A diode packaging structure and packaging method

Abstract

The present invention relates to the field of diodes, and specifically to a diode packaging structure and packaging method, the method comprising: reserving a first and a second preset position inside the diode packaging structure body, the first preset position can ensure that a micro temperature and humidity sensor can accurately collect the temperature and humidity conditions around the diode, and the second preset position can ensure that a micro refrigeration device is at a preset position away from the diode; fixing the micro temperature and humidity sensor at the first preset position, and connecting the micro temperature and humidity sensor to a microcontroller; fixing the micro refrigeration device at the second preset position, and connecting the micro refrigeration device to the microcontroller; the microcontroller reads the temperature and humidity data sent by the micro temperature and humidity sensor, and the microcontroller calculates the refrigeration data according to the temperature and humidity data using a preset algorithm, and sends a signal containing the refrigeration data to the micro refrigeration device, and the micro refrigeration device performs refrigeration according to the refrigeration data. The present invention can prevent the LED light-emitting effect from being damaged due to high temperature and high humidity in the environment.

Description

Technical Field

[0001] The present invention relates to the field of diodes, and in particular to a diode packaging structure and a packaging method. Background Art

[0002] The packaging structure and packaging method of diodes vary depending on the application and technology. Generally, the diode packaging structure includes the following main parts: 1. Diode chip (Die): The core part of the semiconductor diode, usually made of silicon or other semiconductor materials, with two electrodes on the diode chip: anode (Anode) and cathode (Cathode). 2. Lead frame (Lead Frame): Used to connect the diode chip to the external circuit. The lead frame is usually made of copper or other highly conductive metals, and is plated with materials such as silver and gold to improve conductivity and weldability, including brackets and leads that support the diode chip. 3. Packaging material: The packaging material can be plastic, epoxy resin or ceramic, which is used to protect the diode chip from physical damage and environmental impact, and is used to form a shell to encapsulate the diode chip and lead frame inside. 4. Bonding wires (Bonding Wires): Used to connect the diode chip electrodes to the lead frame, usually using gold, aluminum or copper wires. 5. Heat sink (Heat sink, suitable for power diodes): Improve the heat dissipation performance of the diode, usually integrated in the packaging structure.

[0003] The existing light-emitting diode (LED) packaging structure mainly includes a substrate, a light-emitting chip, and a package body doped with phosphor. The light-emitting chip is arranged on the substrate, and the package body covers the light-emitting chip. The light beam emitted by the light-emitting chip is converted into white light after passing through the package body. After the diode is packaged, the internal environment is relatively closed, and its temperature and other factors will change with the efficacy of the diode. When the temperature is high, it will affect the quality of the phosphor in the package body, causing the diode to turn black. Therefore, in a high temperature and high humidity environment, the phosphor in the package body is easily affected by the environment and undergoes a qualitative change, turning into a black substance, which causes the light output effect of the LED to be damaged. Summary of the invention

[0004] In order to solve the technical problem that the light emitting effect of LED is impaired in a high temperature and high humidity environment, the purpose of the present invention is to provide a diode packaging method, and the technical solution adopted is as follows:

[0005] A first preset position and a second preset position are reserved inside the diode packaging structure body, wherein the first preset position can ensure that the micro temperature and humidity sensor can accurately collect the temperature and humidity conditions around the diode, and the second preset position can ensure that the micro refrigeration device is at a preset position away from the diode;

[0006] Fixing the micro temperature and humidity sensor at the first preset position, and connecting the micro temperature and humidity sensor to a microcontroller;

[0007] Fixing the micro refrigeration device at the second preset position, and connecting the micro refrigeration device to the microcontroller;

[0008] The microcontroller reads the temperature and humidity data sent by the micro temperature and humidity sensor, calculates the refrigeration data according to the temperature and humidity data using a preset algorithm, and sends a signal containing the refrigeration data to the micro refrigeration device, the refrigeration data includes: refrigeration efficiency and refrigeration time, and the micro refrigeration device performs refrigeration according to the refrigeration data.

