A solar photovoltaic panel silicon wafer laser cutting device

Abstract

The present invention relates to the field of silicon wafer cutting, specifically a solar photovoltaic panel silicon wafer laser cutting device, including a cutting table and a gantry fixedly connected to the top of the cutting table, a laser cutting device is installed below the gantry, and a positioning device is installed on the top of the cutting table. The present invention uses an electric push rod to push the front and rear clamping mechanisms to move in the direction close to the photovoltaic silicon wafer to clamp the photovoltaic silicon wafer front and back, and then the first push plate pushes the rack to continue to move in the direction close to the photovoltaic silicon wafer, and the rack drives the gear to rotate, so that the top pressure plate can press the left and right sides of the cutting part from above the photovoltaic silicon wafer, and the positioning plate can limit the left and right ends of the photovoltaic silicon wafer, thereby improving the stability of the photovoltaic silicon wafer during the cutting process, and then cooperate with the guide groove to guide and limit the laser cutting head, thereby improving the cutting stability of the laser cutting head, which is conducive to improving the precision of photovoltaic silicon wafer cutting.

Description

Technical Field

[0001] The invention relates to the technical field of silicon wafer cutting, and in particular to a solar photovoltaic panel silicon wafer laser cutting device. Background Art

[0002] Solar photovoltaic panel silicon wafers are important components of photovoltaic cells, which are mainly used to convert solar energy into electrical energy. Photovoltaic panel silicon wafers need to be cut during the production and processing process. Through cutting, photovoltaic panel silicon wafers can be processed into standard sizes to facilitate subsequent processing and application.

[0003] Existing solar photovoltaic panel silicon wafers are usually cut by laser cutting. When cutting, the photovoltaic panel silicon wafer is placed on the cutting table, and then the laser cutting head moves along the part to be cut to cut the photovoltaic panel silicon wafer into the required size. However, the above-mentioned photovoltaic panel silicon wafer cutting method still has the following shortcomings: 1. When the existing photovoltaic panel silicon wafer is cut, the photovoltaic panel silicon wafer itself and the vicinity of the photovoltaic panel cutting line lack corresponding effective fixation, which will affect the subsequent cutting accuracy of the photovoltaic panel silicon wafer; 2. When the photovoltaic panel silicon wafer is laser cut, the temperature of the cutting part is high, and the high temperature easily causes the photovoltaic panel silicon wafer to deform and damage. The cooling method commonly used at present is to cool the cutting part from the top of the photovoltaic panel silicon wafer, but the bottom of the photovoltaic panel silicon wafer is not cooled in time, and the overall cooling effect of the cutting part is uneven, which affects the quality of the photovoltaic panel silicon wafer cutting; 3. After the photovoltaic panel silicon wafer is cut, the temperature of the photovoltaic panel silicon wafers on both sides of the cutting seam is relatively high. After the existing photovoltaic panel silicon wafer is cut, it is still close together and easily affects each other, which is also not conducive to rapid and effective cooling, thereby affecting the quality of the photovoltaic panel silicon wafer after cutting. Summary of the invention

[0004] In order to solve the above problems, the present invention provides a solar photovoltaic panel silicon wafer laser cutting device, comprising a cutting table and a gantry fixedly connected to the top of the cutting table, a laser cutting device is installed under the gantry, the laser cutting device comprises a laser cutting head located above the cutting table and a multi-dimensional driving mechanism installed at the lower part of the horizontal section of the gantry and used to drive the laser cutting head to move, a positioning device is installed on the top of the cutting table, an upper cooling device is installed on the top of the gantry, and a lower cooling device is installed inside the cutting table.

[0005] The positioning device includes front and rear clamping mechanisms symmetrically installed on the top of the cutting table, an electric push rod driving the front and rear clamping mechanisms to move forward and backward is fixedly installed on the top of the cutting table, clamping and separation mechanisms are slidably installed on the left and right ends of the front and rear clamping mechanisms, a lateral moving mechanism driving the clamping and separation mechanisms to move left and right is arranged between the front and rear clamping mechanisms and the corresponding clamping and separation mechanisms, a cutting seam fixing mechanism is installed on the top of the front and rear clamping mechanisms and the clamping and separation mechanisms, and a positioning plate is connected to the side of the clamping and separation mechanism away from the corresponding front and rear clamping mechanisms.

[0006] The lateral movement mechanism includes a pushing component installed between the front and rear clamping mechanisms and the corresponding clamping and separating mechanisms and used to push the clamping and separating mechanisms to move away from the front and rear clamping mechanisms. The clamping and separating mechanisms are also equipped with a locking component for positioning the pushing component.

