Modular combined water-cooled walls and their layout methods

Abstract

Embodiments of the present invention provide a modular combined water-cooled wall and its arrangement method. The modular combined water-cooled wall includes: multiple first water-cooled modules, each first water-cooled module including at least one water-cooled pipe; multiple second water-cooled modules, each second water-cooled module including at least one water-cooled pipe and at least one buffer pipe; the multiple first water-cooled modules are connected to the multiple second water-cooled modules, and adjacent water-cooled modules are detachably connected by clips and components. The clips and components allow displacement between the water-cooled modules along the length of the water-cooled pipe, thereby reducing the vertical component of thermal stress and reducing the impact of thermal stress on the connection points of the water-cooled modules; the buffer pipe can absorb some thermal stress and undergo a certain deformation, thereby reducing the lateral thermal stress of the water-cooled modules, lowering the maximum thermal stress value of the water-cooled wall surface, and preventing cracking of the water-cooled modules.

Description

Technical Field

[0001] The embodiments of the present invention belong to the technical field of water-cooled equipment, specifically relating to a modular combined water-cooled wall and its arrangement method. Background Technology

[0002] In recent years, clean energy, represented by wind power and photovoltaic power, has been vigorously developed in my country. Traditional thermal power units are increasingly taking on peak-shaving tasks, and deep peak-shaving operation of coal-fired power units has become the norm, making the heating and deformation of boiler heating surfaces increasingly complex.

[0003] Deep peak shaving and frequent load changes cause boilers to deviate from their original design conditions, resulting in uneven temperature distribution in the boiler water-cooled walls and ultimately leading to excessive thermal stress. For the problem of excessive thermal stress in boiler water-cooled walls caused by severe uneven heating during load changes, it is necessary to replace the entire or large area of ​​the heated surface during maintenance, but there is currently no perfect or mature solution. Therefore, there is an urgent need for a new type of modular water-cooled wall surface that reduces local thermal stress and allows for convenient and rapid replacement of the water-cooled walls to solve this problem.

[0004] Most current water-cooled walls are membrane-type, consisting of circular water-cooled wall tubes welded together with fins made of straight steel plates on both sides. The water-cooled wall and the straight fins are intermittently arranged and welded together to form a single water-cooled wall panel. In this traditional water-cooled wall panel, the lateral and vertical expansion of the water-cooled wall tubes and fins in locally heated areas is severely restricted due to the welding fixation, which can easily lead to cracking of the water-cooled wall in extreme cases. Summary of the Invention

[0005] The embodiments of the present invention aim to at least solve one of the technical problems existing in the prior art, and provide a modular combined water-cooled wall and its arrangement method.

[0006] An embodiment of the present invention provides a modular combined water-cooled wall, the modular combined water-cooled wall comprising:

[0007] Multiple first water-cooling modules, each first water-cooling module including at least one water-cooling pipe;

[0008] Multiple second water-cooling modules, each second water-cooling module including at least one water-cooling pipe and at least one buffer pipe;

[0009] Multiple first water-cooling modules are connected to multiple second water-cooling modules, and adjacent water-cooling modules are detachably connected via cards and components.

[0010] In some embodiments of the present invention, the second water-cooling module includes:

[0011] At least two of the water-cooling pipes and at least one of the buffer pipes, wherein at least two of the water-cooling pipes are connected to at least one of the buffer pipes, and the two water-cooling pipes are respectively arranged at both ends of the second water-cooling module.

[0012] In some embodiments of the present invention, the second water-cooling module includes two water-cooling pipes and one buffer pipe, with the two water-cooling pipes connected to opposite sides of the buffer pipe, and the two water-cooling pipes connected to the card and the component respectively.

[0013] In some embodiments of the present invention, the buffer tube is a hollow tube.

[0014] In some embodiments of the present invention, the wall thickness of the buffer tube is less than the wall thickness of the water-cooling tube.

[0015] In some embodiments of the present invention, the outer diameter of the buffer tube is not greater than the outer diameter of the water-cooling tube.

