A circuit board nickel plating and gold plating device and a method thereof

Abstract

The application discloses a circuit board nickel plating device and a nickel plating method thereof. The device comprises a reaction tank, a hydraulic rod is installed at the back side of the reaction tank, the output end of the hydraulic rod is connected with a connecting frame, the lower end of the connecting frame is installed with a mounting frame, the inner side of the mounting frame is rotationally connected with a rotating shaft, the end of the rotating shaft is installed with a fixing frame, the outer side of the rotating shaft at the left end position is provided with a positioning hole; the middle section of the fixing frame is installed with a fixed frame, the inner side of the front and rear ends of the fixed frame is slidably connected with a limiting rod, the end of the limiting rod is elastically connected with the fixed frame through a first spring. The device and the method can control the rotating shaft to rotate the fixing frame by controlling the movement of the driving rod and clamping it in the rotating shaft, adjust the plug-in end of the limited circuit board, make the plug-in end of the circuit board exposed for nickel plating reaction, comprehensively carry out the nickel plating reaction of the circuit board body, and improve the nickel plating effect of the circuit board.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of circuit board nickel plating, in particular to a circuit board nickel plating device and a circuit board nickel plating method. BACKGROUND

[0002] Circuit board nickel plating is a method for coating a solderable coating on the surface of bare copper PCB. In this process, nickel is first electroplated, and then a thin gold plating layer is formed on the copper surface by chemical gold immersion. The nickel plating technology can not only meet the requirements of increasingly complex PCB assembly and welding, but also has lower cost than electroplated nickel gold, and can effectively protect the side of the wire to prevent adverse phenomena during use. Therefore, the nickel plating process has been widely used in electronic products.

[0003] In the process of circuit board nickel plating, a hanging basket structure is used to insert and fix the circuit board, and then the circuit board is moved into the reaction tank together with the hanging basket for nickel plating. However, due to the shielding of the end position of the inserted and fixed circuit board, it is not conducive to uniformly plating nickel gold on the outer surface, which affects the overall quality of the circuit board nickel plating. Therefore, we propose a circuit board nickel plating device and a circuit board nickel plating method to solve the above problems. SUMMARY

[0004] The purpose of the present application is to provide a circuit board nickel plating device and a circuit board nickel plating method to solve the problem of the end position of the inserted and fixed circuit board on the market being not conducive to uniformly plating nickel gold on the outer surface due to shielding, which affects the overall quality of the circuit board nickel plating.

[0005] To achieve the above purpose, the present application provides the following technical scheme: a reaction tank is provided, a hydraulic rod is installed on the rear side of the reaction tank, the output end of the hydraulic rod is connected with a connecting frame, a mounting frame is installed at the lower end of the connecting frame, a rotating shaft is rotatably connected to the inner side of the mounting frame, a fixing frame is installed at the end of the rotating shaft, and a positioning hole is formed on the outer side of the rotating shaft at the left end position;

[0006] A fixed frame is installed on the middle section of the fixing frame, a limiting rod is slidingly connected inside the front and rear ends of the fixed frame, the end of the limiting rod is elastically connected with the fixed frame through a first spring, a limiting plate is installed at the inner side corner of the fixed frame and the moving frame, and a ball is movably connected to the inner side wall of the fixed frame and the moving frame; and a circuit board body is arranged between the fixed frame and the moving frame.

[0007] A threaded hole is formed on the front side of the fixed frame, and a threaded rod is threadedly connected in the threaded hole.

[0008] A rotating drum is rotatably connected to the left wall of the reaction tank, a driving rod is slidingly connected inside the rotating drum, and an outer cover is installed on the outer side of the driving rod.

[0009] A servo motor is installed at the front right of the reaction tank. The output end of the servo motor is connected to a lead screw. A support frame is threaded to the outside of the lead screw. A water spray pipe is installed at the lower end of the support frame. A nozzle is connected to the lower section of the water spray pipe. A piston body is slidably connected inside the upper section of the water spray pipe. A piston rod is connected to the upper side of the piston body. A first magnet is installed at the upper end of the piston rod.

[0010] An installation plate is installed on the inner wall of the reaction tank, and a second magnet and a third magnet are installed on the lower side of the installation plate.

[0011] Preferably, a slide rod is slidably connected to the left side of the mounting bracket, and a protrusion is installed on the outer side of the slide rod. The protrusion is elastically connected to the mounting bracket by a second spring.