[0007] The left and right sides of the laser cutting head are fixedly connected with wing plates, the bottom of the wing plates is fixedly connected with guide blocks, and the top of the wing plates is installed with unlocking components.

[0008] In one possible implementation, the front and rear clamping mechanism includes a first push plate slidably mounted on the top of the cutting table, a first clamping plate is slidably mounted on the side of the first push plate close to the center of the cutting table through a first guide rod, a buffer spring is fixedly connected between the first push plate and the first clamping plate, and the telescopic end of the electric push rod is fixedly connected to the side of the first push plate away from the center of the cutting table.

[0009] In one possible implementation, the clamping and separation mechanism includes a second push plate slidably mounted on the top of the cutting table, a second clamping plate is slidably mounted on the side of the second push plate close to the center of the cutting table through a second guide rod, a buffer spring is also installed between the second clamping plate and the second push plate, a guide block is fixedly connected to the bottom of the second push plate, a wedge-shaped guide groove is provided at the top of the cutting table at a position corresponding to the guide block, the oblique side of the wedge-shaped guide groove is away from the center line of the cutting table, and the oblique sides of the two wedge-shaped guide grooves corresponding to the same first push plate are arranged opposite to each other, and the guide block cooperates with the corresponding wedge guide groove.

[0010] In one possible implementation, the pushing assembly includes a movable rod fixedly connected to the side of the first push plate close to the second push plate, and the end of the movable rod close to the second push plate slides through the interior of the second push plate and is fixedly connected to a baffle, and a compression spring is fixedly connected between the baffle and the inner wall of the second push plate.

[0011] In one possible implementation, the locking assembly includes a support frame fixedly connected to the top of the second push plate, a pin rod is installed inside the support frame for sliding up and down, the bottom end of the pin rod passes through the interior of the second push plate to limit the baffle, the bottom end of the pin rod is a wedge-shaped structure, and a return spring is fixedly connected between the pin rod and the support frame.

[0012] In one possible implementation, the unlocking assembly includes a push rod arranged between the tops of the front and rear pin rods, the top of the front pin rod is fixedly connected to the bottom of the push rod, and the top of the rear pin rod is slidably installed on the bottom of the push rod, and the opposite sides of the front ends of the left and right push rods are fixedly connected with fixing plates, and the fixing plates on the two push rods are staggered front and back, and the top of the wing plate is fixedly connected with a wedge-shaped pushing block that cooperates with the fixing plate.

[0013] In one possible implementation, the cutting seam fixing mechanism includes a top pressure plate, and the first clamping plate and the adjacent second clamping plate at opposite ends are hinged with the top pressure plate through a round rod, a guide groove is provided on the top of the top pressure plate, and the guide block slides in cooperation with the corresponding guide groove, a gear is coaxially fixedly connected to one end of the round rod, and a rack is fixedly connected to the top of the opposite ends of the first push plate and the second clamping plate, and the rack is meshed with the corresponding gear.

[0014] In a possible implementation, the positioning plate is fixedly connected to an end of the second clamping plate away from the center of the cutting table, and the length of the left positioning plate is greater than that of the right positioning plate.

[0015] In one possible implementation, the upper cooling device includes a water tank and a water pump installed on the top of the gantry, the input end of the water pump is connected to the water tank, the output end of the water pump is fixedly connected to a corrugated expansion pipe, the bottom end of the corrugated expansion pipe passes through the gantry and is fixedly connected to a left-right symmetrical water spray head, the two water spray heads are fixedly connected to the corresponding wing plates and are respectively located on the left and right sides of the laser cutting head.

[0016] In one possible implementation, the lower cooling device includes a pulley installed inside the cutting table for rotation symmetrically on the left and right, a conveyor belt is connected to the outside of the two pulleys, two conveyor belts are symmetrically arranged front and back, and a number of equidistantly distributed water-cooling parts are fixedly installed between the outsides of the front and rear conveyor belts. A driving motor for driving the pulley to rotate is fixedly installed on the front of the cutting table, and a number of support blocks are also fixedly installed between the outsides of the two conveyor belts.

[0017] Beneficial effects of the present invention: 1. The present invention pushes the front and rear clamping mechanisms to move toward the direction close to the photovoltaic silicon wafer by an electric push rod to clamp the photovoltaic silicon wafer front and back. Then the first push plate pushes the rack to continue to move toward the direction close to the photovoltaic silicon wafer. The rack drives the gear to rotate, so that the top pressure plate can press the left and right sides of the cutting part from above the photovoltaic silicon wafer. At the same time, the positioning plate can limit the left and right ends of the photovoltaic silicon wafer, thereby improving the stability of the photovoltaic silicon wafer during the cutting process. The guide groove is used to guide and limit the laser cutting head, thereby improving the cutting stability of the laser cutting head, which is beneficial to improving the cutting accuracy of the photovoltaic silicon wafer.

