Light-emitting device and display device

Abstract

The application discloses a light emitting device and a display device. The light emitting device comprises a driving element, a plurality of light emitting elements arranged at intervals and a connecting electrode. The driving element comprises a first surface side and a second surface side arranged oppositely. A plurality of terminals arranged at intervals are arranged on the surface of the driving element at the first surface side. A plurality of electrode pads are arranged at the second surface side. The long side of the driving element is less than 200 microns. The plurality of light emitting elements arranged at intervals are arranged on part of the terminals of the surface of the driving element. The connecting electrode extends from the first surface side of the driving element to the second surface side of the driving element through the connecting electrode, and is electrically connected with the electrode pads at the second surface side of the driving element. Thus, the connecting electrode of the application can directly extend from the first surface side of the driving element to the second surface side of the driving element, the wire bonding step is simplified, a complicated wiring layer is not needed, and the miniaturization of the light emitting device is facilitated.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor devices, and in particular to a light-emitting device and a display device. Background Art

[0002] In recent years, new display technologies have been developing rapidly. Technologies such as OLED and MicroLED have received extensive research and attention. These new displays offer advantages such as energy efficiency, high resolution, and a wide color gamut. Many device manufacturers have invested significant manpower and capital in developing these technologies.

[0003] In existing LED package modules, both the light-emitting chip and the driver chip are typically mounted on a package substrate and connected to corresponding pads on the package substrate via wire bonding to establish an electrical connection between the light-emitting chip and the driver chip. However, LED package modules with wire bonding structures and a package substrate are difficult to further reduce in size, making them difficult to meet the current trend toward thinner and smaller electronic products. Summary of the Invention

[0004] In view of the above-mentioned shortcomings of the prior art, an object of the present invention is to provide a light-emitting device and a display device to reduce the size of the light-emitting device, simplify the preparation process, and reduce the cost.

[0005] In order to achieve the above-mentioned and other related objectives, the present invention provides a light-emitting device, comprising:

[0006] A driving element, comprising a first surface side and a second surface side disposed opposite to each other, a plurality of terminals disposed at intervals on a surface of the driving element on the first surface side, a plurality of electrode pads disposed on the second surface side, and a long side of the driving element being less than 200 μm;

[0007] A plurality of light-emitting elements are arranged at intervals and are disposed on some terminals on the surface of the driving element;

[0008] The connecting electrode extends part of the terminal from the first side of the driving element to the second side of the driving element through the connecting electrode and is electrically connected to the electrode pad located on the second side of the driving element.

[0009] According to one aspect of the present invention, the present invention further provides a display device, comprising:

[0010] display substrate;

[0011] At least one light emitting device is disposed on the surface of the display substrate. The light emitting device is electrically connected to the display substrate. The light emitting device is the above-mentioned light emitting device.

[0012] Compared with the prior art, the light-emitting device and display device of the present invention have at least the following beneficial effects:

[0013] The light-emitting device of the present invention includes a driving element, a plurality of light-emitting elements arranged at intervals, and a connecting electrode. The driving element includes a first side and a second side arranged opposite to each other. A plurality of terminals arranged at intervals are arranged on the surface of the driving element on the first side, and a plurality of electrode pads are arranged on the second side. The long side of the driving element is less than 200 μm. The plurality of light-emitting elements arranged at intervals are arranged on some terminals on the surface of the driving element. Some terminals of the connecting electrode extend from the first side of the driving element to the second side of the driving element through the connecting electrode, and are electrically connected to the electrode pads located on the second side of the driving element. Therefore, the present invention adopts a stacked structure to stack small-sized light-emitting elements on the driving element to form a 3D stacked structure. The connecting electrode can directly extend from the first side of the driving element to the second side of the driving element, so as to facilitate connection with the backplane on the second side of the driving element, such as a PCB, glass, etc., to form a display screen. The present invention simplifies the complicated wiring steps and does not require complicated wiring layers, which is more conducive to the miniaturization of the light-emitting device.

[0014] Furthermore, the light-emitting surface of the light-emitting element in the present invention is a roughened surface. In order not to affect or to have less impact on the light-emitting efficiency of the LED, an opening is set at the contact position between the light-emitting surface of the light-emitting element and the first transparent layer. This avoids the first transparent layer from affecting the light output of the roughened light-emitting surface, making the light path closer to the output path of the chip itself, and is not affected by the refractive index of the transparent layer material, thereby reducing brightness loss.

