accounts for 8%-15%, tungsten powder accounts for 7%-15%, and polishing fluid accounts for 15%-20%; when the flushing interface flushes the top hammer, the pressure on the top surface of the top hammer is 0.06Mpa-0.08Mpa.
2. The method of use according to claim 1, characterized in that: The polishing duration in step S4 is 1 hour, and the rinsing duration in step S5 is 3 minutes.
3. The method of use according to claim 1 or 2, characterized in that: The top hammer placement position is provided with an upward-opening groove, and the bottom of the groove is provided with a first through groove running vertically through the top and bottom.
4. The method of use according to claim 1 or 2, characterized in that: The placement platform is provided with a number of annularly spaced second through slots, which penetrate the placement platform in the vertical direction and are located on the inner circumferential side of the top hammer placement position.
5. The method of use according to claim 1 or 2, characterized in that: The stirring assembly includes a driver, a rotating shaft, and an impeller that are detachably disposed from each other. The driver is disposed on the cylinder cover and drives the rotating shaft to rotate. The impeller is fixed on the rotating shaft and includes an upper impeller and a lower impeller, which are located on the upper and lower sides of the placement platform, respectively.
6. The method of use according to claim 4, characterized in that: The bottom of the polishing cylinder protrudes downward and is arc-shaped. The bottom of the cylinder is provided with a drain port. The drain port is connected to the flushing interface through a pipe, and the pipe is equipped with a liquid pump.