[0018] 2. The present invention realizes the linkage cooperation among the clamping and separating mechanism, the lateral moving mechanism and the laser cutting device. When the laser cutting head moves along the guide groove to complete the cutting of one end of the photovoltaic silicon wafer, the laser cutting head drives the wedge-shaped pushing block to push the fixed plate upward, so that the unlocking component releases the limit of the locking component on the pushing component, and the pushing component pushes the clamping and separating mechanism to move away from the front and rear clamping mechanisms, so that the photovoltaic silicon wafers on both sides of the cutting seam are moved away from each other, avoiding the mutual influence of the photovoltaic silicon wafers on both sides of the cutting seam, which is beneficial to improving the cooling effect and improving the quality of the photovoltaic silicon wafers after cutting.

[0019] 3. The present invention uses an upper cooling device and a lower cooling device in combination to evenly cool down the upper and lower sides of the cutting seam at the same time, thereby preventing the temperature of the cut section of the photovoltaic silicon wafer on both sides of the cutting seam from being too high. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a three-dimensional structural schematic diagram of the present invention.

[0021] Figure 2 It is a three-dimensional structural schematic diagram of the positioning device of the present invention.

[0022] Figure 3 It is a three-dimensional structural schematic diagram of the cutting seam fixing mechanism of the present invention.

[0023] Figure 4 It is a front cross-sectional view of the lateral movement mechanism of the present invention.

[0024] Figure 5 It is a schematic diagram of the three-dimensional structure of the laser cutting device of the present invention.

[0025] Figure 6 It is a schematic diagram of the three-dimensional structure of the laser cutting head of the present invention.

[0026] Figure 7 It is a schematic diagram of the three-dimensional structure of the lower cooling device of the present invention.

[0027] Figure 8 It is a front cross-sectional view of the lower cooling device of the present invention.

[0028] Fig. 9 It is a trajectory diagram of the movement of the laser cutting head of the present invention.

[0029] In the figure: 1, cutting table; 2, positioning device; 21, front and rear clamping mechanism; 211, first push plate; 212, first clamping plate; 213, buffer spring; 22, electric push rod; 23, clamping and separating mechanism; 231, second push plate; 232, second clamping plate; 233, guide block; 234, wedge-shaped guide groove; 24, lateral movement mechanism; 241, movable rod; 242, baffle; 243, compression spring; 244, support frame; 245, pin rod; 246, return spring; 247, push rod; 248, fixed plate; 249, wedge-shaped pushing block; 25 , cutting seam fixing mechanism; 251, top pressure plate; 252, guide groove; 253, gear; 254, rack; 26, positioning plate; 3, gantry; 4, laser cutting device; 41, laser cutting head; 42, multi-dimensional driving mechanism; 43, wing plate; 44, guide block; 5, upper cooling device; 51, water storage tank; 52, water pump; 53, corrugated telescopic pipe; 54, water spray head; 6, lower cooling device; 61, pulley; 62, conveyor belt; 63, water cooling part; 64, support block; 65, drive motor; 7, photovoltaic silicon wafer; 71, cutting seam. DETAILED DESCRIPTION

[0030] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific embodiments of the present invention are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention can be implemented in many other ways different from those described below, and those skilled in the art can make similar improvements without violating the connotation of the present invention, so the present invention is not limited by the specific embodiments disclosed below.

[0031] See also Figure 1 , Figure 2 and Figure 5 A solar photovoltaic panel silicon wafer laser cutting device comprises a cutting table 1 and a gantry 3 fixedly connected to the top of the cutting table 1, a laser cutting device 4 is installed below the gantry 3, the laser cutting device 4 comprises a laser cutting head 41 located above the cutting table 1 and a multi-dimensional driving mechanism 42 installed at the lower part of the horizontal section of the gantry 3 and used to drive the laser cutting head 41 to move, a positioning device 2 is installed on the top of the cutting table 1, an upper cooling device 5 is installed on the top of the gantry 3, and a lower cooling device 6 is installed inside the cutting table 1.

