A manufacturing method of a mobile phone camera key and a mobile phone camera key

Abstract

The application discloses a manufacturing method of a mobile phone camera button and the mobile phone camera button. The manufacturing method comprises the following steps: providing a substrate; punching the substrate according to a design; and performing a metalization treatment on the substrate, so that each male unit metal conduction layer is communicated with a female unit metal conduction layer through at least one hole metal conduction layer. The substrate is engraved and milled according to the design, so as to form a button PCB. The substrate is punched and the metalization treatment is performed on the substrate to form the button PCB, so that the interaction of the buttons on the mobile phone can be controlled, the manufacturing is easy, the mobile phone can be protected from physical damage and daily wear and tear, the service life of the mobile phone can be prolonged, and the use experience of the user can be improved.

Description

Technical Field

[0001] This application relates to the field of mobile phone camera button technology, and more specifically, to a method for manufacturing a mobile phone camera button and a mobile phone camera button. Background Technology

[0002] The new camera control button on the iPhone 16 series is a notable feature. This button is a touch-sensitive switch with a tap-to-focus feel, utilizing a high-precision pressure sensor for light taps and a capacitive sensor for touch interaction. This means users can control the camera with different pressure levels and gestures, such as tapping to focus, pressing firmly to shoot, sliding to adjust focus, and long-pressing to lock focus and exposure. This design makes operating the camera on the iPhone 16 more convenient and almost imperceptible, reducing the risk of accidental touches, especially in situations requiring quick photo capture, where the button's brilliance is quickly activated.

[0003] Phone cases are an important mobile phone accessory used to protect mobile phones from physical damage and daily wear and tear.

[0004] Currently, to avoid interfering with the operation of the camera control buttons, most existing phone cases cover the back and sides of the phone, leaving the camera control buttons exposed. While this facilitates camera button operation, the protective effect is relatively weak, and it's difficult to effectively protect the camera control buttons. For example, prolonged use may cause wear and tear on the camera control buttons. Therefore, there is a need to create a phone case that specifically protects the camera control buttons.

[0005] Therefore, existing technologies need to be improved. Summary of the Invention

[0006] The purpose of this application is to provide a method for manufacturing a mobile phone camera button and a mobile phone camera button, aiming to solve the technical problem of how to manufacture a camera control button for a mobile phone case in the prior art.

[0007] To achieve the above objectives, the technical solution adopted in this application is as follows:

[0008] In a first aspect, this application provides a method for manufacturing a mobile phone camera button, wherein the method includes the following steps:

[0009] A substrate is provided, and holes are drilled in the substrate according to a design to form a plurality of through holes on the substrate;

[0010] metallizing the substrate to form a plurality of male metal conductive layers in a straight line on the front side of the substrate, a plurality of female metal conductive layers in a straight line on the back side of the substrate, and a metal conductive layer in the hole of the through hole, and each of the male metal conductive layers is in communication with the female metal conductive layer through at least one of the metal conductive layers in the hole;

[0011] engraving the substrate according to the design to form a key PCB, and the key PCB has a plurality of the male metal conductive layers in a straight line and a plurality of the female metal conductive layers in a straight line.

[0012] In one embodiment, the step of providing a substrate and punching the substrate according to the design to form a plurality of through holes includes:

[0013] providing a glass fiber plate and punching the glass fiber plate according to the design to form a plurality of through holes on the glass fiber plate.

[0014] In one embodiment, the step of metallizing the substrate to form a plurality of male metal conductive layers in a straight line on the front side of the substrate, a plurality of female metal conductive layers in a straight line on the back side of the substrate, and a metal conductive layer in the hole of the through hole, and each of the male metal conductive layers is in communication with the female metal conductive layer through at least one of the metal conductive layers in the hole includes:

[0015] electroplating the glass fiber plate to form a first metal conductive layer on the front side of the glass fiber plate, a second metal conductive layer on the back side of the glass fiber plate, and a metal conductive layer in the hole of the through hole, and the first metal conductive layer is in communication with the second metal conductive layer through the metal conductive layer in the hole;

[0016] etching the first metal conductive layer according to the design to form a plurality of male metal conductive layers in a straight line;

[0017] etching the second metal conductive layer according to the design to form a plurality of female metal conductive layers in a straight line, and each of the male metal conductive layers is in communication with the female metal conductive layer through a plurality of the metal conductive layers in the hole.

