Camera modules and electronic equipment

Abstract

The present invention relates to a camera module and an electronic device, which can effectively reduce the height of the module and meet the requirements of thinness and lightness of the camera module. The camera module includes: a photosensitive component, including a supporting substrate, a photosensitive chip arranged on the supporting substrate, and a filter element arranged in the photosensitive path of the photosensitive chip, the filter element is at least partially located above the supporting substrate; and a lens assembly, wherein the lens assembly is assembled on the supporting substrate, and the lens assembly includes a movable part, an optical lens, and a stopper for limiting the movement of the movable part; wherein the optical lens is arranged on the movable part, and the optical lens is located in the photosensitive path of the photosensitive chip; wherein the stopper is located on the outer side of the filter element, and the lower surface of the stopper is lower than the upper surface of the filter element.

Description

Technical Field

[0001] The present invention relates to the field of imaging technology, and in particular to a camera module and electronic equipment. Background Art

[0002] With the advancement and development of science and technology, electronic devices with camera functions are increasingly moving towards high performance and lightweight. As one of the core configurations of electronic products, the camera module must be adaptively adjusted in terms of performance and size. In other words, in this round of technological innovation, each component in the camera module needs to make corresponding changes in performance and size.

[0003] As electronic devices such as mobile phones have higher and higher requirements for thinner and lighter camera modules, the functional integration of camera modules is also getting higher and higher. In the prior art, a camera module usually includes a lens assembly and a photosensitive assembly assembled together, and the lens assembly includes a motor, and the motor may include a fixed part and a movable part constrained to the fixed part in a movable and / or rotatable manner, wherein the movable part is equipped with a lens, and the lens is located in the photosensitive path of the photosensitive assembly, so that the movable part can drive the lens to move and / or rotate relative to the photosensitive assembly to achieve the focusing function and / or anti-shake function of the camera module. In order to limit the movement and / or rotation of the movable part, the existing motor usually sets a stopper made of a buffer material on the fixed part or the movable part, so that the stopper can reduce chipping and deformation when it contacts the object being collided.

[0004] However, the lens assembly in the existing camera module is usually located above the photosensitive assembly as a whole, resulting in the camera module still being relatively high, which makes it difficult to meet the requirements for making the camera module thin and light. Summary of the invention

[0005] One advantage of the present invention is that it provides a camera module and an electronic device, which can effectively reduce the height of the module and meet the requirements of making the camera module lighter and thinner.

[0006] In order to achieve at least one of the above advantages or other advantages and purposes of the present invention, the present invention provides a camera module, including:

[0007] A photosensitive component, comprising a supporting substrate, a photosensitive chip disposed on the supporting substrate, and a filter element disposed in a light sensing path of the photosensitive chip, wherein the filter element is at least partially located above the supporting substrate; and

[0008] A lens assembly, wherein the lens assembly is assembled on the supporting substrate, and the lens assembly includes a movable part, an optical lens, and a stopper for limiting the movement of the movable part; wherein the optical lens is arranged on the movable part, and the optical lens is located in the light-sensitive path of the photosensitive chip; wherein the stopper is located on the outer side of the filter element, and the lower surface of the stopper is lower than the upper surface of the filter element.

[0009] With such a configuration, the camera module of the present application moves the stopper outward to the outer side of the filter element, allowing the lower surface of the stopper to sink to a position lower than the upper surface of the filter element, so that the stopper and the photosensitive component can at least partially overlap in the direction of the optical axis, ensuring that the position of the stopper is closer to the bottom surface of the photosensitive component, which helps to reduce the overall height of the camera module to meet the requirements of making the camera module thin and light.

[0010] In one embodiment of the present application, the lens assembly further comprises a fixed portion mounted on the supporting substrate, the fixed portion and the supporting substrate jointly define a cavity, and the movable portion is movably constrained within the cavity.

[0011] In one embodiment of the present application, the stopper is provided on the fixing portion.

[0012] In one embodiment of the present application, the movable part is constrained to the fixed part in a manner that it can move along the optical axis direction of the optical lens, and the stopper is at least partially located below the movable part.

[0013] In one embodiment of the present application, along a direction parallel to the optical axis of the optical lens, a distance between the movable part and the stopper is smaller than a distance between the movable part and the filter element.

[0014] With such arrangement, the stopper of the present application can prevent the movable part of the lens assembly from colliding with the filter element when moving downward along the optical axis, thereby avoiding the filter element from being cracked.

[0015] In one embodiment of the present application, an upper surface of the stopper is higher than an upper surface of the filter element.

[0016] With such an arrangement, the camera module of the present application can reserve more space above the filter element to arrange the optical lens, thereby making it easier to achieve that the axial distance between the movable part and the stopper is smaller than the axial distance between the movable part and the filter element, thereby reducing the design difficulty and making it less likely for the optical lens to collide with the filter element.

[0017] In one embodiment of the present application, along a direction parallel to the optical axis of the optical lens, a distance between the stopper and the supporting substrate is smaller than a distance between an upper surface of the stopper and an upper surface of the filter element.

