A second type of superlattice anti-reflection fixing device and method

Abstract

The present invention discloses a type II superlattice anti-reflection fixing device and method, and relates to the technical field of type II superlattice anti-reflection. The present invention comprises a bottom block, wherein two electric telescopic rods are fixedly installed on the top surface of the bottom block, two U-shaped blocks are fixed on the top surface of the bottom block, vertical columns are fixed on the four sides of the top surface of the bottom block, two positioning holes are provided on the top surfaces of the two U-shaped blocks, alignment plates are placed on the top surfaces of the two U-shaped blocks, alignment columns are fixed on the four sides of the bottom surface of the alignment plate, four alignment columns are installed in the positioning holes of the two U-shaped blocks, a plurality of circular holes are provided on the top surface of the alignment plate, a top plate is placed on the bottom end of the alignment plate, and a plurality of circular blocks are placed on the top surface of the top plate. The present invention limits the chip by the circular rubber ring on the chip slot plate, thereby avoiding the problem that the type II superlattice surface of the chip is offset during movement, resulting in poor film pasting effect on the type II superlattice surface of the chip.

Description

Technical Field

[0001] The present invention relates to the technical field of type II superlattice anti-reflection, and in particular to a type II superlattice anti-reflection fixing device and method. Background Art

[0002] When the infrared signal reaches the type-II superlattice surface of the infrared chip, part of the infrared signal will be reflected by the type-II superlattice surface, causing signal loss and leading to a decrease in the chip detection rate. The type-II superlattice back anti-reflection mainly applies an anti-reflection film on the type-II superlattice surface of the chip to increase the transmittance of light. The type-II superlattice anti-reflection fixing device is to stick the anti-reflection film on the type-II superlattice surface of the chip to reduce infrared reflection and improve the anti-reflection effect.

[0003] Patent No. CN220439566U discloses a wafer LC back film attaching device, including a main workbench and an auxiliary workbench, wherein a feeding assembly and a winding assembly are fixedly installed on both sides of the top of the main workbench, and limiting rollers are fixedly connected to the top of the main workbench and one side of the feeding assembly and the winding assembly. A pre-cutting assembly and a film attaching assembly are arranged side by side on the top of the main workbench and between the two limiting rollers. A waste trough is opened on one side inside the auxiliary workbench, and a material removal table is fixedly connected to the inside of the waste trough. An edge material removal assembly is fixedly installed on one side of the top of the auxiliary workbench. This patent can achieve the effect of complete bonding of the wafer and the LC back film, avoid the generation of wafer edge step difference, improve the strength of the wafer, and effectively reduce the risk of chip damage during subsequent wafer handling and processing.

[0004] However, the current wafer LC back film attaching device has the following problems: when the wafer LC back film attaching device is in use, the second type superlattice surface of the chip is easy to deviate from the position during the chip moving film attaching process, thereby causing the second type superlattice surface of the chip to shift during the movement process, resulting in the problem of poor film attaching effect on the second type superlattice surface of the chip. Therefore, we propose a second type superlattice transmittance fixing device and method. Summary of the invention

[0005] In view of the deficiencies in the prior art, the present invention provides a second type of superlattice anti-reflection fixing device and method, which solves the problems raised in the above background technology.

[0006] To achieve the above objectives, the present invention is implemented through the following technical solutions: a second type of superlattice anti-reflection fixing device, comprising a bottom block, the top surface of the bottom block is fixedly equipped with two electric telescopic rods, the top surface of the bottom block is fixed with two U-shaped blocks, the top surface of the bottom block is fixed with vertical columns on the four sides, the top surfaces of the two U-shaped blocks are each provided with two positioning holes, the top surfaces of the two U-shaped blocks are provided with alignment plates, the four sides of the bottom surface of the alignment plates are fixed with alignment columns, the four alignment columns are installed in the positioning holes of the two U-shaped blocks, the top surface of the alignment plate is provided with a plurality of circular holes, a top plate is placed at the bottom end of the alignment plate, a plurality of round blocks are placed on the top surface of the top plate, the top surfaces of the plurality of round blocks are penetrated and slidably installed with four sliding rods, the outer walls of each of the four sliding rods are slidably installed with a chip slot plate, the top surfaces of the plurality of round blocks are penetrated and slidably installed with four screws, the top surfaces of each of the four screws are penetrated and slidably installed with the bottom surface of the chip slot plate, four springs are fixed to the top surfaces of the plurality of round blocks, and each of the four springs is One end away from the plurality of round blocks is fixed to the bottom surface of the plurality of chip slot plates, and a circular rubber ring is fixed to the inner wall of the plurality of chip slot plates. The circular block is taken out from the alignment plate, and the chip is placed in the circular rubber ring. The chip contacts the circular block to avoid the alignment plate from bumping the photosensitive surface of the chip when the chip is aligned alone. The taken-out circular block can be aligned and fixed in batches, which effectively improves the efficiency. The screw rod is turned to adjust the gap between the chip slot plate and the circular block, so that the chip slot plate can be adjusted in real time according to the thickness of chips in different batches. A pressing plate is fixedly installed on the top surface of the four vertical columns, and a plurality of vertical blocks are fixed on the bottom surface of the pressing plate. Chamfers are set at the bottom of the inner wall of the plurality of vertical blocks, and the chamfers of the plurality of vertical blocks are aligned with the inner wall of the plurality of chip slot plates. Two abutment blocks are fixed on the bottom surface of the top plate. The circular rubber ring on the chip slot plate restricts the chip, and the chip will not deviate from its position in the circular rubber ring, so that the second type superlattice surface of the chip can be accurately affixed with an anti-reflection film, and an extrusion component is set at the top end of the plurality of vertical blocks.

