Heat dissipation structure of photon counting detector

Abstract

The invention discloses a heat dissipation structure of a photon counting detector, comprising: a detector bracket, a cooling channel is arranged in the detector bracket; a single-row module, the single-row module comprises a component bracket, a module assembly and a heat conductive sheet; a first mounting groove is arranged on the component bracket, the module assembly is arranged in the first mounting groove, and both ends of the component bracket are connected to the detector bracket; the module assembly comprises a module bracket and a detector module, a second mounting groove is arranged on the module bracket, and the second mounting groove has an end opening and a first side opening; the detector module is arranged in plurality, and the ASIC chips of the plurality of detector modules are inserted into the second mounting groove through the end opening; the heat conductive sheet is arranged on both sides of the module bracket, a plurality of fins are arranged on the inner side of the heat conductive sheet, the plurality of fins are inserted into the second mounting groove through the first side opening, and both ends of the heat conductive sheet are fixedly connected to the component bracket. The invention solves the problem that the heat dissipation of the photon counting detector is difficult due to the close distance between the detector modules.

Description

Technical Field

[0001] The present invention relates to the technical field of CT equipment, and in particular to a heat dissipation structure of a photon counting detector. Background Art

[0002] The imaging principle of traditional CT is that the detector receives X-rays passing through the human body, and the detector first converts the X-rays into light signals, and then converts the light signals into electrical signals. In this method, high-energy photons have higher weights, and the noise of electronic circuits will be introduced into the electrical signals. The energy-integrated data collection method is used, which loses the original energy information.

[0003] Currently known photon counting detectors can greatly improve the problems existing in the above-mentioned traditional detectors, and can improve image contrast, spatial resolution, energy resolution, and effectively reduce radiation.

[0004] Photon counting detectors are mostly composed of deep silicon modules. Each detector module is attached with an ASIC chip, and the modules are very close to each other. Compared with traditional CT detectors, the number of ASIC chips is larger and the distribution is more dense. Heat dissipation is a key issue that needs to be solved for photon counting detectors. Summary of the invention

[0005] The main purpose of the present invention is to provide a heat dissipation structure of a photon counting detector to solve the problem of heat dissipation difficulty in photon counting detectors in related technologies due to the close distance between detector modules.

[0006] In order to achieve the above object, the present invention provides a heat dissipation structure of a photon counting detector, comprising:

[0007] A detector bracket, wherein a cooling channel for passing a cooling medium is provided in the detector bracket;

[0008] A single-row module is provided in a plurality of pieces, and the single-row module comprises a component bracket, a module component and a heat conducting sheet; wherein,

[0009] The component bracket is provided with a first mounting groove, the module components are provided in plurality and arranged side by side in the first mounting groove along the length direction of the first mounting groove, and both ends of the component bracket are connected to the detector bracket;

[0010] The module assembly includes a module bracket and a detector module, the module bracket is provided with a plurality of second mounting slots, the second mounting slots having at least one end opening and first side openings located on both sides of the end opening;

[0011] The detector modules are provided in plurality, and the ASIC chips of the plurality of the detector modules are inserted into the second installation groove through the end opening one by one;

[0012] The heat conducting sheet is arranged on both sides of the module bracket, the inner side of the heat conducting sheet is tightly fitted with the outer side of the module bracket, and a plurality of fins are arranged on the inner side of the heat conducting sheet. The plurality of fins are inserted into the second mounting groove one by one through the first side opening, and the two ends of the heat conducting sheet are fixedly connected to the component bracket.

[0013] Furthermore, a space between the ASIC chip and the side wall of the second mounting groove is filled with thermal conductive adhesive, and a space between the fin and the side wall of the second mounting groove is filled with thermal conductive adhesive.

[0014] Furthermore, the detector module includes a substrate, a circuit board is arranged at the lower end of the substrate, the ASIC chip is arranged on the circuit board, and the circuit board is plugged into the second mounting groove.

[0015] Furthermore, the fin is configured to be wavy, and an end of the fin away from the heat conducting plate abuts against an end surface of the circuit board.

[0016] Furthermore, the heat conducting sheet includes a middle section and end sections located at both ends of the middle section, the end sections are tightly fitted and fixedly connected to the side surfaces of the component bracket, the middle section is tightly fitted to the side surfaces of the module bracket, and the fins are arranged on the inner side of the middle section;

[0017] The upper end surface of the middle section is lower than the upper end surface of the first side opening of the second mounting groove, so that an injection port for injecting thermal conductive adhesive is formed between the upper end surface of the middle section and the upper end surface of the side opening.

