A graphene thermal conductive pad and preparation method thereof

Abstract

The present invention discloses a method for preparing a graphene thermally conductive gasket, the preparation process comprising the following steps: forming a plurality of through-holes penetrating the upper and lower surfaces of a multilayer graphene film; immersing the punched multilayer graphene film in a first adhesive and then removing and drying it; rolling the dried multilayer graphene film to reduce its thickness, increase the bonding strength of the internal layers of the film, and improve the density of the film; using a second adhesive to alternately stack and bond the multilayer graphene film and foam to form a whole, pressing, and curing the whole; cutting the cured multilayer graphene film and foam into a plurality of sheets along the height of the stack, with a bevel angle of 50 to 85 degrees; and coating the upper and lower surfaces of the cut sheets with a layer of organic silicon thermally conductive material to obtain a graphene thermally conductive gasket. The present invention also discloses a graphene thermally conductive gasket, which is formed by alternately stacking and bonding a plurality of multilayer graphene films, a polymer layer, and a foam layer arranged in sequence.

Description

Technical Field

[0001] The present invention relates to the technical field of heat conduction and heat dissipation, and in particular to a graphene thermally conductive gasket and a preparation method thereof. Background Art

[0002] With the rapid development of miniaturization, integration, and high-power electronic devices, heat dissipation has become a major bottleneck in microelectronics technology. Thermal interface materials (TIMs) are widely used to fill the air gap at the interface between electronic components and heat sinks, and therefore play a vital role in dissipating heat from electronic components. Advances in electronic technology require the development of high-performance TIMs. Enhancing thermal conductivity is a highly effective method for improving the heat dissipation performance of TIMs. Graphene films, as highly thermally conductive and ultra-flexible materials, hold great promise for development in this field.

[0003] Graphene has excellent thermal conductivity in the two-dimensional plane direction. By bonding and stacking multiple layers of graphene films and cutting them into sheets, a thermal interface material with high longitudinal thermal conductivity can be obtained, such as patent documents CN113147115A and CN113290958A.

[0004] However, while the preparation method disclosed in the aforementioned patent can produce a gasket with a high thermal conductivity, it does not involve methods for improving the bonding strength between graphene layers. Graphene layers are only connected by weak van der Waals forces, which easily leads to delamination and cracking of the resulting thermally conductive gasket. Furthermore, current graphene thermally conductive gaskets often suffer from high hardness and poor compression performance, especially under low stress. Therefore, developing thermally conductive gaskets with high thermal conductivity, high strength, and high compression resilience under low stress is of great significance for achieving efficient heat dissipation.

[0005] The contents of the background technology section are merely the technologies known to the inventors and do not necessarily represent the existing technologies in this field. Summary of the Invention

[0006] In view of the above problems, the present invention provides a method for preparing a graphene thermally conductive gasket, the preparation process comprising the following steps:

[0007] (a) forming a plurality of through holes penetrating the upper and lower surfaces of the multilayer graphene film;

[0008] (b) immersing the punched multilayer graphene film in a first adhesive, and then taking it out and drying it;

[0009] (c) rolling the dried multilayer graphene film; rolling can reduce the thickness of the multilayer graphene film, increase the density of the film, and increase the number of multilayer graphene films per unit area of ​​the thermally conductive gasket, thereby improving the thermal conductivity of the gasket. It can also allow the first adhesive to further diffuse deep into the internal layers between the multilayer graphene film and distribute it evenly. In addition, the first adhesive bonds the internal layers of the multilayer graphene film, thereby improving the bonding strength between the internal layers of the multilayer graphene film.

[0010] (d) using a second adhesive to alternately stack and bond the multi-layer graphene film and the foam to form a whole;

[0011] (e) pressing the whole and solidifying it into a shape;

[0012] (f) The cured multilayer graphene film and foam are beveled along the height of the stack to form a sheet, with a bevel angle of 50 to 85 degrees. The smaller the bevel angle, the better the compression performance; the larger the bevel angle, the better the rebound performance. When the graphene thermal pad is compressed, the internal layers tilt to one side, and the thickness decreases. The bevel angle is the angle between the internal layers of the graphene thermal pad and the cutting surface. The smaller the bevel angle, the more tilted the internal layers, the easier it is to compress, but it is difficult to rebound to the original thickness after compression. Conversely, it is easier to rebound to the original thickness after compression.

[0013] (g) Coating the cut surface of the cut sheet with a layer of organic silicone thermal conductive material to obtain a graphene thermally conductive gasket. The purpose of applying the organic silicone thermal conductive material is to seal the holes exposed on the cut surface by the high compression and resilience layer (i.e., foam) and to improve the surface condition of the gasket and reduce the contact thermal resistance.

[0014] Punching, dipping and rolling the multilayer graphene film can improve the internal interlayer cohesion of the multilayer graphene film.

[0015] Furthermore, the through hole is formed in step (a) by one or more of needle puncture, laser drilling, plasma drilling, and mechanical punching;

[0016] And / or, the thickness of the multilayer graphene film in step (a) is 100 to 1000 μm; wherein the thickness of the multilayer graphene film is preferably 500 to 700 μm;

[0017] And / or, the through-holes in step (a) have a pore diameter of 50 to 1000 μm and a pore pitch of 300 to 1000 μm; wherein the pore diameter is preferably 100 to 500 μm, and the pore pitch is preferably 500 to 800 μm;

[0018] And / or, the through holes in step (a) are uniformly distributed on the multilayer graphene film;

[0019] And / or, the first adhesive in step (b) and the second adhesive in step (d) are one or more of epoxy resin, phenolic resin, furfural resin, polyurethane, acrylic resin, and organic silicone; wherein the first adhesive and the second adhesive are preferably organic silicone; wherein the organic silicone is preferably liquid organic silicone; wherein the liquid organic silicone is one or more of polydimethylcyclosiloxane, polydimethylsiloxane, α,ω-dihydroxypolydimethylsiloxane, polydiphenylsiloxane, α,ω-dihydroxypolymethyl (3,3,3-trifluoropropyl) siloxane, cyanosiloxysilane, and α,ω-diethylpolydimethylsiloxane;

[0020] And / or, in step (b), the viscosity of the first adhesive is 5 to 50 mPa·s, and the immersion time is 10 to 60 min; wherein, the viscosity of the first adhesive is preferably 10 to 30 mPa·s, and the immersion time is preferably 30 to 40 min; if the viscosity of the first adhesive is too high, it is difficult to penetrate into the graphene layers.

