A flexible circuit board manufacturing method for the field of intelligent video

Abstract

The application discloses a flexible circuit board manufacturing method for the field of intelligent video, which comprises the following steps: taking a double-sided flexible copper-clad plate, making a through hole to a golden finger functional area, making a circuit pattern, brown oxidation, making a blue glue layer to a reinforcing area, removing the brown oxidation, tearing off the blue glue layer, double-sidedly pasting a cover film, first pressing, pasting the reinforcing area, second pressing, and forming the flexible circuit board; the additional functional circuit is moved to the second surface to provide a larger wiring space for the first surface and prevent incomplete etching or over-process capability problems; after the whole brown oxidation and then the local brown oxidation removal, the reinforcing area forms the brown oxidation effect and has higher bonding force, and the whole processing flow can make the flexible circuit board have stronger functional support and higher reliability.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of flexible circuit board manufacturing, in particular to a flexible circuit board manufacturing method for the field of intelligent video. BACKGROUND

[0002] For some digital AI video fields and intelligent camera fields, the size of the applied flexible circuit board is relatively small, but the functional requirements are relatively high, which makes the wiring density of the flexible circuit board applied inside larger and larger, and there is a demand for transmitting large instantaneous current and high voltage in the application process, so the copper layer thickness of the flexible circuit board is relatively thicker than that of the ordinary flexible circuit board.

[0003] When the flexible circuit board is a single-layer board and has a single-sided gold finger (plug-in circuit), the gold finger plug-in line needs to be connected to more board surface lines, and in a small space, a larger wiring density is designed, and the copper layer thickness has certain requirements, which can easily cause problems such as incomplete etching or exceeding the process capacity of the line during processing.

[0004] In general, the gold finger line position of the flexible circuit board needs to be reinforced to improve the hardness and support, and facilitate plugging. The reinforcement is generally attached to the cover film on the non-plugging surface of the gold finger line, and the reinforcement needs to be pressed for processing to ensure firmness. If the reinforcement area is large and the thickness is thick, fast pressing processing is used, which can easily cause the reinforcement to be attached insecurely, and after pressing, the cover film can be easily affected by high temperature, causing delamination and blistering between the inner layer of the flexible circuit board and the flexible circuit board, resulting in scrap and other problems.

[0005] Therefore, in order to solve the problems raised in the background art, a new flexible circuit board manufacturing method for the field of intelligent video is provided. SUMMARY

[0006] The present application aims to solve the problems of incomplete etching of lines or poor reinforcement of the existing technology of high wiring density rigid-flex combined board with gold fingers in line manufacturing and reinforcement attachment manufacturing, and proposes a new flexible circuit board manufacturing method for the field of intelligent video, which includes the following steps:

[0007] S10: Take a double-sided flexible copper-clad plate, the first side of the double-sided flexible copper-clad plate includes a gold finger area, a gold finger functional area and a first connecting line area in sequence, the second side includes a reinforcement attachment area and a second connecting line area in sequence, and the gold finger area and the gold finger functional area correspond to the reinforcement attachment area;

[0008] Make a through hole in the gold finger functional area and perform electroplating processing, the through hole forms a conductive hole, then perform line pattern manufacturing and brown processing to form a patterned brown flexible board;

[0009] The circuit pattern comprises a first surface circuit pattern and a second surface circuit pattern,

[0010] The first surface circuit pattern comprises a gold finger pattern located in the gold finger area and the gold finger function area,

[0011] The second surface circuit pattern comprises a function circuit pattern;

[0012] S20: making a blue glue layer on the reinforcing area of the patterned flexible board, then performing a debrowning process, and then tearing off the blue glue layer to form a partitioned debrowning patterned flexible board;

[0013] S30: covering the double surface of the partitioned debrowning patterned flexible board with a cover film and performing a first pressing to form a cover film flexible board;

[0014] S40: attaching a reinforcing to the reinforcing area of the cover film flexible board and performing a second pressing to form the flexible circuit board.

[0015] Further, the second surface circuit pattern further comprises a compensating copper skin between the function circuit patterns in the reinforcing area.

[0016] Further, the via hole is located on the gold finger pattern corresponding to the gold finger function area of the function circuit pattern.

[0017] Further, the blue glue layer is made by silk printing blue glue or attaching a blue glue film.

