A memory test server architecture

Abstract

The invention discloses a memory test server architecture, which belongs to the field of memory test technology, and includes a switching device, the switching device is used to test the memory, the switching device is provided with an entry device, the entry device is used to insert a memory stick into a mainboard for testing, and the entry device is provided with a take-out device, the take-out device is used to take out the memory stick after the test is completed. The switching device provided by the invention can drive two test mechanisms to continuously switch positions, and the inserted memory stick is tested through the test mainboard. When the test mainboard reaches below the entry device and the take-out device, the take-out device takes out the memory stick after the test is completed, and the insertion device puts in the memory stick to be tested, with a high degree of automation and good test continuity; the entry device can realize full-automatic continuous placement of the memory stick into the memory slot, and each time the memory stick is placed, the memory placement plate will be driven to move forward a certain distance, so that the placement of the memory stick can be carried out continuously, and the placement efficiency is high.

Description

Technical Field

[0001] The present invention relates to the field of memory testing technology, and in particular to a memory testing server architecture. Background Art

[0002] Memory is an important component in a computer system for storing and quickly accessing data. It is used to store data and programs being processed. It can be accessed quickly, making it much faster than auxiliary storage devices. Memory test server architectures are usually used to verify and evaluate the performance, stability, and compatibility of memory modules. By inserting the memory to be tested into the motherboard for testing, the various parameters of the memory, such as timing, frequency, etc., are tested by running a program on the test motherboard. The memory test server architecture in the prior art can usually only measure the memory one by one. The next measurement can only be performed after a piece of memory is measured and removed. At the same time, it is impossible to realize the continuous automatic insertion and removal of memory, resulting in a low degree of automation and low testing efficiency. Summary of the invention

[0003] In response to the above technical problems, the technical solution adopted by the present invention is: a memory testing server architecture, including a switching device, the switching device including a frame, the switching device is used to test the memory, the switching device is provided with an entry device, the entry device includes an upper plate, the upper plate is fixedly mounted on the frame, the entry device is used to insert the memory stick into the testing motherboard, the entry device is provided with a removal device, the removal device includes a removal rack, the removal rack is fixedly mounted on the upper plate, and the removal device is used to remove the memory stick that has completed the test.

[0004] Furthermore, the switching device includes a track block and a slide column fixedly mounted on the frame, a bottom motor fixedly mounted below the frame, a rotating rod fixedly mounted on the motor shaft of the bottom motor, the rotating rod is rotatably mounted with the frame, and a rotating rod slide groove is provided on the rotating rod.

[0005] Furthermore, two testing mechanisms are provided on the frame, and the testing mechanisms include a sliding frame slidably mounted on a sliding column, an inner sliding column slidably mounted on the sliding frame, a placement plate fixedly mounted on the inner sliding column, an inner sliding spring arranged between the inner sliding column and the sliding frame, a test mainboard fixedly mounted on the placement plate, a memory slot arranged on the test mainboard, a memory card block arranged on the memory slot, the test mainboard is powered on for testing the memory, a bottom sliding column is fixedly mounted on the bottom of the sliding frame, the bottom sliding column slides in the rotating rod slide groove, a fitting slider is fixedly mounted on the bottom of the placement plate, and the fitting slider slides along the track block.

[0006] The rotation of the bottom motor drives the rotating rod to rotate, and drives the bottom sliding column and the sliding frame to slide along the sliding column through the rotating rod sliding groove. During the sliding process of the sliding frame, the placement plate is driven to slide along the track block. In the initial state, the inner sliding spring is in a compressed state. When the placement plate moves inward, the inner sliding spring rebounds, and the inner sliding column and the placement plate slide along the sliding frame, so that the fitting slider is always close to the track block, and then when the rotating rod rotates, the two placement plates move towards each other without collision, thereby realizing the position interchange of the two placement plates and the test mainboard, and the tested memory stick can be removed from the test mainboard through the removal device, and the memory stick to be tested can be placed in another test mainboard through the entry device, and in the process of switching the test mainboard, the memory stick inserted therein is tested by the test mainboard, so as to realize continuous testing of the memory stick.

[0007] Furthermore, the entry device includes a placement rack fixedly mounted on the upper plate, a fixed slide fixedly mounted on the upper plate, a memory placement plate slidably mounted on the fixed slide, a plurality of memory sticks inserted into the memory placement plate, a plurality of push plates fixedly mounted on both sides of the memory placement plate, a material discharge trough is arranged on the upper plate, and when the placement plate and the test mainboard move to the bottom of the placement rack, the memory slot is located below the material discharge trough.

[0008] Furthermore, the insertion rack is provided with a pushing mechanism, and the pushing mechanism includes a sliding electric cylinder rack slidably mounted on the insertion rack, an insertion electric cylinder is fixedly mounted on the sliding electric cylinder rack, an insertion clamp is fixedly mounted on the top of the insertion electric cylinder, an insertion sliding column is fixedly mounted on the insertion clamp, the insertion sliding column is slidably mounted with the sliding electric cylinder rack, a front push plate and a sliding guide column are fixedly mounted on the insertion clamp, and a front push fillet is arranged at the bottom of the front push plate.

