Temperature regulation method and packaged storage chip

Abstract

The present invention discloses a temperature regulation method and a packaged storage chip, the method comprising: arranging a temperature regulation module and a temperature sensor in a chip layer; arranging a heating device in a plastic sealing layer; when the monitored temperature of the temperature sensor is lower than a first preset value, the temperature regulation module issues a heating instruction to the heating device; the heating device heats the chip packaging module corresponding to the temperature sensor in response to receiving the heating instruction. In this application, when the monitored temperature of the temperature sensor is lower than the first preset value, the temperature regulation module issues a heating instruction to the heating device, and the heating device heats the chip packaging module corresponding to the temperature sensor in response to receiving the heating instruction. When the temperature of the chip packaging module corresponding to the temperature sensor is detected to be too low, the heating device heats the chip packaging module, so that the chip packaging module is raised to a normal operating temperature and then operates normally, so that the packaged storage chip can still operate normally when the ambient temperature is low.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to a temperature regulation method and a packaged storage chip. Background Art

[0002] With the rapid development of information technology, packaged memory chips are increasingly used in various electronic devices. The temperature of packaged memory chips has an important impact on their working state. If the temperature of packaged memory chips is not within the normal working temperature range, they often cannot work normally.

[0003] Therefore, a temperature regulation method for regulating the temperature of a packaged memory chip has emerged. When the temperature of a packaged memory chip is regulated by a current temperature regulation method, the packaged memory chip is generally cooled down when the temperature of the packaged memory chip is too high.

[0004] However, when the electronic device is in a cold storage or in a winter area, the temperature of the packaged memory chip may be too low, causing the packaged memory chip to fail to work properly. Summary of the invention

[0005] In view of the deficiencies in the prior art, the present application provides a temperature regulation method and a packaged storage chip. When the monitored temperature of the temperature sensor is lower than a first preset value, the temperature regulation module sends a heating instruction to the heating device. The heating device heats the chip packaging module corresponding to the temperature sensor in response to receiving the heating instruction. When it is detected that the temperature of the chip packaging module corresponding to the temperature sensor is too low, the chip packaging module can be heated by the heating device. The chip packaging module can be raised to the normal operating temperature and then operate normally, thereby allowing the packaged storage chip to still operate normally when the ambient temperature is low.

[0006] To solve the above problems, the present invention provides the following technical solutions:

[0007] In a first aspect, an embodiment of the present application provides a temperature regulation method, which is applied to a packaged memory chip, wherein the packaged memory chip comprises a base layer, a chip layer and a plastic sealing layer, wherein the base layer comprises a circuit network, wherein the chip layer is stacked and mounted on the base layer and is electrically connected to the circuit network, wherein the chip layer comprises at least one chip packaging module, and wherein the plastic sealing layer is stacked and arranged on the chip layer, wherein the method comprises:

[0008] A temperature regulating module and a temperature sensor are arranged on the chip layer, the temperature regulating module is electrically connected to the temperature sensor, the temperature sensor is used to monitor the temperature of the chip packaging module corresponding to the temperature sensor, and the temperature regulating module is used to regulate the temperature of the chip packaging module corresponding to the temperature sensor according to the monitored temperature of the temperature sensor;

[0009] A heating device is arranged on the plastic sealing layer, and the heating device is electrically connected to the temperature regulating module;

[0010] When the monitored temperature of the temperature sensor is lower than a first preset value, the temperature adjustment module sends a heating instruction to the heating device;

[0011] The heating device heats the chip packaging module corresponding to the temperature sensor in response to receiving the heating instruction.

[0012] In some embodiments, the plastic encapsulation layer includes an insulating layer, and the heating device is provided in the plastic encapsulation layer, including:

[0013] pre-embedding the heating device in the insulating layer;

[0014] The heating device is configured as a single-layer structure or a stacked-layer structure separated by the insulating layer.

[0015] In some embodiments, pre-embedding the heating device in the insulating layer includes:

[0016] In the insulating layer, the heating device is pre-buried in a region corresponding to the chip packaging module, and the heating device avoids a pin region corresponding to the chip packaging module.

[0017] In some embodiments, the heating device comprises a heating wire mesh.

[0018] In some embodiments, the heating wire mesh is a thermistor with a positive temperature coefficient, and when the temperature of the heating wire mesh increases, the resistance value of the heating wire mesh increases; or

[0019] The heating wire mesh is a thermistor with a negative temperature coefficient. When the temperature of the heating wire mesh increases, the resistance value of the heating wire mesh decreases.

[0020] In some embodiments, the heating wire mesh includes a first heating wire having a positive temperature coefficient and a second heating wire having a negative temperature coefficient, and the first heating wire and the second heating wire are intertwined to form the heating wire mesh;

[0021] When the monitored temperature of the temperature sensor is lower than the first preset value, the temperature adjustment module sends a heating instruction to the heating device, including:

[0022] When the monitored temperature of the temperature sensor is lower than the first preset value, the temperature regulating module sends a first heating instruction to the heating device, where the first heating instruction is used to control the heating device to energize the first heating wire.