[0009] The microcontroller calculates the cooling data using a preset algorithm according to the temperature and humidity data, including:

[0010] Use the preset ARIMA model to analyze the historical temperature data and obtain the predicted temperature data;

[0011] The refrigeration efficiency and refrigeration duration of the micro refrigeration device are determined according to whether the predicted temperature data is greater than or equal to a temperature threshold.

[0012] Wherein, when the predicted temperature data is greater than or equal to the temperature threshold, the process of obtaining the refrigeration efficiency includes:

[0013] Obtaining the absolute value of the difference between the temperature threshold and the predicted temperature data corresponding to the temperature threshold at different time variable values, wherein the time variable value ranges from 1 to N;

[0014] Adding all the absolute values ​​in sequence to obtain a first addition result;

[0015] The first addition result is normalized, and the normalized result is multiplied by the actual refrigeration efficiency value at the current moment to obtain the refrigeration efficiency value at the current moment.

[0016] Wherein, when the predicted temperature data is less than the temperature threshold and the difference between the temperature threshold and the predicted temperature data is less than the temperature step, the process of obtaining the refrigeration efficiency includes:

[0017] Obtaining the reciprocal of the absolute value of the difference between the temperature threshold and the predicted temperature data corresponding to the temperature threshold at different time variable values, wherein the time variable value ranges from 1 to N;

[0018] Adding all the reciprocals in sequence to obtain a second addition result;

[0019] The second addition result is normalized, and the normalized result is multiplied by the actual refrigeration efficiency value at the current moment to obtain the refrigeration efficiency value at the current moment.

[0020] The process of obtaining the temperature threshold includes:

[0021] Obtaining an initial ambient temperature value, an initial temperature threshold empirical value, and a temperature value at a current moment outside the diode packaging structure body;

[0022] The temperature threshold at the current moment is obtained by multiplying the initial temperature threshold empirical value by the temperature value at the current moment, and dividing the multiplication result by the initial ambient temperature value.

[0023] An embodiment of the present invention further provides a diode packaging structure, the structure comprising:

[0024] A micro temperature and humidity sensor, a micro refrigeration device, a microcontroller and a diode packaging structure body, wherein the microcontroller is connected to the micro temperature and humidity sensor and the micro refrigeration device respectively, the micro temperature and humidity sensor and the micro refrigeration device are packaged inside the diode packaging structure body, and the microcontroller is packaged outside the diode packaging structure body;

[0025] The micro temperature and humidity sensor is arranged at a first preset position inside the diode packaging structure body, and the first preset position can ensure that the micro temperature and humidity sensor can accurately collect the temperature and humidity conditions around the diode, and the micro refrigeration device is arranged at a second preset position inside the diode packaging structure body, and the second preset position can ensure that the micro refrigeration device is at a preset position away from the diode;

[0026] The micro temperature and humidity sensor sends the temperature and humidity data to the microcontroller. The microcontroller calculates the refrigeration data based on the temperature and humidity data using a preset algorithm, and sends a signal containing the refrigeration data to the micro refrigeration device. The refrigeration data includes: refrigeration efficiency and refrigeration time. The micro refrigeration device performs refrigeration according to the refrigeration data.

[0027] The microcontroller calculates the cooling data using a preset algorithm according to the temperature and humidity data, including:

[0028] Use the preset ARIMA model to analyze the historical temperature data and obtain the predicted temperature data;

[0029] The refrigeration efficiency and refrigeration duration of the micro refrigeration device are determined according to whether the predicted temperature data is greater than or equal to a temperature threshold.

[0030] Wherein, when the predicted temperature data is greater than or equal to the temperature threshold, the process of obtaining the refrigeration efficiency includes:

[0031] Obtaining the absolute value of the difference between the temperature threshold and the predicted temperature data corresponding to the temperature threshold at different time variable values, wherein the time variable value ranges from 1 to N;

[0032] Adding all the absolute values ​​in sequence to obtain a first addition result;

[0033] The first addition result is normalized, and the normalized result is multiplied by the actual refrigeration efficiency value at the current moment to obtain the refrigeration efficiency value at the current moment.

