Display panel

Abstract

This invention provides a display panel with a protrusion extension at the end of the array substrate, which increases the distance between the driving chip and the display area and the edge of the bezel. This solves the technical defects of existing display panels, which, while increasing the screen ratio, severely compress the bezel area, resulting in the driving chip being too close to the display area and the edge of the substrate, leading to poor electrical properties after the driving chip is pressed together and poor sealing of the liquid crystal cell.

Description

Technical Field

[0001] This invention relates to the field of display technology, and more particularly to a narrow bezel display panel. Background Technology

[0002] With the technological development of full-screen displays, the screen-to-body ratio of displays is constantly increasing, and the bottom bezel of displays is getting smaller and smaller. However, the narrowing of the bottom bezel directly leads to the compression of the space for setting up driver chips, wiring, or other components, and the driver chip is getting closer and closer to the edge of the array substrate. Since glass cracks and defects are easily caused during substrate glass cutting, cracks extending to the bonding area can lead to poor electrical performance after the driver chip is pressed together. At the same time, the smaller the wiring space from the driver chip to the display area, the closer the driver chip is to the display area, which may cause the panel to be coated with too fine glue, resulting in a series of defects such as liquid crystal leakage.

[0003] In summary, existing display panels, while increasing the screen-to-body ratio, severely compress the bezel area, resulting in the driver chip being too close to the display area and the edge of the substrate. This leads to technical defects such as poor electrical properties after the driver chip is pressed together and poor panel sealing. Summary of the Invention

[0004] The present invention provides a display panel in which a protrusion extension is provided at the end of the array substrate of the display panel, which increases the distance between the driving chip and the display area and the edge of the bezel, in order to solve the technical defects of existing display panels, which, while improving the screen ratio, severely compress the bezel area, resulting in the driving chip being too close to the display area and the edge of the substrate, causing poor electrical properties after the driving chip is pressed together and poor sealing of the liquid crystal cell.

[0005] To solve the above problems, the technical solution provided by the present invention is as follows:

[0006] The present invention provides a display panel, including an array substrate and a display area disposed on the surface of the array substrate, wherein a portion of the array substrate not covering the display area forms a frame, and a driver chip and a flexible circuit board are bonded within the frame;

[0007] Wherein, at least one bump is formed at the end of the frame away from the display area, and the driving chip is located between the edge of the bump and the edge of the display area; a portion of the flexible circuit board is bent to the back of the array substrate via the edge of the recess on at least one side of the bump.

[0008] According to one embodiment of the present invention, the distance between the side of the driving chip near the display area and the edge of the display area is greater than the distance between the side of the driving chip near the bump and the edge of the bump.

[0009] According to one embodiment of the present invention, the driving chip is disposed within the frame and located outside the bump.

[0010] According to one embodiment of the present invention, the driver chip is wholly or partially disposed within the bump.

[0011] According to one embodiment of the present invention, the protrusion includes two symmetrically arranged short sides connecting the edge of the frame, and a long side connecting the other end of the two side sides; the short sides are perpendicular to the edge of the frame; or, the included angle formed between the short sides and the edge of the frame is not a right angle.

[0012] According to one embodiment of the present invention, the protrusion includes an outer arc edge, the two ends of the outer arc edge are connected to the edge of the frame, and the end of the outer arc edge is transitioned to an inner arc.

[0013] According to an embodiment of the present invention, at least one set of GOA traces are disposed within the array substrate. The GOA traces include a parallel segment located outside the display area and parallel to the edge of the display area, and an inclined segment located within the frame and pointing towards the driver chip. The inclined segment of the GOA trace is connected to the driver chip to input a Gate signal, and the parallel segment of the GOA trace is connected to the scan line of each pixel row to output a Gate signal. A plurality of metal terminals for accessing signals of the flexible circuit board are disposed within the frame. The metal terminals include at least a main signal metal terminal group and a secondary signal metal terminal group. The main signal metal terminal group is disposed close to the driver chip, and the secondary signal metal terminal group is disposed away from the driver chip and the inclined segment of the GOA trace.