[0018] With such a configuration, the camera module of the present application can design the height position of the stopper to be lower, so as to further reduce the overall height of the camera module.

[0019] In one embodiment of the present application, the photosensitive component also includes a bracket, which is at least partially located above the supporting substrate, and a recess is provided on the top of the bracket. The filter element is installed in the recess, and the upper surface of the stopper is higher than the upper surface of the bracket.

[0020] With such an arrangement, the camera module of the present application can accommodate at least a portion of the filter element in the recessed portion, can further lower the height position of the filter element, and increase the distance between the filter element and the movable part, thereby making it less likely for the movable part to collide with the filter element.

[0021] In one embodiment of the present application, the supporting substrate includes a photosensitive circuit board electrically connected to the photosensitive chip, wherein the bracket is fixedly connected to the photosensitive circuit board, and a gap is formed between the bracket and the fixed part; the electronic components on the photosensitive circuit board are located between the outer wall of the bracket and the inner wall of the fixed part.

[0022] With such an arrangement, the camera module of the present application can reduce the circumferential size of the bracket, thereby reducing the size of the filter element and improving the crack resistance of the filter element.

[0023] In one embodiment of the present application, the lens assembly also includes a shielding portion extending inward from the inner side wall of the fixed portion, and along a direction parallel to the optical axis of the optical lens, the shielding portion is located between the movable portion and the electronic component.

[0024] With such a configuration, the shielding portion of the present application can shield the electronic components, which can not only protect the electronic components, but also block light from irradiating to the electronic components, effectively reducing the impact of stray light.

[0025] In one embodiment of the present application, the photosensitive component also includes a step portion, which is arranged on the outer wall of the bracket, and the shielding portion extends inward from the inner wall of the fixed portion to above the step surface of the step portion.

[0026] With such arrangement, a space for avoiding the shielding portion can be formed above the step surface of the step portion of the present application, so as to further reduce the module size.

[0027] In one embodiment of the present application, the supporting substrate includes a photosensitive circuit board electrically connected to the photosensitive chip, wherein the bracket is injection molded on the supporting substrate and encapsulates the electrical connection structure between the photosensitive chip and the photosensitive circuit board.

[0028] In one embodiment of the present application, the lens assembly also includes a rigid member, which includes a first part embedded in the fixed part and a second part extending inward from the first part into the cavity; the stop member is a flexible material member installed on the second part.

[0029] With such a configuration, the movable part of the present application will first contact the stopper made of a flexible material before contacting the filter element, ensuring that the stopper has a good buffering effect and can prevent the movable part from generating chips when colliding with the stopper made of a hard material.

[0030] In one embodiment of the present application, the stopper is provided on the movable part.

[0031] In one embodiment of the present application, the movable part is constrained to the fixed part in such a manner that it can move along the optical axis direction of the optical lens, and along the direction parallel to the optical axis of the optical lens, the distance between the stopper and the photosensitive component is smaller than the distance between the optical lens and the filter element.

[0032] With such an arrangement, the stopper of the present application can prevent the movable part of the lens assembly from directly contacting the filter element of the photosensitive assembly when moving downward along the optical axis, thereby avoiding damage to the filter element.

[0033] In one embodiment of the present application, the filter element is mounted on the supporting substrate.

[0034] According to another aspect of the present application, the present application further provides an electronic device, including:

[0035] The device itself; and

[0036] Any of the camera modules described above, wherein the camera module is assembled on the device body. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] Figure 1 is a three-dimensional schematic diagram of a camera module according to an embodiment of the present application;

[0038] Figure 2 A first example of a camera module according to the above embodiment of the present application is shown;

[0039] Figure 3A schematic transverse cross-sectional view of a camera module according to the first example of the present application is shown;

[0040] Figure 4 A longitudinal cross-sectional schematic diagram of a camera module according to the first example of the present application is shown;

[0041] Figure 5 A schematic structural diagram of the camera module according to the first example of the present application without the housing and the photosensitive component is shown;

[0042] Figure 6 A three-dimensional schematic diagram of the camera module according to the first example of the present application without movable parts and lenses is shown;

[0043] Figure 7 Shows Figure 6 A longitudinal cross-sectional schematic diagram of the camera module shown;

[0044] Figure 8 A second example of the camera module according to the above embodiment of the present application is shown;

[0045] Fig. 9 A third example of the camera module according to the above embodiment of the present application is shown;

[0046] Fig.10 A schematic transverse cross-sectional view of a camera module according to the third example of the present application is shown;

[0047] Fig.11 A fourth example of the camera module according to the above embodiment of the present application is shown;

[0048] Fig.12 A fifth example of the camera module according to the above embodiment of the present application is shown;

[0049] Fig.13 A sixth example of the camera module according to the above-mentioned embodiment of the present application is shown.

