Cooling device and server having the same

Abstract

The application discloses a cooling device and a server with the same, and the cooling device comprises a shell, a first containing cavity is defined in the shell, a water inlet and a water outlet are formed on the shell and communicate with the first containing cavity, a first heat dissipation member is arranged in the first containing cavity, a plurality of spray plates are arranged in the first containing cavity and sequentially arranged between the water inlet and the first heat dissipation member, and a plurality of spray holes are formed on each spray plate. According to the cooling device, the cooling speed of the cooling device on the chip can be improved by arranging the plurality of spray plates, so that the reliability of the server in the working process is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of servers, and in particular to a cooling device and a server having the same. BACKGROUND

[0002] A large-power chip in a server generates a large amount of heat in the process of working, and some cooling devices are arranged in the server to cool the chip. In the related art, the cooling speed of the cooling device for the chip is insufficient, which affects the reliability of the server in the process of working. SUMMARY

[0003] The present application aims at at least solving one of the problems in the prior art. To this end, the present application provides a cooling device which can improve the reliability of a server in the process of working.

[0004] The present application also provides a server having the above cooling device.

[0005] According to the cooling device of the first aspect of the present application, the shell defines a first accommodating cavity in the shell, and a water inlet and a water outlet are formed on the shell and communicate with the first accommodating cavity; the first heat dissipation member is arranged in the first accommodating cavity; a plurality of spray plates are arranged in the first accommodating cavity and arranged between the water inlet and the first heat dissipation member in sequence, and a plurality of spray holes are formed on each spray plate.

[0006] According to the cooling device of the first aspect of the present application, by arranging a plurality of spray plates, the cooling speed of the cooling device for the chip can be improved, thereby improving the reliability of the server in the process of working.

[0007] According to some embodiments of the present application, in the direction of the water inlet towards the first heat dissipation member, the cross-sectional size of the spray holes on the spray plate arranged close to the water inlet is greater than the cross-sectional size of the spray holes on the spray plate arranged close to the first heat dissipation member.

[0008] According to some embodiments of the present application, the spray holes are circular holes, and in the direction from the water inlet to the first heat dissipation member, the diameters of the spray holes on the plurality of spray plates are sequentially reduced.

[0009] According to some embodiments of the present application, the shell further defines a second accommodating cavity in the shell, the water outlet communicates with the first accommodating cavity through the second accommodating cavity, and a second heat dissipation member is arranged in the second accommodating cavity and arranged on the side of the second accommodating cavity away from the water outlet.

[0010] According to some embodiments of the present application, a water passing plate is arranged in the second accommodating cavity, the water passing plate is arranged between the second heat dissipation member and the water outlet, and a plurality of water passing holes are formed in the water passing plate.

[0011] According to some embodiments of the present application, a plurality of water passing plates are arranged between the second heat dissipation member and the water outlet.

[0012] According to some embodiments of the present application, in the direction from the water outlet to the second heat dissipation member, the cross-sectional size of the water passing holes in the water passing plate arranged close to the water outlet is greater than the cross-sectional size of the water passing holes in the water passing plate arranged close to the second heat dissipation member.

[0013] According to some embodiments of the present application, the water passing holes are circular holes, and in the direction from the water outlet to the second heat dissipation member, the diameters of the water passing holes in the plurality of water passing plates decrease successively.

[0014] According to some embodiments of the present application, a partition plate is arranged in the shell, the first accommodating cavity and the second accommodating cavity are arranged on two sides of the partition plate in the thickness direction of the partition plate, a communication hole is formed in the partition plate and communicates the first accommodating cavity and the second accommodating cavity, at least one water passing plate is arranged between the second heat dissipation member and the water outlet, the communication hole is arranged on the side of the spray plate adjacent to the first heat dissipation member and facing the first heat dissipation member, and the communication hole is arranged on the side of the water passing plate adjacent to the second heat dissipation member and facing the second heat dissipation member.

[0015] According to some embodiments of the present application, the first heat dissipation member comprises a plurality of first heat dissipation fins, the plurality of first heat dissipation fins extend along a first direction and are arranged at intervals in a second direction, the first direction is perpendicular to the second direction, and / or the second heat dissipation member comprises a plurality of second heat dissipation fins, the plurality of second heat dissipation fins extend along the first direction and are arranged at intervals in the second direction, and the communication hole is arranged on at least one side of the first heat dissipation member and the second heat dissipation member in the first direction.