[0014] According to one embodiment of the present invention, the secondary signal metal terminal group is separately disposed from the primary signal metal terminal group, and the primary signal metal terminal is completely or partially located within the bump, while the secondary signal metal terminal is located outside the bump.

[0015] According to an embodiment of the present invention, the flexible circuit board includes a main body section and a connection section for connecting the metal terminals. The connection section includes a first block corresponding to the main signal metal terminal group and a second block corresponding to the secondary signal metal terminal group, wherein the first block and the second block are offset from each other.

[0016] According to one embodiment of the present invention, a virtual metal terminal group is further provided within the frame, and the virtual metal terminal group is located on the side of the secondary signal metal terminal group away from the inclined section of the driver chip and the GOA trace.

[0017] According to one embodiment of the present invention, the area of ​​each metal terminal in the main signal metal terminal group is the same as the area of ​​each metal terminal in the secondary signal metal terminal group; wherein, the length of each metal terminal in the main signal metal terminal group is less than the length of each metal terminal in the secondary signal metal terminal group, and the width of each metal terminal in the main signal metal terminal group is greater than the width of each metal terminal in the secondary signal metal terminal group.

[0018] According to one embodiment of the present invention, the length of each metal terminal in the main signal metal terminal group decreases from the metal terminal away from the inclined section of the driver chip and the GOA trace to the metal terminal close to the inclined section of the driver chip and the GOA trace; and the width of each metal terminal in the main signal metal terminal group increases from the metal terminal away from the inclined section of the driver chip and the GOA trace to the metal terminal close to the inclined section of the driver chip and the GOA trace.

[0019] According to an embodiment of the present invention, the flexible circuit board includes a main body section and a connection section for connecting the metal terminals. The end of the connection section has a regular geometric shape, and the end of the connection section is provided with a first connection area and a second connection area. The first connection area covers and connects to the main signal metal terminal group, and the second connection area covers and connects to the secondary signal metal terminal group.

[0020] The beneficial effects of this invention are as follows: Compared with existing display panels, the display panel provided by this invention has a bump extension at the end of the array substrate, and the driving chip is disposed in the space between the display area and the bump. This increases the distance between the driving chip and the display area and the edge of the bezel, avoiding the technical defects of poor electrical properties and poor sealing of the liquid crystal cell caused by the compression of the bezel area of ​​a high screen ratio display. At the same time, the bending section of the flexible circuit board is located in the flat area on both sides of the bump, and the thickness of the bending section does not exceed the edge of the bump, so it does not increase the bezel width and maintains the screen ratio of the display device. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments or prior art, the drawings used in the description of the embodiments or prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1a This is a schematic diagram of the main view structure of the display panel provided by the present invention;

[0023] Figure 1b for Figure 1a A schematic diagram of the cross-sectional structure in the A-A' direction.

[0024] Figure 2 This is a schematic diagram comparing the display panel provided by the present invention with the prior art.

[0025] Figure 3a A schematic diagram of the protrusion shape structure of a display panel provided by the present invention;

[0026] Figure 3b This is a schematic diagram of the bump shape structure of another display panel provided by the present invention;

[0027] Figure 3c A schematic diagram of the bump shape structure of another display panel provided by the present invention.

[0028] Figure 4a A schematic diagram of the metal terminal distribution structure of a display panel provided by the present invention;

[0029] Figure 4b for Figure 4a A schematic diagram of the flexible circuit board structure of the provided display panel;

[0030] Figure 4c This is a schematic diagram of the metal terminal distribution structure of another display panel provided by the present invention;

[0031] Figure 4d for Figure 4c A schematic diagram of the flexible circuit board structure of the provided display panel. Detailed Implementation

[0032] The following descriptions of the embodiments are with reference to the accompanying illustrations, illustrating specific embodiments in which the invention can be implemented. Directional terms used in this invention, such as [up], [down], [front], [back], [left], [right], [inner], [outer], [side], etc., are merely for reference to the accompanying illustrations. Therefore, the directional terms used are for illustrating and understanding the invention, and not for limiting the invention. In the figures, structurally similar units are denoted by the same reference numerals.