[0018] In one embodiment, the step of providing a substrate and punching the substrate according to the design to form a plurality of through holes includes:

[0019] providing a copper-coated PCB and punching the copper-coated PCB according to the design to form a plurality of through holes.

[0020] In one embodiment, the step of subjecting the substrate to a metallization process to form a plurality of male unit metal conductive layers arranged in a straight line on the front side of the substrate, a plurality of female unit metal conductive layers arranged in a straight line on the back side of the substrate, and a plurality of via metal conductive layers formed by the through holes, and each of the male unit metal conductive layers being in communication with the female unit metal conductive layers through at least one of the via metal conductive layers comprises:

[0021] etching the front side of the copper-clad PCB according to a design to form a plurality of male unit patterns arranged in a straight line on the front side of the copper-clad PCB;

[0022] etching the back side of the copper-clad PCB according to a design to form a plurality of female unit patterns arranged in a straight line on the back side of the copper-clad PCB;

[0023] subjecting the copper-clad PCB to an electroplating process to form a plurality of the male unit metal conductive layers arranged in a straight line from the plurality of the male unit patterns arranged in a straight line, a plurality of the female unit metal conductive layers arranged in a straight line from the plurality of the female unit patterns arranged in a straight line, and the plurality of via metal conductive layers formed by the through holes, and each of the male unit metal conductive layers being in communication with the female unit metal conductive layers through at least one of the via metal conductive layers.

[0024] In one embodiment, the step of providing a substrate and punching the substrate according to a design to form a plurality of through holes on the substrate comprises:

[0025] The diameter of the through holes is 0.3-1.0 mm.

[0026] In one embodiment, the distance between two adjacent male unit metal conductive layers is 0.1-2 mm.

[0027] In one embodiment, the method further comprises:

[0028] providing a silica gel base and bonding the silica gel base to the key PCB;

[0029] providing a glass sheet and bonding the glass sheet to the outer surface of the key PCB.

[0030] In one embodiment, the step of providing a silica gel base and bonding the silica gel base to the key PCB comprises:

[0031] applying vulcanization glue around the key PCB, and then embedding the key PCB in a silica gel sleeve of the silica gel base, so that the key PCB is fixedly connected to the silica gel sleeve through vulcanization bonding.

[0032] In a second aspect, the application provides a mobile phone camera button, wherein the mobile phone camera button is prepared by the method for manufacturing a mobile phone camera button as described in the above embodiments.

[0033] The method for manufacturing a mobile phone camera button and the mobile phone camera button provided by the application have at least the following beneficial effects:

[0034] The application discloses a method for manufacturing a mobile phone camera button and a mobile phone camera button. The method comprises the following steps: providing a substrate, and punching the substrate according to a design to form a plurality of through holes on the substrate; performing a metalization treatment on the substrate to form a plurality of male unit metal conductive layers arranged in a straight line on the front surface of the substrate, a plurality of female unit metal conductive layers arranged in a straight line on the back surface of the substrate, and a hole metal conductive layer in each through hole, and each male unit metal conductive layer is in communication with the female unit metal conductive layer through at least one hole metal conductive layer; and performing engraving and milling on the substrate according to a design to form a key PCB, and the key PCB has a plurality of male unit metal conductive layers arranged in a straight line and a plurality of female unit metal conductive layers arranged in a straight line. The substrate is punched, and the substrate is subjected to a metalization treatment to form a key PCB, so that the interaction of the camera button on the mobile phone can be controlled, the manufacturing is easy, the mobile phone can be protected from physical damage and daily wear and tear, the service life of the mobile phone can be prolonged, and the user experience can be improved. BRIEF DESCRIPTION OF DRAWINGS

[0035] In order to more clearly illustrate the technical solutions in the embodiments of the application, the following will briefly introduce the drawings needed to be used in the embodiments or prior art description. Obviously, the drawings in the following description only some embodiments of the application, and for those skilled in the art, other drawings can also be obtained without creative labor on the basis of these drawings.

