A method, system, storage medium and program product for detecting the production of a chip inductor

Abstract

A method, system, storage medium and program product for detecting the production of chip inductors. In this method, it is determined whether the magnetic core material is in a preset table according to the magnetic parameters measured by a magnetic permeability tester and a hysteresis loop measuring instrument; if the magnetic core material is in the preset table, it is determined whether the winding tension detected by a tension sensor is equal to a preset tension; if the winding tension is equal to the preset tension, the welding area monitoring video sent by a monitoring device is identified to obtain the thickness of the chip inductor; it is determined whether the thickness is within a preset qualified range; if it is within the preset qualified range, the offline time point when the chip inductor passes through a preset point is recorded; all chip inductors corresponding to the offline time points are marked as qualified chip inductors, and all qualified chip inductors are sent to a control terminal. All chip inductors on the production line are detected in real time, and by identifying the monitoring video of the chip inductors, it is determined whether the chip inductors are qualified, thereby improving the accuracy of detecting the qualification rate of chip inductors.

Description

Technical Field

[0001] This application belongs to the field of production inspection, and particularly relates to a method, system, storage medium, and program product for the production inspection of chip inductors. Background Art

[0002] A chip inductor (Surface Mount Inductor) is an electronic component designed for surface mount technology (Surface Mount Technology, SMT). They are widely used in modern electronic devices such as smartphones, computers, communication devices, etc. The main functions of chip inductors are energy storage, filtering, impedance matching, and signal processing.

[0003] Due to the small volume of chip inductors, the requirements for production are very high. If there is even a little production deviation, the chip inductors will be unqualified. However, the production line for producing chip inductors requires high productivity, which may result in a low pass rate of chip inductors. Therefore, the inspection during the production process of chip inductors is particularly important. Related technologies usually use sampling inspection methods, which require directly extracting several chip inductors from the production line for inspection, thus affecting the production speed of the production line. Moreover, the sampling inspection method still has deficiencies in reflecting the pass rate of the entire batch of chip inductors. Extracting a limited number may reduce the accuracy of detecting the pass rate of chip inductors. Summary of the Invention

[0004] This application provides a method, system, storage medium, and program product for the production inspection of chip inductors, which is used to detect all chip inductors in the production line in real time. By identifying the monitoring video of the chip inductors, it is determined whether the chip inductors are qualified, thereby improving the accuracy of detecting the pass rate of chip inductors.

[0005] In a first aspect, this application provides a method for the production inspection of chip inductors. It is determined whether the magnetic core material is in a preset table according to the magnetic parameters measured by a permeability tester and a hysteresis loop tester. The magnetic parameters include the permeability measured by the permeability tester and the coercive force measured by the hysteresis loop tester. When the magnetic parameters are in the preset table, it indicates that the corresponding magnetic core material is qualified;

[0006] If the magnetic core material is in the preset table, it is determined whether the winding tension detected by the tension sensor is equal to the preset tension. At this time, the magnetic core material is in the winding area, and after leaving the winding area, the magnetic core material becomes a sub-chip inductor;

[0007] If the winding tension is equal to the preset tension, the welding area monitoring video sent by the monitoring device is identified to obtain the thickness of the chip inductor;

[0008] It is determined whether the thickness is within the preset qualified range;

[0009] If it is within the preset qualified range, record the offline time point when the chip inductor passes through the preset position.

[0010] Mark all the chip inductors corresponding to the offline time points as qualified chip inductors, and send all the qualified chip inductors to the control terminal.

[0011] By adopting the above technical solution, magnetic parameters are measured by a magnetic permeability tester and a hysteresis loop measuring instrument, and it is judged whether the magnetic parameters are in the preset table, so as to screen out the magnetic core materials with qualified performance, ensure that the magnetic performance meets the requirements, and lay a foundation for subsequent production. Secondly, the winding tension is detected by a tension sensor to ensure that the winding is neither too loose nor too tight, avoiding problems such as inter-turn short circuit caused by too loose winding or magnetic core damage caused by too tight winding, and further improving the product reliability. Furthermore, visual inspection means are used to measure the thickness of the chip inductor after welding, judge whether it meets the design requirements, and reject unqualified products, so as to control the product consistency. Finally, record the offline time points of qualified products to realize the traceability management of the production process. The detection results are fed back to the control terminal in real time for statistical analysis and abnormal warning. All chip inductors on the production line are detected in real time. By identifying the monitoring video of the chip inductor, it is judged whether the chip inductor is qualified, thus improving the accuracy of detecting the qualification rate of the chip inductor.

[0012] Combined with some embodiments of the first aspect, in some embodiments, after judging whether the thickness is within the preset qualified range, the method further includes:

[0013] If the magnetic core material is not in the preset table, send a first instruction to the first robotic arm to make the first robotic arm pick up and place the magnetic core material in the first area.

[0014] If the winding tension is not equal to the preset tension, send a second instruction to the second robotic arm to make the second robotic arm pick up and place the sub-chip inductor in the second area.

[0015] If it is not within the preset qualified range, send a third instruction to the third robotic arm to make the third robotic arm pick up and place the chip inductor in the third area.

[0016] By adopting the above technical solution, for the magnetic core materials with unqualified performance, they are grabbed by the first robotic arm and transferred to a special unqualified product storage area to prevent them from entering the winding process. For the sub-chip inductors with abnormal winding tension, they are grabbed by the second robotic arm and transferred to another unqualified product storage area to prevent them from being wrongly welded. For the finished chip inductors with unqualified thickness after welding, they are grabbed by the third robotic arm and transferred to the finished product unqualified area to prevent them from being mixed into the qualified products. This measure makes full use of machine vision and robotic arm technology to realize the automatic screening of unqualified products through accurate identification and positioning, greatly improving the detection efficiency and accuracy. Classify and store different types of unqualified products for subsequent defect analysis and process improvement.

[0017] In combination with some embodiments of the first aspect, in some embodiments, if the winding tension is equal to the preset tension, the monitoring video of the welding area sent by the identification monitoring device is recognized to obtain the thickness of the chip inductor, which specifically includes:

[0018] Receive the monitoring video of the welding area sent by the monitoring device;

[0019] Identify the secondary chip inductor in the monitoring video of the welding area to obtain an image of the secondary chip inductor;

[0020] Determine the thickness of the secondary chip inductor according to the image.

[0021] By adopting the above technical solution, after determining that the winding tension is qualified, machine vision technology is introduced to perform on-line detection of the products in the welding area. Image data is collected by a high-definition industrial camera, and the thickness information is accurately extracted by using image processing algorithms, realizing the automatic detection of product appearance defects.

[0022] In combination with some embodiments of the first aspect, in some embodiments, determining the thickness of the secondary chip inductor according to the image specifically includes:

[0023] Determine the placement posture of the secondary chip inductor according to the image;

[0024] In the case of determining that the secondary chip inductor is in a flat placement posture, send a fourth instruction to the welding area monitoring device to make the welding area monitoring device move to the first preset position to capture a side view image of the chip inductor;

[0025] In the case of determining that the secondary chip inductor is in a vertical placement posture, send a fifth instruction to the welding area monitoring device to make the welding area monitoring device move to the second preset position to capture a top view image of the chip inductor;

[0026] Determine the thickness of the secondary chip inductor according to the side view image or the top view image.