[0007] The extrusion assembly includes a plurality of slide columns, and the plurality of slide columns are slidably mounted on the top of each vertical block. A square plate is fixed to the bottom of the plurality of slide columns, and a second spring is fixed to the top of the plurality of square plates. One end of the second spring away from the plurality of square plates is fixed to the top of each vertical block. Under the elastic force of the second spring, the square plate presses against the anti-reflection film, so that the anti-reflection film is pressed on the surface of the second type superlattice of the chip.

[0008] A stabilizing device is arranged on one side of the two abutting blocks which are away from each other, and a heating device is arranged on the outer wall of the stabilizing device.

[0009] According to the above technical solution, the two U-shaped blocks are located on the side of the two electric telescopic rods away from each other, rubber blocks are provided on the top surfaces of the telescopic ends of the two electric telescopic rods, and circular grooves are provided on the bottom surfaces of the two resisting blocks, and the circular grooves of the two resisting blocks are aligned with the rubber blocks on the top surfaces of the telescopic ends of the two electric telescopic rods.

[0010] According to the above technical scheme, the stabilizing device includes two horizontal plates, two U-shaped frames, six elastic rods, two long strips and two rubber rollers. The two horizontal plates are fixed on the side of the two resistance blocks away from each other, the two U-shaped frames are fixedly installed on the top surface of the bottom block, the outer walls of the two U-shaped frames are each provided with three through holes, the six elastic rods are respectively embedded in the inner walls of the three through holes of the two U-shaped frames, the two long strips are fixed directly opposite the telescopic ends of the six elastic rods, and the two rubber rollers are rotatably installed on the side of the two horizontal plates away from each other. Under the elastic force of the elastic rods, the long strips will press against the rubber rollers to keep the horizontal plate stable during the upward movement. The resistance block is restricted by the horizontal plate, and the top plate on the resistance block will not shake violently during the upward movement.

[0011] According to the above technical solution, the stabilizing device also includes two inverted U-shaped rods, four concave blocks and four spring pieces. The two inverted U-shaped rods penetrate and are fixed on the outer walls of the two horizontal plates. The two inverted U-shaped rods are located on the side where the two U-shaped blocks are away from each other. The four concave blocks are fixed on the top surface of the bottom block. The four spring pieces are fixed on the front and back sides of the inner walls of the four concave blocks. When the chip completes transmittance enhancement, under the action of the elastic force of the spring pieces, the spring pieces support the inverted U-shaped rods, the inverted U-shaped rods support the horizontal plates, the horizontal plates support the push blocks, and the push blocks support the top plate, so that the top plate will not hit the alignment plate during the downward movement of the top plate.

[0012] According to the above technical solution, the two rubber rollers are respectively located on the outer walls of the two long plates, the opposite sides of the two long plates are set as rough surfaces, and the four spring sheets are located on the movement tracks of the two inverted U-shaped rods.

[0013] According to the above technical solution, the heating device includes four L-shaped plates, two strip shells, and two resistance heating rods. The four L-shaped plates are fixed on the outer walls of the two inverted U-shaped rods, and the four L-shaped plates are respectively located on the left and right sides of the alignment plate. The two strip shells are fixed on the outer walls of the four L-shaped plates, and the two strip shells are arranged on the front and back of the alignment plate. The two resistance heating rods are fixedly installed on the left and right sides of the inner walls of the two strip shells. The heat emitted by the resistance heating rods is transferred to the alignment plate, and the alignment plate transfers heat to the chip slot plate, and the chip slot plate transfers heat to the chip and the edge of the anti-reflection film, so that when the anti-reflection film is cut, the edge of the anti-reflection film fits with the second type superlattice surface of the chip.

[0014] According to the above technical solution, the heating device also includes four connecting blocks, four sliding rods, two baffles and four L-shaped short rods. The four connecting blocks are fixed on the bottom surfaces of the two bar shells, the four sliding rods are fixed directly opposite the four connecting blocks, the two baffles are slidably installed on the outer walls of the four sliding rods, the two baffles are located on the front of the two bar shells, the four L-shaped short rods are respectively fixed on both sides of the bottom surfaces of the two baffles, and the ends of the four L-shaped short rods away from the two baffles are fixed on the front and back of the alignment plate. The insulating chamber of the baffle blocks the heat emitted by the resistance heating rod, so that the device can automatically stop heating the chip when the chip transmittance enhancement is completed.

[0015] According to the above technical solution, sliding grooves are provided on both sides of the front sides of the two baffles, the sliding grooves of the two baffles are slidably connected to the outer walls of the four slide bars, and the interiors of the two baffles are provided with heat-insulating chambers.

[0016] A method for using a second type superlattice anti-reflection fixing device comprises the following steps:

[0017] S1. Take the round block out of the alignment board, and place the chip into the circular rubber ring so that the chip contacts the round block to prevent the alignment board from bumping against the second-type superlattice surface of the chip when aligning the chip alone.

