Laser cutting control method, device and storage medium

Abstract

The present invention relates to the field of laser cutting technology, and discloses a laser cutting control method, device and storage medium. The method comprises: obtaining the fitting information of the cutting image collected by the machine vision module; inputting the fitting information into the pre-trained contour matching model to obtain the cutting contour information on the plastic film and the hole contour information on the circuit board; calibrating the cutting contour information and the hole contour information to obtain the cutting position information on the plastic film and the hole position information on the circuit board; comparing the cutting position information with the hole position information to obtain the difference information between the cutting position information and the hole position information; generating a control instruction according to the difference information, and adjusting the laser cutting parameters according to the control instruction. The method can timely adjust the laser cutting parameters according to the tolerance data after the plastic film and the circuit board are fitted, realize automatic control, and improve production efficiency.

Description

Technical Field

[0001] The present invention relates to the field of laser cutting technology, and in particular to a laser cutting control method, device and storage medium. Background Art

[0002] At present, laser cutting technology is an advanced manufacturing process that uses high-power laser beams to cut materials non-contact. It is widely used in the precision processing of various materials such as metals, plastics, wood, glass, etc. It plays an important role in aerospace, automobile manufacturing, electronics industry, medical equipment and other fields with its advantages of fast cutting speed, high precision, small heat-affected area, and ability to process complex shapes. Laser cutting technology achieves fine processing of materials by precisely controlling the path of the laser beam, which has promoted the development of the manufacturing industry towards higher efficiency and higher quality.

[0003] In a laser cutting and bonding machine technology, in order to protect the circuit board and ensure the correct installation of electronic components, a layer of plastic film needs to be attached to the FPC. After the flexible circuit board is completed, a layer of plastic film needs to be attached before entering the next PCBA patch process. There are holes on the circuit board, and the work of the equipment is divided into two processes: first, the plastic film is punched with a laser, and then the punched plastic film is automatically bonded to the circuit board.

[0004] During the bonding process, due to changes in external temperature, tolerances in hole diameters and hole spacing on the same batch of circuit boards, it is necessary to manually check that the holes on the plastic film are precisely aligned with the holes on the circuit board, and then adjust the laser cutting parameters, resulting in low control efficiency, easy production of defective products, and time-consuming and labor-intensive. Summary of the invention

[0005] The present invention provides a laser cutting control method, device and storage medium, so as to timely adjust the laser cutting parameters according to the tolerance data after the plastic film and the circuit board are bonded in real time, realize automatic control and improve production efficiency.

[0006] In a first aspect, in order to solve the above technical problems, the present invention provides a laser cutting control method, comprising:

[0007] Obtaining the fitting information of the cutting image collected by the machine vision module;

[0008] The fitting information is input into a pre-trained contour matching model to obtain cutting contour information on the plastic film and hole contour information on the circuit board;

[0009] Calibrate the cutting contour information and the hole contour information to obtain the cutting position information on the plastic film and the hole position information on the circuit board;

[0010] Comparing the cutting position information with the hole position information to obtain difference information between the cutting position information and the hole position information;

[0011] A control instruction is generated according to the difference information, and laser cutting parameters are adjusted according to the control instruction.

[0012] As an optional implementation manner, the obtaining of the fitting information of the cutting image collected by the machine vision module includes:

[0013] Converting the pre-prepared circuit board bonding image acquired by the machine vision module into an electrical signal;

[0014] Convert the electrical signal from digital quantity to analog quantity through ADC to obtain digital information, and mark the digital information as the fitting information of the cutting image;

[0015] Wherein, the digital information is represented by binary digital information.

[0016] As an optional implementation, the training process of the contour matching model includes:

[0017] Perform image preprocessing according to historical cutting contour information to obtain first feature information;

[0018] Extracting descriptive information based on the first feature information to obtain contour feature information;

[0019] A contour matching model is determined according to the contour feature information.

[0020] As an optional implementation manner, performing image preprocessing according to the historical cutting contour information to obtain the first feature information includes:

[0021] Perform image cutting according to the historical cutting contour information to obtain standard image information;

[0022] Grayscale the standard image information to obtain a grayscale image information value;

[0023] Normalizing the grayscale image information value to obtain normalized image information, and marking the image information as first feature information; wherein the normalized image information has a range of 0-255;

[0024] The formula for the grayscale processing is:

[0025]

[0026] In the formula, represents the intensity of the red channel, represents the intensity of the green channel, represents the intensity of the blue channel, Represents grayscale image information.

[0027] As an optional implementation, the step of inputting the fitting information into a pre-trained contour matching model to obtain the cutting contour information on the plastic film and the hole contour information on the circuit board includes:

[0028] Performing contour detection according to the fitting information to obtain open-loop contour information;

[0029] Perform edge tracking according to the open-loop contour information to obtain closed-loop contour information, and mark the closed-loop contour information as contour information;

[0030] Wherein, the contour detection comprises:

[0031] The original image is convolved using the filter templates in the x horizontal and y vertical directions provided by Sobel edge detection. The formula is expressed as:

[0032]

[0033] In the formula, is the horizontal transverse gradient amplitude, is the vertical gradient amplitude, Represents the matrix information of the original image;

[0034] The image grayscale value is calculated based on the horizontal gradient amplitude and the vertical gradient amplitude, and the formula is:

[0035]

[0036] In the formula, Represents the gray value of the image;

[0037] The gradient direction is calculated based on the horizontal gradient amplitude and the vertical gradient amplitude. It is expressed as:

[0038]

[0039] According to the gradient direction, the gray value of the image edge is obtained;

[0040] The open-loop contour information is obtained according to the image edge grayscale value and the image grayscale value.