[0027] By adopting the above technical solution, for different placement postures that the chip inductor may have, corresponding strategies are taken to adjust the camera position to ensure obtaining the correct detection perspective, thereby ensuring the accuracy and reliability of thickness measurement. For a flat-placed chip inductor, its thickness information is mainly reflected in the side view image. By controlling the camera to move to the preset position to capture the side view image and combining with the calibrated size, the thickness value can be accurately extracted by using the edge detection algorithm. For a vertically placed chip inductor, the thickness feature is mainly reflected in the top view image. By controlling the camera to move to another preset position to capture the top view image and using the dimensional relationship between the reference hole and the product contour in the top view, the product thickness can be indirectly measured, improving the accuracy of thickness measurement.

[0028] In connection with some embodiments of the first aspect, in some embodiments, after marking all the chip inductors corresponding to the offline time points as qualified chip inductors and sending all the qualified chip inductors to the control terminal, the method further includes:

[0029] Determine the total number of producible chip inductors according to the quantity of magnetic materials;

[0030] Calculate the difference between the total number of producible chip inductors and the number of qualified chip inductors;

[0031] Divide the difference by the total number of producible chip inductors to obtain the qualification rate and send the qualification rate to the control terminal.

[0032] By adopting the above technical solution, the quantity of magnetic materials is the key factor determining the total number of producible chip inductors, and the theoretical output can be estimated based on the quantity of magnetic materials. The number of qualified chip inductors reflects the number of those meeting the quality standards in the actual output. The difference between the two reflects the number of unqualified products caused by various reasons during the production process. Dividing the difference by the total producible quantity can obtain the qualification rate, which intuitively shows the defective rate level of the production line. By monitoring the qualification rate in real time, the operating quality of the production line can be objectively evaluated. Once the qualification rate is lower than expected, measures can be taken in a timely manner for improvement. Sending the qualification rate to the control terminal enables the management to grasp the quality dynamics in real time, analyze whether the production line is stable based on the trend of the qualification rate, and respond promptly when fluctuations occur.

[0033] In connection with some embodiments of the first aspect, in some embodiments, dividing the difference by the total number of producible chip inductors to obtain the qualification rate and sending the qualification rate to the control terminal specifically includes:

[0034] Divide the difference by the total number of producible chip inductors to obtain the qualification rate;

[0035] In the case where it is determined that the qualification rate is not greater than the preset minimum qualification rate, send a seventh instruction to the production line controller to stop the operation of the production line controller;

[0036] Determine the quantity of non - qualified products in the first area, the second area, and the third area, where the non - qualified products include magnetic materials, sub - chip inductors, and chip inductors;

[0037] Determine the unqualified area where the quantity of non - qualified products is greater than the preset maximum quantity;

[0038] Determine the working parameters corresponding to the unqualified area and send the working parameters to the control terminal.

[0039] By adopting the above technical solution, the system sets the minimum pass rate threshold to determine in real time whether the pass rate of the production line is abnormal. Once the pass rate of multiple batches of products is lower than the minimum standard, a stop-production instruction is automatically sent to the production line controller to prevent the continued accumulation of defective products. At the same time, the system will also count the number of defective products in different areas (such as magnetic material area, winding area, welding area, etc.) to find out the problem area where the number of defective products exceeds the upper limit. This kind of refined control by region can narrow the scope of problem investigation and speed up the problem location. After locking the problem area, the system will further analyze the process parameter settings of the area, identify the parameter items that may cause defects and send them to the control terminal. By presenting the time, place, and cause of the problem, the production management personnel have a clear understanding of the overall picture of the problem, and can quickly formulate targeted corrective and preventive measures based on this, thereby reducing the recurrence of similar problems.

[0040] In conjunction with some embodiments of the first aspect, in some embodiments, after determining the operating parameters corresponding to the unqualified area and sending the operating parameters to the control terminal, the method further includes:

[0041] After determining that the adjustment instruction sent by the receiving control terminal is received, adjusting the working parameters according to the adjustment instruction;

[0042] Sending an eighth instruction to the production line controller to start the production line controller to run;

[0043] Re-determining the number of non-conforming products in the first area, the second area, and the third area after a preset period of time;

[0044] Determine whether the quantity of non-conforming products in each of the first area, the second area, and the third area is greater than a preset maximum quantity;

[0045] If it is greater than the preset maximum number, the step of determining the working parameters corresponding to the unqualified area and sending the working parameters to the control terminal is performed;

[0046] If it is not greater than the preset maximum number, the current working parameters will be uploaded to the preset database for storage.

[0047] By adopting the above technical solution, when the system locates the problem area and analyzes the suspicious process parameters, production managers can adjust the control parameters of the equipment accordingly. To verify the effect of the adjustment, the system will automatically restart the production line after receiving the adjustment instruction, and at the same time activate the special monitoring mode to continuously track several production batches after the adjustment. By comparing the changes in the number of defective products in each area before and after the adjustment, it is possible to objectively evaluate whether the adjustment of the process parameters is effective. If the optimized parameters can control the number of defective products in each area within the preset qualified range, it indicates that this round of improvement is successful, and the system will save the optimized parameters to the database as the new standard for subsequent production. However, if the quality problem is not completely eliminated and the number of defective products still exceeds the standard, the system will perform problem area location and parameter analysis again, and propose further optimization suggestions based on the previous round of improvement until the best parameter combination is found.

[0048] In a second aspect, an embodiment of the present application provides a chip inductor production detection system, which includes: one or more processors and a memory; the memory is coupled to the one or more processors, and the memory is used to store computer program code, and the computer program code includes computer instructions, and the one or more processors call the computer instructions to enable the system to execute the method described in the first aspect and any possible implementation manner in the first aspect.

[0049] In a third aspect, an embodiment of the present application provides a computer-readable storage medium, including instructions, when the above instructions run on the system, enabling the above system to execute the method described in the first aspect and any possible implementation manner in the first aspect.

[0050] In a fourth aspect, an embodiment of the present application provides a computer program product, characterized in that when the computer program product runs on the system, enabling the system to execute the method described in any possible implementation manner in the first aspect.

[0051] One or more technical solutions provided in the embodiments of the present application have at least the following technical effects or advantages:

[0052] 1. This application provides a method for detecting the production of chip inductors. By using a permeability tester and a hysteresis loop measuring instrument to measure magnetic parameters and determining whether the magnetic parameters are in a preset table, qualified magnetic core materials can be screened out to ensure that the magnetic properties meet the requirements, laying a foundation for subsequent production. Secondly, the winding tension is detected by a tension sensor to ensure that the winding is neither too loose nor too tight, avoiding problems such as inter-turn short circuits caused by too loose winding or magnetic core damage caused by too tight winding, and further improving the product reliability. Moreover, visual inspection means are used to measure the thickness of the chip inductor after welding, determine whether it meets the design requirements, and eliminate unqualified products, thereby controlling the product consistency. Finally, the off-line time point of qualified products is recorded to achieve traceability management of the production process. The detection results are real-time fed back to the control terminal for statistical analysis and anomaly warning. All chip inductors on the production line are detected in real time. By identifying the monitoring video of the chip inductors, it is determined whether the chip inductors are qualified, thus improving the accuracy of detecting the qualification rate of chip inductors.

[0053] 2. This application provides a method for detecting the production of chip inductors. For magnetic core materials with unqualified performance, they are grabbed by the first robotic arm and transferred to a dedicated unqualified product storage area to prevent them from entering the winding process. For sub-chip inductors with abnormal winding tension, they are grabbed by the second robotic arm and transferred to another unqualified product storage area to prevent them from being wrongly welded. For finished chip inductors with unqualified thickness after welding, they are grabbed by the third robotic arm and transferred to the finished product unqualified area to prevent them from being mixed into qualified products. This measure makes full use of machine vision and robotic arm technology to achieve automatic screening of unqualified products through precise identification and positioning, greatly improving the detection efficiency and accuracy. The different types of unqualified products are stored separately for subsequent defect analysis and process improvement.