[0009] Furthermore, a clamping mechanism is provided on the inserting clamp block, and the clamping mechanism includes a clamping slide column fixedly installed on the inserting clamp block, two clamping plates are slidably installed on the clamping slide column, a clamping spring is provided between the clamping plate and the inserting clamp block, and a clamping chamfer is provided on the clamping plate.

[0010] Furthermore, a descending guide groove is arranged on the side of the placing rack, a lower arc surface and an upper arc surface are arranged on the descending guide groove, and the sliding guide column slides in the descending guide groove.

[0011] When the test motherboard moves to the bottom of the insertion rack, the sliding electric cylinder rack is located under the discharge slot, the insertion electric cylinder extends, driving the insertion clamp to descend, the sliding guide post slides in the descending guide slot, the front push plate is inserted between the two push plates, and the memory stick is inserted between the two clamping plates, and the clamping plate clamps the memory stick through the clamping spring, the front push fillet facilitates the front push plate to be inserted between the two push plates, and the clamping chamfer facilitates the clamping plate to reach both sides of the memory stick, and then the sliding guide post reaches the lower arc surface, the sliding guide post and the insertion clamp continue to descend, and under the action of the lower arc surface, the sliding electric cylinder rack, the insertion clamp, the front push plate and the clamping plate are driven to slide forward along the insertion rack, thereby pushing the push plate and the memory placement plate to slide along the fixed slide through the front push plate, and the clamping plate slides forward with the memory stick, at this time the memory stick and the clamping plate are located above the discharge slot, and the memory stick has not reached the discharge slot When the push plate is pushed down, the clamping plate moves up and the memory stick is pushed down, and the memory stick is finally inserted into the memory slot. When the memory stick is inserted into the memory slot, the memory card block will clamp the memory stick, and then the electric cylinder will be retracted to drive the clamping block to rise, so that the clamping plate will leave the memory stick. Since the memory stick is stuck by the memory card block at this time, the clamping plate will not pull out the memory stick when it rises. When the sliding guide column moves to the upper arc surface, the clamping plate is higher than the memory stick to be fed in at the rear, and the forward push plate is also higher than the push plate. Under the action of the upper arc surface, the sliding electric cylinder frame, the clamping block, the forward push plate and the clamping plate slide backward along the insertion frame. When the electric cylinder is retracted to the top, the clamping plate is located above the next memory stick to be inserted, and the next memory stick is ready to be inserted into the test motherboard.

[0012] Furthermore, the taking-out device includes a taking-out electric cylinder fixedly installed on the taking-out frame, a descending frame fixedly installed on the top of the taking-out electric cylinder, a taking-out sliding column fixedly installed on the descending frame, the taking-out sliding column and the taking-out frame are slidably installed, a discharging chute is arranged on the side of the taking-out frame, a clamping seat is fixedly installed on the descending frame, a clamping column is fixedly installed on the clamping seat, two clamping plates are slidably installed on the clamping column, a chamfer is arranged on the clamping plate, a sliding column spring is arranged between the clamping plate and the clamping seat, an outward push plate is fixedly installed on the clamping plate, an outward push arc surface is arranged on the outward push plate, an upper push column is slidably installed on the descending frame, an upper push spring is arranged between the upper push column and the descending frame, a conical block is fixedly installed on the upper push column, and a lower pressure plate is fixedly installed on the descending frame.

[0013] Furthermore, two ejection columns are slidably installed on the upper plate, an ejection spring is arranged between the ejection column and the upper plate, and an extraction slot is arranged on the upper plate. When the test motherboard moves to the bottom of the extraction rack, the ejection column is located above the memory card block, and the extraction slot is located above the memory slot.

[0014] Furthermore, the take-out rack is provided with a sliding mechanism, and the sliding mechanism includes a discharging rack fixedly mounted on the take-out rack, the discharging rack is provided with an inclined slide groove, guide columns and upper guide columns are slidably mounted in the inclined slide groove, a discharging slope is fixedly mounted on the guide column, the upper guide column is fixedly mounted on the discharging slope, a discharging rotating rod is rotatably mounted on the upper guide column, a discharging guide column is fixedly mounted on the discharging rotating rod, the discharging guide column can slide and rotate in the discharging slide groove, and an anti-static leather is provided on the surface of the discharging slope.

[0015] When one test motherboard moves to the bottom of the placement rack, the other test motherboard is located under the removal rack, and the removal electric cylinder extends to drive the descending rack to descend, thereby causing the clamp to descend, and the clamp reaches the outside of the memory stick on the memory slot, and the sliding column spring causes the clamp to clamp the memory stick. As the descending rack continues to descend, it drives the lower pressure plate to descend. After the lower pressure plate contacts the ejection column, it drives the ejection column to descend, and the ejection spring is compressed. The ejection column pushes the memory card block to open the memory card block, and the memory card block releases the clamp on the memory stick, and the memory card block remains in the open state until the next memory stick is put in, and then the removal electric cylinder contracts, clamps the memory stick through the clamp, drives the memory stick to rise together, and the memory stick leaves the memory slot, thereby removing the tested memory stick from the test motherboard.

