Display panel, method of manufacturing the same, and display device

Abstract

The application discloses a display panel, a preparation method thereof and a display device. The display panel comprises a substrate with opposite first and second surfaces, the first surface having an edge region; a first pad located in the edge region; and a conductive film extending from the first surface to the second surface, one end of the conductive film on the first surface being connected with the first pad, and one end of the conductive film on the second surface having fan-out wires or the conductive film being in contact with the fan-out wires on the second surface. The conductive film is a film layer with wires, which can protect the wires and prevent the wires from being corroded in the preparation process, thereby indirectly improving the strength of the wires. The problem of low wire strength on the side or back of the display panel in the prior art and easy corrosion is solved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of display, in particular to a display panel, a preparation method thereof and a display device. BACKGROUND

[0002] In the prior art, when manufacturing side or back wiring of a display panel, silver paste is often used to connect signal lines on the front and back surfaces of the display panel; or a physical vapor deposition (PVD) process is used to deposit metal and then laser etching is used to make the back surface patterned and wired; or a dry film (DFR) is deposited and patterned and wired, but the wiring formed by the above prior art solutions has low strength and is easily corroded, and the protection of the wiring is weak. SUMMARY

[0003] The present application provides a display panel, a preparation method thereof and a display device to solve the problem of low strength and easy corrosion of side or back wiring of a display panel in the prior art.

[0004] According to one aspect of the present application, a display panel is provided, the display panel comprising a display area and a non-display area, comprising: a substrate having opposite first and second surfaces, the first surface having an edge region; a first pad located in the edge region; a conductive film extending from the first surface to the second surface, one end of the conductive film on the first surface being connected to the first pad, one end of the conductive film on the second surface having a fan-out wiring, or the conductive film being in contact with the fan-out wiring on the second surface. The conductive film has wiring therein, so that the conductive film can not only electrically connect the first and second surfaces, but also protect the wiring from damage.

[0005] According to another aspect of the present application, a preparation method of a display panel is also provided, the method comprising: providing a substrate having opposite first and second surfaces, the first surface having an edge region; disposing a plurality of first pads on the substrate, the first pads being located in the edge region; disposing a conductive film on the substrate, the conductive film extending from the first surface to the second surface, one end of the conductive film on the first surface being connected to the first pad, one end of the conductive film on the second surface having the fan-out wiring, or the conductive film being in contact with the fan-out wiring on the second surface.

[0006] According to another aspect of the present application, a display device is also provided, comprising the display panel as described above.

[0007] The display panel provided by the application is characterized in that: the display panel is electrically connected with the pad through the conductive film, the conductive film extends from the first surface to the second surface, one end of the conductive film on the first surface is connected with the first pad, and one end of the conductive film on the second surface has a fan-out wire or the conductive film is in contact with the fan-out wire on the second surface, so as to realize the electrical connection between the first surface and the second surface. The conductive film is a film layer with a wire, which can protect the wire and prevent the wire from being corroded in the preparation process, thereby improving the strength of the wire and solving the problem of low strength and easy corrosion of the wire on the side or back of the display panel in the prior art. BRIEF DESCRIPTION OF DRAWINGS

[0008] The accompanying drawings, which form a part of the present application, are intended to provide further understanding of the present application, and the illustrative embodiments of the present application and their description serve the purpose of explaining the present application. The accompanying drawings should not be regarded as a limitation of the present application. In the accompanying drawings:

[0009] Figure 1 is a partial cross-sectional structure schematic diagram of a display panel provided by an embodiment of the present application;

[0010] Figure 2 is a partial cross-sectional structure schematic diagram of another display panel provided by an embodiment of the present application;

[0011] Figure 3 is a partial cross-sectional structure schematic diagram of a display panel provided by an embodiment of the present application; Figure 2 is a partial cross-sectional structure schematic diagram of the first wire at the dashed box of the conductive film of the display panel shown in FIG. 1;

[0012] Figure 4 is a partial cross-sectional structure schematic diagram of another display panel provided by an embodiment of the present application;

