Wafer drying device and wafer drying method

Abstract

The invention discloses a wafer drying device and a wafer drying method in the field of wafer drying technology. The device comprises a cleaning box and a waste discharge box. A mounting frame is provided with a lateral movement component. A spray rod component is provided inside the cleaning box. The cleaning box is provided with an exhaust pipe, a second liquid discharge pipe and a first liquid discharge pipe. A quick discharge pipe and a quick discharge valve are provided at the bottom of the cleaning box. A flower basket is provided inside the cleaning box. A swing arm mechanism is provided on the mounting frame. A bubbler component, a heater and an exhaust pipe component are provided at the other end of the mounting frame. The exhaust pipe is arranged at the upper end of the second liquid discharge pipe. In the process of lowering the liquid level, the spray rod sprays liquid and gas with low surface tension to form a surface tension gradient on the wafer surface, activates the Marangoni effect, and effectively removes pollutants. The drying method comprises the following steps: step S1, wafer loading, step S2, pre-cleaning, step S3, wafer cleaning, step S4, wafer drying, and step S5, wafer unloading. The steps can further improve the cleanliness of wafer cleaning.

Description

Technical Field

[0001] The invention relates to the technical field of wafer drying, and in particular to a wafer drying device and a wafer drying method. Background Art

[0002] During wafer manufacturing, different chemicals and solvents may be used in different process steps to perform various chemical or physical treatments on the surface, such as oxidation, deposition, photolithography, etc. If there are previous chemicals left on the wafer surface, they may react with the chemicals in the subsequent process, resulting in cross contamination;

[0003] Contaminants on the wafer surface may also affect the electrical properties of semiconductor devices, such as changing the mobility of carriers, introducing leakage current or causing the threshold voltage of the device to drift. Some contaminants may cause physical damage to the device in subsequent process steps, such as corrosion, cracks or delamination. Contaminants may cause defects on the wafer surface, which may be amplified in subsequent process steps such as etching, deposition or lithography, resulting in device defects and reduced yield.

[0004] With the continuous advancement of semiconductor technology, the feature size of devices is getting smaller and smaller, and the cleanliness requirements for the wafer surface are getting higher and higher. Therefore, in the process of cleaning and drying the wafer, it is very important to remove the contaminants on the wafer surface. Removing these contaminants can prevent the device from failing during the manufacturing process or during use. However, the wafer drying devices on the market only use fluid spraying and gas to dry the wafer. This method is difficult to clean and remove the contaminants on the wafer surface;

[0005] At the same time, the existing wafer drying method lacks a pre-cleaning step, which makes it easy for contaminants to not be completely removed during the wafer cleaning process. Summary of the invention

[0006] In order to overcome the deficiencies of the existing technical solutions, the present invention provides a wafer drying device and a wafer drying method, which can effectively solve the technical problems that the wafer drying devices on the market only spray fluid and use gas to dry the wafer, which makes it difficult to clean and remove contaminants on the surface of the wafer, and the existing wafer drying method lacks a pre-cleaning step, which makes it easy for contaminants to be not completely removed during the cleaning process of the wafer.

[0007] The technical solution adopted by the present invention to solve its technical problem is: a wafer drying device comprises a mounting frame, one end of the mounting frame is provided with a cleaning box and a waste discharge box, the cleaning box is provided with a cleaning slot opening upward, the upper end of the cleaning box is provided with a cover plate non-fixedly connected thereto, and the mounting frame is provided with a lateral movement component for driving the cover plate to perform lateral movement, a spray rod component is provided inside the cleaning box, a liquid injection pipe and a liquid level gauge are provided on one side of the cleaning box, a group of exhaust pipes and a second liquid discharge pipe are provided on the side of the cleaning box close to the liquid injection pipe, and a first liquid discharge pipe is provided on the other side of the cleaning box, a group of the exhaust pipes are arranged in a left-right interval distribution, and a group of the second liquid discharge pipes are arranged in a left-right interval distribution. The two sides of the cleaning box are arranged at intervals, the exhaust pipe is arranged at the upper end of the second liquid discharge pipe, the bottom of the cleaning box is provided with a quick exhaust pipe and a quick exhaust valve, the quick exhaust valve is sleeved on the outside of the quick exhaust pipe and is used to open or close the quick exhaust pipe, the other end of the quick exhaust pipe is connected to the waste discharge box, at least one flower basket non-fixedly connected to the cleaning box is provided inside the cleaning box, a swing arm mechanism for driving the flower basket to move is provided on the side of the mounting frame close to the cleaning box, the swing arm mechanism includes a swing arm, a driving assembly connected to the swing arm, and a flower basket support assembly connected to the swing arm, and the flower basket support assembly includes a support plate and limit plates fixedly arranged at the left and right ends of the support plate;