[0050] Main component symbol description: 1. Camera module; 10. Photosensitive component; 11. Support substrate; 111. Photosensitive circuit board; 1110. Electronic components; 112. Reinforcement plate; 1121. First support part; 1122. Second support part; 12. Photosensitive chip; 13. Filter element; 14. Bracket; 140. Concave part; 15. Step part; 20. Lens assembly; 200. Cavity; 21. Movable part; 211. Focus bracket; 212. Magnetic part; 21 3. Anti-shake bracket; 214. Ball bearing; 215. Guide rod; 22. Optical lens; 23. Stopper; 24. Fixed part; 241. Lens base; 242. Lens circuit board; 243. Coil; 25. Shielding part; 26. Rigid part; 261. First part; 2611. Rear embedded arm; 2612. Left embedded arm; 2613. Right embedded arm; 2614. Partial embedded arm; 262. Second part; 2621. First support arm; 2622. Second support arm.

[0051] The above description of the main component symbols is combined with the accompanying drawings and specific implementation methods to further illustrate the present invention in detail. DETAILED DESCRIPTION

[0052] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0053] It should be noted that when a component is referred to as being "mounted on" another component, it may be directly on the other component or there may be a central component. When a component is considered to be "set on" another component, it may be directly set on the other component or there may be a central component at the same time. When a component is considered to be "fixed to" another component, it may be directly fixed on the other component or there may be a central component at the same time.

[0054] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which the present invention belongs. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "or / and" used herein includes any and all combinations of one or more of the related listed items.

[0055] Considering that the lens assembly in the existing camera module is usually located above the photosensitive assembly as a whole, the height of the camera module is still relatively large, which makes it difficult to meet the requirements of the camera module to be thin and light. Therefore, the present application proposes a camera module and an electronic device, which can effectively reduce the module height and meet the requirements of the camera module to be thin and light.

[0056] Specifically, refer to the attached Figure 1 As shown, an embodiment of the present application provides an electronic device, which may include a device body and a camera module 1 mounted on the device body, so as to collect image information for the device body through the camera module 1. It is understandable that the electronic device mentioned in the present application may be implemented as, but not limited to, a smart phone, a smart watch, a tablet or a notebook, etc.

[0057] More specifically, if Figures 1 to 13 As shown, the camera module 1 may include a photosensitive component 10 and a lens component 20. The photosensitive component 10 includes a supporting substrate 11, a photosensitive chip 12 disposed on the supporting substrate 11, and a filter element 13 disposed in the photosensitive path of the photosensitive chip 12. The filter element 13 is at least partially located above the supporting substrate 11, so that in the vertical direction (i.e., the optical axis direction of the optical lens 22), the filter element 13 is closer to the optical lens 22, and the supporting substrate 11 is farther away from the optical lens 22. The lens component 20 is assembled on the supporting substrate 11, and the lens component 20 includes a movable part 21, an optical lens 22, and a stopper 23 for limiting the movement of the movable part 21. The optical lens 22 is disposed on the movable part 21, and the optical lens 22 is located in the photosensitive path of the photosensitive chip 12. The stopper 23 is located on the outer peripheral side of the filter element 13, and the lower surface of the stopper 23 is lower than the upper surface of the filter element 13.

[0058] In this way, the camera module 1 of the present application moves the stopper 23 outward to the outer side of the filter element 13, allowing the lower surface of the stopper 23 to sink to a position lower than the upper surface of the filter element 13, so that the stopper 23 and the photosensitive component 10 can at least partially overlap in the optical axis direction of the optical lens 22, ensuring that the position of the stopper 23 is closer to the bottom surface of the photosensitive component 10, which helps to reduce the overall height of the camera module 1, so as to meet the requirements of the camera module 1 to be lightweight.

[0059] It is worth noting that the stopper 23 can be, but is not limited to, implemented as a flexible material member so as to reduce chipping and deformation when limiting the movement of the movable part 21 .

[0060] For example, Figures 2 to 7As shown, in the first example of the present application, the lens assembly 20 may further include a fixed portion 24 mounted on the support substrate 11, the fixed portion 24 and the support substrate 11 together define a cavity 200, and the movable portion 21 is movably constrained within the cavity 200. It is understandable that the present application does not limit the installation method of the fixed portion 24 on the support substrate 11, for example: the fixed portion 24 may be formed separately first, and then the fixed portion 24 may be bonded to the support substrate 11 through a conductive or non-conductive adhesive, or the fixed portion 24 may be formed on the support substrate 11 through a molding process or a compression molding process. In addition, in other examples of the present application, the lens assembly 20 may not include the fixed portion 24, and the fixed portion is constituted by a part of the support substrate 11, and the movable portion of the lens assembly 20 is mounted on the fixed portion of the support substrate 11, which can reduce the assembly process, and more importantly, can further reduce the size of the camera module 1.

