Superconducting coil solidification method and system

Abstract

The embodiment of the present application provides a superconducting coil curing method and system, wherein the superconducting coil curing method comprises: pasting an anti-sticking material to the outer turn of the superconducting coil to obtain a curing space, wherein the curing space is formed by the skeleton of the superconducting coil, the winding of the superconducting coil and the anti-sticking material, and the height of the anti-sticking material after pasting is greater than the height of the winding; filling the curing space with curing material, and covering the anti-sticking plate on the curing material parallel to the winding from the outside of the filled curing space; after the curing material is cured, removing the anti-sticking plate and the anti-sticking material to obtain a cured superconducting coil. Pasting the anti-sticking material to the outer turn prevents the outer turn from being sealed by the curing material, ensuring that the superconducting coil can be used normally later, and the cured strip becomes a whole, which can ensure that the end face of the superconducting coil is not scratched, increase the cooling effect of the superconducting coil, and prevent the strip from moving relatively due to temperature changes, thereby improving the stability of the superconducting coil.

Description

Technical Field

[0001] The embodiments of the present application relate to the field of high-temperature superconducting technology, and in particular to a superconducting coil solidification method and system. Background Art

[0002] In recent years, superconducting coils have made great progress and great improvements in industrial applications. A superconducting coil is an electromagnetic coil made of superconducting materials. When such a coil is cooled below its critical temperature, the resistance inside the superconducting material drops to zero and can carry very large currents without heat loss. This enables superconducting coils to generate stronger magnetic fields than traditional copper or aluminum coils at the same input power.

[0003] However, due to the mechanical disturbance caused by the magnetic field and the hot and cold cycles under low temperature conditions, the stability of the superconducting coil is poor. Therefore, a solution that can improve the stability of the superconducting coil is urgently needed. Summary of the invention

[0004] In view of this, an embodiment of the present application provides a superconducting coil solidification method. One or more embodiments of the present application also relate to a superconducting coil solidification system to solve the technical defects existing in the prior art.

[0005] According to a first aspect of an embodiment of the present application, a superconducting coil solidification method is provided, comprising:

[0006] Pasting the anti-sticking material to the outer turn of the superconducting coil to obtain a solidification space, wherein the solidification space is formed by the skeleton of the superconducting coil, the winding of the superconducting coil and the anti-sticking material, and the height of the anti-sticking material after pasting is greater than the height of the winding;

[0007] Fill the curing space with curing material, and cover the anti-sticking plate on the curing material parallel to the winding from the outside of the filled curing space;

[0008] After the solidified material is solidified, the anti-sticking plate and the anti-sticking material are removed to obtain a solidified superconducting coil.

[0009] According to a second aspect of an embodiment of the present application, a superconducting coil curing system is provided, including a pasting component, a filling component, and a removal component;

[0010] A pasting component is used to paste the anti-sticking material to the outer turn of the superconducting coil to obtain a solidification space, wherein the solidification space is formed by the skeleton of the superconducting coil, the winding of the superconducting coil and the anti-sticking material, and the height of the pasted anti-sticking material is greater than the height of the winding;

[0011] A filling component is used to fill the curing material into the curing space, and to cover the anti-sticking plate on the curing material parallel to the winding from the outside of the filled curing space;

[0012] The dismantling assembly is used to remove the anti-sticking plate and the anti-sticking material after the curing material is cured, so as to obtain a cured superconducting coil.

[0013] A superconducting coil curing method provided by an embodiment of the present application includes pasting an anti-adhesive material to the outer turn of the superconducting coil to obtain a curing space, wherein the curing space is formed by the skeleton of the superconducting coil, the winding of the superconducting coil and the anti-adhesive material, and the height of the anti-adhesive material after pasting is greater than the height of the winding; filling the curing space with curing material, and covering the curing material with an anti-adhesive plate parallel to the winding from the outside of the filled curing space; after the curing material is cured, removing the anti-adhesive plate and the anti-adhesive material to obtain a cured superconducting coil. By pasting the anti-adhesive material to the outer turn of the superconducting coil, the outer turn will not be sealed by the curing material, ensuring that the superconducting coil can be used normally later, and the strip cured by the curing material can become a whole, which can not only ensure that the end face of the superconducting coil is not scratched, but also increase the cooling effect of the superconducting coil, so that the strip will not move relatively due to temperature changes, and improve the stability of the superconducting coil. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 This is a flow chart of a superconducting coil solidification method provided by one embodiment of the present application;

[0015] Figure 2 This is a diagram of the end surface structure of a superconducting coil before solidification provided by an embodiment of the present application;

[0016] Figure 3 This is a structural diagram of an end surface of a superconducting coil with an anti-sticking material provided by an embodiment of the present application;

[0017] Figure 4 This is another end surface structure diagram of a superconducting coil with an anti-sticking material attached thereto provided by an embodiment of the present application;

[0018] Figure 5 This is a schematic diagram of the sticking position of an anti-sticking material for the outer turn of a superconducting coil winding provided by an embodiment of the present application;

[0019] Figure 6 This is a structural diagram of an end surface of a superconducting coil covered with an anti-sticking plate provided by an embodiment of the present application;

[0020] Figure 7 This is a structural diagram of an end surface of a superconducting coil after solidification provided by an embodiment of the present application;

[0021] Figure 8 This is a test data diagram of the inter-turn resistance of a superconducting coil after solidification provided by an embodiment of the present application;

[0022] Fig. 9 This is an architectural diagram of a superconducting coil curing system provided in one embodiment of the present application. DETAILED DESCRIPTION

[0023] Many specific details are described in the following description to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways than those described herein, and those skilled in the art can make similar generalizations without violating the connotation of the present application, so the present application is not limited by the specific implementation disclosed below.