[0021] And / or, the multilayer graphene film after dipping in step (b) is dried by natural drying, and the drying time is greater than 10 minutes;

[0022] And / or, the dryness of the multilayer graphene film after dipping in the step (b) is surface drying, but the first adhesive inside the multilayer graphene film keeps moistening; The multilayer graphene film surface is dry, and the multilayer graphene film is adhered to the surface of other objects when rolling. The first adhesive inside the multilayer graphene film keeps moistening and has not yet dried out, and on the one hand, the first adhesive that is dried out and solidified is avoided from affecting the rolling effect, and on the other hand, the first adhesive that has not yet dried out is utilized to bond the internal lamellae of the multilayer graphene film to each other, improves the internal interlayer cohesion of the multilayer graphene film, and improves the bonding strength between the internal lamellae of the multilayer graphene film. In addition, as the solvent evaporates, in the first adhesive drying process, the first adhesive volume originally filled between the internal lamellae of the multilayer graphene film shrinks, and a continuous contact surface is no longer formed between the first adhesive and the internal lamellae of the multilayer graphene film, or the glue layer between the internal lamellae of the multilayer graphene film forms a fault. After rolling, the first adhesive is refilled between the internal layers of the multilayer graphene membrane, forming continuous contact with the internal layers of the multilayer graphene membrane, and bonding the internal layers of the multilayer graphene membrane together. Since part of the solvent has volatilized during the previous drying process, the volume of the first adhesive in the multilayer graphene membrane after rolling is slightly changed after drying, which will not affect the performance of the multilayer graphene membrane.

[0023] In addition, rolling can also drive the first adhesive to flow to the area between the graphene film layers where the first adhesive has not penetrated, so that the first adhesive is evenly distributed between the graphene film layers.

[0024] and / or, in step (c), affixing release films to both sides of the dried multilayer graphene film and then rolling the film;

[0025] And / or, the rolling in step (c) is performed by using an automatic rolling machine; it is convenient to control the thickness of the multilayer graphene film after compression;

[0026] And / or, the thickness of the multilayer graphene film after rolling in step (c) is 90 to 150 μm, preferably 120 to 130 μm; if the thickness of the multilayer graphene film after rolling is less than 90 μm, the multilayer graphene film is prone to severe deformation and cracking; if the thickness is greater than 150 μm, the interlayer bonding strength of the multilayer graphene film is reduced;

[0027] And / or, in step (d), the viscosity of the second adhesive is 5 to 10,000 mPa·s; wherein the viscosity of the second adhesive is preferably 10 to 30 mPa·s;

[0028] And / or, the curing in step (e) is heat curing or room temperature curing;

[0029] The heating curing temperature is below 120°C, preferably below 80°C, and the curing time is greater than 4 hours. If the temperature is higher than 120°C, the curing reaction will be too intense and the product will be prone to cracking.

[0030] And / or, the beveling angle in step (f) is 70 to 80 degrees;

[0031] And / or, the cutting method in step (f) is one of wire cutting, laser cutting, ultrasonic cutting, blade cutting, cryocutting, vibration cutting, and ultrasonic-cryocutting.

[0032] Furthermore, the foam in step (d) is one or more foam materials such as silicone foam, polyethylene foam, polyurethane foam, etc., preferably silicone foam or polyurethane foam;

[0033] And / or, the foam is open-cell foam, closed-cell foam, or a combination of open-cell and closed-cell foam;

[0034] and / or, when the foam is compressed to 60%, the foam compression rebound stress is less than 10 psi;

[0035] And / or, the foam density is 0.1-0.5 g / cm 3 , preferably 0.1 to 0.15 g / cm 3 ;

[0036] And / or, the foam has a thickness of 100 to 1000 μm, preferably 300 to 500 μm.

[0037] If the foam thickness is less than 100μm, the strength is insufficient and it cannot provide sufficient compression rebound performance. If the thickness is greater than 1000μm, the proportion of foam in the thermal gasket is too high and the thermal conductivity is reduced.

[0038] Furthermore, the multilayer graphene film in the thermally conductive gasket accounts for 30wt.% to 70wt.%, the foam in the thermally conductive gasket accounts for 10wt.% to 50wt.%, and the total amount of the first adhesive and the second adhesive in the thermally conductive gasket accounts for 5wt.% to 30wt.%; wherein the multilayer graphene film in the thermally conductive gasket preferably accounts for 50wt.% to 60wt.%, the foam in the thermally conductive gasket preferably accounts for 30wt.% to 40wt.%, and the total amount of the first adhesive and the second adhesive in the thermally conductive gasket preferably accounts for 10wt.% to 20wt.%.

[0039] If the multilayer graphene film accounts for less than 30 wt.%, the thermal conductivity of the thermal gasket is reduced; if the multilayer graphene film accounts for more than 70 wt.%, the compression rebound performance of the thermal gasket is reduced.

[0040] If the foam accounts for less than 10 wt.%, the compression rebound performance of the thermally conductive gasket is reduced; if the foam accounts for more than 50 wt.%, the thermal conductivity of the thermally conductive gasket is reduced.

[0041] If the adhesive accounts for less than 5 wt.%, the thermal pad will easily crack; if the adhesive accounts for more than 30 wt.%, the thermal conductivity of the thermal pad will be reduced.

[0042] Furthermore, the thickness of the graphene thermal conductive gasket is 0.5 to 5 mm, preferably 1 to 3 mm.

[0043] The present invention also discloses a graphene thermally conductive gasket, which is formed by staggered and bonded multi-layer graphene films, polymer layers, and foam layers arranged in sequence.

[0044] Furthermore, the multilayer graphene film is formed with a plurality of through holes penetrating the upper and lower surfaces of the multilayer graphene film, and a first adhesive is distributed between the through holes and the layers of the multilayer graphene film; the polymer layer is composed of a second adhesive;

[0045] And / or, in the graphene thermally conductive gasket, the angle between the stacking planes composed of the multi-layer graphene film, the multi-layer graphene film, the polymer layer and the foam layer is 50 to 85 degrees;

[0046] And / or, the graphene thermal gasket has a compression rate of more than 50% under a pressure of 10 psi, and when the pressure is removed, more than 60% of the compression can rebound.

[0047] Furthermore, the through hole has a diameter of 50 to 1000 μm, preferably 100 to 500 μm;

[0048] and / or, the pore spacing is 300 to 1000 μm, preferably 500 to 800 μm;

[0049] and / or, the bevel angle is 70 to 80 degrees;

[0050] And / or, the multilayer graphene film in the thermally conductive gasket accounts for 30wt.% to 70wt.%, the foam accounts for 10wt.% to 50wt.%, and the total amount of the first adhesive and the second adhesive accounts for 5wt.% to 30wt.%; wherein the multilayer graphene film in the thermally conductive gasket preferably accounts for 50wt.% to 60wt.%, the foam preferably accounts for 30wt.% to 40wt.%, and the total amount of the first adhesive and the second adhesive preferably accounts for 10wt.% to 20wt.%.