[0023] In some embodiments, the method further comprises:

[0024] When the monitored temperature of the temperature sensor is lower than a second preset value, the temperature regulating module sends a second heating instruction to the heating device, wherein the second heating instruction is used to control the heating device to energize the second heating wire, wherein the second preset value is lower than the first preset value;

[0025] When the monitored temperature of the temperature sensor changes from lower than the second preset value to higher than the second preset value and lower than the first preset value, the temperature regulating module sends a third heating instruction to the heating device, and the third heating instruction is used to control the heating device to cut off the power of the second heating wire and keep the first heating wire powered on;

[0026] When the monitored temperature of the temperature sensor changes from lower than the first preset value to higher than the first preset value, the temperature adjustment module sends a stop heating instruction to the heating device, and the stop heating instruction is used to control the heating device to cut off power to the first heating wire.

[0027] In some embodiments, the heating device comprises a heating film.

[0028] In some embodiments, the method further comprises:

[0029] A heat dissipation device is arranged on the plastic packaging layer, and the heat dissipation device is connected to the heat dissipation pins of the chip packaging module.

[0030] In a second aspect, an embodiment of the present application provides a packaged memory chip, which is used to execute the temperature adjustment method as described in the first aspect, including:

[0031] A base layer, the base layer comprising a circuit network;

[0032] A chip layer, wherein the chip layer is stacked and mounted on the base layer and is electrically connected to the circuit network, wherein the chip layer comprises the at least one chip packaging module, the temperature adjustment module and the temperature sensor, and the temperature sensor is arranged inside the chip packaging module corresponding to the temperature sensor;

[0033] A plastic encapsulation layer is stacked on the chip layer, and the plastic encapsulation layer comprises an insulating layer and a heating device, wherein the heating device is pre-buried in the insulating layer.

[0034] The present application provides a temperature regulation method and a packaged storage chip. When the monitored temperature of the temperature sensor is lower than a first preset value, the temperature regulation module sends a heating instruction to the heating device, and the heating device heats the chip packaging module corresponding to the temperature sensor in response to receiving the heating instruction. When it is detected that the temperature of the chip packaging module corresponding to the temperature sensor is too low, the heating device can heat the chip packaging module, so that the chip packaging module can be raised to the normal operating temperature and then work normally, thereby enabling the packaged storage chip to still work normally when the ambient temperature is low. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] Figure 1 It is a schematic diagram of a partial cross-sectional structure of the first implementation mode of the packaged memory chip provided in an embodiment of the present application.

[0036] Figure 2 It is a schematic structural diagram of the first implementation mode of the packaged memory chip provided in the embodiment of the present application.

[0037] Figure 3 It is a flow chart of the first implementation mode of the temperature adjustment method provided in the examples of the present application.

[0038] Figure 4 It is a schematic diagram of a partial cross-sectional structure of a second implementation mode of a packaged memory chip provided in an embodiment of the present application.

[0039] Figure 5 It is a schematic diagram of the partial cross-sectional structure of the third implementation mode of the packaged memory chip provided in the embodiment of the present application.

[0040] Figure 6 yes Figure 3 Detailed flowchart of step S300 in FIG.

[0041] Figure 7 It is a flow chart of the second implementation mode of the temperature adjustment method provided in the examples of the present application. DETAILED DESCRIPTION

[0042] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0043] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0044] The present application provides a temperature regulation method and a packaged storage chip. When the monitored temperature of a temperature sensor is lower than a first preset value, a temperature regulation module sends a heating instruction to a heating device. In response to receiving the heating instruction, the heating device heats a chip packaging module corresponding to the temperature sensor. When it is detected that the temperature of the chip packaging module corresponding to the temperature sensor is too low, the heating device heats the chip packaging module, so that the chip packaging module can be raised to a normal operating temperature and then operate normally, thereby enabling the packaged storage chip to still operate normally when the ambient temperature is low.

[0045] The temperature adjustment method and packaged storage chip provided by the present application will be described in detail below with reference to the accompanying drawings.

[0046] See also Figure 1 and Figure 2 , Figure 1 is a schematic diagram of a partial cross-sectional structure of a first implementation mode of a packaged memory chip provided in an embodiment of the present application, Figure 2 1 is a schematic diagram of the structure of the first implementation mode of the packaged memory chip provided in the embodiment of the present application. Figure 1 As shown, in some embodiments, the packaged memory chip 1 includes a base layer 10, a chip layer 20 and a plastic packaging layer 30, and the base layer 10 includes a circuit network ( Figure 1 The substrate 10 is a plate-like structure for supporting and connecting electronic components, and the circuit network is used to electrically connect at least one chip packaging module 200 in the chip layer 20. The chip layer 20 is stacked and mounted on the substrate 10 and is electrically connected to the circuit network, and the plastic encapsulation layer 30 is stacked and arranged on the chip layer 20.

[0047] like Figure 2 As shown, optionally, the chip layer 20 includes at least one chip packaging module 200. The chip packaging module 200 refers to a module that packages a chip component in a specific housing so that the chip component is connected and fixed with other electronic components.

[0048] In some embodiments, the chip packaging module 200 includes a chip component, a circuit connecting contacts on the chip component, and a plurality of pins 201 electrically connected to the circuit.

[0049] In some embodiments, the chip packaging module 200 includes a plurality of chip components, a circuit connecting contacts on the plurality of chip components, and a plurality of pins 201 electrically connected to the circuit. In this way, compared with a chip packaging module including one chip component, a chip packaging module including a plurality of chip components can have a larger storage space; when the plurality of chip components have different uses, the chip packaging module can perform more complex functions.