[0024] The terms used in one or more embodiments of the present application are only for the purpose of describing specific embodiments, and are not intended to limit one or more embodiments of the present application. The singular forms of "a", "said" and "the" used in one or more embodiments of the present application and the appended claims are also intended to include plural forms, unless the context clearly indicates other meanings. It should also be understood that the term "and / or" used in one or more embodiments of the present application refers to and includes any or all possible combinations of one or more associated listed items.

[0025] It should be understood that, although the terms first, second, etc. may be used to describe various information in one or more embodiments of the present application, these information should not be limited to these terms. These terms are only used to distinguish the same type of information from each other. For example, without departing from the scope of one or more embodiments of the present application, the first may also be referred to as the second, and similarly, the second may also be referred to as the first. Depending on the context, the word "if" as used herein may be interpreted as "at the time of" or "when" or "in response to determining".

[0026] In addition, it should be noted that the user information (including but not limited to user device information, user personal information, etc.) and data (including but not limited to data used for analysis, stored data, displayed data, etc.) involved in one or more embodiments of the present application are all information and data authorized by the user or fully authorized by all parties, and the collection, use and processing of relevant data must comply with the relevant laws, regulations and standards of the relevant countries and regions, and provide corresponding operation entrances for users to choose to authorize or refuse.

[0027] First, the terms involved in one or more embodiments of the present application are explained.

[0028] Uninsulated superconducting coil: It is a specially designed superconducting coil in which the superconducting tape is not wrapped by traditional electrical insulation materials during winding. This design allows direct current transmission and heat conduction between adjacent coil turns. The winding technology of uninsulated superconducting coil has the following advantages: stable mechanical properties; greater current density; stronger quench self-protection ability. Uninsulated coils can be used in the design of high magnetic field insertion coils and highly compact DC magnetic field applications.

[0029] Quench self-protection capability: refers to the ability of the system to automatically take measures to prevent the entire coil from being damaged when a part of the coil changes from a superconducting state to a normal conductive state. The causes of quenching include local temperature increase, increased current density, and changes in magnetic field strength. The superconducting state is a special state in which the resistance of certain materials suddenly drops to zero and exhibits complete anti-magnetism when it is below a certain temperature (called the critical temperature Tc).

[0030] Radial stress: refers to the force acting on the coil material along the radius of the coil (i.e. from the center outward). This stress is usually caused by electromagnetic force, thermal expansion or cold contraction.

[0031] Cracking stress: refers to local high stress concentration caused by internal defects in the material or external loads, which may cause microcracks in the material to propagate and eventually form macrocracks or fractures.

[0032] Epoxy: is a thermosetting plastic that forms a very strong and chemically resistant material when cured. Epoxy consists of two parts: an epoxy prepolymer (also called epoxy resin) and a hardener (or curing agent). When these two parts are mixed, a chemical reaction occurs, causing the material to transform from a liquid or viscous state to a hard solid. The main properties of epoxy include: High strength: The cured material of epoxy has high mechanical strength. Good bonding properties: It can bond well to a variety of materials, including metal, wood, glass and some plastics. Chemical resistance: Epoxy has good resistance to many solvents and chemicals. Electrical insulation properties: Epoxy is a good electrical insulator. Dimensional stability: It can maintain a stable shape even under temperature changes. Low shrinkage: The volume changes very little during the curing process.

[0033] 2850FT: Also known as STYCAST 2850FT, it is a two-component thermally conductive epoxy potting / encapsulation material used to encapsulate components that require heat dissipation and thermal shock resistance.

[0034] CAT9 curing agent: refers to the curing agent used together with 2850FT. 2850FT and CAT9 curing agent can form a packaging material with good thermal conductivity and electrical insulation.

[0035] G10 board: It is a high-performance composite material, belonging to glass fiber reinforced epoxy resin laminate. G10 board is made of multiple layers of glass fiber cloth impregnated with epoxy resin and pressed under high temperature and high pressure. This material is widely used in many fields due to its excellent mechanical properties, electrical insulation properties and chemical corrosion resistance.

[0036] Superconducting coils can be divided into two categories according to whether insulating materials are used: insulated superconducting coils and uninsulated superconducting coils. For insulated superconducting coils, the coils are solidified by epoxy resin impregnation and paraffin wax impregnation. However, the radial stress and cracking stress generated by these two impregnation methods on the superconducting tape will reduce the performance of the tape or even completely damage it. In addition, the non-conductive material impregnation method will also increase the inter-turn contact resistance of the uninsulated superconducting coil, so it is not suitable for uninsulated superconducting coils.