[0008] The other end of the mounting frame is provided with a bubbler assembly, a heater and an exhaust duct assembly, the bubbler assembly includes an installation box, an air outlet duct arranged on the top of the installation box, an air inlet duct arranged on the side of the installation box, a liquid discharge pipe arranged on the front side of the installation box, a second waste pipe arranged at the bottom of the installation box, a bubbler arranged inside the installation box and three liquid level sensors fixed on the installation box, the three liquid level sensors are distributed in sequence from top to bottom, the exhaust duct assembly includes a cleaning tank exhaust duct, a rack exhaust duct and a bubbler heating exhaust duct, a first manual air regulating valve is provided at one end of the cleaning tank exhaust duct away from the rack exhaust duct, and a second manual air regulating valve is provided on the top of the rack exhaust duct.

[0009] Preferably, the cleaning box is mounted on the top of the mounting frame, the cleaning box is provided with a support rod for achieving a fixed connection with the mounting frame, the waste drain box is fixedly arranged at the bottom of the mounting frame, and the waste drain box is arranged on a side of the mounting frame close to the cleaning box, the waste drain box is provided with a quick-drain valve flange for connecting to a quick-drain pipe, the waste drain box is provided with at least two drain joints, the waste drain box is provided with a first waste drain pipe interconnected therewith, the waste water of the cleaning box is passed into the interior of the waste drain box through the quick-drain pipe, and the waste water inside the waste drain box is discharged through the first waste drain pipe.

[0010] Preferably, the transverse movement assembly includes a transverse movement guide rail, a transverse movement slider slidably matched with the transverse movement guide rail, and a transverse movement cylinder for driving the transverse movement slider to slide along the length direction of the transverse movement guide rail. The transverse movement slider is provided with a movable plate interconnected with it, and the cover plate and the movable plate are connected to each other and move therewith, a first sensor plate is fixedly provided on one side of the cover plate, and a mounting frame is provided with a cylinder mounting plate for mounting the transverse movement assembly, a buffer and a mounting bracket for mounting the buffer are provided on one side of the cylinder mounting plate, the transverse movement slider is in contact with the buffer but not connected, the transverse movement cylinder is fixedly provided on the end face of the cylinder mounting plate, the transverse movement guide rail is extended along the length direction of the cylinder mounting plate, a sensor mounting plate is provided on the side of the mounting frame away from the cylinder mounting plate, and an origin sensor is provided on one side of the sensor mounting plate.

[0011] Preferably, the front and rear ends of the flower basket are provided with handles integrally formed therewith, the bottom of the flower basket is provided with a positioning groove, the flower basket is provided with a plurality of material grooves, the plurality of material grooves are evenly spaced along the width direction of the flower basket, and each of the material grooves is provided with a wafer non-fixedly connected thereto, a positioning plate and a group of supporting plates are provided on the end face of the support plate, the structural shape and size of the positioning plate are consistent with the positioning groove, a group of supporting plates are respectively arranged on the front and rear sides of the positioning plate, each of the limiting plates is provided with a hollow groove, and the connection state of the flower basket and the flower basket support assembly is as follows: the bottom of the flower basket and the supporting plate are in contact with each other but not connected, the positioning plate is inserted into the inside of the positioning groove and the flower basket is stably placed on the flower basket support assembly by plugging, and the flower basket is arranged between a group of limiting plates, and the setting of the hollow groove and the handle can facilitate the flower basket to detach from the flower basket support assembly.

[0012] Preferably, the rack exhaust duct is arranged on one side of the bubbler heating exhaust duct and is interconnected therewith, the bubbler heating exhaust duct is arranged at the bottom of the cleaning tank exhaust duct and is interconnected therewith, and the cleaning tank exhaust duct is arranged on the top of the rack exhaust duct.

[0013] Preferably, the driving assembly includes a linear guide rail, a linear slider, a slide plate connected to the linear slider and moving therewith, and a servo motor for driving the linear slider to slide along the linear slide rail. The swing arm is provided with an active groove in an oblong shape, and the active groove is extended along the length direction of the swing arm. The front end face of the slide plate is provided with an active block integrally formed therewith, and the active block is arranged inside the active groove and slidably connected therewith. The front side of the swing arm is provided with a connecting arm connected thereto, and the swing arm and the connecting arm are parallel to each other, and a connecting plate is provided between the swing arm and the connecting arm, and one end of the connecting arm is connected to the support plate. When the servo motor drives the linear slider to slide along the linear slide rail, the slide plate drives the active block to slide inside the active groove, thereby causing the swing arm to swing, and the flower basket support assembly also swings with the swing arm.