[0032] See also Figure 1 , Figure 2 and Figure 3The positioning device 2 includes a front and rear clamping mechanism 21 symmetrically installed on the top of the cutting table 1. An electric push rod 22 is fixedly installed on the top of the cutting table 1 to drive the front and rear clamping mechanism 21 to move forward and backward. A clamping and separation mechanism 23 is slidably installed on the left and right ends of the front and rear clamping mechanism 21. A lateral moving mechanism 24 is arranged between the front and rear clamping mechanism 21 and the corresponding clamping and separation mechanism 23 to drive the clamping and separation mechanism 23 to move left and right. A cutting seam fixing mechanism 25 is installed on the top of the front and rear clamping mechanism 21 and the clamping and separation mechanism 23. A positioning plate 26 is connected to the side of the clamping and separation mechanism 23 away from the corresponding front and rear clamping mechanism 21.

[0033] See also Figure 1 , Figure 3 and Figure 4 The lateral moving mechanism 24 includes a pushing component installed between the front and rear clamping mechanisms 21 and the corresponding clamping and separating mechanisms 23 and used to push the clamping and separating mechanisms 23 to move in a direction away from the front and rear clamping mechanisms 21. A locking component for positioning the pushing component is also installed on the clamping and separating mechanisms 23.

[0034] See also Figure 1 , Figure 5 and Figure 6 The left and right sides of the laser cutting head 41 are fixedly connected with wing plates 43 , the bottom of the wing plates 43 is fixedly connected with a guide block 44 , and the top of the wing plates 43 is installed with an unlocking component.

[0035] See also Figure 1 , Figure 2 and Figure 3 The front and rear clamping mechanism 21 includes a first push plate 211 slidably mounted on the top of the cutting table 1, a first clamping plate 212 is slidably mounted on the side of the first push plate 211 close to the center of the cutting table 1 through a first guide rod, a buffer spring 213 is fixedly connected between the first push plate 211 and the first clamping plate 212, and the telescopic end of the electric push rod 22 is fixedly connected to the side of the first push plate 211 away from the center of the cutting table 1.

[0036] By pushing the first push plate 211 toward the direction approaching the photovoltaic silicon wafer 7 through the electric push rod 22, the first clamping plate 212 can clamp the front and rear sides of the photovoltaic silicon wafer 7. The buffer spring 213 can play a buffering role, so that the first push plate 211 can continue to move toward the direction approaching the photovoltaic silicon wafer 7 after the first clamping plate 212 clamps the photovoltaic silicon wafer 7.

[0037] See also Figure 1 , Figure 2 , Figure 3 and Figure 7The clamping and separating mechanism 23 includes a second push plate 231 slidably mounted on the top of the cutting table 1. A second clamping plate 232 is slidably mounted on the side of the second push plate 231 close to the center of the cutting table 1 through a second guide rod. A buffer spring 213 is also installed between the second clamping plate 232 and the second push plate 231. A guide block 233 is fixedly connected to the bottom of the second push plate 231. A wedge-shaped guide groove 234 is provided at the top of the cutting table 1 at a position corresponding to the guide block 233. The hypotenuse of the wedge-shaped guide groove 234 is away from the center line of the cutting table 1, and the hypotenuses on the two wedge-shaped guide grooves 234 corresponding to the same first push plate 211 are arranged opposite to each other. The guide block 233 cooperates with the corresponding wedge-shaped guide groove 234.

[0038] When the first push plate 211 moves toward the direction approaching the photovoltaic silicon wafer 7, it will drive the second push plate 231 to move together, so that the second clamping plate 232 can tighten the front and rear sides of the photovoltaic silicon wafer 7; when the electric push rod 22 pulls the first push plate 211 and the second push plate 231 to move in the opposite direction away from the photovoltaic silicon wafer 7, the wedge-shaped guide groove 234 is used to guide the guide block 233, so that the second push plate 231 can move toward the direction approaching the first push plate 211.

[0039] See also Figure 1 , Figure 2 , Figure 3 and Figure 4 The pushing assembly includes a movable rod 241 fixedly connected to the side of the first push plate 211 close to the second push plate 231. The end of the movable rod 241 close to the second push plate 231 slides through the interior of the second push plate 231 and is fixedly connected to a baffle 242. A compression spring 243 is fixedly connected between the baffle 242 and the inner wall of the second push plate 231.

[0040] See also Figure 3 and Figure 4 The locking assembly includes a support frame 244 fixedly connected to the top of the second push plate 231, and a pin rod 245 is installed inside the support frame 244 for sliding up and down. The bottom end of the pin rod 245 passes through the inside of the second push plate 231 to limit the baffle 242. The bottom end of the pin rod 245 is a wedge-shaped structure, and a return spring 246 is fixedly connected between the pin rod 245 and the support frame 244.