[0036] Figure 1 The manufacturing process diagram of the mobile phone camera button provided by the embodiment of the application;

[0037] Figure 2 The manufacturing process diagram of the key PCB provided by the embodiment of the application;

[0038] Figure 3 The assembly process diagram of the key PCB and the silica gel base provided by the embodiment of the application;

[0039] Figure 4 The connection structure schematic diagram of the specific embodiment of the key PCB and the silica gel base provided by the embodiment of the application;

[0040] Figure 5 A flow chart of manufacturing a key PCB board by using a glass plate is provided in the embodiment of the present application.

[0041] Figure 6 A flow chart of manufacturing a key PCB board by using a copper-coated PCB board is provided in the embodiment of the present application.

[0042] In the drawings, the reference signs are as follows:

[0043] 100, key PCB board; 200, silica gel base; 300, support frame; 400, glass sheet; 500, substrate; 600, male unit metal conductive layer; 700, female unit metal conductive layer; 510, through hole. DETAILED DESCRIPTION

[0044] In order to make the technical problems, technical solutions and beneficial effects of the present application clearer, the present application will be further described in detail below in combination with the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and not to limit the present application.

[0045] It should be noted that when a component is referred to as "fixed to" or "disposed on" another component, it can be directly or indirectly on the other component. When a component is referred to as "connected to" another component, it can be directly or indirectly connected to the other component. The terms "up", "down", "left", "right", "front", "back", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate the orientation or position based on the orientation or position shown in the drawings, and are only for convenience of description, and cannot be understood as a limitation on the technical solutions. The terms "first", "second" are only for the purpose of convenient description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features. The meaning of "a plurality of" is two or more, unless otherwise specifically limited.

[0046] Embodiment 1

[0047] Please refer to Figure 1 The present embodiment provides a manufacturing method of a mobile phone camera key, wherein the method comprises the following steps:

[0048] S100, providing a substrate 500, and punching the substrate 500 according to the design to form a plurality of through holes 510 on the substrate 500.

[0049] In order to realize the production of the camera button of the mobile phone, the embodiment of the present application provides a substrate 500, and the substrate 500 is punched according to the design, so that a plurality of through holes 510 are formed on the substrate 500, and the through holes 510 mainly play the role of connecting the front surface and the back surface of the substrate 500. For example, the substrate 500 can be punched according to the design, so that a plurality of straightly arranged through holes 510 are formed on the substrate 500, or a plurality of straightly arranged through hole groups are formed on the substrate 500. For example, a plurality of rows of straightly arranged through holes 510 can be formed on the substrate 500, or a plurality of rows of straightly arranged through hole groups can be formed on the substrate 500, and each through hole group is concentrated together, for example, the number of through holes 510 in each through hole group is 3. Wherein, the number of straightly arranged through holes 510 in each row is 6, or the number of straightly arranged through hole groups in each row is 6 groups. It should be understood that the number of straightly arranged through holes 510 in each row is not limited to the above 6 or 6 groups, and the number of straightly arranged through holes 510 in each row can also be other cases, which are not limited here. At the same time, the number of through holes 510 in each through hole group is not limited to the above 3, and the number of through holes 510 in each through hole group can also be other cases, which are not limited here.

[0050] S200, the substrate 500 is subjected to a metalization treatment, so that a plurality of straightly arranged male unit metal conductive layers 600 are formed on the front surface of the substrate 500, a plurality of straightly arranged female unit metal conductive layers 700 are formed on the back surface of the substrate 500, the through holes 510 form hole inner metal conductive layers, and each male unit metal conductive layer 600 is communicated with the female unit metal conductive layer 700 through at least one hole inner metal conductive layer.