[0014] Preferably, the spray rod assembly comprises a spray rod mounting seat, a drag chain, and a spray rod, a pressure gauge, a roller and a second sensor sheet arranged on the spray rod mounting seat, and the drag chain is used to drive the spray rod mounting seat to move.

[0015] A wafer drying method, the drying method comprising the following steps:

[0016] Step S1, wafer loading, the operator turns on the liquid high flow switch to allow liquid to enter, and when the liquid reaches the upper limit of the tank body, the wafer is loaded, and the cavity is closed after confirming that the wafer loading is completed;

[0017] Step S2, pre-cleaning, the operator opens the liquid high flow switch and the liquid low flow switch at the same time, the opening time is 8-12 seconds, and then closes the liquid high flow switch and the liquid low flow switch;

[0018] Step S3, wafer cleaning, open the IPA spray bar and N2, the flow rate is 55-65SLM, the wafer moves to the slow discharge position, and the slow discharge valve is opened at the same time. When the liquid level reaches the lower end of the basket, the fast discharge valve is opened. The slow discharge process time is 200-300S;

[0019] Step S4, wafer drying, the wafer is driven to swing back and forth by the swing arm, and IPA and HOT N2 are turned on at the same time, the temperature range is 50℃-250℃, the flow rate is 380-420SLM, and the drying time is 340-360S;

[0020] Step S5, wafer unloading, the wafer returns to the original position, HOT N2 is turned on, the temperature range is 50℃-250℃, the flow rate is 380-420SLM, the cleaning time is 30S, and after completion, the chamber is opened to unload the wafer.

[0021] Compared with the prior art, the present invention has the following beneficial effects:

[0022] By setting a cleaning box, a waste discharge box, a lateral movement assembly, a swing arm mechanism, a spray rod assembly, a bubbler and an exhaust pipe assembly, the cleaning box is used to contain the cleaning liquid and provide a dust-free environment for wafer drying. The swing arm mechanism can be used as a wafer carrying and moving system and provide power during the wafer drying process to enhance the drying efficiency. The spray rod assembly is used in conjunction with the cleaning box. Since the exhaust pipe is arranged at the upper end of the second liquid discharge pipe, during the process of lowering the liquid level, the spray rod sprays liquid and gas with low surface tension to form a surface tension gradient on the wafer surface, activating the Marangoni effect, thereby effectively removing pollutants. The application of the Marangoni effect improves the cleaning efficiency by promoting liquid flow and ensures that the wafer surface reaches an extremely high cleanliness. The lateral movement assembly can ensure the smooth opening and closing of the cleaning tank and maintain the cleanliness of the cleaning tank. The waste discharge box and the exhaust pipe assembly are responsible for removing the waste liquid and exhaust gas after cleaning respectively.

[0023] The wafer drying steps include wafer loading, pre-cleaning, wafer cleaning, wafer drying and wafer unloading. The operator turns on the liquid high flow switch to allow the liquid to enter. When the liquid reaches the upper limit of the tank, the wafer is loaded. After confirming that the wafer is loaded, the cavity is closed and the liquid high flow switch and liquid low flow switch are turned on at the same time. The opening time is 8-12S. Then, the liquid high flow switch and liquid low flow switch are closed to achieve pre-cleaning. The IPA spray rod and N2 are turned on with a flow rate of 55-65SLM. The wafer moves to the slow row position and the slow row valve is opened at the same time. When the liquid level reaches the lower end of the basket, the fast row valve is opened. The slow row process time is 200-300S to achieve wafer cleaning. The wafer is driven to swing back and forth by the swing arm. At the same time, IPA and HOT N2 are turned on with a temperature range of 50℃-250℃, a flow rate of 380-420SLM, and a drying time of 340-360S to achieve wafer drying. The wafer returns to the original position and the HOT is turned on. N2, the temperature range is 50℃-250℃, the flow rate is 380-420SLM, the cleaning time is 30S, and the chamber is opened to unload the wafer after completion, which can further improve the cleanliness of the wafer cleaning. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 A three-dimensional diagram of a wafer drying device of the present invention from a left angle;

[0025] Figure 2 A three-dimensional diagram of a wafer drying device according to the present invention from a right angle;

[0026] Figure 3 A three-dimensional diagram of a cleaning box in a wafer drying device of the present invention from a right angle;

[0027] Figure 4 A three-dimensional diagram of a cleaning box in a wafer drying device of the present invention from a left angle;

[0028] Figure 5 A three-dimensional diagram of a swing arm mechanism in a wafer drying device of the present invention;