[0016] In some embodiments of the present invention, the card and components include:

[0017] The first water-cooling module is provided with the snap-fit ​​connector at its first end, and the second water-cooling module is provided with the snap-fit ​​connector at its first end.

[0018] The card and component are provided at the second end of the first water-cooling module and at the second end of the second water-cooling module. The first water-cooling module and the second water-cooling module are connected to the card and component through the card connector.

[0019] In some embodiments of the present invention, the first end of the snap-fit ​​component is connected to the first water-cooling module, the first end of the snap-fit ​​component is connected to or the second water-cooling module, the second end of the snap-fit ​​component is provided with a snap-fit ​​protrusion, the first end of the snap-fit ​​component is connected to the first water-cooling module, the first end of the snap-fit ​​component is connected to or the second water-cooling module, the second end of the snap-fit ​​component is formed with a groove, and the snap-fit ​​protrusion is adapted to the groove.

[0020] In some embodiments of the present invention, the groove is T-shaped.

[0021] A second aspect of this invention provides a method for arranging modular combined water-cooled walls, the method comprising:

[0022] Obtain multi-point temperature and multi-point stress values ​​of the original water-cooled wall of the boiler;

[0023] Numerical simulation based on multi-point temperature values ​​and multi-point stress;

[0024] Mark locations where the temperature and stress values ​​are lower than the preset values;

[0025] The second water-cooling module is set at the marked position, and the first water-cooling module is set at the remaining positions.

[0026] The modular combined water-cooled wall and its arrangement method according to embodiments of the present invention involve connecting multiple first water-cooled modules and multiple second water-cooled modules. Specifically, the multiple first water-cooled modules and multiple second water-cooled modules can be arranged in a cross pattern. Adjacent water-cooled modules are detachably connected by clips and components, wherein the clips and components are arranged along the length direction of the water-cooling pipe. The clips and components allow displacement between water-cooled modules along the length direction of the water-cooling pipe, thereby reducing the vertical component of thermal stress. The second water-cooled module includes a buffer tube with a certain deformation capacity. When the water-cooled module is subjected to large thermal stress, the buffer tube can absorb part of the thermal stress and undergo a certain deformation, thereby reducing the lateral thermal stress of the water-cooled module, reducing the maximum thermal stress value of the water-cooled wall surface, and preventing cracking of the water-cooled module. Attached Figure Description

[0027] Figure 1 This is a schematic diagram of the modular combined water-cooled wall structure according to an embodiment of the present invention;

[0028] Figure 2 for Figure 1 The diagram shows the structure of the first water-cooling module.

[0029] Figure 3 for Figure 1 The diagram shows the structure of the second water-cooling module.

[0030] Figure 4 This is a logic diagram of the modular combined water-cooled wall arrangement method according to an embodiment of the present invention.

[0031] The labels in the attached diagram are as follows:

[0032] 100. Modular combined water-cooled wall;

[0033] 10. First water-cooling module; 11. Water-cooling pipes;

[0034] 20. Second water-cooling module; 21. Water-cooling pipe; 22. Buffer pipe;

[0035] 30. Cards and components; 31. Card connectors; 311. Card protrusions; 32. Cards and components; 321. Grooves. Detailed Implementation

[0036] Exemplary embodiments of the invention will now be described in more detail with reference to the accompanying drawings. While exemplary embodiments of the invention are shown in the drawings, it should be understood that the invention can be implemented in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided to enable a more thorough understanding of the invention and to fully convey the scope of the invention to those skilled in the art.

[0037] It should be understood that the terminology used herein is for the purpose of describing particular exemplary embodiments only and is not intended to be limiting. Unless the context clearly indicates otherwise, the singular forms “a,” “an,” and “described” as used herein may also include the plural forms. The terms “comprising,” “including,” “containing,” and “having” are inclusive and therefore indicate the presence of the stated features, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, steps, operations, elements, components, and / or combinations thereof. The method steps, processes, and operations described herein are not construed as requiring them to be performed in a particular order described or illustrated unless the order of performance is explicitly indicated. It should also be understood that additional or alternative steps may be used.