[0041] See also Figure 1 , Figure 3 , Figure 4 , Figure 5 , Figure 6 and Fig. 9The unlocking assembly includes a push rod 247 arranged between the tops of the front and rear pin rods 245, the top of the front pin rod 245 is fixedly connected to the bottom of the push rod 247, the top of the rear pin rod 245 is slidably installed on the bottom of the push rod 247, the opposite sides of the left and right push rods 247 are fixedly connected with fixing plates 248, and the fixing plates 248 on the two push rods 247 are staggered front and back, and the top of the wing plate 43 is fixedly connected with a wedge-shaped pushing block 249 that cooperates with the fixing plate 248.

[0042] Initially, the pin 245 is pushed downward by the return spring 246, so that the bottom end of the pin 245 can be stuck on the baffle 242 for limit locking, and then the distance between the first push plate 211 and the second push plate 231 is fixed; when the laser cutting head 41 completes the cutting of the photovoltaic silicon wafer 7, the laser cutting head 41 drives the wedge-shaped pushing block 249 to move in the direction close to the fixed plate 248, and uses the wedge-shaped pushing block 249 to push the fixed plate 248 and the push rod 247 to move upward, and then uses the push rod 247 to drive the pin 245 to move upward, so that the pin 245 can contact the lock of the baffle 242. At this time, the rebound force of the compression spring 243 can push the second push plate 231 to move away from the first push plate 211, so that the photovoltaic silicon wafers 7 on both sides of the cutting seam 71 are away from each other, which is beneficial to the circulation and heat dissipation of air at the cutting seam 71 of the photovoltaic silicon wafer 7.

[0043] See also Figure 1 , Figure 2 , Figure 3 , Figure 6 and Fig. 9 The cutting seam fixing mechanism 25 includes a top pressure plate 251, and the opposite ends of the first clamping plate 212 and the adjacent second clamping plate 232 are hinged with the top pressure plate 251 through a round rod. A guide groove 252 is provided on the top of the top pressure plate 251, and the guide block 44 is slidably matched with the corresponding guide block 44. A gear 253 is coaxially fixedly connected to one end of the round rod, and a rack 254 is fixedly connected to the top of the first push plate 211 and the second clamping plate 232, and the rack 254 is meshed with the corresponding gear 253.

[0044] After the first clamping plate 212 clamps the photovoltaic silicon wafer 7, the electric push rod 22 pushes the first push plate 211 to continue to move in the direction close to the first clamping plate 212, and the first push plate 211 is used to drive the rack 254 to move, so that the rack 254 drives the gear 253 to rotate, thereby driving the top pressure plate 251 to press on the top of the photovoltaic silicon wafer 7, so that the top pressure plate 251 presses both sides of the cutting seam 71, thereby improving the stability of the photovoltaic silicon wafer 7 during the cutting process. Subsequently, the laser cutting head 41 moves under the drive of the multi-dimensional driving mechanism 42 so that the guide block 44 enters the guide groove 252. In the subsequent cutting process, the guide groove 252 can guide the guide block 44, thereby improving the stability of the laser cutting head 41 during movement, thereby improving the cutting accuracy.

[0045] See also Figure 1 and Figure 2 The positioning plate 26 is fixedly connected to the end of the second clamping plate 232 away from the center of the cutting table 1. The length of the left positioning plate 26 is greater than the length of the right positioning plate 26. When the second clamping plate 232 does not clamp the photovoltaic silicon wafer 7, the distance between the two left positioning plates 26 is less than the width of the photovoltaic silicon wafer 7, while the distance between the two right positioning plates 26 is greater than the width of the photovoltaic silicon wafer 7.

[0046] When the photovoltaic silicon wafer 7 is placed on the cutting table 1 from right to left, the photovoltaic silicon wafer 7 will pass between the two positioning plates 26 on the right side, and finally the left end of the photovoltaic silicon wafer 7 will be against the positioning plate 26 on the left side. After that, when the second clamping plate 232 clamps the photovoltaic silicon wafer 7, it will drive the positioning plate 26 on the right side to clamp the right end of the photovoltaic silicon wafer 7, which is convenient for the positioning plate 26 to position the photovoltaic silicon wafer 7, and can enable the cutting seam fixing mechanism 25 to be aligned with the part of the photovoltaic silicon wafer 7 that needs to be cut.

[0047] See also Figure 1 , Figure 5 and Figure 6 The upper cooling device 5 includes a water tank 51 and a water pump 52 installed on the top of the gantry 3. The input end of the water pump 52 is connected to the water tank 51, and the output end of the water pump 52 is fixedly connected to a corrugated telescopic tube 53. The bottom end of the corrugated telescopic tube 53 passes through the gantry 3 and is fixedly connected to a left-right symmetrical water spray head 54. The two water spray heads 54 are fixedly connected to the corresponding wing plates 43 and are respectively located on the left and right sides of the laser cutting head 41.