[0061] It is worth noting that the movable part 21 mentioned in the present application can drive the optical lens 22 to move relative to the photosensitive chip 12, and the present application does not restrict the movement of the optical lens 22 relative to the photosensitive chip 12. For example, the optical lens 22 can move along the optical axis of the optical lens 22 relative to the photosensitive chip 12 to achieve the autofocus function of the camera module, and / or, the optical lens 22 can move or rotate relative to the photosensitive chip 12 along a direction perpendicular to the optical axis of the optical lens 22 to achieve the optical image stabilization function of the camera module.

[0062] In addition, since the fixed part 24 and the supporting substrate 11 are relatively stationary, the movement of the movable part 21 is limited by the stopper 23 to prevent the movable part 21 from directly colliding with the fixed part 24 and the photosensitive component 10. It can be understood that the limit of the movable part 21 by the stopper 23 is coordinated with the movement direction of the movable part 21, that is, when the movable part 21 is designed to be along the optical axis of the optical lens 22 (such as Figure 1 For example, the Z direction), the stopper 23 limits the movement of the movable part 21 along the optical axis toward or away from the photosensitive component 10; when the movable part 21 is designed to move along a direction perpendicular to the optical axis of the optical lens 22 (such as Figure 1 For example, if the movable part 21 moves in the X direction or the Y direction), the stopper 23 limits the movable part 21 to move in the direction perpendicular to the optical axis of the optical lens 22.

[0063] Alternatively, if Figures 3 to 7 As shown, the stopper 23 is disposed on the fixed portion 24 so as to block the movable portion 21 and prevent the movable portion 21 from colliding with the photosensitive component 10 .

[0064] Furthermore, if Figures 3 to 5 As shown, the movable part 21 is constrained to the fixed part 24 in a manner that it can move along the optical axis direction of the optical lens 22, and the stopper 23 is at least partially located below the movable part 21. In this way, when the movable part 21 moves downward along the optical axis direction of the optical lens 22 to achieve the autofocus function, the stopper 23 can prevent the movable part 21 from moving downward excessively, thereby preventing the movable part 21 from colliding with the photosensitive component 10. It can be understood that the stopper 23 mentioned in the present application can be located entirely below the movable part 21, or partially below the movable part 21, as long as the stopper 23 is located below the corresponding position on the movable part 21, the desired stopping effect can be achieved. In addition, in other examples, the stopper 23 can be at least partially located below the movable part 21 to limit the upward movement of the movable part 21 along the optical axis.

[0065] It is worth noting that Figure 3 and Figure 4 As shown, the movable part 21 mentioned in the present application may include, but is not limited to, a focus bracket 211 connected to the optical lens 22 and a magnetic member 212 fixed to the focus bracket 211; at the same time, the fixed part 24 mentioned in the present application may include, but is not limited to, a lens base 241 installed on the supporting substrate 11, a lens circuit board 242 arranged on the side wall of the lens base 241, and a coil 243 arranged on the lens circuit board 242 and corresponding to the magnetic member 212; the focus bracket 211 is movably arranged on the lens base 241, so that when the coil 243 is energized, a Lorentz force is generated between the coil 243 and the magnetic member 212, driving the focus bracket 211 to move along the optical axis, and driving the optical lens 22 to move along the optical axis (i.e., the Z-axis direction), thereby realizing the automatic focusing function of the camera module 1. It can be understood that in other examples of the present application, the magnetic member 212 can be set in the fixed part 24, and the coil 243 can be set in the movable part 21; in other embodiments of the present application, the movable part 21 can also adopt other types of driving mechanisms such as piezoelectric actuators, SMA actuators, etc.

[0066] In addition, in order to realize the optical image stabilization function of the camera module 1, as Figures 3 to 5As shown, the movable part 21 of the present application can further include an anti-shake bracket 213 that is movably arranged inside the focus bracket 211 and fixedly connected to the optical lens 22; at this time, a pair of magnetic parts 212 are fixedly arranged on the adjacent side walls of the anti-shake bracket 213, and a pair of coils 243 corresponding to the two magnetic parts 212 are additionally arranged on the lens circuit board 242 as anti-shake coils. In this way, when a certain anti-shake coil is energized, a Lorentz force will be generated between the anti-shake coil and the corresponding magnetic part 212 to drive the anti-shake bracket 213 to move left and right or forward and backward, and drive the optical lens 22 to move in the left and right direction (i.e., as shown in FIG. 2 ). Figure 3 X-axis direction as shown) or front-to-back direction (i.e. Figure 3 The lens assembly 20 can also move in the X-axis direction (the Y-axis direction shown) to achieve the X-axis or Y-axis anti-shake function of the camera module 1. It can be understood that the magnetic parts mentioned in the present application can be but are not limited to being implemented as magnets or magnets. It can be understood that in other embodiments, the lens assembly 20 may not include an anti-shake mechanism, that is, the lens assembly 20 only includes an autofocus drive mechanism, so that the camera module is only an autofocus module, or the anti-shake mechanism is arranged in the photosensitive component part, such as the chip is arranged to have an anti-shake function, so that the camera module 1 is implemented as a lens focus and chip anti-shake module.