[0033] This invention addresses the technical defects of existing display panels, which, while increasing the screen-to-body ratio, severely compress the bezel area, resulting in the driver chip being too close to the display area and the edge of the substrate. This leads to electrical defects after the driver chip is pressed together and poor panel sealing. This embodiment can solve these defects.

[0034] like Figure 1a , Figure 1bAs shown, the display panel provided by the present invention includes an array substrate 101 and a color filter substrate 102 disposed opposite to the array substrate 101; a display area 103 is defined on the surface of the array substrate 101, the display area 103 is defined by a frame adhesive, a liquid crystal layer is disposed in the frame adhesive, and the color filter substrate 102 is bonded to the array substrate 101 by the frame adhesive.

[0035] A frame 104 is formed between the outer edge of the display area 103 and the edge of the array substrate 101. Signal traces are arranged in the frame 104, and other electronic components such as the driver chip 105 and the flexible circuit board 106 are bonded therein.

[0036] The color filter substrate 102 is shorter than the array substrate 101, and the color filter substrate 102 is higher than the surface of the array substrate 101. The area between the projection of the lower edge of the color filter substrate 102 onto the surface of the array substrate 101 and the edge of the array substrate 101 forms a stepped area. The stepped area is located within the frame 104, and other electronic components such as the driver chip 105 and the flexible circuit board 106 are located within the stepped area. The signal traces extend from the stepped area to the entire frame 104 and the display area 103.

[0037] When cutting the display panel master plate, a protrusion 107 is reserved at one end of the array substrate 101 away from the display area 103. The protrusion 107 is located at the middle position of the end of the array substrate 101. Recesses are formed on both sides of the protrusion 107. The driving chip 105 is disposed between the lower edge of the protrusion 107 and the edge of the display area 103, thereby increasing the distance between the upper side of the driving chip 105 and the edge of the display area 103, as well as the distance between the lower side of the driving chip 105 and the lower edge of the protrusion 107.

[0038] The flexible circuit board 106 includes a connecting section connected within the frame 104, a main body section bent to the back of the display panel, and a bending section connecting the connecting section and the main body section. The bending section is located within the recessed area, and the bending radius of the bending section is less than or equal to the length of the protrusion 107.

[0039] In this embodiment of the invention, the bumps are set according to the number of driving chips, and the positions of the bumps and the driving chips are not limited to the middle position of the frame. For example, the bumps can also be set close to any side of the frame.

[0040] Therefore, compared with the display panel of the prior art, the embodiment of the present invention widens the space on the upper and lower sides of the driver chip 105 without increasing the overall length of the bezel 104. This not only solves the space problem around the driver chip 105, but also maintains the narrow bezel of the display panel of the prior art.

[0041] like Figure 2 As shown, the left image is a display panel provided by the present invention, and the right image is a display panel of the prior art. Both the left and right images include an array substrate 201, a display area 202, a driving chip 206, and a color filter substrate 204. The array substrate 201 includes a frame 207. The frame 207 includes a distance A between the lower edge of the display area 202 and the edge of the color filter substrate 204, a length B of the driving chip 206, and a distance C between the upper edge of the driving chip 206 and the edge of the color filter substrate 204. The left image also includes a distance D between the length of the bump 208, a distance E between the lower edge of the driving chip 206 and the edge of the bump 208, and a distance F between the lower edge of the color filter substrate 204 and the edge of the recessed portion of the frame 207 in the left image / a distance F between the lower edge of the color filter substrate 204 and the edge of the frame 207 in the right image.