[0050] In some embodiments, the number of the chip packaging modules 200 may be at least one, for example, the number of the chip packaging modules 200 may be one, two, three, four, five, ten, etc.

[0051] like Figure 2 As shown, optionally, at least one chip packaging module 200 may include a control chip packaging module 210 , a cache chip packaging module 220 and a flash memory chip packaging module 230 .

[0052] However, this application is not limited to Figure 2 In the illustrated embodiment, in some embodiments, the packaged storage chip 1 may include other electronic components, such as resistors, capacitors, inductors, diodes, transistors, or various sensor components.

[0053] In some embodiments, the packaged storage chip 1 may be an SSD (Solid State Disk), wherein the chip layer 20 may include a control chip packaging module 210 , a cache chip packaging module 220 , and a flash memory chip packaging module 230 .

[0054] In some embodiments, the control chip packaging module 210 is used to manage data and instructions in the packaged storage chip, the cache chip packaging module 220 is used to temporarily store frequently accessed data and instructions, and the flash chip packaging module 230 is used to store data.

[0055] In some embodiments, the control chip packaging module 210 can be electrically connected to the cache chip packaging module 220 and the flash memory chip packaging module 230 respectively, storing the received data that needs to be accessed quickly into the cache chip packaging module 220, and storing the data that is not frequently accessed into the flash memory chip packaging module 230.

[0056] In some embodiments, the cache chip packaging module 220 is electrically connected to the flash chip packaging module 230 , and the cache chip packaging module 220 can store infrequently accessed data into the flash chip packaging module 230 .

[0057] However, the present application is not limited thereto. In some embodiments, the chip layer 20 may also include other types of chip packaging modules 200 , such as a quantum computing chip packaging module.

[0058] In some embodiments, the plastic encapsulation layer 30 is used to encapsulate the chip layer 20 to provide physical protection for the chip layer 20 .

[0059] Optionally, the plastic layer 30 can be used to solve the problems caused by the exposure of the chip layer 20, such as easy damage and easy contamination of the connection, so as to ensure the reliability and stability of the packaged storage chip 1 and extend its service life.

[0060] Optionally, the plastic packaging layer 30 may also fix at least one chip packaging module 200 in the chip layer 20 .

[0061] Optionally, the plastic packaging layer 30 provides electrical insulation for the chip layer 20 , thereby preventing the chip layer 20 from directly contacting external conductive materials and reducing the risk of short circuit.

[0062] Optionally, the plastic packaging layer 30 provides the chip layer 20 with an anti-electromagnetic interference function, which can reduce the interference of the external electromagnetic environment on the chip layer 20 .

[0063] Optionally, the plastic packaging layer 30 may include a thermosetting plastic material, such as epoxy resin.

[0064] In some embodiments, the packaged memory chip 1 is used to execute the temperature adjustment method described below, which is applied to the packaged memory chip 1 provided in the embodiments of the present application.

[0065] See also Figure 3 , Figure 3 1 is a flow chart of the first embodiment of the temperature adjustment method provided in the present application. Figure 3 As shown, the temperature adjustment method includes: step S100 to step S400.

[0066] Step S100: Setting a temperature adjustment module and a temperature sensor on the chip layer.

[0067] like Figure 2 As shown, in some embodiments, the chip layer 20 further includes a temperature regulating module 240 and a temperature sensor 250 , and the temperature regulating module 240 is electrically connected to the temperature sensor 250 .

[0068] In some embodiments, the temperature sensor is used to monitor the temperature of the chip packaging module corresponding to the temperature sensor, and the temperature adjustment module is used to adjust the temperature of the chip packaging module corresponding to the temperature sensor according to the monitored temperature of the temperature sensor.

[0069] In some embodiments, the temperature adjustment module 240 is disposed inside the chip packaging module 200 corresponding to the temperature sensor. Figure 2As shown, in some embodiments, the temperature regulating module 240 is disposed inside the control chip packaging module 210 corresponding to the temperature sensor. In this way, the temperature regulating module is integrated inside the chip packaging module, and there is no need to set a temperature regulating module on the chip layer and electrically connect it to the corresponding chip packaging module, which can facilitate the processing and packaging of the storage chip 1.

[0070] In some embodiments, the temperature sensor is disposed inside a chip packaging module corresponding to the temperature sensor. Figure 2 As shown, in some embodiments, the temperature sensor 250 is disposed inside the control chip packaging module 210 corresponding to the temperature sensor 250. In this way, the accuracy of the temperature monitored by the temperature sensor can be improved.

[0071] Step S200: a heating device is provided on the plastic sealing layer.

[0072] Optionally, the heating device is used to heat a chip packaging module corresponding to the temperature sensor.

[0073] In some embodiments, the heating device is electrically connected to the temperature adjustment module. In this way, the temperature adjustment module can control the heating device to heat the chip packaging module corresponding to the temperature sensor according to the monitored temperature of the temperature sensor, thereby adjusting the temperature of the corresponding chip packaging module.

[0074] like Figure 1 As shown, optionally, the heating device 320 is electrically connected to the circuit network of the base layer 10, and thus electrically connected to the temperature adjustment module through the circuit network.

[0075] In some embodiments, each chip packaging module has a corresponding temperature sensor, a temperature adjustment module and a heating device. In this way, each chip packaging module can be temperature-adjusted individually.