[0018] S2. The round blocks taken out are aligned and fixed in batches, which effectively improves the efficiency;

[0019] S3, adjusting the gap between the chip slot plate and the round block, and adjusting the chip slot plate in real time according to the thickness of chips in different batches;

[0020] S4. The circular rubber ring on the chip slot plate restricts the chip so that the chip does not deviate from its position in the circular rubber ring. The anti-reflection film is accurately attached to the second type superlattice surface of the chip.

[0021] S5, the square plate presses against the anti-reflection film, so that the anti-reflection film is pressed against the surface of the second type superlattice of the chip;

[0022] S6. Under the elastic force of the elastic rod, the long strip presses against the rubber roller, so that the horizontal plate remains stable during the upward movement;

[0023] S7, the heat emitted by the resistance heating rod is transferred to the vertical block, the vertical block transfers the heat to the chip slot plate, and the chip slot plate transfers the heat to the chip and the edge of the anti-reflection film;

[0024] S8. When the chip has completed the anti-reflection, the spring sheet supports the inverted U-shaped rod under the action of the elastic force of the spring sheet, so that the top plate does not hit the alignment plate;

[0025] S9. The heat-insulating chamber of the baffle blocks the heat emitted by the resistance heating rod, so that the device automatically stops heating the type II superlattice surface of the chip when the chip is enhanced in transmittance.

[0026] The present invention provides a second type of superlattice anti-reflection fixing device, which has the following beneficial effects:

[0027] (1) The present invention uses an alignment plate, an alignment column, a top plate, a round block, a sliding rod, a chip slot plate, a screw rod, a spring 1, a circular rubber ring, a pressure plate, a vertical block, a stop block, a sliding column, a square plate and a spring 2. The circular rubber ring on the chip slot plate restricts the chip, and the chip will not deviate from its position in the circular rubber ring, so that the photosensitive surface of the chip can be accurately affixed with an anti-reflection film, thereby preventing the second-class superlattice surface of the chip from shifting during the movement of the fixing device when in use, resulting in poor film affixing effect on the second-class superlattice surface of the chip. Moreover, under the elastic force of the spring 2, the square plate abuts against the anti-reflection film, allowing the anti-reflection film to be pressed against the photosensitive surface of the chip, thereby preventing the anti-reflection film from being incompletely affixed to the second-class superlattice surface of the chip when the fixing device is in use, resulting in poor pressing effect.

[0028] (2) The present invention arranges a stabilizing device so that the horizontal plate, U-shaped frame, spring rod, long plate, rubber roller, inverted U-shaped rod and concave block cooperate with the spring sheet. Under the elastic force of the spring rod, the long plate will press against the rubber roller to keep the horizontal plate stable during the upward movement. The push block is restricted by the horizontal plate, and the top plate on the push block will not shake violently during the upward movement, thereby preventing the device from shaking violently when the fixing device is in use, resulting in poor anti-reflection effect of the device. When the chip has completed anti-reflection, under the action of the elastic force of the spring sheet, the spring sheet supports the inverted U-shaped rod, the inverted U-shaped rod supports the horizontal plate, the horizontal plate supports the push block, and the push block supports the top plate, thereby preventing the top plate from hitting the alignment plate during the downward movement, thereby preventing the top plate from hitting the alignment plate when the fixing device is in use, resulting in vibration damage to the type II superlattice surface of the chip in the device.

[0029] (3) The present invention arranges the heating device so that the L-shaped plate, the strip shell, the resistance heating rod, the connecting block, the sliding bar and the baffle cooperate with the L-shaped short bar. The heat emitted by the resistance heating rod is transferred to the alignment plate, the alignment plate transfers the heat to the chip slot plate, and the chip slot plate transfers the heat to the chip and the edge of the anti-reflection film, so that when the anti-reflection film is cut, the edge of the anti-reflection film fits with the chip, preventing the edge of the anti-reflection film from not fitting with the second type superlattice surface of the chip when the fixing device is in use, resulting in poor film laminating effect. In addition, the heat-insulating chamber of the baffle blocks the heat emitted by the resistance heating rod, so that the device can automatically stop heating the chip when the chip anti-reflection is completed, preventing the device from heating the chip for a long time when the fixing device is in use, causing heat damage to the second type superlattice surface of the chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 A schematic diagram of the present invention as a whole;

[0031] Figure 2 It is a cross-sectional schematic diagram of the present invention as a whole;

[0032] Figure 3 It is a cross-sectional schematic diagram of the alignment plate of the present invention;

[0033] Figure 4 For the present invention Figure 3 A partial enlarged cross-sectional schematic diagram at center A;

[0034] Figure 5 For the present invention Figure 3 A partial enlarged schematic diagram of point B in the middle;

[0035] Figure 6 is a cross-sectional schematic diagram of the stabilizing device of the present invention;

[0036] Figure 7 is a cross-sectional schematic diagram of a heating device of the present invention;

[0037] Figure 8 For the present invention Figure 7 A partial enlarged schematic diagram of point C in the middle.