[0013] Figure 5 is a partial cross-sectional structure schematic diagram of another display panel provided by an embodiment of the present application;

[0014] Figure 6 is a partial cross-sectional structure schematic diagram of another display panel provided by an embodiment of the present application;

[0015] Figure 7 is a partial cross-sectional structure schematic diagram of a display panel provided by an embodiment of the present application; Figure 6 is a cross-sectional structure schematic diagram of the second wire at the dashed box of the partial cross-sectional structure of another display panel provided by an embodiment of the present application in FIG. 4;

[0016] Figure 8 is a partial cross-sectional structure schematic diagram of another display panel provided by an embodiment of the present application;

[0017] Figure 9 is a flowchart schematic diagram of a preparation method of a display panel provided by an embodiment of the present application;

[0018] Figure 10 A display panel is provided according to an embodiment of the present application Figure 9 A schematic diagram of a cross-sectional structure of a substrate after a first pad is formed on the substrate is provided in the method for manufacturing the display panel

[0019] Figure 11 A schematic diagram of a cross-sectional structure of a substrate after a carrier film and a part of a second trace are formed in the process of forming the conductive film in the method for manufacturing the display panel Figure 10

[0020] A schematic diagram of a cross-sectional structure of a substrate after a carrier film is formed in the method for manufacturing the display panel Figure 12 Figure 11 A schematic diagram of a cross-sectional structure of a substrate after a conductive film is formed on the first pad in the method for manufacturing the display panel

[0021] Figure 13 A schematic diagram of a cross-sectional structure of a substrate after a carrier film is formed in the process of forming the conductive film in the method for manufacturing the display panel Figure 12

[0022] A schematic diagram of a cross-sectional structure of a substrate after a carrier film is formed in the method for manufacturing the display panel Figure 14 Figure 13 A schematic diagram of a display device is provided according to an embodiment of the present application

[0023] Figure 15 The above drawings include the following reference signs:

[0024] 1, display device; 2, display area; 10, substrate; 20, first pad; 30, conductive film; 31, carrier film; 32, trace area; 321, first trace; 322, second trace; 3221, first line segment; 3222, second line segment; 33, conductive film; 34, adhesive film; 341, first part; 342, second part; 40, second pad; 50, fan-out trace; 60, exposed area. DETAILED DESCRIPTION

[0025] It should be noted that the embodiments and features in the present application can be combined with each other without conflict. The present application will be described in detail below with reference to the drawings and in combination with the embodiments.

[0026] In order to enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work should fall within the scope of protection of the present application.

[0027] In order to enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work should fall within the scope of protection of the present application. ​​

[0028] It should be noted that the terms "first", "second" and the like in the description and claims of the application and the above drawings are used to distinguish similar objects, and do not necessarily indicate a specific order or sequence. It should be understood that the data thus used can be interchanged, where appropriate, to describe the embodiments of the application described herein. In addition, the terms "comprising" and "having" and any variations thereof are intended to cover non-exclusive inclusion, for example, a process, method, system, product or apparatus that includes a list of steps or units is not necessarily limited to those steps or units clearly listed, but can include other steps or units not clearly listed or inherent to such processes, methods, products or apparatuses.

[0029] As mentioned in the background, the display panel in the prior art often uses silver paste when making side or back wiring; or uses laser etching after depositing metal to make wiring; or uses patterned dry film to make wiring, but the wiring formed by the above prior art solutions has low strength and is easy to be corroded, and the protection of the wiring is weak. The present application proposes a display panel, a preparation method thereof and a display device.

[0030] According to an embodiment of the present application, as shown in Figure 1 A display panel is provided, the display panel comprising a display area and a non-display area, comprising: a substrate 10 having opposite first and second surfaces, the first surface having an edge region; a first pad 20 located in the edge region; a conductive film 30 extending from the first surface to the second surface, one end of the conductive film 30 on the first surface being connected to the first pad 20, one end of the conductive film 30 on the second surface having a fan-out wiring, or the conductive film 30 being in contact with the fan-out wiring on the second surface.