[0018] Furthermore, the module components are distributed in a fan shape, and the middle section is arranged in an arc shape and matches the distribution arc of the module components.

[0019] Furthermore, a module slot is provided in the detector bracket, a plurality of first plug-in structures are provided on the inner side of the module slot, second plug-in structures are provided at both ends of the component bracket, and the first plug-in structures and the second plug-in structures are plug-fitted.

[0020] Furthermore, the first plug-in structure is a boss, and the distance between the two sides of the boss gradually increases from top to bottom. The second plug-in structure is configured as a groove, and the lower end of the groove has an insertion port, and the distance between the two sides of the groove gradually increases from top to bottom.

[0021] Furthermore, the upper end surface of the module bracket abuts against the lower end surface of the substrate, and the side of the module bracket is also provided with a second side opening, the second side opening is located below the first side opening, the lower end of the circuit board extends to correspond to the second side opening, and the second side opening is used for external wiring to pass through.

[0022] Furthermore, the circuit board includes a first board body and a second board body, the upper end of the first board body is connected to the substrate, and the lower end of the first board body is connected to the second board body;

[0023] The width of the first plate body is smaller than the width of the substrate, a first step surface is provided between the upper end of the first plate body and the substrate, the width of the first plate body is larger than the width of the second plate body, and a second step surface is provided between the lower end of the first plate body and the second plate body;

[0024] The second installation slot includes a first slot body matched with the first plate body and a second slot body matched with the second plate body, the first side opening corresponds to the first slot body, and the second side opening corresponds to the second slot body;

[0025] The ASIC chip is arranged on the first board.

[0026] In an embodiment of the present invention, a detector bracket is provided, and a cooling channel for passing a cooling medium is provided in the detector bracket; a single-row module is provided in a plurality, and the single-row module includes a component bracket, a module assembly and a heat conductive sheet; wherein a first mounting groove is provided on the component bracket, and a plurality of module assemblies are provided and are arranged side by side in the first mounting groove along the length direction of the first mounting groove, and both ends of the component bracket are connected to the detector bracket; the module assembly includes a module bracket and a detector module, and a plurality of second mounting grooves are provided on the module bracket, and the second mounting groove has at least one end opening and a first side opening located on both sides of the end opening; a plurality of detector modules are provided, and the ASIC chips of the plurality of detector modules are inserted into the second mounting groove one by one through the end opening; the heat conductive sheet is provided on both sides of the module bracket, and the inner side of the heat conductive sheet is tightly fitted with the outer side of the module bracket, and the inner side of the heat conductive sheet A plurality of fins are provided, and the plurality of fins are inserted into the second mounting groove through the first side opening one by one, and the two ends of the heat conductive sheet are fixedly connected to the component bracket, so that the detector modules are installed one by one in the second mounting groove of the module bracket, so that the heat generated by the ASIC chip in the detector module is transferred to the module bracket, and the heat of the module bracket is transferred to the heat conductive sheet through the fins inserted into the second mounting groove, and then transferred to the two ends of the component bracket through the heat conductive sheet, and finally transferred to the detector bracket, and is taken away by the cooling medium passed into the cooling channel in the detector bracket, thereby achieving the technical effect of improving the heat dissipation efficiency of the detector module, quickly cooling the ASIC chip in the detector module, and maintaining a constant temperature by using the cooling channel in the detector bracket, thereby solving the problem of heat dissipation difficulty of the photon counting detector in the related technology due to the close distance between the detector modules. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] The accompanying drawings constituting a part of the present invention are used to provide a further understanding of the present invention, so that other features, purposes and advantages of the present invention become more obvious. The accompanying drawings of the exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation of the present invention. In the accompanying drawings:

[0028] Figure 1 is a schematic diagram of the assembly structure of a photon counting detector according to an embodiment of the present invention;

[0029] Figure 2 is a schematic diagram of the structure of a photon counting detector after assembly according to an embodiment of the present invention;

[0030] Figure 3 is a schematic diagram of the assembly structure of a single-row module according to an embodiment of the present invention;

[0031] Figure 4 is a schematic side view of the structure of a single-row module according to an embodiment of the present invention;

[0032] Figure 5 is a schematic cross-sectional structural diagram of a single-row module according to an embodiment of the present invention;