[0029] Figure 6 This is a working state diagram of a swing arm mechanism in a wafer drying device of the present invention;

[0030] Figure 7 It is a three-dimensional diagram of a transverse movement component in a wafer drying device of the present invention;

[0031] Figure 8 A three-dimensional diagram of a sensor mounting plate in a wafer drying device of the present invention;

[0032] Fig. 9 A three-dimensional diagram of a spray bar assembly in a wafer drying device of the present invention;

[0033] Fig.10A three-dimensional diagram of a waste discharge box in a wafer drying device of the present invention;

[0034] Fig.11 A plan view of a bubbler assembly in a wafer drying device of the present invention;

[0035] Fig.12 A three-dimensional diagram of a bubbler assembly in a wafer drying device of the present invention;

[0036] Fig.13 A three-dimensional diagram of an exhaust pipe assembly in a wafer drying device of the present invention;

[0037] Fig.14 The present invention is a flow chart of a wafer drying method.

[0038] Numbers in the figure:

[0039] 1-electric box, 2-bubble generator assembly, 3-exhaust pipe assembly, 4-first waste pipe, 5-mounting frame, 6-heater, 7-waste box, 8-cover, 9-cleaning tank, 10-swing arm mechanism, 11-first sensor, 12-cleaning tank, 13-exhaust pipe, 14-second liquid discharge pipe, 15-liquid level gauge, 16-support rod, 17-liquid injection pipe, 18-quick discharge pipe, 19-quick discharge valve, 20-first liquid discharge pipe, 21-connecting arm, 22-swing arm, 24-linear slide rail, 25-linear slider, 26-slide plate, 27-movable block, 28-fixed seat, 29-movable slot, 30-servo motor, 31-flower basket, 32-material trough, 33-handle, 34-wafer, 35-connecting plate, 36-limiting plate, 37-positioning plate, 39-hollow slot, 40-support plate, 41- support plate, 42- mounting plate, 43- movable plate, 44- transverse slide block, 45- transverse guide rail, 46- mounting bracket, 47- buffer, 48- transverse cylinder, 49- cylinder cover, 50- cylinder mounting plate, 51- sensor mounting plate, 52- origin sensor, 53- second sensor plate, 54- roller, 55- pressure gauge, 56- spray rod mounting seat, 57- spray rod, 58- drag chain, 59- quick exhaust valve flange, 60- drainage joint, 61- outlet pipe, 62- bubbler, 63- air inlet pipe, 64- liquid level sensor, 65- drainage pipe, 66- second waste pipe, 67- installation box, 68- bubbler heating exhaust pipe, 69- cleaning tank exhaust pipe, 70- rack exhaust pipe, 71- second manual air regulating valve, 72- first manual air regulating valve, 73- exhaust port. DETAILED DESCRIPTION