[0041] As an optional implementation manner, the position calibration of the cutting contour information and the hole contour information to obtain the cutting position information on the plastic film and the hole position information on the circuit board includes:

[0042] Performing integral summation according to the cutting contour information and the hole contour information to obtain numerical integral information;

[0043] According to the numerical integration information, solving the mean square value in a two-dimensional coordinate system to obtain the center position information of the contour, and marking the center position information as the position information;

[0044] The two-dimensional coordinate system is established on the flexible circuit board with the geometric center of the flexible circuit board as the origin, the major axis as the x direction, and the minor axis as the y direction.

[0045] As an optional implementation manner, comparing the cutting position information with the hole position information to obtain difference information between the cutting position information and the hole position information includes:

[0046] According to the cutting position information and the hole position information, subtraction is performed in the same coordinate system to obtain difference information between the cutting position information and the hole position information;

[0047] The difference information includes difference information in both horizontal and vertical directions.

[0048] As an optional implementation, generating a control instruction according to the difference information, and adjusting the laser cutting parameters according to the control instruction includes:

[0049] According to the difference information, a numerical determination is performed to obtain direction numerical information;

[0050] The direction numerical information is compared with the preset cutting position information to obtain the laser cutting parameters.

[0051] In a second aspect, the present invention provides a laser cutting control device, comprising:

[0052] A data acquisition module, used to obtain the fitting information of the cutting image acquired by the machine vision module;

[0053] An information processing module, used for inputting the fitting information into a pre-trained contour matching model to obtain cutting contour information on the plastic film and hole contour information on the circuit board;

[0054] A position marking module, used for calibrating the cutting contour information and the hole contour information to obtain the cutting position information on the plastic film and the hole position information on the circuit board;

[0055] A numerical calculation module, used for comparing the cutting position information with the hole position information to obtain difference information between the cutting position information and the hole position information;

[0056] The motion control module is used to generate a control instruction according to the difference information and adjust the laser cutting parameters according to the control instruction.

[0057] In a third aspect, the present invention further provides a computer-readable storage medium, wherein the computer-readable storage medium includes a stored computer program, wherein when the computer program is running, the device where the computer-readable storage medium is located is controlled to execute any one of the laser cutting control methods described above.

[0058] Compared with the prior art, the present invention has the following beneficial effects:

[0059] The present invention provides a laser cutting control method, device and storage medium. The method is executed by a controller, including: obtaining the fitting information of the cutting image collected by the machine vision module; inputting the fitting information into the pre-trained contour matching model to obtain the cutting contour information on the plastic film and the hole contour information on the circuit board; calibrating the cutting contour information and the hole contour information to obtain the cutting position information on the plastic film and the hole position information on the circuit board; comparing the cutting position information with the hole position information to obtain the difference information between the cutting position information and the hole position information; generating a control instruction according to the difference information, and adjusting the laser cutting parameters according to the control instruction. When the controller receives the image data, it analyzes the image data and automatically adjusts the cutting parameters of the laser according to the analysis results to ensure the accuracy of the cutting process. This automatic adjustment mechanism improves the accuracy of the cutting position, eliminates the uncertainty caused by manual operation, and realizes the unattended cutting process in mass production. In the whole process, the laser cutting parameters can be adjusted in time according to the tolerance data after the plastic film and the circuit board are fitted, so as to realize automatic control, reduce labor intensity and improve production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0060] Figure 1 It is a schematic flow chart of a laser cutting control method provided by the first embodiment of the present invention;

[0061] Figure 2 It is a schematic diagram of a process of obtaining the fitting information of the cutting image collected by the machine vision module according to an embodiment of the present invention;

[0062] Figure 3 is a schematic diagram of training a contour matching model according to an embodiment of the present invention;

[0063] Figure 4 It is a structural schematic diagram of a laser cutting control device provided by the second embodiment of the present invention. DETAILED DESCRIPTION

[0064] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0065] At present, laser cutting technology is an advanced manufacturing process that uses high-power laser beams to cut materials non-contact. It is widely used in the precision processing of various materials such as metals, plastics, wood, glass, etc. It plays an important role in aerospace, automobile manufacturing, electronics industry, medical equipment and other fields with its advantages of fast cutting speed, high precision, small heat-affected area, and ability to process complex shapes. Laser cutting technology achieves fine processing of materials by precisely controlling the path of the laser beam, which has promoted the development of the manufacturing industry towards higher efficiency and higher quality.