[0016] According to some embodiments of the present application, the shell comprises a cover plate portion and a flat plate portion, the cover plate portion defines a cavity with an open end, and the flat plate portion covers the opening of the cavity.

[0017] According to some embodiments of the present application, a positioning groove is formed around the opening of the cavity, and the flat plate portion is arranged in the positioning groove.

[0018] According to some embodiments of the present application, the water inlet and the water outlet are arranged on the cover plate portion, and the first heat dissipation member is arranged on the flat plate portion.

[0019] According to some embodiments of the present invention, the housing is further provided with a water inlet connector and a water outlet connector, the water inlet connector being connected to the water inlet and the water outlet connector being connected to the water outlet.

[0020] A server according to a second aspect of the present invention includes: the cooling device described above according to the first aspect of the present invention.

[0021] According to the second aspect of the present invention, by providing the cooling device described above according to the first aspect of the present invention, the cooling device has a higher cooling efficiency for the chip, which can improve the reliability of the server during operation.

[0022] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of a cooling device according to an embodiment of the present invention;

[0024] Figure 2 yes Figure 1 The sectional view along the AA direction shown in the figure;

[0025] Figure 3 yes Figure 2 The sectional view along the DD direction shown;

[0026] Figure 4 yes Figure 1 The sectional view shown in the BB direction;

[0027] Figure 5 yes Figure 4 The sectional view along the EE direction shown;

[0028] Figure 6 yes Figure 1 The cross-sectional view along the CC direction shown;

[0029] Figure 7 yes Figure 6 The sectional view shown in the FF direction;

[0030] Figure 8 yes Figure 1 A schematic diagram of the cooling device shown from another angle;

[0031] Figure 9 yes Figure 1 A schematic diagram of the cooling device from another angle.

[0032] Figure label:

[0033] 100, cooling device;

[0034] 10, housing; 11, first accommodating cavity; 12, water inlet; 13, water outlet; 14, second accommodating cavity; 15, partition plate; 151, communication hole; 16, cover plate part; 17, flat plate part; 18, water inlet connector; 19, water outlet connector;

[0035] 20, first heat dissipation member;

[0036] 30, spray plate; 31, spray hole;

[0037] 40, second heat dissipation member;

[0038] 50, water passing plate; 51, water passing hole;

[0039] 60, mounting buckle. DETAILED DESCRIPTION

[0040] Embodiments of the present application are described in detail below with reference to the accompanying drawings, wherein the same or like reference numerals represent the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to explain the present application, and should not be understood as limiting the present application.

[0041] Reference is made below to Figures 1-9 A cooling device 100 according to an embodiment of the first aspect of the present application is described below.

[0042] As Figures 1-3 shown, the cooling device 100 according to the embodiment of the first aspect of the present application comprises a housing 10, a first heat dissipation member 20, and a plurality of spray plates 30, for example, two, three, or four spray plates 30.

[0043] Specifically, the housing 10 defines a first accommodating cavity 11 therein, the housing 10 is formed with a water inlet 12 and a water outlet 13 which are in communication with the first accommodating cavity 11, the first heat dissipation member 20 is arranged in the first accommodating cavity 11, the plurality of spray plates 30 are arranged in the first accommodating cavity 11 and are arranged in sequence between the water inlet 12 and the first heat dissipation member 20, and each of the spray plates 30 is formed with a plurality of spray holes 31.

[0044] The cooling device 100 is arranged close to a chip generating heat in a server, for example, the cooling device 100 can be arranged close to a CPU, and the first heat dissipation member 20 is a component with high heat exchange efficiency.

[0045] In the working process of the server, the cooling device 100 exchanges heat with the chip. In the working process of the cooling device 100, the cooling liquid flows into the first containing cavity 11 from the water inlet 12, and then the cooling liquid is sprayed onto the first heat dissipation member 20 through the spray holes 31 on the plurality of spray plates 30 in sequence, and then the cooling liquid flows out of the shell 10 through the water outlet 13. In this way, the cooling liquid can take away the heat on the cooling device 100, so that the cooling device 100 can continuously exchange heat with the chip and cool the chip.

