Base ring assembly and substrate processing apparatus
By designing the annular body and gas regulation device of the base ring assembly, the problem of gas pressure change caused by the aging of the seal was solved, which improved the substrate yield and the stability of the reaction chamber, and enhanced the safety and airtightness of the equipment.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- ADVANCED MICRO FAB EQUIP INC CHINA
- Filing Date
- 2023-04-06
- Publication Date
- 2026-05-12
AI Technical Summary
In existing base ring assemblies, pressure changes caused by aging of seals in epitaxial equipment affect substrate yield, and existing solutions are difficult to effectively solve the problem of uneven pressure distribution.
A base ring assembly is designed, comprising an annular body, an upper fluid groove and a lower fluid groove, equipped with a gas inlet and an outlet. The upper and lower annular gas passages are adjusted by a gas regulating device to achieve regulation and cooling of the gas pressure near the base ring assembly.
It stabilizes the gas pressure inside the reaction chamber, improves substrate yield, enhances the airtightness of the reaction chamber, prevents gas leakage, improves the safety of the preparation process, and strengthens the structure of the top cover.
Smart Images

Figure CN118773580B_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of semiconductor equipment technology, and in particular to a base ring assembly and substrate processing equipment. Background Technology
[0002] Semiconductors are materials whose conductivity at room temperature falls between that of conductors and insulators. From both a technological and economic development perspective, semiconductors are of paramount importance. Regarding substrates, especially semiconductor substrates, they are processed into semiconductor devices in substrate processing equipment for a wide range of applications, such as integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, and high-power power conversion.
[0003] Epitaxial equipment is crucial for substrate processing, particularly in semiconductor device manufacturing. When processing substrates using epitaxial equipment, the substrate yield is related to the pressure distribution within the reaction chamber. The epitaxial equipment includes a reaction chamber and support components disposed within it for supporting and / or heating the substrate. The reaction chamber is surrounded by an upper cover, a lower cover, and a base ring assembly. A seal is provided between the upper cover and / or the lower cover and the base ring assembly. As the epitaxial process continues, the seal may age, causing changes in the pressure environment near the base ring assembly. These pressure changes affect the pressure distribution within the reaction chamber, thus impacting substrate yield.
[0004] Existing technologies typically address the issue of pressure variations within the reaction chamber caused by seal aging by improving the surface condition of the contact surfaces between the upper and / or lower cover and the base ring assembly. This can be achieved by enhancing the flatness and / or reducing the roughness of the contact surfaces. However, the flatness and / or roughness of the contact surfaces of current base ring assemblies are already sufficiently good. Further optimization of the flatness and / or roughness places excessively high demands on the manufacturing process of the base ring assembly, making it difficult to implement. Consequently, the aforementioned solutions cannot resolve the issue of pressure variations caused by gas leakage near the base ring assembly.
[0005] In addition, since the base ring assembly itself needs to have a cooling function, there is an urgent need for a base ring assembly that can both cool the base ring assembly itself and regulate the air pressure near the base ring assembly, so as to improve the substrate yield. Summary of the Invention
[0006] The purpose of this invention is to provide a base ring assembly and a substrate processing device, so as to achieve both cooling of the base ring assembly itself and regulation of the air pressure near the base ring assembly, thereby improving the substrate yield.
[0007] To achieve the above objectives, the present invention is implemented through the following technical solution:
[0008] A base ring assembly, used in a substrate processing apparatus, includes: an annular body with its inner sidewall surrounding a reaction chamber of the substrate processing apparatus; a gas inlet and a gas outlet are provided on the sidewall of the annular body, wherein the gas inlet and the gas outlet are disposed opposite to each other; an upper fluid groove formed by a downward indentation of the top surface of the annular body; a lower fluid groove formed by an upward indentation of the bottom surface of the annular body; an annular upper cover plate covering the upper fluid groove, the annular upper cover plate having an upper annular gas passage; and an annular lower cover plate covering the lower fluid groove, the annular lower cover plate having a lower annular gas passage; the upper annular gas passage and the lower annular gas passage are connected to an external gas regulating device via a gas branch located within the annular body, the gas regulating device being used to regulate the gas pressure borne by the top surface of the annular upper cover plate and / or the bottom surface of the annular lower cover plate.
[0009] Furthermore, the annular body is disposed between the upper and lower covers of the substrate processing equipment, with the lower cover opposite to the upper cover; wherein the edge of the upper cover is airtightly connected to the upper surface of the annular upper cover plate, and the gap between them forms the upper annular gas passage; and / or
[0010] The edge of the lower cover is airtightly connected to the lower surface of the annular lower cover plate, and the gap between the two forms the lower annular gas passage.
[0011] Furthermore, it also includes: a first top polymer ring disposed between the edge of the top cover and the upper surface of the annular top cover plate;
[0012] The upper annular gas passage includes at least one, located inside and / or outside the first top polymer ring; the gas regulating device is used to draw gas from the upper annular gas passage located inside and / or outside the first top polymer ring; and / or
[0013] A first bottom polymer ring is disposed between the edge of the lower cover and the lower surface of the annular lower cover plate; the lower annular gas passage includes at least one, located inside and / or outside the first bottom polymer ring; the gas regulating device is used to draw gas from the lower annular gas passage located inside and / or outside the first bottom polymer ring.
[0014] Furthermore, the edge of the upper cover, the top surface of the annular upper cover plate, and the sidewall of the first top polymer ring define the upper annular gas passage; and / or
[0015] The edge of the lower cover, the bottom surface of the annular lower cover plate, and the sidewall of the first bottom polymer ring define the lower annular gas passage.
[0016] Furthermore, it also includes: a second top polymer ring disposed between the edge of the upper cover and the upper surface of the annular upper cover plate, and surrounding the first top polymer ring; the upper annular gas passage located outside the second top polymer ring; the gas regulating device for inflating the upper annular gas passage located outside the second top polymer ring; and / or
[0017] The second bottom polymer ring is disposed between the edge of the lower cover and the lower surface of the annular lower cover plate, and surrounds the first bottom polymer ring; the lower annular gas passage is located outside the second bottom polymer ring; the gas regulating device is used to fill the lower annular gas passage located outside the second bottom polymer ring with gas.
[0018] Furthermore, the inner wall of the upper fluid groove extends upward to form an upper protrusion, the outer side of which abuts against the inner wall of the annular upper cover; and / or
[0019] The inner wall of the lower fluid groove extends downward to form a lower protrusion, and the outer side of the lower protrusion abuts against the inner wall of the annular lower cover plate.
[0020] Furthermore, the outer portion of the upper protrusion and the inner portion of the annular upper cover plate define a first top annular groove, the first top annular groove being used to house the first top polymer ring; the upper annular gas passage is located inside and / or outside the first top annular groove; and / or
[0021] The outer portion of the lower protrusion and the inner portion of the annular lower cover plate define a first bottom annular groove, the first bottom annular groove being used to place the first bottom polymer ring; the lower annular gas passage is located inside and / or outside the first bottom annular groove.
[0022] Furthermore, it also includes: a second top annular groove, which is formed by a downward indentation of the top surface of the annular upper cover plate and surrounds the first top annular groove; the second top annular groove is used to place the second top polymer ring, and the upper annular gas passage is located inside and / or outside the second top annular groove; and / or
[0023] The second bottom annular groove is formed by an upward indentation of the bottom surface of the annular lower cover plate and surrounds the first bottom annular groove; the second bottom annular groove is used to place the second bottom polymer ring; the lower annular gas passage is located inside and / or outside the second bottom annular groove.