[0037] In order to solve the above problems, the embodiment of the present application proposes a superconducting coil curing scheme that can improve the stability of the superconducting coil. The superconducting coil curing scheme is not only applicable to insulated superconducting coils, but also particularly applicable to non-insulated superconducting coils. Specifically, an anti-adhesive material is pasted to the outer turn of the superconducting coil to obtain a curing space, wherein the curing space is formed by the skeleton of the superconducting coil, the winding of the superconducting coil and the anti-adhesive material, and the height of the anti-adhesive material after pasting is greater than the height of the winding; the curing material is filled into the curing space, and from the outside of the filled curing space, the anti-adhesive plate is covered on the curing material in parallel with the winding; after the curing material is cured, the anti-adhesive plate and the anti-adhesive material are removed to obtain a cured superconducting coil. By pasting the anti-adhesive material to the outer turn of the superconducting coil, the outer turn will not be sealed by the curing material, ensuring that the superconducting coil can be used normally later, and the strip cured by the curing material can become a whole, which can not only ensure that the end face of the superconducting coil is not scratched, but also increase the cooling effect of the superconducting coil, so that the strip will not move relatively due to temperature changes, thereby improving the stability of the superconducting coil.

[0038] In the present application, a superconducting coil solidification method is provided. The present application also relates to a superconducting coil solidification system, which will be described in detail one by one in the following embodiments.

[0039] See also Figure 1 , Figure 1 A flow chart of a superconducting coil solidification method provided by an embodiment of the present application is shown, which specifically includes the following steps:

[0040] Step 102: Paste the anti-sticking material to the outer turn of the superconducting coil to obtain a solidification space, wherein the solidification space is formed by the skeleton of the superconducting coil, the winding of the superconducting coil and the anti-sticking material, and the height of the pasted anti-sticking material is greater than the height of the winding.

[0041] It should be noted that in order to prevent the solidified material from flowing to the surface of the strip and causing damage to the strip, an anti-sticking material can be pasted on the outer turn of the superconducting coil to protect the strip. The anti-sticking material is used to prevent the outer turn of the superconducting coil from adhering to the solidified material. The adhesion between the anti-sticking material and the solidified material is low, which facilitates demoulding after the solidified material is solidified. The anti-sticking material includes Teflon tape. Teflon tape, which can also be called polytetrafluoroethylene tape, has the characteristics of very smooth surface, high temperature resistance, chemical corrosion resistance, good non-stickiness, and good electrical insulation performance. The anti-sticking material can also be other materials with good non-stickiness between the solidified material, such as pure anodized aluminum plate, copper plate, aluminum plate, stainless steel plate. The anti-sticking material is selected according to the actual situation, and the embodiment of the present application does not make any restrictions on this. The superconducting coil can be a wound superconducting coil of different shapes (such as round or D-shaped) and different strip states (such as tinned strip or bare strip). When the anti-sticking material is pasted to the outer turns of the superconducting coil, in order to ensure that the outer turns of the superconducting coil will not be sealed by the solidified material, the anti-sticking material may be used to completely cover the windings of the superconducting coil.

[0042] See also Figure 2 , Figure 2 An end structure diagram of a superconducting coil before solidification provided by an embodiment of the present application is shown, and the superconducting coil includes a skeleton, two windings and a divider. The skeleton is a basic structure that provides physical support for the superconducting coil. The winding refers to the overall structure formed by winding the superconducting wire onto the skeleton in a specific manner. The design of the winding determines the key parameters of the superconducting coil, such as inductance, resistance, magnetic field strength and distribution. When the superconducting coil has multiple layers of windings, in order to prevent the wires between different layers from directly contacting each other and causing a short circuit, dividers made of insulating material can be inserted between the layers, thereby ensuring electrical isolation between each layer of windings, while also helping to dissipate heat and reduce eddy current losses.

[0043] In practical applications, there are many ways to stick the anti-sticking material to the outer turns of the superconducting coil to obtain a solidification space, which can be selected based on actual conditions, and the embodiments of the present application do not impose any limitation on this.

[0044] In one implementation of the present application, if the anti-sticking material can completely cover the winding of the superconducting coil and its height is greater than the height of the winding, the anti-sticking material can be directly used to be flush with the skeleton of the superconducting coil and adhered to the outer turns of the superconducting coil to obtain a solidified space formed by the skeleton of the superconducting coil, the winding of the superconducting coil and the anti-sticking material.

[0045] See also Figure 3 , Figure 3The end structure diagram of a superconducting coil with anti-adhesive material attached thereto provided by an embodiment of the present application is shown. The superconducting coil includes a frame, two windings and a dividing plate. Since the anti-adhesive material can completely cover the windings of the superconducting coil and is higher than the height of the windings, the anti-adhesive material can be directly used to be flush with the frame of the superconducting coil and attached to the outer turns of the superconducting coil. The attachment position of the anti-adhesive material attached to the outer turns of the superconducting coil is shown in FIG. Figure 3 Thus, the anti-adhesive material, the winding and the frame can surround and form a cubic solidification space, and ensure that the anti-adhesive material completely covers the winding of the superconducting coil.