[0018] Further, the cover film is attached to the gold finger function area and the first connecting line area, and further, the first pressing is performed by using vacuum pressing and fast pressing, with a pressing parameter of a temperature of 160-180℃ and a pressure of 15-25 kg / cm 2 . 2

[0019] Optionally, the first pressing is performed by using a pressing device of a rigid board, with a heating rate of 2-5℃ / min, a maximum temperature of 160-185℃, a pressure of 20-30 kg / cm 2 2

[0020] Further, the cover film flexible board is subjected to plasma treatment before the reinforcing is attached.

[0021] ​​​Furthermore, the second pressing is performed using a rigid plate pressing device, with a pressing heating rate of 2°C / min to 6°C / min, a maximum temperature of 170°C to 190°C, and a pressure of 25kg / cm 2 Up to 35kg / cm 2 , the cooling rate is 10℃ / min to 20℃ / min.

[0022] Optionally, the first pressing is performed at a temperature of 130°C to 150°C and a pressure of 15 kg / cm 2 Up to 20kg / cm 2 The pressure is set to 5000, and the pre-pressing is carried out for 60 to 90 seconds.

[0023] The manufacturing method of the technical solution of the present invention moves the additional functional circuit to the second side, providing a larger wiring space for the first side, preventing the problem of incomplete etching or exceeding the process capability caused by excessive circuit density, and enabling the flexible circuit board with the same area to form more circuit functions; using the method of first browning the entire area and then partially de-browning, the reinforcement area is patched to form a browning effect, effectively improving the surface bonding strength between the covering film and the connecting line area when the reinforcement is applied, preventing the problems of the covering film and the connecting line area not being able to fit together or delamination after reinforcement and pressing, and the connecting line area is formed by first browning and then de-browning. The brown-black color of the circuit surface after the reinforcement and covering browning will not cause the color difference problem on the surface of the finished flexible circuit board. The roughness of the circuit surface in the connecting line area can be formed by browning, and the color difference problem of the circuit surface in the connecting line area of ​​the finished flexible circuit board can be prevented. Further, the compensation copper foil is added between the functional circuit patterns in the reinforcement area, and the rough surface formed after the copper foil is browned can be effectively used to improve the bonding strength of the covering film. Further, pre-pressing and then high-temperature and high-pressure pressing with rigid board pressing equipment can be used to effectively form the covering film and reinforced pressing, thereby improving the bonding strength between layers. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying any creative work.

[0025] Figure 1 1. It is a process flow chart of the production method of the present invention;

[0026] Figure 2 This is a schematic planar structural diagram of the circuit pattern on the first side of the patterned browned flexible board according to the manufacturing method of the present invention;

[0027] Figure 3A-A cross-sectional structure schematic diagram of the present application; Figure 2 A-A cross-sectional structure schematic diagram of the present application;

[0028] Figure 4 B-B cross-sectional structure schematic diagram of the present application; Figure 2 B-B cross-sectional structure schematic diagram of the present application;

[0029] Figure 5 Second surface circuit pattern plane structure schematic diagram of the flexible board of the present application;

[0030] Figure 6 Second surface circuit pattern plane structure schematic diagram of the flexible board of the present application;

[0031] Figure 7 First surface circuit pattern plane structure schematic diagram of the flexible board of the present application;

[0032] Figure 8 Second surface circuit pattern plane structure schematic diagram of the flexible board of the present application;

[0033] Figure 9 First surface circuit pattern plane structure schematic diagram of the flexible board of the present application;

[0034] Figure 10 C-C cross-sectional structure schematic diagram of the present application; Figure 9 C-C cross-sectional structure schematic diagram of the present application;

[0035] Figure 11 Second surface circuit pattern plane structure schematic diagram of the flexible board of the present application;

[0036] Figure 12 Second surface circuit pattern plane structure schematic diagram of the flexible board of the present application;

[0037] Figure 13 D-D cross-sectional structure schematic diagram of the present application. Figure 12 D-D cross-sectional structure schematic diagram of the present application.

[0038] Explanation of reference numerals:

[0039] Reference Name Reference Name 10A First surface circuit pattern 3210 Functional circuit pattern 110 Gold finger area 20A First surface brown circuit pattern 1110 Gold finger pattern 20B Second surface brown circuit pattern 210 Gold finger functional area 30A First cover film pattern surface 2110 Through hole 410 First surface cover film 310 First connection line area 4110 Cover film protection layer 3110 Original wiring 4120 Cover film adhesive layer 3120 Newly added wiring 30B Second cover film pattern surface 3130 Surface brown layer 420 Second surface cover film 10J Insulating dielectric layer 40 Flexible circuit board 10B Second surface circuit pattern 510 Reinforcement 120 Paste reinforcement area 4210 Reinforcement protection layer 1210 Compensation copper skin 4220 Reinforcement adhesive layer 320 Second connection line / /

[0040] The implementation, functional features and advantages of the present application will be further explained with reference to the embodiments and the accompanying drawings. DETAILED DESCRIPTION

[0041] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making any creative efforts shall fall within the scope of protection of the present invention.