[0051] In order to realize the manufacturing of the camera button of the mobile phone, in the embodiment of the present application, the substrate 500 is subjected to metalization treatment to realize that the front surface of the substrate 500 forms a plurality of male unit metal conductive layers 600 arranged in a straight line, the back surface of the substrate 500 forms a plurality of female unit metal conductive layers 700 arranged in a straight line, the through hole 510 forms a hole-in metal conductive layer, and each male unit metal conductive layer 600 is communicated with the female unit metal conductive layer 700 through at least one hole-in metal conductive layer. For example, the substrate 500 can be subjected to copper electroplating treatment, so that the front surface of the substrate 500 forms a plurality of rows of male unit metal conductive layers 600 arranged in a straight line, the back surface of the substrate 500 forms a plurality of rows of female unit metal conductive layers 700 arranged in a straight line, and the through hole 510 of the substrate 500 is also electroplated with a hole-in metal conductive layer. For example, the front surface of the substrate 500 can form 6 segments of male unit metal copper conductive layers arranged at intervals, the back surface of the substrate 500 can form 6 segments of female unit metal copper conductive layers arranged at intervals, the male unit metal copper conductive layers and the female unit metal copper conductive layers are arranged in correspondence with each other from top to bottom, each male unit metal copper conductive layer is communicated with the corresponding female unit metal copper conductive layer through at least one hole-in metal conductive layer, for example, the male unit metal copper conductive layer corresponds to the side pressed by the finger, the female unit metal copper conductive layer corresponds to the side in contact with the camera button of the mobile phone, and the male unit metal copper conductive layer is connected with the female unit metal copper conductive layer through the hole-in metal conductive layer in the through hole 510.

[0052] S400, according to the design, the substrate 500 is subjected to engraving and milling to form the button PCB 100, and the button PCB 100 has a plurality of male unit metal conductive layers 600 arranged in a straight line and a plurality of female unit metal conductive layers 700 arranged in a straight line.

[0053] In order to realize the manufacturing of the camera button of the mobile phone, in the embodiment of the present application, according to the design, the substrate 500 is subjected to engraving and milling to form the button PCB 100. The button PCB 100 acts on the camera button of the mobile phone, for example, the substrate 500 can be subjected to engraving and milling to form a plurality of independent button PCBs 100. Each button PCB 100 that passes the detection can be assembled into the camera button of the mobile phone shell.

[0054] In the prior art, the newly added camera control button of the iPhone 16 series is a touch-sensitive switch with a point-and-click experience, supports a high-precision pressure sensor for light-touch gestures, and provides a capacitive sensor for touch interaction. This means that users can control the camera through different pressing forces and gestures, such as light-touch focusing, force-pressing shooting, sliding to adjust the focal length, long-pressing to lock focus and exposure, etc.

[0055] When the user's hand presses on the camera key of the mobile phone, the static breakdown glass sheet 400 acts on the camera key of the mobile phone through the key PCB plate 100, and realizes the functions of photographing, focusing and sliding distance through sliding and pressing. For example, the camera key of the mobile phone can press the camera key of the mobile phone through the key PCB plate 100, and the camera key of the mobile phone can sense that focusing and photographing can be performed. When the key PCB plate 100 is slid, the camera key of the mobile phone can be operated to realize the functions of zooming in and out.

[0056] In the embodiment, the camera key of the mobile phone can be controlled through the key PCB plate 100, so that the camera key of the mobile phone is protected from physical damage and daily wear and tear.

[0057] Therefore, the embodiment provides a method for manufacturing a camera control key of a mobile phone shell, which can protect the camera control key of the mobile phone, interactively control the camera control key of the mobile phone, protect the mobile phone from physical damage and daily wear and tear, prolong the service life of the mobile phone, and improve the user experience.

[0058] Specifically, referring to Figure 1 , the step S400 can further include the following steps:

[0059] S300, the substrate 500 is subjected to an oxidation prevention treatment, so that the front surface and the back surface of the substrate 500 are provided with an oxidation prevention coating.

[0060] In order to realize the manufacturing of the camera key of the mobile phone, in the embodiment, the substrate 500 is subjected to an oxidation prevention treatment, so that the front surface and the back surface of the substrate 500 are provided with an oxidation prevention coating. For example, after the substrate 500 is subjected to a metallization treatment, the substrate 500 can be subjected to an oxidation prevention treatment, so that the front surface and the back surface of the substrate 500 are provided with a green solder mask protection coating. The green solder mask protection coating has excellent acid and alkali resistance, solvent resistance, high temperature resistance and other properties, and can prevent insulation deterioration and corrosion caused by external environmental factors such as dust and moisture. It can ensure the accuracy and reliability of the circuit on the key PCB plate 100, and can ensure the performance and durability of the camera key of the mobile phone.

[0061] Specifically, referring to Figure 1 , the step S400 can further include the following steps:

[0062] S500, a silica gel base 200 is provided, and the silica gel base 200 is bonded with the key PCB plate 100.