[0046] In another implementation of the present application, if the anti-adhesive material can completely cover the winding of the superconducting coil, but the height is equal to the height of the winding, then when the anti-adhesive material is pasted to the outer turn, it is impossible to form a solidification space around it. Therefore, the anti-adhesive material can be pasted to the outer turn of the superconducting coil in batches. That is, the above-mentioned pasting of the anti-adhesive material to the outer turn of the superconducting coil to obtain the solidification space can include the following steps:

[0047] The anti-sticking material is flush with the winding of the superconducting coil and pasted to the outer turn of the superconducting coil to obtain the outer turn pasted with the anti-sticking material;

[0048] The anti-sticking material is flush with the framework of the superconducting coil and pasted to the outer turn pasted with the anti-sticking material to obtain a solidification space.

[0049] See also Figure 4 , Figure 4 The end structure diagram of another superconducting coil with anti-adhesive material attached provided by an embodiment of the present application is shown. The superconducting coil includes a frame, two windings and a dividing plate. Since the anti-adhesive material can completely cover the winding of the superconducting coil, but the height is equal to the height of the winding, the anti-adhesive material can be flush with the winding of the superconducting coil and attached to the outer turn of the superconducting coil when attached for the first time. The position of the anti-adhesive material attached to the outer turn is shown in FIG. Figure 4 Next, in order to form a solidification space during the second pasting, the anti-adhesive material can be flush with the skeleton of the superconducting coil and pasted to the outer turn where the anti-adhesive material is pasted. Figure 4 Thus, the anti-adhesive material 1, the anti-adhesive material 2, the winding and the frame can be surrounded to form a solidification space, and ensure that the anti-adhesive material completely covers the winding of the superconducting coil.

[0050] See also Figure 5 , Figure 5 A schematic diagram of the sticking position of an anti-sticking material for the outer turn of a superconducting coil winding provided by an embodiment of the present application is shown. The outer side of the superconducting coil skeleton is the winding, and the outermost turn of the winding is wrapped with a circle of anti-sticking material.

[0051] By applying the solution of the embodiment of the present application, the anti-sticking material is flush with the winding of the superconducting coil and pasted to the outer turn of the superconducting coil to obtain the outer turn with the anti-sticking material pasted, so that the outer turn of the superconducting coil can be completely covered by the anti-sticking material, ensuring that the superconducting coil can be used normally later. Then, the anti-sticking material is flush with the skeleton of the superconducting coil and pasted to the outer turn with the anti-sticking material pasted to ensure that a curing space can be formed to prepare for the subsequent curing process.

[0052] Step 104: Fill the curing space with curing material, and cover the curing material with an anti-sticking plate parallel to the winding from the outside of the filled curing space.

[0053] It should be noted that the solidified material is used for cooling the superconducting coil, and a solidified layer can be formed in the solidification space. The solidified layer can ensure that the end face of the superconducting coil is not scratched, and can also increase the cooling surface of the superconducting coil to achieve the effect of rapid cooling, so that the strip will not move relatively due to temperature changes. The solidified material, such as epoxy resin, is selected according to the actual situation, and the embodiments of the present application do not make any restrictions on this. The anti-sticking plate refers to a flat, hard plate that does not adhere to the solidified material. The anti-sticking plate includes but is not limited to a G10 plate coated with an anti-sticking material, a pure anodized aluminum plate, a copper plate, an aluminum plate, and a stainless steel plate. It is selected according to the actual situation, and the present application does not make any restrictions on this.

[0054] By placing the anti-sticking plate parallel to the winding and covering the curing material, the surface of the cured curing material can be made flat, smooth and free of bubbles. In practical applications, when filling the curing space with curing material, the curing material can be evenly filled into the curing space, and a brush can be used to check for leaks and fill in the gaps until the curing material in the curing space can completely cover the winding. The amount of curing material filled into the curing space only needs to be enough to completely cover the winding, and there is no need to completely fill the curing space. Of course, in order to ensure that the curing material can completely cover the winding, when filling the curing space with curing material, the liquid level of the filled curing material can be higher than the skeleton.

[0055] In one embodiment of the present application, the curing material includes epoxy resin; and filling the curing space with the curing material may include the following steps:

[0056] Fill the curing space with epoxy resin until the liquid level of the epoxy resin in the curing space is higher than the skeleton, and then stop filling to obtain a filled curing space.

[0057] It should be noted that epoxy resin is a thermosetting plastic that can form a very strong and chemically resistant material after curing. Epoxy resins include but are not limited to CTC520, CRT1132, IR-3, and 2850 curing glue prepared by 2850FT and CAT9 curing agents. The specific selection is based on actual conditions, and the present application embodiment does not make any limitation on this.

[0058] In practical applications, before filling the epoxy resin into the curing space, the epoxy resin can be obtained or configured first. For example, 2850FT:CAT9 curing agent is prepared at a weight ratio of 100:7.5 to obtain 2850 curing glue. The weight of 2850 curing glue is proportional to the volume of the coil. For example, the 2850 curing glue used in the Helmholtz coil is 20g. When filling the epoxy resin into the curing space, the prepared 2850 curing glue can be evenly applied to the curing space, and a brush can be used to check for leaks and fill in the gaps until the 2850 curing glue completely covers the winding. In one embodiment, when filling the curing space with 2850 curing glue, the liquid level of the 2850 curing glue can be made higher than the skeleton, thereby ensuring that the 2850 curing glue can completely cover the winding.