[0042] In this embodiment of the invention, the total length of the border is the sum of the spacing A, the spacing F, and the length D. The spacing A and the spacing F have the same value, and the difference between the spacing A and the spacing F is less than 50 μm. The length D is greater than the difference between the length B and the spacing F. For example, the length D is 5 to 6 times the difference between the length B and the spacing F, thereby ensuring that the spacing C and the spacing E are not less than 100 μm.

[0043] For example, please refer to the following table for specific settings:

[0044]

[0045] As shown in the table above, the display panel of this embodiment of the invention increases the length of the bump 208 and lowers the driving chip 206, thereby increasing the spacing A between the lower edge of the display area 202 and the edge of the color filter substrate 204, and the spacing C between the upper edge of the driving chip 206 and the edge of the color filter substrate 204. Furthermore, the spacing F between the lower edge of the color filter substrate 204 and the edge of the recessed portion of the frame 207 is reduced compared to the prior art. With the same bending radius of the flexible circuit board, the combined spacing of the frame 207 and the bent section of the flexible circuit board in this embodiment of the invention is smaller than that in the prior art, further shortening the length of the frame 207.

[0046] It should be noted that the length of this application is the dimension in the direction from the display area 203 to the border 207, and the width is the dimension in the direction perpendicular to the direction from the display area 203 to the border 207.

[0047] Furthermore, in order to reserve enough space for the GOA traces 205, fan-out traces 203 and metal terminals, the distance between the side of the driver chip 206 near the display area 202 and the edge of the display area 202 is set to be greater than the distance between the side of the driver chip 206 near the bump 208 and the edge of the bump 208.

[0048] For example, the driver chip 206 is disposed within the frame 207 and outside the bump 208.

[0049] For example, the driver chip 206 may be entirely or partially disposed within the bump 208.

[0050] like Figure 3a As shown, the display panel provided by the present invention includes an array substrate 301, a display area 302, a color filter substrate 303, and a bump 304 formed at the end of the array substrate 301. A driver chip 306 is disposed in the frame 305 of the array substrate 301.

[0051] The protrusion 304 includes two symmetrically arranged short sides connecting the edge of the frame 305, and a long side connecting the other end of the two side sides; for example, the short sides are straight sides, and the short sides are perpendicular to the edge of the frame 305, and the surface shape of the protrusion 304 is rectangular.

[0052] like Figure 3b As shown, the display panel provided by the present invention and Figure 3a The difference is that the short side is a straight side, and the angle formed between the short side and the edge of the frame 305 is not a right angle, that is, the angle is greater than or less than 90 degrees, and the surface shape of the protrusion 304 is trapezoidal.

[0053] For example Figure 3c As shown, the display panel provided by the present invention and Figure 3a , 3b The difference is that the protrusion 304 includes an outer arc edge, the two ends of which are connected to the edge of the frame 305, and the end of the outer arc edge is an inner arc transition.

[0054] like Figure 4aAs shown, the display panel provided by the present invention includes an array substrate 401, a color filter substrate 408, a bezel 405 located in the non-display area of ​​the array substrate 401, a driver chip 406 disposed within the bezel 405, and fan-out traces 403 connected to the driver chip 406. For example, the fan-out traces 403 are used to transmit display data signals to the display area 402. At least one set of GOA traces 409 are disposed within the bezel 405. Taking two sets of symmetrical GOA traces 409 as an example, both sets of GOA traces 409 include a parallel segment located outside the display area 402 and parallel to the edge of the display area 402, and an inclined segment located within the bezel 405 and pointing towards the driver chip 406. The inclined segment of the GOA trace 409 is connected to the driver chip 406 to input a Gate signal, and the parallel segment of the GOA trace 409 is connected to the scan lines of each pixel row to output a Gate signal.