[0042] It should be noted that all directional indications in the embodiments of the present invention (such as up, down, left, right, front, back, inside, outside, etc.) are only used to explain the relative position relationship and movement status of the various components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0043] In addition, the terms "first," "second," and so on, used in this disclosure are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referenced. Thus, a feature specified as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of this disclosure, "plurality" means at least two, such as two or three, unless otherwise specifically defined.

[0044] In addition, the technical solutions between the various embodiments of the present invention can be combined with each other, but it must be based on the fact that ordinary technicians in this field can implement it. When the combination of technical solutions is mutually contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0045] See also Figure 1 , Figure 1 It is a process flow chart of the production method of the present invention.

[0046] The flexible circuit board manufacturing method of the embodiment of the present invention adopts Figure 1 The process shown is carried out for processing. Figure 1 The processing flow is the process with technical characteristics of this embodiment, not the entire process; the following is Figure 1 The process flow is described in detail.

[0047] Please also refer to Figure 2 to Figure 5 ; Figure 2 This is a schematic planar structural diagram of the circuit pattern on the first side of the patterned browned flexible board according to the manufacturing method of the present invention; Figure 3 The present invention is attached Figure 2 AA cross-sectional structural diagram; Figure 4 The present invention is attached Figure 2 BB cross-sectional structure diagram; Figure 5 This is a schematic planar structural diagram of the circuit pattern on the second side of the patterned browned flexible board produced by the method of the present invention.

[0048] Step S10:

[0049] Take a double-sided flexible copper-clad plate, including an insulating medium layer 10J, the first side of the double-sided flexible copper-clad plate includes a gold finger area 110, a gold finger functional area 210 and a first connecting line area 310 in turn adjacent, and the second side includes a reinforcing area 120 and a second connecting line area 320 in turn adjacent, the gold finger area 110 and the gold finger functional area 210 correspond to the reinforcing area 120.

[0050] Different from the prior art, the single-layer plate with a gold finger design is adjusted to a double-sided plate in the embodiment, some auxiliary functional circuit patterns such as ground lines, heat dissipation lines, auxiliary lines and the like are moved to the second side, and a larger design space is provided for the circuit pattern on the first side with direct functions such as conduction, signal transmission and soldering components, the first side can set new lines 3120 on the basis of the original wiring 3110, the functionality and processability of the flexible circuit board are improved, and the problem of etching failure or over-process capability caused by excessive wiring density on the single side is prevented.

[0051] A through hole is made in the gold finger functional area and is subjected to electroplating processing, and the through hole forms a conduction hole 2110. In the embodiment, the conduction hole 2110 is located on the gold finger pattern of the gold finger functional area corresponding to the functional circuit pattern.

[0052] Then, circuit pattern making is performed, and the circuit pattern includes a first side circuit pattern 10A and a second side circuit pattern 10B, the first side circuit pattern 10A includes a gold finger pattern 1110 located in the gold finger area 110 and the gold finger functional area 210, and the second side circuit pattern 10B includes a functional circuit pattern 3210.

[0053] Since part of the circuit is moved to the second side, the functional circuit pattern 3210 still needs to be conducted to the gold finger pattern 1110 to realize the plug-in conduction effect in application, the gold finger functional area 210 is arranged between the gold finger area 110 and the first connecting line area 310, and the conduction hole 2110 is made in the area, the gold finger functional area 210 can use a cover film to cover the conduction hole 2110 without affecting the appearance and performance in subsequent formation, and the conduction hole 2110 forms the effect of conducting the functional circuit pattern 3210 to the gold finger pattern 1110.

[0054] In the embodiment, the second side circuit pattern 10B further includes a compensating copper skin 1210 between the functional circuit patterns in the reinforcing area.

[0055] The compensating copper skin 1210 is arranged, since the bonding force of the copper skin with the cover film is greater than the bonding force of the cover film with the insulating medium layer 10J, the bonding force between the cover film layer and the core board layer of the flexible circuit board in subsequent formation can be effectively improved, and problems such as delamination and blistering are prevented.