[0031] By providing a conductive film with wiring in the display panel, the wiring can be protected, and the wiring can be prevented from being corroded during preparation, thereby improving the strength of the wiring. The conductive film can also achieve seamless contact with the side of the substrate, realizing the seamless splicing technology of the display panel. The problem of low strength and easy corrosion of the side or back wiring of the display panel in the prior art is solved.

[0032] The above is the core idea of the present application, and the technical solutions in the embodiments of the present application will be described clearly and completely in combination with the drawings in the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without making creative efforts fall within the scope of protection of the present application.

[0033] In the display panel in the embodiments of the present application, as shown in Figure 1As shown, the first pad 20 is located at the edge of the substrate 10, one end of the conductive film 30 is in contact with the first pad 20, and the other end of the conductive film 30 extends to the second surface of the substrate and is in contact with the fan-out wire on the second surface of the substrate 10, or part of the other end of the conductive film 30 is the fan-out wire, and the fan-out wire is further electrically connected to other devices in the display panel, such as a flexible circuit board.

[0034] The substrate 10 described above can be formed of any one of polyimide (PI), polycarbonate (PC), polyether sulfone (PES), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyarylate (PAR), glass fiber reinforced plastic (FRP), glass, and ceramic, and the conductive film can adopt a material of organic and flexible material, which is not specifically limited in the present application.

[0035] In some optional embodiments, as shown in Figure 2 As shown, the conductive film 30 includes a carrier film 31 and a wire area 32, the wire area 32 is located between the carrier film 31 and the substrate 10, and the wire area 32 extends from the side of the substrate 10 having the first surface to the side of the substrate 10 having the second surface.

[0036] In the optional embodiments described above, as shown in Figure 2 The conductive film 30 has a wire area 32 and a carrier film 31, the carrier film 31 is located outside the wire area 32 and can protect the wire area 32, the wire area 32 extends from the first surface to the second surface and is used to electrically connect the front and back surfaces of the substrate 10.

[0037] In some optional embodiments, as shown in Figure 2 and Figure 3 As shown, the wire area 32 includes a plurality of first wires 321, the first wires 321 are spaced apart on the carrier film 31, and the first ends of the first wires 321 are electrically connected to the first pads 20, and the second ends of the first wires 321 are connected to the fan-out wires on the second surface.

[0038] In the optional embodiments described above, as shown in Figure 2 and Figure 3 As shown, the wire area 32 has a plurality of first wires 321, the first ends of each first wire 321 are electrically connected to different first pads 20, and the second ends extend from the first surface to the second surface to transmit the electrical signals output from the first pads 20 to the second surface and then to other devices in the display panel through the fan-out wires.

[0039] In the optional embodiments described above, as shown in Figure 4As shown, in the case that the conductive film 30 is in contact with the fan-out wire on the second surface, the second surface of the substrate 10 has a second pad 40, and the first wire 321 is in contact with the fan-out wire 50 through the second pad 40, so as to transmit the electrical signal on the first surface to the second surface. Figure 4 The first pad 20 and the carrier film 31 in the above embodiment are consistent with the structure in the prior art, which will not be repeated here. Figure 2 and Figure 3 The first pad 20 and the carrier film 31 in the above embodiment are consistent with the structure in the prior art, which will not be repeated here.

[0040] In the above optional embodiment, the conductive film is subjected to a laser processing process, so as to fix the conductive film on the first pad and realize the electrical connection between the first pad and the conductive film. In the case of using the laser processing process, the material of the conductive film can be a material with high transparency, temperature resistance and no absorption to laser. The present application does not make specific limitation.

[0041] In some optional embodiments, as shown in Figure 5 The conductive film 30 further includes a conductive film 33, the first wire 321 is located between the conductive film 33 and the carrier film 31, the conductive film 33 extends from the first surface to the second surface, the first end of the first wire 321 is electrically connected to the first pad 20 through the conductive film 33, and the display panel further includes a binding area on the second surface, and the second end of the first wire 321 is electrically connected to a second pad 40 in the binding area through the conductive film 33.