[0046] After the cooling liquid passes through the spray holes 31 on the plurality of spray plates 30 in sequence, the cooling liquid can be more evenly distributed in the shell 10, thereby improving the heat exchange efficiency of the cooling liquid with the shell 10 and the spray plates 30. At the same time, it can be understood that in the cooling device 100, the first heat dissipation member 20 absorbs a relatively large proportion of heat. After the cooling liquid passes through the spray holes 31 on the plurality of spray plates 30 in sequence, on the one hand, the cooling liquid can be sprayed more evenly on the first heat dissipation member 20, and on the other hand, the spray holes 31 on each spray plate 30 can disperse the cooling liquid, so that the cooling liquid is more dispersed when sprayed onto the first heat dissipation member 20, producing a similar atomization effect, thereby improving the contact degree of the cooling liquid with the first heat dissipation member 20 and improving the heat exchange efficiency of the cooling liquid with the first heat dissipation member 20. Thus, the heat exchange efficiency of the cooling liquid with the cooling device 100 can be improved, thereby improving the cooling efficiency of the cooling device 100 on the chip.

[0047] It can be understood by those skilled in the art that when the server is in a low-temperature environment and the performance of the chip is limited, the cooling liquid flowing into the cooling device 100 can also be heated, so that the cooling device 100 heats the chip, thereby improving the performance of the chip in a low-temperature environment.

[0048] According to the cooling device 100 of the first aspect of the present application, by arranging the plurality of spray plates 30, the cooling speed of the cooling device 100 on the chip can be improved, thereby improving the reliability of the server in the working process.

[0049] In some embodiments of the present application, as Figure 2 , Figure 3 and Figure 5As shown, in the direction from the water inlet 12 to the first heat dissipation member 20, the cross-sectional size of the spray holes 31 on the spray plate 30 arranged close to the water inlet 12 is greater than the cross-sectional size of the spray holes 31 on the spray plate 30 arranged close to the first heat dissipation member 20. That is, the cooling liquid flowing from the water inlet 12 will pass through the spray holes 31 on at least one spray plate 30 whose cross-sectional size is smaller than the cross-sectional size of the spray holes 31 on the first spray plate 30 after passing through the spray holes 31 on the first spray plate 30. It can be understood that, under the condition that the driving pressure of the water inlet 12 is constant, the smaller the size of the spray holes 31, the higher the dispersion degree of the cooling liquid, so that the heat exchange efficiency of the cooling liquid with the shell 10 and the first heat dissipation member 20 can be further improved, thereby further improving the cooling speed of the chip.

[0050] In some embodiments of the present application, as shown in Figure 2 、 Figure 3 and Figure 5 , the spray holes 31 are circular holes, and the diameters of the spray holes 31 on the plurality of spray plates 30 gradually decrease in the direction from the water inlet 12 to the first heat dissipation member 20. Thus, the dispersion degree of the cooling liquid gradually increases in the process of passing through the spray holes 31 on the plurality of spray plates 30, so that the heat exchange efficiency of the cooling liquid with the shell 10 and the first heat dissipation member 20 can be further improved, thereby further improving the cooling speed of the chip. By setting the spray holes 31 as circular holes, the force acting on the cooling liquid during the process of passing through the circular holes is uniform, so that the stability of the cooling device 100 during the flow of the cooling liquid can be improved.

[0051] In some embodiments of the present application, as shown in Figure 1 、 Figure 6 and Figure 7 , the shell 10 further defines a second accommodating cavity 14, the water outlet 13 communicates with the first accommodating cavity 11 through the second accommodating cavity 14, and the second accommodating cavity 14 is provided with a second heat dissipation member 40, and the second heat dissipation member 40 is arranged on the side of the second accommodating cavity 14 away from the water outlet 13.

[0052] In the process of working of the cooling device 100, the cooling liquid flows into the shell 10 from the water inlet 12, passes through the plurality of spray plates 30 in sequence, then exchanges heat with the first heat dissipation member 20, then enters the second accommodating cavity 14 and exchanges heat with the second heat dissipation member 40, and then flows out of the shell 10 from the water outlet 13.