[0066] In a laser cutting and bonding machine technology, in order to protect the circuit board and ensure the correct installation of electronic components, a layer of plastic film needs to be attached to the FPC. After the flexible circuit board is completed, a layer of plastic film needs to be attached before entering the next PCBA patch process. There are holes on the circuit board, and the work of the equipment is divided into two processes: first, the plastic film is punched with a laser, and then the punched plastic film is automatically bonded to the circuit board.

[0067] During the bonding process, due to changes in external temperature, tolerances in hole diameters and hole spacing on the same batch of circuit boards, it is necessary to manually check that the holes on the plastic film are precisely aligned with the holes on the circuit board, and then adjust the laser cutting parameters, resulting in low control efficiency, easy production of defective products, and time-consuming and labor-intensive.

[0068] In order to solve the above problems, a laser cutting control method provided in an embodiment of the present application will be introduced and explained in detail through the following specific embodiments.

[0069] Reference Figure 1 The first embodiment of the present invention provides a laser cutting control method, comprising the following steps:

[0070] S11, obtaining the fitting information of the cutting image collected by the machine vision module;

[0071] S12, inputting the fitting information into a pre-trained contour matching model to obtain cutting contour information on the plastic film and hole contour information on the circuit board;

[0072] S13, calibrating the cutting contour information and the hole contour information to obtain the cutting position information on the plastic film and the hole position information on the circuit board;

[0073] S14, comparing the cutting position information with the hole position information to obtain difference information between the cutting position information and the hole position information;

[0074] S15, generating a control instruction according to the difference information, and adjusting the laser cutting parameters according to the control instruction.

[0075] It should be noted that the machine vision module is a key component in modern industrial automation and intelligent manufacturing. It captures and analyzes images through high-precision visual sensors to provide the necessary visual information for the automation system. This module usually includes different types of cameras, such as CCD (charge-coupled device) cameras, CMOS (complementary metal oxide semiconductor) cameras, and line array cameras, each of which has unique advantages and application scenarios. CCD cameras are known for their high resolution, high sensitivity, and excellent image quality, and are particularly suitable for applications that require high-quality image capture. CMOS cameras are favored for their fast imaging capabilities, low power consumption, and cost-effectiveness, and are widely used in situations that require fast response. Linear array cameras are used for continuous object detection and measurement tasks with their expertise in high-speed scanning and precise measurement.

[0076] Exemplarily, in this embodiment, the machine vision module uses a CMOS camera. The image data of the product to be marked collected by the CMOS camera, and the generated digital image data contains detailed visual information of the product to be marked, which can be used for further image processing, analysis and decision making.

[0077] In an embodiment of the present invention, a cutting image of a plastic film is captured by a machine vision module, and the lamination information in the image is extracted. The lamination information is input into a pre-trained contour matching model to identify the cutting contour on the plastic film and the hole contour on the circuit board. The cutting position on the plastic film and the hole position on the circuit board are determined by calibrating the positions of the two contours. The two positions are compared and the difference information between them is calculated. The corresponding control instructions are generated using the difference information to adjust the parameters of the laser cutting machine. The whole process realizes the real-time adjustment of the laser cutting parameters according to the error data after the plastic film and the circuit board are laminated, thereby improving the level of automation control and production efficiency.

[0078] In order to facilitate the understanding of the present invention, some preferred embodiments of the present invention are further described below.

[0079] like Figure 2 As shown, the step S11 of obtaining the fitting information of the cutting image collected by the machine vision module includes:

[0080] S111, converting the pre-prepared circuit board bonding image acquired by the machine vision module into an electrical signal;

[0081] S112, converting the electrical signal from a digital quantity to an analog quantity through an ADC to obtain digital information, and marking the digital information as the fitting information of the cut image.

[0082] It should be noted that in the process of collecting the lamination image of the circuit board by the machine vision module, the image signal needs to be sampled, and the analog signal of brightness change information is obtained as discrete sampling points within a certain time interval. After sampling, the analog signal of brightness change information is still continuous and needs to be quantized into discrete digital values. The quantization process maps the amplitude of the sampling point to discrete levels, so it involves the selection of the quantizer and the determination of the quantization level. Usually, equidistant discrete levels are used, and ADC (Analog-to-Digital Converter) is used to perform the quantization operation. The quantized sample values ​​need to be encoded and represented as binary data for easy storage and transmission. The encoded binary data can be further processed and analyzed by a digital signal processor, microcontroller or other digital system.

[0083] In step S111, the pre-prepared circuit board bonding image collected by the machine vision module is converted into an electrical signal.

[0084] It should be noted that the pre-prepared circuit board bonding image is an image obtained after the plastic film is bonded to the flexible circuit board after the laser cutting of the plastic film is completed. Due to the change of external temperature, the diameter tolerance of the holes on the circuit board and the position tolerance between the hole spacing, the holes on the plastic film and the holes on the circuit board cannot be accurately aligned. The pre-prepared circuit board bonding image contains the offset information.

[0085] In step S112, the electrical signal is converted from a digital quantity to an analog quantity through an ADC to obtain digital information, and the digital information is marked as the fitting information of the cut image.

[0086] It should be noted that the accuracy of the conversion from digital to analog depends on the resolution during the sampling and quantization process, where the resolution determines the number of discrete levels that can be represented. The higher the resolution, the finer the representation capability, and the more accurate the digital representation can be. Accuracy refers to the degree of closeness between the output data of the AD converter and the actual analog signal.

