Unstructured grid combination method and device based on boundary merging

Abstract

The present invention discloses an unstructured grid combination method and device based on boundary merging, comprising: dividing a PCB layout to obtain a plurality of modules; establishing a mapping relationship between each module obtained by division and its own geometric boundary surface; meshing each module according to the geometric boundary surface of each module to generate an unstructured grid unit; based on a boundary merging algorithm, merging the grid units of each module to obtain an unstructured grid. The present invention processes the meshing and boundary merging of each module in parallel in a computer program, greatly improving the efficiency of meshing. In addition, the mesh of each module can be stored in the computer program, which is convenient for separate analysis, greatly improving the efficiency of mesh processing.

Description

Technical Field

[0001] The present invention relates to the field of electronic design automation, and in particular to an unstructured grid combination method and device based on boundary merging. Background Art

[0002] In the field of electronic design automation, electromagnetic simulation based on the finite element method plays a vital role in the design and verification of PCB layout or other models. In the finite element method, structured grids, unstructured grids or hybrid grids are often used to discretize the solution area. The degree of discretization directly affects the accuracy and speed of solving the equation (group). Therefore, how to efficiently and accurately mesh the solution area is the prerequisite for the finite element method to obtain correct simulation results.

[0003] The main meshing algorithms include Delaunay generation method and front-end advancement method. Delaunay generation method is generally used together with point addition insertion method, which uses the properties of inserted points and empty circles to find cavities and construct new mesh units with newly inserted points. Front-end advancement method generally starts from the geometric boundary, and according to the given mesh unit size, it gradually advances into the geometry and generates mesh units.

[0004] The speed of meshing according to the geometric information of the PCB layout is the key to determining the overall simulation efficiency and accuracy. How to improve the efficiency of the meshing algorithm for meshing PCB layouts with huge geometric capacity is also a major problem in simulation analysis of PCB layouts. In addition, if a certain layer or a certain module in the PCB layout is to be simulated and analyzed separately, it is often necessary to re-mesh, which is also an important factor affecting the simulation efficiency. Summary of the invention

[0005] One of the purposes of the embodiments of the present invention is to provide a method and device for combining unstructured grids based on boundary merging, so as to greatly improve the efficiency of grid generation.

[0006] In order to solve the above technical problems, in a first aspect, an embodiment of the present invention provides an unstructured grid combination method based on boundary merging, the method comprising:

[0007] Divide the PCB layout into several modules;

[0008] Establish a mapping relationship between each module obtained by division and its own geometric boundary surface;

[0009] According to the geometric boundary surface of each module, each module is meshed to generate unstructured grid cells;

[0010] Based on the boundary merging algorithm, the grid cells of each module are merged to obtain an unstructured grid.

[0011] Preferably, the PCB layout is divided to obtain a plurality of modules, including but not limited to one or more of the following combinations:

[0012] According to the stacking structure characteristics of the PCB layout, each layer of the PCB layout is divided into a separate module, or grouped according to the connectivity relationship between the components inside the PCB; or grouped according to the physical material properties of the components.

[0013] Preferably, the step of establishing a mapping relationship between each module obtained by division and its own geometric boundary surface specifically includes:

[0014] According to the selected module division method, the geometric boundary surface of each module is calculated, and a mapping relationship between each module and its own geometric boundary surface is established.

[0015] Preferably, the step of performing meshing inside each module according to the geometric boundary surface of each module to generate unstructured mesh units specifically includes:

[0016] According to the calculated geometric boundary surface, the mesh generation algorithm of the front advancing method is used to mesh each module to obtain unstructured grid units.

[0017] Preferably, the step of merging the grid units of each module based on the boundary merging algorithm to obtain the unstructured grid specifically includes:

[0018] S41, if the vertices of the boundary surfaces of adjacent modules overlap, directly merge the repeated vertices of the grid units corresponding to the boundary surfaces;

[0019] S42, if the vertices of the boundary surfaces of adjacent modules do not overlap, first remove the points of the boundary surfaces, and then regenerate the grid units according to the remaining points and the constraint surface, and if the vertices of the boundary surfaces of the regenerated grid units overlap with the vertices of the boundary surfaces of the remaining grid units, directly merge the repeated vertices of the grid units corresponding to the boundary surfaces;

[0020] Preferably, S42 specifically includes:

[0021] S421, finding out the different point sets P of the first module T1 and the second module T2 in the common boundary surface F;

[0022] S422, find out the set T11 of tetrahedrons where all points in the point set P are located in T1;