[0067] Alternatively, if Figure 3 and Figure 5 As shown, the movable part 21 of the lens assembly 20 further includes a ball bearing 214 disposed between the lens base 241 and the focus bracket 211, so as to support the focus bracket 211 axially movably within the lens base 241, so as to meet the moving space required for autofocus. In addition, a ball bearing may also be disposed between the focus bracket 211 and the anti-shake bracket 213, so as to movably support the anti-shake bracket 213 on the focus bracket 211, so as to meet the moving space required for optical image stabilization.

[0068] Alternatively, if Figure 4 As shown, along the direction parallel to the optical axis of the optical lens 22, the distance between the movable part 21 and the stopper 23 is smaller than the distance between the movable part 21 and the filter element 13, so that the movable part 21 is closer to the stopper 23; when the movable part 21 of the lens assembly 20 drives the optical lens 22 to move downward along the optical axis direction of the optical lens 22, the movable part 21 first contacts the stopper 23, which can ensure that the optical lens 22 does not collide with the filter element 13, thereby preventing the filter element 13 from being cracked.

[0069] Preferably, if Figure 7As shown, the upper surface of the stopper 23 is higher than the upper surface of the filter element 13. In this way, the camera module 1 of the present application can reserve more space above the filter element 13 to arrange the optical lens 22, so that it is easier to achieve that the axial distance between the movable part 21 and the stopper 23 is smaller than the axial distance between the movable part 21 and the filter element 13, reducing the design difficulty, so that the optical lens 22 is less likely to collide with the filter element 13.

[0070] In addition, if Figure 7 As shown, along the direction parallel to the optical axis of the optical lens 22, the distance between the stopper 23 and the support substrate 11 can be smaller than the distance between the upper surface of the stopper 23 and the upper surface of the filter element 13. In this way, the camera module 1 of the present application can design the height position of the stopper 23 to be lower, so as to further reduce the overall height of the camera module 1; and, because there are inevitable tolerances in the production and assembly of the stopper 23 and the filter element 13, the distance between the upper surface of the stopper 23 and the upper surface of the filter element 13 is designed to be larger, which can also reduce the upper surface of the filter element 13 being higher than the upper surface of the stopper 23 or flush with the upper surface of the stopper 23 due to processing tolerance and assembly tolerance.

[0071] According to the above first example of the present application, Figures 2 to 7 As shown, the photosensitive component 10 may further include a bracket 14, the bracket 14 is at least partially located above the supporting substrate 11, a recess 140 is provided on the top of the bracket 14, the filter element 13 is installed in the recess 140, and the upper surface of the stopper 23 is higher than the upper surface of the bracket 14, so as to effectively prevent the movable part 21 from colliding with the bracket 14. In addition, the filter element 13 of the present application is installed in the recess 140 of the bracket 14, that is, the filter element 13 is arranged downward relative to the bracket 14, and at least a part of the filter element 13 can be accommodated in the recess 140, which can further reduce the height position of the filter element 13 and increase the distance between the filter element 13 and the movable part 21, so that the movable part 21 is less likely to collide with the filter element 13. More preferably, the lower surface of the filter element 13 is designed to be lower than the upper surface of the bracket 14 , which can further thin the photosensitive component and enhance the anti-collision effect of the filter element 13 .

[0072] Alternatively, if Figure 4 and Figure 7As shown, the supporting substrate 11 includes a photosensitive circuit board 111 electrically connected to the photosensitive chip 12, wherein the bracket 14 is fixedly connected to the photosensitive circuit board 111, and a gap is formed between the bracket 14 and the fixed part 24; the electronic components 1110 on the photosensitive circuit board 111 are located between the outer wall of the bracket 14 and the inner wall of the fixed part 24, so as to reduce the circumferential size of the bracket 14, thereby reducing the size of the filter element 13, which is beneficial to improve the crack resistance of the filter element 13.

[0073] It is worth noting that the front side of the photosensitive chip 12 may have a photosensitive area and a non-photosensitive area located outside the photosensitive area, and the non-photosensitive area of ​​the photosensitive chip 12 is electrically connected to the photosensitive circuit board 111. The non-photosensitive area of ​​the photosensitive chip 12 is electrically connected to the photosensitive circuit board 111 in any of the following ways: the photosensitive chip 12 is located above the photosensitive circuit board 111, and the non-photosensitive area of ​​the photosensitive chip 12 is electrically connected to the front side of the photosensitive circuit board 111 (such as by gold wire), which is similar to the traditional COB packaging structure; or Figure 4 As shown, the photosensitive circuit board 111 is provided with a through hole, the photosensitive chip 12 is accommodated in the through hole of the photosensitive circuit board 111, and the non-photosensitive area of ​​the photosensitive chip 12 is electrically connected to the front side of the photosensitive circuit board 111 (such as by gold wire), which is similar to a chip-sinking packaging structure; the photosensitive chip 12 is located below the photosensitive circuit board 111, and the non-photosensitive area of ​​the photosensitive chip 12 is electrically connected to the back side of the photosensitive circuit board 111 (such as by welding or conductive adhesive bonding), which is similar to a chip flip-chip structure.