[0033] Figure 6 is a schematic cross-sectional structural diagram of a single-row module according to another embodiment of the present invention;

[0034] Figure 7 is a schematic diagram of the structure of a heat conducting sheet according to an embodiment of the present invention;

[0035] Figure 8 is a schematic diagram of the structure of a module assembly according to an embodiment of the present invention;

[0036] Fig. 9 is a schematic diagram of the assembly structure of the module components according to an embodiment of the present invention;

[0037] Fig.10 is a schematic diagram of the assembly structure of a single detector module according to an embodiment of the present invention;

[0038] Fig.11 is a schematic structural diagram of a module bracket according to an embodiment of the present invention;

[0039] Fig.12 is a schematic structural diagram of a single detector module according to an embodiment of the present invention;

[0040] Among them, 1 detector bracket, 2 single-row modules, 201 component bracket, 2010 first mounting slot, 202 heat conductive sheet, 2020 end section, 2021 middle section, 2022 fin, 203 module component, 2030 module bracket, 20301 first side opening, 20302 second side opening, 20303 second mounting slot, 20304 end opening, 2031 detector module, 20310 circuit board, 20311 ASIC chip, 20312 substrate, 20313 first board body, 20314 second board body, 204 injection port, 3 first plug-in structure, 4 second plug-in structure, 5 module slot. DETAILED DESCRIPTION

[0041] In order to enable those skilled in the art to better understand the scheme of the present invention, the technical scheme in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.

[0042] It should be noted that the terms "first", "second", etc. in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the numbers used in this way can be interchanged under appropriate circumstances to facilitate the embodiments of the present invention described herein.

[0043] In the present invention, the directions or positional relationships indicated by the terms "upper", "lower", "inner", etc. are based on the directions or positional relationships shown in the drawings. These terms are mainly used to better describe the present invention and its embodiments, and are not used to limit the indicated devices, elements or components to have a specific direction, or to be constructed and operated in a specific direction.

[0044] In addition, some of the above terms may be used to express other meanings in addition to indicating orientation or positional relationship. For example, the term "on" may also be used to express a certain dependency or connection relationship in some cases. For those skilled in the art, the specific meanings of these terms in the present invention can be understood according to specific circumstances.

[0045] In addition, the terms "disposed", "provided with", "connected", "fixed" and the like should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection, or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be an internal connection between two devices, elements or components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0046] In addition, the term "plurality" shall mean two or more.

[0047] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features in the embodiments can be combined with each other. The present invention will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0048] To solve relevant technical problems, such as Figures 1 to 12 As shown, an embodiment of the present invention provides a heat dissipation structure of a photon counting detector, including:

[0049] The detector bracket 1 is provided with a cooling channel for passing a cooling medium;

[0050] The single-row module 2 is provided in a plurality of pieces, and the single-row module 2 comprises a component bracket 201, a module component 203 and a heat conducting sheet 202; wherein,

[0051] The component bracket 201 is provided with a first installation slot 2010, and the module components 203 are provided in plurality and arranged side by side in the first installation slot 2010 along the length direction of the first installation slot 2010, and both ends of the component bracket 201 are connected to the detector bracket 1;

[0052] The module assembly 203 includes a module bracket 2030 and a detector module 2031. The module bracket 2030 is provided with a plurality of second mounting slots 20303. The second mounting slots 20303 have at least one end opening 20304 and first side openings 20301 located on both sides of the end opening 20304.

[0053] There are multiple detector modules 2031, and the ASIC chips 20311 of the multiple detector modules 2031 are inserted into the second installation groove 20303 through the end opening 20304 one by one;

[0054] The heat conducting sheet 202 is disposed on both sides of the module bracket 2030, the inner side of the heat conducting sheet 202 is tightly fitted with the outer side of the module bracket 2030, and a plurality of fins 2022 are disposed on the inner side of the heat conducting sheet 202, the plurality of fins 2022 are inserted into the second mounting groove 20303 one by one through the first side opening 20301, and both ends of the heat conducting sheet 202 are fixedly connected to the component bracket 201.

[0055] In this embodiment, if Figure 1 and Figure 2 As shown, the heat dissipation structure mainly includes a detector bracket 1 and a plurality of single-row modules, wherein the detector bracket 1 can be installed on a CT device for use, and the detector bracket 1 also serves as a mounting structure for the single-row modules, and the heat of the single-row modules can be transferred to the detector bracket 1. After a cooling medium is introduced into the cooling channel of the detector bracket 1, the detector bracket 1 can be cooled, thereby cooling the single-row modules. In this embodiment, the cooling medium can be a cooling liquid or a cooling gas, or a mixture of a liquid and a gas, which is not limited in this embodiment.