[0040] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0041] like Figure 1-14As shown, the present invention provides a wafer drying device, including a mounting frame 5, one end of which is provided with a cleaning box 12, an electrical box 1 and a waste discharge box 7, the cleaning box 12 is mounted on the top of the mounting frame 5, the cleaning box 12 is provided with a support rod 16 for achieving fixed connection with the mounting frame 5, the waste discharge box 7 is fixedly arranged at the bottom of the mounting frame 5, and the waste discharge box 7 is arranged on the side of the mounting frame 5 close to the cleaning box 12, the waste discharge box 7 is provided with a quick-drain valve flange 59 for connecting to a quick-drain pipe 18, the waste discharge box 7 is provided with at least two liquid drainage joints 60, the waste discharge box 7 is provided with a first waste discharge pipe 4 interconnected therewith, the waste water of the cleaning box 12 is passed into the interior of the waste discharge box 7 through the quick-drain pipe 18, and the waste water inside the waste discharge box 7 is discharged through the first waste discharge pipe 4, the The cleaning box 12 is provided with a cleaning slot 9 with an upward opening, and a cover plate 8 non-fixedly connected thereto is provided at the upper end of the cleaning box 12, and a mounting frame 5 is provided with a transverse movement assembly for driving the cover plate 8 to perform transverse movement, the transverse movement assembly includes a transverse movement guide rail 45, a transverse movement slider 44 slidably matched with the transverse movement guide rail 45, and a transverse movement cylinder 48 for driving the transverse movement slider 44 to slide along the length direction of the transverse movement guide rail 45, the transverse movement slider 44 is provided with a movable plate 43 interconnected therewith, the cover plate 8 and the movable plate 43 are interconnected and move therewith, a first induction plate 11 is fixedly provided on one side of the cover plate 8, the mounting frame 5 is provided with a cylinder mounting plate 50 for mounting the transverse movement assembly, and the cylinder mounting plate 50 is provided with a cylinder cover 49 for protecting the transverse movement cylinder 48, A buffer 47 and a mounting bracket 46 for mounting the buffer 47 are provided on one side of the cylinder mounting plate 50. The transverse sliding block 44 and the buffer 47 are in contact with each other but not connected. The transverse cylinder 48 is fixedly arranged on the end surface of the cylinder mounting plate 50. The transverse guide rail 45 is extended along the length direction of the cylinder mounting plate 50. A sensor mounting plate 51 is provided on the side of the mounting frame 5 away from the cylinder mounting plate 50. An origin sensor 52 is provided on one side of the sensor mounting plate 51. A spray rod assembly is provided inside the cleaning box 12. The spray rod assembly includes a spray rod mounting seat 56, a drag chain 58, and a spray rod 57, a pressure gauge 55, a roller 54 and a second sensor sheet 53 arranged on the spray rod mounting seat 56. The drag chain 58 is used to drive the spray rod mounting seat 56 to move the spray rod 57 ... The mounting seat 56 is moved, a liquid injection pipe 17 and a liquid level meter 15 are provided on one side of the cleaning box 12, a group of exhaust pipes 13 and a second liquid discharge pipe 14 are provided on one side of the cleaning box 12 close to the liquid injection pipe 17, a first liquid discharge pipe 20 is provided on the other side of the cleaning box 12, a group of the exhaust pipes 13 are arranged at intervals on the left and right, a group of the second liquid discharge pipes 14 are arranged at intervals on the left and right, the exhaust pipe 13 is arranged at the upper end of the second liquid discharge pipe 14, a quick exhaust pipe 18 and a quick exhaust valve 19 are provided at the bottom of the cleaning box 12, the quick exhaust valve 19 is sleeved on the outside of the quick exhaust pipe 18 and is used to open or close the quick exhaust pipe 18, the other end of the quick exhaust pipe 18 is connected to the waste discharge box 7, and at least one flower basket 31 non-fixedly connected to it is provided inside the cleaning box 12,The front and rear ends of the flower basket 31 are provided with handles 33 integrally formed therewith, the bottom of the flower basket 31 is provided with a positioning groove, the flower basket 31 is provided with a plurality of material grooves 32, and the plurality of material grooves 32 are evenly spaced and arranged along the width direction of the flower basket 31, and each of the material grooves 32 is provided with a wafer 34 non-fixedly connected thereto, a positioning plate 37 and a group of supporting plates 41 are provided on the end surface of the support plate 40, the structure, shape and size of the positioning plate 37 are consistent with the positioning groove, a group of the supporting plates 41 are respectively provided on the front and rear sides of the positioning plate 37, and each of the limiting plates 36 is provided with a hollow groove 3 9. The connection state of the flower basket 31 and the flower basket support assembly is as follows: the bottom of the flower basket 31 is in contact with the support plate 41 but not connected to each other; the positioning plate 37 is inserted into the interior of the positioning groove and the flower basket 31 is stably placed on the flower basket support assembly by plugging; and the flower basket 31 is arranged between a group of limit plates 36; the hollow groove 39 and the handle portion 33 are arranged to facilitate the flower basket 31 to be separated from the flower basket support assembly; a swing arm mechanism 10 for driving the movement of the flower basket 31 is provided on one side of the mounting frame 5 close to the washing box 12; the swing arm mechanism 10 includes a fixing seat 28, a swing arm 22, a driving assembly connected to the swing arm 22, and a and a basket support assembly interconnected with the swing arm 22, the driving assembly includes a linear guide rail 24, a linear slider 25, a slide plate 26 interconnected with the linear slider 25 and moving therewith, and a servo motor 30 for driving the linear slider 25 to slide along the linear guide rail 24, one end of the swing arm 22 is rotatably connected to the fixed seat 28, the swing arm 22 is provided with an oblong movable groove 29, the movable groove 29 is extended along the length direction of the swing arm 22, the front end surface of the slide plate 26 is provided with an integral movable block 27, the movable block 27 is arranged inside the movable groove 29 and is slidably connected thereto, the A connecting arm 21 connected to the swing arm 22 is provided at the front side thereof. The swing arm 22 and the connecting arm 21 are parallel to each other, and a connecting plate 35 is provided between the swing arm 22 and the connecting arm 21. One end of the connecting arm 21 is connected to the support plate 40. When the servo motor 30 drives the linear slider 25 to slide along the linear slide rail 24, the slide plate 26 drives the movable block 27 to slide inside the movable groove 29, thereby making the swing arm 22 swing, and the flower basket support assembly also swings with the swing arm 22. The flower basket support assembly includes a support plate 40 and limit plates 36 fixedly arranged at the left and right ends of the support plate 40;