[0051] Furthermore, the foam is one or more foam materials such as silicone foam, polyethylene foam, polyurethane foam, etc., preferably silicone foam or polyurethane foam;

[0052] And / or, the foam is open-cell foam, closed-cell foam, or a combination of open-cell and closed-cell foam;

[0053] and / or, when the foam is compressed to 60%, the foam compression rebound stress is less than 10 psi;

[0054] And / or, the foam density is 0.1-0.5 g / cm 3 , preferably 0.1 to 0.15 g / cm 3 ;

[0055] And / or, the foam has a thickness of 100 to 1000 μm, preferably 300 to 500 μm.

[0056] And / or, the first adhesive and the second adhesive are one or more of epoxy resin, phenolic resin, furfural resin, polyurethane, acrylic resin, and organic silicone; wherein, the first adhesive and the second adhesive are preferably organic silicone; wherein, the organic silicone is preferably liquid organic silicone; wherein, the liquid organic silicone is one or more of polydimethylcyclosiloxane, polydimethylsiloxane, α,ω-dihydroxypolydimethylsiloxane, polydiphenylsiloxane, α,ω-dihydroxypolymethyl (3,3,3-trifluoropropyl) siloxane, cyanosiloxysilane, and α,ω-diethylpolydimethylsiloxane;

[0057] Furthermore, the thickness of the graphene thermal conductive gasket is 0.5 to 5 mm, preferably 1 to 3 mm.

[0058] The internal layers of the multilayer graphene film are connected by weak van der Waals forces. When the gasket is made into a multilayer graphene film and is subjected to pressure, the internal layers of the multilayer graphene film are prone to stratification, causing the gasket to crack. The bonding strength between the internal layers can be improved by punching, dipping in glue, and rolling the multilayer graphene film. At the same time, the rolling process can increase the density of the multilayer graphene film and increase the number of multilayer graphene films per unit area of ​​the gasket, thereby improving the thermal conductivity of the gasket.

[0059] Multiple multilayer graphene films are bonded into a whole and then pressed as a whole. This pressing method cannot guarantee the effect of improving the internal bonding force of a single multilayer graphene film. In the present application, after a single multilayer graphene film is dipped in glue, the glue will penetrate into the graphene layers inside the film along the through holes. The glue still has strong viscosity under uncured conditions at room temperature. At this time, the multilayer graphene film is rolled, and the glue between the internal graphene layers will bond the layers together to achieve the purpose of improving the bonding strength between the graphene layers inside the film, thereby solving the problem that the graphene thermal gasket is prone to delamination and cracking; at the same time, rolling the multilayer graphene film can also improve the directional arrangement of the internal layers of the film, increase the density of the film, and thus enhance the thermal conductivity of the gasket per unit area.

[0060] In the present invention:

[0061] 1. Through punching, dipping and rolling treatment, the internal interlayer bonding strength of the multi-layer graphene film is enhanced, solving the delamination and cracking problems of the graphene thermal pad.

[0062] 2. The foam material has excellent compression rebound performance under low stress, which solves the problem that the graphene thermal conductive gasket is difficult to compress under low stress and has high contact thermal resistance.

[0063] 3. The treated multilayer graphene film and foam are easier to combine with adhesives, which can reduce the adhesive content of the graphene thermal pad and improve the thermal conductivity.

[0064] 4. This thermal pad has a high compression rate under low stress and can be used for heat transfer between two interfaces with small pressure and large height difference.

[0065] 5. The graphene thermal pad of the present invention has a uniform thickness of each layer, and the buffering and shock absorbing performance of different positions of the thermal pad is uniform.

[0066] Due to the preparation method of the present invention, the processed multilayer graphene film is not easy to delaminate, which solves the problem of easy cracking of the thermal conductive gasket. The foam layer has good compression rebound performance under low stress. The presence of the foam layer also provides sufficient deformation space for the multilayer graphene film when the gasket is compressed, thereby improving the overall compression rebound performance of the gasket under low stress, thereby obtaining a thermal conductive gasket with complete structure, high thermal conductivity and excellent compression rebound performance.

[0067] This type of thermal pad has a compression rate of more than 50% under a pressure of 10psi. When the pressure is removed, more than 60% of the compression can rebound. BRIEF DESCRIPTION OF THE DRAWINGS

[0068] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:

[0069] Figure 1 This is a three-dimensional schematic diagram of stacked blocks of the graphene thermal conductive gasket of the present invention before cutting;

[0070] Figure 2 Schematic diagram of the graphene thermal pad of the present invention;

[0071] Figure 3 is a cross-sectional view of the graphene thermal pad of the present invention;

[0072] Figure 4 This is a schematic diagram of the structure of the graphene thermal pad of the present invention;

[0073] Figure 5 This is a schematic diagram of the internal layer of the graphene thermal conductive gasket of the present invention tilting to one side when under pressure;

[0074] Figure 6 This is a cross-sectional SEM image of the multilayer graphene film of the present invention. DETAILED DESCRIPTION

[0075] In the following description, only certain exemplary embodiments are briefly described. As will be appreciated by those skilled in the art, the described embodiments may be modified in various ways without departing from the spirit or scope of the present invention. Therefore, the drawings and description are to be regarded as illustrative in nature and not restrictive.

[0076] The preferred embodiments of the present invention are described below with reference to the accompanying drawings. It should be understood that the preferred embodiments described herein are only used to illustrate and explain the present invention, and are not used to limit the present invention.

[0077] In the description of the present invention, it should be understood that terms such as "center," "longitudinal," "transverse," "length," "width," "thickness," "up," "down," "front," "back," "left," "right," "vertical," "horizontal," "top," "bottom," "inside," "outside," "clockwise," and "counterclockwise" are used to indicate positions or relationships based on those shown in the accompanying drawings. These terms are intended solely to facilitate the description of the present invention and simplify the description. They do not indicate or imply that the devices or components referred to must have, be constructed, or operate in a specific orientation, and therefore should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed to indicate or imply relative importance or to implicitly specify the number of the technical features referred to. Thus, features designated "first" or "second" may explicitly or implicitly include one or more of the designated features. In the description of the present invention, "plurality" means two or more, unless otherwise specifically defined.

[0078] The disclosure below provides many different embodiments or examples for implementing the present invention. In order to simplify the disclosure of the present invention, specific examples are described below. Of course, they are merely examples and are not intended to limit the present invention. In addition, the present invention may repeat reference numerals and / or reference letters in different examples. Such repetition is for the purpose of simplicity and clarity and does not in itself indicate the relationship between the various embodiments and / or settings discussed. In addition, the present invention provides examples of various specific processes and materials, but those skilled in the art will recognize the application of other processes and / or the use of other materials.