[0048] The cooling water in the water tank 51 is transported to the bellows 53 by the water pump 52, and then the bellows 53 transports the cooling water to the water spray head 54 to spray out to form water mist, so as to cool the cut section of the photovoltaic silicon wafer 7, thereby reducing thermal damage to the cut part of the photovoltaic silicon wafer 7, reducing cracks and defects, and improving the cutting quality.

[0049] See also Figure 1 , Figure 7 , Figure 8 and Fig. 9 The lower cooling device 6 includes a pulley 61 symmetrically mounted on the inside of the cutting table 1 for rotation. A conveyor belt 62 is connected between the outsides of the two pulleys 61. Two conveyor belts 62 are symmetrically arranged front and back. A plurality of water-cooling parts 63 equidistantly distributed are fixedly mounted between the outsides of the front and rear conveyor belts 62. A driving motor 65 for driving the pulley 61 to rotate is fixedly mounted on the front of the cutting table 1. A plurality of support blocks 64 are also fixedly mounted between the outsides of the two conveyor belts 62.

[0050] When the laser cutting head 41 cuts the photovoltaic silicon wafer 7, the water-cooling parts 63 are attached to the bottom of both sides of the cutting seam 71 of the photovoltaic silicon wafer 7, and the heat of the photovoltaic silicon wafer 7 is conducted and dissipated by the water-cooling parts 63, which is conducive to evenly reducing the temperature of the upper and lower sides of the cutting seam 71 of the photovoltaic silicon wafer 7; after each cutting of a photovoltaic silicon wafer 7 is completed, the driving motor 65 drives the pulley 61 to rotate, and then the pulley 61 drives the conveyor belt 62 to rotate, and the position of the upper water-cooling part 63 and the lower water-cooling part 63 are exchanged, so that the water-cooling parts 63 on the upper and lower sides alternately dissipate heat, avoid the water-cooling part 63 itself from being too high, and ensure the heat dissipation effect of the water-cooling part 63; the photovoltaic silicon wafer 7 is supported by the supporting block 64. The water-cooling part 63 is a prior art, which uses cooling water to reduce the temperature.

[0051] During specific use, step one is to place the photovoltaic silicon wafer 7 from right to left on the cutting table 1. When placing it, the photovoltaic silicon wafer 7 passes through between the positioning plates 26 on the right side until the left end of the photovoltaic silicon wafer 7 is pressed against the positioning plate 26 on the left side. At this time, the water cooling part 63 is just located below the left and right cutting seams 71 and is in contact with the bottom surface of the photovoltaic silicon wafer 7 on the left and right sides of the cutting seam 71.

[0052] Step 2, then the electric push rod 22 pushes the first push plate 211 to move in the direction close to the center of the cutting table 1, so that the first clamping plate 212 is clamped on the front and rear sides of the photovoltaic silicon wafer 7, and the first push plate 211 will drive the second push plate 231 to move together when moving, so that the second clamping plate 232 is also clamped on the front and rear sides of the photovoltaic silicon wafer 7, and at this time, the positioning plate 26 at the right end will block the right end of the photovoltaic silicon wafer 7 to achieve the positioning of the photovoltaic silicon wafer 7; after the first clamping plate 212 and the second clamping plate 232 clamp the photovoltaic silicon wafer 7, the electric push rod 22 continues to push the first push plate 211 to move in the direction close to the photovoltaic silicon wafer 7, and the first push plate 211 and the second push plate 231 are used to drive the corresponding rack 254 to move, and then the rack 254 drives the gear 253 to rotate, so that the top pressing plate 251 rotates from a vertical state to a horizontal state, so that the top pressing plate 251 is pressed against the top of the photovoltaic silicon wafer 7, and the two sides of the cutting seam 71 are pressed.

[0053] Step three, when starting cutting, the laser cutting head 41 is located behind the cutting seam 71 to be cut on the right side. Subsequently, the laser cutting head 41 moves under the drive of the multi-dimensional driving mechanism 42 so that the guide block 44 enters the guide groove 252 and moves forward along the guide groove 252, thereby improving the stability of the laser cutting head 41 during movement. The photovoltaic silicon wafer 7 is cut by the laser cutting head 41. During cutting, the water pump 52 transports the cooling water in the water tank 51 to the water spray head 54 for spraying to cool the cutting part. At the same time, the water cooling part 63 performs heat conduction cooling from the photovoltaic silicon wafer 7 below.