[0056] In this embodiment, if Figures 2 to 4 As shown, a single-row module is provided in a plurality. To meet the use requirements of the CT device, in this embodiment, a single-row module is provided in a plurality and arranged in sequence along the length direction of the detector bracket 1. To save space, adjacent single-row modules can fit closely together. The single-row module includes a component bracket 201, a module assembly 203 and a heat conductive sheet 202. The component bracket 201 serves as a structure for installing the module assembly 203. Both ends of the component bracket 201 are connected to the detector bracket 1 and correspond to the cooling channel. A first mounting groove 2010 is provided on the component bracket 201. The module assembly 203 is provided in a plurality and arranged in the first mounting groove 2010. Adjacent module assemblies 203 fit closely together. The heat generated by the module assembly 203 can be transferred to the component bracket 201, and then transferred to the detector bracket 1 by the component bracket 201.

[0057] In this embodiment, the module assembly 203 includes a module bracket 2030 and a detector module 2031, wherein the detector module 2031 is provided in plurality. Fig.12 As shown, the detector module 2031 is the main structure of the photon counting detector, which mainly includes a substrate 20312, a circuit board 20310 and an ASIC chip 20311 (application specific integrated circuit chip) arranged on the circuit board 20310. Fig. 9 and Fig.10 As shown, multiple detector modules 2031 are installed on the same module bracket 2030 to form a module assembly 203. For the detector modules 2031, it is mainly the ASIC chip 20311 that generates heat. When the detector modules 2031 are closely arranged, the heat generated by the ASIC chip 20311 is difficult to discharge. Based on this, Figures 9 to 11As shown, in this embodiment, a plurality of second mounting grooves 20303 are provided on the module bracket 2030, and the second mounting groove 20303 includes an end opening 20304 and two first side openings 20301, and the two first side openings 20301 are respectively located on both sides of the module bracket 2030. The plurality of second mounting grooves 20303 correspond to the plurality of detector modules 2031 one by one, and the ASIC chip 20311 of each detector module 2031 is installed in the second mounting groove 20303 one by one through the end opening 20304, so that the heat generated by the ASIC chip 20311 can be transferred to the module bracket 2030.

[0058] On this basis, in order to transfer the heat of the module bracket 2030 to the component bracket 201, as shown in FIG. Figure 3 As shown, the single-row module 2 in this embodiment further includes a heat conducting sheet 202, which is located on both sides of the component bracket 201. Since the module bracket 2030 has a plurality of second mounting slots 20303, in order to transfer the heat in the plurality of second mounting slots 20303 to the component bracket 201, in this embodiment, a plurality of fins 2022 are arranged on the inner side of the heat conducting sheet 202, and the plurality of fins 2022 are inserted into the second mounting slots 20303 through the first side opening 20301 one by one. The heat generated by the ASIC chip 20311 in each second mounting slot 20303 can be transferred to the heat conducting sheet 202 through the fins 2022, and finally transferred to both ends of the component bracket 201 by the heat conducting sheet 202.

[0059] In this embodiment, due to the arrangement of the fins 2022 on the heat conductive sheet 202, the heat of the module bracket 2030 and the detector module 2031 located in the middle area of ​​the component bracket 201 can be transferred to both ends of the component bracket 201 through the heat conductive sheet 202, thereby improving the heat dissipation effect while avoiding heat concentration in the middle of the component bracket 201 as much as possible.

[0060] In this embodiment, the module bracket 2030 can be a silicon wafer bracket, so that it has a good thermal conductivity effect.

[0061] The present embodiment achieves the purpose of installing the detector modules 2031 one by one in the second mounting groove 20303 of the module bracket 2030, so that the heat generated by the ASIC chip 20311 in the detector module 2031 is transferred to the module bracket 2030, and the heat of the module bracket 2030 is transferred to the heat conductive sheet 202 through the fin 2022 inserted into the second mounting groove 20303, and then transferred to the two ends of the component bracket 201 through the heat conductive sheet 202, and finally transferred to the detector bracket 1, and is taken away by the cooling medium passed into the cooling channel in the detector bracket 1, thereby achieving the technical effect of improving the heat dissipation efficiency of the detector module 2031, quickly cooling the ASIC chip 2031 in the detector module 2031, and maintaining a constant temperature by using the cooling channel in the detector bracket 1, thereby solving the problem of heat dissipation difficulty of the photon counting detector in the related art due to the close distance between the detector modules 2031.