[0034] Wherein, when the predicted temperature data is less than the temperature threshold and the difference between the temperature threshold and the predicted temperature data is less than the temperature step, the process of obtaining the refrigeration efficiency includes:

[0035] Obtaining the reciprocal of the absolute value of the difference between the temperature threshold and the predicted temperature data corresponding to the temperature threshold at different time variable values, wherein the time variable value ranges from 1 to N;

[0036] Adding all the reciprocals in sequence to obtain a second addition result;

[0037] The second addition result is normalized, and the normalized result is multiplied by the actual refrigeration efficiency value at the current moment to obtain the refrigeration efficiency value at the current moment.

[0038] The process of obtaining the temperature threshold includes:

[0039] Obtaining an initial ambient temperature value, an initial temperature threshold empirical value, and a temperature value at a current moment outside the diode packaging structure body;

[0040] The temperature threshold at the current moment is obtained by multiplying the initial temperature threshold empirical value by the temperature value at the current moment, and dividing the multiplication result by the initial ambient temperature value.

[0041] The present invention has the following beneficial effects:

[0042] In the present invention, the micro temperature and humidity sensor sends the temperature and humidity data to the microcontroller, and the microcontroller calculates the refrigeration data according to the temperature and humidity data using a preset algorithm, and sends a signal containing the refrigeration data to the micro refrigeration device, and the refrigeration data includes: refrigeration efficiency and refrigeration time, and the micro refrigeration device performs refrigeration according to the refrigeration data. The acquisition of the refrigeration data is very accurate, because the temperature and humidity data collected by the micro temperature and humidity sensor is the temperature and humidity data around the diode inside the diode packaging structure body, and the acquisition of temperature and humidity data is more accurate and more representative. In addition, the acquisition of the refrigeration data is also very accurate, and the time threshold is not fixed, but changes with the temperature data outside the diode packaging structure body. The present invention creatively obtains the refrigeration efficiency in two cases based on the judgment condition of whether the predicted temperature data is greater than or equal to the temperature threshold. The refrigeration efficiency has strong adjustable ability and can adapt to the change of the predicted temperature data, so that the diode is in the best temperature environment, eliminating the influence of the abnormal environment on the diode light emission. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] In order to more clearly illustrate the technical solutions and advantages in the embodiments of the present invention or the prior art, the drawings required for use in the embodiments or the prior art descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0044] Figure 1 A flow chart of a diode packaging method provided by one embodiment of the present invention;

[0045] Figure 2 A flowchart of a process for obtaining refrigeration data provided by an embodiment of the present invention;

[0046] Figure 3 A flowchart of a process for obtaining the refrigeration efficiency when the predicted temperature data is greater than or equal to the temperature threshold provided by an embodiment of the present invention;

[0047] Figure 4 A flowchart of a process for obtaining the refrigeration efficiency when the predicted temperature data is less than the temperature threshold and the difference between the temperature threshold and the predicted temperature data is less than the temperature step provided by an embodiment of the present invention;

[0048] Figure 5 A flowchart of a process for obtaining a temperature threshold provided by an embodiment of the present invention;

[0049] Figure 6A schematic diagram of a diode packaging structure provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0050] In order to further explain the technical means and effects adopted by the present invention to achieve the predetermined invention purpose, the following is a detailed description of a diode packaging structure and packaging method proposed by the present invention, its specific implementation, structure, features and effects, in conjunction with the accompanying drawings and preferred embodiments. In the following description, different "one embodiment" or "another embodiment" does not necessarily refer to the same embodiment. In addition, specific features, structures or characteristics in one or more embodiments may be combined in any suitable form.

[0051] Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs.

[0052] A specific solution of a diode packaging method provided by the present invention is described in detail below with reference to the accompanying drawings.