[0038] Although terms such as first, second, third, etc., may be used in this document to describe multiple elements, components, regions, layers, and / or segments, these elements, components, regions, layers, and / or segments should not be limited by these terms. These terms may be used only to distinguish one element, component, region, layer, or segment from another. Unless the context clearly indicates otherwise, terms such as "first," "second," and other numerical terms used herein do not imply order or sequence. Therefore, the first element, component, region, layer, or segment discussed below may be referred to as the second element, component, region, layer, or segment without departing from the teachings of the exemplary embodiments.

[0039] For ease of description, spatial relative terms may be used in the text to describe the relationship of one element or feature relative to another element or feature, as shown in the figure. These relative terms include, for example, "inside," "outside," "middle," "outer," "below," "below," "above," "over," etc. Such spatial relative terms are intended to include different orientations of the device in use or operation, other than those depicted in the figure. For example, if the device in the figure is flipped, an element described as "below other elements or features" or "below other elements or features" would subsequently be oriented as "above other elements or features" or "above other elements or features." Therefore, the example term "below" can include both upper and lower orientations. The device may be otherwise oriented (rotated 90 degrees or in other directions), and the spatial relative descriptors used in the text will be interpreted accordingly.

[0040] like Figure 1 As shown, an embodiment of the present invention provides a modular combined water-cooled wall 100, which includes a plurality of first water-cooled modules 10 and a plurality of second water-cooled modules 20. Specifically, the first water-cooled module 10 includes at least one water-cooled pipe 11, and the second water-cooled module 20 includes at least one water-cooled pipe 21 and at least one buffer pipe 22. Adjacent water-cooled modules are detachably connected by clips and components 30.

[0041] According to an embodiment of the present invention, a modular combined water-cooled wall 100 includes multiple first water-cooled modules 10 and multiple second water-cooled modules 20 connected together. Specifically, the multiple first water-cooled modules 10 and multiple second water-cooled modules 20 can be arranged crosswise. Adjacent water-cooled modules are detachably connected by clips and components 30. The clips and components 30 are arranged along the length of the water-cooled pipe. The clips and components 30 can cause displacement between the water-cooled modules along the length of the water-cooled pipe, thereby reducing the vertical component of thermal stress and reducing the impact of thermal stress on the connection of the water-cooled modules. The second water-cooled module 20 includes a buffer tube 22, which has a certain deformation capacity. When the water-cooled module is subjected to large thermal stress, the buffer tube 22 can absorb part of the thermal stress and undergo a certain deformation, thereby reducing the lateral thermal stress of the water-cooled module and avoiding cracking of the water-cooled module.

[0042] Specifically, two adjacent first water-cooling modules 10 are connected by cards and components 30, and two adjacent second water-cooling modules 20 are connected by cards and components 30. When the multiple first water-cooling modules 10 and the multiple second water-cooling modules 20 are arranged in a cross manner, adjacent first water-cooling modules 10 and second water-cooling modules 20 are connected by cards and components 30.

[0043] The first water-cooling module 10 includes at least one water-cooling pipe 11. Specifically, the number of water-cooling pipes 11 can be one, two, three, four, five, six or more, and the water-cooling pipes 11 are welded together. In order to provide arrangement space for the second water-cooling module 20, this embodiment preferably includes one water-cooling pipe 11 in the first water-cooling module 10.

[0044] The second water-cooled module 20 includes at least one water-cooling pipe 21 and at least one buffer pipe 22. A single water-cooling pipe 21 can partially reduce vertical stress, while multiple water-cooling pipes 21 can enhance the vertical stress reduction effect of the second water-cooled module 20. Including a buffer pipe 22 in the second water-cooled module 20 allows it to have a certain degree of deformability, thereby reducing the overall lateral thermal stress of the modular combined water-cooled wall 100. Alternatively, multiple buffer pipes 22 can be arranged to give the second water-cooled module 20 greater deformability, further reducing the overall lateral thermal stress of the modular combined water-cooled wall 100.