[0023] S423, find out the set T21 of tetrahedrons where all points in the point set P are located in T2;

[0024] S424, let T12 be the tetrahedron set of T1 minus T11, and T22 be the tetrahedron set of T2 minus T21;

[0025] S425, let F1 be the boundary surface set of T12 and T11, and F2 be the boundary surface set of T22 and T21;

[0026] S426, re-dividing the geometric model composed of F, F1 and F2 into three-dimensional unstructured grids, and obtaining a module after the division is recorded as T3;

[0027] S427, using the overlap of the boundary surface vertices of T12, T3 and T22, the repeated vertices of the grid units corresponding to the boundary surface are merged, that is, the T12, T3 and T22 modules are combined.

[0028] In order to solve the above technical problems, in a second aspect, an embodiment of the present invention provides an unstructured grid combination device based on boundary merging, and the device specifically includes:

[0029] A module division unit is used to divide the PCB layout into several modules;

[0030] A mapping unit, used to establish a mapping relationship between each module obtained by division and its own geometric boundary surface;

[0031] A meshing unit, used for meshing each module according to the geometric boundary surface of each module to generate an unstructured mesh unit;

[0032] The merging unit is used to merge the grid units of each module based on the boundary merging algorithm to obtain an unstructured grid.

[0033] On the other hand, an embodiment of the present invention further provides an electronic device, including a processor and a memory, wherein the memory is used to store a computer program, the computer program includes program instructions, and the processor is configured to call the program instructions to execute the method as described above.

[0034] On the other hand, an embodiment of the present invention further provides a computer-readable storage medium, wherein the computer-readable storage medium stores a computer program, wherein the computer program includes program instructions, and when the program instructions are executed by a processor, the processor executes the method as described above.

[0035] Compared with the prior art, the unstructured grid combination method and device based on boundary merging provided by the embodiment of the present invention has at least the following beneficial effects:

[0036] The present invention analyzes the geometric information of the PCB layout, splits the complete PCB layout into several modules according to certain rules, then divides the grids of each module respectively and calculates the geometric boundaries of each module, finally merges the grids of each module based on a boundary merging algorithm, and combines to generate a two-dimensional or three-dimensional unstructured grid of the entire PCB layout. The grid division and boundary merging of each module are processed in parallel in a computer program, which greatly improves the efficiency of grid division. In addition, the grid of each module can be stored in the computer program, which is convenient for individual analysis, thereby greatly improving the grid processing efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] The preferred implementation modes will be described below in a clear and understandable manner with reference to the accompanying drawings to further illustrate the above-mentioned characteristics, technical features, advantages and implementation methods of the present invention.

[0038] Figure 1 A flowchart of an unstructured grid combination method based on boundary merging according to an embodiment of the present invention;

[0039] Figure 2 This is a schematic diagram of the metal layer grid of a PCB case according to an embodiment of the present invention (top view);

[0040] Figure 3 This is a schematic diagram of the non-metallic layer grid of a PCB case according to an embodiment of the present invention (top view);

[0041] Figure 4 This is a schematic diagram of a grid after the boundaries of a PCB case are consistently merged according to an embodiment of the present invention;

[0042] Figure 5 This is a schematic diagram of the first layer of meshes with inconsistent boundaries in a two-dimensional case according to an embodiment of the present invention;

[0043] Figure 6 This is a schematic diagram of the second layer grid of a two-dimensional case with inconsistent boundaries according to an embodiment of the present invention;

[0044] Figure 7 for Figure 5 and Figure 6 Schematic diagram of non-co-shaped meshes after merging with inconsistent boundaries;

[0045] Figure 8 for Figure 5 Schematic diagram of part of the grid;

[0046] Fig. 9 for Figure 6 Schematic diagram of part of the grid;

[0047] Fig.10 for Figure 5 and Figure 6 Schematic diagram of the geometry dug out with inconsistent boundaries;

[0048] Fig.11 for Fig.10 The initial mesh division diagram of ;

[0049] Fig.12 for Figure 8 , Fig. 9 and Fig.11 Schematic diagram of the mesh after merging according to the boundary consistency;

[0050] Fig.13 for Fig.10 Schematic diagram of the local refined grid;

[0051] Fig.14 for Figure 8 , Fig. 9 and Fig.13 Schematic diagram of the mesh after merging according to boundary consistency. DETAILED DESCRIPTION

[0052] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the specific implementation methods of the present invention will be described below with reference to the accompanying drawings. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings and other implementation methods can be obtained based on these drawings without creative work.