[0012] Preferably, the fixing frame is connected to the mounting frame via a rotating shaft to form a rotating structure. Fixed frames are evenly distributed on the fixing frame, and there is a gap between the fixing frame and the movable frame. This design allows the fixed frame and the movable frame to rotate by rotating the fixing frame, thereby adjusting the position of the circuit board. The movable frame can move smoothly, avoiding friction and obstruction between it and the fixing frame.

[0013] Preferably, the threaded rod passes through the threaded hole and fits into the end of the limiting rod. The limiting rod has an "I" shaped structure, and the threaded holes are evenly distributed on the side wall of the fixed frame. This design can use the threaded rod to limit the movement distance of the limiting rod, making it easier for the space between the fixed frame and the moving frame to accommodate circuit boards of different sizes.

[0014] Preferably, the upper end of the support frame has an "n" shaped structure, and the support frame is slidably connected to the front wall of the reaction tank. This design can limit the support frame to move horizontally on the reaction tank and prevent it from rotating.

[0015] Preferably, the first magnet and the second magnet are magnets with the same poles, the first magnet and the third magnet are magnets with opposite poles, and the second magnet and the third magnet are distributed alternately. This design can utilize the repulsive and attractive forces between the magnets to achieve the reciprocating movement of the piston.

[0016] Preferably, the drive rod and the rotating shaft engage with each other, and the outer side of the rotating shaft has positioning holes distributed at equal angles. The positioning holes and the slide rod engage with each other. This design allows the drive rod to control the rotation of the rotating shaft, preventing rotation between the two, and the engagement of the slide rod and the positioning holes limits the angle of the rotating shaft.

[0017] Preferably, the contact points between the outer cover and the protrusion are both smoothly distributed, and the protrusion has a trapezoidal structure. This design allows the outer cover to push the protrusion to move and adjust the position of the slide rod.

[0018] The specific nickel plating method of the circuit board nickel plating device is as follows:

[0019] Step 1: the hydraulic rod is extended, the fixed frame and the movable frame are moved out of the reaction tank, the movable frame is pulled, the circuit board body is placed between the movable frame and the fixed frame, the movable frame is reset by the elastic force of the first spring, and the circuit board body is limited between the movable frame and the fixed frame;

[0020] Step 2: the hydraulic rod is retracted, the circuit board body is moved into the reaction tank, the nickel is chemically plated, and then a thin gold plating layer is formed on the copper surface through chemical gold immersion;

[0021] Step 3: the driving rod is pushed, the driving rod is moved into the rotating shaft, the rotating shaft is controlled to rotate, the fixed frame and the movable frame are inclined, the position of the circuit board body is adjusted, the plug-in end of the circuit board body is alternately adjusted, the bare part is subjected to the nickel plating reaction, and the nickel plating reaction of the circuit board body is comprehensively carried out;

[0022] Step 4: the servo motor works, the screw rod is controlled to rotate, the support frame is driven to move, the water spray pipe is controlled to move, the repulsion and attraction between the magnets are matched, the piston is driven to reciprocate up and down, the liquid in the reaction tank is continuously pumped out and discharged, the liquid in the reaction tank is mixed by reciprocating, the sedimentation is avoided, and the effect of the circuit board nickel plating reaction is improved.

[0023] Compared with the prior art, the beneficial effects of the present application are:

[0024] 1) The circuit board nickel plating device and the nickel plating method thereof can drive the movable frame to move, adjust the distance between the movable frame and the fixed frame, enable the circuit board to be smoothly inserted between the adjustable movable frame and the fixed frame for limiting, and limit the reset movement distance of the movable frame by adjusting the position of the threaded rod, so that the movable frame and the fixed frame can adapt to the size of the circuit board body for limiting, avoiding that the circuit board is clamped too tightly and being not conducive to adjusting the position of the circuit board;

[0025] 2) The circuit board nickel plating device and the nickel plating method thereof can control the rotating shaft to rotate by controlling the movable frame to move and being clamped in the rotating shaft, adjust the plug-in end of the limited circuit board, enable the plug-in end of the circuit board to be exposed for nickel plating reaction, comprehensively carry out the nickel plating reaction of the circuit board body, and improve the effect of the circuit board nickel plating;

[0026] 3) the line board nickel gold device and its nickel gold method, drive support frame to move with water pipe, cooperate first magnet and second magnet and third magnet alternate corresponding, use same pole magnet repulsion and opposite pole magnet attraction, control piston rod to drive piston body in water pipe up and down reciprocating movement, repeatedly pumping, spraying to the liquid in reaction pool, realize the mixing of liquid, avoid its precipitation, improve the effect of line board nickel gold reaction. BRIEF DESCRIPTION OF DRAWINGS