[0042] The other end of the mounting frame 5 is provided with a bubbler assembly 2, a heater 6 and an exhaust pipe assembly 3. The bubbler assembly 2 includes an installation box 67, an air outlet pipe 61 arranged at the top of the installation box 67, an air inlet pipe 63 arranged at the side of the installation box 67, a liquid discharge pipe 65 arranged at the front side of the installation box 67, a second row of waste pipes 66 arranged at the bottom of the installation box 67, a bubbler 62 arranged inside the installation box 67, and three liquid level sensors 64 fixedly arranged on the installation box 67. The three liquid level sensors 64 are arranged in sequence from top to bottom. The exhaust pipe assembly 3 comprises a cleaning tank exhaust pipe 69, a rack exhaust pipe 70 and a bubbler heating exhaust pipe 68, wherein one end of the cleaning tank exhaust pipe 69 away from the rack exhaust pipe 70 is provided with a first manual air regulating valve 72 and an exhaust port 73, a second manual air regulating valve 71 is provided on the top of the rack exhaust pipe 70, the rack exhaust pipe 70 is provided on one side of the bubbler heating exhaust pipe 68 and is interconnected therewith, the bubbler heating exhaust pipe 68 is provided on the bottom of the cleaning tank exhaust pipe 69 and is interconnected therewith, and a cleaning tank exhaust pipe 69 is provided on the top of the rack exhaust pipe 70.

[0043] A wafer drying method, the drying method comprising the following steps:

[0044] Step S1, wafer 34 is loaded. The operator turns on the liquid high flow switch to allow liquid to enter. When the liquid reaches the upper limit of the tank, the wafer 34 is loaded. After confirming that the wafer 34 is loaded, the cavity is closed.

[0045] Step S2, pre-cleaning, the operator opens the liquid high flow switch and the liquid low flow switch at the same time, the opening time is 8-12 seconds, and then closes the liquid high flow switch and the liquid low flow switch;

[0046] Step S3, wafer 34 cleaning, open IPA spray bar and N2, flow rate is 55-65SLM, wafer 34 moves to slow discharge position, open slow discharge valve at the same time, when liquid level reaches the lower end of basket 31, open fast discharge valve 19, slow discharge process time is 200-300S;

[0047] Step S4, the wafer 34 is dried, the swing arm 22 drives the wafer 34 to swing back and forth, and IPA and HOTN2 are turned on at the same time, the temperature range is 50°C-250°C, the flow rate is 380-420SLM, and the drying time is 340-360S;

[0048] Step S5, the wafer 34 is unloaded, the wafer 34 returns to the original position, HOT N2 is turned on, the temperature range is 50°C-250°C, the flow rate is 380-420SLM, the cleaning time is 30S, and after completion, the chamber is opened to unload the wafer 34.

[0049] Compared with the conventional technology: by setting a cleaning box 12, a waste discharge box 7, a lateral movement assembly, a swing arm mechanism 10, a spray bar assembly, a bubbler 62 and an exhaust pipe assembly 3, the cleaning box 12 is used to contain the cleaning liquid and provide a dust-free environment for the drying of the wafer 34, the swing arm mechanism 10 can be used as a bearing and moving system for the wafer 34, and provide power during the drying process of the wafer 34 to enhance the drying efficiency, the spray bar assembly and the cleaning box 12 are used in coordination, and since the exhaust pipe 13 is arranged at the upper end of the second liquid discharge pipe 14, during the process of lowering the liquid level, the spray bar 57 sprays liquid and gas with low surface tension to form a surface tension gradient on the surface of the wafer 34, activating the Marangoni effect, thereby effectively removing pollutants, and the application of the Marangoni effect improves the cleaning efficiency by promoting the flow of liquid, ensuring that the surface of the wafer 34 reaches an extremely high degree of cleanliness, the lateral movement assembly can ensure the smooth opening and closing of the cleaning tank 9, and maintain the cleanliness of the cleaning tank 9, the waste discharge box 7 and the exhaust pipe assembly 3 are respectively responsible for removing the waste liquid and waste gas after cleaning;