[0053] In order to simplify the drawings, only the parts related to the invention are schematically shown in each figure, and they do not represent the actual structure of the product. In addition, in order to simplify the drawings and facilitate understanding, in some figures, only one of the parts with the same structure or function is schematically drawn or marked. In this article, "one" not only means "only one", but also means "more than one".

[0054] The following mainly takes some specific embodiments as examples to describe in detail the implementation of the technical solution of the present invention.

[0055] like Figure 1 As shown, in order to achieve the purpose of the present invention, an embodiment of the present invention provides an unstructured grid combination method based on boundary merging, which supports two-dimensional / three-dimensional unstructured grid division of the entire PCB.

[0056] An unstructured grid combination method based on boundary merging in an embodiment of the present invention comprises the following steps:

[0057] S1. Divide the PCB layout into several modules;

[0058] S2, establishing a mapping relationship between each module obtained by division and its own geometric boundary surface;

[0059] S3, meshing each module according to the geometric boundary surface of each module to generate unstructured grid cells;

[0060] S4. Based on the boundary merging algorithm, the grid cells of each module are merged to obtain an unstructured grid.

[0061] The embodiment of the present invention analyzes the geometric information of the PCB layout, splits the complete PCB layout into several modules according to certain rules, then divides the grids of each module respectively and calculates the geometric boundaries of each module, and finally merges the grids of each module based on a boundary merging algorithm to generate a two-dimensional or three-dimensional unstructured grid of the entire PCB layout.

[0062] Specifically, preferably, the PCB layout is divided to obtain a plurality of modules, including but not limited to one or more of the following combinations:

[0063] According to the stacking structure characteristics of the PCB layout, each layer of the PCB layout is divided into a separate module, or grouped according to the connectivity relationship between the components inside the PCB; or grouped according to the physical material properties of the components.

[0064] The embodiment of the present invention uses the characteristics of the stacked structure of the PCB layout, and uses each layer of the PCB layout as a separate module for subsequent processing. In addition, the components can be grouped according to the connectivity relationship of the components inside the PCB, or according to the physical material properties of the components.

[0065] Specifically, establish the mapping relationship between each module and its geometric boundary surface:

[0066] It is necessary to calculate the geometric boundary surface of each module according to the selected module grouping rules, and establish a mapping relationship between the module and the geometric boundary surface as the basis for the subsequent merging of the module meshes.

[0067] In particular, based on the independent characteristics of each module, the boundary generation is processed in parallel in the computer program, which greatly improves the efficiency.

[0068] Specifically, preferably, the step of performing meshing inside each module according to the geometric boundary surface of each module to generate unstructured mesh units specifically includes:

[0069] According to the calculated geometric boundary surface, the mesh generation algorithm of the front advancing method is adopted to perform mesh division inside each module to obtain unstructured mesh units.

[0070] In particular, the mesh generation of each module in this process does not interfere with each other, which facilitates parallel processing in the computer program and greatly improves the efficiency of mesh generation.

[0071] Specifically, the grid units of each module are merged based on the boundary merging algorithm to obtain an unstructured grid, which specifically includes:

[0072] S41, if the vertices of the boundary surfaces of adjacent modules overlap, directly merge the repeated vertices of the grid units corresponding to the boundary surfaces;

[0073] S42. If the vertices of the boundary surfaces of adjacent modules do not overlap, first remove the points of the boundary surfaces, and then regenerate the grid units based on the remaining points and the constraint surface. If the vertices of the boundary surfaces of the regenerated grid units overlap with the vertices of the boundary surfaces of the remaining grid units, directly merge the repeated vertices of the grid units corresponding to the boundary surfaces.

[0074] Since the boundary surface is a constraint surface and cannot be destroyed, the boundary surface connects two modules, that is, two meshes. Since the point sets of the boundary surface are different, first remove all the points on the boundary surface, and then regenerate the mesh based on the remaining points and the constraint surface. Since the boundary surface of the regenerated mesh is the same as that of the remaining mesh, it can be combined according to the first method.