[0054] 3. This application provides a method for detecting the production of chip inductors. When the system locates the problem area and analyzes the suspicious process parameters, production managers can adjust the control parameters of the equipment accordingly. To verify the effect of the adjustment, the system will automatically restart the production line after receiving the adjustment instruction and simultaneously activate the special monitoring mode to continuously track several production batches after the adjustment. By comparing the changes in the number of unqualified products in each area before and after the adjustment, it is possible to objectively evaluate whether the adjustment of process parameters is effective. If the optimized parameters can control the number of unqualified products in each area within the preset qualified range, it indicates that this round of improvement is successful, and the system will save the optimized parameters to the database as a new standard for subsequent production. However, if the quality problem has not been completely eliminated and the number of unqualified products is still excessive, the system will perform problem area location and parameter analysis again, and put forward further optimization suggestions based on the previous round of improvement until the best parameter combination is found. Description of the Drawings

[0055] Figure 1It is a schematic flow diagram of a method for manufacturing and testing chip inductors in an embodiment of the present application.

[0056] Figure 2 It is another schematic flow diagram of a method for manufacturing and testing chip inductors in an embodiment of the present application.

[0057] Figure 3 It is a schematic structural diagram of an entity device of a chip inductor manufacturing and testing system provided by an embodiment of the present application. Detailed implementation manners

[0058] The terms used in the following embodiments of the present application are only for the purpose of describing specific embodiments and are not intended to limit the present application. As used in the specification and appended claims of the present application, the singular forms "a", "an", "the", "above-mentioned", "said", and "this" are also intended to include the plural forms, unless the context clearly indicates otherwise. It should also be understood that the term "and / or" used in the present application refers to any and all possible combinations including one or more of the listed items.

[0059] Hereinafter, the terms "first" and "second" are only used for descriptive purposes and cannot be construed as implying or suggesting relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the embodiments of the present application, unless otherwise specified, the meaning of "a plurality" is two or more.

[0060] The processing techniques used for the chip inductors of the present application include:

[0061] Make a groove at the matching part of the U-shaped magnetic powder base block structure and the angled coil, and make clearance at the position of the coil leads.

[0062] Put the combined powder base block and the coil into a mold, and first perform shaping through a first punch. The punch corresponding to the lead part forms a certain arc, and during the downward pressing process, the lead is stressed and fits with the body through the punch limit groove.

[0063] The pre-pressed product enters hot pressing, and the lead is pressed into the powder base block through a second punch so that the surface of the lead is flush with the surface of the product.

[0064] The following describes an application scenario of an embodiment of the present application:

[0065] In today's era of rapidly evolving electronic products, highly integrated electronic products such as smartphones, wearable devices, and Internet of Things devices are emerging continuously, posing higher requirements for the miniaturization and high performance of electronic components. As an indispensable passive component in modern electronic devices, surface mount inductors play a crucial role in circuit design. They are widely used in modules such as RF circuits, power management, and noise filtering, and achieve functions such as energy storage and signal conditioning through magnetic field coupling, ensuring the stable operation of the circuit system.

[0066] However, as the integration level of electronic devices continues to increase, the size of surface mount inductors has also shrunk accordingly, which poses severe challenges to the production process. A small size means that any slight deviation in the production process may lead to unqualified product performance, such as inductor value deviation, poor insulation, and pin soldering problems, which will directly affect the reliability and stability of the circuit.

[0067] Taking the RF front-end module of a smartphone as an example, the surface mount inductors used in it are generally in the 0201, 0402 levels, with a length of only 0.4 - 1.0 mm and a thickness between 0.2 - 0.5 mm. Achieving precise winding, soldering, and encapsulation at such a tiny scale poses extremely high requirements for the accuracy and stability of production equipment. Any deviation in any process may bring quality risks, and strict quality control needs to be implemented during the production process to promptly detect and isolate unqualified products to ensure the consistency of product quality.

[0068] However, the requirements for the yield and cost of surface mount inductor production are also strict. In the context of increasingly fierce market competition, production enterprises need to maximize production capacity and efficiency while ensuring quality, and reduce unnecessary cost inputs. This requires the production line to remain stable while operating at high speed, avoiding excessive line stops and rework.

[0069] The limitations of the traditional sampling inspection mode are exposed in this situation. Offline sampling inspection requires directly extracting a certain number of products from the production line for inspection, which inevitably interferes with the production rhythm and reduces production efficiency. Moreover, the limited sampling quantity is difficult to comprehensively reflect the quality level of the entire batch of products. If the sampling inspection is improper, it may let go of unqualified products with potential hazards or misjudge qualified products, causing unnecessary losses.

[0070] To solve the above technical problems, this application provides a surface mount inductor production detection method, system, storage medium, and program product for real-time detecting all surface mount inductors in the production line, and determining whether the surface mount inductors are qualified by identifying the monitoring videos of the surface mount inductors, thereby improving the accuracy of detecting the qualified rate of surface mount inductors. The following combines Figure 1 , to describe a surface mount inductor production detection method in an embodiment of this application:

[0071] Please refer to Figure 1 , which is a schematic flow chart of a method for detecting the production of a chip inductor in an embodiment of the present application.

[0072] S101. Determine whether the magnetic core material is in a preset table according to the magnetic parameters measured by a magnetic permeability tester and a hysteresis loop tester;

[0073] The system determines whether the magnetic core material is in a preset table according to the magnetic parameters measured by a magnetic permeability tester and a hysteresis loop tester. The magnetic parameters include the magnetic permeability measured by the magnetic permeability tester and the coercive force measured by the hysteresis loop tester. When the magnetic parameters are in the preset table, it indicates that the corresponding magnetic core material is qualified.

[0074] The system uses a magnetic permeability tester and a hysteresis loop tester to detect the magnetic core material and obtain the magnetic parameters of the material. These parameters usually include the magnetic permeability and coercive force of the material, which are key indicators for measuring the performance of magnetic materials. The magnetic permeability reflects the ease with which the material is magnetized under an applied magnetic field. The higher the value, the easier the material is to be magnetized. The coercive force represents the applied magnetic field strength required for the material to maintain a certain magnetism. The larger the value, the stronger the hysteresis characteristics of the material.

[0075] In actual production, different models and specifications of chip inductors have different requirements for magnetic core materials. To ensure the consistency and stability of inductor performance, the system will pre-establish a standard table of magnetic parameters (preset table). The preset table stipulates the qualified magnetic permeability and coercive force ranges for various common magnetic core materials. When the magnetic permeability measured by the magnetic permeability tester and the coercive force measured by the hysteresis loop tester both fall within the ranges specified in the table, it is considered that the batch of magnetic core materials is qualified and can be put into subsequent production; otherwise, the batch of materials will be judged as unqualified and need to be removed.

[0076] For example, the YT-01 model of chip inductor uses the M100022 material as the magnetic core. Through a large number of experiments and data analysis, the system determines that the qualified magnetic permeability range of this material is 1200 - 1500, and the coercive force range is 10 - 20 A / m. After testing, the magnetic permeability of a batch of M100022 materials is 1463, and the coercive force is 17 A / m, both within the qualified range. Therefore, this batch of materials passes the preliminary selection and can enter the next winding process. However, the test results of another batch of materials show that the magnetic permeability is 973 and the coercive force is 31 A / m, which is significantly deviated from the standard. The system determines it as unqualified and automatically isolates it to prevent it from flowing into subsequent links.