[0027] Figure 1 It is whole structure schematic diagram of the present application;

[0028] Figure 2 It is rear view structure schematic diagram of the present application;

[0029] Figure 3 It is sectional structure schematic diagram of the present application;

[0030] Figure 4 It is water pipe structure schematic diagram of the present application;

[0031] Figure 5 It is fixed frame structure schematic diagram of the present application;

[0032] Figure 6 It is mounting frame sectional structure schematic diagram of the present application;

[0033] Figure 7 It is A place enlarged structure schematic diagram in the present application Figure 6

[0034] Figure 8 It is mounting plate bottom structure schematic diagram of the present application;

[0035] Figure 9 It is fixed frame sectional structure schematic diagram of the present application;

[0036] Figure 10 It is water pipe sectional structure schematic diagram of the present application;

[0037] Figure 11 It is moving frame structure schematic diagram of the present application.

[0038] ​In the diagram: 1. Reaction tank; 2. Hydraulic rod; 3. Connecting frame; 4. Mounting frame; 5. Rotating shaft; 6. Fixed frame; 7. Fixed frame; 8. Limiting rod; 9. First spring; 10. Moving frame; 11. Ball bearing; 12. Limiting plate; 13. Threaded hole; 14. Threaded rod; 15. Servo motor; 16. Lead screw; 17. Support frame; 18. Water spray pipe; 19. Piston rod; 20. First magnet; 21. Piston body; 22. Nozzle; 23. Mounting plate; 24. Second magnet; 25. Third magnet; 26. Rotating drum; 27. Drive rod; 28. Outer cover; 29. ​​Sliding rod; 30. Protrusion; 31. Second spring; 32. Positioning hole; 33. Circuit board body. Detailed Implementation

[0039] The technical solutions of the present invention will be clearly and completely described below with reference to the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0040] Please see Figures 1-11 The present invention provides the following technical solution.

[0041] The system includes a reaction tank 1, a hydraulic rod 2 mounted on the rear side of the reaction tank 1, a connecting frame 3 connected to the output end of the hydraulic rod 2, a mounting frame 4 mounted on the lower end of the connecting frame 3, a rotating shaft 5 rotatably connected to the inner side of the mounting frame 4, a fixing frame 6 mounted on the end of the rotating shaft 5, and a positioning hole 32 opened on the outer side of the rotating shaft 5 at the left end; a fixing frame 7 is mounted in the middle section of the fixing frame 6, and limit rods 8 are slidably connected inside the front and rear ends of the fixing frame 7, with the ends of the limit rods 8 elastically connected to the fixing frame 7 via a first spring 9; limit plates 12 are installed at the inner corners of the fixing frame 7 and the moving frame 10, and ball bearings 11 are movably connected to the inner walls of the fixing frame 7 and the moving frame 10; a circuit board body 33 is provided between the fixing frame 7 and the moving frame 10; a threaded hole 13 is opened on the front side of the fixing frame 7, and a threaded rod 14 is threadedly connected to the threaded hole 13;

[0042] Furthermore, the threaded rod 14 passes through the threaded hole 13 and fits against the end of the limiting rod 8. The limiting rod 8 has an "I" shaped structure, and the threaded holes 13 are evenly distributed on the side wall of the fixed frame 7.

[0043] according to Figure 2 As shown, opening hydraulic rod 2 pushes the connecting frame 3 connected to the output end upward, thereby controlling the mounting frame 4 to move upward, which in turn controls the fixed frame 6 to move upward, removing the fixed frame 7 and the moving frame 10 from the reaction tank 1. Figure 5 , Figure 9 and Figure 11As shown, pull the moving frame 10, so that the moving frame 10 moves away from the fixed frame 7, at this time the limit rod 8 connected to the end of the moving frame 10 slides in the fixed frame 7, and the limit rod 8 extrudes the first spring 9 to store power, increase the distance between the moving frame 10 and the fixed frame 7, the circuit board body 33 can be placed between the moving frame 10 and the fixed frame 7, and one end of the circuit board body 33 is attached to the rear end of the fixed frame 7. Loosen the pull of the moving frame 10, the first spring 9 can control the limit rod 8 to reset the movement, thereby controlling the moving frame 10 to reset the movement, shortening the distance between the moving frame 10 and the fixed frame 7, limiting the circuit board body 33 between the moving frame 10 and the fixed frame 7. The size between the moving frame 10 and the fixed frame 7 after resetting can be adjusted according to the size of the same batch of circuit board bodies 33 that need to be processed, that is, the threaded rod 14 is screwed into the threaded hole 13 at the corresponding position. The stroke of the limit rod 8 is limited by the threaded rod 14, so that the moving frame 10 and the fixed frame 7 can adapt to the size of the circuit board body 33, so that the ball 11 contacts the side surface of the circuit board body 33 when limiting the circuit board, but the tightness is smaller. In turn, the same batch of circuit board bodies 33 are limited between the moving frame 10 and the fixed frame 7, then the connecting frame 3 is controlled to move down by the hydraulic rod 2, thereby controlling the mounting frame 4 to move down, moving the limited circuit board body 33 into the reaction tank 1, and performing chemical reaction on it, plating nickel on the circuit board body 33, and plating a layer of gold on the nickel layer;

