A monitoring and processing base for memory chip production

Abstract

The present invention discloses a monitoring processing base for memory chip production, which belongs to the field of memory preparation technology, and includes a monitoring transfer box body and a bearing base. The monitoring transfer box body is provided with a placement port for the bearing base to be stored. The monitoring transfer box body is slidably connected with the bearing base through an electromagnetic bearing slide rail member. The installation cover plate is connected with a moving platform through a vertical stepping assembly. The mobile platform is connected with a detection platform through a horizontal moving member. The detection platform is provided with a visual detector. The present invention achieves the effect of rotating the wafer by setting a monitoring transfer box body and utilizing the bearing base in the process of installing with the monitoring transfer box body. The visual detector provided on the top performs visual detection of the rotation process of the chip on the wafer, and can timely identify the defects of the wafer after each process, adjust the different chip positions thereon, ensure the consistency of the chip positions on the wafer taken out for processing each time, and ensure the effect of precise processing.

Description

Technical Field

[0001] The present invention relates to the technical field of memory preparation, and in particular to a monitoring and processing base for memory chip production. Background Art

[0002] The main components inside the hard disk storage are storage chips. Storage chip technology is mainly focused on the application of enterprise-level storage systems, providing high-quality support for access performance, storage protocols, management platforms, storage media, and a variety of applications.

[0003] In the production of memory chips, integrated processing is mainly carried out on wafers. A large number of similar chips are arranged on the preferred silicon wafer, which is the carrier of the chip. The processing process of the wafer is very cumbersome, and the wafer is carried by a processing seat during the processing to facilitate positioning and transportation. In the process of chip transfer and integration, the wafer often needs to be moved, resulting in changes in the position of the corresponding chip on the moving wafer. This requires the wafer to be positioned again after the next transportation to ensure accurate identification and processing. Chips will more or less have defective products in the processing process. The existing processing base lacks monitoring effect, and it is difficult to identify defective products in time, intervene in time, reduce unnecessary and redundant processing, and reduce costs. Based on this, a monitoring and processing base for memory chip production is proposed. Summary of the invention

[0004] The purpose of the present invention is to solve the problem in the prior art that more or less defective chips will appear during the processing, the existing processing base lacks monitoring effect, it is difficult to identify defective products in time, and timely intervene, reduce unnecessary and redundant processing, and reduce costs. A monitoring and processing base for memory chip production is proposed.

[0005] In order to achieve the above object, the present invention adopts the following technical solutions:

[0006] A monitoring and processing base for memory chip production, comprising a monitoring transfer box body and a bearing base, wherein the monitoring transfer box body is provided with a placement opening for the bearing base to be stored, the monitoring transfer box body is slidably connected with the bearing base through an electromagnetic bearing slide rail, a mounting cover is arranged on the top of the monitoring transfer box body, the mounting cover is connected with a moving platform through a vertical stepping assembly, a detection platform is connected inside the moving platform through a horizontal moving member, and a visual detector is arranged on the detection platform;

[0007] The supporting base is provided with an installation opening for placing the wafer, a ball plate is arranged at the bottom of the installation opening to reduce the friction of the wafer, a friction wheel is arranged on one side of the installation opening, and the friction wheel is connected to a spur gear used in conjunction with the electromagnetic supporting slide rail through a rotating shaft.

[0008] Preferably, a negative pressure cavity is opened inside the bearing base, the ball plate is in the negative pressure cavity, and control support rods are arranged around it. A support leg is fixedly arranged at the bottom of the control support rod and extends downward through the side wall of the bearing base.

[0009] Preferably, the electromagnetic bearing slide rail component includes a bearing slide rail fixedly arranged on the side wall of the placement port, the side wall of the bearing base is provided with a bearing slide groove adapted to the bearing slide rail, a rectangular offset moving port is provided on the bearing slide rail, a downward pressing magnetic rack is connected to the inside of the rectangular offset moving port through a resistance spring, the downward pressing magnetic rack is adapted to the spur gear, and a magnetic control plate magnetically attracted to the downward pressing magnetic rack is provided on the bearing slide rail.

[0010] Preferably, the ends of the control support rods located inside are each provided with a trigger member, and the trigger member includes an inclined touch rod that interferes with the end of the control support rod, and the end of the inclined touch rod is provided with a triangular locking member, and the triangular locking member extends outward through the side wall of the bearing slide groove, and a locking opening that is compatible with the triangular locking member is opened on the bearing slide rail.