[0045] In some embodiments of the present invention, the second water-cooling module 20 includes at least two water-cooling pipes 21 and at least one buffer pipe 22. The at least two water-cooling pipes 21 are connected to the at least one buffer pipe 22, and the two water-cooling pipes 21 are respectively arranged at both ends of the second water-cooling module 20. Arranging the two water-cooling pipes 21 at both ends of the second water-cooling module 20, the two water-cooling pipes 21 are respectively used to connect the clips and components 30 to ensure the reliability of the connection between the clips and components 30, prevent deformation of the buffer pipe 22 from affecting the clips and connections at both ends of the second water-cooling module 20, and improve the reliability of the connection between adjacent water-cooling modules. Specifically, the two water-cooling pipes 21 are located at both ends of the second water-cooling module 20. One or more buffer pipes 22 can be arranged between the two second water-cooling modules 20, or buffer pipes 22 and water-cooling pipes 21 can be arranged between the two second water-cooling modules 20. The number of buffer pipes 22 and water-cooling pipes 21 can be set according to actual needs.

[0046] Furthermore, the second water-cooling module 20 includes two water-cooling pipes 21 and a buffer pipe 22. The two water-cooling pipes 21 are connected to opposite sides of the buffer pipe 22, and the two water-cooling pipes 21 are connected to the clip and assembly 30 respectively. The combination of the two water-cooling pipes 21 and the buffer pipe 22 can reduce the lateral thermal stress of the water-cooling module, while also reducing the impact of the deformation of the buffer pipe 22 on the clip and assembly 30 connection, thus improving the reliability of the connection between the clip and assembly 30.

[0047] In some embodiments of the present invention, the buffer tube 22 is a hollow tube, that is, the cavity of the buffer tube 22 is not filled with any liquid or solid, so as to ensure the deformability of the buffer tube 22.

[0048] In some embodiments of the present invention, the wall thickness of the buffer tube 22 is less than that of the water cooling tube 21 to improve the deformability of the buffer tube 22 and further ensure that the buffer tube 22 can reduce the lateral thermal stress of the water cooling module.

[0049] In some embodiments of the present invention, the outer diameter of the buffer tube 22 is less than or equal to the outer diameter of the water-cooling tube 21, so as to avoid the buffer tube 22 occupying too much space, prevent the overall volume of the modular combined water-cooling wall 100 from being too large, and facilitate the installation of the modular combined water-cooling wall 100.

[0050] In some embodiments of the present invention, the card and component 30 includes: a snap-fit ​​component 31 and a snap-fit ​​component 32. The first water-cooling module 10 has snap-fit ​​components 31 and 32 respectively at its two ends; that is, the first end of the first water-cooling module 10 has a snap-fit ​​component 31, and the second end of the first water-cooling module 10 has a snap-fit ​​component 32, with snap-fit ​​components 31 and 32 located at opposite ends of the first water-cooling module 10. The second water-cooling module 20 also has snap-fit ​​components 31 and 32 respectively at its two ends; that is, the first end of the second water-cooling module 20 has a snap-fit ​​component 31, and the second end of the second water-cooling module 20 has a snap-fit ​​component 32, with snap-fit ​​components 31 and 32 located at opposite ends of the second water-cooling module 20. Two adjacent first water-cooling modules 10 are detachably connected by snap-fit ​​connectors 31 and 32. Two adjacent second water-cooling modules 20 are detachably connected by snap-fit ​​connectors 31 and 32.