[0044] Further, the left wall of the reaction tank 1 is rotatably connected with a rotating drum 26, the inside of the rotating drum 26 is slidably connected with a driving rod 27, the outside of the driving rod 27 is installed with an outer cover 28; the front right of the reaction tank 1 is installed with a servo motor 15, the output end of the servo motor 15 is connected with a lead screw 16, the outside of the lead screw 16 is threadedly connected with a support frame 17, the lower end of the support frame 17 is installed with a water spraying pipe 18, the lower section of the water spraying pipe 18 is connected with a spray head 22, the inside of the upper section of the water spraying pipe 18 is slidably connected with a piston body 21, the upper side of the piston body 21 is connected with a piston rod 19, the upper end of the piston rod 19 is installed with a first magnet 20; the inner wall of the reaction tank 1 is installed with a mounting plate 23, the lower side of the mounting plate 23 is installed with a second magnet 24 and a third magnet 25;

[0045] Specific, the left side of the mounting frame 4 is slidably connected with a slide bar 29, the outer side of the slide bar 29 is provided with a protrusion 30, the protrusion 30 is elastically connected with the mounting frame 4 through a second spring 31; the fixed frame 6 is rotatably connected with the mounting frame 4 through a rotating shaft 5, the fixed frame 6 is provided with fixed frames 7 at equal intervals, and there is a gap between the fixed frame 6 and the moving frame 10; the upper end of the support frame 17 is an "n" shaped structure, the support frame 17 is slidably connected with the front wall of the reaction tank 1; the first magnet 20 and the second magnet 24 are same-pole magnets, the first magnet 20 and the third magnet 25 are opposite-pole magnets, and the second magnet 24 and the third magnet 25 are alternately distributed; the driving rod 27 and the rotating shaft 5 are mutually engaged, the outer side of the rotating shaft 5 is provided with positioning holes 32 at equal angles, the positioning holes 32 and the slide bar 29 are mutually engaged; the contact parts between the outer cover 28 and the protrusion 30 are smoothly distributed, and the protrusion 30 is a trapezoidal structure;

[0046] In combination Figures 6-7As shown, the driving rod 27 is pushed to slide in the rotating drum 26, the end of the driving rod 27 is moved into the rotating shaft 5, and the outer mounted cover 28 is moved synchronously when the driving rod 27 moves, the cover 28 pushes the protrusion 30, the protrusion 30 extrudes the second spring 31, and the protrusion 30 drives the slide rod 29 to move upwards, the slide rod 29 is moved out of the positioning hole 32, the locking of the rotating shaft 5 is released, the control driving rod 27 drives the rotating shaft 5 to rotate, so that the fixed frame 6 can be controlled to rotate, and then the fixed frame 7 and the moving frame 10 are controlled to rotate, so that the fixed frame 7 and the moving frame 10 are inclined, and when the fixed frame 7 and the moving frame 10 are inclined to the rear, the circuit board body 33 can slide to the rear position and be attached to the rear end of the fixed frame 7 and the moving frame 10, and the front end of the circuit board body 33 is exposed for nickel immersion reaction, and when the fixed frame 7 and the moving frame 10 are inclined to the front, the circuit board body 33 can slide to the front position, the front end of the circuit board body 33 is attached to the front end of the fixed frame 7 and the moving frame 10, and the rear end of the circuit board body 33 is exposed for nickel immersion reaction, so that the nickel immersion reaction of the circuit board body 33 can be comprehensively performed, and when the circuit board is subjected to nickel immersion reaction, the servo motor 15 can be connected to the power supply, the servo motor 15 is controlled to rotate forward, so that the lead screw 16 connected to the output end is driven to rotate, the support frame 17 connected to the outer thread is controlled to move left, the support frame 17 slides on the side wall of the reaction tank 1 to ensure the horizontal movement of the support frame 17, the water jet pipe 18 mounted at the lower end is driven by the support frame 17 to move left, and when the positions of the first magnet 20 and the second magnet 24 distributed at the same pole correspond, the piston rod 19 is pressed to move down, so that the piston body 21 is controlled to move down, the liquid in the water jet pipe 18 is sprayed from the nozzle 22 into the reaction tank 1, and when the positions of the first magnet 20 and the third magnet 25 distributed at different poles correspond, the piston rod 19 is pulled to move up, so that the piston body 21 is controlled to move up, the liquid in the reaction tank 1 is sucked into the water jet pipe 18, and the liquid is mixed by reciprocation, the servo motor 15 is controlled to rotate reversely, so that the lead screw 16 is controlled to rotate reversely, the support frame 17 drives the water jet pipe 18 to move right, and the liquid in the reaction tank 1 is mixed by reciprocation to avoid sedimentation, thereby improving the effect of the circuit board nickel immersion reaction.