[0038] In the figure: 1. bottom block; 2. electric telescopic rod; 3. U-shaped block; 4. vertical column; 5. alignment plate; 6. stabilizing device; 61. horizontal plate; 62. U-shaped frame; 63. spring rod; 64. long strip plate; 65. rubber roller; 66. inverted U-shaped rod; 67. concave block; 68. spring piece; 7. heating device; 71. L-shaped plate; 72. strip shell; 73. resistance heating rod; 74. connecting block; 75. sliding bar; 76. baffle; 77. L-shaped short rod; 8. alignment column; 9. top plate; 10. round block; 11. sliding rod; 12. chip slot plate; 13. screw; 14. spring one; 15. circular rubber ring; 16. pressure plate; 17. vertical block; 18. resistive block; 19. sliding column; 20. square plate; 21. spring two. DETAILED DESCRIPTION

[0039] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0040] See also Figure 1-Figure 8 , one embodiment of the present invention is: a second-class superlattice anti-reflection fixing device, comprising a bottom block 1, two electric telescopic rods 2 are fixedly installed on the top surface of the bottom block 1, two U-shaped blocks 3 are fixed on the top surface of the bottom block 1, vertical columns 4 are fixed on the four sides of the top surface of the bottom block 1, the two U-shaped blocks 3 are located on the side where the two electric telescopic rods 2 are away from each other, and rubber blocks are arranged on the top surfaces of the telescopic ends of the two electric telescopic rods 2;

[0041] Two positioning holes are provided on the top surfaces of the two U-shaped blocks 3, and alignment plates 5 are placed on the top surfaces of the two U-shaped blocks 3. Alignment columns 8 are fixed on the four sides of the bottom surface of the alignment plates 5, and the four alignment columns 8 are installed in the positioning holes of the two U-shaped blocks 3. A number of circular holes are provided on the top surface of the alignment plate 5, and a top plate 9 is placed on the bottom end of the alignment plate 5. A number of round blocks 10 are placed on the top surface of the top plate 9, and four slide rods 11 are penetrated and slidably installed on the top surfaces of the round blocks 10. A chip slot plate 12 is slidably installed on the outer wall of each of the four slide rods 11. Four screws 13 are penetrated and slidably installed on the top surfaces of the round blocks 10, and each of the four screws 13 is penetrated and rotatably connected with the chip slot plate 12, and the top end of the screw 13 extends and passes through the top of the chip slot plate 12, and four springs 14 are fixed on the top surfaces of the round blocks 10, and one end of each of the four springs 14 away from the round blocks 10 is fixed to the chip slot plates 12 On the bottom surface, a plurality of chip slot plates 12 are fixed with a circular rubber ring 15 on the inner wall, a pressure plate 16 is fixedly installed on the top surface of the four vertical columns 4, a plurality of vertical blocks 17 are fixed on the bottom surface of the pressure plate 16, a plurality of vertical blocks 17 are provided with chamfers on the bottom of the inner wall of the plurality of chip slot plates 12, two abutting blocks 18 are fixed on the bottom surface of the top plate 9, a circular groove is provided on the bottom surface of the two abutting blocks 18, the circular grooves of the two abutting blocks 18 are aligned with the rubber blocks on the top surface of the telescopic end of the two electric telescopic rods 2, during the chamfer cutting process of the vertical blocks 17, the circular rubber ring 15 on the chip slot plate 12 restricts the chip, and the chip will not deviate from the position in the circular rubber ring 15, so that the second type superlattice surface of the chip can be accurately affixed with the anti-reflection film, so as to avoid the second type superlattice surface of the chip being offset during the movement when the fixing device is in use, resulting in poor film affixing effect on the second type superlattice surface of the chip;

[0042] An extrusion assembly is provided at the top of the inner part of the plurality of vertical blocks 17, and the extrusion assembly includes a plurality of slide columns 19, and the plurality of slide columns 19 are slidably installed at the top of the inner part of each vertical block 17, and a square plate 20 is fixed to the bottom surface of the plurality of slide columns 19, and a spring 21 is fixed to the top surface of the plurality of square plates 20, and one end of the plurality of springs 21 away from the plurality of square plates 20 is fixed to the top of the inner part of each vertical block 17. Under the elastic force of the spring 21, the square plate 20 presses against the anti-reflection film, so that the anti-reflection film is pressed on the surface of the second type superlattice of the chip, so as to avoid poor pressing effect caused by incomplete fitting between the anti-reflection film and the second type superlattice surface of the chip when the fixing device is in use.