[0042] In the above optional embodiment, as shown in Figure 5 The conductive film 30 further includes a conductive film 33, the first wire 321 is located between the conductive film 33 and the carrier film 31, the conductive film 33 extends from the first surface to the second surface, the first end of the first wire 321 is electrically connected to the first pad 20 through the conductive film 33, and the display panel further includes a binding area on the second surface, and the second end of the first wire 321 is electrically connected to a second pad 40 in the binding area through the conductive film 33.

[0043] In some optional embodiments, as shown in Figure 6 The conductive film 33 has adhesion, so that the conductive film 30, the first pad 20, the second pad 40 and the substrate 10 are tightly attached together, and there is no gap between the conductive film 30, the first pad 20, the second pad 40 and the substrate 10. One end of the first wire 321 is electrically connected to the first pad 20, and the other end is electrically connected to the second pad 40. The first wire 321 serves as a side wire to transmit the electrical signal output from the first pad 20 to the second pad 40. The second pad 40 is further connected to the fan-out wire 50, which transmits the electrical signal to the corresponding device module, so as to complete the transmission of the electrical signal from the first surface to the second surface of the substrate 10. The conductive film 30 can be attached to the substrate 10 by a hot pressing process, and the material of the conductive film can be a material with flexibility, temperature resistance, voltage resistance and water and oxygen isolation properties. The carrier film 31 is attached to the first wire 321 to prevent damage to the first wire 321 during the hot pressing process. Figure 7As shown, the above-mentioned wiring area includes a plurality of second wirings 322, the second wirings 322 on the side of the substrate 10 with the second surface penetrate the carrier film 31, the third end of the second wirings 322 is electrically connected with the first pad 20, and the end of the second wirings 322 on the side of the second surface has the above-mentioned fan-out wiring.

[0044] In the above-mentioned optional embodiments, as shown in Figure 6 As shown, the wiring area can also have second wirings 322, one end of the second wirings 322 is electrically connected with the first pad 20, and the other end of the second wirings 322 penetrates the carrier film 31, and the part of the second wirings 322 penetrating the carrier film 31 is electrically connected with other device modules as the fan-out wiring. After high-precision alignment between the conductive film and the first pad 20, the conductive film is attached to the first pad 20 by hot pressing process, and the conductive film is high-precision bent to tightly adhere to the side profile of the substrate 10, so that the seamless process between the conductive film and the substrate 10 can be realized. There is also a conductive film 33 between the substrate 10 and the second wirings 322 and between the substrate 10 and part of the carrier film 31. Figure 7 As shown in the cross-sectional view of the dashed box, Figure 6 As shown in the cross-sectional view of the dashed box, the arrangement of the plurality of second wirings 322 on the carrier film 31 in the wiring area is shown.

[0045] In some optional embodiments, as shown in Figure 6 As shown, the above-mentioned second wirings 322 on the side of the substrate 10 with the second surface include a first line segment 3221 and a second line segment 3222, the first line segment 3221 is located on the side of the carrier film 31 close to the second surface, the second line segment 3222 is located on the side of the carrier film 31 away from the second surface, and the fan-out wiring is located in the second line segment 3222.

[0046] In the above-mentioned optional embodiments, as shown in Figure 6 As shown, the above-mentioned second wirings 322 extending to the second surface include a first line segment 3221 and a second line segment 3222, wherein the second line segment 3222 penetrates the carrier film 31, and the carrier film 31 on the second surface is divided into two parts, the first line segment 3221 is located between the part of the carrier film 31 and the substrate 10, and the second line segment 3222 is located on the side of the other part of the carrier film 31 away from the substrate 10.

[0047] In some optional embodiments, as shown in Figure 8As shown, the conductive film further comprises an adhesive film 34, the adhesive film 34 has a first portion 341 and a second portion 342, the first portion 341 extends from the first surface to the second surface, and the first portion 341 has a conductive area, the second trace 322 is electrically connected to the first pad 20 through the conductive area, and the second portion 342 is located on the side of the carrier film 31 away from the second line segment 3222.