[0016] In the initial state, the discharge slope will not block the rise of the descending frame. As the removal electric cylinder further contracts, the descending frame is driven to rise. When the descending frame contacts the discharge guide post, the rise of the descending frame will drive the discharge guide post to rise, thereby driving the discharge rotating rod to rotate, thereby driving the upper guide post, the discharge slope and the guide post to slide along the inclined slide groove, thereby driving the discharge slope to the bottom of the pulled out memory stick. As the descending frame continues to rise, when the upper ejector post contacts the top of the removal frame, the upper ejector spring is compressed, and the conical block moves toward the push plate. The conical block is pushed outward. The arc surface pushes the push plate and the clamping plate to slide outward along the clamping column, so that the clamping plate no longer clamps the memory stick, and the memory stick falls onto the discharge slope and finally leaves along the discharge slope. Then, when the removal electric cylinder extends for the next time, the upper push spring rebounds, and the upper push column and the clamping plate are reset. As the descending frame descends, the discharge guide column and the discharge rotating rod are reset under the action of gravity, and the discharge slope leaves the bottom of the descending frame and will not block the movement of the descending frame. In this reciprocating manner, the tested memory stick is automatically removed from the test mainboard and placed on the discharge slope to leave the device.

[0017] Compared with the prior art, the present invention has the following beneficial effects: (1) the switching device provided in the present invention can drive the two test mechanisms to continuously switch positions. During the switching process, the inserted memory stick is tested by the test mainboard. When the test mainboard reaches below the entry device and the removal device, the tested memory stick is removed by the removal device, and the memory stick to be tested is placed by the placement device. The automation level is high and the test continuity is good. (2) the entry device provided in the present invention can realize the full automatic placement of the memory stick into the memory slot continuously. Each time the memory stick is placed, the memory placement plate is driven to move forward a certain distance, so that the placement of the memory stick can be carried out continuously and the placement efficiency is high. (3) the removal device provided in the present invention can automatically remove the tested memory stick from the memory slot. After the memory stick is removed, after the clamping plate lifts the memory stick to a certain height, the discharge slope automatically reaches below the memory stick, places the memory stick on the discharge slope, and automatically leaves the structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the overall structure of the present invention.

[0019] Figure 2 The switching device structure of the present invention is shown in FIG. Figure 1 .

[0020] Figure 3 The switching device structure of the present invention is shown in FIG. Figure 2 .

[0021] Figure 4 Schematic diagram of the structure of the entry device of the present invention Figure 1 .

[0022] Figure 5 For the present invention Figure 4 A local enlarged schematic diagram of point A in the middle.

[0023] Figure 6 Schematic diagram of the structure of the entry device of the present invention Figure 2 .

[0024] Figure 7 Schematic diagram of the structure of the entry device of the present invention Figure 3 .

[0025] Figure 8 Schematic diagram of the structure of the entry device of the present invention Figure 4 .

[0026] Fig. 9 It is a schematic diagram of the cooperation between the sliding guide column and the descending guide groove of the present invention.

[0027] Fig.10 The structure of the removal device of the present invention is shown in FIG. Figure 1 .

[0028] Fig.11 For the present invention Fig.10 A local enlarged schematic diagram of point B in the middle.

[0029] Fig.12 The structure of the removal device of the present invention is shown in FIG. Figure 2 .

[0030] Fig.13 For the present invention Fig.12 A partial enlarged schematic diagram of point C in the middle.

[0031] Fig.14 The slide-out mechanism structure of the present invention is schematically shown in FIG. Figure 1 .

[0032] Fig.15 The slide-out mechanism structure of the present invention is schematically shown in FIG. Figure 2 .

[0033] Figure numbers: 101-frame; 102-track block; 103-slide column; 104-slide frame; 105-inner slide column; 106-inner slide spring; 107-test main board; 1071-memory slot; 1072-memory card block; 108-rotating rod; 109-bottom motor; 110-bottom slide column; 111-rotating rod slide groove; 112-fitting slider; 113-placing plate; 201-upper plate; 202-insertion frame; 203-fixed slide frame; 204-memory placement plate; 205-memory bar; 206-propelling plate; 207-sliding electric cylinder frame; 208-insertion electric cylinder; 209-insertion slide column; 210-insertion clamp block; 211-forward push plate; 212-clamping slide column; 213-clamping plate; 214-clamping spring; 215-forward push fillet; 216-clamping chamfer; 217-descending guide groove; 2171-lower arc surface; 2172-upper arc surface; 218-sliding guide column; 219-discharging trough; 301-removal rack; 302-removal electric cylinder; 303-removal slide column; 304-discharging rotating rod; 305-discharging chute; 306-discharging guide column; 307-discharging slope; 308-guide column; 309-inclined chute; 3 10-discharging rack; 311-ejection column; 312-ejection spring; 313-descending rack; 314-upper ejection column; 315-upper ejection spring; 316-conical block; 317-lower pressure plate; 318-clamping seat; 319-clamping column; 320-clamping plate; 321-outward push plate; 322-outward push arc surface; 323-sliding column spring; 324-upper guide column; 325-removal groove. DETAILED DESCRIPTION

[0034] The specific implementation of the present invention will be further described below in conjunction with the accompanying drawings.