[0077] Through this standardized screening method based on magnetic parameters, the system conducts quality control on the magnetic core materials at the source of production, discovers and isolates quality risks early, and lays a solid quality foundation for subsequent processes. At the same time, this detection is carried out online and will not affect the production rhythm, achieving the unity of quality and efficiency. Through full inspection, the quality status of the entire batch of materials is truly reflected, avoiding misjudgment in sampling inspection.

[0078] S102. Determine whether the winding tension detected by the tension sensor is equal to the preset tension;

[0079] If the magnetic core material is in the preset table, the system determines whether the winding tension detected by the tension sensor is equal to the preset tension. At this time, the magnetic core material is in the winding area, and after leaving the winding area, the magnetic core material becomes a secondary patch inductor. The production line sequence of this application is as follows: the raw material area, where all magnetic core materials are stored; the winding area, where the magnetic core materials are wound to obtain secondary magnetic core materials; the welding area, where the secondary magnetic core materials are welded to obtain magnetic core materials.

[0080] In the winding process of the patch inductor, the winding quality of the coil directly affects the electrical performance of the inductor, such as key parameters like inductance and quality factor. And the winding tension is one of the core factors affecting the winding quality. If the tension is too small, the coil is likely to be scattered and the insulation between turns is poor; if the tension is too large, it may damage the core body, causing stress concentration and a decrease in mechanical strength. Therefore, precisely controlling the winding tension is the key to ensuring the quality of the inductor.

[0081] In the embodiment of this application, the system uses a tension sensor to continuously detect the tension applied by the winding machine to the enameled wire and compares the detected value with the preset standard tension value. If the two are equal, it means the current tension is appropriate and the winding can continue; if the detected value deviates from the standard value, the system will determine that there is a tension abnormality, which may trigger a quality risk and needs to be adjusted in a timely manner.

[0082] The preset tension is determined comprehensively according to the product design requirements, combined with factors such as equipment capabilities and material characteristics. For example, for an enameled copper wire with a wire diameter of 0.05 mm when winding a magnetic core with an inner diameter of 0.4 mm, the standard tension specified by the system is 1.5 N. During a certain production, the actual tension detected by the tension sensor is 1.2 N, which is less than the standard value. The system determines that the tension is insufficient, automatically sends a signal to the winding machine to increase the tension to 1.5 N, and at the same time records the time point of the tension abnormality and the adjustment process for subsequent analysis.

[0083] S103. Send a first instruction to the first robotic arm to clamp and place the magnetic core material in the first area;

[0084] If the magnetic core material is not in the preset table, the system sends a first instruction to the first robotic arm to pick up and place the magnetic core material in the first area, which is located on one side of the raw material area and is used to store unqualified magnetic core materials.

[0085] When the system determines that a certain batch of magnetic core materials is unqualified according to the detection result of step S101, it is necessary to isolate these unqualified products in time to prevent them from mixing into the subsequent processes. The traditional manual selection method is inefficient and prone to errors, so the system uses a robotic arm to automatically complete the transfer of unqualified products.

[0086] The system specifically sets up an unqualified product storage area beside the production line, which is the first area mentioned in S103. When a certain magnetic core is detected as unqualified, the system sends an instruction to the first robotic arm to drive the robotic arm to grab the unqualified magnetic core from the conveyor belt and transfer it to the first area. The first robotic arm usually uses a pneumatic or electric mechanism, equipped with a high-precision vision positioning system and a flexible robotic hand, and can quickly and accurately complete the grabbing and placing actions.

[0087] For example, when the system conducts spot checks on the M100022 material, it is found that the magnetic permeability of the magnetic core numbered A01-20210302-0012 is only 985, far lower than the qualified range. The system immediately triggers an alarm and simultaneously issues an instruction to the first robotic arm: "@Robot_1:GRAB(A01-20210302-0012), PLACE(NG_Area_1)". After receiving the instruction, the robotic arm identifies and locates the magnetic core through the vision system, grabs it from the production line, and then quickly moves to the first area and places the magnetic core into it.

[0088] S104. Send a second instruction to the second robotic arm to make the second robotic arm pick up and place the sub-chip inductor in the second area;

[0089] If the winding tension is not equal to the preset tension, the system sends a second instruction to the second robotic arm to make the second robotic arm pick up and place the sub-chip inductor in the second area, which is located on one side of the winding area and is used to store unqualified sub-chip inductors. Similar to the magnetic core material detection, in the winding process, the system also needs to conduct quality inspection on the wound sub-chip inductors. If defective products are found, they should be removed from the main production line in time to avoid consuming subsequent resources. Step S104 is to use the second robotic arm to automatically complete the transfer of defective products.

[0090] According to the tension detection result in step S102, if the system determines that the winding tension of a certain sub-chip inductor is abnormal, the product will be considered unqualified. At this time, the system will send an instruction to the second robotic arm to pick up the defective product from the conveyor belt in the winding area and transfer it to a dedicated storage area for unqualified products, that is, the second area. Compared with manual picking, the robotic arm transfer method greatly improves the efficiency and accuracy of isolating unqualified products.

[0091] For example, when producing the YT-01 type of chip inductor, the system finds that the winding tension of the defective product with the serial number "YT-01-20210302-1035" is only 0.8N, which is lower than the standard value. The system quickly makes a judgment and sends the instruction "@Robot_2:GRAB(YT-01-20210302-1035), PLACE(NG_Area_2)" to the second robotic arm. The robotic arm immediately locates the defective product, picks it up and transfers it to the second area at high speed.

[0092] S105. Determine whether the thickness is within a preset qualified range;

[0093] The system determines whether the thickness is within a preset qualified range, which is a previously set range. Specifically: receive the welding area monitoring video sent by the monitoring device;

[0094] Identify the sub-chip inductor in the welding area monitoring video to obtain an image of the sub-chip inductor;

[0095] Determine the placement posture of the sub-chip inductor according to the image;

[0096] When it is determined that the sub-chip inductor is in a flat placement posture, send a fourth instruction to the welding area monitoring device to make the welding area monitoring device move to the first preset position to capture a side view image of the chip inductor;

[0097] When it is determined that the sub-chip inductor is in a vertical placement posture, send a fifth instruction to the welding area monitoring device to make the welding area monitoring device move to the second preset position to capture a top view image of the chip inductor;

[0098] Determine the thickness of the sub-chip inductor according to the side view image or the top view image.

[0099] In addition to magnetic properties and winding quality, the appearance size of the chip inductor is also an important indicator to measure its quality. In the welding process of the chip inductor, the system focuses on whether the thickness of the product meets the design requirements. If the thickness exceeds the qualified range, problems such as poor soldering and misalignment will occur during subsequent SMT mounting, affecting the assembly quality of the entire unit.

[0100] To online detect the thickness of products, a high-resolution camera is installed in the welding area of the system to take pictures of each passing chip inductor. The system will analyze the images taken by the camera in real time and measure the thickness dimension of the product. Since the posture of the chip inductor may be different during the conveying process, the system adopts two different shooting strategies. When the chip inductor is in a flat state, the camera will move to a preset shooting position to shoot the product from the side and obtain its side view image. If the product is placed vertically, the camera will move to another shooting position to shoot the product from above to get a top view image. Whether it is a side view or a top view, the system can accurately extract the thickness dimension from it and compare it with the preset qualified range to determine whether the product is qualified.