[0053] See also Figure 1 , which shows a flow chart of a diode packaging method provided by an embodiment of the present invention, the structure includes:

[0054] S101. A first preset position and a second preset position are reserved inside the diode packaging structure body, wherein the first preset position can ensure that the micro temperature and humidity sensor can accurately collect the temperature and humidity conditions around the diode, and the second preset position can ensure that the micro refrigeration device is at a preset distance from the diode;

[0055] S102. Fixing the micro temperature and humidity sensor at the first preset position, and connecting the micro temperature and humidity sensor to the microcontroller;

[0056] S103. Fixing the micro refrigeration device at the second preset position, and connecting the micro refrigeration device to the microcontroller;

[0057] S104. The microcontroller reads the temperature and humidity data sent by the micro temperature and humidity sensor, calculates the refrigeration data according to the temperature and humidity data using a preset algorithm, and sends a signal containing the refrigeration data to the micro refrigeration device, wherein the refrigeration data includes: refrigeration efficiency and refrigeration time, and the micro refrigeration device performs refrigeration according to the refrigeration data.

[0058] The model of the micro temperature sensor is AHT20-F. The temperature accuracy of the micro temperature sensor is ±0.1°C and the humidity accuracy is ±1%. The operating range of the micro temperature sensor is: temperature: -40°C to 125°C, humidity: 0%-100%RH. The size of the micro temperature sensor is less than or equal to 2mm x 2mm x 0.5mm.

[0059] The model of the micro refrigeration device is TES1-007008, the refrigeration capacity is 0.5W-2W, the working voltage is 2V-5V. The size of the micro refrigeration device is less than or equal to 12.5mm × 12.5mm × 3mm.

[0060] The microcontroller is a low-power MCU, such as TI MSP430 series or Atmel ATtiny series, with an integrated ADC (analog-to-digital converter) and the like, and has an I2C / SPI interface for data reading.

[0061] The second preset position should be set in consideration of the thermal coupling efficiency between the micro-refrigeration device and the diode.

[0062] When the micro temperature and humidity sensor is fixed at the first preset position, the output pin of the micro temperature and humidity sensor can be connected to the input pin of the microcontroller by conductive glue or welding.

[0063] When the micro-refrigeration device is fixed at the second preset position, the micro-refrigeration device is connected to the control pin and the power supply of the microcontroller.

[0064] The diode is a light emitting diode.

[0065] Figure 2 A flowchart of a process for acquiring cooling data provided by an embodiment of the present invention, wherein the microcontroller calculates cooling data using a preset algorithm according to the temperature and humidity data, including:

[0066] S201. Analyze the temperature history data using a preset ARIMA model to obtain predicted temperature data;

[0067] The acquisition frequency of the temperature history data p may be 1 time / second, and the subscript represents the acquisition time, and the following data sequence may be obtained:

[0068]

[0069] The ARIMA model is an existing prediction algorithm that can predict future temperature data, i.e., predicted temperature data, based on historical temperature data. This will not be described in detail here. The purpose of obtaining predicted temperature data is to improve the real-time performance of cooling, because when the temperature data reaches a fixed threshold, the cooling effect starts slowly, and high temperature may still cause the quality of the phosphor to vary.

[0070] S202. Determine the refrigeration efficiency and refrigeration duration of the micro refrigeration device according to whether the predicted temperature data is greater than or equal to a temperature threshold.

[0071] The cooling efficiency and cooling time are adaptively assigned according to the predicted temperature data, so as to accurately eliminate the damage to LED light emission.

[0072] Figure 3 A flowchart of a process for obtaining the refrigeration efficiency when the predicted temperature data is greater than or equal to the temperature threshold is provided for an embodiment of the present invention. When the predicted temperature data is greater than or equal to the temperature threshold, the process for obtaining the refrigeration efficiency includes:

[0073] S301. Obtaining the absolute value of the difference between the temperature threshold and the predicted temperature data corresponding to the temperature threshold at different time variable values, wherein the time variable value ranges from 1 to N;

[0074] The absolute value of the difference is as follows:

[0075]

[0076] Among them, the is the temperature threshold at time t+n, is the predicted temperature data at time t+n.