[0079] The present invention provides a method for preparing a graphene thermally conductive gasket, the preparation process comprising the following steps:

[0080] (a) Forming a plurality of through-holes through the upper and lower surfaces of the multilayer graphene film; the through-holes are formed by one or more of needle puncture, laser drilling, plasma drilling, and mechanical punching. The number of through-holes is determined by the hole diameter and the hole spacing, where the hole diameter is the diameter of the through-holes and the hole spacing is the minimum distance between the edges of two adjacent through-holes. The plurality of through-holes may be arranged in an array or evenly distributed across the multilayer graphene film.

[0081] The multilayer graphene film in the present invention is composed of multiple single-layer graphenes assembled together, and its structure is as follows: Figure 6In some embodiments of the present invention, the thickness of the multilayer graphene film is 100 to 1000 μm, for example, 100 μm, 150 μm, 200 μm, 250 μm, 300 μm, 350 μm, 400 μm, 450 μm, 500 μm, 550 μm, 600 μm, 650 μm, 700 μm, 750 μm, 800 μm, 850 μm, 900 μm, 950 μm, or 1000 μm, wherein the thickness of the multilayer graphene film is preferably 500 to 700 μm.

[0082] In some embodiments of the present invention, the pore size of the through hole is 50 to 1000 μm, for example, 50 μm, 100 μm, 150 μm, 200 μm, 250 μm, 300 μm, 350 μm, 400 μm, 450 μm, 500 μm, 550 μm, 600 μm, 650 μm, 700 μm, 750 μm, 800 μm, 850 μm, 900 μm, 950 μm, 100 0μm; the pore spacing is 300-1000μm, for example, 300μm, 350μm, 400μm, 450μm, 500μm, 550μm, 600μm, 650μm, 700μm, 750μm, 800μm, 850μm, 900μm, 950μm, 1000μm; wherein the pore size is preferably 100-500μm, and the pore spacing is preferably 500-800μm.

[0083] (b) immersing the multilayer graphene film after the above-mentioned punching treatment in a first adhesive, and then taking it out and drying it; the viscosity of the first adhesive is 5 to 50 mPa·s, for example, 5 Pa·s, 10 Pa·s, 15 Pa·s, 20 Pa·s, 25 Pa·s, 30 Pa·s, 35 Pa·s, 40 Pa·s, 45 Pa·s, 50 Pa·s; the immersion time is 10 to 60 min, for example, 10 min, 15 min, 20 min, 25 min, 30 min, 35 min, 40 min, 45 min, 50 min, 55 min, 60 min; preferably, the viscosity of the first adhesive is 10 to 30 mPa·s, and the immersion time is preferably 30 to 40 min.

[0084] Preferably, the multilayer graphene film after dipping is dried naturally, and the drying time is greater than 10 minutes.

[0085] Preferably, the dryness of the multilayer graphene film after dipping is such that the surface is dry, but the first adhesive inside the multilayer graphene film remains moist.

[0086] (c) rolling the dried multilayer graphene film.

[0087] Preferably, release films are attached to both sides of the dried multilayer graphene film and then rolled.

[0088] Preferably, the rolling in step (c) is performed by using an automatic rolling machine, which facilitates controlling the thickness of the multilayer graphene film after compression.

[0089] In some embodiments of the present invention, the thickness of the multilayer graphene film after rolling is 90 to 150 μm, for example, 90 μm, 100 μm, 110 μm, 120 μm, 130 μm, 140 μm, 150 μm, preferably 120 to 130 μm; if the thickness of the multilayer graphene film after rolling is lower than 90 μm, the multilayer graphene film is prone to severe deformation and cracking; if the thickness is higher than 150 μm, the internal interlayer bonding strength of the multilayer graphene film is reduced.

[0090] (d) Use a second adhesive to cross-stack and bond the multi-layer graphene film and foam to form a whole. The viscosity of the second adhesive is 5 to 10,000 mPa·s. The second adhesive can be applied by dipping, that is, the multi-layer graphene film is completely immersed in the glue. In this case, the second adhesive can be the same as the first adhesive; or it can be applied by scraping (coating). The requirement for the viscosity range of the glue during scraping is relatively wide, and the viscosity can be selected from 5 to 10,000 mPa·s. Other coating methods are also applicable to the present invention as long as they can achieve the purpose of gluing.

[0091] (e) Pressing the interlaced and bonded multi-layer graphene film and foam into a block, and curing and forming the block. Figure 1 The curing method is heat curing or room temperature curing. The heat curing temperature is below 120°C, preferably below 80°C, and the curing time is greater than 4 hours. If the temperature is higher than 120°C, the curing reaction is too intense and the product is prone to cracking.

[0092] (f) beveling the solidified multilayer graphene film and foam into a sheet along the stacking height direction, with a beveling angle of 50 to 85 degrees, for example, 50 degrees, 51 degrees, 52 degrees, 53 degrees, 54 degrees, 55 degrees, 56 degrees, 57 degrees, 58 degrees, 59 degrees, 60 degrees, 61 degrees, 62 degrees, 63 degrees, 64 degrees, 65 degrees, 66 degrees, 67 degrees, 68 degrees, 69 degrees, 70 degrees, 71 degrees, 72 degrees, 73 degrees, 74 degrees, 75 degrees, 76 degrees, 77 degrees, 78 degrees, 79 degrees, 80 degrees, 81 degrees, 82 degrees, 83 degrees, 84 degrees, 85 degrees, and preferably a beveling angle of 70 to 80 degrees, such as Figure 4 The cutting method is one of wire cutting, laser cutting, ultrasonic cutting, blade cutting, cryocutting, vibration cutting, and ultrasonic-cryocutting.

[0093] (g) Coating the cut surface of the cut sheet with a layer of organic silicone thermal conductive material to obtain a graphene thermally conductive gasket. The purpose of applying the organic silicone thermal conductive material is to seal the holes exposed on the cut surface by the high compression and resilience layer (i.e., foam) and to improve the surface condition of the gasket and reduce the contact thermal resistance.

[0094] In some embodiments of the present invention, the first adhesive in step (b) and the second adhesive in step (d) are one or more of epoxy resin, phenolic resin, furfural resin, polyurethane, acrylic resin, and organic silicone; wherein the first adhesive and the second adhesive are preferably organic silicone; wherein the organic silicone is preferably liquid organic silicone; wherein the liquid organic silicone is one or more of polydimethylcyclosiloxane, polydimethylsiloxane, α,ω-dihydroxypolydimethylsiloxane, polydiphenylsiloxane, α,ω-dihydroxypolymethyl (3,3,3-trifluoropropyl) siloxane, cyanosiloxysilane, and α,ω-diethylpolydimethylsiloxane.