[0015] The display device of the present invention includes the above-mentioned light-emitting device and also has the above-mentioned effects. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 1 is an exploded view of the light emitting device in Example 1 of the present invention;

[0017] Figure 2 Schematic diagram of the structure of the driving element in Example 1 of the present invention;

[0018] Figure 3 2 is a bottom view schematic diagram of the light emitting device in Example 1 of the present invention;

[0019] Figure 4 Schematic diagram of the top view of the light emitting device in Example 1 of the present invention;

[0020] Figure 5 For the Figure 4 Schematic diagram of the cross-sectional structure along the A-A' direction;

[0021] Figure 6 Schematic diagram of the top view of the light emitting device in embodiment 2 of the present invention;

[0022] Figure 7For example 2 of the present invention, Figure 5 Schematic diagram of the cross-sectional structure along the B-B' direction;

[0023] Figure 8 For the Figure 5 Schematic diagram of the cross-sectional structure along the B-B' direction;

[0024] Figure 9 For the Figure 5 Schematic diagram of the cross-sectional structure along the B-B' direction;

[0025] Figure 10 For example 3 of the present invention, Figure 5 Schematic diagram of the cross-sectional structure along the B-B' direction;

[0026] Figure 11 Schematic diagram of the structure of the display device in Example 4 of the present invention.

[0027] List of reference numerals:

[0028] 100 substrates

[0029] 200 drive components

[0030] 210 First side

[0031] 220 Second side

[0032] 230 Extended Surface

[0033] 201 First Terminal

[0034] 202 Second terminal

[0035] 203 Third terminal

[0036] 204 Fourth Terminal

[0037] 205 Fifth Terminal

[0038] 206 Sixth Terminal

[0039] 207 Seventh Terminal

[0040] 208 through holes

[0041] 300 light-emitting elements

[0042] 301 first light-emitting element

[0043] 302 second light emitting element

[0044] 303 third light-emitting element

[0045] 400 insulation layer

[0046] 401 Part 1

[0047] 402 Part 2

[0048] 410 filling layer

[0049] 500 Connecting electrodes

[0050] 600 transparent layers

[0051] 610 First transparent layer

[0052] 611 Opening

[0053] 620 Second transparent layer

[0054] 700 electrode pads

[0055] 701 first electrode pad

[0056] 702 second electrode pad

[0057] 703 third electrode pad

[0058] 704 fourth electrode pad

[0059] 800 occlusion layer

[0060] 001 Lighting Device

[0061] 002 Display substrate DETAILED DESCRIPTION

[0062] The following specific embodiments illustrate the embodiments of the present invention. Those skilled in the art will readily appreciate the other advantages and benefits of the present invention from the disclosure herein. The present invention may also be implemented or applied through various other specific embodiments, and the details in this specification may be modified or altered based on different perspectives and applications without departing from the spirit of the present application. It should be noted that the following embodiments and features of the embodiments may be combined with each other unless they conflict.

[0063] It should be noted that the diagrams provided in the embodiments of the present invention are only schematic illustrations of the basic concept of the present invention. Although the diagrams only show components related to the present invention and are not drawn according to the number, shape, and size of components in actual implementation, the form, quantity, and proportion of each component in actual implementation can be changed at will, and the component layout form may also be more complex. The structures, proportions, sizes, etc. illustrated in the drawings of the specification are only used to match the contents disclosed in the specification for people familiar with this technology to understand and read, and are not used to limit the conditions for the implementation of this application. Therefore, they have no technical significance. Any structural modification, change in proportional relationship, or adjustment of size should still fall within the scope of the technical content disclosed in this application without affecting the efficacy and purpose of the present invention.

[0064] In order to reduce component size, miniaturize the light-emitting device, simplify the preparation process, and reduce manufacturing costs, this embodiment provides a light-emitting device, which includes:

[0065] A driving element, comprising a first surface side and a second surface side disposed opposite to each other, a plurality of terminals disposed at intervals on a surface of the driving element on the first surface side, a plurality of electrode pads disposed on the second surface side, and a long side of the driving element being less than 200 μm;

[0066] A plurality of light-emitting elements are arranged at intervals and are disposed on some terminals on the surface of the driving element;

[0067] Connecting electrodes, part of the terminals extend from the first side of the driving element to the second side of the driving element through the connecting electrodes, and are electrically connected to the electrode pads located on the second side of the driving element. Therefore, this embodiment adopts a stacked structure to stack small-sized light-emitting elements on the driving element to form a 3D stacked structure. The connecting electrodes can directly extend the terminals located on the first side of the driving element to the second side of the driving element, which is convenient for forming a connection with the backplane on the second side of the driving element, such as PCB, glass, etc., to form a display screen. The setting of the driving element and the connecting electrode in this embodiment simplifies the complicated wiring steps, eliminates the need for complicated wiring layers, and is more conducive to the miniaturization of the light-emitting device.