[0062] In order to improve the heat conduction efficiency from the ASIC chip 20311 to the module bracket 2030, in this embodiment, a thermal conductive adhesive is filled between the ASIC chip 20311 and the side wall of the second mounting groove 20303, and the thermal conductive adhesive is filled in the gap between the ASIC chip 20311 and the second mounting groove 20303, thereby improving the heat conduction efficiency from the ASIC chip 20311 to the module bracket 2030. On this basis, in this embodiment, a thermal conductive adhesive is filled between the side wall of the fin 2022 and the second mounting groove 20303, and the thermal conductive adhesive is filled in the gap between the fin 2022 and the second mounting groove 20303, thereby improving the heat conduction efficiency from the module bracket 2030 to the heat conductive sheet 202.

[0063] In one embodiment of the detector module 2031, Figure 8 , Fig. 9 and Fig.12 As shown, the detector module 2031 includes a substrate 20312, a circuit board 20310 is disposed at the lower end of the substrate 20312, an ASIC chip 20311 is disposed on the circuit board 20310, and the circuit board 20310 is inserted into the second mounting groove 20303, so that the ASIC chip 20311 is located in the second mounting groove 20303. During installation, for the convenience of positioning, the width of the substrate 20312 is greater than the width of the opening 20304 at the upper end of the second mounting groove 20303, so that during installation, the lower end of the substrate 20312 can be abutted against the upper end of the module bracket 2030, so that each detector module 2031 is installed at the same height.

[0064] In addition, it should be noted that in order to facilitate the heat dissipation generated by the ASIC chip 20311, the ASIC chip 20311 needs to be as close to the fin 2022 as possible. Fig.12As shown, when designing the detector module 2031, the ASIC chip 20311 can be designed to be located near the side edge of the circuit board 20310. Since the heat conducting sheets 202 are arranged on both sides of the module bracket 2030, that is, the fins 2022 are inserted into the two first side openings 20301 of the second mounting groove 20303, the ASIC chip 20311 can be arranged on both side edges of the same circuit board 20310, or for two adjacent circuit boards 20310, the ASIC chip 20311 of one circuit board 20310 is close to the fin 2022 on the left, and the ASIC chip 20311 of the other circuit board 20310 is close to the fin 2022 on the right. In this embodiment, by arranging the ASIC chip 20311 at the side edge of the circuit, it is not only convenient to transfer the heat generated by the ASIC chip 20311 to the heat conductive sheet 202 through the fins 2022, but also convenient to fill the gap between the ASIC chip 20311 and the second mounting groove 20303 with thermal conductive adhesive.

[0065] like Figure 5 As shown, the fin 2022 can be configured as a straight piece. Figure 6 As shown, in order to make the fin 2022 and the second mounting groove 20303 plug and match, the fin 2022 in this embodiment is set to be wavy, and the end of the fin 2022 away from the heat conductive sheet 202 abuts against the end surface of the circuit board 20310. After the fin 2022 is set to be wavy, it is convenient to match the gap between the fin 2022 and the bracket slot, and within the same straight line distance, more contact area can be increased to improve the heat conduction efficiency.

[0066] Further, such as Figure 4 As shown, the heat conductive sheet 202 includes a middle section 2021 and end sections 2020 located at both ends of the middle section 2021. The end sections 2020 are tightly fitted to and fixedly connected to the side of the component bracket 201. The middle section 2021 is tightly fitted to the side of the module bracket 2030. The fins 2022 are arranged on the inner side of the middle section 2021.

[0067] In this embodiment, the length and width of the end section 2020 are close to the length of the side surfaces of the module bracket 201 at both ends, so as to increase the contact area between the end section 2020 and the module bracket 201 as much as possible, thereby improving the thermal conductivity. The middle section 2021 is a long strip structure, and its width can be smaller than the width of the end section 2020. On this basis, in order to improve the thermal conductivity efficiency from the module bracket 2030 to the middle section 2021, the width of the middle section 2021 is close to the width of the second mounting groove 20303 on the module bracket 2030.