[0087] Exemplarily, a 16-bit AD converter is selected for sampling in this embodiment.

[0088] In step S12, the fitting information is input into a pre-trained contour matching model to obtain cutting contour information on the plastic film and hole contour information on the circuit board.

[0089] like Figure 3 As shown, the training steps of the contour matching model are:

[0090] S121, performing image preprocessing according to historical cutting contour information to obtain first feature information;

[0091] S122, extracting descriptive information according to the first feature information to obtain contour feature information;

[0092] S123: Determine a contour matching model according to the contour feature information.

[0093] In step S121, image preprocessing is performed according to the historical cutting contour information to obtain first feature information, including:

[0094] According to the historical cutting contour information, image cutting is performed to obtain standard image information; the standard image information is grayed to obtain gray image information value; the gray image information value is normalized to obtain normalized image information, and the image information is marked as first feature information; wherein the range of the normalized image information is 0-255;

[0095] The formula for the grayscale processing is:

[0096]

[0097] In the formula, represents the intensity of the red channel, represents the intensity of the green channel, represents the intensity of the blue channel, Represents grayscale image information.

[0098] In step S122, descriptive information is extracted according to the first feature information to obtain contour feature information. In the embodiment of the present invention, the specific process of extracting the descriptive information of the first feature is to calculate the moment information of the image, specifically:

[0099] Establish a two-dimensional coordinate system to obtain the image probability density distribution function of the first feature information Two-dimensional continuous random function + Origin moment , the calculation formula is:

[0100]

[0101] In the formula, for Directional value Second power, for Directional Second power, is the image probability density distribution function of the first feature information, is the origin moment of the first feature information.

[0102] Using the origin moment The central moment is calculated using the following formula:

[0103]

[0104] In the formula, represents the horizontal coordinate of the center of mass, represents the ordinate of the center of mass, It represents the first characteristic information The first-order origin moment of the direction, It represents the first characteristic information The first-order origin moment of the direction, It represents the 0th order moment of the first feature information.

[0105] In order to make the moment translation invariant, the central moment is constructed using the centroid coordinates:

[0106]

[0107] In the formula, It means In the direction of Step, In the direction of The central moment of the first eigenvalue of order, It represents the horizontal coordinate value of the first feature information. It represents the vertical coordinate value of the first feature information.

[0108] The obtained center distance information is normalized to offset the effect of scale change on the center moment and calculated using the following formula:

[0109]

[0110] In the formula, , It means In the direction of Step, In the direction of The central moment of the first eigenvalue of order, It represents the 0th order central moment of the first feature information. Second power, It means In the direction of Step, In the direction of The normalized center moment of the first feature information of the order is the contour feature.

[0111] It should be further explained that the moment set calculated from an image can not only describe the global characteristics of the image shape, but also provide a lot of information about the different geometric features of the image, such as size, position, direction and shape. This descriptive ability of image moments is widely used in target recognition and orientation estimation in various fields of image processing, computer vision and robotics.

[0112] Exemplarily, the two-dimensional coordinate system is established on the flexible circuit board with the geometric center of the flexible circuit board as the center of the circle, the major axis in the x direction, and the minor axis in the y direction. The flexible circuit board is a rectangle.

[0113] In step S123, a contour matching model is determined according to the contour feature information.

[0114] It should be noted that the contour information includes geometric feature information and shape feature information of the image.

[0115] Furthermore, the fitting information is input into a pre-trained contour matching model to obtain the cutting contour information on the plastic film and the hole contour information on the circuit board, including:

[0116] Performing contour detection according to the fitting information to obtain open-loop contour information;

[0117] Edge tracking is performed according to the open-loop contour information to obtain closed-loop contour information, and the closed-loop contour information is marked as contour information.

[0118] Specifically, the Sobel method is used for edge detection, and the Sobel edge detection provides Level and The filter templates in two vertical directions convolve the original image, and the formula is expressed as:

[0119]

[0120] In the formula, is the horizontal transverse gradient amplitude, is the vertical gradient amplitude, Represents the matrix information of the original image;

[0121] The image grayscale value is calculated based on the horizontal gradient amplitude and the vertical gradient amplitude, and the formula is:

[0122]

[0123] In the formula, Represents the gray value of the image;

[0124] The gradient direction is calculated based on the horizontal gradient amplitude and the vertical gradient amplitude. It is expressed as:

[0125]

[0126] According to the gradient direction, the gray value of the image edge is obtained;

[0127] The open-loop contour information is obtained according to the image edge grayscale value and the image grayscale value.

[0128] Compare the values ​​of a layer of pixels around the open-loop contour information. If the value is greater than the preset pixel value, the pixel contour is retained. If the value is less than or equal to the preset pixel value, the pixel contour is abandoned. The closed-loop contour information is composed of the open-loop contour information and the pixels retained around the open-loop information.

[0129] It should be noted that the preset value is preset by the user, and the preset value may be 128, which is not limited in the present invention.