[0024] Furthermore, the bottom surface of the annular upper cover plate is a plane, and the bottom surface of the annular upper cover plate and the upper fluid groove form a closed upper fluid channel; and / or
[0025] The top surface of the annular lower cover plate is a plane, and the top surface of the annular lower cover plate and the lower fluid groove form a closed lower fluid channel.
[0026] Furthermore, the inner wall of the annular upper cover plate is welded to the outer surface of the upper protrusion; and / or the inner wall of the annular lower cover plate is welded to the outer surface of the lower protrusion.
[0027] Furthermore, the upper port of the gas branch is located on the top surface of the annular upper cover plate, and is located inside the first top polymer ring and / or outside the first top polymer ring and / or outside the second top polymer ring; the lower port of the gas branch is located on the bottom surface of the annular lower cover plate, and is located inside the first bottom polymer ring and / or outside the first bottom polymer ring and / or outside the second bottom polymer ring.
[0028] Furthermore, the upper annular gas passage includes an upper internal gas passage located inside the first top polymer ring.
[0029] The upper internal gas passage is defined by the upper protruding top surface, the bottom surface of the upper cover, and the inner side of the first top polymer ring; the upper internal gas passage is located close to the inner surface of the annular body;
[0030] And / or, the lower annular gas passage includes a lower internal gas passage located inside the first bottom polymer ring, the lower internal gas passage being defined by the bottom surface of the lower protrusion, the top surface of the lower cover, and the inner surface of the first bottom polymer ring; the lower internal gas passage is disposed close to the inner surface of the annular body.
[0031] Furthermore, the upper annular gas passage includes an upper external gas passage located outside the second top polymer ring; the outer top surface of the annular top cover extends upward to form an outer top wall; the upper external gas passage is defined by the second top polymer ring, the top surface of the groove wall near the outer top wall in the second top annular groove, the inner surface of the outer top wall, and the bottom surface of the top cover; the upper external gas passage is disposed away from the inner surface of the annular body;
[0032] And / or, the lower annular gas passage includes a lower external gas passage located outside the second bottom polymer ring, the outer bottom surface of the annular lower cover plate extending downward to form an outer bottom wall; the lower external gas passage is defined by the second bottom polymer ring, the bottom surface of the groove wall near the outer bottom wall in the second bottom annular groove, the inner surface of the outer bottom wall and the top surface of the lower cover; the lower external gas passage is disposed away from the inner surface of the annular body.
[0033] Furthermore, the upper annular gas passage includes an upper middle gas passage located between the first top polymer ring and the second top polymer ring; the upper middle gas passage is defined by the top surface of the groove wall in the second top annular groove away from the outer top wall, the bottom surface of the upper cover, the first top polymer ring, and the second top polymer ring;
[0034] The upper central gas passage is located between the upper internal gas passage and the upper external gas passage; and / or, the lower annular gas passage includes a lower central gas passage located between the first bottom polymer ring and the second bottom polymer ring, the lower central gas passage being defined by the bottom surface of the groove wall in the second bottom annular groove away from the outer bottom wall, the top surface of the lower cover, the first bottom polymer ring, and the second bottom polymer ring; the lower central gas passage is located between the lower internal gas passage and the lower external gas passage.
[0035] Furthermore, the gas regulating device is used to reduce or increase the gas pressure in the upper annular gas passage and / or the lower annular gas passage.
[0036] Furthermore, the gas regulating device includes a vacuum pump, a clean gas source, and a compressed air source.
[0037] Furthermore, the annular upper cover plate and / or the annular lower cover plate are provided with a notch in the circumferential direction; the upper surface and / or lower surface of the annular body are provided with a notch protrusion that matches the notch so that the notch protrusion is inserted into the notch; the notch protrusion is used to block the upper fluid groove and the lower fluid groove; the annular upper cover plate and / or the annular lower cover plate are eccentrically arranged relative to the center of the inner circumference of the annular body, and the centers of the annular upper cover plate and the annular lower cover plate are offset in a direction away from the notch protrusion.
[0038] Furthermore, the gas branch passes through the notch protrusion and is configured to avoid the upper fluid groove and the lower fluid groove.
[0039] Furthermore, it also includes: an upper partition and a lower partition, respectively disposed in the upper fluid groove and the lower fluid groove, for dividing the upper fluid channel into two independent upper sub-fluid channels and dividing the lower fluid channel into two independent lower sub-fluid channels.
[0040] Furthermore, the first top polymer ring covers the weld between the annular upper cover plate and the upper protrusion.
[0041] The present invention also provides a substrate processing apparatus, comprising: a base ring assembly as described above; an upper cover disposed above the base ring assembly; a lower cover disposed below the base ring assembly; wherein the upper cover, the base ring assembly, and the lower cover define an internal volume of a reaction chamber; and a support member disposed within the reaction chamber for supporting the substrate.
[0042] This invention has at least one of the following technical effects:
[0043] The present invention, through the cooperation of the gas regulating device with the gas branch, the upper annular gas passage and the lower annular gas passage, can regulate the gas pressure near the base ring assembly, thereby stabilizing the gas pressure in the reaction chamber and improving the substrate yield.
[0044] The upper / lower annular gas passages provided by this invention are used for evacuation, which can not only extract the reaction gas that has leaked into the upper / lower annular gas passages, thus preventing the reaction gas from leaking to the outside of the reaction chamber and improving the safety of the preparation process, but also improve the airtightness of the reaction chamber.
[0045] The upper / lower internal gas passages provided by this invention can be used to clean the periphery of the annular body when purge gas is introduced, thereby improving the substrate yield.
[0046] When the upper / lower middle gas passage is used for gas extraction, it can improve the safety of the extended equipment and solve the safety problem of leakage of reaction gas inside the cavity to the outside of the cavity when the sealing ring fails.
[0047] The upper / lower external gas passages are used to introduce gas; the introduction of gas can increase the pressure at the edge of the upper cover, promote the formation of a stepped vacuum environment between the atmospheric pressure on the top surface of the upper cover and the vacuum environment inside the cavity, and by increasing the gas pressure at the edge of the upper cover, it helps to offset the external atmospheric pressure on the upper cover, increase the structural strength of the upper cover, and make the upper cover less prone to breakage.
[0048] The present invention provides a location for the arrangement of gas branches by means of the notch protrusion, which allows the gas branches to avoid the upper fluid groove and the lower fluid groove, thus ensuring that the upper fluid groove and the lower fluid groove function properly as cooling channels. Attached Figure Description
[0049] Figure 1 This is a schematic diagram of the structure of a substrate processing device provided in an embodiment of the present invention;
[0050] Figure 2 This is a three-dimensional structural schematic diagram of a base ring assembly provided in an embodiment of the present invention;
[0051] Figure 3 This is an exploded view of a base ring assembly provided in an embodiment of the present invention;
[0052] Figure 4 This is a top view of a base ring assembly provided in an embodiment of the present invention;
[0053] Figure 5 for Figure 2 A schematic diagram of the enlarged cross-sectional structure of the base ring assembly shown;
[0054] Figure 6 for Figure 4 A schematic diagram of the enlarged cross-sectional structure at the notch in the cover plate along the CC direction;
[0055] Figure 7 for Figure 4 The diagram shows a cross-sectional view of the base ring assembly along the AA-AA direction.