[0068] Since thermally conductive adhesive needs to be injected into the second mounting groove 20303 after the thermal conductive sheet 202 is installed, in order to facilitate the injection of thermally conductive adhesive, in this embodiment, while keeping the width of the middle section 2021 close to the width of the second mounting groove 20303, the upper end surface of the middle section 2021 is lower than the upper end surface of the first side opening 20301 of the second mounting groove 20303, so that an injection port 204 for injecting thermally conductive adhesive is formed between the upper end surface of the middle section 2021 and the upper end surface of the side opening.

[0069] In one embodiment, the plurality of module assemblies 203 are distributed in a fan shape, and the middle section 2021 is configured to be in an arc shape and matches the distribution arc of the module assemblies 203 .

[0070] To facilitate the installation of the component bracket 201 on the detector bracket 1, as shown in FIG. Figure 1 As shown, in this embodiment, a module slot 5 is provided in the detector bracket 1, and a plurality of first plug-in structures 3 are provided on the inner side of the module slot 5. Second plug-in structures 4 are provided at both ends of the component bracket 201. The first plug-in structure 3 and the second plug-in structure 4 are plug-fitted together, and the first plug-in structure 3 and the second plug-in structure 4 can be plug-fitted together in the vertical direction.

[0071] In one embodiment of the first plug-in structure 3 and the second plug-in structure 4, the first plug-in structure 3 is a boss, and the distance between the two side surfaces of the boss gradually increases from top to bottom. The second plug-in structure 4 is configured as a groove, and the lower end of the groove has an insertion port, and the distance between the two side surfaces of the groove gradually increases from top to bottom.

[0072] In this embodiment, the structural arrangement of the bosses and grooves enables the plug-in structure to guide the plug-in process of the component bracket 201 and maintain sufficient connection stability after plug-in.

[0073] Since the circuit board 20310 on the detector module 2031 needs to be connected to an external device for use, Figure 8 As shown, in this embodiment, the upper end surface of the module bracket 2030 is abutted against the lower end surface of the substrate 20312, and the side of the module bracket 2030 is also provided with a second side opening 20302, and the second side opening 20302 is located below the first side opening 20301. The lower end of the circuit board 20310 extends to correspond to the second side opening 20302, and the second side opening 20302 is used for external wiring to pass through.

[0074] Specifically, in this embodiment, the depth of the second mounting groove 20303 extends at least to a position corresponding to the second side opening 20302. After the circuit board 20310 on the detector module 2031 is inserted into the second mounting groove 20303, the portion of the circuit board 20310 used for wiring corresponds to the second side opening 20302, the ASIC chip 20311 on the circuit board 20310 corresponds to the first side opening 20301, the fin 2022 on the heat conductive sheet 202 is inserted from the first side opening 20301 to dissipate heat, and the external wiring is connected to the circuit board 20310 through the second side opening 20302.

[0075] In one embodiment of the second side opening 20302, the second side opening 20302 is arranged in a one-to-one correspondence with the first side opening 20301. In another embodiment, the second side opening 20302 can be arranged as an opening with a larger area, and the circuit boards 20310 of all the detector modules 2031 in a single module bracket 2030 are located at positions corresponding to the second side opening 20302.

[0076] In one embodiment of the circuit board 20310, as Fig.12 As shown, the circuit board 20310 includes a first board body 20313 and a second board body 20314, the upper end of the first board body 20313 is connected to the base plate 20312, and the lower end of the first board body 20313 is connected to the second board body 20314;

[0077] The width of the first plate 20313 is smaller than that of the base plate 20312, a first step surface is provided between the upper end of the first plate 20313 and the base plate 20312, the width of the first plate 20313 is larger than that of the second plate 20314, and a second step surface is provided between the lower end of the first plate 20313 and the second plate 20314;

[0078] The second installation slot 20303 includes a first slot body matching the first plate body 20313 and a second slot body matching the second plate body 20314, the first side opening 20301 corresponds to the first slot body, and the second side opening 20302 corresponds to the second slot body;

[0079] An ASIC chip 20311 is disposed on the first board 20313 .

[0080] Specifically, in this embodiment, both the first step surface and the second step surface serve as positioning surfaces for installing the detector module 2031. During installation, the first step surface abuts against the upper end surface of the module bracket 2030, and the second step surface abuts against the bottom surface of the first slot body, thereby positioning the circuit board 20310 during installation. Based on the structural requirements for the first slot body and the second slot body, the module bracket 2030 in this embodiment is set to a T-shaped structure, wherein the width of the upper end of the module bracket 2030 is greater than the width of the lower end, the first slot body is located at the upper end with a larger width, and the second slot body is located at the lower end with a smaller width, thereby effectively reducing the volume and occupied space of the module bracket 2030 while meeting the use requirements.