[0101] For example, the standard thickness of the YT-01 type chip inductor is 1.0 ± 0.1 mm. After a certain product is welded, its thickness measured from the side view image is 0.95 mm, which just falls within the qualified range, and the system determines that the thickness of this product is qualified. While the thickness measurement value of another product is 1.15 mm, which exceeds the qualified range, and the system will determine it as abnormal thickness and perform isolation processing according to step S106.

[0102] S106. Send a third instruction to the third robotic arm to make the third robotic arm grab the chip inductor and place it in the third area;

[0103] If it is not within the preset qualified range, send a third instruction to the third robotic arm to make the third robotic arm grab the chip inductor and place it in the third area, and this third area is located on one side of the welding area and is used to store unqualified chip inductors.

[0104] Similar to the foregoing steps, when the system determines that a certain chip inductor is unqualified according to the thickness detection in step S105, it is also necessary to use the robotic arm to remove the unqualified product to the dedicated storage area. The third area in step S106 is used to store chip inductors with unqualified thickness.

[0105] For example, for the YT-01 type chip inductor with excessive thickness, the system will send an instruction to the third robotic arm "@Robot_3:GRAB(YT-01-20210302-1157), PLACE(NG_Area_3)". The robotic arm quickly grabs the product from the conveyor belt and transfers it to the third area.

[0106] S107. Record the off-line time point when the chip inductor passes through the preset point;

[0107] If it is within the preset qualified range, the system records the off-line time point when the chip inductor passes through the preset point.

[0108] For the qualified chip inductors detected by thickness measurement, the system needs to record their offline time for subsequent batch management and quality traceability. Specifically, the system will set a preset point on the conveyor line in the welding area. When each qualified product passes through this point, a signal will be triggered. The system captures this signal and records the corresponding time point as the offline time of the product.

[0109] For example, a qualified product of the YT-01 type chip inductor passes through the preset point at 14:25:36 on March 2, 2021. The system will record this time point and associate it with the serial number of the product to generate a record "YT-01-20210302-1205, 2021-03-02 14:25:36".

[0110] S108. Mark the chip inductors corresponding to all offline time points as qualified chip inductors and send all qualified chip inductors to the control terminal.

[0111] The above embodiments have the following beneficial effects:

[0112] Measure magnetic parameters using a magnetic permeability tester and a hysteresis loop measuring instrument, and determine whether the magnetic parameters are in the preset table, which can screen out qualified magnetic core materials, ensure that the magnetic properties meet the requirements, and lay a foundation for subsequent production. Secondly, detect the winding tension through a tension sensor to ensure that the winding is moderately tight, avoiding problems such as inter-turn short circuits caused by too loose winding or magnetic core damage caused by too tight winding, and further improving the product reliability. Furthermore, use visual inspection means to measure the thickness of the chip inductor after welding, determine whether it meets the design requirements, and reject unqualified products, thereby controlling the product consistency. Finally, record the offline time points of qualified products to achieve traceability management of the production process. Real-time feedback the detection results to the control terminal for easy statistical analysis and anomaly warning. Real-time detect all chip inductors on the production line, and judge whether the chip inductor is qualified by identifying the monitoring video of the chip inductor, thereby improving the accuracy of detecting the qualification rate of chip inductors.

[0113] For the magnetic core materials with unqualified performance, they are grabbed by the first robotic arm and transferred to a special unqualified product storage area to prevent them from entering the winding process. For the sub-standard chip inductors with abnormal winding tension, they are grabbed by the second robotic arm and transferred to another unqualified product storage area to prevent them from being wrongly welded. For the finished chip inductors with unqualified thickness after welding, they are grabbed by the third robotic arm and transferred to the finished product unqualified area to prevent them from being mixed into the qualified products. This measure makes full use of machine vision and robotic arm technology to achieve automatic screening of unqualified products through precise identification and positioning, greatly improving the detection efficiency and accuracy. Classify and store different types of unqualified products for subsequent defect analysis and process improvement.

[0114] After determining that the winding tension is qualified, machine vision technology is introduced to conduct on-line inspection of the products in the welding area. Image data is collected by a high-definition industrial camera, and image processing algorithms are used to accurately extract the thickness information, realizing the automatic inspection of product appearance defects.

[0115] For the different placement postures that the chip inductors may have, corresponding strategies are adopted to adjust the camera position to ensure obtaining the correct inspection perspective, thereby guaranteeing the accuracy and reliability of thickness measurement. For the horizontally placed chip inductors, their thickness information is mainly reflected in the side view image. By controlling the camera to move to the preset position to capture the side view image and combining with the calibrated dimensions, the edge detection algorithm can be used to accurately extract the thickness value. For the vertically placed chip inductors, the thickness characteristics are mainly reflected in the top view image. By controlling the camera to move to another preset position to capture the top view image and using the dimensional relationship between the reference holes and the product contour in the top view, the product thickness can be indirectly measured, improving the accuracy of thickness measurement.

[0116] The above embodiments are for the real-time inspection of the production line. After the inspection is completed and the results are obtained, there may be a situation where the qualified rate does not meet the standard. In this case, it is still necessary to rely on the detection system to determine which link has problems, so as to be able to correct the problems. The following combines Figure 2 , and describes another chip inductor production inspection method of the present application:

[0117] Please refer to Figure 2 , which is another process schematic diagram of a chip inductor production inspection method in the embodiment of the present application.

[0118] S201. Determine the total number of chip inductors that can be produced according to the quantity of magnetic materials;

[0119] In the production process of chip inductors, the quantity of magnetic materials is the key factor determining the production capacity. Each magnetic core will be processed into a chip inductor, so the number of magnetic cores directly determines the total number of chip inductors that can be produced. The system can estimate the maximum output of this batch by counting the magnetic materials put into production.

[0120] Specifically, the system will weigh the magnetic core materials before the production starts to obtain the total weight. Then, according to the standard weight of a single magnetic core, the number of magnetic cores is calculated. For example, if the total weight of the magnetic cores fed in this batch is 50 kg and the standard weight of each magnetic core is 0.5 g, then the number of magnetic cores is 50 kg ÷ 0.5 g / each = 100,000. If production losses are not considered, these 100,000 magnetic cores can be made into 100,000 chip inductors.

[0121] S202. Calculate the difference between the total number of chip inductors that can be produced and the number of qualified chip inductors;

[0122] After production is completed, the system will count the actual number of qualified chip inductors produced to obtain the quantity of qualified products. By comparing this value with the total estimated production quantity in step S201, the loss situation during the production process can be calculated. The system will calculate the difference between the two values, that is, the total number of chip inductors that can be produced minus the number of qualified chip inductors.

[0123] For example, in step S201, the system estimates that 100,000 chip inductors can be produced in a certain batch. After the full-process production, 96,000 qualified products are finally obtained. Then the difference between the two values is 100,000 - 96,000 = 4,000. This indicates that 4,000 chip inductors are scrapped due to various reasons during the production process and do not form qualified products.

[0124] S203. Divide the difference by the total number of chip inductors that can be produced to obtain the qualified rate;

[0125] After obtaining the difference between the total production quantity and the number of qualified products, the system will further calculate the qualified rate to intuitively evaluate the quality level of the production process. The specific method is to divide the number of qualified products by the total production quantity, and the resulting percentage is the qualified rate.