[0035] Example: Reference Figure 1-Figure 10A memory test server architecture includes a switching device, the switching device includes a frame 101, the switching device is used to test the memory, an entry device is provided on the switching device, the entry device includes an upper plate 201, the upper plate 201 is fixedly installed on the frame 101, the entry device is used to insert a memory stick into a test mainboard for testing, the entry device is provided with a removal device, the removal device includes a removal rack 301, the removal rack 301 is fixedly installed on the upper plate 201, and the removal device is used to remove the memory stick after the test is completed.

[0036] like Figure 2 , Figure 3 As shown, the switching device includes a track block 102 and a slide column 103 fixedly mounted on a frame 101, a bottom motor 109 is fixedly mounted below the frame 101, a rotating rod 108 is fixedly mounted on the motor shaft of the bottom motor 109, the rotating rod 108 is rotatably mounted with the frame 101, and a rotating rod slide groove 111 is provided on the rotating rod 108.

[0037] like Figure 2 , Figure 3 As shown, two testing mechanisms are provided on the frame 101, and the testing mechanisms include a sliding frame 104 slidably mounted on a sliding column 103, an inner sliding column 105 slidably mounted on the sliding frame 104, a placement plate 113 fixedly mounted on the inner sliding column 105, an inner sliding spring 106 is provided between the inner sliding column 105 and the sliding frame 104, a testing mainboard 107 is fixedly mounted on the placement plate 113, a memory slot 1071 is provided on the testing mainboard 107, a memory card block 1072 is provided on the memory slot 1071, the testing mainboard 107 is powered on for testing the memory, a bottom sliding column 110 is fixedly mounted on the bottom of the sliding frame 104, the bottom sliding column 110 slides in the rotating rod slide groove 111, a fitting slider 112 is fixedly mounted on the bottom of the placement plate 113, and the fitting slider 112 slides along the track block 102.

[0038] The bottom motor 109 rotates to drive the rotating rod 108 to rotate, and drives the bottom sliding column 110 and the sliding frame 104 to slide along the sliding column 103 through the rotating rod sliding groove 111. During the sliding process of the sliding frame 104, the placement plate 113 is driven to slide along the track block 102. In the initial state, the inner sliding spring 106 is in a compressed state. When the placement plate 113 moves inward, the inner sliding spring 106 rebounds, and the inner sliding column 105 and the placement plate 113 slide along the sliding frame 104, so that the fitting slider 112 is always close to the track block 102, thereby realizing that when the rotating rod 1 When 08 rotates, the two placement plates 113 move toward each other without colliding, thereby realizing the position interchange of the two placement plates 113 and the test main board 107. The tested memory stick 205 can be removed from the test main board 107 through the removal device, and the memory stick 205 to be tested can be placed into another test main board 107 through the entry device. In the process of switching the position of the test main board 107, the memory stick 205 inserted therein is tested through the test main board 107, thereby realizing continuous testing of the memory stick 205.

[0039] like Figure 4-Figure 9 As shown, the entry device includes a placement rack 202 fixedly mounted on an upper plate 201, a fixed slide 203 fixedly mounted on the upper plate 201, a memory placement plate 204 slidably mounted on the fixed slide 203, a plurality of memory sticks 205 inserted into the memory placement plate 204, a plurality of push plates 206 fixedly mounted on both sides of the memory placement plate 204, and a material discharge trough 219 is provided on the upper plate 201. When the placement plate 113 and the test main board 107 move to the bottom of the placement rack 202, the memory slot 1071 is located below the material discharge trough 219.

[0040] like Figure 4-Figure 9 As shown, a pushing mechanism is provided on the placing frame 202, and the pushing mechanism includes a sliding electric cylinder frame 207 slidably mounted on the placing frame 202, a placing electric cylinder 208 is fixedly mounted on the sliding electric cylinder frame 207, a placing clamp 210 is fixedly mounted on the top of the placing electric cylinder 208, a placing slide column 209 is fixedly mounted on the placing clamp 210, the placing slide column 209 is slidably mounted with the sliding electric cylinder frame 207, a front push plate 211 and a sliding guide column 218 are fixedly mounted on the placing clamp 210, and a front push fillet 215 is provided at the bottom of the front push plate 211.

[0041] like Figure 4-Figure 9 As shown, a clamping mechanism is provided on the inserting clamp 210, and the clamping mechanism includes a clamping slide 212 fixedly installed on the inserting clamp 210, and two clamping plates 213 are slidably installed on the clamping slide 212, a clamping spring 214 is provided between the clamping plate 213 and the inserting clamp 210, and a clamping chamfer 216 is provided on the clamping plate 213.

[0042] like Figure 4-Figure 9As shown, a descending guide groove 217 is provided on the side of the loading rack 202 , and a lower arc surface 2171 and an upper arc surface 2172 are provided on the descending guide groove 217 , and a sliding guide post 218 slides in the descending guide groove 217 .