[0068] Optionally, seven terminals are arranged on the surface of the driving element, namely the first terminal, the second terminal, the third terminal, the fourth terminal, the fifth terminal, the sixth terminal and the seventh terminal. The first terminal, the second terminal, the third terminal and the fourth terminal are arranged along the periphery of the surface of the driving element, and the fifth terminal, the sixth terminal and the seventh terminal are arranged inside surrounded by the first terminal, the second terminal, the third terminal and the fourth terminal.

[0069] Optionally, the light-emitting device includes three light-emitting elements, namely a first light-emitting element, a second light-emitting element and a third light-emitting element, wherein the first electrodes of the first light-emitting element, the second light-emitting element and the third light-emitting element are all electrically connected to the first terminal, the second electrode of the first light-emitting element is electrically connected to the fifth terminal, the second electrode of the second light-emitting element is electrically connected to the sixth terminal, and the second electrode of the third light-emitting element is electrically connected to the seventh terminal.

[0070] Optionally, the light emitting device includes four connecting electrodes and four electrode pads, one end of the four connecting electrodes is electrically connected to the first terminal, the second terminal, the third terminal and the fourth terminal respectively, and the other end is connected to the four electrode pads one by one.

[0071] Optionally, the driving element further includes:

[0072] A plurality of through holes are provided on the driving element, extending from the first side of the driving element to the second side of the driving element. The through holes correspond one-to-one to the connecting electrodes. The connecting electrodes are provided in the corresponding through holes and electrically connected to the corresponding electrode pads on the second side of the driving element.

[0073] Optionally, the lighting device further comprises:

[0074] The insulating layer includes a first portion covering the surface of the driving element and the light-emitting element, and a second portion covering the side surface of the driving element. The second portion forms an extended surface around the surface of the driving element located on the second side, and the electrode pads are exposed on the extended surface. Each connecting electrode is arranged in the insulating layer and electrically connected to a portion of the terminal on the surface of the driving element located on the first side. The electrodes extend from the connection end with the terminal through the first and second portions of the insulating layer to the extended surface flush with the second surface of the driving element, and form an electrical connection with the electrode pads located on the extended surface. In this embodiment, the connecting electrodes are formed in the insulating layer around the driving element, eliminating the need to drill holes in the driving element, which helps reduce production costs. Similarly, the driving element can be smaller in size, which is conducive to miniaturization.

[0075] Optionally, the lighting device further comprises:

[0076] The filling layer is arranged between adjacent light-emitting elements and on the side walls of the light-emitting elements.

[0077] Optionally, the lighting device further comprises:

[0078] a substrate; a driving element is disposed on the substrate, and a surface of the driving element located on the second surface side is bonded to a surface of the substrate;

[0079] The connection electrodes are electrically connected to some of the terminals on the surface of the driver element, extending from the surface of the driver element along the insulating layer on the side of the driver element to the surface of the substrate, and then extending through the through-holes in the substrate to the other surface of the substrate. This embodiment uses a substrate to secure the driver element, allowing the driver element to be thinner. Similarly, this embodiment does not require complex wire bonding, simplifying the process flow.

[0080] Optionally, the area of ​​the substrate is larger than the area of ​​the driving element.

[0081] Optionally, the driving element is an active driving IC chip.

[0082] Optionally, the light emitting element is located on the surface of the first surface side of the driving element, and the surface of the light emitting element facing away from the driving element is a light emitting surface, and the light emitting surface is a roughened surface.

[0083] Optionally, the lighting device further comprises:

[0084] The first transparent layer is arranged above the insulating layer.

[0085] Optionally, the lighting device further comprises:

[0086] Openings are provided on the first transparent layer, corresponding to and covering all light-emitting elements; or multiple openings are provided at intervals on the first transparent layer, corresponding one to each light-emitting element. Since the light-emitting surface of the light-emitting element is a roughened surface, in order to minimize or minimize the impact on the light-emitting efficiency of the LED, the openings are provided at the contact point between the light-emitting surface of the light-emitting element and the first transparent layer. This prevents the first transparent layer from affecting the light emitted from the roughened light-emitting surface, making the light path closer to the emission path of the chip itself, unaffected by the refractive index of the transparent layer material, and reducing brightness loss.

[0087] Optionally, the lighting device further comprises:

[0088] The second transparent layer is arranged above the first transparent layer.

[0089] Optionally, the size of the driving element is less than 150 μm.

[0090] Optionally, the diameter of the through hole is less than 30 μm.