[0051] Specifically, the first end of the snap-fit ​​component 31 is connected to the water-cooling module, that is, the first end of the snap-fit ​​component 31 is connected to the first water-cooling module 10, and the first end of the snap-fit ​​component 31 is connected to the second water-cooling module 20. The second end of the snap-fit ​​component 31 is provided with a snap-fit ​​protrusion 311. The first end of the snap-fit ​​component 32 is connected to the water-cooling module, that is, the first end of the snap-fit ​​component 32 is connected to the first water-cooling module 10, and the first end of the snap-fit ​​component 32 is connected to the second water-cooling module 20. The second end of the snap-fit ​​component 32 is formed with a groove 321. The snap-fit ​​protrusion 311 and the groove 321 are adapted to each other, and the snap-fit ​​protrusion 311 and the groove 321 realize the detachable connection of two adjacent water-cooling modules.

[0052] In some embodiments of the present invention, the groove 321 is T-shaped. The T-shaped groove 321, in conjunction with the latching protrusion 311, prevents the latching member 31 and the latching member 32 from disengaging laterally along the modular water-cooled wall 100. Simultaneously, it ensures that the latching member 31 and the latching member 32 can move or slide vertically along the modular water-cooled wall 100, thereby reducing the vertical component of thermal stress.

[0053] It should be noted that the water-cooling module in this invention includes a first water-cooling module 10 and a second water-cooling module 20. The transverse direction of the modular combined water-cooled wall 100 refers to the arrangement direction of the water-cooling pipes 21 and / or buffer pipes 22, and the longitudinal direction of the modular combined water-cooled wall 100 refers to the length direction of any water-cooling pipe 21 or buffer pipe 22.

[0054] A second aspect of the present invention provides a method for arranging a modular combined water-cooled wall 100, the method comprising:

[0055] Obtain multi-point temperature and multi-point stress values ​​of the original water-cooled wall of the boiler;

[0056] Numerical simulation based on multi-point temperature values ​​and multi-point stress;

[0057] Mark locations where the temperature and stress values ​​are lower than the preset values;

[0058] The second water-cooling module is set at the marked position, and the first water-cooling module is set at the remaining positions.

[0059] According to the modular combined water-cooled wall 100 arrangement method of the present invention, multiple first water-cooled modules 10 and multiple second water-cooled modules 20 are connected. Specifically, the multiple first water-cooled modules 10 and multiple second water-cooled modules 20 can be arranged crosswise. Adjacent water-cooled modules are detachably connected by clips and components 30. The clips and components 30 are arranged along the length direction of the water-cooled pipe. The clips and components 30 can cause displacement between the water-cooled modules along the length direction of the water-cooled pipe, thereby reducing the vertical component of thermal stress and reducing the impact of thermal stress on the connection of the water-cooled modules. The second water-cooled module 20 includes a buffer tube 22. The buffer tube 22 has a certain deformation capacity. When the water-cooled module is subjected to large thermal stress, the buffer tube 22 can absorb part of the thermal stress and undergo a certain deformation, thereby reducing the lateral thermal stress of the water-cooled module and preventing the water-cooled module from cracking.

[0060] The specific steps of the modular combined water-cooled wall 100 arrangement method include:

[0061] 1. Multiple water-cooled wall surface temperature thermocouple measuring points and thermal stress high-temperature strain gauge measuring points are evenly arranged on the original water-cooled wall of the boiler of the unit.

[0062] 2. Connect the temperature measuring point to the temperature acquisition board, and connect the stress measuring point to the high-temperature strain gauge;

[0063] 3. Temperature acquisition data from the IMP board and high-temperature strain gauge are collected and processed on a personal PC for full collection of temperature and stress data.

[0064] 4. Collect thermal stress data of water-cooled wall thermometers under various variable load conditions encountered in actual power plant operation;

[0065] 5. Analyze and process water-cooled wall temperature and stress data under various variable load conditions, including but not limited to: numerical statistics of temperature and stress scatter point measurements, numerical simulation of water-cooled wall temperature and thermal stress based on measurement data, and interpolation and inversion of water-cooled wall temperature field and thermal stress field distribution based on measurement data.