[0126] Expressed by a mathematical formula: qualified rate = number of qualified products ÷ total production quantity × 100%

[0127] Combined with the previous example, the total production quantity is 100,000 and the number of qualified products is 96,000. Substituting into the formula, we get:

[0128] qualified rate = 96,000 ÷ 100,000 × 100% = 96%

[0129] This result indicates that the qualified rate of the entire production process reaches 96%. That is to say, on average, for every 100 chip inductors produced, 96 are qualified and can be delivered to customers.

[0130] The qualified rate is a key indicator to measure the quality performance of the production process, directly reflecting the effectiveness and reliability of production. Generally speaking, the higher the qualified rate, the more stable the production process and the more in-place the quality control. By tracking the change of the qualified rate, the system can timely detect quality anomalies and activate the early warning and correction mechanisms. For example, if the qualified rate suddenly drops significantly, the system will automatically alarm, prompting the management to take countermeasures, find out the reasons, and prevent further losses.

[0131] S204. When it is determined that the qualified rate is not greater than the preset minimum qualified rate, send the seventh instruction to the production line controller to stop the operation of the production line controller;

[0132] When the system determines that the qualified rate is not greater than the preset minimum qualified rate, it sends a seventh instruction to the production line controller to stop the operation of the production line, preventing greater losses caused by continued production. Stopping the production line in this way is also for subsequent adjustment of the production line.

[0133] S205. Determine the number of non-conforming products in the first area, the second area, and the third area;

[0134] After suspending the operation of the production line, the system will further locate the link where the quality abnormality occurs. According to the design of the previous steps, there are three non-conforming product isolation areas on the chip inductor production line, corresponding to poor magnetic properties (the first area), poor winding (the second area), and abnormal thickness (the third area) respectively. By counting the number of non-conforming products in these three areas, the system can judge which process the quality abnormality mainly occurs in.

[0135] For example, the system checks the storage conditions of the three isolation areas and finds that there are 120 non-conforming products in the first area, 80 in the second area, and 200 in the third area. This shows that there are quality problems to varying degrees in the three links of magnetic property detection, winding, and thickness detection, among which the abnormal thickness is the most prominent.

[0136] By distinguishing the bad conditions of different processes, the system can more accurately identify the root cause of the quality abnormality. This provides a direction for subsequent cause analysis and formulation of improvement measures, and helps to improve the efficiency of solving quality problems.

[0137] S206. Determine the non-conforming area where the number of non-conforming products is greater than the preset maximum number;

[0138] The system will further judge whether the bad level of each area exceeds the expectation. Similar to the minimum qualified rate, for each isolation area, the system will also preset a standard for the maximum number of non-conforming products. Once the actual number of bad products in a certain area exceeds this upper limit, it means that the quality abnormality of the corresponding process is relatively serious and corresponding countermeasures need to be taken in a timely manner.

[0139] For example, the system presets the maximum number of non-conforming products in the first area to be 100, in the second area to be 80, and in the third area to be 150. Combining the statistical results of step S205, it can be found that the number of bad products in the first area and the third area exceeds the standard, while the second area just reaches the upper limit. Therefore, the system determines that the quality abnormality risks of the two processes of magnetic property detection and thickness detection are higher and need to be focused on.

[0140] By setting an upper limit on the number of defective products, the system can automatically identify the most abnormal processes with serious quality problems. Based on this, managers can conduct targeted cause analysis, prioritize improvements in the highest-risk links, and improve the timeliness and accuracy of quality management. At the same time, the system can also quantitatively assess the severity of quality anomalies based on the gap between the number of defective products in each area and the upper limit, dynamically adjust the warning level and response measures, and achieve hierarchical management and control.

[0141] S207, determining the working parameters corresponding to the unqualified area, and sending the working parameters to the control terminal;

[0142] After finding the process with the most serious quality abnormality, the system will further explore the technical reasons for the abnormality. Generally speaking, each production process corresponds to a series of process parameters, such as raw material ratio, equipment parameter settings, environmental conditions, etc. These parameters are the key to ensuring the stability of process quality, and their fluctuations are often an important cause of quality abnormalities.

[0143] Therefore, the system will automatically retrieve the process parameters corresponding to the abnormal process. Taking the third area (abnormal thickness) as an example, the system found that the probe height at the thickness detection position was set to 1.05mm, while the standard value should be 1.00mm. The probe height offset caused some qualified products to be misjudged as exceeding the thickness standard. The system records this parameter abnormality, forms a parameter report, sends it to the control terminal, and notifies relevant personnel to correct the parameters.

[0144] S208, after determining that the adjustment instruction sent by the receiving control terminal is received, adjusting the working parameters according to the adjustment instruction;

[0145] When the manager of the control terminal receives the parameter abnormality report sent by the system, he will further analyze the problem, formulate corresponding corrective measures, and form parameter adjustment instructions. For example, in response to the probe height offset problem identified in step S207, the manager decided to adjust the probe height from 1.05mm back to the standard value of 1.00mm to eliminate the thickness abnormality caused by misjudgment. The manager sends this adjustment instruction back to the system through the control terminal.

[0146] After receiving the adjustment instruction, the system will automatically modify the parameters of the production line. Machine vision will guide the robot arm to fine-tune the probe height to 1.00mm to complete the parameter correction. At the same time, the system will also record the adjustment process, including the content of the adjustment instruction, the parameter values ​​before and after the adjustment, the adjustment time, etc., to form a complete traceable record to ensure that every response process to quality abnormalities can be documented.

[0147] S209, sending an eighth instruction to the production line controller to start the production line controller to operate;

[0148] After the process parameters are adjusted, the triggering factors for quality anomalies are basically eliminated, and the production process can be restarted. At this time, the system will send a restart command to the production line controller to notify it to resume production. For example, the system sends the command "@Controller:ResumeProduction". After receiving the command, the controller will gradually restore each station and equipment to the operating state according to the restart procedure, including loading, powering on, resetting, etc., to ensure that the production process starts again smoothly and orderly.

[0149] S210. After a preset time period, re-determine the number of non-conforming products in the first area, the second area, and the third area.

[0150] After the production restarts and runs stably for a period of time, the system will check the three non-conforming product isolation areas again and count the number of non-conforming products in each area. This step mainly has two purposes: one is to evaluate the effectiveness of the process parameter adjustment by comparing the defective conditions before and after the resumption of production; the other is to evaluate the improvement progress and trend of the quality problem by comparing the changes in the number of non-conforming products in the three areas.

[0151] For example, within 2 hours after the resumption of production, the system re-counts the number of non-conforming products in the three isolation areas. The results show that there are 20 in the first area, 10 in the second area, and 30 in the third area. Comparing the data in step S205, the number of defects in the three areas has decreased significantly. Among them, the improvement in the third area is the most obvious, from 200 to 30, indicating that the adjustment of the probe height has a significant effect on solving the thickness anomaly problem. However, 30 is still higher than the normal level, suggesting that there may be other influencing factors.

[0152] S211. Judge whether the number of non-conforming products in each of the first area, the second area, and the third area is greater than the preset maximum number.

[0153] After counting the number of non-conforming products in each isolation area after the resumption of production, the system will compare the results with the preset maximum number of non-conforming products standard to judge whether the quality anomaly still exists. Once it is found that the number of non-conforming products in a certain area exceeds the preset upper limit, the system will issue a warning, indicating that the quality problem has not been completely solved.