[0091] Optionally, a size of each light emitting element is smaller than 80 μm.

[0092] Optionally, the plurality of light-emitting elements include at least three light-emitting elements emitting light of different colors from each other, and one of the light-emitting elements is a light-emitting element radiating blue light.

[0093] Optionally, the substrate is an ABF substrate.

[0094] Optionally, the lighting device further comprises:

[0095] The shielding layer is disposed above the connecting electrode and completely covers the connecting electrode. When the transparent layer above the connecting electrode is made of a completely transparent material, a shielding layer is also required above the connecting electrode to prevent the connecting electrode from being displayed on the luminous surface, thereby increasing the display contrast.

[0096] This embodiment further provides a display device, including:

[0097] display substrate;

[0098] At least one light emitting device is disposed on the surface of the display substrate. The light emitting device is electrically connected to the display substrate. The light emitting device is the above-mentioned light emitting device.

[0099] The present invention is described in detail below with reference to specific embodiments.

[0100] Example 1

[0101] This embodiment provides a light emitting device, referring to Figure 1 、 2 Or 5, the light emitting device includes a driving element 200, a plurality of light emitting elements 300 arranged at intervals, and a connecting electrode 500.

[0102] Reference Figure 2The driving element 200 includes a first surface side 210 and a second surface side 220 that are arranged opposite to each other. A plurality of terminals arranged at intervals are provided on the surface of the driving element 200 located on the first surface side 210, and a plurality of electrode pads 700 are provided on the second surface side 220. In this embodiment, seven terminals are provided on the surface of the driving element 200 located on the first surface side 210, namely a first terminal 201, a second terminal 202, a third terminal 203, a fourth terminal 204, a fifth terminal 205, a sixth terminal 206 and a seventh terminal 207. The first terminal 201, the second terminal 202, the third terminal 203 and the fourth terminal 204 are arranged along the periphery of the surface of the driving element 200, and the fifth terminal 205, the sixth terminal 206 and the seventh terminal 207 are arranged on the surface of the driving element 200 and are arranged inside the area enclosed by the first terminal 201, the second terminal 202, the third terminal 203 and the fourth terminal 204. The electrode pad 700 can be arranged on the surface of the driving element 200 located on the second surface side 220, or can be arranged on the extended surface 230 of the periphery of the driving element 200 located on the second surface side 220, or on other structures on the second surface side 220 of the driving element 200. This embodiment does not limit the specific position of the electrode pad 700. Optionally, the driving element 200 is an active driving IC chip. Optionally, the size of the driving element 200 is less than 200μm, for example, less than 150μm. The driving element 200 is rectangular, including a long side and a short side, and the size of the long side of the driving element 200 is less than 200μm.

[0103] Reference Figure 2 and Figure 4 , multiple light-emitting elements 300 are spaced apart and arranged on part of the terminals on the surface of the driving element 200 located on the first surface side 210. The light-emitting element 300 mainly refers to a micron-sized light-emitting diode, whose width and length range are 2-5μm, 5-10μm, 10-20μm, 20-50μm or 50-100μm, and its thickness range is 2-15μm, preferably 5-10μm. In this embodiment, the light-emitting device includes three light-emitting elements 300, namely a first light-emitting element 301, a second light-emitting element 302 and a third light-emitting element 303. Among them, the first electrodes of the first light-emitting element 301, the second light-emitting element 302 and the third light-emitting element 303 are all electrically connected to the first terminal 201, the second electrode of the first light-emitting element 301 is electrically connected to the fifth terminal 205, the second electrode of the second light-emitting element 302 is electrically connected to the sixth terminal 206, and the second electrode of the third light-emitting element 303 is electrically connected to the seventh terminal 207.

[0104] Each light-emitting element 300 comprises a stack of semiconductor layers, which may include a first semiconductor layer, a second semiconductor layer, and an active layer disposed therebetween. The first semiconductor layer is an N-type semiconductor layer, the second semiconductor layer is a P-type semiconductor layer, and the active layer is a multi-layer quantum well layer, which can provide red, green, or blue light. The N-type semiconductor layer, the multi-layer quantum well layer, and the P-type semiconductor layer are merely the basic building blocks of the light-emitting element 300. Furthermore, the light-emitting element 300 may also include other functional structural layers that optimize the performance of the light-emitting element 300. The first light-emitting element 301, the second light-emitting element 302, and the third light-emitting element 303 each radiate light of different wavelengths. For example, the first light-emitting element 301 radiates red light and is a red light-emitting element. The second light-emitting element 302 radiates green light and is a green light-emitting element. The third light-emitting element 303 radiates blue light and is a blue light-emitting element. Optionally, each light-emitting element 300 is less than 80 μm in size. In this embodiment, the light emitting surface of the light emitting element 300 is a roughened surface. During the formation of the light emitting element 300 , the epitaxial layer is generally formed on a patterned substrate, and the roughened light emitting surface is formed after the patterned substrate is subsequently removed.