[0053] By setting the second accommodating cavity 14 and the second heat dissipation member 40, on the one hand, the cooling liquid is cooled in the second accommodating cavity 14 and the shell 10 and the second heat dissipation member 40, thereby further improving the cooling efficiency of the cooling device 100, on the other hand, the second accommodating cavity 14 can provide accommodation space for the cooling liquid, when the cooling liquid flowing into the water inlet 12 is relatively fast, the second accommodating cavity 14 can buffer the cooling liquid, and during the flow of the cooling liquid in the shell 10, the stability of the cooling device 100 is improved.

[0054] In some embodiments of the present application, as shown in Figure 3 、 Figure 5 and Figure 6 , the second accommodating cavity 14 is provided with a water passing plate 50, the water passing plate 50 is arranged between the second heat dissipation member 40 and the water outlet 13, and a plurality of water passing holes 51 are formed on the water passing plate 50. In this way, after the cooling liquid entering the second accommodating cavity 14 exchanges heat with the second heat dissipation member 40, the cooling liquid flows out of the water outlet 13 by passing through the water passing holes 51 on the water passing plate 50, and the cooling liquid passing through the water passing holes 51 is more dispersed, which can increase the heat exchange efficiency of the cooling liquid with the shell 10 and the water passing plate 50, thereby further improving the cooling speed of the cooling device 100 on the chip.

[0055] In some embodiments of the present application, as shown in Figure 3 、 Figure 5 and Figure 6 , the number of water passing plates 50 is multiple, for example, the water passing plate 50 can be two, three or four, and the multiple water passing plates 50 are arranged in sequence between the second heat dissipation member 40 and the water outlet 13. In this way, during the process of the cooling liquid passing through the water passing holes 51 on the multiple water passing plates 50 in sequence, the water passing holes 51 on each water passing plate 50 can make the cooling liquid more dispersed, thereby further improving the heat exchange efficiency of the cooling liquid with the shell 10 and the water passing plate 50, thereby further improving the cooling speed of the cooling device 100 on the chip.

[0056] In some embodiments of the present application, as shown in Figure 3 and Figure 5 , in the direction of the water outlet 13 towards the second heat dissipation member 40, among the at least two water passing plates 50, the cross-sectional size of the water passing holes 51 on the water passing plate 50 arranged close to the water outlet 13 is greater than that of the water passing holes 51 on the water passing plate 50 arranged close to the second heat dissipation member 40. That is to say, during the process of the cooling liquid in the second accommodating cavity 14 flowing out of the water outlet 13, after the cooling liquid passes through the water passing holes 51 on the first water passing plate 50, it will pass through the water passing holes 51 on at least one water passing plate 50 with a larger cross-sectional size than the water passing holes 51 on the first water passing plate 50.

[0057] It can be understood that the temperature of the part of the shell 10 close to the second heat dissipation member 40 is higher, the cross-sectional size of the water passing hole 51 on the water passing plate 50 arranged close to the second heat dissipation member 40 is smaller, which can make the cooling liquid passing through the water passing plate 50 more dispersed in the area close to the second heat dissipation member 40, so that the heat exchange efficiency between the cooling liquid and the area environment in this part of the area is higher, and the cross-sectional size of the water passing hole 51 on the water passing plate 50 arranged close to the water outlet 13 is larger, and the cooling liquid receives smaller resistance in the process of passing through the water passing hole 51, which can improve the flow speed of the cooling liquid.

[0058] In some embodiments of the present application, as shown in Figure 3 and Figure 5 , the water passing hole 51 is a circular hole, and the diameter of the water passing hole 51 on the plurality of water passing plates 50 gradually decreases in the direction of the water outlet 13 towards the second heat dissipation member 40. Thus, in the process of the cooling liquid passing through the water passing hole 51 on the plurality of water passing plates 50, the resistance received by the cooling liquid gradually decreases, so that the flow speed of the cooling liquid can be improved. Among them, by setting the water passing hole 51 as a circular hole, the force acting on the cooling liquid in the process of passing through the circular hole is more uniform, which can improve the stability of the cooling device 100 in the process of cooling liquid flowing.

[0059] In some embodiments of the present application, the spray plate 30 is a copper material piece, and the water passing plate 50 is a copper material piece. The copper material piece has excellent heat conduction performance, and by setting the spray plate 30 and the water passing plate 50 as copper material pieces, the heat exchange efficiency of the spray plate 30 with the water passing plate 50 and the cooling liquid can be further improved, so that the heat exchange efficiency of the cooling liquid with the cooling device 100 is further improved, and the cooling speed of the cooling device 100 on the chip is improved.