[0076] like Figure 1 As shown, in some embodiments, the molding layer 30 includes an insulating layer 310 and a heating device 320 .

[0077] like Figure 1 As shown, optionally, a heating device 320 is pre-buried in the insulating layer 310 .

[0078] In some embodiments, step S200 includes: pre-embedding a heating device in the insulating layer.

[0079] As described above, the plastic encapsulation layer 30 may include a thermosetting plastic material. Optionally, the insulating layer may be a thermosetting plastic material. In this way, it is convenient to embed the heating device in the insulating layer when the insulating layer is not completely cured during processing.

[0080] By pre-embedding the heating device in the insulating layer as mentioned above, firstly, it is possible to avoid uneven heating or excessive temperature of the chip packaging module caused by direct contact between the heating device and the chip packaging module; secondly, the insulating layer can provide physical protection for the chip layer and the heating device at the same time, thereby ensuring the reliability and stability of the packaged storage chip.

[0081] In some embodiments, the heating device is laminated on the insulating layer.

[0082] Optionally, the heating device is bonded onto the insulating layer.

[0083] By stacking the heating device on the insulating layer, firstly, it is easy to process the insulating layer; secondly, it is easy to modify other packaged storage chips in this way to add a heating function.

[0084] like Figure 1 As shown, in some embodiments, in the insulating layer 310 , a heating device 320 is pre-buried in a region 330 corresponding to the chip packaging module.

[0085] like Figure 1 As shown, optionally, the region 330 corresponding to the chip packaging module refers to a region in the insulating layer 310 that vertically corresponds to a region of the chip packaging module 200 on the base layer 10 .

[0086] like Figure 1 As shown, in some embodiments, the heating device 320 avoids the pin area 340 corresponding to the chip packaging module 200 .

[0087] like Figure 1 As shown, optionally, the pin region 340 corresponding to the chip packaging module 200 refers to a region in the insulating layer 310 that vertically corresponds to the pin region of the chip packaging module 200 on the base layer 10 .

[0088] The pins of the chip packaging module are usually made of metal materials with good thermal conductivity, so they are sensitive to temperature and easily damaged. Through the above method, the heating device will not be too close to the pin area. During the heating process, the pins and the circuit network connected to the pins can be prevented from being damaged due to excessive temperature, thereby enabling the chip packaging module to work normally.

[0089] In some embodiments, when the chip packaging module includes at least one chip element, at least one heating device is pre-buried in an area in the insulating layer corresponding to at least one chip element in the chip packaging module. In this way, only the chip element in the chip packaging module can be heated, thereby preventing other temperature-sensitive elements in the chip packaging module from being damaged due to overheating, and saving energy.

[0090] In some embodiments, the heating device is provided as a single-layer structure or a stacked-layer structure separated by insulating layers.

[0091] like Figure 1 As shown, optionally, the heating device 320 is configured as a single-layer structure.

[0092] See also Figure 4 , Figure 4 FIG. 2 is a schematic diagram of a partial cross-sectional structure of a second embodiment of a packaged memory chip provided in an embodiment of the present application. Figure 4 As shown, optionally, the heating device 320 is provided as a stacked structure separated by an insulating layer 310 .

[0093] like Figure 4 As shown, optionally, the insulating layer 310 includes three layers of heating devices 320 .

[0094] like Figure 4 As shown, optionally, the heating device 320 closest to the base layer 10 is electrically connected to the circuit network of the base layer 10 , and adjacent heating devices 320 are electrically connected to each other.

[0095] By adopting the above-mentioned method, compared with the method of setting the heating device as a single-layer structure, the heating speed can be increased, so that the chip packaging module can be restored to a normal working state as soon as possible when the temperature is too low.

[0096] See also Figure 5 , Figure 5 FIG. 2 is a schematic diagram of a partial cross-sectional structure of a third embodiment of a packaged memory chip provided in an embodiment of the present application. Figure 5 As shown, in some embodiments, the heating device 320 includes a heating film 322 .

[0097] Optionally, the heating film 322 may be a carbon fiber film, a stainless steel film, a titanium film or the like.

[0098] Please return to Figure 1 ,like Figure 1 As shown, in some embodiments, the heating device 320 includes a heating wire mesh 321. The heating wire mesh 321 refers to a mesh formed by winding heating wires. In this way, the heating wire mesh can maintain a certain heat dissipation area while heating, and can prevent the temperature of the heating device from rising too fast during the heating process, so that it is convenient for the temperature adjustment module to control the heating device.

[0099] Optionally, the diameter of the heating wire is 0.01 mm (millimeter) to 0.05 mm. For example, the diameter of the heating wire may be 0.01 mm, 0.02 mm, 0.03 mm, 0.04 mm or 0.05 mm.

[0100] In some embodiments, the heating wire mesh is a thermistor with a positive temperature coefficient, and when the temperature of the heating wire mesh increases, the resistance value of the heating wire mesh increases.

[0101] In some embodiments, the calculation formula of the heating power of the heating screen may be:

[0102] P=U 2 / R,

[0103] Among them, P represents the heating power of the heating wire mesh, U represents the voltage across the heating wire mesh, and R represents the resistance of the heating wire mesh.

[0104] Optionally, during the heating process, the voltage across the heating device is kept constant.