[0105] Optionally, refer to Figure 9 or Figure 10 The light-emitting device further includes a filling layer 410, which is formed at least between adjacent light-emitting elements 300 or around the sidewalls of the light-emitting elements 300 to prevent color mixing or light interference between adjacent light-emitting elements 300, thereby improving the contrast of the light-emitting device. The filling layer 410 is provided as a light-absorbing black glue layer. The filling layer 410 can be a component formed by dispersing a black filler component with a particle size of no more than 1 μm in a transparent or translucent material such as silicone, epoxy resin, polyimide, low-temperature glass, polysiloxane, or polysilazane. The black filler component in the filling layer 410 includes, but is not limited to, carbon black, titanium nitride, iron oxide, ferrosoferric oxide, iron powder, etc. The particle size of the black filler component is preferably in the range of 10 to 100 nm, or 100 to 200 nm, or 200 to 300 nm, or 300 to 500 nm. The filling layer 410 can also be made of a black dye. Optionally, the light-emitting device further includes an insulating layer 400, which is formed on the sidewalls of the light-emitting elements.

[0106] Reference Figure 5 、 6 7-10, the connecting electrode 500 is used to connect the terminal located on the first side 210 of the driving element 200 and the electrode pad 700 located on the second side 220 of the driving element 200. In addition, the connecting electrode 500 can be arranged inside the driving element 200 or outside the driving element 200. In this embodiment, referring to Figure 5The connecting electrodes 500 are arranged inside the driving element 200. In this case, the driving element 200 is provided with through holes 208 corresponding to the number of the connecting electrodes 500. The through holes 208 extend from the surface of the driving element 200 located on the first side 210 to the surface of the driving element 200 located on the second side 220. The through holes 208 correspond one-to-one to the connecting electrodes 500. The connecting electrodes 500 are arranged in the corresponding through holes 208 and form an electrical connection with the corresponding electrode pads 700 on the second side 220 of the driving element 200. Optionally, the diameter of the through holes 208 is less than 30μm. Optionally, the size of the driving element 200 in this embodiment is 50 to 200μm. Since the connecting electrodes 500 in this embodiment are directly formed on the driving element 200, no complex wiring layer is required, so the overall size is small, which is conducive to miniaturization. The position of the light-emitting element 300 can be set near the middle of the driving element 200, and the light-emitting element 300 will not be damaged when it is hit, which is beneficial to the overall manufacturing yield of the light-emitting device.

[0107] In this embodiment, referring to Figure 3 and Figure 5 The light-emitting device includes four connecting electrodes 500 and four electrode pads 700. One end of each of the four connecting electrodes 500 is electrically connected to the first terminal 201, the second terminal 202, the third terminal 203, and the fourth terminal 204, respectively. The other ends of the four connecting electrodes 500 are connected to four electrode pads 700, which are respectively the first electrode pad 701, the second electrode pad 702, the third electrode pad 703, and the fourth electrode pad 704. In other embodiments, the number of connecting electrodes 500 and electrode pads 700 can be set as needed.

[0108] Optionally, the light emitting device further comprises a transparent layer 600. Figure 5The transparent layer 600 includes a first transparent layer 610, which is arranged above the insulating layer 400, and an opening 611 is provided on the first transparent layer 610. When the number of openings 611 is one, the opening 611 covers all the light-emitting elements 300. When the number of openings 611 is multiple, the number of openings 611 corresponds to the number of light-emitting elements 300, and the openings 611 are arranged on the first transparent layer 610 in a one-to-one correspondence with the light-emitting elements 300. In this embodiment, the first transparent layer 610 is an adhesive layer. The material of the adhesive layer can be silicone, epoxy resin, etc. The thickness of the adhesive layer can be 1 to 15 μm or 3 to 10 μm. In this embodiment, the thickness of the adhesive layer is less than 10 μm. Since the light-emitting surface of the light-emitting element 300 in this embodiment has no substrate (sapphire, etc.) and is only a roughened epitaxial surface, in order to improve the light extraction efficiency of the light-emitting element 300, an opening 611 is provided at a position of the first transparent layer 610 corresponding to the light-emitting surface of the light-emitting element 300, so that the light first passes from the roughened epitaxial surface to the air and then to the second transparent layer described below, thereby improving the light extraction efficiency.