[0095] In some embodiments of the present invention, the foam in step (d) is one or more foam materials such as silicone foam, polyethylene foam, polyurethane foam, etc., preferably silicone foam or polyurethane foam.

[0096] Furthermore, the foam is open-cell foam, closed-cell foam, or a combination of open-cell and closed-cell foam.

[0097] In some embodiments of the present invention, when the foam is compressed to 60%, the compression rebound stress of the foam is less than 10 psi.

[0098] In some embodiments of the present invention, the foam density is 0.1-0.5 g / cm 3 , for example 0.1 g / cm 3 , 0.2g / cm 3 , 0.3g / cm 3 , 0.4g / cm 3 , 0.5g / cm 3 ; preferably 0.1~0.15g / cm 3 .

[0099] In some embodiments of the present invention, the foam has a thickness of 100 to 1000 μm, for example, 100 μm, 150 μm, 200 μm, 250 μm, 300 μm, 350 μm, 400 μm, 450 μm, 500 μm, 550 μm, 600 μm, 650 μm, 700 μm, 750 μm, 800 μm, 850 μm, 900 μm, 950 μm, 1000 μm; preferably 300 to 500 μm.

[0100] If the foam thickness is less than 100μm, the strength is insufficient and it cannot provide sufficient compression rebound performance. If the thickness is greater than 1000μm, the proportion of foam in the thermal gasket is too high and the thermal conductivity is reduced.

[0101] In some embodiments of the present invention, the multilayer graphene film in the thermal conductive gasket accounts for 30wt.% to 70wt.%, for example, 30wt.%, 35wt.%, 40wt.%, 45wt.%, 50wt.%, 55wt.%, 60wt.%, 65wt.%, and 70wt.%; the foam in the thermal conductive gasket accounts for 10wt.% to 50wt.%, for example, 10wt.%, 15wt.%, 20wt.%, 25wt.%, 30wt.%, 35wt.%, 40wt.%, 45wt. .%, 50wt.%; the total amount of the first adhesive and the second adhesive in the thermally conductive gasket accounts for 5wt.% to 30wt.%, for example, 5wt.%, 10wt.%, 15wt.%, 20wt.%, 25wt.%, 30wt.%; wherein the multilayer graphene film in the thermally conductive gasket preferably accounts for 50wt.% to 60wt.%, the foam in the thermally conductive gasket preferably accounts for 30wt.% to 40wt.%, and the total amount of the first adhesive and the second adhesive in the thermally conductive gasket preferably accounts for 10wt.% to 20wt.%.

[0102] In some embodiments of the present invention, the graphene thermally conductive pad has a thickness of 0.5 to 5 mm, preferably 1 to 3 mm. The thickness is the distance between two cut surfaces of the graphene thermally conductive pad.

[0103] The present invention also discloses a graphene thermal conductive pad, such as Figure 2 and Figure 3 shown.

[0104] Graphene thermal pad structure diagram Figure 4 As shown; the internal layer of the graphene thermal pad tilts to one side when it is under pressure. Figure 5 shown.

[0105] In the following examples, liquid silicone was used as an adhesive to prepare a thermally conductive gasket. The thickness of the slice was 2.1 mm, and its application thermal resistance and compression resilience were tested.

[0106] The preparation process of graphene thermal pad is as follows:

[0107] 1. Forming multiple through-holes penetrating the upper and lower surfaces of the multilayer graphene film by laser drilling or other methods;

[0108] 2. After the multi-layer graphene film after the punching process is immersed in the first adhesive for a certain period of time, it is taken out and naturally dried.

[0109] 3. Attach release films to both sides of the dried multilayer graphene film, and reduce the thickness of the multilayer graphene film by rolling or other methods to increase the bonding strength of the internal layers of the film and improve the density of the film;

[0110] 4. Using a second adhesive to alternately stack and bond the multi-layer graphene film and foam to form a whole;

[0111] 5. After stacking, press into blocks and solidify into shape;

[0112] 6. Cut into several sheets along the stacking height direction, with a bevel angle of 70 degrees;

[0113] 7. Coat the upper and lower surfaces of the cut sheet with a layer of silicone thermal conductive material to seal and fill the holes exposed on the cut surface of the high compression and rebound layer to obtain a graphene thermal conductive gasket.

[0114] The thermal resistance and compression rate of thermal conductive gaskets are tested according to ASTM D5470 at 10 psi.

[0115] The compression rebound performance of the thermal conductive gasket under 60% strain conditions was tested according to ASTM D575.

[0116] The present invention is further illustrated by the following examples and comparative examples.

[0117] Example 1:

[0118] This embodiment shows a graphene thermal conductive gasket, and its preparation process parameters are as follows:

[0119] In this embodiment, the multilayer graphene film accounts for 30 wt.%, the foam accounts for 50 wt.%, and the liquid silicone accounts for 20 wt.%;

[0120] The through-hole diameter is 100 μm and the hole spacing is 500 μm;

[0121] The viscosity of the liquid silicone was 15 mPa·s, and the immersion time was 30 min;

[0122] The thickness of the multilayer graphene film is 600 μm, and the thickness after rolling is 120 μm;

[0123] The foam is polyurethane foam with a density of 0.1g / cm 3 , thickness 450μm;

[0124] The liquid silicone rubber is polydimethylcyclosiloxane, which serves as the first adhesive (impregnation) and the second adhesive (bonding);

[0125] The bonding method is coating bonding;

[0126] Heat curing is adopted, and the curing temperature is 80℃.

[0127] The application performance test results of the samples are shown in Table 1.

[0128] Example 2:

[0129] This embodiment shows a graphene thermal conductive gasket, and its preparation process parameters are as follows:

[0130] In this embodiment, the multilayer graphene film accounts for 40 wt.%, the foam accounts for 50 wt.%, and the liquid silicone accounts for 10 wt.%;

[0131] The through-hole diameter is 300 μm and the hole spacing is 600 μm;

[0132] The viscosity of the liquid silicone was 5 mPa·s, and the immersion time was 60 min;

[0133] The thickness of the multilayer graphene film is 700 μm, and the thickness after rolling is 130 μm;

[0134] The foam is polyurethane foam with a density of 0.15g / cm 3 , thickness 500 μm;

[0135] The liquid silicone rubber is polydimethylcyclosiloxane, which serves as the first adhesive (impregnation) and the second adhesive (bonding);

[0136] The bonding method is coating bonding;

[0137] Heat curing is adopted, and the curing temperature is 80℃.