[0043] When the test motherboard 107 moves to the bottom of the insertion rack 202, the sliding electric cylinder rack 207 is located below the discharge slot 219, the insertion electric cylinder 208 extends, driving the insertion clamp 210 to descend, and the sliding guide column 218 slides in the descending guide slot 217. The forward push plate 211 is inserted between the two push plates 206, and the memory bar 205 is inserted between the two clamping plates 213. The clamping plate 213 clamps the memory bar 205 through the clamping spring 214. The forward push fillet 215 facilitates the insertion of the forward push plate 211 between the two push plates 206, and the clamping chamfer 216 facilitates the clamping plate 213 to reach the memory The memory stick 205 is pushed forward by the push plate 211, and the memory stick 205 is pushed forward by the push plate 211. At the same time, the memory stick 205 is pushed forward by the push plate 211, and the memory stick 205 is pushed forward by the push plate 211. At this time, the memory stick 205 and the clamping plate 213 are located above the discharge slot 219, and the memory stick 205 has not reached the discharge slot. Before the position 219, the memory stick 205 is supported by the upper plate 201, and then the clamping block 210 and the sliding guide column 218 are placed in to continue to descend, and the front push plate 211 slides downward in the push plate 206, and the clamping plate 213 clamps the memory stick 205 and descends, and finally the memory stick 205 is inserted into the memory slot 1071. When the memory stick 205 is inserted into the memory slot 1071, the memory card block 1072 will clamp the memory stick 205, and then the electric cylinder 208 is placed in to shrink, driving the clamping block 210 to rise, so that the clamping plate 213 leaves the memory stick 205. Since the memory stick 205 is now clamped by the memory card block 1072 The clamping plate 213 rises and will not pull out the memory stick 205. When the sliding guide post 218 moves to the upper arc surface 2172, the clamping plate 213 is higher than the memory stick 205 to be fed in from the rear, and the forward push plate 211 is also higher than the push plate 206. Under the action of the upper arc surface 2172, the sliding electric cylinder frame 207, the insertion clamp 210, the forward push plate 211 and the clamping plate 213 slide backward along the insertion frame 202. When the insertion electric cylinder 208 shrinks to the top, the clamping plate 213 is located above the next memory stick 205 to be inserted, preparing for the next memory stick 205 to be inserted into the test motherboard 107.

[0044] like Figure 10-Figure 15As shown, the taking-out device includes a taking-out electric cylinder 302 fixedly mounted on the taking-out frame 301, a descending frame 313 fixedly mounted on the top of the taking-out electric cylinder 302, a taking-out sliding column 303 fixedly mounted on the descending frame 313, the taking-out sliding column 303 is slidably mounted with the taking-out frame 301, a discharging chute 305 is arranged on the side of the taking-out frame 301, a clamping seat 318 is fixedly mounted on the descending frame 313, a clamping column 319 is fixedly mounted on the clamping seat 318, and two clamping columns 319 are slidably mounted on the clamping column 319. The clamping plate 320 is provided with a chamfer, a sliding column spring 323 is provided between the clamping plate 320 and the clamping seat 318, an outward push plate 321 is fixedly installed on the clamping plate 320, an outward push arc surface 322 is provided on the outward push plate 321, an upper push column 314 is slidably installed on the descending frame 313, an upper push spring 315 is provided between the upper push column 314 and the descending frame 313, a conical block 316 is fixedly installed on the upper push column 314, and a lower pressure plate 317 is fixedly installed on the descending frame 313.

[0045] like Figure 10-Figure 15 As shown, two ejection columns 311 are slidably installed on the upper plate 201, an ejection spring 312 is arranged between the ejection column 311 and the upper plate 201, and an extraction slot 325 is arranged on the upper plate 201. When the test motherboard 107 moves to the bottom of the extraction rack 301, the ejection column 311 is located above the memory card block 1072, and the extraction slot 325 is located above the memory slot 1071.

[0046] like Figure 10-Figure 15 As shown, the take-out rack 301 is provided with a sliding mechanism, and the sliding mechanism includes a discharging rack 310 fixedly mounted on the discharging rack 301, and an inclined slide groove 309 is provided on the discharging rack 310, and a guide column 308 and an upper guide column 324 are slidably mounted in the inclined slide groove 309, a discharging slope 307 is fixedly mounted on the guide column 308, and the upper guide column 324 is fixedly mounted on the discharging slope 307, a discharging rotating rod 304 is rotatably mounted on the upper guide column 324, a discharging guide column 306 is fixedly mounted on the discharging rotating rod 304, and the discharging guide column 306 can slide and rotate in the discharging slide groove 305, and an anti-static leather is provided on the surface of the discharging slope 307.