[0109] Optionally, refer to Figure 5 The light-emitting device further includes a second transparent layer 620 disposed above the first transparent layer 610. The second transparent layer 620 may have a light transmittance of greater than 60% in the visible light range. Optionally, the second transparent layer 620 is a transparent protective layer, and its material may be an organic material such as epoxy resin, silicone, etc., or an inorganic material such as glass or sapphire.

[0110] Optionally, refer to Figure 7 The light-emitting device further includes a shielding layer 800. The shielding layer 800 is disposed above the connecting electrode 500, completely covering the connecting electrode 500. This prevents the connecting electrode 500 from being visible on the light-emitting surface, thereby increasing display contrast. Specifically, the shielding layer 800 can be formed within the insulating layer 400 above the connecting electrode 500, or between the insulating layer 400 and the first transparent layer 610, or between the first transparent layer 610 and the second transparent layer 620, or above the second transparent layer 620. It should be noted that the present invention does not limit the location of the shielding layer 800, as long as it can shield the connecting electrode 500 visible on the light-emitting surface. In this embodiment, the shielding layer 800 is disposed on the second transparent layer 620. Optionally, the material of the shielding layer 800 can be the same as or different from that of the filling layer 410, as long as its transmittance is less than 50%. If the second transparent layer 620 is a semi-transparent layer 600, meaning one with a transmittance of 50% or less, a separate shielding layer 800 is not required.

[0111] Example 2

[0112] This embodiment provides a light emitting device. The similarities between the light emitting device and the embodiment 1 are not described here. The difference is that: Figures 6-9 In this embodiment, the connecting electrode 500 is arranged on the periphery of the driving element 200. Specifically, an insulating layer 400 is further formed on the periphery of the driving element 200, on the surface of the first surface side 210 of the driving element 200, and above the light-emitting element 300. The insulating layer 400 includes a first portion 401 and a second portion 402. The first portion 401 covers the surface of the driving element 200 and the light-emitting element 300, and the second portion 402 covers the side of the driving element 200. The second portion 402 is formed with an extended surface 230 on the periphery of the surface of the driving element 200 located on the second surface side 220, and the electrode pad 700 is exposed on the extended surface 230. At this time, the connecting electrode 500 connects to part of the terminal on the surface of the first surface side 210 of the driving element 200, and extends to the second surface side 220 of the driving element 200 through the first portion 401 and the second portion 402 of the insulating layer 400 in sequence, and forms an electrical connection with the electrode pad 700 located on the extended surface 230 of the second surface side 220. In this embodiment, the connecting electrode 500 is formed in the insulating layer 400 outside the driving element 200, and there is no need to drill holes in the driving element 200, which is conducive to reducing production costs. Similarly, the driving element 200 can adopt a smaller size, which is conducive to miniaturization. In this embodiment, the size of the driving element 200 is less than 100μm. Optionally, the first part of the insulating layer 400 is a light-transmitting insulating layer or a semi-transparent insulating layer. A filling layer 410 may be provided between adjacent light-emitting elements 300, or a filling layer 410 may not be provided. When there is no filling layer 410 between adjacent light-emitting elements 300, forming a shielding layer 800 above the insulating layer 400 can shield the electrode, improve the contrast, and thereby improve the contrast of the entire light-emitting device. In addition, a transparent layer 600 may be provided above the light-emitting element 300, or a transparent layer 600 may not be provided, and this embodiment does not limit this.

[0113] In one example, referring to Figure 7 A transparent layer 600 is formed above the insulating layer 400, a shielding layer 800 is disposed above the transparent layer 600, and no filling layer 410 is disposed between adjacent light-emitting elements 300. The transparent layer 600 in this embodiment is a single transparent layer 600, and the material of the transparent layer 600 is the same as that of the second transparent layer 620 in Example 1.

[0114] In one example, referring to Figure 8A transparent layer 600 is formed above the insulating layer 400. This light-emitting device does not have a shielding layer 800 disposed above the transparent layer 600. The transparent layer 600 is a semi-transparent layer 600. Therefore, even without the shielding layer 800, the connecting electrode 500 can be shielded, thereby improving display contrast. No filling layer 410 is disposed between adjacent light-emitting elements 300. The transparent layer 600 in this embodiment is a single layer. The material of this transparent layer 600 is the same as that of the second transparent layer 620 in Example 1.