[0075] S42 specifically includes:

[0076] S421, finding out the different point sets P of the first module T1 and the second module T2 in the common boundary surface F;

[0077] S422, find out the set T11 of tetrahedrons where all points in the point set P are located in T1;

[0078] S423, find out the set T21 of tetrahedrons where all points in the point set P are located in T2;

[0079] S424, let T12 be the tetrahedron set of T1 minus T11, and T22 be the tetrahedron set of T2 minus T21;

[0080] S425, let F1 be the boundary surface set of T12 and T11, and F2 be the boundary surface set of T22 and T21;

[0081] S426, re-dividing the geometric model composed of F, F1 and F2 into three-dimensional unstructured grids, and obtaining a module after the division is recorded as T3;

[0082] S427, using the overlap of the boundary surface vertices of T12, T3 and T22, the repeated vertices of the grid units corresponding to the boundary surface are merged, that is, the T12, T3 and T22 modules are combined.

[0083] At this point, the boundary surface mesh merging between the two modules is completed.

[0084] In the embodiment of the present invention, in step S1, in a specific embodiment of the present invention, each layer in the PCB layout is treated as a separate module by dividing the PCB layout into modules by layer.

[0085] This embodiment of the present invention makes good use of the geometric characteristics of the PCB layout.

[0086] It should be particularly pointed out that in other embodiments, the components can be grouped according to the connectivity relationship of the components in the PCB layout, according to the physical material properties of the components, or according to user-defined rules, to ultimately obtain a mapping relationship between each module and its own geometric boundary surface.

[0087] It should be noted that different grouping methods will also increase the complexity of geometric processing, so the complexity of geometry should also be considered when grouping, which will greatly affect the overall processing efficiency.

[0088] In another embodiment of the present invention, in step S2, the geometric surface of each device in each layer is calculated in units of layers, and a mapping relationship between the geometric surface and each device is established. Each device is matched with each layer, and a mapping relationship between each layer and all geometric boundary surfaces of the layer is established.

[0089] Since the geometry of the layers is relatively regular, the embodiment of the present invention simplifies each layer into two dimensions during processing, only calculating the lower bottom surface of the layer, and then stretching it along the coordinate axis Z axis to establish the upper bottom surface and side surfaces, which greatly improves the processing efficiency.

[0090] In another embodiment of the present invention, in step S3, taking layers as units and taking the geometric surfaces of devices in each layer as boundaries, a front advancing method is used to generate a grid of the geometric boundary surface, and then unstructured grid units are gradually generated toward the inside of the geometric boundary to generate an unstructured grid of the layer.

[0091] like Figure 2 , Figure 3 FIG. 1 is a schematic diagram of a mesh generated by two adjacent metal layers and a non-metal layer. In particular, the present invention performs parallel processing on the mesh generation of each layer in a computer program, which greatly improves the efficiency of mesh generation.

[0092] In another embodiment of the present invention, in the process of merging the boundary meshes of each module in step S4, only the upper and lower bottom surface meshes of each layer need to be merged.

[0093] This is because in step S3, the same meshing algorithm is used when generating meshes of each layer. When the geometric characteristics of the boundary surface are consistent, the meshes on the boundary surface are completely consistent, which greatly reduces the cost of mesh merging.

[0094] When the boundary grids are consistent, the points, lines, and grid cells in the grids on the corresponding boundary surfaces are removed to complete the merging.

[0095] We illustrate the method using a partial 2D mesh when the boundary mesh is inconsistent:

[0096] like Figure 5 and Figure 6 As shown, they are combined into non-conformal grids to obtain Figure 7 , it can be seen that their common edges have different vertices, which leads to the appearance of non-conformal meshes.

[0097] Remove the meshes where these different vertices are located and get Figure 8 and Fig. 9 of grid.

[0098] Then combine the meshes containing these different vertices and remove the unconstrained edges to get Fig.10 .

[0099] Then Fig.10 Perform constrained Delaunay meshing and obtain Fig.11 .

[0100] Finally Fig.11 , Figure 8 and Fig. 9 The grids are merged according to the consistency of the boundary grids to obtain Fig.12 .

[0101] Since the three-dimensional constrained Delaunay meshing may not be successful for some geometric models, constrained Delaunay meshing is required in the three-dimensional case, which corresponds to Fig.13 , that is, in the two-dimensional case Fig.10 By performing constrained Delaunay mesh subdivision, we get Fig.13 .

[0102] Finally Fig.13 , Figure 8 and Fig. 9 The grids are merged according to the consistency of the boundary grids to obtain Fig.14 .

[0103] At this point, the merging of the grids of each layer of the PCB layout is completed, such as Figure 4 shown.