[0138] The application performance test results of the samples are shown in Table 1.

[0139] Example 3:

[0140] This embodiment shows a graphene thermal conductive gasket, and its preparation process parameters are as follows:

[0141] In this embodiment, the multilayer graphene film accounts for 45 wt.%, the foam accounts for 50 wt.%, and the liquid silicone accounts for 5 wt.%;

[0142] The through-hole diameter is 50 μm and the hole spacing is 300 μm;

[0143] The viscosity of the liquid silicone was 10 mPa·s, and the immersion time was 35 min;

[0144] The thickness of the multilayer graphene film is 500 μm, and the thickness after rolling is 100 μm;

[0145] The foam is polyurethane foam with a density of 0.12g / cm 3 , thickness 300 μm;

[0146] The liquid silicone is α,ω-dihydroxypolydimethylsiloxane, which serves as the first adhesive (impregnation) and the second adhesive (bonding);

[0147] The bonding method is coating bonding;

[0148] Heat curing is adopted, and the curing temperature is 80℃.

[0149] The application performance test results of the samples are shown in Table 1.

[0150] Example 4:

[0151] This embodiment shows a graphene thermal conductive gasket, and its preparation process parameters are as follows:

[0152] In this embodiment, the multilayer graphene film accounts for 45 wt.%, the foam accounts for 40 wt.%, and the liquid silicone accounts for 15 wt.%;

[0153] The through-hole diameter is 500 μm and the hole spacing is 800 μm;

[0154] The viscosity of the liquid silicone was 30 mPa·s, and the immersion time was 10 min;

[0155] The thickness of the multilayer graphene film is 100 μm, and the thickness after rolling is 90 μm;

[0156] The foam is polyurethane foam with a density of 0.1g / cm 3 , thickness 400 μm;

[0157] The liquid silicone rubber is cyanosiloxysilane, which is used as the first adhesive (impregnation) and the second adhesive (bonding); the bonding method is coating bonding;

[0158] Heat curing is adopted, and the curing temperature is 80℃.

[0159] The application performance test results of the samples are shown in Table 1.

[0160] Example 5:

[0161] This embodiment shows a graphene thermal conductive gasket, and its preparation process parameters are as follows:

[0162] In this embodiment, the multilayer graphene film accounts for 50 wt.%, the foam accounts for 35 wt.%, and the liquid silicone accounts for 15 wt.%; the through-hole diameter is 100 μm, and the hole pitch is 500 μm;

[0163] The viscosity of the liquid silicone was 10 mPa·s, and the immersion time was 30 min;

[0164] The thickness of the multilayer graphene film is 600 μm, and the thickness after rolling is 120 μm;

[0165] The foam is polyurethane foam with a density of 0.1g / cm 3 , thickness 400 μm;

[0166] The liquid silicone rubber is cyanosiloxysilane, which is used as the first adhesive (impregnation) and the second adhesive (bonding); the bonding method is coating bonding;

[0167] Heat curing is adopted, and the curing temperature is 80℃.

[0168] The application performance test results of the samples are shown in Table 1.

[0169] Example 6:

[0170] This embodiment shows a graphene thermal conductive gasket, and its preparation process parameters are as follows:

[0171] In this embodiment, the multilayer graphene film accounts for 55 wt.%, the foam accounts for 30 wt.%, and the liquid silicone accounts for 15 wt.%; the through-hole diameter is 100 μm, and the hole pitch is 500 μm;

[0172] The viscosity of the liquid silicone was 10 mPa·s, and the immersion time was 40 min;

[0173] The thickness of the multilayer graphene film is 600 μm, and the thickness after rolling is 120 μm;

[0174] The foam is polyurethane foam with a density of 0.1g / cm 3 , thickness 400 μm;

[0175] The liquid silicone is polydimethylcyclosiloxane, which is used as the first adhesive (impregnation) and the second adhesive (bonding); the bonding method is coating bonding;

[0176] Heat curing is adopted, and the curing temperature is 80℃.

[0177] The application performance test results of the samples are shown in Table 1.

[0178] Example 7:

[0179] This embodiment shows a graphene thermal conductive gasket, and its preparation process parameters are as follows:

[0180] In this embodiment, the multilayer graphene film accounts for 60 wt.%, the foam accounts for 10 wt.%, and the liquid silicone accounts for 30 wt.%; the through hole diameter is 1000 μm, and the hole pitch is 1000 μm;

[0181] The viscosity of the liquid silicone was 50 mPa·s, and the immersion time was 30 min;

[0182] The thickness of the multilayer graphene film is 1000 μm, and the thickness after rolling is 150 μm;

[0183] The foam is polyurethane foam with a density of 0.2g / cm 3 , thickness 100 μm;

[0184] The liquid silicone is polydimethylcyclosiloxane, which is used as the first adhesive (impregnation) and the second adhesive (bonding); the bonding method is coating bonding;

[0185] Heat curing is adopted, and the curing temperature is 80℃.

[0186] The application performance test results of the samples are shown in Table 1.

[0187] Example 8:

[0188] This embodiment shows a graphene thermal conductive gasket, and its preparation process parameters are as follows:

[0189] In this embodiment, the multilayer graphene film accounts for 70 wt.%, the foam accounts for 10 wt.%, and the liquid silicone accounts for 20 wt.%; the through-hole diameter is 300 μm, and the hole pitch is 600 μm;

[0190] The viscosity of the liquid silicone was 10 mPa·s, and the immersion time was 30 min;

[0191] The thickness of the multilayer graphene film is 500 μm, and the thickness after rolling is 125 μm;

[0192] The foam is polyurethane foam with a density of 0.15g / cm 3 , thickness 350μm;

[0193] The liquid silicone is polydimethylcyclosiloxane, which is used as the first adhesive (impregnation) and the second adhesive (bonding); the bonding method is coating bonding;

[0194] Heat curing is adopted, and the curing temperature is 80℃.

[0195] The application performance test results of the samples are shown in Table 1.

[0196] Example 9:

[0197] This embodiment shows a graphene thermal conductive gasket, and its preparation process parameters are as follows:

[0198] In this embodiment, the multilayer graphene film accounts for 45 wt.%, the foam accounts for 50 wt.%, and the liquid silicone accounts for 5 wt.%; the through-hole diameter is 50 μm, and the hole pitch is 300 μm;

[0199] The viscosity of the liquid silicone was 10 mPa·s, and the immersion time was 35 min;

[0200] The thickness of the multilayer graphene film is 500 μm, and the thickness after rolling is 100 μm;

[0201] The foam is silicone foam with a density of 0.5g / cm 3 , thickness 1000 μm;

[0202] The liquid silicone is α,ω-dihydroxypolydimethylsiloxane, which serves as the first adhesive (impregnation) and the second adhesive (bonding);

[0203] The bonding method is coating bonding;

[0204] Heat curing is adopted, and the curing temperature is 80℃.