[0074] In addition, the installation base of the photosensitive chip 12 can be the photosensitive circuit board 111, such as the photosensitive chip 12 is mounted on the front side of the photosensitive circuit board 111, or the photosensitive chip 12 is flipped on the back side of the photosensitive circuit board 111; in another embodiment, the installation base of the photosensitive chip 12 can be the bracket 14, such as the bracket 14 is arranged on the front side of the photosensitive circuit board 111, and the photosensitive chip 12 is mounted on the front side of the bracket 14, or the bracket 14 is arranged in the through hole of the photosensitive circuit board 111, and the photosensitive chip 12 is mounted on the front side of the bracket 14, or the photosensitive chip 12 is accommodated in the through hole of the photosensitive circuit board 111, the bracket 14 is arranged on the back side of the photosensitive circuit board 111, and the photosensitive chip 12 is mounted on the front side of the bracket 14.

[0075] Alternatively, if Figure 4 and Figure 7As shown, the support substrate 11 further includes a reinforcing plate 112, which can be arranged on the front or back of the photosensitive circuit board 111, and the photosensitive chip 12 is mounted on the reinforcing plate 112. It can be understood that in other examples of the present application, the reinforcing plate 112 can also be arranged on the surface of the bracket 14 (such as assembled by mounting or embedding), and the photosensitive chip 12 is mounted on the reinforcing plate 112.

[0076] Furthermore, if Figure 4 and Figure 7 As shown, the reinforcing plate 112 may include a first supporting portion 1121 for mounting the photosensitive chip 12 and a second supporting portion 1122 located around the first supporting portion 1121 and mounted on the photosensitive circuit board 111, so as to strengthen the overall structural strength of the photosensitive component 10 through the reinforcing plate 112, so that the photosensitive circuit board 111 is not easy to warp, and the photosensitive chip 12 is prevented from breaking. It is understandable that the reinforcing plate 112 mentioned in the present application may be, but is not limited to, implemented as a steel plate.

[0077] Furthermore, if Figure 4 and Figure 7 As shown, the first support portion 1121 protrudes upward from the second support portion 1122, that is, the upper surface of the second support portion 1122 is lower than the upper surface of the first support portion 1121, so as to ensure that the camera module 1 has the characteristics of low shoulder height while supporting the photosensitive chip 12 to partially protrude from the top surface of the photosensitive circuit board 111 to avoid blocking the photosensitive field of view of the photosensitive chip 12.

[0078] It is worth noting that in the first example of the present application, since the electronic component 1110 is usually made of metal, the electronic component 1110 easily reflects light and generates a large amount of stray light. In order to solve the stray light problem, Figure 8 A second example of the camera module 1 according to the above embodiment of the present application is shown. Compared with the above first example according to the present application, the difference of the camera module 1 according to the second example of the present application is that the lens assembly 20 also includes a shielding portion 25 extending inward from the inner side wall of the fixed portion 24, and the shielding portion 25 is located between the movable portion 21 and the electronic component 1110 to shield the electronic component 1110, which can not only protect the electronic component 1110, but also block light from irradiating to the electronic component 1110, effectively reducing the influence of stray light.

[0079] Furthermore, if Figure 8As shown, the photosensitive component 10 may further include a step portion 15, which is disposed on the outer side wall of the bracket 14, and the shielding portion 25 extends inward from the inner side wall of the fixing portion 24 to above the step surface of the step portion 15. In this way, a space can be formed above the step surface of the step portion 15 to avoid the shielding portion 25, so as to further reduce the module size.

[0080] Alternatively, if Figure 8 As shown, the shielding portion 25 extends inward as a whole from the inner wall of the lens base 241, and a through hole is provided on the outer side of the shielding portion 25. The stopper 23 is accommodated in the through hole and protrudes from the upper surface of the shielding portion 25, which not only ensures that the stopper 23 is located below the movable portion 21, but also can lower the height position of the stopper 23.

[0081] It is worth noting that in the first example and the second example of the present application, the bracket 14 may be a prefabricated part, fixed to the photosensitive circuit board 111 of the support substrate 11 by means such as bonding and fixing. In other examples of the present application, the bracket 14 may also be implemented as a molded part. For example, Fig. 9 and Fig.10 As shown, in the third example of the present application, the supporting substrate 11 includes a photosensitive circuit board 111 electrically connected to the photosensitive chip 12; the bracket 14 is injection molded on the supporting substrate 11, and encapsulates the electrical connection structure between the photosensitive chip 12 and the photosensitive circuit board 111, so that the bracket 14 can support the filter element 13 while also encapsulating the photosensitive chip 12.