[0154] Combined with the example in step S206, the maximum number of non-conforming products in the three isolation areas is set to 100, 80, and 150 respectively. The actual statistics after the resumption of production are 20 in the first area, 10 in the second area, and 30 in the third area. It can be seen that the defective levels in the three areas have been controlled within the standard range, and the overall quality performance of the current production process is generally qualified.

[0155] S212. Upload the current working parameters to the preset database for storage.

[0156] When the production process resumes normalcy, the system uploads the data and parameters formed during the entire process of dealing with quality anomalies to the database for archiving. This includes the non-conforming product statistics data, abnormal process parameters, adjustment instructions, comparison data before and after improvement, etc. mentioned in the previous steps. Through data storage, the system can completely record the whole process of each quality anomaly event, forming valuable empirical data.

[0157] For example, the system summarizes the handling process of this thickness anomaly as a case, including data on various links such as problem discovery (step S204), problem location (steps S205 and S206), cause analysis (step S207), solution measure formulation (step S208), effectiveness tracking (steps S210 and S211), etc., and stores it in the quality case database. In the future, if other production lines encounter similar problems, they can retrieve this case and refer to its handling method to quickly formulate countermeasures.

[0158] The continuous accumulation of data can help the system summarize the laws of quality anomalies and optimize the early warning model and response process. For example, through big data analysis of non-conforming products, the system can find that the occurrence of certain defects often has a certain time periodicity, and then accordingly adjust the sampling frequency; through the correlation analysis of parameter fluctuations and defect rates, the system can identify the most critical factors affecting quality, and then optimize the parameter control limits.

[0159] The above embodiments have the following beneficial effects:

[0160] The quantity of magnetic materials is the key factor determining the total number of surface mount inductors that can be produced, and the theoretical output can be estimated based on the quantity of magnetic materials. The number of qualified surface mount inductors reflects the number that meets the quality standards in the actual output. The difference between the two reflects the number of non-conforming products caused by various reasons during the production process. Dividing the difference by the total number that can be produced gives the qualification rate, which intuitively shows the defect rate level of the production line. By real-time monitoring of the qualification rate, the operating quality of the production line can be objectively evaluated. Once the qualification rate is lower than expected, measures can be taken in a timely manner for improvement. Sending the qualification rate to the control terminal enables managers to grasp the quality dynamics in real time, analyze whether the production line is stable based on the trend of the qualification rate, and respond in a timely manner when fluctuations occur.

[0161] The system determines in real time whether the pass rate of the production line is abnormal by setting a minimum pass rate threshold. Once the pass rates of multiple consecutive batches of products are lower than the minimum standard, a shutdown instruction is automatically sent to the production line controller to prevent the backlog of non-conforming products. At the same time, the system also counts the number of non-conforming products in different areas (such as the magnetic material area, the winding area, the welding area, etc.) to identify problem areas where the number of non-conforming products exceeds the upper limit. This refined control by area can narrow down the scope of problem investigation and speed up the problem location. After locking the problem area, the system further analyzes the process parameter settings in this area, identifies parameter items that may cause defects, and sends them to the control terminal. By presenting the time, location, and cause of the problem in association, production managers can have a clear understanding of the overall situation of the problem, and thus can quickly formulate targeted corrective and preventive measures to reduce the recurrence of similar problems.

[0162] When the system locates the problem area and analyzes the suspicious process parameters, production managers can adjust the control parameters of the equipment accordingly. To verify the effect of the adjustment, the system automatically restarts the production line after receiving the adjustment instruction, and at the same time activates the special monitoring mode to continuously track several production batches after the adjustment. By comparing the changes in the number of non-conforming products in each area before and after the adjustment, it is possible to objectively evaluate whether the process parameter adjustment is effective. If the optimized parameters can control the number of non-conforming products in each area within the preset qualified range, it indicates that this round of improvement is successful, and the system saves the optimized parameters to the database as the new standard for subsequent production. However, if the quality problem is not completely eliminated and the number of non-conforming products still exceeds the standard, the system will perform problem area location and parameter analysis again, and put forward further optimization suggestions based on the previous round of improvement until the best parameter combination is found.

[0163] The system in the embodiments of the present invention application will be described from the perspective of hardware processing. Please refer to Figure 3 , which is a schematic structural diagram of an entity device of a chip inductor production detection system provided by an embodiment of the present application.

[0164] It should be noted that Figure 3 the structure of the system shown is only an example and should not impose any limitations on the functions and usage scope of the embodiments of the present invention.

[0165] Such as Figure 3As shown, the system includes a Central Processing Unit (CPU) 301, which can perform various appropriate actions and processes according to the program stored in the Read-Only Memory (ROM) 302 or the program loaded from the storage section 308 into the Random Access Memory (RAM) 303, such as executing the method in the above embodiment. In the RAM 303, various programs and data required for system operation are also stored. The CPU 301, ROM 302, and RAM 303 are connected to each other via a bus 304. An Input / Output (I / O) interface 305 is also connected to the bus 304.

[0166] The following components are connected to the I / O interface 305: an input section 306 including a camera, an infrared sensor, etc.; an output section 307 including a Liquid Crystal Display (LCD), a speaker, etc.; a storage section 308 including a hard disk, etc.; and a communication section 309 including a network interface card such as a LAN (Local Area Network) card, a modem, etc. The communication section 309 performs communication processing via a network such as the Internet. A drive 310 is also connected to the I / O interface 305 as required. A removable medium 311, such as a magnetic disk, an optical disk, a magneto-optical disk, a semiconductor memory, etc., is installed on the drive 310 as required so that a computer program read from it can be installed into the storage section 308 as required.

[0167] In particular, according to an embodiment of the present invention, the process described above with reference to the flowchart can be implemented as a computer software program. For example, an embodiment of the present invention includes a computer program product, which includes a computer program carried on a computer-readable medium, and the computer program contains a computer program for executing the method shown in the flowchart. In such an embodiment, the computer program can be downloaded and installed from the network via the communication section 309, and / or installed from the removable medium 311. When the computer program is executed by the Central Processing Unit (CPU) 301, various functions defined in the present invention are executed.

[0168] It should be noted that the computer-readable medium shown in the embodiments of the present invention can be a computer-readable signal medium, a computer-readable storage medium, or any combination of the two. The computer-readable storage medium can be, for example, but not limited to, an electrical, magnetic, optical, electromagnetic, infrared, or semiconductor system, apparatus, or device, or any combination of the above. More specific examples of the computer-readable storage medium can include, but are not limited to: an electrical connection with one or more wires, a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM), a flash memory, an optical fiber, a portable compact disc read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the above. In the present invention, the computer-readable storage medium can be any tangible medium that contains or stores a program, and this program can be used by or in combination with an instruction execution system, apparatus, or device. In the present invention, the computer-readable signal medium can include a data signal propagated in a baseband or as part of a carrier wave, which carries a computer-readable computer program. Such a propagated data signal can take various forms, including but not limited to electromagnetic signals, optical signals, or any suitable combination of the above.

[0169] The flowcharts and block diagrams in the accompanying drawings illustrate the possible architectures, functions, and operations of systems, methods, and computer program products according to various embodiments of the present invention. Among them, each block in the flowchart or block diagram can represent a module, a program segment, or a part of code, and the above module, program segment, or part of code contains one or more executable instructions for implementing the specified logical function. It should also be noted that in some alternative implementations, the functions marked in the blocks may occur in a different order from that marked in the accompanying drawings. For example, two consecutive blocks shown may actually be executed substantially in parallel, and they may sometimes be executed in the reverse order, depending on the functions involved. It should also be noted that each block in the block diagram or flowchart, as well as the combination of blocks in the block diagram or flowchart, can be implemented by a dedicated hardware-based system for performing the specified functions or operations, or can be implemented by a combination of dedicated hardware and computer instructions.