[0115] In one example, referring to Figure 9 A transparent layer 600 is formed above the insulating layer 400. This light-emitting device does not have a shielding layer 800 disposed above the transparent layer 600. The transparent layer 600 is a semi-transparent layer 600, so even without the shielding layer 800, the connecting electrode 500 can be shielded, thereby improving display contrast. A filling layer 410 is disposed between adjacent light-emitting elements 300 and on the sidewalls of the light-emitting elements 300. This filling layer 410 prevents optical crosstalk or interference between adjacent light-emitting elements 300. The transparent layer 600 in this embodiment is a single layer. The material of this transparent layer 600 is the same as that of the second transparent layer 620 in Example 1.

[0116] Example 3

[0117] This embodiment provides a light emitting device. The light emitting device is similar to that of the embodiment 1 and will not be described in detail. The difference is that: Figure 10 In this embodiment, the connecting electrode 500 is disposed on the periphery of the driving element 200. Similar to Example 2, an insulating layer 400 is further formed on the periphery of the driving element 200, on the surface of the first side 210 of the driving element 200, and above the light-emitting element 300. The insulating layer 400 includes a first portion 401 and a second portion 402. The first portion 401 covers the surface of the driving element 200 and the light-emitting element 300, and the second portion 402 covers the side of the driving element 200. The second portion 402 forms an extended surface 230 on the periphery of the surface of the driving element 200 located on the second side 220, and the electrode pad 700 is exposed on the extended surface 230. At this time, the connecting electrode 500 connects to a portion of the terminal on the surface of the first side 210 of the driving element 200, and extends sequentially through the first portion 401 and the second portion 402 of the insulating layer 400 to the second side 220 of the driving element 200, and forms an electrical connection with the electrode pad 700 located on the extended surface 230 of the second side 220. Furthermore, in this embodiment, a filling layer 410 is provided between adjacent light emitting elements 300 and on the sidewalls of the light emitting elements 300 . The filling layer 410 can prevent light crosstalk or interference between adjacent light emitting elements 300 .

[0118] In addition, the light-emitting device also includes a substrate 100, and the driving element 200 is arranged on the substrate 100, and the surface of the driving element 200 located on the second surface side 220 is in contact with the surface of the substrate 100. In this case, the connecting electrode 500 also extends to the surface of the substrate 100, extends to the other surface of the substrate 100 through the through hole 208 on the substrate 100, and the electrode pad 700 is arranged on the other surface of the substrate 100. Optionally, the area of ​​the substrate 100 is larger than the area of ​​the driving element 200. Optionally, the substrate 100 is an ABF substrate 100. Optionally, the insulating layer 400 can be formed of a material such as epoxy resin, polysiloxane or photoresist. In this embodiment, a filling layer 410 is provided between adjacent light-emitting elements 300 and on the sidewalls of the light-emitting elements 300. The material of the filling layer 410 can be the same as the material of the insulating layer 400. In addition, the thickness of the driving element 200 in this embodiment can be smaller, and the thickness of the driving element 200 is less than 50μm, for example, 20μm. Similarly, this embodiment does not require complex wire bonding, the process is simple, the light emitting element 300 can be centrally located, the bonding process will not damage the light emitting element 300, and the thickness of the driver element 200 can be thinner. Optionally, the size of the driver element 200 in this embodiment is between 50 and 200 μm.

[0119] Example 4

[0120] This embodiment also provides a display device, referring to Figure 11 The display device includes a display substrate 002 and at least one light-emitting device 001. The at least one light-emitting device 001 is disposed on a surface of the display substrate 002 and is electrically connected to the display substrate 002. In this embodiment, the light-emitting device 001 is the light-emitting device of any one of Embodiment 1, Embodiment 2, or Embodiment 3.

[0121] The above embodiments are merely illustrative of the principles and effects of the present invention and are not intended to limit the present invention. Anyone skilled in the art may modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by one of ordinary skill in the art without departing from the spirit and technical principles disclosed herein are intended to be covered by the claims of the present invention.

Claims

1. A light emitting device, characterized in that: include: A driving element, comprising a first surface side and a second surface side disposed opposite to each other, a plurality of terminals disposed at intervals on a surface of the driving element located on the first surface side, a plurality of electrode pads disposed on the second surface side, and a long side of the driving element being less than 200 μm; A plurality of light-emitting elements are arranged at intervals and are provided on some terminals on the surface of the driving element; A connecting electrode, through which part of the terminals extend from the first surface side of the driving element to the second surface side of the driving element, and is electrically connected to the electrode pad located on the second surface side of the driving element.

2. The light emitting device according to claim 1, wherein Seven terminals are arranged on the surface of the driving element, namely the first terminal, the second terminal, the third terminal, the fourth terminal, the fifth terminal, the sixth terminal and the seventh terminal. The first terminal, the second terminal, the third terminal and the fourth terminal are arranged along the periphery of the surface of the driving element, and the fifth terminal, the sixth terminal and the seventh terminal are arranged inside the interior enclosed by the first terminal, the second terminal, the third terminal and the fourth terminal.