[0082] Furthermore, in the above examples of the present application, Figure 7As shown, the lens assembly 20 may further include a rigid member 26, and the rigid member 26 may include a first portion 261 embedded in the fixed portion 24 and a second portion 262 extending inwardly from the first portion 261 into the cavity 200; the stopper 23 is implemented as a flexible material member installed on the second portion 262, ensuring that the stopper 23 is located below the movable portion 21. In this way, the movable portion 21 of the present application will first contact the stopper 23 made of a flexible material before contacting the filter element 13 or the bracket 14, ensuring that the stopper 23 has a good buffering effect, preventing the filter element 13 from being broken by the movable portion 21, or preventing the movable portion 21 from directly colliding with the bracket 14 and causing chipping or deformation. It is understandable that the rigid member 26 mentioned in the present application can be implemented as, but not limited to, a conductive sheet such as a copper sheet embedded in the lens base 241. In addition to being a reinforcing member of the lens base 241, it can also be used as a conductive member (such as when the lens assembly needs to be powered), which is not described in detail in the present application. In other embodiments, the lens assembly 20 may not include the rigid member 26, and the stopper 23 is directly mounted on the fixed part, such as by bonding or embedding.

[0083] Optionally, in the third example of the present application, as Fig.10 As shown, the first part 261 of the rigid member 26 includes a rear embedded arm 2611 extending left and right along the rear side wall of the lens base 241, a left embedded arm 2612 extending forward from the left end of the rear embedded arm 2611 along the left side wall of the lens base 241, and a right embedded arm 2613 extending forward from the right end of the rear embedded arm 2611 along the right side wall of the lens base 241; the second part 262 of the rigid member 26 includes a pair of front and rear ends extending inwardly from the right embedded arm 2613 to extend into the cavity 200 A first support arm 2621 and a pair of second support arms 2622 extending inward from the inner side of the left embedded arm 2612 to extend into the cavity 200 and arranged at intervals; the first support arm 2621 and the second support arm 2622 are both fixed with the stopper 23 so that the multiple stoppers 23 can be distributed as evenly as possible in the circumferential direction, so that the buffering effect of the stopper 23 on the movable part 21 of the lens assembly 20 can be more uniform, and the movable part 21 can be prevented from being skewed under the buffering effect of the stopper 23.

[0084] In addition, since the first support arm 2621 at the front end of the right embedded arm 2613 is adjacent to the edge of the rigid member 26, the first support arm 2621 at the front end of the right embedded arm 2613 is easily deformed during the solidification process of the lens base 241, thereby affecting the position accuracy of the stopper 23 at the front end of the right embedded arm 2613, and it is difficult to ensure that the four stoppers 23 remain flush. In this way, when the focus bracket 211 moves downward along the optical axis to collide with the stopper 23, the focus bracket 211 is easily skewed; therefore, if Fig.10 As shown, the first part 261 of the rigid member 26 may further include a partial embedded arm 2614 extending to the left from the front end of the right embedded arm 2613 along the front side wall of the lens base 241, so as to enhance the strength of the rigid member 26 adjacent to the front end of the right embedded arm 2613, reduce the deformation of the first support arm 2621 of the rigid member 26 located at the front end of the right embedded arm 2613 during the curing process of the lens base 241, ensure that the four stoppers 23 remain flush, and prevent the focus bracket 211 from being skewed due to collision with the stoppers 23.

[0085] It is worth noting that, although in the above-mentioned various examples of the present application, the filter element 13 is mounted on the bracket 14 so as to support the filter element 13 in the light sensing path of the light sensing chip 12 through the bracket 14; however, in other examples of the present application, the filter element 13 can also be directly mounted on the supporting substrate 11 so as to further reduce the height of the light sensing component 10. For example, in the fourth example of the present application, as Fig.11 As shown, the filter element 13 is mounted on the supporting substrate 11 so as to reduce the height of the photosensitive component 10 while eliminating the bracket 14, thereby reducing the overall height of the camera module 1.

[0086] Alternatively, if Fig.11 As shown, the filter element 13 is mounted on the upper surface of the photosensitive circuit board 111; the reinforcing plate 112 is mounted on the lower surface of the photosensitive circuit board 111; the photosensitive chip 12 is mounted on the reinforcing plate 112 and is located between the reinforcing plate 112 and the filter element 13. In this way, the camera module 1 of the present application can also avoid the filter element 13 and the photosensitive chip 12 being too close, which is easy to affect the optical imaging quality.

[0087] It is worth mentioning that in the fifth example of the present application, Fig.12As shown, the ball bearing 214 of the movable part 21 in the lens assembly 20 can also be replaced by a guide rod 215, which extends along the optical axis direction of the optical lens 22, so as to better support the focus bracket 211 in the lens base 241 so as to be axially movable, so as to meet the moving space required for autofocus. It can be understood that the present application does not limit the installation method of the guide rod 215, and the guide rod 215 and the lens base 241 can be processed separately first and then assembled together; or the guide rod 215 can be embedded in the interior of the lens base 241 while the lens base 241 is injection molded.