[0130] In step S13, the cutting contour information and the hole contour information are positionally calibrated to obtain the cutting position information on the plastic film and the hole position information on the circuit board, including:

[0131] Performing integral summation according to the cutting contour information and the hole contour information to obtain numerical integral information;

[0132] According to the numerical integration information, solving the mean square value in a two-dimensional coordinate system to obtain the center position information of the contour, and marking the center position information as the position information;

[0133] It should be noted that the integral summation of the hole profile information can be expressed by the following formula:

[0134]

[0135] In the formula, The outline of the hole is The integral summation value in the coordinate direction system, represents the function of the hole in the two-dimensional coordinate system, Indicates the minimum value of the horizontal coordinate of the flexible circuit board in the two-dimensional coordinate system. It represents the maximum value of the horizontal coordinate of the flexible circuit board in the two-dimensional coordinate system.

[0136]

[0137] In the formula, The outline of the hole is The integral summation value in the coordinate direction system, represents the function of the hole in the two-dimensional coordinate system, Indicates the minimum value of the horizontal coordinate of the flexible circuit board in the two-dimensional coordinate system. It represents the maximum value of the horizontal coordinate of the flexible circuit board in the two-dimensional coordinate system.

[0138] The integral summation of the cutting profile information can be expressed by the following formula:

[0139]

[0140] In the formula, Indicates the cutting contour in The integral summation value in the coordinate direction system, represents the function of the hole in the two-dimensional coordinate system, Indicates the minimum value of the horizontal coordinate of the flexible circuit board in the two-dimensional coordinate system. It represents the maximum value of the horizontal coordinate of the flexible circuit board in the two-dimensional coordinate system.

[0141]

[0142] In the formula, The outline of the hole is The integral summation value in the coordinate direction system, represents the function of the hole in the two-dimensional coordinate system, Indicates the minimum value of the horizontal coordinate of the flexible circuit board in the two-dimensional coordinate system. It represents the maximum value of the horizontal coordinate of the flexible circuit board in the two-dimensional coordinate system.

[0143] Exemplarily, the two-dimensional coordinate system is established on the flexible circuit board with the geometric center of the flexible circuit board as the origin, the long axis direction away from the laser arm as the positive direction of the x-axis, and the short axis direction away from the laser arm as the positive direction of the y-axis.

[0144] In step S14, the cutting position information is compared with the hole position information to obtain difference information between the cutting position information and the hole position information, including:

[0145] According to the cutting position information and the hole position information, subtraction is performed in the same coordinate system to obtain difference information between the cutting position information and the hole position information;

[0146] It should be noted that the difference information includes difference information in both horizontal and vertical directions.

[0147] In step S15, generating a control instruction according to the difference information and adjusting the laser cutting parameters according to the control instruction include:

[0148] According to the difference information, a numerical determination is performed to obtain direction numerical information;

[0149] The direction numerical information is compared with the preset cutting position information to obtain the laser cutting parameters.

[0150] It should be noted that the difference information includes the level and vertical Information in two directions, when the horizontal difference information When it is less than zero, the numerical information is expressed as negative, indicating that the The axis is close to the laser arm, when the vertical difference When it is less than zero, the numerical information is expressed as negative, indicating that the The axis is close to the laser arm. The direction value information is summed with the preset cutting position information to obtain the laser cutting parameters.

[0151] Exemplarily, the preset cutting position information is pre-set by the user and may be (5 cm, 5 cm), and the present invention does not make any specific limitation to this.

[0152] In order to facilitate the understanding of the present invention, some preferred embodiments of the present invention are further described below.

[0153] In this embodiment, an integrated laser cutting control system is proposed, which consists of the following key parts: machine vision module detection end, motion control end, manual operation end, data processing end and central processing unit. These components work together to ensure the normal operation of the laser cutting control system.

[0154] The working process is as follows:

[0155] Step 1: Use the machine vision module to collect cutting images, convert the collected images into electrical signals, and then convert them into digital information through ADC. The digital information is marked as fitting information;

[0156] Step 2: Based on the historical cutting contour information, perform image preprocessing, extract feature information, and determine the contour matching model

[0157] Step 3: Obtain the cutting contour information on the plastic film and the hole contour information on the circuit board from the bonding information through contour detection and edge tracking.

[0158] Step 4: Integrate and sum the cutting contour information and the hole contour information, solve the mean square value, and obtain the center position information of the contour.

[0159] Step 5: Subtract the cutting position information from the hole position information in the same coordinate system to obtain the difference information in the horizontal and vertical directions.

[0160] Step 6: Make a numerical determination based on the difference information, compare it with the preset cutting position information, and generate a control instruction.

[0161] Step 7: According to the generated control instructions, adjust the laser cutting parameters to achieve precise cutting effect.

[0162] Through the above steps and system design, the laser cutting control system of the present invention can realize autonomous adjustment of cutting parameters to meet the requirements of laminating the plastic film and the flexible circuit board, thereby improving production efficiency and product quality.