[0056] Figure 8 This is a cross-sectional structural diagram of a base ring assembly with two cooling channels provided in an embodiment of the present invention. Detailed Implementation
[0057] The base ring assembly and substrate processing device proposed in this invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. The advantages and features of this invention will become clearer from the following description. It should be noted that the drawings are in a very simplified form and use non-precise proportions, only for the purpose of conveniently and clearly illustrating the embodiments of this invention. Please refer to the drawings to make the objectives, features, and advantages of this invention more apparent and understandable. It should be understood that the structures, proportions, sizes, etc., depicted in the accompanying drawings are only for the purpose of assisting those skilled in the art in understanding and reading the content disclosed in the specification, and are not intended to limit the implementation conditions of this invention. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in the proportional relationships, or adjustments to the size, without affecting the effects and objectives achieved by this invention, should still fall within the scope of the technical content disclosed in this invention.
[0058] like Figure 1As shown, this embodiment provides a substrate processing device, including: a base ring assembly 10, which provides a base for assembling other components of the entire substrate processing device; an upper cover 30, which is disposed above the base ring assembly 10; and a lower cover 31, which is disposed below the base ring assembly 10.
[0059] The upper cover 30, the base ring assembly 10, and the lower cover 31 surround and form the reaction chamber 80, with their inner walls defining the internal volume of the reaction chamber 80. A support member 50 is disposed within the reaction chamber and has a substrate support surface for supporting the substrate W, with the surface of the substrate W to be processed facing the upper cover 30. In this embodiment, the upper cover 30 and the lower cover 31 can be made of quartz, allowing heat radiation to reach the substrate W and thus heat it.
[0060] Combination Figure 2 and Figure 3 As shown, the base ring assembly 10 provided in this embodiment includes: an annular body 14, the inner sidewall of which surrounds a reaction chamber 80; the reaction chamber 80 is a reaction space for performing a process, and a gas inlet 11 and a gas outlet 12 are provided on the sidewall of the annular body 14, wherein the gas inlet 11 and the gas outlet 12 are arranged opposite to each other; when processing a substrate W using a substrate processing device, process gas is introduced through the gas inlet 11; the process gas enters the reaction chamber 80, and then under certain conditions, the process gas reacts on the surface of the substrate W, and then the unreacted process gas flows out from the gas outlet 12 to the outside of the reaction chamber 80.
[0061] In this embodiment or other embodiments, the annular body 14 may also be provided with a separate substrate loading port 13, wherein the gas inlet 11 and the gas outlet 12 are located at opposite ends of the annular body 14. It is understood that the location of the substrate loading port 13 is only necessary to enable substrate loading. Preferably, the substrate loading port 13 may be offset at a 90° angle relative to the gas inlet 11 and the gas outlet 12, but this invention is not limited thereto. When the substrate W needs to be transferred before or after the process reaction, the support member 50 needs to rise / fall to the substrate loading port 13 position to facilitate the loading and unloading of the substrate W.
[0062] An upper fluid groove 204 is formed by a downward indentation of the top surface of the annular body 14. A lower fluid groove 205 is formed by an upward indentation of the bottom surface of the annular body 14. The upper and lower fluid grooves 204 and 205 are used to introduce cooling liquid or gas to cool the base ring assembly itself. An annular upper cover plate 20 covers the upper fluid groove 204 and has an upper annular gas passage 110. An annular lower cover plate 21 covers the lower fluid groove 205 and has a lower annular gas passage 111. The annular upper cover plate 20 can overlap the outer edge of the upper fluid groove 204 or be fixedly connected to the inner sidewall or bottom wall of the upper fluid groove 204. The positional relationship between the annular lower cover plate 21 and the lower fluid groove 205 is similar to that described above; this positional relationship can be the same or different.
[0063] The upper annular gas passage 110 and the lower annular gas passage 111 are connected to an external gas regulating device via a gas branch 101 located within the annular body 14. Figure 1 (Not shown) The connection allows gas to flow in the upper annular gas passage 110, the lower annular gas passage 111, and the gas branch 101. The gas regulating device can then be used to regulate the gas pressure on the top surface of the annular upper cover plate 20 and / or the bottom surface of the annular lower cover plate 21 by using its outward and inward quantitative regulating functions.
[0064] This embodiment enables the arrangement of the aforementioned upper / lower annular gas passages without affecting the upper / lower fluid trench configuration. This embodiment achieves cooling of the base ring assembly through the fluid trenches; by cooperating with the gas regulating device and the upper / lower annular gas passages, the gas pressure near the base ring assembly is regulated. This solves the problem of uneven film growth on the substrate caused by changes in gas pressure distribution within the reaction chamber due to leakage at the upper and lower surfaces of the annular assembly, thus improving substrate yield.
[0065] Please continue to refer to this. Figure 1 As shown, the annular body 14 is disposed between the upper cover 30 and the lower cover 31, with the lower cover 31 positioned opposite to the upper cover 30. The edge of the upper cover 30 is airtightly connected to the upper surface of the annular upper cover plate 20. This airtight connection can be achieved using a sealing ring or gasket, or by allowing the surfaces of the two parts to be directly contacted after treatment. Due to other components providing support or surface roughness, gaps of varying sizes may form between the two parts, creating the upper annular gas passage 110. Similarly, the edge of the lower cover 31 is airtightly connected to the lower surface of the annular lower cover plate 21, with the gap between them forming the lower annular gas passage 111.
[0066] In this embodiment, the gas regulating device can reduce or increase the total amount of gas in the upper annular gas passage 110 and / or the lower annular gas passage 111, thereby changing the gas pressure in the upper and lower annular gas passages and influencing the flow trend of the gas flowing out of the reaction chamber 80 at that location, achieving the desired reaction gas control objective. The gas regulating device may include a vacuum pump, a clean gas source, and a compressed air source.
[0067] This embodiment achieves direct pressure regulation at the gap (here, the gap can refer to the gap between the edge of the lower cover and the lower surface of the annular lower cover plate and / or the gap between the edge of the upper cover and the upper surface of the annular upper cover plate) by regulating the gas pressure of the upper annular gas passage 110 and the lower annular gas passage 111. This enables pressure regulation near the annular assembly, maintains the stability of the gas pressure in the reaction chamber, and solves the problem of low substrate yield caused by uneven gas pressure distribution in the reaction chamber.
[0068] Combination Figure 1 and Figure 5 As shown, this embodiment also includes a first top polymer ring 220, which is disposed between the edge of the upper cover 30 and the upper surface of the annular upper cover plate 20. The first top polymer ring 220 can be made of rubber, that is, the upper cover 30 can be airtightly connected to the annular upper cover plate 20 through the first top polymer ring 220. The first top polymer ring 220 can also be made of heat-insulating material to reduce the heat conduction between the upper cover 30 and the annular upper cover plate 20, which can protect the mechanical structure of the upper cover 30. The upper annular gas passage 110 includes at least one, located inside and / or outside the first top polymer ring 220. The position of the first top polymer ring 220 is closer to the reaction chamber 80. Therefore, in order to prevent particles generated at this position from entering the chamber and falling onto the substrate and causing defects, the upper annular gas passage inside or outside, or both positions of the first top polymer ring 220, is controlled to draw gas outward by a gas regulating device. That is, the upper surface of the annular upper cover plate 20 at this position is subjected to a pressure lower than atmospheric pressure to ensure that the particles at this position are drawn away in time. And / or a first bottom polymer ring 222, which is disposed between the edge of the lower cover 31 and the lower surface of the annular lower cover plate 21; the lower annular gas passage 111 includes at least one, located inside and / or outside the first bottom polymer ring 222, and the gas regulating device can regulate the lower annular gas passage 111 at this position in a similar manner to the upper annular gas passage 110.