[0047] When one test motherboard 107 moves to the bottom of the insertion rack 202, the other test motherboard 107 is located under the removal rack 301, and the removal electric cylinder 302 extends to drive the descending rack 313 to descend, thereby causing the clamping plate 320 to descend, and the clamping plate 320 reaches the outside of the memory bar 205 on the memory slot 1071, and the sliding column spring 323 causes the clamping plate 320 to clamp the memory bar 205. As the descending rack 313 continues to descend, the lower pressure plate 317 is driven to descend. When the lower pressure plate 317 contacts the ejection column 311, the ejection column 311 is driven to The ejection spring 312 is compressed, and the ejection column 311 pushes the memory card block 1072 to open the memory card block 1072. The memory card block 1072 releases the clamp on the memory stick 205, and the memory card block 1072 remains in the open state until the next memory stick 205 is put in. The electric cylinder 302 is then taken out and contracts, clamping the memory stick 205 through the clamping plate 320, driving the memory stick 205 to rise together, and the memory stick 205 leaves the memory slot 1071, thereby removing the tested memory stick 205 from the test motherboard 107.

[0048] In the initial state, the discharge slope 307 will not block the rise of the lowering frame 313. As the removal electric cylinder 302 further contracts, the lowering frame 313 is driven to rise. When the lowering frame 313 contacts the discharge guide post 306, the rise of the lowering frame 313 will drive the discharge guide post 306 to rise, thereby driving the discharge rotating rod 304 to rotate, thereby driving the upper guide post 324, the discharge slope 307 and the guide post 308 to slide along the inclined slide groove 309, thereby driving the discharge slope 307 to reach the bottom of the pulled out memory stick 205. As the lowering frame 313 continues to rise, when the upper push post 314 contacts the top of the removal frame 301, the upper push spring 315 is compressed, and the conical block 316 moves toward the outer push plate 321. The arc surface 322 pushes the outer push plate 321 and the clamping plate 320 to slide outward along the clamping column 319, so that the clamping plate 320 no longer clamps the memory stick 205, and the memory stick 205 falls onto the discharge slope 307 and finally leaves along the discharge slope 307. Then, when the removal electric cylinder 302 is extended for the next time, the upper push spring 315 rebounds, and the upper push column 314 and the clamping plate 320 are reset. As the descending frame 313 descends, the discharge guide column 306 and the discharge rotating rod 304 are reset under the action of gravity, and the discharge slope 307 leaves the bottom of the descending frame 313 and will not block the movement of the descending frame 313. In this way, the memory stick 205 that has completed the test is automatically removed from the test mainboard 107 and placed on the discharge slope 307 to leave the device.

[0049] The working principle of a memory test server architecture disclosed in the present invention is as follows: the bottom motor 109 rotates to drive the rotating rod 108 to rotate, and the bottom sliding column 110 and the sliding frame 104 are driven to slide along the sliding column 103 through the rotating rod sliding groove 111. During the sliding process of the sliding frame 104, the placement plate 113 is driven to slide along the track block 102. In the initial state, the inner sliding spring 106 is in a compressed state. When the placement plate 113 moves inward, the inner sliding spring 106 rebounds, and the inner sliding column 105 and the placement plate 113 slide along the sliding frame 104, so that the fitting slider 112 is always close to the track block. 102, and then when the rotating rod 108 rotates, the two placement plates 113 move towards each other without colliding, so that the positions of the two placement plates 113 and the test main board 107 are interchanged, and the tested memory stick 205 can be removed from the test main board 107 by the removal device, and the memory stick 205 to be tested can be placed into another test main board 107 by the entry device, and in the process of switching the position of the test main board 107, the memory stick 205 inserted therein is tested by the test main board 107, so as to realize continuous testing of the memory stick 205.When the test motherboard 107 moves to the bottom of the insertion rack 202, the sliding electric cylinder rack 207 is located below the discharge slot 219, the insertion electric cylinder 208 extends, driving the insertion clamp 210 to descend, and the sliding guide column 218 slides in the descending guide slot 217. The forward push plate 211 is inserted between the two push plates 206, and the memory bar 205 is inserted between the two clamping plates 213. The clamping plate 213 clamps the memory bar 205 through the clamping spring 214. The forward push fillet 215 facilitates the insertion of the forward push plate 211 between the two push plates 206, and the clamping chamfer 216 facilitates the clamping plate 213 to reach the memory The memory stick 205 is pushed forward by the push plate 211, and the memory stick 205 is pushed forward by the push plate 211. At the same time, the memory stick 205 is pushed forward by the push plate 211, and the memory stick 205 is pushed forward by the push plate 211. At this time, the memory stick 205 and the clamping plate 213 are located above the discharge slot 219, and the memory stick 205 has not reached the discharge slot. Before the position 219, the memory stick 205 is supported by the upper plate 201, and then the clamping block 210 and the sliding guide column 218 are placed in to continue to descend, and the front push plate 211 slides downward in the push plate 206, and the clamping plate 213 clamps the memory stick 205 and descends, and finally the memory stick 205 is inserted into the memory slot 1071. When the memory stick 205 is inserted into the memory slot 1071, the memory card block 1072 will clamp the memory stick 205, and then the electric cylinder 208 is placed in to shrink, driving the clamping block 210 to rise, so that the clamping plate 213 leaves the memory stick 205. Since the memory stick 205 is now clamped by the memory card block 1072 The clamping plate 213 rises and will not pull out the memory stick 205. When the sliding guide post 218 moves to the upper arc surface 2172, the clamping plate 213 is higher than the memory stick 205 to be fed in from the rear, and the forward push plate 211 is also higher than the push plate 206. Under the action of the upper arc surface 2172, the sliding electric cylinder frame 207, the insertion clamp 210, the forward push plate 211 and the clamping plate 213 slide backward along the insertion frame 202. When the insertion electric cylinder 208 shrinks to the top, the clamping plate 213 is located above the next memory stick 205 to be inserted, preparing for the next memory stick 205 to be inserted into the test motherboard 107.When one test motherboard 107 moves to the bottom of the insertion rack 202, the other test motherboard 107 is located under the removal rack 301, and the removal electric cylinder 302 extends to drive the descending rack 313 to descend, thereby causing the clamping plate 320 to descend, and the clamping plate 320 reaches the outside of the memory bar 205 on the memory slot 1071, and the sliding column spring 323 causes the clamping plate 320 to clamp the memory bar 205. As the descending rack 313 continues to descend, the lower pressure plate 317 is driven to descend. When the lower pressure plate 317 contacts the ejection column 311, the ejection column 311 is driven to The ejection spring 312 is compressed, and the ejection column 311 pushes the memory card block 1072 to open the memory card block 1072. The memory card block 1072 releases the clamp on the memory stick 205, and the memory card block 1072 remains in the open state until the next memory stick 205 is put in. The electric cylinder 302 is then taken out and contracts, clamping the memory stick 205 through the clamping plate 320, driving the memory stick 205 to rise together, and the memory stick 205 leaves the memory slot 1071, thereby removing the tested memory stick 205 from the test motherboard 107. In the initial state, the discharge slope 307 will not block the rise of the lowering frame 313. As the removal electric cylinder 302 further contracts, the lowering frame 313 is driven to rise. When the lowering frame 313 contacts the discharge guide post 306, the rise of the lowering frame 313 will drive the discharge guide post 306 to rise, thereby driving the discharge rotating rod 304 to rotate, thereby driving the upper guide post 324, the discharge slope 307 and the guide post 308 to slide along the inclined slide groove 309, thereby driving the discharge slope 307 to reach the bottom of the pulled out memory stick 205. As the lowering frame 313 continues to rise, when the upper push post 314 contacts the top of the removal frame 301, the upper push spring 315 is compressed, and the conical block 316 moves toward the outer push plate 321. The arc surface 322 pushes the outer push plate 321 and the clamping plate 320 to slide outward along the clamping column 319, so that the clamping plate 320 no longer clamps the memory stick 205, and the memory stick 205 falls onto the discharge slope 307 and finally leaves along the discharge slope 307. Then, when the removal electric cylinder 302 is extended for the next time, the upper push spring 315 rebounds, and the upper push column 314 and the clamping plate 320 are reset. As the descending frame 313 descends, the discharge guide column 306 and the discharge rotating rod 304 are reset under the action of gravity, and the discharge slope 307 leaves the bottom of the descending frame 313 and will not block the movement of the descending frame 313. In this way, the memory stick 205 that has completed the test is automatically removed from the test mainboard 107 and placed on the discharge slope 307 to leave the device.