[0105] In this way, when the temperature of the heating wire mesh increases and the resistance value of the heating wire mesh increases, the heating power will decrease. Therefore, when the temperature of the heating wire mesh is low, the heating power is high and the heating is faster, which makes it easier for the chip packaging module to heat up quickly when the temperature is low; when the temperature of the heating wire mesh is high, the heating power is low and the heating is slower, which can prevent the chip packaging module from being damaged due to excessive temperature.

[0106] In some embodiments, the heating wire mesh is a thermistor with a negative temperature coefficient, and when the temperature of the heating wire mesh increases, the resistance value of the heating wire mesh decreases.

[0107] In this way, when the temperature of the heating wire mesh increases and the resistance value of the heating wire mesh decreases, the heating power will increase. Therefore, during the heating process, the higher the temperature of the heating wire mesh, the higher the heating power and the faster the heating, which makes it easier for the chip packaging module to quickly heat up to the normal operating temperature when the temperature is extremely low, so that it can quickly return to the normal working state.

[0108] In some embodiments, the heating wire mesh includes a first heating wire with a positive temperature coefficient and a second heating wire with a negative temperature coefficient, and the first heating wire and the second heating wire are intertwined to form the heating wire mesh.

[0109] Step S300: When the monitored temperature of the temperature sensor is lower than a first preset value, the temperature adjustment module sends a heating instruction to the heating device.

[0110] See also Figure 6 , Figure 6 yes Figure 3 Detailed flow chart of step S300 in FIG. Figure 6 As shown, step S300 includes steps S310 to S340.

[0111] Step S310: When the monitored temperature of the temperature sensor is lower than a first preset value, the temperature regulating module sends a first heating instruction to the heating device, and the first heating instruction is used to control the heating device to energize the first heating wire.

[0112] In some implementations, the first preset value is determined by a lowest operating temperature or an optimal operating temperature in a normal operating temperature range of the chip packaging module.

[0113] In some implementations, the first preset value is set according to the lowest operating temperature in a normal operating temperature range of the chip packaging module.

[0114] In some embodiments, the industrial-grade normal operating temperature range of the chip packaging module is -45 degrees to 85 degrees.

[0115] In some embodiments, the normal operating temperature range of the chip packaging module is from -55 degrees to 125 degrees.

[0116] Optionally, the first preset value may be a minimum operating temperature, such as -45 degrees or -55 degrees.

[0117] In some embodiments, when the temperature of the chip packaging module is slightly lower than the minimum operating temperature, the chip packaging module can still work, so the first preset value can be lower than the minimum operating temperature. For example, when the minimum operating temperature is -45 degrees, the first preset value can be -50 degrees, -60 degrees or -70 degrees.

[0118] In some embodiments, although the temperature of the chip packaging module is higher than the minimum operating temperature, since the temperature is not yet the optimal operating temperature, the working efficiency of the chip packaging module is not high, so the first preset value may be higher than the minimum operating temperature.

[0119] Optionally, the first preset value may be -20 degrees, -15 degrees, -10 degrees, 0 degrees, 5 degrees or 10 degrees, etc.

[0120] In some embodiments, when the monitored temperature of the temperature sensor is lower than a first preset value and higher than a second preset value, the temperature regulating module controls the second heating wire of the heating device to not be energized, wherein the second preset value is lower than the first preset value. In this way, energy can be saved when heating the chip packaging module when the temperature is not extremely low.

[0121] By energizing the first heating wire with a positive temperature coefficient when the monitored temperature is lower than the first preset value, the chip packaging module can be heated when the monitored temperature is lower than the first preset value. When the temperature of the first heating wire is low, the heating power is high and the heating is fast, which facilitates the chip packaging module to heat up quickly when the temperature is low; when the temperature of the first heating wire is high, the heating power is low and the heating is slow, which can prevent the chip packaging module from being damaged due to excessively high temperature.

[0122] Step S320: When the monitored temperature of the temperature sensor is lower than the second preset value, the temperature regulating module sends a second heating instruction to the heating device, and the second heating instruction is used to control the heating device to energize the second heating wire.

[0123] The second preset value is lower than the first preset value.

[0124] In some implementations, the first preset value and the second preset value are set according to a lowest operating temperature in a normal operating range of the chip packaging module.

[0125] Optionally, when the first preset value is -45 degrees, the second preset value may be -50 degrees.

[0126] In some embodiments, when the monitored temperature of the temperature sensor is lower than the second preset value, since the second preset value is lower than the first preset value, the monitored temperature of the temperature sensor is also lower than the first preset value, and the temperature adjustment module controls the first heating wire and the second heating wire of the heating device to be energized at the same time.

[0127] By energizing the second heating wire with a negative temperature coefficient when the monitored temperature is lower than the second preset value, the chip packaging module can be heated when the monitored temperature is lower than the second preset value. During the heating process, the higher the temperature of the second heating wire, the higher the heating power and the faster the heating, which makes it easier for the chip packaging module to quickly heat up to the normal operating temperature when the temperature is extremely low, so that it can quickly return to the normal operating state.

[0128] Step S330: When the monitored temperature of the temperature sensor changes from lower than the second preset value to higher than the second preset value and lower than the first preset value, the temperature adjustment module sends a third heating instruction to the heating device, and the third heating instruction is used to control the heating device to cut off the power to the second heating wire and keep the first heating wire powered on.