[0063] In order to realize the production of the camera key of the mobile phone, the silicone base 200 is provided and bonded with the key PCB 100. As described above, the camera key of the mobile phone has a pressure sensor, and the silicone base 200 is connected with the key PCB 100, and the key PCB 100 can realize the pressing operation through the elasticity of the silicone base 200 itself. The key PCB 100 can be assembled with the silicone base 200 by bonding, and the silicone base 200 can be installed on the mobile phone shell. When the mobile phone shell is worn on the mobile phone, the camera key of the mobile phone can be controlled by touching or pressing the key PCB 100. For example, the support frame 300 can be embedded in the silicone base 200, and the support frame 300 is used to support the silicone base 200, so that the key PCB 100 realizes the pressing movement. The support frame 300 can be made of a metal frame or a plastic frame.

[0064] S600, a glass sheet 400 is provided and bonded to the outer surface of the key PCB 100.

[0065] In order to realize the production of the camera key of the mobile phone, the glass sheet 400 is provided and bonded to the outer surface of the key PCB 100. For example, after the silicone base 200 is bonded with the key PCB 100, the glass sheet 400 is provided and bonded to the outer surface of the key PCB 100. The glass sheet 400 mainly plays a role in protecting the key PCB 100, which can protect the key PCB 100 from physical damage and daily wear and tear, not only prolonging the service life of the key PCB 100, but also improving the user experience.

[0066] Specifically, please refer to Figure 2 In step S100, the aperture of the through hole 510 can be set to 0.3-1.0mm. It can be understood that the main function of the through hole 510 is to electroplate the hole-in metal conductive layer in the through hole 510, and connect the male unit metal copper conductive layer and the female unit metal copper conductive layer through the hole-in metal conductive layer. The aperture of the through hole 510 is 0.3-1.0mm, which is moderate in size, which can facilitate the electroplating of the hole-in metal conductive layer in the through hole 510, and at the same time does not affect the operation and use of the key PCB 100. Preferably, the aperture of the through hole 510 is 0.3mm, which is reasonable in structure and convenient to operate, and can realize the connection of the male unit metal copper conductive layer and the female unit metal copper conductive layer to realize the interactive control of the key PCB 100.

[0067] Specifically, please refer to Figure 2As shown in It can be understood that the key PCB 100 is provided with a plurality of spaced apart male unit metal conductive layers 600, for example, the key PCB 100 is provided with six spaced apart male unit metal conductive layers 600, wherein the six spaced apart male unit metal conductive layers 600 are mainly used for the interaction of the camera key of the mobile phone. For example, when the key PCB 100 is slid, the sliding action of the camera key of the mobile phone can be operated to control the zooming function of the mobile phone when taking pictures. In this way, the operation of the camera of the mobile phone is sensitive, and the user experience can be improved. Preferably, the spacing between the two adjacent male unit metal conductive layers 600 is 1 mm. In this way, the sensitivity of the key PCB 100 can be high, and the manufacturing is easy. If the spacing between the two adjacent male unit metal conductive layers 600 is too close, the manufacturing is difficult and the cost is high. Preferably, the spacing between the two adjacent female unit metal conductive layers 700 is 1 mm.

[0068] Optionally, the length of the key PCB 100 is 13-18 mm, the width is 1.5-4 mm, and the thickness is 0.8-2.5 mm. The length of the male unit metal conductive layer 600 in the key PCB 100 is 1.5-3.5 mm, and the width is 1.5-3.5 mm. Preferably, the length of the key PCB 100 is 16.4 mm, the width is 2.5 mm, and the thickness is 1.4 mm. The length of the male unit metal conductive layer 600 in the key PCB 100 is 2.45 mm, and the width is 2.3 mm. The reasonable setting can be installed in the mobile phone shell and can be sensitive to operate the camera key of the mobile phone.

[0069] Specifically, please refer to Figure 3 and Figure 4 As shown in

[0070] S510, the key PCB 100 is coated with vulcanized glue around the key PCB 100, and then the key PCB 100 is embedded in the silica gel sleeve of the silica gel base 200, so that the key PCB 100 is fixedly connected with the silica gel sleeve by vulcanization.