[0163] In summary, the present invention provides a laser cutting control method, system, device and storage medium, the method is executed by a controller, including obtaining the fitting information of the cutting image collected by the machine vision module; inputting the fitting information into the pre-trained contour matching model to obtain the cutting contour information on the plastic film and the hole contour information on the circuit board; calibrating the cutting contour information and the hole contour information to obtain the cutting position information on the plastic film and the hole position information on the circuit board; comparing the cutting position information with the hole position information to obtain the difference information between the cutting position information and the hole position information; generating a control instruction according to the difference information, and adjusting the laser cutting parameters according to the control instruction. When the controller receives the image data, it analyzes the image data and automatically adjusts the cutting parameters of the laser according to the analysis results to ensure the accuracy of the cutting process. This automatic adjustment mechanism improves the accuracy of the cutting position, while eliminating the uncertainty caused by human operation, and realizes an unattended cutting process in mass production. During the entire process, the laser cutting parameters can be adjusted in real time according to the tolerance data after the plastic film and circuit board are bonded together, realizing automatic control, reducing labor intensity and improving production efficiency.

[0164] Reference Figure 4 The second embodiment of the present invention provides a laser cutting control device, comprising:

[0165] A data acquisition module, used to obtain the fitting information of the cutting image acquired by the machine vision module;

[0166] An information processing module, used for inputting the fitting information into a pre-trained contour matching model to obtain cutting contour information on the plastic film and hole contour information on the circuit board;

[0167] A position marking module, used for calibrating the cutting contour information and the hole contour information to obtain the cutting position information on the plastic film and the hole position information on the circuit board;

[0168] A numerical calculation module, used for comparing the cutting position information with the hole position information to obtain difference information between the cutting position information and the hole position information;

[0169] The motion control module is used to generate a control instruction according to the difference information and adjust the laser cutting parameters according to the control instruction.

[0170] In one embodiment, the data acquisition module includes:

[0171] Converting the pre-prepared circuit board bonding image acquired by the machine vision module into an electrical signal;

[0172] The electrical signal is converted from digital quantity to analog quantity through ADC to obtain digital information, and the digital information is marked as the fitting information of the cutting image; wherein the digital information is represented by binary digital information.

[0173] In one embodiment, the information processing module includes:

[0174] Performing contour detection according to the fitting information to obtain open-loop contour information;

[0175] Perform edge tracking according to the open-loop contour information to obtain closed-loop contour information, and mark the closed-loop contour information as contour information;

[0176] Wherein, the contour detection comprises:

[0177] The original image is convolved using the filter templates in the x horizontal and y vertical directions provided by Sobel edge detection. The formula is expressed as:

[0178]

[0179] In the formula, is the horizontal transverse gradient amplitude, is the vertical gradient amplitude, Represents the matrix information of the original image;

[0180] The image grayscale value is calculated based on the horizontal gradient amplitude and the vertical gradient amplitude, and the formula is:

[0181]

[0182] In the formula, Represents the gray value of the image;

[0183] The gradient direction is calculated based on the horizontal gradient amplitude and the vertical gradient amplitude. It is expressed as:

[0184]

[0185] According to the gradient direction, the gray value of the image edge is obtained;

[0186] The open-loop contour information is obtained according to the image edge grayscale value and the image grayscale value.

[0187] In one embodiment, the information processing module further includes:

[0188] The contour matching model is trained, specifically: image preprocessing is performed according to historical cutting contour information to obtain first feature information; descriptive information is extracted according to the first feature information to obtain contour feature information; and a contour matching model is determined according to the contour feature information.

[0189] It should be noted that the image preprocessing according to the historical cutting contour information to obtain the first characteristic information includes: performing image cutting according to the historical cutting contour information to obtain standard image information; graying the standard image information to obtain a gray image information value; normalizing the gray image information value to obtain normalized image information, and marking the image information as the first characteristic information; wherein the range of the normalized image information is 0-255;

[0190] The formula for the grayscale processing is:

[0191]

[0192] In the formula, represents the intensity of the red channel, represents the intensity of the green channel, represents the intensity of the blue channel, Represents grayscale image information.

[0193] In one embodiment, the position marking module includes:

[0194] Performing integral summation according to the cutting contour information and the hole contour information to obtain numerical integral information;

[0195] According to the numerical integration information, the mean square value is solved in a two-dimensional coordinate system to obtain the center position information of the contour, and the center position information is marked as the position information.

[0196] Exemplarily, the two-dimensional coordinate system described in the present invention is established on the flexible circuit board with the geometric center of the flexible circuit board as the origin, the long axis direction away from the laser arm as the positive direction of the x-axis, and the short axis direction away from the laser arm as the positive direction of the y-axis.

[0197] In one embodiment, the motion control module includes:

[0198] According to the difference information, a numerical determination is performed to obtain direction numerical information; according to the direction numerical information, it is compared with the preset cutting position information to obtain the laser cutting parameters.

[0199] The difference information includes the level and vertical Information in two directions, when the horizontal difference information When it is less than zero, the numerical information is expressed as negative, indicating that the The axis is close to the laser arm, when the vertical difference When it is less than zero, the numerical information is expressed as negative, indicating that the The axis is close to the laser arm. The direction value information is summed with the preset cutting position information to obtain the laser cutting parameters.

[0200] Exemplarily, the preset cutting position information is pre-set by the user and may be (5 cm, 5 cm), and the present invention does not make any specific limitation to this.