[0129] Since the higher the temperature of the first heating wire, the lower the heating power, and the slower the heating; the higher the temperature of the second heating wire, the higher the heating power, and the faster the heating, through the above method, during the heating process, when the monitored temperature changes from lower than the second preset value to higher than the second preset value and lower than the first preset value, the heating power can be reduced, and in the subsequent heating process, the heating power decreases with the increase of temperature, which can avoid damage to the chip packaging module due to excessive temperature.

[0130] Step S340: When the monitored temperature of the temperature sensor changes from lower than the first preset value to higher than the first preset value, the temperature regulating module sends a stop heating instruction to the heating device, and the stop heating instruction is used to control the heating device to cut off the power to the first heating wire.

[0131] In some embodiments, although the monitored temperature is higher than the first preset value, the temperature at this time is not the optimal working temperature, and the working efficiency of the chip packaging module is not high, so the chip packaging module needs to be heated to a temperature of a fourth preset value before stopping the heating. The fourth preset value is higher than the first preset value. For example, when the first preset value is -45 degrees, the fourth preset value can be 0 degrees.

[0132] In some embodiments, when the monitored temperature of the temperature sensor changes from being lower than a fourth preset value to being higher than a fourth preset value, the temperature adjustment module sends a stop heating instruction to the heating device.

[0133] By means of the above method, the heating can be automatically stopped when the chip packaging module is heated to a suitable temperature, thereby preventing the chip packaging module from being damaged due to over-high temperature.

[0134] In some embodiments, the temperature regulating module sends a periodic heating instruction to the heating device, and the periodic heating instruction is used to control the heating device to periodically power on and off, so as to periodically heat the chip packaging module.

[0135] In this way, the heating device does not need to be kept powered on for heating all the time, which can save energy consumption. At the same time, the chip packaging module can be heated up slowly to avoid overheating the chip packaging module to make it too high.

[0136] Please return to Figure 1 , step S400: the heating device heats the chip packaging module corresponding to the temperature sensor in response to receiving the heating instruction.

[0137] Optionally, the heating instruction includes a first heating instruction, a second heating instruction and a third heating instruction, and the heating device controls the first heating wire and the second heating wire in the heating wire mesh to turn on or off power according to the received instructions in response to receiving the first heating instruction, the second heating instruction or the third heating instruction.

[0138] In some embodiments, the heating device periodically heats the chip packaging module in response to receiving a periodic heating instruction.

[0139] Optionally, the heating device is powered on and off periodically according to the conversion cycle of the high level and the low level of the input terminal signal of the heating device, so as to periodically heat the chip packaging module.

[0140] Optionally, the heating device stops heating the chip packaging module corresponding to the temperature sensor in response to receiving a stop heating instruction.

[0141] In some embodiments, the heating device includes an overheat protection device, and when the temperature of the heating device is higher than a fifth preset value, the overheat protection device controls the heating device to cut off power.

[0142] Optionally, the overheat protection device comprises a thermal fuse, which melts when the temperature is higher than a fifth preset value, thereby cutting off the electrical connection between the heating device and the circuit network.

[0143] Optionally, the fifth preset value is higher than the fourth preset value, for example, the fifth preset value may be 30 degrees.

[0144] By adopting the above method, it is possible to prevent the chip packaging module from being damaged due to over-high temperature.

[0145] In some implementations, during operation, the temperature of the chip packaging module may be too high, and the chip packaging module needs to be cooled down.

[0146] like Figure 1 As shown, in some embodiments, a heat sink 350 is provided on the plastic packaging layer 30 , and the heat sink 350 is connected to the heat dissipation pins of the chip packaging module 200 . Figure 1 The middle pin 201 is a heat dissipation pin.

[0147] like Figure 1 As shown, optionally, in the insulating layer 310 , a heat dissipation device 350 is pre-buried in a region 330 corresponding to the chip packaging module.

[0148] Optionally, each chip packaging module has a corresponding heat dissipation device.

[0149] Because the heat dissipation pins of the chip packaging module are usually made of metal, through the above method, the heat of the chip packaging module can be quickly conducted to the heat dissipation device through the heat dissipation pins. The heat dissipation device has a large heat dissipation area, which can increase the heat dissipation speed of the chip packaging module, thereby cooling the chip packaging module.

[0150] Optionally, the heat dissipation device does not avoid the pin area corresponding to the chip packaging module.

[0151] In this way, the heat dissipation device has a larger heat dissipation area and can dissipate the heat conducted by the pins through the insulating layer, which can further improve the heat dissipation speed of the chip packaging module.

[0152] In some embodiments, the heat dissipation device is connected to a heat dissipation pin of at least one chip element in the chip packaging module.

[0153] Optionally, each chip element in the chip packaging module has a corresponding heat dissipation device.

[0154] Optionally, in the insulating layer, a heat sink is pre-buried in a region corresponding to the chip element in the chip packaging module.

[0155] Optionally, the heat dissipation device does not avoid pin regions corresponding to chip components in the chip packaging module.

[0156] In this way, the heat dissipation device has a larger heat dissipation area and can conduct the heat dissipated by the pins through the insulating layer, which can further improve the heat dissipation speed of the chip components in the chip packaging module.

[0157] In some embodiments, in the insulating layer, the relative positions of the heating device and the heat dissipation device are not limited.

[0158] Optionally, the heating device is closer to the chip packaging module than the heat dissipation device. In this way, it is convenient to heat the chip packaging module by the heating device.