[0011] Preferably, the vertical stepping assembly includes a cover body arranged on the side wall of the monitoring transfer box body, a stepping motor is arranged on the top of the cover body, a stepping screw is connected to the output end of the stepping motor, and the moving platform is threadedly connected to the stepping screw through a driving block.

[0012] Preferably, the transverse moving member includes a driving rail arranged on an electric track, and driving rails are arranged on both sides of the detection platform and move within the electric track.

[0013] Preferably, the triangular locking member is connected to the inner wall of the negative pressure cavity via a reset spring plate.

[0014] Preferably, the ball bearing plate is densely provided with balls, and the bottom of the mounting opening is densely provided with negative pressure holes matched with the balls.

[0015] Compared with the prior art, the present invention has the following beneficial effects:

[0016] 1. The present invention provides a supporting base to meet the needs of the storage chip on the wafer for rotation and positioning in different process processing environments, so as to ensure accurate identification and processing.

[0017] 2. The present invention achieves the effect of rotating the wafer by setting up a monitoring transfer box body and utilizing the supporting base during the installation process with the monitoring transfer box body. The visual detector set on the top performs visual inspection of the chip on the wafer during the rotation process, and can identify defects of the wafer in a timely manner after each process.

[0018] 3. The present invention sets up the cooperation between the monitoring transfer box and the supporting base. Each time the wafer is placed in the monitoring transfer box, the wafer is rotated to adjust the different chip positions thereon, ensuring that the chip positions on the wafer taken out for processing each time are consistent, thereby ensuring the effect of precise processing. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 This is a schematic diagram of the main structure of a monitoring and processing base for memory chip production proposed by the present invention;

[0020] Figure 2 This is a schematic diagram of the assembly structure of a monitoring transfer box in a monitoring processing base for memory chip production proposed by the present invention;

[0021] Figure 3 This is a schematic structural diagram of a supporting base in a monitoring and processing base for memory chip production proposed by the present invention;

[0022] Figure 4 This is a schematic diagram of the internal structure of a supporting base in a monitoring and processing base for memory chip production proposed by the present invention;

[0023] Figure 5 for Figure 4 A schematic diagram of the enlarged structure at A in the middle;

[0024] Figure 6 The present invention is a schematic structural diagram of an electromagnetic bearing slide rail member in a monitoring and processing base for memory chip production.

[0025] In the figure: 1. Monitoring transfer box; 2. Bearing base; 3. Mounting cover; 4. Moving platform; 5. Inspection platform; 6. Visual detector; 7. Mounting port; 8. Ball plate; 9. Friction wheel; 10. Spur gear; 11. Control support rod; 12. Support leg; 13. Bearing slide rail; 14. Bearing slide groove; 15. Pressing magnetic rack; 16. Magnetic control plate; 17. Inclined contact rod; 18. Triangular locking piece; 19. Locking port; 20. Stepping motor; 21. Stepping screw; 22. Driving block; 23. Electric track; 24. Driving slide rail; 25. Reset spring plate. DETAILED DESCRIPTION

[0026] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0027] Example, see Figure 1-6A monitoring and processing base for memory chip production includes a monitoring transfer box body 1 and a bearing base 2. The monitoring transfer box body 1 is provided with a placement opening for storing the bearing base 2. The monitoring transfer box body 1 is slidably connected to the bearing base 2 through an electromagnetic bearing slide rail. A mounting cover 3 is arranged on the top of the monitoring transfer box body 1. The mounting cover 3 is connected to a moving platform 4 through a vertical stepping assembly. Further, the vertical stepping assembly includes a cover body arranged on the side wall of the monitoring transfer box body 1. A stepping motor 20 is arranged on the top of the cover body. A stepping screw 21 is connected to the output end of the stepping motor 20. The moving platform 4 is threadedly connected to the stepping screw 21 through a driving block 22.

[0028] The moving platform 4 is connected to the detection platform 5 via a transverse moving member. Furthermore, the transverse moving member includes a motorized track 23. Both sides of the detection platform 5 are provided with driving rails 24 that move in the motorized track 23.

[0029] The driving slide rail 24 is a kind of electric slide rail. When the robot transports the supporting base 2 inward to the placement port, the driving slide rail 24 will control the detection platform 5 to move at the same speed as the supporting base 2, so as to achieve relative stillness, ensuring that the visual detector 6 installed thereon can realize the detection of data on the chip.