[0071] In order to realize the production of the mobile phone camera button, in the embodiment of the application, vulcanizing glue is applied around the button PCB 100, and then the button PCB 100 is embedded in the silica gel sleeve of the silica gel base 200, so that the button PCB 100 is fixedly connected with the silica gel sleeve through vulcanization bonding, the connection is stable, and in the process of pressing the button PCB, the movement of the button PCB can be ensured to be stable, the phenomenon of deviation and misalignment of the button PCB can be prevented, and the camera can be prevented from being operated by mistake. For example, the silica gel sleeve of the silica gel base 200 can be added with a vulcanizing agent, and then the button PCB 100 is embedded in the silica gel sleeve of the silica gel base 200 to form an integral whole, and then the button PCB 100 and the silica gel base 200 are placed in a mold, and then vulcanization fixing is performed under heating conditions, for example, vulcanization fixing can be performed at 120 DEG C to 180 DEG C.

[0072] Embodiment 2

[0073] Specifically, referring to Figure 5 , the step S100 can include the following steps:

[0074] S110, a glass fiber plate is provided, and the glass fiber plate is punched according to the design, so that a plurality of through holes 510 are formed on the glass fiber plate.

[0075] Specifically, the step S200 can include the following steps:

[0076] S211, the glass fiber plate is subjected to electroplating treatment, so that a first metal conductive layer is formed on the front surface of the glass fiber plate, a second metal conductive layer is formed on the back surface of the glass fiber plate, the through hole 510 forms a hole metal conductive layer, and the first metal conductive layer and the second metal conductive layer are communicated through the hole metal conductive layer.

[0077] S212, the first metal conductive layer is etched according to the design, so that a plurality of male unit metal conductive layers 600 arranged in a straight line are formed on the first metal conductive layer.

[0078] S213, the second metal conductive layer is etched according to the design, so that a plurality of female unit metal conductive layers 700 arranged in a straight line are formed on the second metal conductive layer, and each male unit metal conductive layer 600 is communicated with the female unit metal conductive layer 700 through a plurality of hole metal conductive layers.

[0079] In the embodiment, in order to realize the manufacturing of the mobile phone camera button, the button PCB 100 is manufactured by the steps of punching, electroplating and etching of the glass fiber plate. Specifically, a glass fiber plate is provided, and the glass fiber plate is punched according to the design, so that a plurality of through holes 510 are formed on the glass fiber plate. Then, the glass fiber plate can be electroplated, so that a first metal conductive layer is formed on the front surface of the glass fiber plate, a second metal conductive layer is formed on the back surface of the glass fiber plate, and the through holes 510 form hole metal conductive layers. Then, the first metal conductive layer and the second metal conductive layer are etched by an etching process to form a plurality of male unit metal conductive layers 600 arranged in a straight line and a plurality of female unit metal conductive layers 700 arranged in a straight line. For example, a glass fiber plate is provided, and the glass fiber plate is punched according to the design, so that a plurality of through holes 510 are formed on the glass fiber plate. Then, the glass fiber plate can be electroplated with copper, so that a copper metal conductive layer is formed on the front surface and the back surface of the glass fiber plate. Then, the copper metal conductive layer is etched to form 6 sections of copper electroplated layers arranged at intervals, the copper electroplated layers on the front surface of the glass fiber plate and the copper electroplated layers on the back surface of the glass fiber plate are arranged in a one-to-one correspondence, and the copper electroplated layers on the front surface and the copper electroplated layers on the back surface are connected by the electroplated copper in the through holes 510.

[0080] Embodiment 3

[0081] Specifically, referring to Figure 6 , the step S100 can include the following steps:

[0082] S120, a copper-coated PCB plate is provided, and the copper-coated PCB plate is punched according to the design, so that the copper-coated PCB plate forms a plurality of through holes 510.

[0083] Specifically, the step S200 can include the following steps:

[0084] S221, the front surface of the copper-coated PCB plate is etched according to the design, so that the front surface of the copper-coated PCB plate forms a plurality of male unit patterns arranged in a straight line.

[0085] S222, the back surface of the copper-coated PCB plate is etched according to the design, so that the back surface of the copper-coated PCB plate forms a plurality of female unit patterns arranged in a straight line.