[0159] Optionally, the heat sink is closer to the chip packaging module than the heating device. In this way, the chip packaging module can be cooled by the heat sink.

[0160] Optionally, the heat dissipation device includes a heat dissipation wire mesh.

[0161] Optionally, the heat dissipation device includes a heat dissipation film.

[0162] Optionally, the material of the heat dissipation wire mesh or the heat dissipation film is a material with good thermal conductivity, such as copper, graphene, carbon nanotubes or metal oxides.

[0163] In some embodiments, the temperature adjustment method further includes adjusting a working state of a chip packaging module corresponding to the temperature sensor by the temperature adjustment module to cool the chip packaging module.

[0164] See also Figure 7 , Figure 7 2 is a flow chart of the second embodiment of the temperature adjustment method provided in the present application. Figure 7 As shown, the temperature adjustment method includes: step S100 to step S500.

[0165] Step S100: Setting a temperature adjustment module and a temperature sensor on the chip layer.

[0166] Step S200: a heating device is provided on the plastic sealing layer.

[0167] Step S300: When the monitored temperature of the temperature sensor is lower than a first preset value, the temperature adjustment module sends a heating instruction to the heating device.

[0168] Step S400: the heating device heats the chip packaging module corresponding to the temperature sensor in response to receiving the heating instruction.

[0169] Steps S100 to S400 refer to the above description.

[0170] Step S500: When the monitored temperature of the temperature sensor is higher than a third preset value, the temperature adjustment module controls the chip packaging module corresponding to the temperature sensor to reduce the reading and writing speed or stop writing data.

[0171] Optionally, the third preset value may be higher than 60 degrees, for example, the third preset value may be 60 degrees, 70 degrees, 80 degrees, 90 degrees or 100 degrees.

[0172] In some embodiments, when the monitored temperature of the temperature sensor is higher than a third preset value and lower than a sixth preset value, the temperature adjustment module controls the chip packaging module corresponding to the temperature sensor to reduce the read and write speed, wherein the sixth preset value is higher than the third preset value. For example, when the third preset value is 60 degrees, the sixth preset value may be 90 degrees.

[0173] Optionally, if the original read / write speed is 500 Mbps, the reduced read / write speed may be 300 Mbps or 200 Mbps, etc.

[0174] In some embodiments, when the monitored temperature of the temperature sensor is higher than a sixth preset value, the temperature adjustment module controls the chip packaging module corresponding to the temperature sensor to stop writing data.

[0175] Through the above manner, when the chip packaging module is overheated, the temperature of the chip packaging module can be reduced to ensure the normal operation of the chip packaging module.

[0176] In summary, the temperature adjustment method provided in the embodiment of the present application has the following advantages:

[0177] 1. When the monitored temperature of the temperature sensor is lower than a first preset value, the temperature regulating module sends a heating instruction to the heating device, and the heating device heats the chip packaging module corresponding to the temperature sensor in response to receiving the heating instruction. When it is detected that the temperature of the chip packaging module corresponding to the temperature sensor is too low, the chip packaging module can be heated by the heating device, so that the chip packaging module can be raised to the normal operating temperature and then work normally, so that the packaged storage chip can still work normally when the ambient temperature is low.

[0178] 2. By pre-embedding the heating device in the insulating layer, firstly, it can avoid uneven heating or excessive temperature of the chip packaging module due to direct contact between the heating device and the chip packaging module; secondly, the insulating layer can provide physical protection for the chip layer and the heating device at the same time, thereby ensuring the reliability and stability of the packaged storage chip.

[0179] 3. By avoiding the pin area corresponding to the chip packaging module, the heating device will not be too close to the pin area. During the heating process, the pins and the circuit network connected to the pins can be prevented from being damaged due to excessive temperature, thereby enabling the chip packaging module to work normally.

[0180] 4. By including a heating screen in the heating device, the heating screen can maintain a certain heat dissipation area while heating, and can prevent the temperature of the heating device from rising too quickly during the heating process, thereby facilitating the temperature adjustment module to control the heating device.

[0181] 5. By energizing the first heating wire with a positive temperature coefficient when the monitored temperature is lower than the first preset value, the chip packaging module can be heated when the monitored temperature is lower than the first preset value. When the temperature of the first heating wire is lower, the heating power is higher and the heating is faster, which facilitates the chip packaging module to heat up quickly when the temperature is lower; when the temperature of the first heating wire is higher, the heating power is lower and the heating is slower, which can prevent the chip packaging module from being damaged due to excessively high temperature.

[0182] 6. By energizing the second heating wire with a negative temperature coefficient when the monitored temperature is lower than the second preset value, the chip packaging module can be heated when the monitored temperature is lower than the second preset value. During the heating process, the higher the temperature of the second heating wire, the higher the heating power and the faster the heating, which makes it easier for the chip packaging module to quickly heat up to the normal operating temperature when the temperature is extremely low, so that it can quickly return to the normal working state.

[0183] 7. By arranging a heat dissipation device in the plastic packaging layer and connecting the heat dissipation device to the heat dissipation pins of the chip packaging module, the heat of the chip packaging module can be quickly conducted to the heat dissipation device through the heat dissipation pins. The heat dissipation area of ​​the heat dissipation device is large, which can increase the heat dissipation speed of the chip packaging module, thereby cooling the chip packaging module.