[0048] In the optional embodiment, as shown, the second trace 322 and the substrate 10 are further provided with an adhesive film 34, the adhesive film 34 extends from the first surface to the second surface, and the adhesive film 34 is used to connect the second trace 322 located at the first surface to the first pad 20, and connect the second trace 322 located at the second surface to the substrate 10, wherein the first portion 341 of the adhesive film 34 has a conductive area at the connection between the second trace 322 and the first pad 20, so as to realize the electrical connection between the second trace 322 and the first pad 20. The second portion 342 of the adhesive film 34 is located between the substrate 10 and the first line segment 3221, and the second portion 342 is located on the side of the carrier film 31 away from the second line segment 3222. Figure 8

[0049] In some optional embodiments, the conductive film comprises an anisotropic conductive film.

[0050] In the optional embodiment, the anisotropic conductive film is composed of an epoxy film and super-dispersed conductive particles, wherein the epoxy film has the advantages of high temperature stability, thermal expansion and moisture absorption, and the anisotropic conductive film can realize longitudinal conduction, transverse insulation and water vapor isolation through the action of hot pressing.

[0051] According to another embodiment of the present application, as shown in the figure, a preparation method of a display panel is provided, comprising: Figure 9

[0052] Step S100: providing a substrate, the substrate has opposite first and second surfaces, and the first surface has an edge region;

[0053] Step S200: providing a plurality of first pads on the substrate, the first pads are located in the edge region;

[0054] Step S300: providing a conductive film on the substrate, the conductive film extends from the first surface to the second surface, one end of the conductive film located at the first surface is connected to the first pad, and one end of the conductive film located at the second surface has the fan-out trace or the conductive film is in contact with the fan-out trace located at the second surface. ​​

[0055] The display panel produced by the above-described display panel manufacturing method includes a conductive film with self-contained wiring, which not only protects the wiring but also prevents corrosion during the manufacturing process, thereby improving the wiring strength. The conductive film also achieves seamless contact with the sides of the substrate, enabling seamless splicing of the display panel. This solves the existing problem of weak wiring strength and susceptibility to corrosion on the sides or back of display panels.

[0056] The following describes in more detail exemplary embodiments of the method for manufacturing a display panel according to the present application. However, these exemplary embodiments can be implemented in a variety of different forms and should not be construed as being limited to the embodiments described herein. It should be understood that these embodiments are provided to make the disclosure of this application thorough and complete, and to fully convey the concepts of these exemplary embodiments to those of ordinary skill in the art.

[0057] First, if Figure 10 As shown, step S100 is performed: providing a substrate 10 , wherein the substrate 10 has a first surface and a second surface opposite to each other, and the first surface has an edge region.

[0058] Specifically, the substrate 10 is provided with an edge region on its first surface, and the edge region is used to form side wiring of the display panel. The substrate 10 can be formed of any one of polyimide (PI), polycarbonate (PC), polyethersulfone (PES), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyarylate (PAR), fiberglass reinforced plastic (FRP), glass, and ceramic, and is not specifically limited in this application.

[0059] After the step of providing the substrate, as Figure 11 As shown, step S200 is performed: a plurality of first solder pads 20 are provided on the substrate 10 , and the first solder pads 20 are located in the edge region.

[0060] Specifically, a plurality of first pads 20 are provided at the edge region. Figure 11 Shown are only cross-sectional views.

[0061] After the step of setting the first pad is completed, as shown in FIG. Figure 1 As shown, step S300 is performed: a conductive film 30 is set on the above-mentioned substrate 10, and the above-mentioned conductive film 30 extends from the above-mentioned first surface to the above-mentioned second surface, and the above-mentioned conductive film 30 is located on the above-mentioned first surface. One end of the above-mentioned conductive film 30 is connected to the above-mentioned first pad 20, and the end of the above-mentioned conductive film 30 is located on the above-mentioned second surface has the above-mentioned fan-out trace, or the above-mentioned conductive film 30 is in contact with the fan-out trace located on the above-mentioned second surface.