[0030] A visual detector 6 is provided on the detection platform 5. The visual detector 6 is a prior art and can realize the effect of position reading of the chips on the wafer and visual detection of the chips.

[0031] The visual detector 6 is linear, and during the rotation of the wafer, the effect of detecting the entire wafer is achieved. After the visual detector 6 detects the wafer chip, it controls the magnetron plate 16 to be energized through visual detection according to the unified position to release the rotation of the wafer. The unified position can be based on the characteristics of the wafer (the wafer will have a positioning V-shaped groove on the outer wall for positioning) to ensure that the position of the storage chip on the wafer is consistent after each removal, thereby achieving the effect of automatic adjustment and positioning.

[0032] The supporting base 2 is provided with a mounting opening 7 for placing the wafer, and a ball plate 8 is provided inside the mounting opening 7 and at the bottom of the mounting opening 7 to reduce the friction of the wafer, and the ball plate 8 is densely provided with balls, and the bottom of the mounting opening 7 is densely provided with negative pressure holes adapted to the balls;

[0033] A friction wheel 9 is provided on one side of the mounting opening 7. The friction wheel 9 is connected to a spur gear 10 used in conjunction with the electromagnetic bearing slide rail member through a rotating shaft. The spur gear 10 will mesh with the downward pressing magnetic rack 15 during the movement, and drive the spur gear 10 to rotate. The friction wheel 9 connected to the spur gear 10 through the rotating shaft will rotate the wafer;

[0034] Furthermore, a negative pressure cavity is opened inside the bearing base 2, the ball plate 8 is in the negative pressure cavity, and control support rods 11 are arranged around it. A support leg 12 that penetrates the side wall of the bearing base 2 and extends downward is fixedly arranged at the bottom of the control support rod 11.

[0035] A further advantage of adopting the above method is that when the wafer in the supporting base 2 needs to be taken out, the supporting base 2 can be pressed down so that the supporting legs 12 generate pressure to move the ball plate 8 upward and take out the wafer in the mounting port 7.

[0036] Furthermore, the electromagnetic bearing slide rail member includes a bearing slide rail 13 fixedly arranged on the side wall of the placement opening, a bearing slide groove 14 adapted to the bearing slide rail 13 is provided on the side wall of the bearing base 2, and a rectangular offset moving opening is provided on the bearing slide rail 13;

[0037] A downward pressing magnetic rack 15 is connected inside the rectangular offset moving port through a resisting spring. The downward pressing magnetic rack 15 is matched with the spur gear 10 . A magnetic control plate 16 magnetically attracted to the downward pressing magnetic rack 15 is arranged on the bearing slide rail 13 .

[0038] When the magnetron plate 16 is powered on, it will generate suction force on the downward pressing magnetic rack 15, so that the downward pressing magnetic rack 15 is disengaged from the spur gear 10, thereby releasing the rotation of the wafer chip;

[0039] Furthermore, a trigger member is provided at the end of the control support rod 11 located inside, and the trigger member includes an inclined touch rod 17 that contacts the end of the control support rod 11. A triangular locking member 18 is provided at the end of the inclined touch rod 17, and the triangular locking member 18 is connected to the inner wall of the negative pressure cavity through a reset spring plate 25.

[0040] The triangular locking piece 18 extends outward through the side wall of the bearing slide groove 14, and a locking opening 19 adapted to the triangular locking piece 18 is provided on the bearing slide rail 13; the setting of the locking opening 19 can ensure that the bearing base 2 is completely in the monitoring transfer box body 1 and the wafer cannot change its position.

[0041] The triangular locking piece 18 will contact the side wall of the bearing slide rail 13 in advance, and the generated resistance force will directly act on the inclined touch rod 17, causing the ball plate 8 originally at the bottom to generate a moving force upward, thereby converting the friction force at the bottom of the wafer from sliding friction to rolling friction.

[0042] When the present invention is used, the wafer is placed in the mounting opening 7 on the supporting base 2. When the wafer is being processed, the ball plate 8 provided at the bottom is at the bottom, and the balls thereon will not contact the wafer. At this time, the wafer is completely in the mounting opening 7 and in a positioning state, so as to ensure the positioning effect in the processing state.