[0055] The frame 405 is provided with a plurality of metal terminals for accessing signals of the flexible circuit board. The metal terminals include at least a main signal metal terminal group 4071 and a secondary signal metal terminal group 4072. For example, the main signal metal terminal group 4071 includes pixel data signals and gate signals, and the secondary signal metal terminal group 4072 includes power signals, etc. The main signal metal terminal group 4071 is located close to the driver chip 406, and the secondary signal metal terminal group 4072 is located away from the driver chip 406 and the inclined section of the GOA trace 409.

[0056] As the driver chip 406 moves downwards, the inclined segment of the GOA trace 409 connected to the driver chip 406 also moves downwards, thereby compressing the space for setting the metal terminal. If the metal terminal is too close to the GOA trace 409, the impedance will increase, which will cause signal distortion and affect the display quality. Therefore, in this embodiment of the invention, the metal terminal is set at least partially away from the GOA trace 409.

[0057] Furthermore, the secondary signal metal terminal group 4072 is separately disposed from the main signal metal terminal group 4071, and the main signal metal terminal is completely or partially located inside the bump 404, while the secondary signal metal terminal is located outside the bump 404, thereby effectively controlling the distance between the metal terminal and the GOA trace 409 and reducing impedance.

[0058] like Figure 4bAs shown, the flexible circuit board includes a main body section 4101 and a connection section for connecting the metal terminals. The connection section includes a first block 4102 corresponding to the main signal metal terminal group 4071 and a second block 4103 corresponding to the secondary signal metal terminal group 4072. The first block 4102 and the second block 4103 are offset from each other.

[0059] like Figure 4c As shown, with Figure 4a Compared to the previous metal terminal arrangement, the metal terminals are arranged closely together. The main signal metal terminal group 4071 and the secondary signal metal terminal group 4072 are both located outside the bump 404, thereby avoiding spatial compression of the bump. Furthermore, the area of ​​each metal terminal in the main signal metal terminal group 4071 is the same as the area of ​​each metal terminal in the secondary signal metal terminal group 4072, to ensure stable connection of the signal contact points.

[0060] Furthermore, the length of each metal terminal in the main signal metal terminal group 4071 is less than the length of each metal terminal in the secondary signal metal terminal group 4072, and the width of each metal terminal in the main signal metal terminal group 4071 is greater than the width of each metal terminal in the secondary signal metal terminal group 4072. By reducing the length of the metal terminal close to the GOA trace 409, the distance between the metal terminal and the GOA trace 409 is maintained, thereby reducing the impedance generated between the metal terminal and the GOA trace 409.

[0061] Furthermore, the length of each metal terminal in the main signal metal terminal group 4071 decreases from the metal terminal away from the inclined section of the driver chip 406 and the GOA trace 409 to the metal terminal close to the inclined section of the driver chip 406 and the GOA trace 409; and the width of each metal terminal in the main signal metal terminal group 4071 increases from the metal terminal away from the inclined section of the driver chip 406 and the GOA trace 409 to the metal terminal close to the inclined section of the driver chip 406 and the GOA trace 409, thereby ensuring that the distance between each metal terminal and the GOA trace 409 is equal.

[0062] like Figure 4d As shown, the flexible circuit board includes a main body section 4101 and a connection section 4104 for connecting the metal terminals. The end of the connection section 4104 has a regular geometric shape. The end of the connection section 4104 is provided with a first connection area and a second connection area. The first connection area covers and connects to the main signal metal terminal group, and the second connection area covers and connects to the secondary signal metal terminal group.

[0063] Furthermore, a virtual metal terminal group is also provided within the frame 405. The virtual metal terminal group is located on the side of the secondary signal metal terminal group 4072 away from the inclined section of the driver chip 406 and the GOA trace 409.

[0064] The beneficial effects are as follows: Compared with existing display panels, the display panel provided by the present invention has a bump extension at the end of the array substrate, and the driving chip is disposed in the space between the display area and the bump. This increases the distance between the driving chip and the display area and the edge of the bezel, avoiding the technical defects of poor electrical properties and poor sealing of the liquid crystal cell caused by the compression of the bezel area of ​​a high screen ratio display. At the same time, the bending section of the flexible circuit board is located in the flat area on both sides of the bump, and the thickness of the bending section does not exceed the edge of the bump, so it does not increase the bezel width and maintains the screen ratio of the display device.