[0104] In order to solve the above technical problems, in a second aspect, an embodiment of the present invention provides an unstructured grid combination device based on boundary merging, and the device specifically includes:

[0105] A module division unit is used to divide the PCB layout into several modules;

[0106] A mapping unit, used to establish a mapping relationship between each module obtained by division and its own geometric boundary surface;

[0107] A meshing unit, used for meshing each module according to the geometric boundary surface of each module to generate an unstructured mesh unit;

[0108] The merging unit is used to merge the grid units of each module based on the boundary merging algorithm to obtain an unstructured grid.

[0109] An electronic device provided in an embodiment of the present application includes a processor 1001 and a memory 1002. The processor 1001 and the memory 1002 can be interconnected via a communication bus 1003. The communication bus 1003 can be a Peripheral Component Interconnect (PCI) bus or an Extended Industry Standard Architecture (EISA) bus, etc. The communication bus 1003 can be divided into an address bus, a data bus, a control bus, etc. For ease of representation, the memory 1002 is used to store a computer program, and the computer program includes program instructions. The processor 1001 is configured to call the program instructions, and the above program includes a method for executing some or all of the steps in the aforementioned method.

[0110] The processor 1001 may be a general purpose central processing unit (CPU), a microprocessor, an application-specific integrated circuit (ASIC), or one or more integrated circuits for controlling the execution of the above program.

[0111] The memory 1002 may be a read-only memory (ROM) or other types of static storage devices that can store static information and instructions, a random access memory (RAM) or other types of dynamic storage devices that can store information and instructions, or an electrically erasable programmable read-only memory (EEPROM), a compact disc (CD-ROM) or other optical disc storage, optical disc storage (including compressed optical disc, laser disc, optical disc, digital versatile disc, Blu-ray disc, etc.), a magnetic disk storage medium or other magnetic storage device, or any other medium that can be used to carry or store the desired program code in the form of instructions or data structures and can be accessed by a computer, but is not limited thereto. The memory may exist independently and be connected to the processor via a bus. The memory may also be integrated with the processor.

[0112] The electronic device 1000 may further include a communication module 1004 and a display 1005. The communication module 1004 may be connected to the optical tracking device for communication. The communication module 1004 may be a wireless communication module (eg, a WiFi module, a Bluetooth module, etc.) or a wired communication module.

[0113] In addition, the electronic device 1000 may also include common components such as a communication interface (eg, a USB interface, a microphone interface, etc.), an antenna, etc., which will not be described in detail here.

[0114] An embodiment of the present invention also provides a computer-readable storage medium, wherein the computer-readable storage medium stores a computer program for electronic data exchange, and the computer program enables a computer to execute part or all of the steps of any one of the boundary-merging-based unstructured grid combinations recorded in the above method embodiments.

[0115] It should be noted that, for the aforementioned method embodiments, for the sake of simplicity, they are all expressed as a series of action combinations, but those skilled in the art should be aware that the present application is not limited by the described order of actions, because according to the present application, certain steps can be performed in other orders or simultaneously. Secondly, those skilled in the art should also be aware that the embodiments described in the specification are all preferred embodiments, and the actions and modules involved are not necessarily required by the present application.

[0116] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0117] In the several embodiments provided in the present application, it should be understood that the disclosed device can be implemented in other ways. For example, the device embodiments described above are only schematic, such as the division of the units, which is only a logical function division. There may be other division methods in actual implementation, such as multiple units or components can be combined or integrated into another device, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some interfaces, and the indirect coupling or communication connection of devices or units can be electrical or other forms.

[0118] The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0119] In addition, the functional units in the various embodiments of the application may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit. The above-mentioned integrated units may be implemented in the form of hardware or in the form of software program modules.

[0120] If the integrated unit is implemented in the form of a software program module and sold or used as an independent product, it can be stored in a computer-readable memory. Based on this understanding, the technical solution of the present application is essentially or the part that contributes to the prior art or all or part of the technical solution can be embodied in the form of a software product, and the computer software product is stored in a memory, including a number of instructions to enable a computer device (which can be a personal computer, server or network device, etc.) to perform all or part of the steps of the method described in each embodiment of the present application. The aforementioned memory includes: U disk, read-only memory (ROM), random access memory (RAM), mobile hard disk, disk or optical disk and other media that can store program codes.

[0121] A person of ordinary skill in the art can understand that all or part of the steps in the various methods of the above embodiments can be completed by instructing related hardware through a program, and the program can be stored in a computer-readable memory, which can include: a flash drive, a read-only memory, a random access memory, a magnetic disk or an optical disk, etc.