[0205] The application performance test results of the samples are shown in Table 1.

[0206]

[0207] Comparative Example 1:

[0208] In this comparative example, the multilayer graphene film accounts for 20 wt.%, the foam accounts for 50 wt.%, and the liquid silicone accounts for 30 wt.%;

[0209] The through-hole diameter is 100 μm and the hole spacing is 500 μm;

[0210] The viscosity of the liquid silicone was 10 mPa·s, and the immersion time was 30 min;

[0211] The thickness of the multilayer graphene film is 600 μm, and the thickness after rolling is 120 μm;

[0212] The foam is polyurethane foam with a density of 0.1g / cm 3 , thickness 400 μm;

[0213] The liquid silicone is polydimethylcyclosiloxane, which is used as the first adhesive (impregnation) and the second adhesive (bonding); the bonding method is coating bonding;

[0214] Heat curing is adopted, and the curing temperature is 80℃.

[0215] The application performance test results of the samples are shown in Table 2.

[0216] Comparative Example 2:

[0217] In this comparative example, the multilayer graphene film accounts for 65 wt.%, the foam accounts for 5 wt.%, and the liquid silicone accounts for 30 wt.%; the through-hole diameter is 100 μm, and the pore spacing is 500 μm;

[0218] The viscosity of the liquid silicone was 10 mPa·s, and the immersion time was 30 min;

[0219] The thickness of the multilayer graphene film is 600 μm, and the thickness after rolling is 120 μm;

[0220] The foam is polyurethane foam with a density of 0.1g / cm 3 , thickness 400 μm;

[0221] The liquid silicone is polydimethylcyclosiloxane, which is used as the first adhesive (impregnation) and the second adhesive (bonding); the bonding method is coating bonding;

[0222] Heat curing is adopted, and the curing temperature is 80℃.

[0223] The application performance test results of the samples are shown in Table 2.

[0224] Comparative Example 3:

[0225] In this comparative example, the multilayer graphene film accounts for 40 wt.%, the foam accounts for 20 wt.%, and the liquid silicone accounts for 40 wt.%; the through-hole diameter is 100 μm, and the pore spacing is 500 μm;

[0226] The viscosity of the liquid silicone was 10 mPa·s, and the immersion time was 30 min;

[0227] The thickness of the multilayer graphene film is 600 μm, and the thickness after rolling is 120 μm;

[0228] The foam is polyurethane foam with a density of 0.1g / cm 3 , thickness 400 μm;

[0229] The liquid silicone is polydimethylcyclosiloxane, which is used as the first adhesive (impregnation) and the second adhesive (bonding); the bonding method is coating bonding;

[0230] Heat curing is adopted, and the curing temperature is 80℃.

[0231] The application performance test results of the samples are shown in Table 2.

[0232]

[0233]

[0234] The application performance test results of Comparative Example 1 show that when the multilayer graphene film accounts for 20 wt.% and less than 30 wt.%, the resulting graphene thermal pad achieves an application thermal resistance of 1.890, significantly higher than the highest application thermal resistance of 1.235 in the Example. This indicates that the thermal conductivity of the thermal pad decreases when the multilayer graphene film accounts for less than 30 wt.%.

[0235] The performance test results of Comparative Example 2 show that when the foam content is 5 wt.%, less than 10 wt.%, the resulting graphene thermal pad has a compression rate of only 11% and a rebound rate of only 27%, significantly lower than those in the examples. This indicates that the thermal pad's compression and rebound performance decreases when the foam content is less than 10 wt.%.

[0236] According to the application performance test results of Comparative Example 3, when the liquid silicone accounts for 40wt.%, higher than 30wt.%, the application thermal resistance is 1.546, which is higher than the highest application thermal resistance of 1.235 in the embodiment, and the compression rate and rebound rate are both reduced.

[0237] Although the above disclosed content shows exemplary embodiments of the present invention, it should be noted that, without departing from the scope defined in the claims, various changes and modifications may be made. In addition, although elements of the present invention may be described or required in individual form, it is also conceivable to have multiple elements, unless explicitly limited to a single element.

[0238] Finally, it should be noted that the above descriptions are merely preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art will be able to modify the technical solutions described in the aforementioned embodiments or substitute equivalents for some of the technical features. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention shall be included within the scope of protection of the present invention.

Claims

1. A method for preparing a graphene thermally conductive gasket, characterized in that: The preparation process includes the following steps: (a) forming a plurality of through-holes penetrating the upper and lower surfaces of the multilayer graphene film; (b) immersing the punched multilayer graphene film in a first adhesive, and then removing the film and drying it; (c) Multilayer graphene film after roller drying; (d) using a second adhesive to alternately stack and bond the multi-layer graphene film and foam to form a whole; (e) pressing the whole and curing it into a shape; (f) The solidified multilayer graphene film and foam are cut obliquely along the stacking height direction into sheets, with the bevel angle ranging from 50 to 85 degrees; (g) Coating the cut surface of the cut sheet with a layer of organic silicon thermal conductive material to obtain a graphene thermal conductive gasket, wherein the multilayer graphene film accounts for 30wt.%~70wt.%, the foam accounts for 10wt.%~50wt.%, and the total amount of the first adhesive and the second adhesive accounts for 5wt.%~30wt.%.

2. The method for preparing a graphene thermally conductive gasket according to claim 1, wherein: The through holes are formed in step (a) by one or more of laser drilling, plasma drilling, and mechanical punching; And / or, the thickness of the multilayer graphene film in step (a) is 100-1000 μm; And / or, the through holes in step (a) have a pore diameter of 50-1000 μm and a pore pitch of 300-1000 μm; and / or, the through holes in step (a) are uniformly distributed on the multilayer graphene film; And / or, the first adhesive in step (b) and the second adhesive in step (d) are one or more of epoxy resin, phenolic resin, furfural resin, polyurethane, acrylic resin, and organic silica gel; And / or, in step (b), the viscosity of the first adhesive is 5-50 mPa·s, and the immersion time is 10-60 min; And / or, the multilayer graphene film after dipping in step (b) is dried by natural drying, and the drying time is greater than 10 minutes; and / or, the multilayer graphene film after dipping in step (b) is dried to the extent that the surface is dry, but the first adhesive inside the multilayer graphene film remains moist; and / or, in step (c), affixing release films to both sides of the dried multilayer graphene film and then rolling the film; and / or, the rolling in step (c) is performed by using an automatic roller machine; And / or, the thickness of the multilayer graphene film after rolling in step (c) is 90-150 μm; and / or, the viscosity of the second adhesive in step (d) is 5 to 10,000 mPa·s; And / or, the curing in step (e) is heat curing or room temperature curing; wherein the heat curing temperature is below 120° C. and the curing time is greater than 4 hours; And / or, the beveling angle in step (f) is 70 to 80 degrees; And / or, the cutting method in step (f) is one of wire cutting, laser cutting, blade cutting, cryocutting, vibration cutting, and ultrasonic-cryocutting.