[0069] In this embodiment, the first top / bottom sealing ring improves the sealing performance of the reaction chamber, preventing leakage of process gas inside the reaction chamber or reducing heat conduction between the upper and lower components, thereby improving the safety of the preparation process. Furthermore, the annular gas passages (which can refer to the upper annular gas passage 110 and the lower annular gas passage 111) are located near the first top / bottom sealing ring, allowing direct adjustment of the gas pressure at the first top / bottom sealing ring. This achieves gas pressure regulation near the upper and lower surfaces of the annular body 10. When the polymer ring ages and reduces its sealing effect after multiple processing steps, low-pressure evacuation or high-pressure gas delivery near the sealing ring can be used to prevent further leakage of leaked gas from the sealing ring to the outside of the chamber. Together with the first top / bottom sealing ring, this further improves the airtightness of the reaction chamber.
[0070] Please continue to refer to this. Figure 1 and Figure 5 As shown, in this embodiment, the edge of the upper cover 30, the top surface of the annular upper cover plate 20, and the sidewall of the first top polymer ring 220 define the upper annular gas passage 110; and / or the edge of the lower cover 31, the bottom surface of the annular lower cover plate 21, and the sidewall of the first bottom polymer ring 222 define the lower annular gas passage 111.
[0071] This embodiment can utilize existing components (the sidewall of the first top polymer ring 220; the sidewall of the first bottom polymer ring 222) to form the annular gas passage without requiring extensive modifications to the annular assembly, thereby reducing manufacturing difficulty and saving on the cost of improving the annular assembly.
[0072] Please continue to refer to this. Figure 1 and Figure 5As shown, this embodiment also includes: a second top polymer ring 221, which is disposed between the edge of the top cover 30 and the upper surface of the annular top cover plate 20, and may be made of rubber, and is disposed around the first top polymer ring 220; the upper annular gas passage 110 is located inside and / or outside the second top polymer ring 221, and the gas regulating device can inflate the upper annular gas passage located outside the second top polymer ring 221, that is, the upper surface of the annular top cover plate 20 at this position is subjected to positive pressure, and the inflation of the upper annular gas passage can extend to the outer edge of the top cover 30, while the upper surface and side of the edge of the top cover 30 are covered by the fixing flange, and the upper annular gas passage is connected to the gap between the top cover 30 and the fixing flange. By inflating, an inward thrust can be applied to the edge of the top cover 30 to maintain a certain gap with the fixing flange, preventing the top cover from making hard contact with the inner side of the fixing flange when heated, thus preventing damage. And / or a second bottom polymer ring 223, which is disposed between the edge of the lower cover 31 and the lower surface of the annular lower cover plate 21, and surrounds the first bottom polymer ring 222; the lower annular gas passage 111 is located inside and / or outside the second bottom polymer ring 223, and the gas regulating device adjusts the lower annular gas passage 111 in this position in a similar manner to the upper annular gas passage 110 described above.
[0073] This embodiment further improves the airtightness of the reaction chamber by setting the second top polymer ring 221 and the second bottom polymer ring 223. In addition, the annular gas passages (which may refer to the upper annular gas passage 110 and the lower annular gas passage 111) provided in this embodiment are located near the sealing rings (which may refer to the second top polymer ring 221 and the second bottom polymer ring 223), allowing direct adjustment of the gas pressure at the sealing rings. This achieves gas pressure regulation near the annular assembly, and together with the second top / bottom sealing rings, further improves the airtightness of the reaction chamber.
[0074] Please continue to refer to this. Figure 1 and Figure 5 As shown, in this embodiment, the edge of the upper cover 30, the top surface of the annular upper cover plate 20, the sidewall of the first top polymer ring 220, and the sidewall of the second top polymer ring 221 define the upper annular gas passage 110; and / or the edge of the lower cover 31, the bottom surface of the annular lower cover plate 21, the sidewall of the first bottom polymer ring 222, and the sidewall of the second bottom polymer ring 223 define the lower annular gas passage 111.
[0075] This embodiment can utilize existing components (the sidewalls of the first top polymer ring 220, the sidewalls of the second top polymer ring 221, the sidewalls of the first bottom polymer ring 222, and the second bottom polymer ring 223) to form the annular gas passage without requiring extensive modifications to the annular assembly, thereby reducing manufacturing process difficulty and saving on the cost of improving the annular assembly.
[0076] Taking the above annular gas passage 110 as an example, when it is located inside the first top polymer ring 220, the opening of the upper annular gas passage 110 and the opposite side of the first top polymer ring 220 have an opening that connects to the reaction chamber 80. It directly regulates the gas flow trend of the reaction chamber 80 at the contact point between the upper cover 30 and the annular upper cover plate 20. In addition to preventing gas leakage through the sealing ring, it can also regulate the gas near the side wall in the reaction chamber 80. For example, if gas is pumped out, the reaction gas at the edge will flow out from the annular gas passage. If gas is supplied and it is of the same type as the reaction gas, the concentration of the reaction gas at the edge will be replenished. When it is located outside the first top polymer ring 220 and inside the second top polymer ring 221, gas leakage caused by the aging of the first sealing ring 220 can be prevented by pumping or supplying gas. When it is located outside the second top polymer ring 221, gas leakage caused by the aging of the first sealing ring 220 and the second sealing ring 221 can be prevented by pumping or supplying gas. In some embodiments, the upper annular gas passage 110 may also be located at any of the three locations, or at multiple locations. The lower annular gas passage 111 is similar.
[0077] Please continue to refer to this. Figure 5 As shown, in this embodiment, the inner wall of the upper fluid groove 204 extends upward to form an upper protrusion 2101, and the outer side of the upper protrusion 2101 abuts against the inner wall of the annular upper cover plate 20. The inner wall of the lower fluid groove 205 extends downward to form a lower protrusion 2120, and the outer side of the lower protrusion 2120 abuts against the inner wall of the annular lower cover plate 21. The upper and lower protrusions can effectively prevent particles falling from the upper and lower cover plates and the annular components or weld seams on the cover plates from entering the processing space, and are promptly discharged from the reaction chamber 80 with the help of the gas regulating device. In some other embodiments, because the particles generated on the lower side of the annular body 14 have less impact on the substrate, the lower fluid groove 204 can also be made without a lower protrusion to reduce processing difficulty.
[0078] In this embodiment, when the upper / lower cover plate is placed on the annular body 14, the upper / lower protrusions are used to position the upper / lower cover plate, facilitating the installation, positioning, and welding of the upper / lower cover plate.
[0079] Please continue to refer to this. Figure 5As shown, the outer portion of the upper protrusion 2101 and the inner portion of the annular upper cover plate 20 define a first top annular groove 210, which is used to place the first top polymer ring 220. The upper annular gas passage 110 is located inside and / or outside the first top annular groove 210. And / or the outer portion of the lower protrusion 2120 and the inner portion of the annular lower cover plate 21 define a first bottom annular groove 212, which is used to place the first bottom polymer ring 222. The lower annular gas passage 111 is located inside and / or outside the first bottom annular groove 212. The weld seam between the upper protrusion and the upper cover plate can be located below the first top polymer ring 220 within the first top annular groove 210. Correspondingly, the cross-section of the first top polymer ring 220 can be square, covering the weld seam and preventing the overflow of welding material particles caused by temperature changes.