[0059] By applying the solution of the embodiment of the present application, epoxy resin is filled into the curing space until the liquid level of the epoxy resin in the curing space is higher than the skeleton, and the filling is stopped to obtain the filled curing space, thereby ensuring that the epoxy resin can completely cover the winding in the curing space, further ensuring that the end face of the superconducting coil is not scratched, thereby increasing the cooling effect of the superconducting coil.

[0060] In one embodiment of the present application, before the anti-sticking plate is covered on the solidified material parallel to the winding from the outside of the filled solidified space, the following steps may also be included:

[0061] Adhere a non-stick material to at least one surface of the flat plate to obtain a non-stick flat plate;

[0062] From the outside of the filled curing space, place the anti-sticking plate parallel to the winding onto the curing material, including:

[0063] The plate surface of the anti-sticking plate with the anti-sticking material is placed toward the filled solidified space, and the anti-sticking plate is covered on the solidified material parallel to the winding from the outside of the filled solidified space.

[0064] It should be noted that at least one surface of the anti-sticking plate is pasted with anti-sticking material. In order to reduce the consumption of anti-sticking material, the anti-sticking material can be pasted only on any surface of the anti-sticking plate. If the curing material in the curing space does not fill the curing space, an anti-sticking plate of the same size as the winding can be used to cover the curing material from the outside of the filled curing space in parallel with the winding. If the liquid level of the curing material in the curing space is higher than the skeleton, an anti-sticking plate of a size greater than or equal to the winding can be used to cover the curing material from the outside of the filled curing space in parallel with the winding.

[0065] See also Figure 6 , Figure 6 The end structure diagram of a superconducting coil covered with an anti-adhesive plate provided by an embodiment of the present application is shown. The superconducting coil includes a frame, two windings and a dividing plate. The frame, the windings and the anti-adhesive material surround a solidification space. The plate surface of the anti-adhesive plate with the anti-adhesive material is facing the filled solidification space, and the anti-adhesive plate is covered on the solidification material parallel to the winding from the outside of the filled solidification space, and the anti-adhesive plate is parallel to the winding.

[0066] By applying the solution of the embodiment of the present application, the board surface with the anti-sticking material pasted on it in the anti-sticking flat plate is oriented toward the filled solidifying space, and the anti-sticking flat plate is covered on the solidifying material in parallel with the winding from the outside of the filled solidifying space, so as to ensure that the surface of the solidifying material is smooth, and because the board surface in contact with the solidifying material is pasted with the anti-sticking tape, the anti-sticking flat plate can be removed later without damaging the solidifying material.

[0067] Step 106: After the curing material is cured, the anti-sticking plate and the anti-sticking material are removed to obtain a cured superconducting coil.

[0068] It should be noted that, from the outside of the filled solidification space, the anti-sticking plate is covered on the solidification material in parallel with the winding, and then the solidification material can be solidified. After the solidification material is solidified, the anti-sticking plate and the anti-sticking material are removed to obtain a solidified superconducting coil. There are many ways to solidify the solidification material, such as natural air drying and high temperature treatment, which are selected according to actual conditions, and the embodiments of the present application do not make any restrictions on this.

[0069] By applying the scheme of the embodiment of the present application, the strip of the superconducting coil and the solidified material can be made into a whole after the solidified material is solidified. The strip is covered with a layer of solidified material with a smooth surface and no pores. The solidified material can not only effectively protect the end face of the superconducting coil from being scratched, but also protect the superconducting coil well during multiple hot and cold cycles, enhance the overall cooling performance of the coil, and prevent the strips from moving relative to each other due to temperature changes, thereby avoiding damage to the strips, thereby not affecting the use of the strips after multiple hot and cold cycles.

[0070] In practical applications, after the curing material is cured, there are many ways to remove the anti-sticking plate and the anti-sticking material, which can be selected according to the actual situation, and the embodiments of the present application do not impose any limitation on this.

[0071] In one implementation of the present application, after the curing material is cured, the anti-sticking plate can be directly removed from the superconducting coil, and the anti-sticking material on the winding is removed at the same time to obtain a cured superconducting coil.

[0072] In another embodiment of the present application, after the curing material is cured, removing the anti-sticking plate and the anti-sticking material to obtain a cured superconducting coil may include the following steps:

[0073] After the solidified material is solidified, the anti-sticking plate is removed from the superconducting coil;

[0074] Cleaning cured material from anti-stick material;

[0075] The anti-sticking material on the winding is removed to obtain a solidified superconducting coil.

[0076] It should be noted that after the solidifying material is solidified, there is a certain bonding force between the excess solidifying material on the anti-sticking material and the effective solidifying material in the solidifying space. If the anti-sticking material on the winding is directly removed, the effective solidifying material in the solidifying space may be damaged. Therefore, after the solidifying material is solidified, the anti-sticking plate can be removed from the superconducting coil first; then the solidifying material on the anti-sticking material can be cleaned; finally, the anti-sticking material on the winding can be removed to obtain a solidified superconducting coil.

[0077] By applying the solution of the embodiment of the present application, the solidified material on the anti-sticking material is first cleaned, and then the anti-sticking material is removed from the winding, thereby ensuring the integrity of the solidified material in the solidification space.