[0043] When in use, the bottom block 1 supports the electric telescopic rod 2, the bottom block 1 supports the U-shaped block 3, the U-shaped block 3 supports the alignment plate 5, the staff can take the round block 10 out of the alignment plate 5, and place the chip into the circular rubber ring 15. The chip contacts the round block 10 to avoid the alignment plate 5 from bumping against the second type superlattice surface of the chip when it is aligned alone. At the same time, the taken out round blocks 10 can be aligned and fixed in batches, which effectively improves the efficiency. The circular rubber ring 15 is limited by the chip slot plate 12, and the chip slot plate 12 fixes the chip. The staff passes the screw 13 through the top of the chip slot plate 12 to rotate The screw 13 drives the chip slot plate 12 to move downward, and the chip slot plate 12 slides downward on the slide bar 11. The spring 14 on the chip slot plate 12 begins to shrink, narrowing the gap between the chip slot plate 12 and the round block 10, so that the chip slot plate 12 can be adjusted in real time according to the thickness of chips in different batches. Since the chip is easy to deviate from the position during the process of moving the film, the staff will place the round block 10 in the alignment plate 5, place the anti-reflection film on the alignment plate 5, start the electric telescopic rod 2 on the bottom block 1, and the telescopic end of the electric telescopic rod 2 begins to move upward, and the electric telescopic rod 2 is extended and retracted. The rubber block at the telescopic end of the electric telescopic rod 2 contacts the block 18, and the rubber block at the telescopic end of the electric telescopic rod 2 moves upward against the block 18, and the block 18 drives the top plate 9 to move upward, and the top plate 9 moves upward in the alignment plate 5, and the top plate 9 drives the round block 10 to move upward, and the round block 10 moves upward in the round hole of the alignment plate 5, and the round block 10 drives the slide bar 11 to move upward, and the slide bar 11 drives the chip slot plate 12 to move upward, and the chip slot plate 12 drives the circular rubber ring 15 to move upward, and the circular rubber ring 15 drives the chip to move upward, and at the same time, the vertical column 4 supports the pressing plate 16, and the pressing plate 16 supports the vertical block 17, and the core During the upward movement of the chip slot plate 12, the chip slot plate 12 contacts the chamfer of the vertical block 17, and the chamfer of the vertical block 17 cuts the edge of the anti-reflection film. During the chamfer cutting process of the vertical block 17, the circular rubber ring 15 on the chip slot plate 12 restricts the chip so that the chip will not deviate from its position in the circular rubber ring 15, so that the photosensitive surface of the chip can be accurately affixed with the anti-reflection film, preventing the second type superlattice surface of the chip from shifting during movement, thereby avoiding the problem of poor surface film adhesion of the second type superlattice of the chip due to the shift of the second type superlattice surface of the chip during movement when the fixing device is in use.

[0044] When the chip slot plate 12 is in contact with the vertical block 17, the square plate 20 is in contact with the anti-reflection film. Under the action of the squeezing force, the square plate 20 drives the slide column 19 to move upward, and the slide column 19 slides upward in the vertical block 17. The spring 21 on the square plate 20 begins to shrink. Under the elastic force of the spring 21, the square plate 20 is pressed against the anti-reflection film, so that the anti-reflection film is pressed on the surface of the second type superlattice of the chip, thereby preventing the anti-reflection film from being incompletely bonded to the surface of the second type superlattice of the chip when the device is in use, thereby avoiding the problem of poor pressing effect caused by incomplete bonding between the anti-reflection film and the second type superlattice surface of the chip when the fixing device is in use.

[0045] See also Figure 1-Figure 8 On the basis of the above embodiment, in another embodiment of the present invention, a stabilizing device 6 is provided on the side of the two abutting blocks 18 away from each other, and the stabilizing device 6 includes two horizontal plates 61, two U-shaped frames 62, six elastic rods 63, two long strips 64 and two rubber rollers 65. The two horizontal plates 61 are fixed on the side of the two abutting blocks 18 away from each other, and the two U-shaped frames 62 are fixedly installed on the top surface of the bottom block 1. The outer walls of the two U-shaped frames 62 are each provided with three through holes, and the six elastic rods 63 are respectively embedded in the inner walls of the three through holes of the two U-shaped frames 62, and the two long strips 64 are fixed on the six elastic rods 63. Opposite the telescopic end, two rubber rollers 65 are rotatably installed on the side of the two horizontal plates 61 away from each other. The two rubber rollers 65 are respectively located on the outer walls of the two long plates 64. The opposite side of the two long plates 64 is set as a rough surface. Under the elastic force of the elastic rod 63, the long plates 64 will press against the rubber rollers 65 to keep the horizontal plate 61 stable during the upward movement. The stop block 18 is restricted by the horizontal plate 61, and the top plate 9 on the stop block 18 will not shake violently during the upward movement, so as to avoid the poor anti-reflection effect of the equipment caused by the violent shaking of the equipment when the fixing device is in use.

[0046] The stabilizing device 6 also includes two inverted U-shaped rods 66, four recessed blocks 67 and four spring clips 68. The two inverted U-shaped rods 66 penetrate and are fixed on the outer walls of the two horizontal plates 61. The two inverted U-shaped rods 66 are located on the side of the two U-shaped blocks 3 that are away from each other. The four recessed blocks 67 are fixed on the top surface of the bottom block 1. The four spring clips 68 are fixed on the front and back sides of the inner walls of the four recessed blocks 67. The four spring clips 68 are on the movement trajectory of the two inverted U-shaped rods 66. When the chip completes the transmittance enhancement, under the action of the elastic force of the spring clips 68, the spring clips 68 support the inverted U-shaped rods 66, the inverted U-shaped rods 66 support the horizontal plate 61, the horizontal plate 61 supports the stop block 18, and the stop block 18 supports the top plate 9, so that the top plate 9 will not hit the alignment plate 5 during the downward movement of the top plate 9, so as to avoid the top plate 9 hitting the alignment plate 5 when the fixing device is in use, causing the second type of superlattice surface vibration damage in the equipment.