[0077] The value range of the time variable value n is 1-N, where N is the cooling time.

[0078] S302. Adding all the absolute values ​​in sequence to obtain a first addition result;

[0079] The process of obtaining the first addition result is:

[0080]

[0081] S303. Normalize the first addition result, and multiply the normalized result by the actual cooling efficiency value at the current moment to obtain the cooling efficiency value at the current moment.

[0082] The process of obtaining the refrigeration efficiency value is as follows:

[0083]

[0084] Among them, Norm is the normalization function, is the actual cooling efficiency value at the current time t, The refrigeration efficiency value at the current time t is the refrigeration efficiency value of the micro refrigeration device. The normalization method may be a range normalization method, which is a prior art and will not be described in detail herein. The value of is (1, N), which represents the time distance from the current time t. For example, when n=1, t+n is t+1, which represents the time of 1 unit time distance after the current time t. The unit time distance is a preset value, which can be set to one second, one minute, etc.

[0085] By summing the difference between the predicted temperature data value and the rated data value, i.e., the temperature threshold value, in different time periods, the temperature change trend in the diode in the future period is determined. The greater the difference, the greater the amount exceeding the temperature threshold value, the higher the corresponding cooling efficiency value, and the higher the degree of suppression of the high temperature affecting the phosphor in the diode package.

[0086] Figure 4 A flowchart of a process for obtaining the refrigeration efficiency when the predicted temperature data is less than the temperature threshold and the difference between the temperature threshold and the predicted temperature data is less than the temperature step is provided for an embodiment of the present invention. When the predicted temperature data is less than the temperature threshold and the difference between the temperature threshold and the predicted temperature data is less than the temperature step, the process for obtaining the refrigeration efficiency includes:

[0087] S401. Obtain the reciprocal of the absolute value of the difference between the temperature threshold and the predicted temperature data corresponding to the temperature threshold at different time variable values, where the time variable value ranges from 1 to N;

[0088] The reciprocal of the absolute value of the difference is as follows:

[0089]

[0090] Among them, the is the temperature threshold at time t+n, is the predicted temperature data at time t+n.

[0091] The value range of the time variable value n is 1-N, where N is the cooling time.

[0092] S402. Adding all the reciprocals in sequence to obtain a second addition result;

[0093] The process of obtaining the second addition result is:

[0094]

[0095] S403. Normalize the second addition result, and multiply the normalized result by the actual refrigeration efficiency value at the current moment to obtain the refrigeration efficiency value at the current moment.

[0096] The process of obtaining the refrigeration efficiency value is as follows:

[0097]

[0098] Among them, Norm is the normalization function, is the actual cooling efficiency value at the current time t, The refrigeration efficiency value at the current time t is the refrigeration efficiency value of the micro refrigeration device. The normalization method may be a range normalization method, which is a prior art and will not be described in detail herein. The value of is (1, N), which represents the time distance from the current time t. For example, when n=1, t+n is t+1, which represents the time of 1 unit time distance after the current time t. The unit time distance is a preset value, which can be set to one second, one minute, etc.

[0099] When the predicted temperature data is less than the temperature threshold and the difference between the temperature threshold and the predicted temperature data is less than the temperature step, the cooling efficiency is inversely proportional to the difference between the predicted temperature data value and the rated data value, i.e., the temperature threshold. This is because: when the predicted temperature data is less than the temperature threshold, but the two gradually approach, i.e., the predicted temperature data value gradually approaches the temperature threshold, the lower the difference between the two, then it can be determined that the cooling efficiency needs to be increased because the high temperature effect needs to be avoided. The temperature step can be set by the user.