[0201] It should be noted that a laser cutting control device provided in an embodiment of the present invention is used to execute all process steps of a laser cutting control method in the above embodiment, and the working principles and beneficial effects of the two correspond one to one, so they will not be repeated.

[0202] In summary, the present invention provides a laser cutting control method, device and storage medium. The method is executed by a controller, including: obtaining the fitting information of the cutting image collected by the machine vision module; inputting the fitting information into the pre-trained contour matching model to obtain the cutting contour information on the plastic film and the hole contour information on the circuit board; calibrating the cutting contour information and the hole contour information to obtain the cutting position information on the plastic film and the hole position information on the circuit board; comparing the cutting position information with the hole position information to obtain the difference information between the cutting position information and the hole position information; generating a control instruction according to the difference information, and adjusting the laser cutting parameters according to the control instruction. When the controller receives the image data, it analyzes the image data and automatically adjusts the cutting parameters of the laser according to the analysis results to ensure the accuracy of the cutting process. This automatic adjustment mechanism improves the accuracy of the cutting position, eliminates the uncertainty caused by manual operation, and realizes the unattended cutting process in mass production. In the whole process, the laser cutting parameters can be adjusted in time according to the tolerance data after the plastic film and the circuit board are fitted, so as to realize automatic control, reduce labor intensity and improve production efficiency.

[0203] The embodiment of the present invention further provides an electronic device. The electronic device includes: a processor, a memory, and a computer program stored in the memory and executable on the processor, such as a contour matching model. When the processor executes the computer program, the steps in the above-mentioned laser cutting control method embodiments are implemented, such as Figure 1 Alternatively, when the processor executes the computer program, the functions of each module / unit in the above-mentioned device embodiments are realized, such as the information processing module.

[0204] Exemplarily, the computer program may be divided into one or more modules / units, which are stored in the memory and executed by the processor to implement the present invention. The one or more modules / units may be a series of computer program instruction segments capable of implementing specific functions, which are used to describe the execution process of the computer program in the electronic device.

[0205] The electronic device may be a computing device such as a desktop computer, a notebook, a PDA, and a smart tablet. The electronic device may include, but is not limited to, a processor and a memory. Those skilled in the art will appreciate that the above components are merely examples of electronic devices and do not constitute a limitation on the electronic device. The electronic device may include more or fewer components than the above components, or may combine certain components, or different components. For example, the electronic device may also include input and output devices, network access devices, buses, etc.

[0206] The processor may be a central processing unit (CPU), other general-purpose processors, digital signal processors (DSP), application-specific integrated circuits (ASIC), field-programmable gate arrays (FPGA) or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. A general-purpose processor may be a microprocessor or any conventional processor, etc. The processor is the control center of the electronic device, and uses various interfaces and lines to connect various parts of the entire electronic device.

[0207] The memory can be used to store the computer program and / or module, and the processor realizes various functions of the electronic device by running or executing the computer program and / or module stored in the memory, and calling the data stored in the memory. The memory can mainly include a program storage area and a data storage area, wherein the program storage area can store an operating system, an application required for at least one function (such as a sound playback function, an image playback function, etc.), etc.; the data storage area can store data created according to the use of the mobile phone (such as audio data, a phone book, etc.), etc. In addition, the memory can include a high-speed random access memory, and can also include a non-volatile memory, such as a hard disk, a memory, a plug-in hard disk, a smart memory card (Smart Media Card, SMC), a secure digital (Secure Digital, SD) card, a flash card (Flash Card), at least one disk storage device, a flash memory device, or other volatile solid-state storage devices.

[0208] Wherein, if the module / unit integrated in the electronic device is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on such an understanding, the present invention implements all or part of the processes in the above-mentioned embodiment method, and can also be completed by instructing the relevant hardware through a computer program. The computer program can be stored in a computer-readable storage medium, and the computer program can implement the steps of the above-mentioned various method embodiments when executed by the processor. Wherein, the computer program includes computer program code, and the computer program code can be in source code form, object code form, executable file or some intermediate form. The computer-readable medium may include: any entity or device capable of carrying the computer program code, recording medium, U disk, mobile hard disk, disk, optical disk, computer memory, read-only memory (ROM, Read-Only Memory), random access memory (RAM, Random Access Memory), electric carrier signal, telecommunication signal and software distribution medium. It should be noted that the content contained in the computer-readable medium can be appropriately increased or decreased according to the requirements of legislation and patent practice in the jurisdiction. For example, in some jurisdictions, according to legislation and patent practice, computer-readable media do not include electric carrier signals and telecommunication signals.

[0209] It should be noted that the device embodiments described above are merely schematic, wherein the units described as separate components may or may not be physically separated, and the components displayed as units may or may not be physical units, that is, they may be located in one place, or they may be distributed on multiple network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the scheme of this embodiment. In addition, in the accompanying drawings of the device embodiments provided by the present invention, the connection relationship between the modules indicates that there is a communication connection between them, which may be specifically implemented as one or more communication buses or signal lines. A person of ordinary skill in the art may understand and implement it without paying any creative effort.