[0062] Specifically, the conductive film 30 extends from the first pad 20 on the first surface to the second surface, and the portion of the conductive film 30 on the second surface can be connected with the fan-out traces on the second surface, and the portion of the conductive film 30 on the second surface can also be the fan-out traces.

[0063] In some optional embodiments, as shown in Figure 12 In the step of disposing the conductive film 30 on the substrate 10, the preparation method further includes: disposing an adhesive film 34 on the conductive film 30, the adhesive film 34 has a first portion 341 and a second portion 342, the first portion 341 extends from the first surface to the second surface, and the first portion 341 has a conductive region.

[0064] In the optional embodiments, as shown in Figure 12 The conductive film 30 includes an adhesive film 34, the adhesive film 34 is formed on one side of the conductive film 30, and the adhesive film 34 extends from the first surface to the second surface of the substrate 10 to connect the conductive film 30 with the first pad 20 and the substrate.

[0065] In some optional embodiments, as shown in Figure 8 , Figure 13 and Figure 14 The step of disposing the conductive film 30 on the substrate 10 includes: disposing a carrier film 31 and a portion of a plurality of second traces 322 on the substrate 10, the second traces 322 extend from the side of the substrate 10 having the first surface to the side of the substrate 10 having the second surface, the second traces 322 are located between the carrier film 31 and the substrate 10, and the second traces 322 are electrically connected with the first pad 20 through the conductive region; patterning the carrier film 31 on the side of the substrate 10 having the second surface to make the second traces 322 have an exposed region; forming another portion of the plurality of second traces 322 on the exposed region and the carrier film 31, so that the second traces 322 on the second surface include a first segment 3221 and a second segment 3222 connected with each other, the first segment 3221 is located on the side of the carrier film 31 close to the second surface, the second segment 3222 is located on the side of the carrier film 31 away from the second surface, and the fan-out traces are located in the second segment 3222.

[0066] In the optional embodiments, as shown in Figure 13As shown, an adhesive film 34, a portion of the second trace 322, and a carrier film 31 are sequentially formed on the substrate 10. The adhesive film 34 includes a first portion 341 and a second portion 342. The area of ​​the first portion 341 in contact with the first pad 20 has a conductive area, and the second trace 322 is electrically connected to the first pad 20 through the conductive area. Figure 14 As shown, the carrier film 31 on the second surface is patterned to form a first portion of the carrier film and a second portion of the carrier film, and the second trace 322 has an exposed area 60. The portion of the second trace 322 on the second surface is the first line segment of the second trace 322. Figure 8 As shown, another part of the second trace 322 , ie, a second line segment, is formed on the exposed area and the second portion of the carrier film 31 . The second line segment is a fan-out trace and is electrically connected to other device modules on the second surface.

[0067] In some optional embodiments, the adhesive film is attached to the substrate by a hot pressing process.

[0068] In the above optional embodiment, the conductive film with the adhesive film is subjected to a hot pressing process to tightly adhere the conductive film, the first pad and the overtime to achieve seamless splicing.

[0069] According to another embodiment of the present application, Figure 15 As shown, a display device 1 is provided, comprising the above-mentioned display panel, wherein the display panel has a display area 2 and a non-display area.

[0070] Specifically, the display device may be an electronic device such as a mobile phone, a computer, or a television, and the display panel may be applied thereto.

[0071] It should also be noted that the terms "comprises," "includes," or any other variations thereof are intended to encompass non-exclusive inclusion, such that a process, method, commodity, or apparatus that includes a series of elements includes not only those elements but also other elements not explicitly listed, or includes elements inherent to such process, method, commodity, or apparatus. In the absence of further limitations, an element defined by the phrase "comprises a ..." does not exclude the presence of other identical elements in the process, method, commodity, or apparatus that includes the element.

[0072] The above are merely embodiments of the present application and are not intended to limit the present application. For those skilled in the art, the present application may have various changes and variations. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present application should all be included within the scope of the claims of the present application.