[0050] The wafer 34 drying step includes wafer 34 loading, pre-cleaning, wafer 34 cleaning, wafer 34 drying and wafer 34 unloading. The operator turns on the liquid high flow switch to allow the liquid to enter. When the liquid reaches the upper limit of the tank, the wafer 34 is loaded. After confirming that the wafer 34 is loaded, the cavity is closed, and the liquid high flow switch and the liquid low flow switch are turned on at the same time. The opening time is 8-12S, and then the liquid high flow switch and the liquid low flow switch are closed to achieve pre-cleaning. The IPA spray rod and N2 are turned on with a flow rate of 55-65SLM. The wafer 34 moves to the slow discharge position and the slow discharge valve is turned on at the same time. When the liquid level reaches the lower end of the basket 31, the fast discharge valve 19 is opened. The slow discharge process time is 200-300S to achieve wafer 34 cleaning. The wafer 34 is driven to swing back and forth by the swing arm 22, and the IPA and HOT are turned on at the same time. N2, the temperature range is 50℃-250℃, the flow rate is 380-420SLM, and the drying time is 340-360S to dry the wafer 34. The wafer 34 returns to the original position, and HOT N2 is turned on. The temperature range is 50℃-250℃, the flow rate is 380-420SLM, and the cleaning time is 30S. After the end, the chamber is opened to unload the wafer 34, which can further improve the cleanliness of the wafer 34.

[0051] It will be apparent to those skilled in the art that the invention is not limited to the details of the exemplary embodiments described above and that the invention can be implemented in other specific forms without departing from the spirit or essential features of the invention. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of the invention is defined by the appended claims rather than the foregoing description, and it is intended that all variations falling within the meaning and scope of the equivalent elements of the claims be included in the invention. Any reference numeral in a claim should not be considered as limiting the claim to which it relates.

Claims

1. A wafer drying device, comprising a mounting frame, characterized in that: One end of the mounting frame is provided with a cleaning box and a waste discharge box, the cleaning box is provided with a cleaning trough opening upward, the upper end of the cleaning box is provided with a cover plate non-fixedly connected thereto, and the mounting frame is provided with a transverse movement component for driving the cover plate to perform transverse movement, a spray rod component is provided inside the cleaning box, a liquid injection pipe and a liquid level gauge are provided on one side of the cleaning box, a group of exhaust pipes and a second liquid discharge pipe are provided on the side of the cleaning box close to the liquid injection pipe, and a first liquid discharge pipe is provided on the other side of the cleaning box, a group of the exhaust pipes are arranged at intervals on the left and right, a group of the second liquid discharge pipes are arranged at intervals on the left and right, and the exhaust pipe is arranged on the second A quick-discharge pipe and a quick-discharge valve are provided at the upper end of the liquid discharge pipe and at the bottom of the cleaning box. The quick-discharge valve is sleeved on the outer side of the quick-discharge pipe and is used to open or close the quick-discharge pipe. The other end of the quick-discharge pipe is connected to the waste discharge box. At least one flower basket non-fixedly connected to the cleaning box is provided inside the cleaning box. A swing arm mechanism for driving the flower basket is provided on the side of the mounting frame close to the cleaning box. The swing arm mechanism includes a swing arm, a driving assembly connected to the swing arm, and a flower basket support assembly connected to the swing arm. The flower basket support assembly includes a support plate and limit plates fixedly provided at the left and right ends of the support plate. The other end of the mounting frame is provided with a bubbler assembly, a heater and an exhaust pipe assembly, the bubbler assembly includes an installation box, an air outlet pipe arranged at the top of the installation box, an air inlet pipe arranged at the side of the installation box, a liquid discharge pipe arranged at the front side of the installation box, a second waste pipe arranged at the bottom of the installation box, a bubbler arranged inside the installation box and three liquid level sensors fixedly arranged on the installation box, the three liquid level sensors are sequentially distributed from top to bottom, the exhaust pipe assembly includes a cleaning tank exhaust pipe, a rack exhaust pipe and a bubbler heating exhaust pipe, the end of the cleaning tank exhaust pipe away from the rack exhaust pipe is provided with a first manual air regulating valve, and the top of the rack exhaust pipe is provided with a second manual air regulating valve; The transverse movement assembly includes a transverse movement guide rail, a transverse movement slider slidably matched with the transverse movement guide rail, and a transverse movement cylinder for driving the transverse movement slider to slide along the length direction of the transverse movement guide rail, the transverse movement slider is provided with a movable plate interconnected with it, the cover plate and the movable plate are interconnected and move therewith, a first sensor plate is fixedly provided on one side of the cover plate, a mounting frame is provided with a cylinder mounting plate for mounting the transverse movement assembly, a buffer and a mounting bracket for mounting the buffer are provided on one side of the cylinder mounting plate, the transverse movement slider and the buffer are in contact with each other but not connected, the transverse movement cylinder is fixedly provided on the end surface of the cylinder mounting plate, the transverse movement guide rail is extended along the length direction of the cylinder mounting plate, a sensor mounting plate is provided on the side of the mounting frame away from the cylinder mounting plate, and an origin sensor is provided on one side of the sensor mounting plate; The driving assembly includes a linear guide rail, a linear slider, a slide plate connected to the linear slider and moving therewith, and a servo motor for driving the linear slider to slide along the linear slide rail. The swing arm is provided with an oblong movable groove, which extends along the length direction of the swing arm. The front end face of the slide plate is provided with a movable block integrally formed therewith, and the movable block is arranged inside the movable groove and slidably connected therewith. The front side of the swing arm is provided with a connecting arm connected thereto, and the swing arm and the connecting arm are parallel to each other, and a connecting plate is provided between the swing arm and the connecting arm, and one end of the connecting arm is connected to the support plate. When the servo motor drives the linear slider to slide along the linear slide rail, the slide plate drives the movable block to slide inside the movable groove, thereby causing the swing arm to swing, and the flower basket support assembly also swings with the swing arm.