[0047] A heating device 7 is provided on the outer wall of the stabilizing device 6, and the heating device 7 includes four L-shaped plates 71, two strip shells 72, and two resistance heating rods 73. The four L-shaped plates 71 are fixed on the outer walls of the two inverted U-shaped rods 66, and the four L-shaped plates 71 are respectively located on the left and right sides of the alignment plate 5, and the two strip shells 72 are fixed on the outer walls of the four L-shaped plates 71. The two strip shells 72 are arranged on the front and back of the alignment plate 5, and the two resistance heating rods 73 are fixedly installed on the left and right sides of the inner walls of the two strip shells 72. The heat emitted by the resistance heating rods 73 is transferred to the alignment plate 5, and the alignment plate 5 transfers the heat to the chip slot plate 12, and the chip slot plate 12 transfers the heat to the chip and the edge of the anti-reflection film, so that the edge of the anti-reflection film fits with the chip when the anti-reflection film is cut, so as to avoid the edge of the anti-reflection film not fitting with the second type superlattice surface of the chip when the fixing device is in use, resulting in poor film pasting effect.

[0048] The heating device 7 further includes four connecting blocks 74, four sliding bars 75, two baffles 76 and four L-shaped short bars 77. The four connecting blocks 74 are fixed to the bottom surfaces of the two bar shells 72, the four sliding bars 75 are fixed directly opposite the four connecting blocks 74, the two baffles 76 are slidably mounted on the outer walls of the four sliding bars 75, the two baffles 76 are located on the front of the two bar shells 72, the four L-shaped short bars 77 are respectively fixed to both sides of the bottom surfaces of the two baffles 76, and the four L-shaped short bars 77 are away from the two baffles 76. One end is fixed to the front and back of the alignment plate 5, and sliding grooves are provided on both sides of the front of the two baffles 76. The sliding grooves of the two baffles 76 are slidably connected to the outer walls of the four sliding bars 75. The interior of the two baffles 76 is provided with a heat-insulating chamber, and the heat-insulating chamber of the baffle 76 blocks the heat emitted by the resistance heating rod 73, so that the device can automatically stop heating the chip when the chip transmittance is increased, so as to avoid the device heating the second type superlattice surface of the chip for a long time when the fixing device is in use, causing heat damage to the chip.

[0049] A method for using a second type superlattice anti-reflection fixing device comprises the following steps:

[0050] S1, take out the round block 10 from the alignment plate 5, and place the chip into the circular rubber ring 15, so that the chip contacts the round block 10, so as to avoid the alignment plate 5 bumping against the second type superlattice surface of the chip when aligning alone;

[0051] S2, the round blocks 10 taken out are aligned and fixed in batches, which effectively improves the efficiency;

[0052] S3, adjusting the gap between the chip slot plate 12 and the round block 10, and adjusting the chip slot plate 12 in real time according to the thickness of chips in different batches;

[0053] S4, the circular rubber ring 15 on the chip slot plate 12 restricts the chip, the chip does not deviate from the position in the circular rubber ring 15, and the anti-reflection film is accurately attached to the second type superlattice surface of the chip;

[0054] S5, the square plate 20 presses against the anti-reflection film, so that the anti-reflection film is pressed on the surface of the second type superlattice of the chip;

[0055] S6. Under the elastic force of the elastic rod 63, the long strip 64 presses against the rubber roller 65, so that the horizontal plate 61 remains stable during the upward movement;

[0056] S7, the heat emitted by the resistance heating rod 73 is transferred to the vertical block 17, the vertical block 17 transfers the heat to the chip slot plate 12, and the chip slot plate 12 transfers the heat to the chip and the edge of the anti-reflection film;

[0057] S8, when the chip has completed the anti-reflection, under the action of the elastic force of the spring sheet 68, the spring sheet 68 supports the inverted U-shaped rod 66, so that the top plate 9 does not hit the alignment plate 5;

[0058] S9. The heat-insulating chamber of the baffle 76 blocks the heat emitted by the resistance heating rod 73, so that the device automatically stops heating the type II superlattice surface of the chip when the chip is enhanced in transmittance.

[0059] When the stop block 18 moves upward, the stop block 18 drives the cross plate 61 to move upward, and the cross plate 61 drives the rubber roller 65 to move upward. At the same time, the bottom block 1 supports the U-shaped frame 62, the U-shaped frame 62 supports the elastic rod 63, and the elastic rod 63 supports the long plate 64. Under the action of friction, the rubber roller 65 rolls on the long plate 64. Under the elastic force of the elastic rod 63, the long plate 64 will press against the rubber roller 65 to keep the cross plate 61 stable during the upward movement. The stop block 18 is restricted by the cross plate 61, so that the top plate 9 on the stop block 18 will not shake violently during the upward movement, thereby preventing the device from shaking during the upward movement, thereby avoiding the problem of poor transmittance enhancement effect of the device caused by violent shaking of the device when the fixing device is in use.

[0060] When the support block 18 drives the horizontal plate 61 to move upward, the horizontal plate 61 drives the inverted U-shaped rod 66 to move upward. When the chip completes the transmittance enhancement, the horizontal plate 61 drives the inverted U-shaped rod 66 to move downward. At the same time, the bottom block 1 supports the concave block 67, the concave block 67 supports the spring piece 68, and the two ends of the inverted U-shaped rod 66 contact the spring piece 68, which deforms. Under the action of the elastic force of the spring piece 68, the spring piece 68 supports the inverted U-shaped rod 66, and the inverted U-shaped rod 66 supports the horizontal plate 61. The horizontal plate 61 supports the support block 18, and the support block 18 supports the top plate 9, so that the top plate 9 will not hit the alignment plate 5 during the downward movement, thereby preventing the top plate 9 from hitting the alignment plate 5, thereby avoiding the problem of vibration damage to the second type superlattice surface of the chip in the device caused by the top plate 9 hitting the alignment plate 5 when the fixing device is in use.