[0100] After analyzing the relationship between the predicted temperature data and the temperature threshold, it is necessary to preset the temperature threshold at different times. Generally, it is sufficient to preset it according to the empirical value. However, due to the differences in the working environment of the diode, the temperature threshold needs to be continuously iterated. The specific reasons are:

[0101] The forward voltage of the diode decreases with increasing temperature, with a temperature coefficient of about -2mV / ℃. In a high temperature environment, the forward voltage of the diode will decrease due to the characteristics, and this change is a known factor in the design. In order to avoid additional impact on system performance, it is more reasonable to set a higher startup threshold in a high temperature environment. In addition, in summer or tropical areas, the ambient temperature is high for a long time. Setting a higher startup threshold helps the system adapt to environmental changes and maintain stable operation, without frequently starting the refrigeration equipment due to temperature fluctuations.

[0102] Figure 5 A flowchart of a process for obtaining a temperature threshold provided by an embodiment of the present invention, wherein the process for obtaining the temperature threshold includes:

[0103] S501. Obtaining the initial ambient temperature value, the initial temperature threshold empirical value and the temperature value at the current moment outside the diode packaging structure body;

[0104] The set of ambient temperature values ​​outside the diode packaging structure body can be expressed as:

[0105]

[0106] Among them, the is the initial ambient temperature value, is the temperature value at the current moment t.

[0107] S502. Multiply the initial temperature threshold empirical value by the temperature value at the current moment, and divide the multiplication result by the initial ambient temperature value to obtain the temperature threshold at the current moment.

[0108]

[0109] Among them, the is the empirical value of the initial temperature threshold, is the temperature threshold at the current time t.

[0110] In this way, a higher start threshold is set in a high temperature environment, and the size of the temperature threshold is logical.

[0111] Figure 6 A schematic diagram of a diode packaging structure provided by an embodiment of the present invention, the structure comprising:

[0112] A micro temperature and humidity sensor 601, a micro refrigeration device 604, a microcontroller 602 and a diode package structure body, wherein the microcontroller 602 is connected to the micro temperature and humidity sensor 601 and the micro refrigeration device 604 respectively, the micro temperature and humidity sensor 601 and the micro refrigeration device 604 are packaged inside the diode package structure body, and the microcontroller 602 is packaged outside the diode package structure body;

[0113] The micro temperature and humidity sensor 601 is arranged at a first preset position inside the diode packaging structure body, and the first preset position can ensure that the micro temperature and humidity sensor 601 can accurately collect the temperature and humidity conditions around the diode, and the micro refrigeration device 604 is arranged at a second preset position inside the diode packaging structure body, and the second preset position can ensure that the micro refrigeration device 604 is at a preset position away from the diode 603;

[0114] The micro temperature and humidity sensor 601 sends the temperature and humidity data to the microcontroller 602. The microcontroller 602 calculates the cooling data according to the temperature and humidity data using a preset algorithm, and sends a signal containing the cooling data to the micro refrigeration device 604. The cooling data includes: cooling efficiency and cooling time. The micro refrigeration device 604 performs cooling according to the cooling data.

[0115] The microcontroller calculates the cooling data using a preset algorithm according to the temperature and humidity data, including:

[0116] Use the preset ARIMA model to analyze the historical temperature data and obtain the predicted temperature data;

[0117] The refrigeration efficiency and refrigeration duration of the micro refrigeration device are determined according to whether the predicted temperature data is greater than or equal to a temperature threshold.

[0118] Wherein, when the predicted temperature data is greater than or equal to the temperature threshold, the process of obtaining the refrigeration efficiency includes:

[0119] Obtaining the absolute value of the difference between the temperature threshold and the predicted temperature data corresponding to the temperature threshold at different time variable values, wherein the time variable value ranges from 1 to N;

[0120] Adding all the absolute values ​​in sequence to obtain a first addition result;

[0121] The first addition result is normalized, and the normalized result is multiplied by the actual refrigeration efficiency value at the current moment to obtain the refrigeration efficiency value at the current moment.