[0054] Step 4. After the laser cutting head 41 completes the cutting of the right cutting seam 71, the laser cutting head 41 continues to move forward for a distance. At this time, the wedge-shaped pushing block 249 releases the fixing plate 248 and pushes the fixing plate 248 and the top rod 247 to move upward. The top rod 247 pulls the pin rod 245 upward to release the limit of the baffle 242 at the bottom end of the pin rod 245, so that the compression spring 243 quickly pushes the second push plate 231 to the right. The second clamping plate 232 will drive the cut photovoltaic silicon wafer 7 to move to the right, thereby separating the photovoltaic silicon wafers 7 on both sides of the cutting seam 71.

[0055] Step 5: After that, the multi-dimensional driving mechanism 42 drives the laser cutting head 41 to move to the left to the front of the left cutting seam 71, and then repeats steps 3 and 4 to complete the cutting of the left cutting seam 71. When the cutting of the left cutting seam 71 is completed, the multi-dimensional driving mechanism 42 drives the laser cutting head 41 to move to the right to the initial position, and then the electric push rod 22 drives the first push plate 211 to move away from the center of the cutting table 1. When the first push plate 211 moves, it will drive the rack 254 to move together, so that the rack 254 drives the gear 253 to rotate in the opposite direction, thereby driving the top pressure plate 251 to rotate to a vertical state, and then the first push plate 211 drives the first clamping plate 212 to release the clamping of the photovoltaic silicon wafer 7. At the same time, the first push plate 211 drives the second push plate 231 to move away from the center of the cutting table 1, and guides the guide block 233 through the wedge-shaped guide groove 234, so that the guide block 233 drives the second push plate 231 to gradually approach the first push plate 211 until the pin rod 245 re-jams the baffle 242.

[0056] Step 6. Finally, the cut photovoltaic silicon wafer 7 is taken off the cutting table 1, and then the driving motor 65 drives the conveyor belt 62 to rotate half a circle, so that the water-cooling parts 63 on the upper and lower sides exchange positions, and then a new photovoltaic silicon wafer 7 is placed on the cutting table 1, and the above steps are repeated for subsequent cutting.