[0081] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Within the spirit and principle of the present invention, any modification, equivalent replacement, improvement, etc. made should be included in the protection scope of the present invention.

Claims

1. A heat dissipation structure of a photon counting detector, characterized in that: include: A detector bracket, wherein a cooling channel for passing a cooling medium is provided in the detector bracket; A single-row module is provided in a plurality of pieces, and the single-row module comprises a component bracket, a module component and a heat conducting sheet; wherein, The component bracket is provided with a first mounting groove, the module components are provided in plurality and arranged side by side in the first mounting groove along the length direction of the first mounting groove, and both ends of the component bracket are connected to the detector bracket; The module assembly includes a module bracket and a detector module, the module bracket is provided with a plurality of second mounting slots, the second mounting slots having at least one end opening and first side openings located on both sides of the end opening; The detector modules are provided in plurality, and the ASIC chips of the plurality of the detector modules are inserted into the second installation groove through the end opening one by one; The heat conducting sheet is arranged on both sides of the module bracket, the inner side of the heat conducting sheet is tightly fitted with the outer side of the module bracket, and a plurality of fins are arranged on the inner side of the heat conducting sheet, and the plurality of fins are inserted into the second mounting groove through the first side opening one by one, and the two ends of the heat conducting sheet are fixedly connected to the module bracket; The heat conducting sheet includes a middle section and end sections located at both ends of the middle section, the end sections are tightly fitted and fixedly connected to the side surfaces of the component bracket, the middle section is tightly fitted to the side surfaces of the module bracket, and the fins are arranged on the inner side of the middle section; The upper end surface of the middle section is lower than the upper end surface of the first side opening of the second mounting groove, so that an injection port for injecting thermal conductive adhesive is formed between the upper end surface of the middle section and the upper end surface of the side opening.

2. The heat dissipation structure of the photon counting detector according to claim 1, characterized in that: The space between the ASIC chip and the side wall of the second mounting groove is filled with heat-conducting glue, and the space between the fin and the side wall of the second mounting groove is filled with heat-conducting glue.

3. The heat dissipation structure of the photon counting detector according to claim 2, characterized in that: The detector module comprises a substrate, a circuit board is arranged at the lower end of the substrate, the ASIC chip is arranged on the circuit board, and the circuit board is inserted into the second installation groove.

4. The heat dissipation structure of the photon counting detector according to claim 1, characterized in that: The module components are distributed in a fan shape, and the middle section is arranged in an arc shape and matches the distribution arc of the module components.

5. The heat dissipation structure of the photon counting detector according to claim 1, characterized in that: A module slot is provided in the detector bracket, a plurality of first plug-in structures are provided inside the module slot, and second plug-in structures are provided at both ends of the component bracket. The first plug-in structures and the second plug-in structures are plug-fitted.

6. The heat dissipation structure of the photon counting detector according to claim 5, characterized in that: The first plug-in structure is a boss, and the distance between the two sides of the boss gradually increases from top to bottom. The second plug-in structure is set as a groove, and the lower end of the groove has an insertion port, and the distance between the two sides of the groove gradually increases from top to bottom.

7. The heat dissipation structure of the photon counting detector according to claim 3, characterized in that: The upper end surface of the module bracket is abutted against the lower end surface of the substrate, and the side of the module bracket is also provided with a second side opening, the second side opening is located below the first side opening, the lower end of the circuit board extends to correspond to the second side opening, and the second side opening is used for external wiring to pass through.

8. The heat dissipation structure of the photon counting detector according to claim 7, characterized in that: The circuit board comprises a first plate body and a second plate body, the upper end of the first plate body is connected to the substrate, and the lower end of the first plate body is connected to the second plate body; The width of the first plate body is smaller than the width of the substrate, a first step surface is provided between the upper end of the first plate body and the substrate, the width of the first plate body is larger than the width of the second plate body, and a second step surface is provided between the lower end of the first plate body and the second plate body; The second installation slot includes a first slot body matched with the first plate body and a second slot body matched with the second plate body, the first side opening corresponds to the first slot body, and the second side opening corresponds to the second slot body; The ASIC chip is arranged on the first board.

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