[0170] As another aspect, the present invention also provides a computer-readable storage medium, which can be included in the system described in the above embodiments; or it can exist separately without being assembled into the system. The above storage medium carries one or more computer programs, and when the above one or more computer programs are executed by a processor of a system, the system implements the method provided in the above embodiments.

[0171] As described above, the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some of the technical features; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the various embodiments of the present application.

[0172] As used in the above embodiments, depending on the context, the term "when..." can be interpreted to mean "if...", or "after...", or "in response to determining...", or "in response to detecting...". Similarly, depending on the context, the phrase "when determining..." or "if detecting (the stated condition or event)" can be interpreted to mean "if determining...", or "in response to determining...", or "when detecting (the stated condition or event)", or "in response to detecting (the stated condition or event)".

[0173] In the above embodiments, it can be implemented in whole or in part by software, hardware, firmware, or any combination thereof. When implemented using software, it can be implemented in whole or in part in the form of a computer program product. The computer program product includes one or more computer instructions. When the computer program instructions are loaded and executed on a computer, the processes or functions described in the embodiments of the present application are generated in whole or in part. The computer can be a general-purpose computer, a special-purpose computer, a computer network, or other programmable devices. The computer instructions can be stored in a computer-readable storage medium, or transmitted from one computer-readable storage medium to another computer-readable storage medium. For example, the computer instructions can be transmitted from one website, computer, server, or data center to another website, computer, server, or data center in a wired manner (such as coaxial cable, optical fiber, digital subscriber line) or a wireless manner (such as infrared, wireless, microwave, etc.). The computer-readable storage medium can be any available medium that the computer can access, or a data storage device such as a server or data center that includes one or more integrated available media. The available medium can be a magnetic medium (such as a floppy disk, hard disk, magnetic tape), an optical medium (such as a DVD), or a semiconductor medium (such as a solid-state drive), etc.

[0174] Those of ordinary skill in the art can understand all or part of the processes in the methods of the above embodiments. These processes can be completed by relevant hardware instructed by a computer program. The program can be stored in a computer-readable storage medium. When the program is executed, it can include the processes of the above method embodiments. The foregoing storage media include various media that can store program codes, such as ROM or random access memory RAM, magnetic disks, or optical discs.

Claims

1. A chip inductor production detection method, characterized in that: include: Determine whether the magnetic core material is in a preset table according to the magnetic parameters measured by the magnetic permeability tester and the hysteresis loop tester, wherein the magnetic parameters include the magnetic permeability measured by the magnetic permeability tester and the coercive force measured by the hysteresis loop tester. When the magnetic parameters are in the preset table, it indicates that the corresponding magnetic core material is qualified; If the magnetic core material is in the preset table, it is determined whether the winding tension detected by the tension sensor is equal to the preset tension. At this time, the magnetic core material is in the winding area. After leaving the winding area, the magnetic core material becomes a secondary chip inductor. If the winding tension is equal to the preset tension, the welding area monitoring video sent by the monitoring device is identified to obtain the thickness of the chip inductor; Determining whether the thickness is within a preset qualified range; If it is within the preset qualified interval, the offline time point when the chip inductor passes the preset point is recorded; All the chip inductors corresponding to the offline time points are marked as qualified chip inductors, and all the qualified chip inductors are sent to the control terminal.

2. The method according to claim 1, characterized in that After determining whether the thickness is within a preset qualified range, the method further includes: If the magnetic core material is not in the preset table, sending a first instruction to the first robot arm to enable the first robot arm to clamp the magnetic core material and place it in the first area; If the winding tension is not equal to the preset tension, sending a second instruction to the second robotic arm so that the second robotic arm will clamp the secondary chip inductor and place it in the second area; If it is not in the preset qualified interval, a third instruction is sent to the third robotic arm to enable the third robotic arm to clamp the chip inductor and place it in the third area.

3. The method according to claim 1, characterized in that If the winding tension is equal to the preset tension, identifying the welding area monitoring video sent by the monitoring device to obtain the thickness of the chip inductor specifically includes: Receive the welding area monitoring video sent by the monitoring equipment; Identify the sub-chip inductor in the welding area monitoring video and obtain an image of the sub-chip inductor; The thickness of the sub-chip inductor is determined according to the image.

4. The method according to claim 3, characterized in that: Determining the thickness of the sub-chip inductor according to the image specifically includes: Determine the placement posture of the secondary chip inductor according to the image; When it is determined that the secondary chip inductor is in a flat position, a fourth instruction is sent to a welding area monitoring device to move the welding area monitoring device to a first preset position to capture a side view image of the chip inductor; When it is determined that the secondary chip inductor is in a vertical position, a fifth instruction is sent to the welding area monitoring device to move the welding area monitoring device to a second preset position to capture a top view image of the chip inductor; The thickness of the sub-chip inductor is determined according to the side view image or the top view image.

5. The method according to claim 1, characterized in that After marking all the chip inductors corresponding to the offline time points as qualified chip inductors and sending all the qualified chip inductors to the control terminal, the method further includes: The total number of chip inductors that can be produced is determined based on the amount of core material; The number of qualified chip inductors is divided by the total number of producible chip inductors to obtain a qualified rate, and the qualified rate is sent to the control terminal.

6. The method according to claim 5, characterized in that The step of dividing the number of qualified chip inductors by the total number of producible chip inductors to obtain a qualified rate, and sending the qualified rate to the control terminal, specifically includes: When it is determined that the qualified rate is not greater than the preset minimum qualified rate, a seventh instruction is sent to the production line controller to stop the operation of the production line controller; Determine the number of non-conforming products in the first area, the second area, and the third area, wherein the non-conforming products include magnetic core materials, sub-chip inductors, and chip inductors; Determine a non-conforming area containing a quantity of the non-conforming product greater than a preset maximum quantity; Determine the operating parameters corresponding to the unqualified area, and send the operating parameters to the control terminal.

7. The method according to claim 6, characterized in that After determining the operating parameters corresponding to the unqualified area and sending the operating parameters to the control terminal, the method further includes: After determining to receive the adjustment instruction sent by the control terminal, adjusting the working parameter according to the adjustment instruction; sending an eighth instruction to the production line controller to enable the production line controller to start running; After a preset period of time, re-determine the number of non-conforming products in the first area, the second area, and the third area; Determine whether the quantity of the non-conforming products contained in each of the first area, the second area, and the third area is greater than the preset maximum quantity; If it is greater than the preset maximum number, executing the step of determining the working parameters corresponding to the unqualified area and sending the working parameters to the control terminal; If it is not greater than the preset maximum number, the current working parameters are uploaded to the preset database for storage.

8. A chip inductor production detection system, characterized in that: The system comprises: One or more processors and a memory; the memory is coupled to the one or more processors, the memory is used to store computer program code, the computer program code includes computer instructions, and the one or more processors call the computer instructions to cause the system to execute the method as described in any one of claims 1-7.

9. A computer-readable storage medium comprising instructions, characterized in that: When the instructions are executed on a system, the system is caused to execute the method according to any one of claims 1 to 7.

10. A computer program product, characterized in that When the computer program product is run on a system, the system is caused to execute the method according to any one of claims 1 to 7.

Images