[0060] In some embodiments of the present application, as shown in Figure 1 , Figure 4 , Figure 5 and Figure 7 , the shell 10 is provided with a partition plate 15, the first containing cavity 11 and the second containing cavity 14 are respectively located on both sides of the thickness direction of the partition plate 15, the partition plate 15 is formed with a communication hole 151 communicating the first containing cavity 11 and the second containing cavity 14, at least one water passing plate 50 is arranged between the second heat dissipation member 40 and the water outlet 13, the communication hole 151 is located on the side of the spray plate 30 adjacent to the first heat dissipation member 20 and facing the first heat dissipation member 20, and is located on the side of the water passing plate 50 adjacent to the second heat dissipation member 40 and facing the second heat dissipation member 40.

[0061] During the working process of the cooling device 100, the cooling liquid flows into the first containing cavity 11 from the water inlet 12, then sequentially passes through the spray holes 31 on the plurality of spray plates 30 and exchanges heat with the first heat dissipation plate, then the cooling liquid passes through the communication holes 151 into the second containing cavity 14 and exchanges heat with the second heat dissipation member 40, and then the cooling liquid passes through the water passing holes 51 on the water passing plate 50 and flows out of the shell 10 from the water outlet 13.

[0062] The first containing cavity 11 and the second containing cavity 14 are separated by the partition plate 15 in the shell 10, so that the structure of the cooling device 100 is relatively simple, and the product design difficulty and the production difficulty can be reduced. The first containing cavity 11 and the second containing cavity 14 are communicated by the communication holes 151 on the partition plate 15, so that the structure of the cooling device 100 can be further simplified, and the flow speed of the cooling liquid in the shell 10 can be improved because the cooling liquid flows from the first containing cavity 11 to the second containing cavity 14 in a relatively short distance.

[0063] In some embodiments of the present application, as shown in Figure 2 , Figure 6 and Figure 7 , the first heat dissipation member 20 includes a plurality of first heat dissipation fins, the plurality of first heat dissipation fins extend along a first direction and are arranged at intervals in a second direction, the first direction is perpendicular to the second direction, and / or the second heat dissipation member 40 includes a plurality of second heat dissipation fins, the plurality of second heat dissipation fins extend along the first direction and are arranged at intervals in the second direction.

[0064] That is, the first heat dissipation member 20 can include a plurality of first heat dissipation fins, the second heat dissipation member 40 can include a plurality of second heat dissipation fins, or the first heat dissipation member 20 can include a plurality of first heat dissipation fins and the second heat dissipation member 40 can include a plurality of second heat dissipation fins.

[0065] The communication holes 151 are arranged on at least one side of the first heat dissipation member 20 and the second heat dissipation member 40 in the first direction, that is, the first heat dissipation member 20 and the second heat dissipation member 40 can be arranged with the communication holes 151 on one side in the first direction, or the first heat dissipation member 20 and the second heat dissipation member 40 can be arranged with the communication holes 151 on both sides in the first direction.

[0066] In the present embodiment, preferably, the first heat dissipation member 20 includes a plurality of first heat dissipation fins, the second heat dissipation member 40 includes a plurality of second heat dissipation fins, and the first heat dissipation member 20 and the second heat dissipation member 40 are arranged with the communication holes 151 on both sides in the first direction.

[0067] It can be understood that the first heat dissipation member 20 and the second heat dissipation member 40 are arranged with the communication holes 151 on both sides in the first direction, and the first heat dissipation member 20 and the second heat dissipation member 40 are arranged at intervals with the inner wall of the shell 10 on both sides in the first direction.

[0068] After the cooling liquid is sprayed to the plurality of first heat dissipation fins through the spray holes 31 on the spray plate 30, the cooling liquid moves along the channels between the first heat dissipation fins in a first direction, and the cooling liquid flowing out of the channels between the first heat dissipation fins flows to the communication holes 151 from the channels between the first heat dissipation fins and the inner wall of the shell 10. After the cooling liquid enters the second cavity through the communication holes 151, the cooling liquid moves along the channels between the second heat dissipation fins and the inner wall of the shell 10 and sequentially enters the channels between the second heat dissipation fins. In this way, the flow of the cooling liquid can be smoother during the heat exchange between the cooling liquid and the first heat dissipation member 20 and the second heat dissipation member 40, and the contact degree between the cooling liquid and the first heat dissipation member 20 and the second heat dissipation member 40 can be improved, thereby further improving the cooling speed of the cooling device 100 on the chip.