3. The method for preparing the graphene thermally conductive pad according to claim 2, wherein: The thickness of the multilayer graphene film in step (a) is 500-700 μm; And / or, the through holes in step (a) have a pore diameter of 100-500 μm and a pore pitch of 500-800 μm; And / or, the first adhesive in step (b) and the second adhesive in step (d) are organic silicone; And / or, in step (b), the viscosity of the first adhesive is 10-30 mPa·s, and the immersion time is 30-40 min; And / or, the thickness of the multilayer graphene film after rolling in step (c) is 120-130 μm; and / or, the viscosity of the second adhesive in step (d) is 10-30 mPa·s; And / or, the heating and curing temperature in step (e) is below 80°C.

4. The method for preparing the graphene thermally conductive pad according to claim 3, wherein: The organic silica gel is liquid organic silica gel; wherein the liquid organic silica gel is one or more of polydimethylcyclosiloxane, polydimethylsiloxane, α, ω-dihydroxypolydimethylsiloxane, polydiphenylsiloxane, α, ω-dihydroxypolymethyl (3, 3, 3-trifluoropropyl) siloxane, cyanosiloxysilane, and α, ω-diethylpolydimethylsiloxane.

5. The method for preparing a graphene thermally conductive gasket according to claim 1, wherein: The foam in step (d) is one or more of silicone foam, polyethylene foam, and polyurethane foam; And / or, the foam is open-cell foam, closed-cell foam, or a combination of open-cell and closed-cell foam; and / or, when the foam is compressed to 60%, the compression rebound stress of the foam is less than 10 psi; And / or, the foam density is 0.1~0.5g / cm 3 ; And / or, the foam has a thickness of 100-1000 μm.

6. The method for preparing the graphene thermally conductive gasket according to claim 5, characterized in that: The foam in step (d) is silicone foam or polyurethane foam; And / or, the foam density is 0.1~0.15g / cm 3 ; And / or, the foam has a thickness of 300-500 μm.

7. The method for preparing a graphene thermally conductive gasket according to claim 1, wherein: The multilayer graphene film in the thermally conductive gasket accounts for 50wt.%~60wt.%, the foam accounts for 30wt.%~40wt.%, and the total amount of the first adhesive and the second adhesive accounts for 10wt.%~20wt.%.

8. The method for preparing a graphene thermally conductive gasket according to claim 1, wherein: The thickness of the graphene thermal conductive pad is 0.5-5 mm.

9. The method for preparing a graphene thermally conductive gasket according to claim 8, wherein: The thickness of the graphene thermal conductive pad is 1-3 mm.

10. A graphene thermally conductive gasket, characterized in that: The multilayer graphene film is formed by staggered and bonded multilayer graphene films, polymer layers, and foam layers arranged in sequence; the multilayer graphene film is formed with a plurality of through holes penetrating the upper and lower surfaces of the multilayer graphene film, and a first adhesive is distributed in the through holes and between the layers of the multilayer graphene film; the polymer layer is composed of a second adhesive; In the graphene thermally conductive gasket, the angle between the stacking planes composed of the multi-layer graphene film, the multi-layer graphene film, the polymer layer and the foam layer is 50 to 85 degrees; In the thermally conductive gasket, the multilayer graphene film accounts for 30 wt.% to 70 wt.%, the foam accounts for 10 wt.% to 50 wt.%, and the first adhesive and the second adhesive account for a total of 5 wt.% to 30 wt.%; The graphene thermal gasket has a compression rate of more than 50% under a pressure of 10 psi. When the pressure is removed, more than 60% of the compression can rebound.

11. The graphene thermally conductive pad according to claim 10, characterized in that: The through hole has a diameter of 50 to 1000 μm; And / or, the through-holes have a pitch of 300-1000 μm; And / or, the angle between the stacking planes formed by the multilayer graphene film and the multilayer graphene film, the polymer layer and the foam layer is 70 to 80 degrees; And / or, the multilayer graphene film in the thermal conductive gasket accounts for 50wt.%~60wt.%, the foam accounts for 30wt.%~40wt.%, and the total amount of the first adhesive and the second adhesive accounts for 10wt.%~20wt.%.

12. The graphene thermally conductive pad according to claim 11, characterized in that: The through hole has a diameter of 100-500 μm; And / or, the pore distance is 500-800 μm.

13. The graphene thermally conductive pad according to claim 12, characterized in that: The foam is one or more of silicone foam, polyethylene foam, and polyurethane foam; And / or, the foam is open-cell foam, closed-cell foam, or a combination of open-cell and closed-cell foam; and / or, when the foam is compressed to 60%, the compression rebound stress of the foam is less than 10 psi; And / or, the foam density is 0.1~0.5g / cm 3 ; And / or, the foam has a thickness of 100-1000 μm; And / or, the first adhesive and the second adhesive are one or more of epoxy resin, phenolic resin, furfural resin, polyurethane, acrylic resin, and organic silicone.

14. The graphene thermally conductive pad according to claim 13, characterized in that: The foam is silicone foam or polyurethane foam; And / or, the foam density is 0.1~0.15g / cm 3 ; And / or, the foam has a thickness of 300-500 μm; And / or, the first adhesive and the second adhesive are organic silicone.

15. The graphene thermally conductive pad according to claim 14, characterized in that: The organic silica gel is liquid organic silica gel; wherein the liquid organic silica gel is one or more of polydimethylcyclosiloxane, polydimethylsiloxane, α, ω-dihydroxypolydimethylsiloxane, polydiphenylsiloxane, α, ω-dihydroxypolymethyl (3, 3, 3-trifluoropropyl) siloxane, cyanosiloxysilane, and α, ω-diethylpolydimethylsiloxane.

16. The graphene thermally conductive pad according to claim 10, characterized in that: The thickness of the graphene thermal conductive pad is 0.5-5 mm.

17. The graphene thermally conductive pad according to claim 16, characterized in that: The thickness of the graphene thermal conductive pad is 1-3 mm.

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