[0078] In the embodiment of the present application, the anti-sticking material is Teflon tape, the curing material is 2850 curing glue, and the superconducting coil is a Helmholtz coil as an example. The upper and lower sections of the dividing plate are the upper single cake and the lower single cake of the superconducting coil respectively, and the upper side of the upper single cake and the lower side of the lower single cake are the two end faces of the coil. In the curing operation, the upper and lower end faces can be cured separately. For any end face, first, Teflon tape is pasted on the outermost turn of the superconducting coil after winding and the G10 board surface. Then, 2850 curing glue is applied to one end of the superconducting coil and pressed with two G10 boards. Since 2850 curing glue is liquid, it is necessary to perform a curing operation on 2850 curing glue. The curing temperature range of 2850 curing glue is room temperature-200°C, and the curing time shortens with increasing temperature. In an optional embodiment, the entire tooling can be placed in an oven and heated at 80°C for two hours. Finally, after the 2850 curing glue is cured, the tooling is removed, and the curing operation is repeated on the other end face of the superconducting coil. After the two end faces are cured, the tooling is removed to remove the excess 2850 curing glue residue. Next, the above steps are described in detail. Prepare a wound Helmholtz coil. The outermost turns of the two single cakes of the coil are first wrapped with 4mm wide Teflon tape twice flush with the winding, and then wrapped with the frame twice after two turns. Prepare two G10 plates that are larger than the coil and 10mm thick and not easy to deform, and stick Teflon tape on one of the G10 plates. Prepare 2850 curing glue with 2850FT:CAT9 curing agent at a weight ratio of 100:7.5. Apply the prepared 2850 curing glue evenly on one of the end faces of the coil, and use a brush to check for leaks and fill in the gaps until the winding is completely covered and the liquid level of the 2850 curing glue is higher than the frame. After the application is completed, place the coil between two G10 plates and lightly clamp it with bolts. Place the entire coil and tooling in an oven, heat the oven to 80°C and keep it warm for two hours. After the 2850 curing glue is completely cured, take it out, disassemble the tooling, and repeat the above operation. Apply 2850 curing glue to the other end face of the coil and put it in the oven to wait for curing to be completed. After the coil is completely cured, demould the coil from the G10 board, knock off the excess 2850 curing glue on the Teflon tape, and tear off the Teflon tape to complete the curing of the coil. In one embodiment, after curing is completed, the 2850 curing glue is slightly higher than the surface of the skeleton. Since the outermost layer of the winding is wrapped with Teflon tape in advance, it will not be sealed by the 2850 curing glue, and it also ensures the normal use of the coil in subsequent testing.

[0079] See also Figure 7 , Figure 7 The end face structure diagram of a superconducting coil after solidification provided by an embodiment of the present application is shown, and the superconducting coil after solidification includes a frame, two windings and a dividing plate. One side of each winding is covered with solidified material.

[0080] In one embodiment of the present application, after the curing material is cured, before removing the anti-sticking plate and the anti-sticking material to obtain the cured superconducting coil, the following steps may also be included:

[0081] The curing material is subjected to high temperature treatment until the curing material is completely cured.

[0082] For example, the entire superconducting coil and the anti-sticking plate can be placed in an oven, heated to 80°C and kept warm for two hours, and taken out after the curing material is completely cured, and the anti-sticking plate and the anti-sticking material are removed to obtain a cured superconducting coil. The heating temperature and time are specifically set according to the curing material, and the embodiments of the present application do not impose any limitation on this.

[0083] By applying the solution of the embodiment of the present application, the curing time of the curing material is shortened by performing high-temperature treatment on the curing material, thereby improving the curing efficiency of the superconducting coil.

[0084] In one embodiment of the present application, after the curing material is cured, the anti-sticking plate and the anti-sticking material are removed to obtain a cured superconducting coil, the following steps may also be included:

[0085] A low temperature test is performed on the cured superconducting coil to obtain a curing test result of the cured superconducting coil.

[0086] It should be noted that the purpose of the low temperature test is to test whether the inter-turn resistance of the solidified superconducting coil can remain stable. The low temperature test method includes but is not limited to liquid nitrogen immersion, refrigerator cooling, and cold helium cooling, which is selected according to the actual situation and is not limited in the present application embodiment.

[0087] In practical applications, the number of low-temperature tests on the solidified superconducting coil can be one or more times. When multiple low-temperature tests are performed, a hot and cold cycle test can be performed to test whether multiple hot and cold cycles will cause damage to the strip, thereby affecting the normal use of the coil.

[0088] By applying the solution of the embodiment of the present application and performing a low-temperature test on the superconducting coil after curing, the curing effect of the superconducting coil can be accurately determined, and further whether the curing is successful can be determined.

[0089] In one embodiment of the present application, the above-mentioned low-temperature test on the cured superconducting coil to obtain the curing test result of the cured superconducting coil may include the following steps:

[0090] The solidified superconducting coil is immersed in liquid nitrogen, and a cold and hot cycle test is performed for multiple times to obtain a solidification test result of the solidified superconducting coil.