[0043] When the wafer needs to be transferred through the monitoring transfer box 1 after each processing, the bearing base 2 is placed on the bearing slide 13 inside the monitoring transfer box 1. During the placement process, the triangular locking piece 18 arranged on the inner wall of the bearing slide groove 14 will contact the side wall of the bearing slide 13 in advance, and the generated resistance will directly act on the inclined touch rod 17 to make the ball plate 8 originally at the bottom generate a moving force upward, and the ball plate 8 will lift the wafer inside the installation port 7. At this time, the spur gear 10 will mesh with the downward pressing magnetic rack 15 during the movement, and drive the spur gear 10 to rotate. The friction wheel 9 connected to the spur gear 10 through the rotating shaft will rotate the wafer. During the rotation process, the visual detector 6 on the upper detection table 5 will visually detect the chips on the wafer one by one;

[0044] After the visual detector 6 detects the wafer chip, the magnetron plate 16 is controlled to be energized through visual detection according to the unified position. When energized, the magnetron plate 16 will generate suction to the downward magnetic rack 15, thereby releasing the engagement between the downward magnetic rack 15 and the spur gear 10, releasing the rotation of the wafer chip, completing the combination of the supporting base 2 and the monitoring transfer box body 1, thereby ensuring that the wafer taken out next time has a consistent angle.

[0045] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A monitoring and processing base for memory chip production, comprising a monitoring transfer box (1) and a bearing base (2), characterized in that: The monitoring transfer box body (1) is provided with a placement opening for storing the bearing base (2); the monitoring transfer box body (1) is slidably connected to the bearing base (2) via an electromagnetic bearing slide rail (13); a mounting cover plate (3) is provided on the top of the monitoring transfer box body (1); the mounting cover plate (3) is connected to a moving platform (4) via a vertical stepping assembly; a detection platform (5) is connected to the inside of the moving platform (4) via a horizontal moving member; and a visual detector (6) is provided on the detection platform (5); The bearing base (2) is provided with a mounting opening (7) for placing a wafer, a ball plate (8) is provided inside the mounting opening (7) and at the bottom of the mounting opening (7) for reducing the friction of the wafer, a friction wheel (9) is provided on one side of the mounting opening (7), and the friction wheel (9) is connected to a spur gear (10) used in conjunction with an electromagnetic bearing slide rail member via a rotating shaft; A negative pressure cavity is provided inside the bearing base (2), the ball bearing plate (8) is located in the negative pressure cavity, and control rods (11) are arranged around the bearing base (2). A support leg (12) is fixedly provided at the bottom of the control rod (11) and extends downward through the side wall of the bearing base (2). The electromagnetic bearing slide rail member comprises a bearing slide rail (13) fixedly arranged on the side wall of the placement opening, a bearing slide groove (14) adapted to the bearing slide rail (13) is provided on the side wall of the bearing base (2), a rectangular offset movable opening is provided on the bearing slide rail (13), a downward pressing magnetic rack (15) is connected to the inside of the rectangular offset movable opening via a resisting spring, the downward pressing magnetic rack (15) is adapted to the spur gear (10), and a magnetic control plate (16) magnetically attracted to the downward pressing magnetic rack (15) is provided on the bearing slide rail (13); The ends of the control support rods (11) located inside are each provided with a triggering member, the triggering member comprising an inclined touch rod (17) that contacts the end of the control support rod (11), the end of the inclined touch rod (17) being provided with a triangular locking member (18), the triangular locking member (18) penetrating the side wall of the bearing slide groove (14) and extending outwards, and the bearing slide rail (13) being provided with a locking opening (19) that matches the triangular locking member (18); The vertical stepping assembly comprises a cover body arranged on the side wall of the monitoring transfer box body (1), a stepping motor (20) is arranged on the top of the cover body, the output end of the stepping motor (20) is connected to a stepping screw (21), and the moving platform (4) is threadedly connected to the stepping screw (21) via a driving block (22); The transverse moving member comprises a motor-driven track (23), and driving slide rails (24) are provided on both sides of the detection platform (5) and are located in the motor-driven track (23) for movement. The triangular locking member (18) is connected to the inner wall of the negative pressure cavity via a return spring plate (25).

2. The memory chip production monitoring and processing base according to claim 1, characterized in that: The ball bearing plate (8) is densely provided with balls, and the bottom of the mounting opening (7) is densely provided with negative pressure holes that are compatible with the balls.

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