[0122] Wherein, when the predicted temperature data is less than the temperature threshold and the difference between the temperature threshold and the predicted temperature data is less than the temperature step, the process of obtaining the refrigeration efficiency includes:

[0123] Obtaining the reciprocal of the absolute value of the difference between the temperature threshold and the predicted temperature data corresponding to the temperature threshold at different time variable values, wherein the time variable value ranges from 1 to N;

[0124] Adding all the reciprocals in sequence to obtain a second addition result;

[0125] The second addition result is normalized, and the normalized result is multiplied by the actual refrigeration efficiency value at the current moment to obtain the refrigeration efficiency value at the current moment.

[0126] The process of obtaining the temperature threshold includes:

[0127] Obtaining an initial ambient temperature value, an initial temperature threshold empirical value, and a temperature value at a current moment outside the diode packaging structure body;

[0128] The temperature threshold at the current moment is obtained by multiplying the initial temperature threshold empirical value by the temperature value at the current moment, and dividing the multiplication result by the initial ambient temperature value.

[0129] The technical features and technical effects of a diode packaging structure proposed in an embodiment of the present invention are the same as those of the method proposed in an embodiment of the present invention, and will not be described in detail herein.

[0130] The present invention has the following beneficial effects:

[0131] In the present invention, the micro temperature and humidity sensor sends the temperature and humidity data to the microcontroller, and the microcontroller calculates the refrigeration data according to the temperature and humidity data using a preset algorithm, and sends a signal containing the refrigeration data to the micro refrigeration device, and the refrigeration data includes: refrigeration efficiency and refrigeration time, and the micro refrigeration device performs refrigeration according to the refrigeration data. The acquisition of the refrigeration data is very accurate, because the temperature and humidity data collected by the micro temperature and humidity sensor is the temperature and humidity data around the diode inside the diode packaging structure body, and the acquisition of temperature and humidity data is more accurate and more representative. In addition, the acquisition of the refrigeration data is also very accurate, and the time threshold is not fixed, but changes with the temperature data outside the diode packaging structure body. The present invention creatively obtains the refrigeration efficiency in two cases based on the judgment condition of whether the predicted temperature data is greater than or equal to the temperature threshold. The refrigeration efficiency has strong adjustable ability and can adapt to the change of the predicted temperature data, so that the diode is in the best temperature environment, eliminating the influence of the abnormal environment on the diode light emission.

[0132] It should be noted that the sequence of the above embodiments of the present invention is only for description and does not represent the advantages and disadvantages of the embodiments. The processes depicted in the accompanying drawings do not necessarily require the specific order or continuous order shown to achieve the desired results. In some embodiments, multitasking and parallel processing are also possible or may be advantageous.

[0133] The various embodiments in this specification are described in a progressive manner, and the same or similar parts between the various embodiments can be referenced to each other, and each embodiment focuses on the differences from other embodiments.

Claims

1. A diode packaging method, characterized in that: The method comprises: A first preset position and a second preset position are reserved inside the diode packaging structure body, wherein the first preset position can ensure that the micro temperature and humidity sensor can accurately collect the temperature and humidity conditions around the diode, and the second preset position can ensure that the micro refrigeration device is at a preset position away from the diode; Fixing the micro temperature and humidity sensor at the first preset position, and connecting the micro temperature and humidity sensor to a microcontroller; Fixing the micro refrigeration device at the second preset position, and connecting the micro refrigeration device to the microcontroller; The microcontroller reads the temperature and humidity data sent by the micro temperature and humidity sensor, calculates the cooling data according to the temperature and humidity data using a preset algorithm, and sends a signal containing the cooling data to the micro refrigeration device, wherein the cooling data includes cooling efficiency and cooling time, and the micro refrigeration device performs cooling according to the cooling data; The microcontroller calculates the cooling data using a preset algorithm according to the temperature and humidity data, including: using a preset ARIMA model to analyze the temperature history data to obtain predicted temperature data; determining the cooling efficiency and cooling time of the micro-refrigeration device according to whether the predicted temperature data is greater than or equal to a temperature threshold; Wherein, when the predicted temperature data is greater than or equal to the temperature threshold, the process of obtaining the cooling efficiency includes: obtaining the absolute value of the difference between the temperature threshold and the predicted temperature data corresponding to the temperature threshold at different time variable values, and the value of the time variable value is 1-N; adding all the absolute values ​​in sequence to obtain a first addition result; normalizing the first addition result, and multiplying the normalized result by the actual cooling efficiency value at the current moment to obtain the cooling efficiency value at the current moment; Wherein, when the predicted temperature data is less than the temperature threshold and the difference between the temperature threshold and the predicted temperature data is less than the temperature step, the process of obtaining the cooling efficiency includes: obtaining the reciprocal of the absolute value of the difference between the temperature threshold and the predicted temperature data corresponding to the temperature threshold at different time variable values, and the value of the time variable value is 1-N; adding all the reciprocals in sequence to obtain a second addition result; normalizing the second addition result, and multiplying the normalized result by the actual cooling efficiency value at the current moment to obtain the cooling efficiency value at the current moment; Among them, the process of obtaining the temperature threshold includes: obtaining the initial ambient temperature value outside the diode packaging structure body, the initial temperature threshold empirical value and the temperature value at the current moment; multiplying the initial temperature threshold empirical value with the temperature value at the current moment, and dividing the multiplication result by the initial ambient temperature value to obtain the temperature threshold at the current moment.