[0091] It should be noted that, taking the curing material as 2850 curing glue as an example, the cured superconducting coil is immersed in liquid nitrogen and subjected to multiple hot and cold cycle tests. After curing, its thermal conductivity can reach 1.25W / m*K, while before curing, the thermal conductivity of dry air is only 0.026W / m*K. After curing, the thermal conductivity increases by 48 times, which can better increase the cooling effect of the superconducting coil. In addition, after multiple liquid nitrogen immersions and hot and cold cycles, the superconducting coil can still maintain the overall structural strength. At the same time, the inter-turn resistance of the superconducting coil can remain stable, and the strip will not be deformed and displaced due to the temperature difference changes of multiple hot and cold cycles, thereby affecting the normal use of the superconducting coil.

[0092] By applying the solution of the embodiment of the present application, by immersing the solidified superconducting coil in liquid nitrogen and performing hot and cold cycle tests multiple times, it is possible to accurately determine whether the inter-turn resistance of the solidified superconducting coil can remain stable, and further determine whether the superconducting coil can be used normally.

[0093] See also Figure 8 , Figure 8 A turn-to-turn resistance test data graph of a superconducting coil after solidification provided by an embodiment of the present application is shown, where the horizontal axis is the number of tests (1 to 5 times), and the vertical axis is the turn-to-turn resistance (8μΩ to 20μΩ). The turn-to-turn resistance of the solidified superconducting coil is tested by multiple hot and cold cycles. It can be seen that after 5 liquid nitrogen immersion hot and cold cycles, the turn-to-turn resistance value of the superconducting coil changes by only about 2μΩ, and the rate of change does not exceed 14%. Therefore, the superconducting coil solidification method proposed in the embodiment of the present application can effectively control the change of the turn-to-turn resistance value and ensure the service life of the superconducting coil.

[0094] Corresponding to the above method embodiment, the present application also provides a superconducting coil curing system embodiment, Fig. 9 The structure diagram of a superconducting coil curing system provided by an embodiment of the present application is shown. The system includes a pasting component 902, a filling component 904 and a removal component 906;

[0095] Pasting component 902, used to paste the anti-sticking material to the outer turn of the superconducting coil to obtain a solidification space, wherein the solidification space is formed by the skeleton of the superconducting coil, the winding of the superconducting coil and the anti-sticking material, and the height of the anti-sticking material after pasting is greater than the height of the winding;

[0096] A filling assembly 904 is used to fill the curing space with curing material, and to cover the anti-sticking plate on the curing material parallel to the winding from the outside of the filled curing space;

[0097] The removal component 906 is used to remove the anti-sticking plate and the anti-sticking material after the solidified material is solidified, so as to obtain a solidified superconducting coil.

[0098] In one embodiment, the pasting component 902 is also used to align the anti-sticking material with the winding of the superconducting coil, and paste it to the outer turn of the superconducting coil to obtain the outer turn with the anti-sticking material pasted; align the anti-sticking material with the skeleton of the superconducting coil, and paste it to the outer turn with the anti-sticking material pasted to obtain a solidification space.

[0099] In one embodiment, the anti-sticking material is used to prevent the outer turns of the superconducting coil from sticking to the solidified material, and the anti-sticking material includes Teflon tape.

[0100] In one embodiment, the curing material includes epoxy resin; the filling component 904 is also used to fill the epoxy resin into the curing space until the liquid level of the epoxy resin in the curing space is higher than the skeleton, and then stop filling to obtain a filled curing space.

[0101] In one embodiment, the removal component 906 is also used to remove the anti-sticking plate from the superconducting coil after the solidified material is solidified; clean the solidified material on the anti-sticking material; and remove the anti-sticking material on the winding to obtain a solidified superconducting coil.

[0102] In one embodiment, the pasting component 902 is also used to paste the anti-sticking material onto at least one surface of the flat plate to obtain the anti-sticking flat plate; the filling component 904 is also used to face the surface of the anti-sticking flat plate with the anti-sticking material pasted onto the filled solidifying space, and to cover the anti-sticking flat plate parallel to the winding onto the solidifying material from the outside of the filled solidifying space.

[0103] In one embodiment, the system further includes: a processing component for performing high temperature processing on the curing material until the curing material is completely cured.

[0104] In one embodiment, the system further includes: a testing component for performing a low-temperature test on the cured superconducting coil to obtain a curing test result of the cured superconducting coil.

[0105] In one embodiment, the test assembly is further used to immerse the solidified superconducting coil in liquid nitrogen, perform cold and hot cycle tests multiple times, and obtain the solidification test results of the solidified superconducting coil.

[0106] By applying the solution of the embodiment of the present application, the anti-sticking material is adhered to the outer turns of the superconducting coil, so that the outer turns will not be sealed by the solidifying material, thereby ensuring that the superconducting coil can be used normally later. In addition, the strip cured by the solidifying material can become a whole, which can not only ensure that the end face of the superconducting coil is not scratched, but also increase the cooling effect of the superconducting coil, so that the strip will not move relatively due to temperature changes, thereby improving the stability of the superconducting coil.

[0107] The above is a schematic scheme of a superconducting coil solidification system of this embodiment. It should be noted that the technical scheme of the superconducting coil solidification system and the technical scheme of the superconducting coil solidification method described above are of the same concept, and the details not described in detail in the technical scheme of the superconducting coil solidification system can be referred to the description of the technical scheme of the superconducting coil solidification method described above.