[0065] In summary, although the present invention has been disclosed above with reference to preferred embodiments, the above preferred embodiments are not intended to limit the present invention. Those skilled in the art can make various modifications and refinements without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be determined by the scope defined in the claims.

Claims

1. A display panel, characterized in that, The display panel includes a display area, a border on one side of the display area, and a lower edge near the border; wherein the display panel includes: An array substrate, wherein the portion of the array substrate not covering the display area is the border; A protrusion is provided at the end of the frame away from the display area; A driver chip is bonded within the bezel, with its lower edge located between the lower edge of the display panel and the protrusion, and its upper edge located between the lower edge of the display panel and the edge of the display area. Multiple metal terminals, including a main signal metal terminal group and a secondary signal metal terminal group, wherein the main signal metal terminal group is arranged close to the driver chip and is wholly or partially located within the area of ​​the bump, and the secondary signal metal terminal group is arranged away from the driver chip. A flexible circuit board includes a main body and a connecting portion for connecting the metal terminals, wherein the connecting portion includes a first block connected to the main signal metal terminal group and a second block connected to the secondary signal metal terminal group, the first block and the second block being offset from each other.

2. The display panel according to claim 1, characterized in that, The distance between the side of the driver chip closest to the display area and the edge of the display area is greater than the distance between the side of the driver chip closest to the bump and the edge of the bump.

3. The display panel according to claim 2, characterized in that, The driver chip is disposed within the frame and outside the bump.

4. The display panel according to claim 2, characterized in that, The driver chip is wholly or partially disposed within the bump.

5. The display panel according to claim 1, characterized in that, The protrusion includes two symmetrically arranged short sides connecting the edge of the frame, and a long side connecting the other end of the two short sides. Wherein, the short side is perpendicular to the edge of the border; or, the angle formed between the short side and the edge of the border is not a right angle.

6. The display panel according to claim 1, characterized in that, The protrusion includes an outer arc edge, the two ends of which are connected to the edge of the frame, and the end of the outer arc edge transitions into an inner arc.

7. The display panel according to claim 1, characterized in that, At least one set of GOA traces are provided in the array substrate. The GOA traces include a parallel segment located outside the display area and parallel to the edge of the display area, and an inclined segment located inside the frame and pointing to the driver chip. The inclined segment of the GOA trace is connected to the driver chip, and the parallel segment of the GOA trace is connected to the scan line of each pixel row. The secondary signal metal terminal group is positioned at an angle away from the GOA trace.

8. The display panel according to claim 7, characterized in that, The secondary signal metal terminal group is separately disposed from the primary signal metal terminal group, and the secondary signal metal terminal is located outside the bump.

9. The display panel according to claim 7, characterized in that, A virtual metal terminal group is also provided within the frame, and the virtual metal terminal group is located on the side of the secondary signal metal terminal group away from the inclined section of the driver chip and the GOA trace.

10. The display panel according to claim 7, characterized in that, The area of ​​each metal terminal in the main signal metal terminal group is the same as the area of ​​each metal terminal in the secondary signal metal terminal group. The height of each metal terminal in the main signal metal terminal group is less than the height of each metal terminal in the secondary signal metal terminal group, and the width of each metal terminal in the main signal metal terminal group is greater than the width of each metal terminal in the secondary signal metal terminal group.

11. The display panel according to claim 10, characterized in that, The height of each metal terminal in the main signal metal terminal group decreases from the metal terminal away from the inclined section of the driver chip and the GOA trace to the metal terminal closer to the inclined section of the driver chip and the GOA trace. The width of each metal terminal in the main signal metal terminal group increases from the metal terminal away from the inclined section of the driver chip and the GOA trace to the metal terminal closer to the inclined section of the driver chip and the GOA trace.

Images