[0061] While the horizontal plate 61 drives the inverted U-shaped rod 66 to move upward, the inverted U-shaped rod 66 drives the L-shaped plate 71 to move upward, the L-shaped plate 71 drives the strip shell 72 to move upward, the strip shell 72 drives the resistance heating rod 73 to move upward, the resistance heating rod 73 is started, the resistance heating rod 73 begins to heat up, the heat emitted by the resistance heating rod 73 is transferred to the alignment plate 5, the alignment plate 5 transfers the heat to the chip slot plate 12, the chip slot plate 12 transfers the heat to the chip and the edge of the anti-reflection film, so that the edge of the anti-reflection film fits the chip when the anti-reflection film is cut, to prevent the edge of the anti-reflection film from not fitting with the second type superlattice surface of the chip when the equipment is in use, thereby avoiding the problem of poor film bonding effect caused by the edge of the anti-reflection film not fitting with the second type superlattice surface of the chip when the fixing device is in use.

[0062] When the L-shaped plate 71 drives the strip shell 72 to move upward, the strip shell 72 drives the connecting block 74 to move upward, and the connecting block 74 drives the sliding bar 75 to move upward, and the sliding bar 75 slides upward in the sliding groove of the baffle 76. At the same time, the alignment plate 5 supports the L-shaped short rod 77, and the L-shaped short rod 77 supports the baffle 76. When the chip transmittance enhancement is completed, the strip shell 72 drives the connecting block 74 to move downward, and the connecting block 74 drives the sliding bar 75 to move downward, and the sliding bar 75 slides downward in the sliding groove of the baffle 76. The baffle 76 blocks the strip shell 72, so that the heat insulation chamber of the baffle 76 blocks the heat emitted by the resistance heating rod 73, so that the equipment can automatically stop heating the second type superlattice surface of the chip when the chip transmittance enhancement is completed, thereby avoiding the problem of heat damage to the chip caused by the equipment heating the second type superlattice surface of the chip for a long time when the fixing device is in use.

[0063] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A second-class superlattice anti-reflection fixing device, comprising a bottom block (1), two electric telescopic rods (2) are fixedly mounted on the top surface of the bottom block (1), two U-shaped blocks (3) are fixed on the top surface of the bottom block (1), and vertical columns (4) are fixed on four sides of the top surface of the bottom block (1), characterized in that: The top surfaces of the two U-shaped blocks (3) are each provided with two positioning holes, and an alignment plate (5) is placed on the top surfaces of the two U-shaped blocks (3). Alignment columns (8) are fixed on four sides of the bottom surface of the alignment plate (5), and the four alignment columns (8) are installed in the positioning holes of the two U-shaped blocks (3). The top surface of the alignment plate (5) is provided with a plurality of circular holes, and a top plate (9) is placed at the bottom end of the alignment plate (5). A plurality of round blocks (10) are placed on the top surface of the top plate (9), and four sliding rods (11) are penetrated and slidably installed on the top surfaces of the plurality of round blocks (10), and a chip slot plate (12) is slidably installed on the outer wall of each of the four sliding rods (11), and four screws (13) are penetrated and slidably installed on the top surfaces of the plurality of round blocks (10), and each of the four screws (13) is ) penetrates and is rotatably connected to the chip slot plate (12), four springs (14) are fixed on the top surfaces of the plurality of round blocks (10), one end of each of the four springs (14) away from the plurality of round blocks (10) is fixed to the bottom surfaces of the plurality of chip slot plates (12), a circular rubber ring (15) is fixed to the inner walls of the plurality of chip slot plates (12), a pressure plate (16) is fixedly installed on the top surfaces of the four vertical columns (4), a plurality of vertical blocks (17) are fixed to the bottom surface of the pressure plate (16), a chamfer is provided at the bottom of the inner wall of the plurality of vertical blocks (17), the chamfer of the plurality of vertical blocks (17) is aligned with the inner wall of the plurality of chip slot plates (12), two abutment blocks (18) are fixed on the bottom surface of the top plate (9), and an extrusion assembly is provided at the top end of the plurality of vertical blocks (17); The extrusion assembly comprises a plurality of sliding columns (19), wherein the plurality of sliding columns (19) are slidably mounted on the top inner side of each vertical block (17), a square plate (20) is fixed to the bottom surface of the plurality of sliding columns (19), a spring second (21) is fixed to the top surface of the plurality of square plates (20), and one end of the plurality of spring second (21) away from the plurality of square plates (20) is fixed to the top inner side of each vertical block (17); A stabilizing device (6) is provided on one side of the two stop blocks (18) that is away from each other, and a heating device (7) is provided on the outer wall of the stabilizing device (6).

2. A second type superlattice anti-reflection fixing device according to claim 1, characterized in that: The two U-shaped blocks (3) are located on a side of the two electric telescopic rods (2) that is away from each other, and rubber blocks are provided on the top surfaces of the telescopic ends of the two electric telescopic rods (2). Circular grooves are provided on the bottom surfaces of the two stop blocks (18), and the circular grooves of the two stop blocks (18) are aligned with the rubber blocks on the top surfaces of the telescopic ends of the two electric telescopic rods (2).