[0057] In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set", "connect", "install", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, an integral connection, or a sliding connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0058] The embodiments of this specific implementation method are all preferred embodiments of the present invention, and are not intended to limit the protection scope of the present invention. Therefore, all equivalent changes made based on the structure, shape, and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A solar photovoltaic panel silicon wafer laser cutting device, comprising a cutting table (1) and a gantry (3) fixedly connected to the top of the cutting table (1), a laser cutting device (4) being installed below the gantry (3), the laser cutting device (4) comprising a laser cutting head (41) located above the cutting table (1) and a multi-dimensional driving mechanism (42) installed at the lower part of the horizontal section of the gantry (3) and used to drive the laser cutting head (41) to move, characterized in that: A positioning device (2) is installed on the top of the cutting table (1), an upper cooling device (5) is installed on the top of the gantry (3), and a lower cooling device (6) is installed inside the cutting table (1); The positioning device (2) comprises a front and rear clamping mechanism (21) symmetrically mounted on the top of the cutting table (1); an electric push rod (22) is fixedly mounted on the top of the cutting table (1) for driving the front and rear clamping mechanism (21) to move forward and backward; a clamping and separating mechanism (23) is slidably mounted on both left and right ends of the front and rear clamping mechanism (21); a lateral moving mechanism (24) is arranged between the front and rear clamping mechanism (21) and the corresponding clamping and separating mechanism (23) for driving the clamping and separating mechanism (23) to move left and right; a cutting seam fixing mechanism (25) is mounted on the top of the front and rear clamping mechanism (21) and the clamping and separating mechanism (23); and a positioning plate (26) is connected to the side of the clamping and separating mechanism (23) away from the corresponding front and rear clamping mechanism (21); The lateral movement mechanism (24) comprises a pushing component installed between the front and rear clamping mechanisms (21) and the corresponding clamping and separating mechanisms (23) and used to push the clamping and separating mechanisms (23) to move in a direction away from the front and rear clamping mechanisms (21); the clamping and separating mechanisms (23) are also provided with a locking component for positioning the pushing component; The left and right sides of the laser cutting head (41) are fixedly connected with wing plates (43), the bottom of the wing plate (43) is fixedly connected with a guide block (44), and the top of the wing plate (43) is installed with an unlocking component; The front-rear clamping mechanism (21) comprises a first push plate (211) mounted on the top of the cutting table (1) for forward and backward sliding, a first clamping plate (212) being mounted on a side of the first push plate (211) close to the center of the cutting table (1) for forward and backward sliding via a first guide rod, a buffer spring (213) being fixedly connected between the first push plate (211) and the first clamping plate (212), and a telescopic end of the electric push rod (22) being fixedly connected to a side of the first push plate (211) away from the center of the cutting table (1); The clamping and separating mechanism (23) comprises a second push plate (231) mounted on the top of the cutting table (1) for forward and backward sliding movement, a second clamping plate (232) being mounted on one side of the second push plate (231) close to the center of the cutting table (1) for forward and backward sliding movement via a second guide rod, a buffer spring (213) being also mounted between the second clamping plate (232) and the second push plate (231), a guide block (233) being fixedly connected to the bottom of the second push plate (231), a wedge-shaped guide groove (234) being provided at a position corresponding to the guide block (233) at the top of the cutting table (1), the oblique side of the wedge-shaped guide groove (234) being away from the center line of the cutting table (1), and the oblique sides of the two wedge-shaped guide grooves (234) corresponding to the same first push plate (211) being arranged opposite to each other, and the guide block (233) is matched with the corresponding wedge-shaped guide groove (234); The pushing assembly comprises a movable rod (241) fixedly connected to a side of the first pushing plate (211) close to the second pushing plate (231); one end of the movable rod (241) close to the second pushing plate (231) slides through the interior of the second pushing plate (231) and is fixedly connected to a baffle plate (242); a compression spring (243) is fixedly connected between the baffle plate (242) and the inner wall of the second pushing plate (231); The locking assembly comprises a support frame (244) fixedly connected to the top of the second push plate (231); a pin rod (245) is slidably mounted inside the support frame (244) and the bottom end of the pin rod (245) penetrates into the inside of the second push plate (231) to limit the baffle plate (242); the bottom end of the pin rod (245) is in a wedge-shaped structure; a return spring (246) is fixedly connected between the pin rod (245) and the support frame (244); The unlocking assembly comprises a push rod (247) arranged between the tops of the front and rear pin rods (245), the top of the front pin rod (245) is fixedly connected to the bottom of the push rod (247), the top of the rear pin rod (245) is slidably mounted on the bottom of the push rod (247) in a forward and backward manner, the opposite sides of the left and right push rods (247) are fixedly connected with a fixing plate (248), and the fixing plates (248) on the two push rods (247) are staggered in front and back, and the top of the wing plate (43) is fixedly connected with a wedge-shaped pushing block (249) matched with the fixing plate (248); The cutting seam fixing mechanism (25) comprises a top pressure plate (251), the first clamping plate (212) and the adjacent second clamping plate (232) are hingedly connected to the top pressure plate (251) at one end opposite to each other via a round rod, a guide groove (252) is provided at the top of the top pressure plate (251), the guide block (44) is slidably matched with the corresponding guide groove (252), a gear (253) is coaxially fixedly connected to one end of the round rod, and a rack (254) is fixedly connected to the top of the first push plate (211) and the second push plate (231), and the rack (254) is meshed with the corresponding gear (253).

2. A solar photovoltaic panel silicon wafer laser cutting device according to claim 1, characterized in that: The positioning plate (26) is fixedly connected to an end of the second clamping plate (232) away from the center of the cutting table (1), and the length of the left positioning plate (26) is greater than the length of the right positioning plate (26).

3. A solar photovoltaic panel silicon wafer laser cutting device according to claim 1, characterized in that: The upper cooling device (5) comprises a water tank (51) and a water pump (52) mounted on the top of the gantry (3); the input end of the water pump (52) is in communication with the water tank (51); the output end of the water pump (52) is fixedly connected to a bellows expansion tube (53); the bottom end of the bellows expansion tube (53) passes through the gantry (3) and is fixedly connected to left-right symmetrical water spray heads (54); the two water spray heads (54) are both fixedly connected to corresponding wing plates (43) and are respectively located on the left and right sides of the laser cutting head (41).

4. A solar photovoltaic panel silicon wafer laser cutting device according to claim 1, characterized in that: The lower cooling device (6) comprises a pulley (61) rotatably mounted inside the cutting table (1) in a left-right symmetrical manner, a conveyor belt (62) is connected between the outsides of the two pulleys (61), two conveyor belts (62) are symmetrically arranged front and back, a plurality of water-cooling components (63) are fixedly mounted between the outsides of the two conveyor belts (62) at equal intervals, a driving motor (65) for driving the pulley (61) to rotate is fixedly mounted on the front side of the cutting table (1), and a plurality of support blocks (64) are also fixedly mounted between the outsides of the two conveyor belts (62).

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