[0122] The embodiments of the present application are introduced in detail above. Specific examples are used in this article to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method and core idea of ​​the present application. At the same time, for general technical personnel in this field, according to the idea of ​​the present application, there will be changes in the specific implementation method and application scope. In summary, the content of this specification should not be understood as a limitation on the present application.

[0123] It should be noted that the above embodiments can be freely combined as needed. The above are only preferred embodiments of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principle of the present invention, and these improvements and modifications should also be regarded as the protection scope of the present invention.

Claims

1. An unstructured grid combination method based on boundary merging, characterized in that: The method comprises: Divide the PCB layout into several modules; Establish a mapping relationship between each module obtained by division and its own geometric boundary surface; According to the geometric boundary surface of each module, each module is meshed to generate unstructured grid cells; Based on the boundary merging algorithm, the grid cells of each module are merged to obtain an unstructured grid, which includes: S41, if the vertices of the boundary surfaces of adjacent modules overlap, directly merge the repeated vertices of the grid units corresponding to the boundary surfaces; S42. If the vertices of the boundary surfaces of adjacent modules do not overlap, first remove the points of the boundary surfaces, and then regenerate the grid units based on the remaining points and the constraint surface. If the vertices of the boundary surfaces of the regenerated grid units overlap with the vertices of the boundary surfaces of the remaining grid units, directly merge the repeated vertices of the grid units corresponding to the boundary surfaces.

2. The unstructured grid combination method based on boundary merging according to claim 1, characterized in that: The PCB layout is divided into several modules, and the module division method among them includes but is not limited to one or more of the following combinations: According to the stacking structure characteristics of the PCB layout, each layer of the PCB layout is divided into a separate module, or grouped according to the connectivity relationship of each device inside the PCB or according to the physical material properties of the device.

3. The unstructured grid combination method based on boundary merging according to claim 2, characterized in that: The mapping relationship between each module obtained by division and its own geometric boundary surface is specifically established as follows: According to the selected module division method, the geometric boundary surface of each module is calculated, and a mapping relationship between each module and its own geometric boundary surface is established.

4. The unstructured grid combination method based on boundary merging according to claim 3, characterized in that: The step of meshing each module according to the geometric boundary surface of each module to generate an unstructured grid unit specifically includes: According to the calculated geometric boundary surface, the mesh generation algorithm of the front advancing method is used to mesh each module to obtain unstructured grid units.

5. The unstructured grid combination method based on boundary merging according to claim 1, characterized in that: S42 specifically includes: S421, finding out the different point sets P of the first module T1 and the second module T2 in the common boundary surface F; S422, find out the set T11 of tetrahedrons where all points in the point set P are located in T1; S423, find out the set T21 of tetrahedrons where all points in the point set P are located in T2; S424, let T12 be the tetrahedron set of T1 minus T11, and T22 be the tetrahedron set of T2 minus T21; S425, let F1 be the boundary surface set of T12 and T11, and F2 be the boundary surface set of T22 and T21; S426, re-dividing the geometric model composed of F, F1 and F2 into three-dimensional unstructured grids, and obtaining a module after the division is recorded as T3; S427, using the overlap of the boundary surface vertices of T12, T3 and T22, the repeated vertices of the grid cells corresponding to the boundary surface are merged, that is, the T12, T3 and T22 modules are combined.

6. An unstructured grid combination device based on boundary merging, characterized in that: The device specifically comprises: A module division unit is used to divide the PCB layout into several modules; A mapping unit, used to establish a mapping relationship between each module obtained by division and its own geometric boundary surface; A meshing unit, used for meshing each module according to the geometric boundary surface of each module to generate an unstructured mesh unit; The merging unit is used to merge the grid cells of each module based on the boundary merging algorithm to obtain an unstructured grid, specifically including: if the vertices of the boundary surfaces of adjacent modules coincide, directly merge the repeated vertices of the grid cells corresponding to the boundary surfaces; if the vertices of the boundary surfaces of adjacent modules do not coincide, first remove the points of the boundary surfaces, and then regenerate the grid cells according to the remaining points and the constraint surface; if the regenerated grid cells coincide with the boundary surface vertices of the remaining grid cells, directly merge the repeated vertices of the grid cells corresponding to the boundary surfaces.

7. An electronic device, characterized in that: The method comprises a processor and a memory, wherein the memory is used to store a computer program, the computer program comprises program instructions, and the processor is configured to call the program instructions to execute the method according to any one of claims 1 to 5.

8. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores a computer program, wherein the computer program includes program instructions, and when the program instructions are executed by a processor, the processor is caused to execute the method according to any one of claims 1 to 5.

Images