[0066] 6. After determining the high temperature and high stress areas of the original water-cooled wall surface under various variable load conditions, find the maximum temperature and stress values ​​in each working condition. The preset temperature value for each working condition is less than or equal to 60% of the maximum temperature under that working condition, and the preset stress value for each working condition is less than or equal to 60% of the maximum stress under that working condition. Mark their locations.

[0067] 7. The water-cooled wall panel serial number that appears in all operating conditions is the position that should be replaced with the second water-cooled module 20; all other positions are the first water-cooled module 10. This method ensures that the modular water-cooled wall panel absorbs thermal stress in high-stress areas without becoming a new danger zone.

[0068] 8. Based on the above analysis, a modular combined water-cooled wall 100 suitable for a certain boiler was built on site to replace the original water-cooled wall, so as to realize the scientific use of the modular water-cooled wall and reduce the lateral and vertical thermal stress of the water-cooled wall under various variable load conditions.

[0069] It is understood that the above embodiments are merely exemplary implementations used to illustrate the principles of the present invention, and the present invention is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and essence of the present invention, and these modifications and improvements are also considered to be within the scope of protection of the present invention.

Claims

1. A modular combined water-cooled wall, characterized in that, The modular combined water-cooled wall includes: Multiple first water-cooling modules, each first water-cooling module including at least one water-cooling pipe; Multiple second water-cooling modules, each second water-cooling module including at least one water-cooling pipe and at least one buffer pipe; Multiple first water-cooling modules are connected to multiple second water-cooling modules, and adjacent water-cooling modules are detachably connected via cards and components; The buffer tube is a hollow tube.

2. The modular combined water-cooled wall according to claim 1, characterized in that, The second water-cooling module includes: At least two of the water-cooling pipes and at least one of the buffer pipes, wherein at least two of the water-cooling pipes are connected to at least one of the buffer pipes, and the two water-cooling pipes are respectively arranged at both ends of the second water-cooling module.

3. The modular combined water-cooled wall according to claim 2, characterized in that, The second water-cooling module includes two water-cooling pipes and one buffer pipe. The two water-cooling pipes are connected to opposite sides of the buffer pipe, and the two water-cooling pipes are connected to the card and the component respectively.

4. The modular combined water-cooled wall according to claim 3, characterized in that, The wall thickness of the buffer tube is less than that of the water-cooling tube.

5. The modular combined water-cooled wall according to claim 3, characterized in that, The outer diameter of the buffer tube is not greater than the outer diameter of the water-cooling tube.

6. The modular combined water-cooled wall according to any one of claims 1 to 5, characterized in that, The card and components include: The first water-cooling module is provided with the snap-fit ​​connector at its first end, and the second water-cooling module is provided with the snap-fit ​​connector at its first end. The card and component are provided at the second end of the first water-cooling module and at the second end of the second water-cooling module. The first water-cooling module and the second water-cooling module are connected to the card and component through the card connector.

7. The modular combined water-cooled wall according to claim 6, characterized in that, The first end of the snap-fit ​​component is connected to the first water-cooling module, the first end of the snap-fit ​​component is connected to the second water-cooling module, the second end of the snap-fit ​​component is provided with a snap-fit ​​protrusion, the first end of the snap-fit ​​component is connected to the first water-cooling module, the first end of the snap-fit ​​component is connected to the second water-cooling module, the second end of the snap-fit ​​component is formed with a groove, and the snap-fit ​​protrusion is adapted to the groove.

8. The modular combined water-cooled wall according to claim 7, characterized in that, The groove is T-shaped.

9. A method for arranging modular combined water-cooled walls according to any one of claims 1 to 8, characterized in that, The arrangement method of the modular combined water-cooled wall includes: Obtain multi-point temperature and multi-point stress values ​​of the original water-cooled wall of the boiler; Numerical simulation based on multi-point temperature values ​​and multi-point stress; Mark locations where the temperature and stress values ​​are lower than the preset values; The second water-cooling module is set at the marked position, and the first water-cooling module is set at the remaining positions.

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