[0069] In some embodiments of the present application, as shown in Figure 2 , Figure 4 and Figure 6 , the shell 10 comprises a cover plate portion 16 and a flat plate portion 17. The cover plate portion 16 defines a cavity with an open end in the cover plate portion 16, and the flat plate portion 17 is arranged at the opening of the cavity. In this way, during production, after the components in the cavity are installed, the flat plate portion 17 is sealed at the opening of the cavity, the production process is relatively simple, the structure of the shell 10 is simple, and the product design difficulty can be reduced.

[0070] In some embodiments of the present application, a positioning groove is formed around the opening of the cavity, and the flat plate portion 17 is arranged in the positioning groove. By arranging the positioning groove, the flat plate portion 17 can be positioned during assembly, so that the flat plate portion 17 can be quickly placed in position, thereby improving the production efficiency. After production is completed, the displacement of the flat plate portion 17 can be limited by the positioning groove, and the positioning groove can be sealed with the flat plate portion 17 through two different angle surfaces, thereby improving the structural stability of the shell 10 and the sealing reliability between the cover plate portion 16 and the flat plate portion 17.

[0071] In some embodiments of the present application, as shown in Figure 1 , Figure 2 and Figure 6 , the water inlet 12 and the water outlet 13 are arranged on the cover plate portion 16, and the first heat dissipation member 20 is arranged on the flat plate portion 17. In this way, when the second accommodating cavity 14 and the second heat dissipation member 40 are arranged in the shell 10, the second heat dissipation member 40 is also arranged on the flat plate portion 17, and the water inlet 12 and the water outlet 13 are located at different ends of the first heat dissipation member 20 and the second heat dissipation member 40 in the cooling device 100. When the cooling device 100 is assembled on the server, the flat plate portion 17 can be directed towards the chip, and the cooling liquid pipeline can be connected to the cover plate portion 16, thereby reducing the arrangement difficulty of the cooling device 100 on the server.

[0072] In some embodiments of the present application, the flat plate part 17 is a copper material piece. The copper material piece has excellent heat conduction performance, and by setting the flat plate part 17 as a copper material piece, the heat exchange efficiency between the cooling device 100 and the chip and the heat exchange efficiency between the cooling liquid and the flat plate part 17 can be further improved, so that the cooling speed of the cooling device 100 on the chip is further improved.

[0073] In some embodiments of the present application, as shown in Figure 1 、 Figure 2 and Figure 6 The shell 10 is also provided with a water inlet connector 18 and a water outlet connector 19. The water inlet connector 18 is in communication with the water inlet 12, and the water outlet connector 19 is in communication with the water outlet 13. By setting the water inlet connector 18 and the water outlet connector 19, the connection of the water inlet 12 and the water outlet 13 with the cooling liquid pipeline can be facilitated.

[0074] In some embodiments of the present application, as shown in Figure 1 、 Figure 8 and Figure 9 The shell 10 is also provided with a plurality of mounting buckles 60. The mounting buckles 60 are in the shape of an elbow pipe. When the cooling device 100 is assembled on the server, the mounting buckles 60 are buckled on the mounting positions of the server. In this way, the installation of the cooling device 100 on the server can be achieved, and the assembly is relatively simple.

[0075] According to the second aspect of the present application, the server comprises the cooling device 100 according to the first aspect of the present application.

[0076] According to the second aspect of the present application, by setting the cooling device 100 according to the first aspect of the present application, the cooling efficiency of the cooling device 100 on the chip is higher, and the reliability of the server during operation can be improved.

[0077] In the description of the present application, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0078] In addition, the terms "first", "second", etc. are used only to describe purposes and can not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined with "first", "second" can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "a plurality of" is two or more, unless otherwise explicitly specified and limited.