[0080] In this embodiment, the annular grooves (first top annular groove 210 and first bottom annular groove 212) can be used to position the sealing rings (first top polymer ring 220 and first bottom polymer ring 222). The annular gas channel is located near the annular grooves, which can directly adjust the gas pressure at the annular grooves, thereby adjusting the gas pressure near the base ring assembly to stabilize the gas pressure distribution inside the reaction chamber 80 and improve the substrate yield.
[0081] Combination Figure 5 and Figure 6 As shown, this embodiment further includes: a second top annular groove 211, which is formed by a downward indentation of the top surface of the annular upper cover plate 20 and surrounds the first top annular groove 210. The second top annular groove 211 is used to place the second top polymer ring 221, and the upper annular gas passage 110 is located inside and / or outside the second top annular groove 211. and / or a second bottom annular groove 213, which is formed by an upward indentation of the bottom surface of the annular lower cover plate 21 and surrounds the first bottom annular groove 212; the second bottom annular groove 213 is used to place the second bottom polymer ring 223; the lower annular gas passage 111 is located inside and / or outside the second bottom annular groove 213.
[0082] In this embodiment, the annular grooves (second top annular groove 211 and second bottom annular groove 213) can be used to position the sealing rings (second top polymer ring 221 and second bottom polymer ring 223). The annular gas channel is located near the annular grooves, which can directly adjust the gas pressure at the annular grooves, thereby adjusting the gas pressure near the base ring assembly to stabilize the gas pressure distribution inside the reaction chamber and improve the substrate yield.
[0083] Please continue to refer to this. Figure 1 and Figure 6 As shown, the annular body 10 is provided with a gas branch 101 penetrating the annular upper cover plate 20 and the annular lower cover plate 21. The upper port of the gas branch 101 is located on the top surface of the annular upper cover plate, and is located inside the first top polymer ring and / or outside the first top polymer ring and / or outside the second top polymer ring; the lower port of the gas branch is located on the bottom surface of the annular lower cover plate, and is located inside the first bottom polymer ring and / or outside the first bottom polymer ring and / or outside the second bottom polymer ring. The side port 102 of the gas branch is opened at the side wall of the annular body 10, and the side port 102 of the gas branch is connected to the gas regulating device ( Figure 1 and 6 (Not shown in the image) connection. In some embodiments, the gas branch can be an elongated pipe machined in the annular body 10, the shape of which is not limited to the embodiment and can be bent as appropriate.
[0084] In this embodiment or other embodiments, the gas regulating device may be used only to reduce the gas pressure in the upper annular gas passage and / or the lower annular gas passage, i.e., to evacuate the upper annular gas passage and / or the lower annular gas passage. When both the upper and lower annular gas passages in this embodiment are used for evacuation, the reactant gas leaking into the upper / lower annular gas passages can be extracted, preventing it from leaking outside the reaction chamber and improving the safety of the preparation process, while also improving the airtightness of the reaction chamber.
[0085] Please continue to refer to this. Figure 5 and Figure 6 As shown, the upper annular gas passage 110 includes an upper internal gas passage 2141 located inside the first top polymer ring 220. The upper internal gas passage 2141 is defined by the top surface of the upper protrusion 2101, the bottom surface of the upper cover 30 (specifically, the bottom surface of the edge of the upper cover 20), and the inner surface of the first top polymer ring 220; the upper internal gas passage 2141 is disposed close to the inner surface of the annular body 14. Preferably, the upper internal gas passage 2141 communicates with the upper port of the gas branch located inside the first top polymer ring 220, and is connected to the gas regulating device through the side port of the gas branch located on the side wall of the annular body 14.
[0086] In this embodiment, the lower annular gas passage 111 includes a lower internal gas passage 2151 located inside the first bottom polymer ring 222. The lower internal gas passage 2151 is defined by the bottom surface of the lower protrusion 2120, the top surface of the lower cover 31, and the inner surface of the first bottom polymer ring 222. The lower internal gas passage 2151 is disposed close to the inner surface of the annular body 14.
[0087] Preferably, the lower internal gas passage 2151 is connected to the lower port of the gas branch located inside the first bottom polymer ring 222, and is connected to the gas regulating device through the side port of the gas branch located on the side wall of the annular body 14.
[0088] In this embodiment, the gas regulating device is used to increase the gas pressure in the upper internal gas passage 2141 and / or the lower internal gas passage 2151. When the gas regulating device is used to introduce purging gas into the upper / lower internal gas passage, it can clean the periphery of the annular body 14, prevent the process gas from generating deposits in the upper internal gas passage 2141 and / or the lower internal gas passage 2151, and thus prevent the deposits from contaminating the inside of the reaction chamber, thereby improving the substrate yield.
[0089] In this embodiment, the purging gas can be any one of N2, H2, HCl and Cl2.
[0090] In some other embodiments, the gas regulating device can also be used to reduce the gas pressure in the upper internal gas passage 2141 and / or the lower internal gas passage 2151. When the gas regulating device evacuates the upper / lower internal gas passages, it can extract the process gas entering the upper internal gas passage 2141 and / or the lower internal gas passage 2151 to the outside of the reaction chamber, thereby increasing the airtightness of the reaction chamber, preventing the process gas from leaking to the outside of the reaction chamber, improving the safety of the substrate processing process, and extending the service life of the reaction chamber or base ring assembly due to the improved airtightness of the reaction chamber.
[0091] Please continue to refer to this. Figure 5 and Figure 6 As shown, the upper annular gas passage 110 includes an upper external gas passage 2143 located outside the second top polymer ring 221.
[0092] The outer top surface of the annular top cover 20 extends upward to form an outer top wall 2011. The upper external gas passage 2143 is defined by the second top polymer ring 221, the top surface of the groove wall of the second top annular groove 211 near the outer top wall 2011, the inner surface of the outer top wall 2011, and the bottom surface of the top cover 30; the upper external gas passage 2143 is disposed away from the inner surface of the annular body 14.
[0093] Preferably, the upper external gas passage 2143 can be connected to the upper port of the gas branch located outside the second top polymer ring 221, and connected to the gas regulating device through the side port of the gas branch located on the side wall of the annular body 14.
[0094] In this embodiment, the lower annular gas passage 111 includes a lower external gas passage 2153 located outside the second bottom polymer ring 223. The outer bottom surface of the annular lower cover plate 21 extends downward to form an outer bottom wall 2111; the lower external gas passage 2153 is defined by the second bottom polymer ring 223, the bottom surface of the groove wall of the second bottom annular groove 213 near the outer bottom wall 2111, the inner surface of the outer bottom wall 2111, and the top surface of the lower cover 31; the lower external gas passage 2153 is disposed away from the inner surface of the annular body 14.
[0095] Preferably, the lower external gas passage 2153 can be connected to the lower port of the gas branch located outside the second bottom polymer ring 223, and connected to the gas regulating device through the side port of the gas branch located on the side wall of the annular body 14.
[0096] In this embodiment, the gas regulating device is used to increase the gas pressure in the upper external gas passage 2143 and / or the lower external gas passage 2153. The upper / lower external gas passages are used to introduce gas; the introduction of gas can increase the pressure at the edge of the upper cover 30, promote the formation of a stepped vacuum environment between the atmospheric pressure borne by the top surface of the upper cover 20 and the vacuum environment inside the reaction chamber, and by increasing the gas pressure at the edge of the upper cover 30, it helps to counteract the external atmospheric pressure borne by the upper cover 30, increase the structural strength of the upper cover 30, and make the upper cover 30 less prone to breakage.