3. The light emitting device according to claim 2, wherein: The light-emitting device includes three light-emitting elements, namely a first light-emitting element, a second light-emitting element and a third light-emitting element, wherein the first electrodes of the first light-emitting element, the second light-emitting element and the third light-emitting element are all electrically connected to the first terminal, the second electrode of the first light-emitting element is electrically connected to the fifth terminal, the second electrode of the second light-emitting element is electrically connected to the sixth terminal, and the second electrode of the third light-emitting element is electrically connected to the seventh terminal.

4. The light emitting device according to claim 3, characterized in that The light emitting device includes four connecting electrodes and four electrode pads. One end of the four connecting electrodes is electrically connected to the first terminal, the second terminal, the third terminal and the fourth terminal respectively, and the other end is connected to the four electrode pads in a one-to-one correspondence.

5. The light emitting device according to claim 1, wherein The driving element further comprises: A plurality of through holes are provided on the driving element, extending from the first surface side of the driving element to the second surface side of the driving element, the through holes corresponding one-to-one to the connecting electrodes, the connecting electrodes being provided in the corresponding through holes and forming an electrical connection with the corresponding electrode pads on the second surface side of the driving element.

6. The light emitting device according to claim 1, wherein The light emitting device further comprises: An insulating layer comprising a first portion covering the surface of the driving element and the light-emitting element and a second portion covering the side surface of the driving element, wherein the second portion forms an extended surface on the periphery of the surface of the driving element located on the second surface side, and the electrode pad is exposed on the extended surface; each of the connecting electrodes is arranged in the insulating layer, electrically connected to a portion of the terminal on the surface of the driving element located on the first surface side, and extends from the connection end with the terminal through the first and second portions of the insulating layer to the extended surface flush with the second surface of the driving element, thereby forming an electrical connection with the electrode pad located on the extended surface.

7. The light emitting device according to claim 1 or 6, characterized in that: The light emitting device further comprises: The filling layer is arranged between adjacent light-emitting elements and on the side walls of the light-emitting elements.

8. The light emitting device according to claim 6, wherein: The light emitting device further comprises: The driving element is provided on the substrate, and the surface of the driving element located on the second surface side is in contact with the surface of the substrate; The connecting electrode is electrically connected to some terminals on the surface of the driving element, and extends from the surface of the driving element along the insulating layer on the side of the driving element to the surface of the substrate, and extends to the other surface of the substrate through the through hole on the substrate.

9. The light emitting device according to claim 8, characterized in that The area of ​​the substrate is larger than the area of ​​the driving element.

10. The light emitting device according to claim 1, wherein The driving element is an active driving IC chip.

11. The light emitting device according to claim 1, wherein The light emitting element is located on the surface of the first surface side of the driving element, and the surface of the light emitting element facing away from the driving element is a light emitting surface, and the light emitting surface is a roughened surface.

12. The light emitting device according to claim 1 or 11, characterized in that: The light emitting device further comprises: The first transparent layer is arranged above the light emitting element.

13. The light emitting device according to claim 12, characterized in that: The light emitting device further comprises: An opening is provided on the first transparent layer, and the opening corresponds to and covers all the light-emitting elements; or a plurality of openings are provided at intervals on the first transparent layer, and the openings correspond to the light-emitting elements one by one.

14. The light emitting device according to claim 12, wherein: The light emitting device further comprises: The second transparent layer is arranged above the first transparent layer.

15. The light emitting device according to claim 1, wherein The size of the driving element is less than 150 μm.

16. The light emitting device according to claim 5, characterized in that The diameter of the through hole is less than 30 μm.

17. The light emitting device according to claim 1, wherein The size of each light-emitting element is less than 80 μm.

18. The light emitting device according to claim 1, wherein The plurality of light-emitting elements include at least three light-emitting elements emitting light of different colors from each other, wherein one of the light-emitting elements is a light-emitting element radiating blue light.

19. The light emitting device according to claim 8, characterized in that The substrate is an ABF substrate.

20. The light emitting device according to claim 5, 6 or 8, characterized in that: The light emitting device further comprises: The shielding layer is arranged above the connecting electrode and completely covers the connecting electrode.

21. A display device, characterized in that: include: display substrate; At least one light-emitting device is disposed on a surface of the display substrate, the light-emitting device being electrically connected to the display substrate, and the light-emitting device is the light-emitting device according to any one of claims 1 to 20.

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