[0050] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope of the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A memory test server architecture, comprising a switching device, characterized in that: The switching device comprises a frame (101), the switching device is used to test the memory, an entry device is arranged on the switching device, the entry device comprises an upper plate (201), the upper plate (201) is fixedly mounted on the frame (101), the entry device is used to insert the memory stick into a test mainboard for testing, the entry device is provided with a removal device, the removal device comprises a removal rack (301), the removal rack (301) is fixedly mounted on the upper plate (201), and the removal device is used to remove the memory stick after the test is completed; The switching device comprises a track block (102) and a slide column (103) fixedly mounted on a frame (101); a bottom motor (109) is fixedly mounted below the frame (101); a rotating rod (108) is fixedly mounted on the motor shaft of the bottom motor (109); the rotating rod (108) is rotatably mounted on the frame (101); and a rotating rod slide groove (111) is provided on the rotating rod (108); The frame (101) is provided with two test mechanisms, the test mechanisms comprising a sliding frame (104) slidably mounted on a sliding column (103), an inner sliding column (105) slidably mounted on the sliding frame (104), a placement plate (113) fixedly mounted on the inner sliding column (105), an inner sliding spring (106) being provided between the inner sliding column (105) and the sliding frame (104), a test main board (107) fixedly mounted on the placement plate (113), and the test main board (107) being fixedly mounted on the placement plate (113). A memory slot (1071) is provided on the board (107), a memory card block (1072) is provided on the memory slot (1071), the test main board (107) is powered on to test the memory, a bottom slide column (110) is fixedly installed at the bottom of the slide frame (104), the bottom slide column (110) slides in the rotating rod slide groove (111), a fitting slide block (112) is fixedly installed at the bottom of the placement board (113), and the fitting slide block (112) slides along the track block (102); The entry device comprises an insertion rack (202) fixedly mounted on an upper plate (201), a fixed slide (203) fixedly mounted on the upper plate (201), a memory placement plate (204) slidably mounted on the fixed slide (203), a plurality of memory bars (205) inserted into the memory placement plate (204), a plurality of push plates (206) fixedly mounted on both sides of the memory placement plate (204), a material discharge groove (219) being arranged on the upper plate (201), and when the placement plate (113) and the test main board (107) move to below the insertion rack (202), the memory groove (1071) is located below the material discharge groove (219); The bottom motor (109) rotates to drive the rotating rod (108) to rotate, and drives the bottom sliding column (110) and the sliding frame (104) to slide along the sliding column (103) through the rotating rod sliding groove (111). During the sliding process of the sliding frame (104), the placement plate (113) is driven to slide along the track block (102). In the initial state, the inner sliding spring (106) is in a compressed state. When the placement plate (113) moves inward, the inner sliding spring (106) rebounds, and the inner sliding column (105) and the placement plate (113) slide along the sliding frame (104), so that the fitting slider (112) is always in close contact with the track block (102), thereby achieving Now, when the rotating rod (108) rotates, the two placement plates (113) move towards each other without colliding with each other, thereby realizing the position exchange of the two placement plates (113) and the test mainboard (107), and being able to remove the tested memory bar (205) from the test mainboard (107) through the removal device, and simultaneously putting the memory bar (205) to be tested into another test mainboard (107) through the entry device, and in the process of switching the position of the test mainboard (107), the memory bar (205) inserted therein is tested through the test mainboard (107), thereby realizing continuous testing of the memory bar (205).