[0097] Please continue to refer to this. Figure 5 and Figure 6As shown, the upper annular gas passage 110 includes an upper middle gas passage 2142 located between the first top polymer ring 220 and the second top polymer ring 221; or it can be described as an upper middle gas passage 2142 located between the first top annular groove 210 and the second top annular groove 211.
[0098] In this embodiment, the upper central gas passage 2142 is defined by the top surface of the groove wall in the second top annular groove 211 that is away from the outer top wall 2011, the bottom surface of the upper cover 30, the first top polymer ring 220, and the second top polymer ring 221. The upper central gas passage 2142 is located between the upper inner gas passage 2141 and the upper outer gas passage 2143.
[0099] Preferably, the upper middle gas passage 2142 can be connected to the lower port of the gas branch located between the first top polymer ring 220 and the second top polymer ring 221, and can be connected to the gas regulating device through the side port of the gas branch located on the side wall of the annular body 14.
[0100] In this embodiment, the lower annular gas passage 111 includes a lower middle gas passage 2152 located between the first bottom polymer ring 222 and the second bottom polymer ring 223.
[0101] The lower central gas passage 2152 is defined by the bottom surface of the groove wall in the second bottom annular groove 213 away from the outer bottom wall 2111, the top surface of the lower cover 31, the first bottom polymer ring 222 and the second bottom polymer ring 223; the lower central gas passage 2152 is located between the lower inner gas passage 2151 and the lower outer gas passage 2153.
[0102] The lower central gas passage 2152 can communicate with the lower port of the gas branch located between the first bottom polymer ring 222 and the second bottom polymer ring 223, and can be connected to the gas regulating device through the side port of the gas branch located on the side wall of the annular body 14.
[0103] The gas regulating device is used to reduce the gas pressure in the upper middle gas passage 2142 and / or the lower middle gas passage 2152; that is, when the upper / lower middle gas passage is used for evacuation, it can improve the safety of the extended equipment and solve the safety problem of leakage of reaction gas inside the cavity to the outside of the cavity when the sealing ring fails.
[0104] In this embodiment or other embodiments, the upper internal gas passage 2141, the upper middle gas passage 2142, and the upper external gas passage 2143 are interconnected or independent; the lower internal gas passage 2151, the lower middle gas passage 2152, and the lower external gas passage 2153 are interconnected or independent.
[0105] like Figure 2 and Figure 3 As shown, in this embodiment, the annular upper cover plate 20 has an upper notch 200 in the circumferential direction, and the presence of the upper notch 200 makes the annular upper cover plate 20 have a C-shaped cover plate shape. The annular lower cover plate 21 has a lower notch 203 in the circumferential direction, and the presence of the lower notch 203 makes the annular lower cover plate 21 have a C-shaped cover plate shape; the upper notch 200 and the lower notch 203 are arranged opposite each other.
[0106] In this embodiment, the device further includes a notch protrusion disposed on the annular body 10. Specifically, it may include an upper notch protrusion 201 disposed on the top surface of the annular body 14, which may extend upward from the upper fluid groove or be an independent component welded to the upper fluid groove, matching the upper notch 200; and a lower notch protrusion 202 disposed on the bottom surface of the annular body 14, matching the lower notch 203. When the annular upper cover plate 20 and the annular lower cover plate 21 are correspondingly disposed on the top and bottom surfaces of the annular body 10, the upper notch protrusion 201 is inserted into the upper notch 200 and fits the shape of the C-shaped annular upper cover plate 20, assembling a complete annular annular upper cover plate 20; the lower notch protrusion 202 is inserted into the lower notch 203 and fits the shape of the C-shaped annular lower cover plate 21, assembling a complete annular annular lower cover plate 21.
[0107] The upper notch protrusion 201 is used to block the upper fluid channel 204, so that the upper fluid channel 204 is not connected at the position where the upper notch protrusion 201 is provided; the lower notch protrusion 202 is used to block the lower fluid channel 205, so that the lower fluid channel 205 is not connected at the position where the lower notch protrusion 202 is provided; the upper notch protrusion 201 and the lower notch protrusion 202 respectively block the upper fluid channel 204 and the lower fluid channel 205 to form a C-shape. Therefore, the setting of the notch protrusion can provide a setting position for setting gas branches, and will not hinder the setting of the upper and lower fluid channels.
[0108] In this embodiment, the notch protrusion avoids the substrate loading port 13, and the gas inlet 11 and the gas outlet 12 are provided therein, thereby facilitating the configuration of the gas branch. The notch protrusion also facilitates the inline welding between the upper and lower annular cover plates and the annular body, preventing the leakage of cooling liquid in the upper and lower fluid channels.
[0109] like Figure 4 As shown, in this embodiment, the annular upper cover plate 20 and the annular lower cover plate 21 are eccentrically positioned relative to the center of the inner circumference of the annular body 14. The centers of the annular upper cover plate 20 and the annular lower cover plate 21 are offset in a direction away from the notch protrusion.
[0110] In this embodiment, the eccentric distance between the center of the annular upper cover plate 20 and the center of the annular lower cover plate 21 and the center of the annular body 14 is d / 2, where d represents the distance between the inner edge of the annular upper cover plate 20 or the annular lower cover plate 21 and the inner edge of the annular body 14.
[0111] The notch protrusion and notch setting provide the location for the gas branch, and the eccentric setting of the C-shaped cover plate can increase the radial width of the upper notch protrusion 201 and the lower notch protrusion 202. That is, the inner diameter of the two notch protrusions is consistent with the inner diameter of the upper cover plate 20 and the lower cover plate 21, respectively, while the outer diameter can exceed the outer diameter of the upper cover plate 20 and the lower cover plate 21. Thus, when the gas branch is set in the radial direction of the notch protrusion, a sufficiently large branch aperture can be obtained to provide airflow control.
[0112] Please continue to refer to this. Figure 6 As shown, the gas branch 101 is specifically formed inside the upper notch protrusion 201, penetrating the annular body (i.e., the upper and lower notch protrusions 201), and communicates with the upper annular gas passage through an opening on the upper notch protrusion 201. It also communicates with the lower annular gas passage through an opening on the lower notch protrusion 202. In this embodiment, by having the gas branch penetrate the notch protrusion, the upper fluid groove and the lower fluid groove can be avoided.
[0113] In this embodiment or some other embodiments, there are two gas branches 101, which are independent and not connected to each other. One branch is used to connect the upper annular gas passage and the gas regulating device, and the other branch is used to connect the lower annular gas passage and the gas regulating device.
[0114] In this embodiment or some other embodiments, the gas branch 101 consists of three interconnected branches arranged radially along the notch protrusion; that is, one branch connects the upper internal gas passage 2141, the lower internal gas passage 2151 and the gas regulating device; the second branch connects the upper middle gas passage 2142, the lower internal gas passage 2152 and the gas regulating device; and the third branch connects the upper external gas passage 2143, the lower external gas passage 2153 and the gas regulating device.
[0115] In this embodiment or some other embodiments, the gas branch 101 consists of six non-intersecting branches arranged radially along the notch protrusion.