[0056] Then, the brown treatment is performed to form a surface brown layer 3130, and the whole processing forms a patterned brown flexible board.

[0057] The surface brown layer 3130 has a compact and uniform rough surface structure, which can greatly improve the bonding force between the cover film layer and the circuit pattern, and provides a good surface condition for subsequent attachment of the cover film and manufacturing of the reinforcement.

[0058] Please refer to Figure 6 to Figure 8 ; Figure 6 It is a second surface structure schematic diagram of the manufacturing method of the present application for manufacturing the blue glue layer and then performing the brown treatment. Figure 7 It is a first surface brown circuit pattern structure schematic diagram of the manufacturing method of the present application for manufacturing the partitioned brown patterned flexible board. Figure 8 It is a second surface brown circuit pattern structure schematic diagram of the manufacturing method of the present application for manufacturing the partitioned brown patterned flexible board.

[0059] Step S20:

[0060] The blue glue layer 1220 is manufactured on the patterned brown flexible board of the reinforcement attaching area 120, and then the brown treatment is performed, and then the blue glue layer 1220 is torn off to form a partitioned brown patterned flexible board, wherein the first surface circuit pattern 10A forms a first surface brown circuit pattern 20A, and the second surface circuit pattern 10B forms a second surface brown circuit pattern 20B; in the embodiment, the blue glue layer is manufactured by silk printing or attaching a blue glue film.

[0061] Only the blue glue layer 1220 is manufactured on the reinforcement attaching area 120 to protect the surface brown layer 3130 of the reinforcement attaching area 120, and the surface brown layer 3130 is removed after the brown treatment of other areas, the reason of the manufacturing method is that the reinforcement attaching area 120 needs to be attached with a cover film and then attached with a reinforcement, so a greater surface bonding force is needed, and thus the surface brown layer 3130 of the area is retained, at the same time, the reinforcement is generally a solid layer which is opaque and can effectively cover the black brown color of the copper surface after the brown treatment of the area, but other areas are only attached with a cover film (the gold finger area 110 is not attached with a cover film), and the surface brown layer 3130 is relatively fragile and is easily scratched and damaged, thus the surface brown layer 3130 of other areas is removed to effectively prevent the scratching and damage problems in the subsequent processing, at the same time, the color of the cover film is semi-transparent, and thus cannot completely cover the scratched and damaged surface brown layer 3130 when attached to the surface, and thus color difference problems of the surface of the finished flexible circuit board are caused, resulting in poor visual detection.

[0062] It is worth mentioning that, the reason why the manufacturing method of first overall brown and then local de-brown is adopted, instead of the manufacturing method of first pasting dry film to protect the surface brown layer 3130, and then separately brown the reinforcing area 120, is that the effect of the rough surface (roughness, rough uniformity) formed by first brown and then de-brown is much better than the effect of the rough surface of the original copper layer (or the copper layer after electroplating), so that the copper surface and the subsequent cover film have better bonding force, and it is ensured that the cover film will not delaminate and bubble during the subsequent secondary pressing of the reinforcing area.

[0063] If the blue glue layer 1220 is made of liquid blue glue, it can be processed by silk-screening blue glue, and if it is made of blue glue tape, it can be made by attaching blue glue film.

[0064] Please refer to Figure 9 to Figure 11 ; Figure 9 for the first cover film pattern plane structure diagram of the cover film flexible board of the manufacturing method of the application; Figure 10 for the C-C cross-sectional structure diagram of the application Figure 9 ; Figure 11 for the second cover film pattern plane structure diagram of the cover film flexible board of the manufacturing method of the application.

[0065] Step S30:

[0066] Double-sidedly paste the cover film on the partitioned brown pattern flexible board, wherein the first surface brown circuit pattern 20A is attached with the first surface cover film 410 to form the first cover film pattern plane 30A, and the second surface brown circuit pattern 20B is attached with the second surface cover film 420 to form the second cover film pattern plane 30B; in this embodiment, the cover film is pasted on the gold finger functional area 210 and the first connecting line area 310, and the cover film is pasted on the reinforcing area 120 and the second connecting line area 320; then the first pressing is performed to form the cover film flexible board.