3. A second type superlattice anti-reflection fixing device according to claim 2, characterized in that: The stabilizing device (6) comprises two horizontal plates (61), two U-shaped frames (62), six elastic rods (63), two long strips (64) and two rubber rollers (65). The two horizontal plates (61) are fixed on the side of the two abutting blocks (18) away from each other. The two U-shaped frames (62) are fixedly mounted on the top surface of the bottom block (1). The outer walls of the two U-shaped frames (62) are each provided with three through holes. The six elastic rods (63) are respectively embedded in the inner walls of the three through holes of the two U-shaped frames (62). The two long strips (64) are fixed directly opposite to the telescopic ends of the six elastic rods (63). The two rubber rollers (65) are rotatably mounted on the side of the two horizontal plates (61) away from each other.

4. A second type superlattice anti-reflection fixing device according to claim 3, characterized in that: The stabilizing device (6) further comprises two inverted U-shaped rods (66), four recessed blocks (67) and four spring sheets (68), the two inverted U-shaped rods (66) passing through and being fixed on the outer walls of the two horizontal plates (61), the two inverted U-shaped rods (66) being located on a side of the two U-shaped blocks (3) that is away from each other, the four recessed blocks (67) being fixed on the top surface of the bottom block (1), and the four spring sheets (68) being fixed on the front and back surfaces of the inner walls of the four recessed blocks (67).

5. A second type superlattice anti-reflection fixing device according to claim 4, characterized in that: The two rubber rollers (65) are respectively located on the outer walls of the two long plates (64); the opposite sides of the two long plates (64) are provided as rough surfaces; and the four spring sheets (68) are located on the movement tracks of the two inverted U-shaped rods (66).

6. A second type superlattice anti-reflection fixing device according to claim 5, characterized in that: The heating device (7) comprises four L-shaped plates (71), two strip shells (72), and two resistance heating rods (73); the four L-shaped plates (71) are fixed on the outer walls of the two inverted U-shaped rods (66); the four L-shaped plates (71) are respectively located on the left and right sides of the alignment plate (5); the two strip shells (72) are fixed on the outer walls of the four L-shaped plates (71); the two strip shells (72) are arranged on the front and back sides of the alignment plate (5); and the two resistance heating rods (73) are fixedly mounted on the left and right sides of the inner walls of the two strip shells (72).

7. A second type superlattice anti-reflection fixing device according to claim 6, characterized in that: The heating device (7) further comprises four connecting blocks (74), four sliding bars (75), two baffles (76) and four L-shaped short bars (77), wherein the four connecting blocks (74) are fixed to the bottom surfaces of the two strip shells (72), the four sliding bars (75) are fixed to the opposite sides of the four connecting blocks (74), the two baffles (76) are slidably mounted on the outer walls of the four sliding bars (75), the two baffles (76) are located on the front sides of the two strip shells (72), the four L-shaped short bars (77) are respectively fixed to the two sides of the bottom surfaces of the two baffles (76), and the ends of the four L-shaped short bars (77) away from the two baffles (76) are fixed to the front and back sides of the alignment plate (5).

8. A second type superlattice anti-reflection fixing device according to claim 7, characterized in that: Slide grooves are provided on both sides of the front of the two baffles (76), the slide grooves of the two baffles (76) are slidably connected to the outer walls of the four slide bars (75), and a heat insulation chamber is provided inside the two baffles (76).

9. A method for using a second-type superlattice anti-reflection fixing device, using the second-type superlattice anti-reflection fixing device according to claim 8, characterized in that: The following steps are involved: S1, taking the round block (10) out of the alignment plate (5), placing the chip into the circular rubber ring (15), so that the chip contacts the round block (10), and preventing the alignment plate (5) from bumping against the second type superlattice surface of the chip when the chip is aligned alone; S2, the round blocks (10) taken out are aligned and fixed in batches, which effectively improves the efficiency; S3, adjusting the gap between the chip slot plate (12) and the round block (10), and adjusting the chip slot plate (12) in real time according to the thickness of chips of different batches; S4, the circular rubber ring (15) on the chip slot plate (12) restrains the chip, the chip does not deviate from its position in the circular rubber ring (15), and the anti-reflection film is accurately attached to the second type superlattice surface of the chip; S5, the square plate (20) is pressed against the anti-reflection film, so that the anti-reflection film is pressed against the surface of the second type superlattice of the chip; S6. Under the elastic force of the elastic rod (63), the long strip plate (64) presses against the rubber roller (65), so that the horizontal plate (61) remains stable during the upward movement; S7, the heat emitted by the resistance heating rod (73) is transferred to the vertical block (17), the vertical block (17) transfers the heat to the chip slot plate (12), and the chip slot plate (12) transfers the heat to the chip and the edge of the anti-reflection film; S8, when the chip has completed the anti-reflection, under the action of the elastic force of the spring sheet (68), the spring sheet (68) supports the inverted U-shaped rod (66) so that the top plate (9) does not hit the alignment plate (5); S9. The heat-insulating chamber of the baffle (76) blocks the heat emitted by the resistance heating rod (73), so that the device automatically stops heating the surface of the second-type superlattice of the chip when the chip is enhanced in transmittance.

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