[0184] In summary, the present application provides a temperature regulation method and a packaged storage chip. When the monitored temperature of the temperature sensor is lower than a first preset value, the temperature regulation module sends a heating instruction to the heating device. The heating device heats the chip packaging module corresponding to the temperature sensor in response to receiving the heating instruction. When it is detected that the temperature of the chip packaging module corresponding to the temperature sensor is too low, the chip packaging module can be heated by the heating device. The chip packaging module can be raised to the normal operating temperature and then operate normally, so that the packaged storage chip can still operate normally when the ambient temperature is low.

[0185] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A temperature regulation method, applied to packaging memory chips, characterized in that: The packaged storage chip comprises a base layer, a chip layer and a plastic sealing layer, the base layer comprises a circuit network, the chip layer is stacked and installed on the base layer and is electrically connected to the circuit network, the chip layer comprises at least one chip packaging module, and the plastic sealing layer is stacked and arranged on the chip layer, and the method comprises: A temperature regulating module and a temperature sensor are arranged on the chip layer, the temperature regulating module is electrically connected to the temperature sensor, the temperature sensor is used to monitor the temperature of the chip packaging module corresponding to the temperature sensor, and the temperature regulating module is used to regulate the temperature of the chip packaging module corresponding to the temperature sensor according to the monitored temperature of the temperature sensor; A heating device is arranged on the plastic sealing layer, and the heating device is electrically connected to the temperature regulating module; The plastic sealing layer includes an insulating layer, and the heating device is arranged in the plastic sealing layer, including: In the insulating layer, the heating device is pre-buried in an area corresponding to the chip packaging module, and the heating device avoids a pin area corresponding to the chip packaging module; The heating device is configured as a single-layer structure or a stacked structure separated by the insulating layer; When the monitored temperature of the temperature sensor is lower than a first preset value, the temperature adjustment module sends a heating instruction to the heating device; The heating device comprises a heating wire mesh, wherein the heating wire mesh comprises a first heating wire having a positive temperature coefficient and a second heating wire having a negative temperature coefficient, wherein the first heating wire and the second heating wire are mutually wound to form the heating wire mesh; When the monitored temperature of the temperature sensor is lower than the first preset value, the temperature adjustment module sends a heating instruction to the heating device, including: When the monitored temperature of the temperature sensor is lower than the first preset value, the temperature regulating module sends a first heating instruction to the heating device, where the first heating instruction is used to control the heating device to energize the first heating wire; When the monitored temperature of the temperature sensor is lower than a second preset value, the temperature regulating module sends a second heating instruction to the heating device, wherein the second heating instruction is used to control the heating device to energize the second heating wire, wherein the second preset value is lower than the first preset value; When the monitored temperature of the temperature sensor changes from lower than the second preset value to higher than the second preset value and lower than the first preset value, the temperature regulating module sends a third heating instruction to the heating device, and the third heating instruction is used to control the heating device to cut off the power of the second heating wire and keep the first heating wire powered on; When the monitored temperature of the temperature sensor changes from lower than the first preset value to higher than the first preset value, the temperature adjustment module sends a stop heating instruction to the heating device, and the stop heating instruction is used to control the heating device to cut off the power to the first heating wire; The heating device heats the chip packaging module corresponding to the temperature sensor in response to receiving the heating instruction.

2. The temperature adjustment method according to claim 1, characterized in that: The heating wire mesh is a thermistor with a positive temperature coefficient, and when the temperature of the heating wire mesh increases, the resistance value of the heating wire mesh increases; or The heating wire mesh is a thermistor with a negative temperature coefficient. When the temperature of the heating wire mesh increases, the resistance value of the heating wire mesh decreases.

3. The temperature adjustment method according to claim 1, characterized in that: The heating device comprises a heating film.

4. The temperature adjustment method according to claim 1, characterized in that: The method further comprises: A heat dissipation device is arranged on the plastic packaging layer, and the heat dissipation device is connected to the heat dissipation pins of the chip packaging module.

5. A packaged memory chip, used to execute the temperature adjustment method according to any one of claims 1 to 4, characterized in that: include: A base layer, the base layer comprising a circuit network; A chip layer, wherein the chip layer is stacked and mounted on the base layer and is electrically connected to the circuit network, wherein the chip layer comprises the at least one chip packaging module, the temperature adjustment module and the temperature sensor, and the temperature sensor is arranged inside the chip packaging module corresponding to the temperature sensor; A plastic encapsulation layer, the plastic encapsulation layer is stacked on the chip layer, the plastic encapsulation layer includes an insulating layer and a heating device, the heating device is pre-buried in the insulating layer, the heating device is pre-buried in an area corresponding to the chip packaging module, and the heating device avoids a pin area corresponding to the chip packaging module; The heating device is a single-layer structure or a laminated structure separated by the insulating layer; The heating device comprises a heating wire mesh, wherein the heating wire mesh comprises a first heating wire having a positive temperature coefficient and a second heating wire having a negative temperature coefficient, wherein the first heating wire and the second heating wire are mutually wound to form the heating wire mesh; The heating instructions include a first heating instruction, a second heating instruction and a third heating instruction. The heating device controls the first heating wire and the second heating wire in the heating wire mesh to turn on or off power according to the received instructions in response to receiving the first heating instruction, the second heating instruction or the third heating instruction.

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