[0116] Specifically, the first passage connects the upper internal gas passage 2141 and the gas regulating device; the second passage connects the lower internal gas passage 2151 and the gas regulating device; the third passage connects the upper middle gas passage 2142 and the gas regulating device; the fourth passage connects the lower internal gas passage 2152 and the gas regulating device; the fifth passage connects the upper external gas passage 2143 and the gas regulating device; and the sixth passage connects the lower external gas passage 2153 and the gas regulating device.
[0117] Please refer to Figure 3 and Figure 5 As shown, the bottom surface of the annular upper cover plate 20 is a plane, and the bottom surface of the annular upper cover plate 20 and the upper fluid groove 204 form a closed upper fluid channel. Coolant is introduced into the upper fluid channel to cool the annular body 14.
[0118] In this embodiment, the top surface of the annular lower cover plate 21 is flat; the top surface of the annular lower cover plate 21 and the lower fluid groove 205 form a closed lower fluid channel. Coolant is introduced into the lower fluid channel to cool the annular body 14. The annular upper and lower cover plates provided in this embodiment have flat surfaces to facilitate their placement on the corresponding grooves, increasing the contact area with the grooves, facilitating contact with the coolant in the grooves, achieving cooling of the annular cover plates, and ensuring stable installation with the grooves. Furthermore, when assembling the upper and lower cover plates by welding, the flat contact makes welding easier.
[0119] In this embodiment, the inner wall of the annular upper cover plate 20 is welded to the outer surface of the upper protrusion 2101; the inner wall of the annular lower cover plate 21 is welded to the outer surface of the lower protrusion 2120, thereby forming a closed upper / lower fluid channel.
[0120] In this embodiment, as Figure 8As shown, this embodiment also includes an upper partition 40 and a lower partition 41, respectively disposed within the upper fluid groove 204 and the lower fluid groove 205, for dividing the upper fluid channel into two independent C-shaped upper sub-fluid channels 234 and 224, and dividing the lower fluid channel into two independent C-shaped lower sub-fluid channels 235 and 225. The dual-layer flow channel configuration improves the temperature regulation effect on the annular body 14. The dual-layer flow channels are independent of each other, allowing for independent regulation of the fluid and temperature within the channels, thus enabling better temperature regulation of the annular body 14.
[0121] Please continue to refer to this. Figure 1 As shown, this embodiment may also include a pressure-bearing housing 62, which is hermetically connected to the base ring assembly and forms a sealed space 61 with the upper cover 30 and the base ring assembly; the substrate processing equipment also includes a heating lamp group 70, which is located in the sealed space 61 and is at a certain distance from the upper cover 30. The heating lamp group 70 emits infrared radiation outward, which heats the substrate W through the upper cover 30, causing it to undergo a film-forming reaction in the process gas environment.
[0122] Meanwhile, a heating lamp 70 can also be installed on the outside of the lower cover 31 to emit infrared radiation through the lower cover 31 to heat the base of the support member 50 and assist the film formation reaction on the surface of the substrate W.
[0123] In some embodiments, the substrate processing apparatus further includes a clamping ring 63, the upper cover 30 reinforces the airtightness between the upper cover 30 and the base ring assembly through the clamping ring 63; the lower cover 31 reinforces the airtightness between the lower cover 31 and the base ring assembly through the clamping ring 64.
[0124] In some other embodiments, the upper annular gas passage may be disposed inside the annular upper cover plate 20 and extend circumferentially along the annular upper cover plate 20; the upper annular gas passage may also include a plurality of suction / exhaust ports formed on the top surface of the annular upper cover plate 20. And / or,
[0125] The lower annular gas passage can be disposed inside the annular lower cover plate 21 and extend circumferentially along the annular lower cover plate 21; the lower annular gas passage may also include a plurality of suction / exhaust ports formed on the top surface of the annular lower cover plate 21. The upper annular gas passage and the lower annular gas passage are connected to an external gas regulating device via a gas branch 101 located within the annular body 14. Figure 1 (Not shown in the diagram) The gas regulating device is used to regulate the gas pressure on the top surface of the annular upper cover plate 20 and / or the bottom surface of the annular lower cover plate 21, which solves the problem of uneven film growth on the substrate caused by changes in gas pressure distribution in the reaction chamber due to gas leakage at the annular assembly, thereby improving the substrate yield.
[0126] In summary, this embodiment solves the problem of arranging upper / lower annular gas passages on the base ring assembly to regulate the gas pressure near the base ring assembly by setting the gas branches at the protruding notch. This is because the base ring assembly itself needs a cooling function, that is, a cooling channel needs to be set inside the base ring assembly. The existence of this cooling channel makes it difficult to arrange upper / lower annular gas passages on the base ring assembly. In other words, it solves the problem of not being able to both cool the base ring assembly itself and regulate the gas pressure near the base ring assembly.
[0127] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.
[0128] In the description of this invention, it should be understood that the terms "center," "height," "thickness," "upper," "lower," "vertical," "horizontal," "top," "bottom," "inner," "outer," "axial," "radial," and "circumferential," etc., indicating orientation or positional relationships, are based on the orientation or positional relationships shown in the accompanying drawings and are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. In the description of this invention, unless otherwise stated, "a plurality of" means two or more.
[0129] In the description of this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.
[0130] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.
[0131] Although the present invention has been described in detail through the preferred embodiments above, it should be understood that the above description should not be considered as a limitation of the present invention. Various modifications and substitutions to the present invention will be apparent to those skilled in the art after reading the above description. Therefore, the scope of protection of the present invention should be defined by the appended claims.
Claims
1. A base ring assembly used in a substrate processing device, characterized in that, include: An annular body, the inner wall of which surrounds the reaction chamber of the substrate processing equipment; The annular body has a gas inlet and a gas outlet on its side wall, wherein the gas inlet and the gas outlet are arranged opposite to each other. Upper fluid groove, which is formed by a downward indentation of the top surface of the annular body; The lower fluid groove is formed by an upward indentation of the bottom surface of the annular body; An annular upper cover plate covers the upper fluid groove, and the annular upper cover plate is provided with an upper annular gas passage; An annular lower cover plate covers the lower fluid groove, and the annular lower cover plate is provided with a lower annular gas passage; The annular main body is disposed between the upper cover and the lower cover of the substrate processing equipment, and the lower cover is disposed opposite to the upper cover; The edge of the upper cover is airtightly connected to the upper surface of the annular upper cover plate, and the gap between the two forms the upper annular gas passage. and / or The edge of the lower cover is airtightly connected to the lower surface of the annular lower cover plate, and the gap between the two forms the lower annular gas passage. The upper annular gas passage and the lower annular gas passage are connected to an external gas regulating device through gas branches located within the annular body. The gas regulating device is used to regulate the gas pressure borne by the top surface of the upper annular cover plate and / or the bottom surface of the lower annular cover plate.
2. The base ring assembly as described in claim 1, characterized in that, Also includes: A first top polymer ring is disposed between the edge of the top cover and the upper surface of the annular top cover plate; The upper annular gas passage includes at least one, located inside and / or outside the first top polymer ring; the gas regulating device is used to draw gas from the upper annular gas passage located inside and / or outside the first top polymer ring; and / or A first bottom polymer ring is disposed between the edge of the lower cover and the lower surface of the annular lower cover plate; the lower annular gas passage includes at least one, located inside and / or outside the first bottom polymer ring; the gas regulating device is used to draw gas from the lower annular gas passage located inside and / or outside the first bottom polymer ring.