[0088] In addition, although in the above-mentioned various examples of the present application, the stopper 23 is arranged on the fixed part 24 of the lens assembly 20, in other examples of the present application, the stopper 23 may also be arranged on the movable part 21 of the lens assembly 20 to prevent the movable part 21 from directly colliding with the photosensitive component 10.

[0089] For example, Fig.13 As shown, in the sixth example of the present application, the movable part 21 of the lens assembly 20 is constrained to the fixed part 24 in a manner that it can move along the optical axis direction of the optical lens 22, wherein the stopper 23 is provided on the movable part 21, and the distance between the stopper 23 and the photosensitive component 10 is smaller than the distance between the optical lens 22 and the filter element 13. In this way, when the movable part 21 drives the optical lens 22 to move downward, the stopper 23 is first brought into contact with the supporting substrate 11, so that the stopper 23 of the present application can prevent the optical lens 22 from directly contacting the filter element 13 of the photosensitive component 10 when the movable part 21 of the lens assembly 20 moves downward along the optical axis, thereby preventing the filter element 13 from being damaged.

[0090] Alternatively, if Fig.13 As shown, the stopper 23 is fixed to the lower surface of the focus bracket 211 of the movable part 21 and is located at the outer side of the filter element 13, so as to prevent the stopper 23 from colliding with the filter element 13 while preventing the movable part 21 from colliding with the filter element 13, so as to protect the filter element 13 from being broken. It can be understood that in other examples, the stopper 23 can also be installed on the outer side of the movable part 21, as long as the part of the stopper 23 is located below the movable part 21.

[0091] The technical features of the above embodiments may be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0092] The above embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention.

Claims

1. A camera module, characterized in that: include: A photosensitive component, comprising a supporting substrate, a photosensitive chip disposed on the supporting substrate, and a filter element disposed in a light sensing path of the photosensitive chip, wherein the filter element is at least partially located above the supporting substrate; and A lens assembly, wherein the lens assembly is assembled to the support substrate, and comprises a movable part, an optical lens, and a stopper for limiting the movement of the movable part; wherein the optical lens is disposed on the movable part, and the optical lens is located in the light sensing path of the light sensing chip; wherein the stopper is located on the outer peripheral side of the filter element, and the lower surface of the stopper is lower than the upper surface of the filter element; The lens assembly further comprises a fixed portion mounted on the support substrate, and the stopper is disposed on the fixed portion; Along a direction parallel to the optical axis of the optical lens, the distance between the movable part and the stopper is smaller than the distance between the movable part and the filter element; The photosensitive component also includes a bracket for mounting the filter element, wherein the bracket is at least partially located above the supporting substrate and a gap is formed between the bracket and the fixed part.

2. The camera module according to claim 1, characterized in that: The fixed part and the supporting substrate jointly define a cavity, and the movable part is movably constrained within the cavity.

3. The camera module according to claim 2, characterized in that: The movable part is constrained to the fixed part in a manner that it can move along the optical axis direction of the optical lens, and the stopper is at least partially located below the movable part.

4. The camera module according to claim 3, characterized in that: The upper surface of the stopper is higher than the upper surface of the filter element.

5. The camera module according to claim 4, characterized in that: Along a direction parallel to the optical axis of the optical lens, a distance between the stopper and the supporting substrate is smaller than a distance between an upper surface of the stopper and an upper surface of the filter element.

6. The camera module according to claim 4, characterized in that: A concave portion is provided on the top of the bracket, the filter element is mounted on the concave portion, and the upper surface of the stopper is higher than the upper surface of the bracket.

7. The camera module according to claim 6, characterized in that: The supporting substrate includes a photosensitive circuit board electrically connected to the photosensitive chip, wherein the bracket is fixedly connected to the photosensitive circuit board and a gap is formed between the bracket and the fixed part; the electronic components on the photosensitive circuit board are located between the outer wall of the bracket and the inner wall of the fixed part.

8. The camera module according to claim 7, characterized in that: The lens assembly also includes a shielding portion extending inwardly from the inner side wall of the fixed portion, and along a direction parallel to the optical axis of the optical lens, the shielding portion is located between the movable portion and the electronic component.

9. The camera module according to claim 8, characterized in that: The photosensitive component also includes a step portion, which is arranged on the outer side wall of the bracket, and the shielding portion extends inward from the inner side wall of the fixed portion to above the step surface of the step portion.

10. The camera module according to claim 6, characterized in that: The supporting substrate comprises a photosensitive circuit board electrically connected to the photosensitive chip, wherein the bracket is injection molded on the supporting substrate and encapsulates the electrical connection structure between the photosensitive chip and the photosensitive circuit board.

11. The camera module according to any one of claims 2 to 10, characterized in that: The lens assembly also includes a rigid part, which includes a first part embedded in the fixed part and a second part extending inward from the first part into the cavity; the stopper is a flexible material part installed on the second part.

12. An electronic device, characterized in that include: Equipment body; and The camera module as described in any one of claims 1 to claim 11 is assembled on the device body.

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