[0108] It should be noted that, for the aforementioned method embodiments, for the sake of simplicity of description, they are all expressed as a series of action combinations, but those skilled in the art should be aware that the embodiments of the present application are not limited by the described action sequence, because according to the embodiments of the present application, certain steps can be performed in other sequences or simultaneously. Secondly, those skilled in the art should also be aware that the embodiments described in this application are all preferred embodiments, and the actions and modules involved are not necessarily required by the embodiments of the present application.

[0109] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0110] The preferred embodiments of the present application disclosed above are only used to help explain the present application. The optional embodiments do not describe all the details in detail, nor do they limit the invention to the specific implementation methods described. Obviously, many modifications and changes can be made according to the content of the embodiments of the present application. The present application selects and specifically describes these embodiments in order to better explain the principles and practical applications of the embodiments of the present application, so that those skilled in the art can understand and use the present application well. The present application is only limited by the claims and their full scope and equivalents.

Claims

1. A superconducting coil solidification method, characterized in that: include: Pasting the anti-sticking material to the outer turn of the superconducting coil to obtain a solidification space, wherein the solidification space is formed by the skeleton of the superconducting coil, the winding of the superconducting coil and the anti-sticking material, and the height of the anti-sticking material after pasting is greater than the height of the winding; Filling the curing space with curing material, and covering the curing material with an anti-sticking plate parallel to the winding from the outside of the filled curing space, wherein the curing material in the filled curing space completely covers the winding; After the solidifying material is solidified, the anti-sticking plate and the anti-sticking material are removed to obtain a solidified superconducting coil.

2. The method according to claim 1, characterized in that The step of sticking the anti-sticking material to the outer turns of the superconducting coil to obtain a solidification space comprises: The anti-sticking material is flush with the winding of the superconducting coil and pasted to the outer turn of the superconducting coil to obtain the outer turn pasted with the anti-sticking material; The anti-sticking material is flush with the skeleton of the superconducting coil and is pasted to the outer turn pasted with the anti-sticking material to obtain a solidification space.

3. The method according to claim 1, characterized in that The anti-sticking material is used to prevent the outer turns of the superconducting coil from adhering to the solidified material, and the anti-sticking material includes Teflon tape.

4. The method according to claim 1, characterized in that: The curing material includes epoxy resin; The step of filling the curing space with the curing material comprises: The epoxy resin is filled into the curing space until the liquid level of the epoxy resin in the curing space is higher than the skeleton, and the filling is stopped to obtain a filled curing space.

5. The method according to claim 1, characterized in that: After the solidifying material is solidified, the anti-sticking plate and the anti-sticking material are removed to obtain a solidified superconducting coil, comprising: After the solidified material is solidified, removing the anti-sticking plate from the superconducting coil; cleaning the solidified material on the anti-sticking material; The anti-sticking material on the winding is removed to obtain a cured superconducting coil.

6. The method according to any one of claims 1 to 5, characterized in that: Before the anti-sticking plate is covered on the curing material parallel to the winding from the outside of the filled curing space, the method further comprises: Adhere a non-stick material to at least one surface of the flat plate to obtain a non-stick flat plate; The step of covering the anti-sticking plate on the solidified material parallel to the winding from the outside of the filled solidified space comprises: The plate surface of the anti-sticking flat plate with the anti-sticking material is directed toward the filled solidified space, and the anti-sticking flat plate is covered on the solidified material parallel to the winding from the outside of the filled solidified space.

7. The method according to any one of claims 1 to 5, characterized in that: After the solidified material is solidified, before the anti-sticking plate and the anti-sticking material are removed to obtain the solidified superconducting coil, the method further comprises: The solidified material is subjected to high temperature treatment until the solidified material is completely solidified.

8. The method according to any one of claims 1 to 5, characterized in that: After the solidified material is solidified, the anti-sticking plate and the anti-sticking material are removed to obtain a solidified superconducting coil, and the method further comprises: A low temperature test is performed on the cured superconducting coil to obtain a curing test result of the cured superconducting coil.

9. The method according to claim 8, characterized in that The step of performing a low temperature test on the cured superconducting coil to obtain a curing test result of the cured superconducting coil comprises: The solidified superconducting coil is immersed in liquid nitrogen, and a cold and hot cycle test is performed for multiple times to obtain a solidification test result of the solidified superconducting coil.

10. A superconducting coil curing system, characterized in that: Including sticking components, filling components and removing components; The pasting assembly is used to paste the anti-sticking material to the outer turn of the superconducting coil to obtain a solidification space, wherein the solidification space is formed by the skeleton of the superconducting coil, the winding of the superconducting coil and the anti-sticking material, and the height of the anti-sticking material after pasting is greater than the height of the winding; The filling assembly is used to fill the curing space with curing material, and to cover the anti-sticking plate on the curing material from the outside of the filled curing space in parallel with the winding, wherein the curing material in the filled curing space completely covers the winding; The removal assembly is used to remove the anti-sticking plate and the anti-sticking material after the solidifying material is solidified, so as to obtain a solidified superconducting coil.

Images