[0079] In the present application, unless otherwise explicitly specified and limited, the terms "mounting", "connecting", "connecting", "fixing" and the like should be understood in a broad sense, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected, or it can be communicated; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the communication or interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0080] In the description of the present application, the description of the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In the present application, the illustrative description of the above terms is not necessarily for the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art can combine and combine the different embodiments or examples described in the present application and the features of the different embodiments or examples without contradiction.

[0081] Although the embodiments of the present application have been shown and described, those skilled in the art can understand that various changes, modifications, replacements and variations can be made to the embodiments without departing from the principles and purposes of the present application, and the scope of the present application is defined by the claims and their equivalents.

Claims

1. Cooling device, characterized in that The application relates to a shell, which is internally defined with a first accommodating cavity, and is externally formed with a water inlet and a water outlet, which are communicated with the first accommodating cavity; a first heat radiating member is arranged in the first accommodating cavity; a plurality of spray plates are arranged in the first accommodating cavity and are sequentially arranged between the water inlet and the first heat radiating member; a plurality of spray holes are formed in each of the spray plates; the shell is internally further defined with a second accommodating cavity; the water outlet is communicated with the first accommodating cavity through the second accommodating cavity; a water passing plate is arranged in the second accommodating cavity and is formed with a plurality of water passing holes; in the direction from the water inlet to the first heat radiating member, the cross-sectional size of the spray holes in the spray plate arranged close to the water inlet is larger than that of the spray holes in the spray plate arranged close to the first heat radiating member; a second heat radiating member is arranged in the second accommodating cavity; the water passing plate is arranged between the second heat radiating member and the water outlet; the number of the water passing plates is plural; the water passing plates are sequentially arranged between the second heat radiating member and the water outlet; in the direction from the water outlet to the second heat radiating member, the cross-sectional size of the water passing holes in the water passing plate arranged close to the water outlet is larger than that of the water passing holes in the water passing plate arranged close to the second heat radiating member. The spray holes are circular holes; in the direction from the water inlet to the first heat radiating member, the diameters of the spray holes in the plurality of spray plates are sequentially reduced. The second heat radiating member is arranged on the side of the second accommodating cavity, which is away from the water outlet. The water passing holes are circular holes; in the direction from the water outlet to the second heat radiating member, the diameters of the water passing holes in the plurality of water passing plates are sequentially reduced. The shell is internally arranged with a partition plate; the first accommodating cavity and the second accommodating cavity are respectively arranged on the two sides of the thickness direction of the partition plate; the partition plate is formed with a communicating hole, which communicates the first accommodating cavity and the second accommodating cavity; at least one water passing plate is arranged between the second heat radiating member and the water outlet; the communicating hole is arranged on the side of the spray plate, which is adjacent to the first heat radiating member and faces the first heat radiating member, and is arranged on the side of the water passing plate, which is adjacent to the second heat radiating member and faces the second heat radiating member. The first heat radiating member comprises a plurality of first heat radiating fins; the first heat radiating fins are extended along a first direction and are arranged in a second direction; the first direction is perpendicular to the second direction; and / or The second heat radiating member comprises a plurality of second heat radiating fins; the second heat radiating fins are extended along the first direction and are arranged in the second direction. The communicating hole is arranged on at least one side of the first heat radiating member and the second heat radiating member in the first direction. The shell comprises a cover plate part and a flat plate part; the cover plate part is internally defined with a cavity, which is open at one end; the flat plate part is arranged on the opening of the cavity.

2. Cooling device according to claim 1, characterized in that The opening of the cavity is formed with a positioning groove; the flat plate part is arranged in the positioning groove.

3. The cooling device of claim 1, wherein ​ 4. The cooling device of claim 1, wherein ​ 5. Cooling device according to claim 3, characterized in that ​ ​ 6. Cooling device according to claim 5, characterized in that ​ ​ ​ 7. The cooling device of claim 1, wherein ​ 8. Cooling device according to claim 7, characterized in that ​ 9. Cooling device according to claim 7, characterized in that The water inlet and the water outlet are arranged on the cover plate part, and the first heat dissipation member is arranged on the flat plate part.

10. The cooling device of claim 1, wherein, The shell is further provided with a water inlet connector and a water outlet connector, the water inlet connector is communicated with the water inlet, and the water outlet connector is communicated with the water outlet.

11. A server, characterized by Comprising: The cooling device of any one of claims 1-10.

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