[0067] Since the gold finger functional area 210 is a new area added compared with the prior art, it does not need to be exposed like the gold finger pattern 1110, and there is a through hole 2110 in this area, so the cover film is used to cover this area, which can maintain the original size and pattern of the gold finger pattern 1110 unchanged on one hand, and on the other hand, since the first surface cover film is composed of a cover film protection layer 4110 and a cover film glue layer 4120 (the second surface cover film 420 is also composed of a protection layer and a glue layer), after the first pressing, the cover film glue layer 4120 can effectively fill the through hole 2110 to form a solid hole, preventing the problem of burst hole and burst board caused by gas expansion in the hole during the subsequent attachment and pressing of the reinforcing area.

[0068] In this embodiment, the first pressing is performed by vacuum pressing and rapid pressing. The pressing parameters are a temperature of 160°C to 180°C and a pressure of 15kg / cm 2 Up to 25kg / cm 2 The pressure is applied for 7 to 15 minutes.

[0069] The first pressing uses vacuum pressing, which can effectively ensure that no gas is hidden in the conductive hole 2110. Using relative pressing parameters of the existing technology, appropriately increasing the temperature, increasing the pressure, and extending the pressing time can effectively melt the covering film adhesive layer 4120 and fill the conductive hole 2110. It is worth noting that due to the browning and de-browning processing, the surface of the copper layer and the surface of the conductive hole 2110 form a uniform rough surface. Can higher temperature, greater pressure, and longer pressing time improve the bonding strength between the covering film and the copper surface?

[0070] In this embodiment, the first pressing is performed using a rigid plate pressing device, with a pressing heating rate of 2°C / min to 5°C / min, a maximum temperature of 160°C to 185°C, and a pressure of 20kg / cm 2 Up to 30kg / cm 2 , the cooling rate is 8℃ / min to 12℃ / min.

[0071] When the thickness of the partitioned browned graphic flexible board is thicker and the covering film adhesive layer 4120 is thicker, the first pressing can optionally be performed using a rigid board pressing device, which has relatively greater pressure and pressing temperature, and a more moderate temperature rise, effectively improving the expansion and contraction performance of the covering film pressing and the interlayer bonding strength.

[0072] See also Figure 12 and Figure 13 ; Figure 12 This is a schematic diagram of the planar structure of the second surface of the flexible circuit board manufactured by the method of the present invention; Figure 13 The present invention is attached Figure 12 Schematic diagram of the DD cross-section structure.

[0073] Step S40:

[0074] The reinforcement 510 is attached to the reinforcement area of ​​the cover film flexible board, and a second pressing is performed to form the flexible circuit board 40.

[0075] In this embodiment, before attaching the reinforcement 510 , the flexible board with the cover film is subjected to plasma treatment.

[0076] Since the reinforcement 510 is attached to the cover film, and the cover film surface is generally smooth, and the cover film material is generally a relatively inert polyimide material, plasma treatment of the cover film can form a rough surface on the cover film surface, thereby improving the bonding strength of the reinforcement.

[0077] In the embodiment, the second pressing is performed by using the pressing equipment of the rigid plate, the pressing temperature increasing rate is 2-6°C / min, the highest temperature is 170-190°C, and the pressure is 25-35 kg / cm 2 . 2 The temperature decreasing rate is 10-20°C / min.

[0078] Since the embodiment requires stronger bonding force between the reinforcing plate and the cover film, the second pressing is performed by using the pressing equipment of the rigid plate when the cover film has good bonding force with the flexible plate with the sectionalized brown pattern, and the pressing temperature and pressure are relatively higher, and the temperature increasing is relatively slow, so that the expansion and contraction performance and the interlayer bonding force of the cover film are effectively improved.

[0079] In the embodiment, the first pressing is pre-pressing with the temperature of 130-150°C and the pressure of 10-20 kg / cm 2 . 2 The pressing time is 60-90 seconds.

[0080] It is worth mentioning that when the sectionalized brown pattern flexible plate is relatively thin, and the cover film glue layer 4120 can easily fill the through hole 2110, the first pressing is pre-pressing, and the second pressing is performed by using the pressing equipment of the rigid plate, and the first pressing is performed by using the pre-pressing equipment with relatively low temperature and relatively small pressure, and the cover film is pre-pressed to the surface of the sectionalized brown pattern flexible plate, and then the cover film, the sectionalized brown pattern flexible plate and the reinforcing plate are completely pressed by using the second pressing, so that the production efficiency is effectively improved, and the production energy consumption is saved.