2. A wafer drying device according to claim 1, characterized in that: The cleaning box is mounted on the top of the mounting frame, and the cleaning box is provided with a support rod for being fixedly connected to the mounting frame. The waste drain box is fixedly mounted on the bottom of the mounting frame, and the waste drain box is arranged on a side of the mounting frame close to the cleaning box. The waste drain box is provided with a quick-drain valve flange for connecting to a quick-drain pipe, and the waste drain box is provided with at least two liquid discharge joints. The waste drain box is provided with a first waste drain pipe interconnected therewith, and waste water from the cleaning box is passed into the interior of the waste drain box through the quick-drain pipe, and waste water inside the waste drain box is discharged through the first waste drain pipe.

3. The wafer drying device according to claim 1, characterized in that: The front and rear ends of the flower basket are provided with handles integrally formed therewith, the bottom of the flower basket is provided with a positioning groove, the flower basket is provided with a plurality of material grooves, the plurality of material grooves are evenly spaced along the width direction of the flower basket, and a wafer non-fixedly connected thereto is provided inside each of the material grooves, a positioning plate and a group of supporting plates are provided on the end surface of the support plate, the structural shape and size of the positioning plate are consistent with the positioning groove, a group of supporting plates are respectively arranged on the front and rear sides of the positioning plate, each of the limiting plates is provided with a hollow groove, and the connection state of the flower basket and the flower basket support assembly is as follows: the bottom of the flower basket and the supporting plate are in contact with each other but not connected, the positioning plate is inserted into the inside of the positioning groove and the flower basket is stably placed on the flower basket support assembly by plugging, and the flower basket is arranged between a group of limiting plates, and the arrangement of the hollow groove and the handle can facilitate the flower basket to detach from the flower basket support assembly.

4. The wafer drying device according to claim 1, characterized in that: The rack exhaust duct is arranged at one side of the bubbler heating exhaust duct and is interconnected therewith, the bubbler heating exhaust duct is arranged at the bottom of the cleaning tank exhaust duct and is interconnected therewith, and the top of the rack exhaust duct is provided with a cleaning tank exhaust duct.

5. The wafer drying device according to claim 1, characterized in that: The spray bar assembly comprises a spray bar mounting seat, a drag chain, and a spray bar, a pressure gauge, a roller and a second sensor sheet arranged on the spray bar mounting seat. The drag chain is used for driving the spray bar mounting seat to move.

6. A wafer drying method, characterized in that: The drying method is performed by the wafer drying device according to any one of claims 1 to 5, and the drying method comprises the following steps: Step S1, wafer loading, the operator turns on the liquid high flow switch to allow liquid to enter, and when the liquid reaches the upper limit of the tank body, the wafer is loaded, and the cavity is closed after confirming that the wafer loading is completed; Step S2, pre-cleaning, the operator opens the liquid high flow switch and the liquid low flow switch at the same time, the opening time is 8-12 seconds, and then closes the liquid high flow switch and the liquid low flow switch; Step S3, wafer cleaning, open the IPA spray bar and N2, the flow rate is 55-65SLM, the wafer moves to the slow discharge position, and the slow discharge valve is opened at the same time. When the liquid level reaches the lower end of the basket, the fast discharge valve is opened. The slow discharge process time is 200-300S; Step S4, wafer drying, the wafer is driven to swing back and forth by the swing arm, and IPA and HOT N2 are turned on at the same time, the temperature range is 50℃-250℃, the flow rate is 380-420SLM, and the drying time is 340-360S; Step S5, wafer unloading, the wafer returns to the original position, HOT N2 is turned on, the temperature range is 50℃-250℃, the flow rate is 380-420SLM, the cleaning time is 30S, and after completion, the chamber is opened to unload the wafer.

Images