3. The base ring assembly as described in claim 2, characterized in that, The edge of the upper cover, the top surface of the annular upper cover plate, and the sidewall of the first top polymer ring define the upper annular gas passage; and / or The edge of the lower cover, the bottom surface of the annular lower cover plate, and the sidewall of the first bottom polymer ring define the lower annular gas passage.
4. The base ring assembly as described in claim 3, characterized in that, Also includes: A second top polymer ring is disposed between the edge of the upper cover and the upper surface of the annular upper cover plate, and surrounds the first top polymer ring; the upper annular gas passage is located outside the second top polymer ring; the gas regulating device is used to inflate the upper annular gas passage located outside the second top polymer ring; and / or The second bottom polymer ring is disposed between the edge of the lower cover and the lower surface of the annular lower cover plate, and surrounds the first bottom polymer ring; the lower annular gas passage is located outside the second bottom polymer ring; the gas regulating device is used to fill the lower annular gas passage located outside the second bottom polymer ring with gas.
5. The base ring assembly as described in claim 4, characterized in that, The inner wall of the upper fluid groove extends upward to form an upper protrusion, and the outer side of the upper protrusion abuts against the inner wall of the annular upper cover; and / or The inner wall of the lower fluid groove extends downward to form a lower protrusion, and the outer side of the lower protrusion abuts against the inner wall of the annular lower cover plate.
6. The base ring assembly as described in claim 5, characterized in that, The outer portion of the upper protrusion and the inner portion of the annular upper cover plate define a first top annular groove, which is used to house the first top polymer ring; the upper annular gas passage is located inside and / or outside the first top annular groove; and / or The outer portion of the lower protrusion and the inner portion of the annular lower cover plate define a first bottom annular groove, the first bottom annular groove being used to place the first bottom polymer ring; the lower annular gas passage is located inside and / or outside the first bottom annular groove.
7. The base ring assembly as described in claim 6, characterized in that, Also includes: The second top annular groove is formed by a downward indentation of the top surface of the annular upper cover plate and surrounds the first top annular groove; the second top annular groove is used to house the second top polymer ring, and the upper annular gas passage is located inside and / or outside the second top annular groove; and / or The second bottom annular groove is formed by an upward indentation of the bottom surface of the annular lower cover plate and surrounds the first bottom annular groove; the second bottom annular groove is used to place the second bottom polymer ring; the lower annular gas passage is located inside and / or outside the second bottom annular groove.
8. The base ring assembly as described in claim 7, characterized in that, The bottom surface of the annular upper cover plate is a plane, and the bottom surface of the annular upper cover plate and the upper fluid groove form a closed upper fluid channel. and / or The top surface of the annular lower cover plate is a plane, and the top surface of the annular lower cover plate and the lower fluid groove form a closed lower fluid channel.
9. The base ring assembly as described in claim 8, characterized in that, The inner wall of the annular upper cover plate is welded to the outer surface of the upper protrusion; and / or the inner wall of the annular lower cover plate is welded to the outer surface of the lower protrusion.
10. The base ring assembly as claimed in claim 7, characterized in that, The upper port of the gas branch is located on the top surface of the annular upper cover plate, and is located inside the first top polymer ring and / or outside the first top polymer ring and / or outside the second top polymer ring; the lower port of the gas branch is located on the bottom surface of the annular lower cover plate, and is located inside the first bottom polymer ring and / or outside the first bottom polymer ring and / or outside the second bottom polymer ring.
11. The base ring assembly as claimed in claim 10, characterized in that, The upper annular gas passage includes an upper internal gas passage located inside the first top polymer ring. The upper internal gas passage is defined by the upper protruding top surface, the bottom surface of the upper cover, and the inner side of the first top polymer ring; the upper internal gas passage is located close to the inner surface of the annular body; And / or, The lower annular gas passage includes an internal gas passage located inside the first bottom polymer ring. The lower internal gas passage is defined by the bottom surface of the lower protrusion, the top surface of the lower cover, and the inner side of the first bottom polymer ring; the lower internal gas passage is located close to the inner surface of the annular body.
12. The base ring assembly as claimed in claim 11, characterized in that, The upper annular gas passage includes an upper external gas passage located outside the second top polymer ring; The outer top surface of the annular upper cover plate extends upward to form an outer top wall; The upper external gas passage is defined by the second top polymer ring, the top surface of the groove wall near the outer top wall in the second top annular groove, the inner surface of the outer top wall, and the bottom surface of the top cover. The upper external gas passage is located away from the inner surface of the annular body; And / or, The lower annular gas passage includes a lower external gas passage located outside the second bottom polymer ring, and the outer bottom surface of the annular lower cover plate extends downward to form an outer bottom wall; The lower external gas passage is defined by the second bottom polymer ring, the bottom surface of the groove wall near the outer bottom wall in the second bottom annular groove, the inner surface of the outer bottom wall, and the top surface of the lower cover. The lower external gas passage is located away from the inner surface of the annular body.
13. The base ring assembly as claimed in claim 12, characterized in that, The upper annular gas passage includes an upper middle gas passage located between the first top polymer ring and the second top polymer ring; the upper middle gas passage is defined by the top surface of the groove wall in the second top annular groove away from the outer top wall, the bottom surface of the upper cover, the first top polymer ring and the second top polymer ring; The upper middle gas passage is located between the upper internal gas passage and the upper external gas passage; And / or, The lower annular gas passage includes a lower central gas passage located between the first bottom polymer ring and the second bottom polymer ring. The lower central gas passage is defined by the bottom surface of the groove wall in the second bottom annular groove that is away from the outer bottom wall, the top surface of the lower cover, the first bottom polymer ring, and the second bottom polymer ring; The lower central gas passage is located between the lower internal gas passage and the lower external gas passage.
14. The base ring assembly as claimed in claim 10, characterized in that, The gas regulating device is used to reduce or increase the gas pressure in the upper annular gas passage and / or the lower annular gas passage.
15. The base ring assembly as claimed in claim 14, characterized in that, The gas regulating device includes a vacuum pump, a clean gas source, and a compressed air source.
16. The base ring assembly as claimed in claim 8, characterized in that, The annular upper cover plate and / or the annular lower cover plate are provided with a notch in the circumferential direction; The upper and / or lower surfaces of the annular body are provided with notched protrusions that match the notches so that the notched protrusions can be inserted into the notches; the notched protrusions are used to block the upper fluid groove and the lower fluid groove; The annular upper cover plate and / or the annular lower cover plate are eccentrically positioned relative to the center of the inner circumference of the annular body, and the centers of the annular upper cover plate and the annular lower cover plate are offset in a direction away from the notch protrusion.
17. The base ring assembly as claimed in claim 16, characterized in that, The gas branch passes through the notch protrusion and is configured to avoid the upper fluid groove and the lower fluid groove.
18. The base ring assembly as claimed in claim 17, characterized in that, Also includes: The upper and lower partitions are respectively disposed in the upper fluid groove and the lower fluid groove, for dividing the upper fluid channel into two independent upper sub-fluid channels and the lower fluid channel into two independent lower sub-fluid channels.
19. The base ring assembly as claimed in claim 9, characterized in that, The first top polymer ring covers the weld between the annular upper cover plate and the upper protrusion.
20. A substrate processing apparatus, characterized in that, include: The base ring assembly as described in any one of claims 1 to 19; A top cover, which is disposed above the base ring assembly; The lower cover is disposed below the base ring assembly; The upper cover, the base ring assembly, and the lower cover define the internal volume of the reaction chamber; A support member is disposed within the reaction chamber and is used to support the substrate.