[0047] A specific nickel immersion method of the circuit board nickel immersion device is as follows:

[0048] Step 1: The hydraulic rod 2 is extended, the fixed frame 7 and the moving frame 10 are moved out of the reaction tank 1, the moving frame 10 is pulled, the circuit board body 33 is placed between the moving frame 10 and the fixed frame 7, the first spring 9 is used to control the moving frame 10 to reset, and the circuit board body 33 is positioned between the moving frame 10 and the fixed frame 7;

[0049] Step 2: the hydraulic rod 2 is retracted, the circuit board body 33 is moved into the reaction tank 1, and a thin gold plating layer is formed on the copper surface by electroless nickel plating and then electroless gold plating;

[0050] Step 3: the driving rod 27 is pushed, the driving rod 27 is moved into the rotating shaft 5, the rotating shaft 5 is controlled to rotate, the fixed frame 7 and the moving frame 10 are inclined, the position of the circuit board body 33 is adjusted, the plug-in end of the circuit board body 33 is alternately adjusted, the circuit board body 33 is exposed for nickel-gold plating reaction, and the nickel-gold plating reaction of the circuit board body 33 is comprehensively performed.

[0051] Step 4: the servo motor 15 works, the screw rod 16 is controlled to rotate, the support frame 17 is driven to move, the water jet pipe 18 is controlled to move, the repulsion and attraction between the magnets are matched, the piston is driven to reciprocate up and down, the liquid in the reaction tank is continuously pumped out and discharged, the liquid in the reaction tank 1 is mixed by reciprocation to avoid sedimentation, and the effect of the circuit board nickel-gold plating reaction is improved.

[0052] The contents not described in detail in the specification belong to the prior art known to those skilled in the art.

[0053] Although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art can modify the technical solutions recorded in the foregoing embodiments or make equivalent replacement to part of the technical features, and any modification, equivalent replacement, improvement, etc. within the spirit and principles of the present application shall be included in the protection scope of the present application.

Claims

1. A circuit board electroless nickel-gold plating apparatus, comprising a reaction cell (1), characterized in that: A hydraulic rod (2) is installed on the rear side of the reaction tank (1). A connecting frame (3) is connected to the output end of the hydraulic rod (2). A mounting frame (4) is installed at the lower end of the connecting frame (3). A rotating shaft (5) is rotatably connected to the inner side of the mounting frame (4). A fixing frame (6) is installed at the end of the rotating shaft (5). A positioning hole (32) is opened on the outer side of the rotating shaft (5) at the left end. A fixed frame (7) is installed in the middle section of the fixed frame (6). Limiting rods (8) are slidably connected inside the front and rear ends of the fixed frame (7). The ends of the limiting rods (8) are elastically connected to the fixed frame (7) through a first spring (9). Limiting plates (12) are installed at the inner corners of the fixed frame (7) and the moving frame (10). Ball bearings (11) are movably connected on the inner walls of the fixed frame (7) and the moving frame (10). A circuit board body (33) is provided between the fixed frame (7) and the moving frame (10). The front side of the fixed frame (7) is provided with a threaded hole (13), and a threaded rod (14) is threadedly connected inside the threaded hole (13); A rotating cylinder (26) is rotatably connected to the left wall of the reaction tank (1), and a drive rod (27) is slidably connected inside the rotating cylinder (26). An outer cover (28) is installed on the outside of the drive rod (27). A servo motor (15) is installed at the front right of the reaction tank (1). The output end of the servo motor (15) is connected to a lead screw (16). A support frame (17) is threaded to the outside of the lead screw (16). A water spray pipe (18) is installed at the lower end of the support frame (17). A nozzle (22) is connected to the lower section of the water spray pipe (18). A piston body (21) is slidably connected to the upper section of the water spray pipe (18). A piston rod (19) is connected to the upper side of the piston body (21). A first magnet (20) is installed at the upper end of the piston rod (19). An installation plate (23) is installed on the inner wall of the reaction tank (1), and a second magnet (24) and a third magnet (25) are installed on the lower side of the installation plate (23).