[0210] The specific embodiments described above further illustrate the purpose, technical solutions and beneficial effects of the present invention. It should be understood that the above description is only a specific embodiment of the present invention and is not intended to limit the scope of protection of the present invention. It is particularly pointed out that for those skilled in the art, any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the scope of protection of the present invention.

Claims

1. A laser cutting control method, characterized in that: Executed by a controller, the method includes: Obtaining the fitting information of the cutting image collected by the machine vision module; The fitting information is input into a pre-trained contour matching model to obtain cutting contour information on the plastic film and hole contour information on the circuit board; The training process of the contour matching model includes: Perform image preprocessing according to historical cutting contour information to obtain first feature information; Extracting descriptive information based on the first feature information to obtain contour feature information; Determining a contour matching model according to the contour feature information; Calibrate the cutting contour information and the hole contour information to obtain the cutting position information on the plastic film and the hole position information on the circuit board, specifically including: Performing integral summation according to the cutting contour information and the hole contour information to obtain numerical integral information; According to the numerical integration information, solving the mean square value in a two-dimensional coordinate system to obtain the center position information of the contour, and marking the center position information as the position information; Wherein, the two-dimensional coordinate system is established on the flexible circuit board, with the geometric center of the flexible circuit board as the origin, the long axis direction away from the laser arm as the positive direction of the x-axis, and the short axis direction away from the laser arm as the positive direction of the y-axis; Comparing the cutting position information with the hole position information to obtain difference information between the cutting position information and the hole position information; A control instruction is generated according to the difference information, and laser cutting parameters are adjusted according to the control instruction.

2. The laser cutting control method according to claim 1, characterized in that: The obtaining of the fitting information of the cutting image collected by the machine vision module includes: Converting the pre-prepared circuit board bonding image acquired by the machine vision module into an electrical signal; Convert the electrical signal from digital quantity to analog quantity through ADC to obtain digital information, and mark the digital information as the fitting information of the cutting image; Wherein, the digital information is represented by binary digital information.

3. The laser cutting control method according to claim 1, characterized in that: The image preprocessing is performed according to the historical cutting contour information to obtain the first feature information, including: Perform image cutting according to the historical cutting contour information to obtain standard image information; Grayscale the standard image information to obtain a grayscale image information value; Normalizing the grayscale image information value to obtain normalized image information, and marking the image information as first feature information; wherein the normalized image information has a range of 0-255; The grayscale processing formula is: In the formula, represents the intensity of the red channel, represents the intensity of the green channel, represents the intensity of the blue channel, Represents grayscale image information.

4. The laser cutting control method according to claim 1, characterized in that: The step of inputting the fitting information into a pre-trained contour matching model to obtain the cutting contour information on the plastic film and the hole contour information on the circuit board includes: Performing contour detection according to the fitting information to obtain open-loop contour information; Perform edge tracking according to the open-loop contour information to obtain closed-loop contour information, and mark the closed-loop contour information as contour information; Wherein, the contour detection comprises: The original image is convolved using the filter templates in the x horizontal and y vertical directions provided by Sobel edge detection. The formula is expressed as: In the formula, is the horizontal transverse gradient amplitude, is the vertical gradient amplitude, Represents the matrix information of the original image; The image grayscale value is calculated based on the horizontal gradient amplitude and the vertical gradient amplitude, and the formula is: In the formula, Represents the gray value of the image; The gradient direction is calculated based on the horizontal gradient amplitude and the vertical gradient amplitude. It is expressed as: According to the gradient direction, the gray value of the image edge is obtained; The open-loop contour information is obtained according to the image edge grayscale value and the image grayscale value.

5. The laser cutting control method according to claim 1, characterized in that: Comparing the cutting position information with the hole position information to obtain difference information between the cutting position information and the hole position information includes: According to the cutting position information and the hole position information, subtraction is performed in the same coordinate system to obtain difference information between the cutting position information and the hole position information; The difference information includes difference information in both horizontal and vertical directions.

6. The laser cutting control method according to claim 1, characterized in that: The step of generating a control instruction according to the difference information and adjusting the laser cutting parameters according to the control instruction includes: According to the difference information, a numerical determination is performed to obtain direction numerical information; The direction numerical information is compared with the preset cutting position information to obtain the laser cutting parameters.

7. A laser cutting control device, characterized in that: A method for implementing the laser cutting control method according to any one of claims 1 to 6, comprising: A data acquisition module, used to obtain the fitting information of the cutting image acquired by the machine vision module; An information processing module, used for inputting the fitting information into a pre-trained contour matching model to obtain cutting contour information on the plastic film and hole contour information on the circuit board; A position marking module, used for calibrating the cutting contour information and the hole contour information to obtain the cutting position information on the plastic film and the hole position information on the circuit board; A numerical calculation module, used for comparing the cutting position information with the hole position information to obtain difference information between the cutting position information and the hole position information; The motion control module is used to generate a control instruction according to the difference information and adjust the laser cutting parameters according to the control instruction.

8. A computer-readable storage medium, characterized in that: The computer-readable storage medium includes a stored computer program, wherein when the computer program is executed, the device where the computer-readable storage medium is located is controlled to execute the laser cutting control method according to any one of claims 1 to 6.

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