2. A diode packaging structure, characterized in that: The structure comprises: A micro temperature and humidity sensor, a micro refrigeration device, a microcontroller and a diode packaging structure body, wherein the microcontroller is connected to the micro temperature and humidity sensor and the micro refrigeration device respectively, the micro temperature and humidity sensor and the micro refrigeration device are packaged inside the diode packaging structure body, and the microcontroller is packaged outside the diode packaging structure body; The micro temperature and humidity sensor is arranged at a first preset position inside the diode packaging structure body, and the first preset position can ensure that the micro temperature and humidity sensor can accurately collect the temperature and humidity conditions around the diode, and the micro refrigeration device is arranged at a second preset position inside the diode packaging structure body, and the second preset position can ensure that the micro refrigeration device is at a preset position away from the diode; The micro temperature and humidity sensor sends the temperature and humidity data to the microcontroller, and the microcontroller calculates the cooling data using a preset algorithm according to the temperature and humidity data, and sends a signal containing the cooling data to the micro refrigeration device, wherein the cooling data includes cooling efficiency and cooling time, and the micro refrigeration device performs cooling according to the cooling data; The microcontroller calculates the cooling data using a preset algorithm according to the temperature and humidity data, including: using a preset ARIMA model to analyze the temperature history data to obtain predicted temperature data; determining the cooling efficiency and cooling time of the micro-refrigeration device according to whether the predicted temperature data is greater than or equal to a temperature threshold; Wherein, when the predicted temperature data is greater than or equal to the temperature threshold, the process of obtaining the cooling efficiency includes: obtaining the absolute value of the difference between the temperature threshold and the predicted temperature data corresponding to the temperature threshold at different time variable values, and the value of the time variable value is 1-N; adding all the absolute values ​​in sequence to obtain a first addition result; normalizing the first addition result, and multiplying the normalized result by the actual cooling efficiency value at the current moment to obtain the cooling efficiency value at the current moment; Wherein, when the predicted temperature data is less than the temperature threshold and the difference between the temperature threshold and the predicted temperature data is less than the temperature step, the process of obtaining the cooling efficiency includes: obtaining the reciprocal of the absolute value of the difference between the temperature threshold and the predicted temperature data corresponding to the temperature threshold at different time variable values, and the value of the time variable value is 1-N; adding all the reciprocals in sequence to obtain a second addition result; normalizing the second addition result, and multiplying the normalized result by the actual cooling efficiency value at the current moment to obtain the cooling efficiency value at the current moment; Among them, the process of obtaining the temperature threshold includes: obtaining the initial ambient temperature value outside the diode packaging structure body, the initial temperature threshold empirical value and the temperature value at the current moment; multiplying the initial temperature threshold empirical value with the temperature value at the current moment, and dividing the multiplication result by the initial ambient temperature value to obtain the temperature threshold at the current moment.

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