2. The circuit board electroless nickel-gold plating apparatus according to claim 1, characterized in that: A slide rod (29) is slidably connected to the left side of the mounting bracket (4), and a protrusion (30) is installed on the outside of the slide rod (29). The protrusion (30) is elastically connected to the mounting bracket (4) through a second spring (31).

3. The circuit board electroless nickel-gold plating apparatus according to claim 1, characterized in that: The fixed frame (6) forms a rotating structure with the mounting frame (4) through the rotating shaft (5). Fixed frames (7) are evenly distributed on the fixed frame (6), and there is a gap between the fixed frame (6) and the moving frame (10).

4. The circuit board immersion nickel-gold plating apparatus according to claim 1, characterized in that: The threaded rod (14) passes through the threaded hole (13) and fits against the end of the limiting rod (8). The limiting rod (8) has an "I" shaped structure. The threaded holes (13) are evenly distributed on the side wall of the fixed frame (7).

5. The circuit board electroless nickel-gold plating apparatus according to claim 1, characterized in that: The upper end of the support frame (17) has an "n" shaped structure, and the support frame (17) is slidably connected to the front wall of the reaction tank (1).

6. The circuit board electroless nickel-gold plating apparatus according to claim 1, characterized in that: The first magnet (20) and the second magnet (24) are magnets with the same poles, and the first magnet (20) and the third magnet (25) are magnets with opposite poles. The second magnet (24) and the third magnet (25) are distributed alternately.

7. The circuit board immersion nickel-gold plating device according to claim 2, characterized in that: The drive rod (27) and the rotating shaft (5) engage with each other. The rotating shaft (5) has positioning holes (32) distributed at equal angles on its outer side. The positioning holes (32) and the slide rod (29) engage with each other.

8. The circuit board immersion nickel-gold plating apparatus according to claim 2, characterized in that: The contact points of the outer cover (28) and the protrusions (30) are both smoothly distributed, and the protrusions (30) have a trapezoidal structure.

9. A method for immersion nickel-gold plating of a circuit board immersion nickel-gold plating apparatus as described in any one of claims 1-8, characterized in that: The specific method for nickel-gold plating in the circuit board immersion nickel-gold device is as follows: Step 1: Extend the hydraulic rod (12) to move the fixed frame (7) and the moving frame (10) out of the reaction tank (1), pull the moving frame (10) to place the circuit board body (33) between the moving frame (10) and the fixed frame (7), and use the elastic force of the first spring (9) to control the moving frame (10) to reset, and limit the circuit board body (33) between the moving frame (10) and the fixed frame (7); Step 2: The hydraulic rod (12) retracts, moving the circuit board body (33) into the reaction tank (1), first chemically plating nickel, and then forming a thin gold plating layer on the copper surface by chemical immersion gold. Step 3: Push the drive rod (27), the drive rod (27) moves into the rotating shaft (5), control the rotating shaft (5) to rotate, so that the fixed frame (7) and the moving frame (10) tilt, adjust the position of the circuit board body (33), so that the plug end of the circuit board body (33) is adjusted alternately, so that it is exposed for the nickel plating reaction, and the entire circuit board body (33) is subjected to the nickel plating reaction; Step 4: The servo motor (15) works, controls the lead screw (16) to rotate, drives the support frame (17) to move, thereby controlling the water spray pipe (18) to move. Combined with the repulsive and attractive forces between the magnets, the piston moves up and down repeatedly to continuously draw and discharge the liquid in the reaction tank. This process is repeated to mix the liquid in the reaction tank (1) to prevent it from settling and improve the effect of the nickel-gold plating reaction on the circuit board.

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