Claims

1. A display panel, characterized by, The display panel includes a display area and a non-display area, comprising: a substrate having opposite first and second surfaces, the first surface having an edge region; a first pad located in the edge region; a conductive film extending from the first surface to the second surface, one end of the conductive film on the first surface being connected to the first pad, and one end of the conductive film on the second surface having fan-out wires, the conductive film including a carrier film and a wire area, the wire area including a plurality of second wires, the second wires having the fan-out wires at ends on the second surface side, the second wires on the substrate having the second surface side including connected first and second line segments, the first line segments being on a side of the carrier film close to the second surface, the second line segments being on a side of the carrier film away from the second surface, and the fan-out wires being in the second line segments.

2. The display panel of claim 1, wherein, The wire area is between the carrier film and the substrate, and the wire area extends from the substrate side having the first surface to the substrate side having the second surface.

3. The display panel of claim 2, wherein, The wire area includes a plurality of first wires, the first wires being spaced apart on the carrier film, and first ends of the first wires being electrically connected to the first pad, and second ends of the first wires being connected to the fan-out wires on the second surface.

4. The display panel of claim 3, wherein, The display panel further includes a binding area on the second surface, the first wires being electrically connected to the fan-out wires through second pads in the binding area.

5. The display panel of claim 3, wherein, The conductive film further includes a conductive film, the first wires being between the conductive film and the side of the carrier film away from the first wires, the conductive film extending from the first surface to the second surface, the first ends of the first wires being electrically connected to the first pad through the conductive film, and the display panel further including a binding area on the second surface, the second ends of the first wires being electrically connected to second pads in the binding area through the conductive film.

6. The display panel of claim 2, wherein, The second wires on the substrate having the second surface side penetrate the carrier film, third ends of the second wires being electrically connected to the first pad, and the ends of the second wires on the second surface side having the fan-out wires.

7. The display panel of claim 6, wherein, The conductive film further includes an adhesive film having first and second portions, the first portion extending from the first surface to the second surface, and the first portion having a conductive area therein, the second wires being electrically connected to the first pad through the conductive area, the second portion being on the side of the carrier film away from the second line segments, and the second portion connecting the carrier film and the second surface.

8. The display panel of claim 5, wherein, The conductive film includes an anisotropic conductive film.

9. A method of manufacturing the display panel according to any one of claims 1 to 8, characterized by, The method includes: providing a substrate having opposite first and second surfaces, the first surface having an edge region; providing a plurality of first pads on the substrate, the first pads being located in the edge region; A conductive film is disposed on the substrate, the conductive film extending from the first surface to the second surface, the conductive film being connected to the first pad at one end of the first surface, the conductive film having a fan-out wire at one end of the conductive film on the second surface, the conductive film including a carrier film and a wire region, the wire region including a plurality of second wires, the second wires having the fan-out wire at ends of the second wires on the second surface side, the second wires on the second surface side of the substrate including connected first segments and second segments, the first segments being on a side of the carrier film close to the second surface, the second segments being on a side of the carrier film away from the second surface, and the fan-out wire being in the second segments.

10. The method of claim 9, wherein, In the step of disposing the conductive film on the substrate, the manufacturing method further includes: An adhesive film is disposed on the conductive film, the adhesive film having a first portion and a second portion, the first portion extending from the first surface to the second surface, and the first portion having a conductive region therein.

11. The method of claim 10, wherein, The step of disposing the conductive film on the substrate includes: The carrier film and a portion of the plurality of second wires are disposed on the substrate, the second wires extending from a side of the substrate having the first surface to a side of the substrate having the second surface, the second wires being between the carrier film and the substrate, the second wires being electrically connected to the first pad through the conductive region; The carrier film on the side of the substrate having the second surface is subjected to a patterning process to cause the second wires to have exposed regions; Another portion of the plurality of second wires is formed on the exposed regions and the carrier film to cause the second wires on the side of the substrate having the second surface to include the connected first segments and second segments, the first segments being on a side of the carrier film close to the second surface, the second segments being on a side of the carrier film away from the second surface, and the fan-out wire being in the second segments.

12. The method of claim 11, wherein, The adhesive film is attached to the substrate using a hot-pressing process.

13. A display device comprising: A display panel including any one of the display panels of claims 1-8.

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