[0086] S223, the copper-coated PCB plate is electroplated, so that the plurality of male unit patterns arranged in a straight line form a plurality of male unit metal conductive layers 600 arranged in a straight line, the plurality of female unit patterns arranged in a straight line form a plurality of female unit metal conductive layers 700 arranged in a straight line, the through holes 510 form hole metal conductive layers, and each male unit metal conductive layer 600 is in communication with the female unit metal conductive layer 700 through at least one hole metal conductive layer.

[0087] In the embodiment, in order to realize the manufacturing of the mobile phone camera button, the copper-coated PCB plate is punched, etched and electroplated to manufacture the button PCB plate 100. The copper-coated PCB plate refers to that the front surface and the back surface of the PCB plate are provided with a copper layer, wherein the copper layer is thin, specifically, a copper-coated PCB plate is provided, and the copper-coated PCB plate is punched according to the design, so that the copper-coated PCB plate forms a plurality of through holes 510; then the front surface of the copper-coated PCB plate is etched according to the design, so that the front surface of the copper-coated PCB plate forms a plurality of male unit patterns arranged in a straight line; then the back surface of the copper-coated PCB plate is etched according to the design, so that the back surface of the copper-coated PCB plate forms a plurality of female unit patterns arranged in a straight line; then the copper-coated PCB plate is electroplated, so that the male unit patterns are electroplated to form male unit metal conductive layers 600, and the female unit patterns are electroplated to form female unit metal conductive layers 700, wherein the male unit patterns and the female unit patterns are arranged in a one-to-one correspondence, and the male unit patterns contain at least one through hole 510, and the through hole 510 forms a hole metal conductive layer in the electroplating process, so that the male unit metal conductive layers 600 can be connected to the female unit metal conductive layers 700 through the at least one hole metal conductive layer. In this way, a more fine and precise circuit can be made in the electroplating process, that is, the edge profile of the male unit metal conductive layers 600 and the female unit metal conductive layers 700 is more accurate, and the whole plate electroplating copper is avoided, thereby saving cost.

[0088] Embodiment 4:

[0089] The embodiment provides a mobile phone camera button, wherein the mobile phone camera button is prepared by using the manufacturing method of the mobile phone camera button in the above embodiment.

[0090] In summary, the application discloses a manufacturing method of a mobile phone camera button and the mobile phone camera button, wherein the manufacturing method comprises the following steps: providing a substrate, and punching the substrate according to a design to form a plurality of through holes on the substrate; performing a metalization treatment on the substrate to form a plurality of male unit metal conductive layers arranged in a straight line on the front surface of the substrate, a plurality of female unit metal conductive layers arranged in a straight line on the back surface of the substrate, and a hole metal conductive layer in the through hole, and each male unit metal conductive layer is communicated with the female unit metal conductive layer through at least one hole metal conductive layer; and engraving and milling the substrate according to a design to form a button PCB plate, and the button PCB plate has a plurality of male unit metal conductive layers arranged in a straight line and a plurality of female unit metal conductive layers arranged in a straight line. The substrate is punched, and the metalization treatment is performed on the substrate to form the button PCB plate, so that the interaction control of the mobile phone camera button on the mobile phone can be realized, the manufacturing is easy, the mobile phone can be protected from physical damage and daily wear and tear, the service life of the mobile phone can be prolonged, and the user experience can be improved.

[0091] The above only describes preferred embodiments of the present application and is not used to limit the present application, and any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the protection scope of the present application.

Claims

1. A method for making a camera key for a mobile phone, characterized in that The method comprises the following steps: providing a substrate and punching the substrate according to design to form a plurality of through holes on the substrate; metalizing the substrate to form a plurality of linearly arranged male unit metal conductive layers on the front surface of the substrate, a plurality of linearly arranged female unit metal conductive layers on the back surface of the substrate, and a hole metal conductive layer in each through hole, and each male unit metal conductive layer is in communication with the female unit metal conductive layer through at least one hole metal conductive layer; engraving the substrate according to design to form a key PCB, and the key PCB has a plurality of linearly arranged male unit metal conductive layers and a plurality of linearly arranged female unit metal conductive layers, wherein each key PCB is used to assemble a mobile phone camera key of a mobile phone shell; providing a silica gel base and bonding the silica gel base and the key PCB; providing a glass sheet and bonding the glass sheet to the outer surface of the key PCB; wherein the silica gel base is mounted on the mobile phone shell, the key PCB realizes the pressing operation through the elasticity of the silica gel base itself, when the user's hand presses on the mobile phone camera key, the static electricity breaks through the glass sheet and acts on the camera key of the mobile phone through the key PCB, and the functions of photographing, focusing and sliding distance are realized through sliding and pressing.