2. A memory test server architecture according to claim 1, characterized in that: The insertion frame (202) is provided with a pushing mechanism, and the pushing mechanism comprises a sliding electric cylinder frame (207) slidably mounted on the insertion frame (202), an insertion electric cylinder (208) fixedly mounted on the sliding electric cylinder frame (207), an insertion clamping block (210) fixedly mounted on the top of the insertion electric cylinder (208), an insertion sliding column (209) fixedly mounted on the insertion clamping block (210), the insertion sliding column (209) and the sliding electric cylinder frame (207) are slidably mounted, a front push plate (211) and a sliding guide column (218) are fixedly mounted on the insertion clamping block (210), and a front push fillet (215) is provided at the bottom of the front push plate (211).

3. A memory test server architecture according to claim 2, characterized in that: The inserting clamp block (210) is provided with a clamping mechanism, the clamping mechanism comprising a clamping slide column (212) fixedly mounted on the inserting clamp block (210), two clamping plates (213) slidably mounted on the clamping slide column (212), a clamping spring (214) is provided between the clamping plate (213) and the inserting clamp block (210), and a clamping chamfer (216) is provided on the clamping plate (213).

4. A memory test server architecture according to claim 2, characterized in that: The side of the loading rack (202) is provided with a descending guide groove (217), and the descending guide groove (217) is provided with a lower arc surface (2171) and an upper arc surface (2172), and the sliding guide column (218) slides in the descending guide groove (217).

5. The memory test server architecture according to claim 1, characterized in that: The taking-out device comprises a taking-out electric cylinder (302) fixedly mounted on a taking-out frame (301), a descending frame (313) fixedly mounted on the top of the taking-out electric cylinder (302), a taking-out sliding column (303) fixedly mounted on the descending frame (313), the taking-out sliding column (303) and the taking-out frame (301) being slidably mounted, a discharging chute (305) being arranged on the side of the taking-out frame (301), a clamping seat (318) fixedly mounted on the descending frame (313), a clamping column (319) fixedly mounted on the clamping seat (318), and two clamping plates (319) being slidably mounted on the clamping column (319). 320, a chamfer is provided on the clamping plate (320), a sliding column spring (323) is provided between the clamping plate (320) and the clamping seat (318), an outward push plate (321) is fixedly installed on the clamping plate (320), an outward push arc surface (322) is provided on the outward push plate (321), an upper push column (314) is slidably installed on the descending frame (313), an upper push spring (315) is provided between the upper push column (314) and the descending frame (313), a conical block (316) is fixedly installed on the upper push column (314), and a lower pressure plate (317) is fixedly installed on the descending frame (313).

6. A memory test server architecture according to claim 5, characterized in that: Two ejection columns (311) are slidably mounted on the upper plate (201), an ejection spring (312) is arranged between the ejection column (311) and the upper plate (201), and an extraction slot (325) is arranged on the upper plate (201). When the test mainboard (107) moves to the bottom of the extraction rack (301), the ejection column (311) is located above the memory card block (1072), and the extraction slot (325) is located above the memory slot (1071).

7. The memory test server architecture according to claim 6, characterized in that: The take-out rack (301) is provided with a slide-out mechanism, and the slide-out mechanism comprises a discharging rack (310) fixedly mounted on the discharging rack (301); the discharging rack (310) is provided with an inclined slide groove (309); a guide column (308) and an upper guide column (324) are slidably mounted in the inclined slide groove (309); a discharging slope (307) is fixedly mounted on the guide column (308); the upper guide column (324) is fixedly mounted on the discharging slope (307); a discharging rotating rod (304) is rotatably mounted on the upper guide column (324); a discharging guide column (306) is fixedly mounted on the discharging rotating rod (304); the discharging guide column (306) can slide and rotate in the discharging slide groove (305); and an anti-static leather is provided on the surface of the discharging slope (307).

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