[0081] It is worth mentioning that since the flexible circuit board is generally more precise, the actual structure diagram and the thickness of each layer, the line width and other sizes are micron level, and if the actual proportion is followed, the diagram is not clear, and therefore in order to more clearly represent the implementation process of the production method of the embodiment, the drawings of the embodiment are schematic diagrams of the technical features, and do not represent the size of the actual structure diagram, nor represent the enlarged diagram of the actual structure diagram in the same proportion.

[0082] The above is only the preferred embodiment of the application, and does not limit the patent scope of the application, and any equivalent structural transformation made by using the content of the application specification and drawings, or direct / indirect application in other related technical fields is included in the patent protection scope of the application.

Claims

1. A flexible circuit board manufacturing method for smart video field, characterized in that, The flexible circuit board manufacturing method comprises the following steps: S10: taking a double-sided flexible copper-clad plate, the first side of the double-sided flexible copper-clad plate comprising a gold finger area, a gold finger functional area and a first connecting line area in sequence, and the second side comprising a reinforcing area and a second connecting line area in sequence, the gold finger area and the gold finger functional area corresponding to the reinforcing area; A via hole is made in the gold finger functional area and electroplating processing is performed, the via hole forming a conductive hole, then line pattern making and brown processing are performed to form a pattern brown flexible plate; The line pattern comprises a first side line pattern and a second side line pattern, The first side line pattern comprises a gold finger pattern in the gold finger area and the gold finger functional area, The second side line pattern comprises a functional line pattern; S20: making a blue glue layer on the reinforcing area of the pattern brown flexible plate, then performing a brown removal process, and then tearing off the blue glue layer to form a partition brown pattern flexible plate; S30: double-sidedly pasting a cover film on the partition brown pattern flexible plate and performing a first pressing to form a cover film flexible plate; S40: pasting a reinforcing on the reinforcing area of the cover film flexible plate and performing a second pressing to form the flexible circuit board.

2. The flexible circuit board manufacturing method for the field of intelligent video as claimed in claim 1, wherein, The second side line pattern further comprises a compensating copper skin between the functional line patterns in the reinforcing area.

3. The method of claim 1, wherein the flexible circuit board is used in a smart video field. The conductive hole is located on the gold finger pattern in the gold finger functional area corresponding to the functional line pattern.

4. The flexible circuit board manufacturing method for the field of intelligent video as claimed in claim 1 or 2, wherein, The blue glue layer is made by silk-screening or pasting a blue glue film.

5. The flexible circuit board manufacturing method for the field of intelligent video as claimed in claim 1 or 2, wherein, The cover film pasting comprises pasting a cover film on the gold finger functional area and the first connecting line area, and pasting a cover film on the reinforcing area and the second connecting line area.

6. The method of claim 1, wherein the flexible circuit board is used in a smart video field. The first pressing is performed using vacuum pressing and rapid pressing, and the pressing parameters are a temperature of 160°C to 180°C and a pressure of 15 kg / cm 2 to 25 kg / cm 2 for 7 minutes to 15 minutes.

7. The method for manufacturing a flexible circuit board for the field of intelligent video communication according to claim 1, characterized in that: The first pressing is performed using a pressing apparatus of a rigid plate, at a temperature increase rate of 2 to 5°C / min, a maximum temperature of 160 to 185°C, and a pressure of 20 to 30 kg / cm 2 , and a temperature decrease rate of 8 to 12°C / min. 2 The first pressing is performed using a pressing apparatus of a rigid plate, at a temperature increase rate of 2 to 5°C / min, a maximum temperature of 160 to 185°C, and a pressure of 20 to 30 kg / cm 2 , and a temperature decrease rate of 8 to 12°C / min. 2 8. The method for manufacturing a flexible circuit board for the field of intelligent video communication according to claim 1, wherein: The cover film flexible plate is subjected to plasma treatment before the reinforcing is pasted.

9. The method for manufacturing a flexible circuit board for the field of intelligent video communication according to claim 1, wherein: The second pressing is performed using a pressing apparatus with a rigid plate, at a temperature increase rate of 2 to 6°C / min, a maximum temperature of 170 to 190°C, and a pressure of 25 to 35 kg / cm 2 , and a temperature decrease rate of 10 to 20°C / min. 2 , and a temperature decrease rate of 10 to 20°C / min.

10. The method of claim 9, wherein the flexible circuit board is used in a smart video field. The first pressing is a pre-pressing at a temperature of 130°C to 150°C and a pressure of 15 kg / cm 2 to 20 kg / cm 2 for 60 seconds to 90 seconds.

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