2. The method for manufacturing a mobile phone camera button as described in claim 1, characterized in that, The step of providing a substrate and punching the substrate according to design to form a plurality of through holes on the substrate comprises: providing a glass fiber plate and punching the glass fiber plate according to design to form a plurality of through holes on the glass fiber plate.

3. The method for manufacturing a mobile phone camera button as described in claim 2, characterized in that, The step of metalizing the substrate to form a plurality of linearly arranged male unit metal conductive layers on the front surface of the substrate, a plurality of linearly arranged female unit metal conductive layers on the back surface of the substrate, and a hole metal conductive layer in each through hole, and each male unit metal conductive layer is in communication with the female unit metal conductive layer through at least one hole metal conductive layer comprises: electroplating the glass fiber plate to form a first metal conductive layer on the front surface of the glass fiber plate, a second metal conductive layer on the back surface of the glass fiber plate, and a hole metal conductive layer in each through hole, and the first metal conductive layer and the second metal conductive layer are in communication through the hole metal conductive layer; etching the first metal conductive layer according to design to form a plurality of linearly arranged male unit metal conductive layers; etching the second metal conductive layer according to design to form a plurality of linearly arranged female unit metal conductive layers, and each male unit metal conductive layer is in communication with the female unit metal conductive layer through a plurality of hole metal conductive layers.

4. The method of claim 1, wherein the method further comprises: forming a plurality of openings in the first layer of material; and forming a plurality of openings in the second layer of material. The step of providing a substrate and punching the substrate according to design to form a plurality of through holes on the substrate comprises: providing a copper-coated PCB and punching the copper-coated PCB according to design to form a plurality of through holes on the copper-coated PCB.

5. The method of claim 4, wherein the step of forming the camera key comprises the step of: The step of subjecting the substrate to a metallization process to achieve that the front side of the substrate forms a plurality of linearly arranged male unit metal conductive layers, the back side of the substrate forms a plurality of linearly arranged female unit metal conductive layers, the through hole forms an inner hole metal conductive layer, and each of the male unit metal conductive layers is communicated with the female unit metal conductive layer through at least one inner hole metal conductive layer comprises: ​ etching the front side of the copper-coated PCB according to the design, so that the front side of the copper-coated PCB forms a plurality of linearly arranged male unit patterns; etching the back side of the copper-coated PCB according to the design, so that the back side of the copper-coated PCB forms a plurality of linearly arranged female unit patterns; electroplating the copper-coated PCB, so that the plurality of linearly arranged male unit patterns form a plurality of linearly arranged male unit metal conductive layers, the plurality of linearly arranged female unit patterns form a plurality of linearly arranged female unit metal conductive layers, the through hole forms the inner hole metal conductive layer, and each of the male unit metal conductive layers is communicated with the female unit metal conductive layer through at least one inner hole metal conductive layer.

6. The method of claim 1, wherein the method further comprises: forming a plurality of openings in the first layer of material; and forming a plurality of openings in the second layer of material. The step of providing a substrate and punching the substrate according to the design to form a plurality of through holes on the substrate comprises: The aperture of the through hole is 0.3-1.0mm.

7. The method of claim 1, wherein the method further comprises: forming a plurality of openings in the first layer of material; and forming a plurality of openings in the second layer of material. The spacing between two adjacent male unit metal conductive layers is 0.1-2mm.

8. The method of claim 1, wherein the method further comprises: forming a plurality of openings in the first layer of material; and forming a plurality of openings in the second layer of material. The step of providing a silica gel base and bonding the silica gel base with the key PCB comprises: Applying vulcanization glue around the key PCB, and then embedding the key PCB into the silica gel sleeve of the silica gel base, so that the key PCB is fixedly connected with the silica gel sleeve through vulcanization bonding.

9. A mobile phone camera key, characterized in that The mobile phone camera key is prepared by the manufacturing method of the mobile phone camera key according to any one of claims 1-8.

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