An intelligent tank cleaning device for semiconductor wafer processing

Abstract

The present invention relates to the field of wafer cleaning, and specifically discloses an intelligent tank cleaning device for semiconductor wafer processing, including a bottom shell, an electric slider is slidably installed on the top of the bottom shell, a plurality of clamping components are fixedly connected to the bottom of the electric slider, a flower basket is clamped on the clamping component, a conveyor belt is arranged at one end of the top of the bottom shell, a plurality of cleaning tanks are opened on the top of the bottom shell, and the cleaning tank is located at the end of the bottom shell away from the conveyor belt. By spraying water, on the one hand, it can effectively prevent suspended impurities from entering the device, and can effectively wash away impurities suspended in the air, and on the other hand, it can also effectively spray the wafer to promote the cleaning effect of the cleaning tank on the wafer. In the process of moving the flower basket from one cleaning tank to another, the surface of the wafer can also be effectively cleaned.

Description

Technical Field

[0001] The invention relates to a cleaning device, in particular to an intelligent tank cleaning device for semiconductor wafer processing, belonging to the field of wafer cleaning. Background Art

[0002] Semiconductor wafers are materials used in the production of semiconductor chips. Etching and wiring are performed on semiconductor wafers to make semiconductor chips. Before wafer processing, the wafer needs to be cleaned promptly and effectively. In the prior art, semiconductor wafers are often cleaned using a tank cleaning device.

[0003] However, the existing trough cleaning device for semiconductor wafer processing still has certain defects when in use. Since the semiconductor wafers need to be placed on a flower basket for cleaning, there are prone to cleaning dead corners, resulting in reduced cleaning efficiency of the semiconductor wafers. Secondly, after the semiconductor wafers are cleaned, since the semiconductor wafers are often stacked on the flower basket, the semiconductor wafers dry very slowly, reducing the processing efficiency of the semiconductor wafers. For this reason, we propose an intelligent trough cleaning device for semiconductor wafer processing. Summary of the invention

[0004] In view of the problems in the prior art, the present invention provides an intelligent tank cleaning device for semiconductor wafer processing.

[0005] The purpose of the present invention can be achieved through the following technical solutions:

[0006] An intelligent tank cleaning device for semiconductor wafer processing comprises a bottom shell, an electric slider is slidably installed on the top of the bottom shell, a plurality of clamping assemblies are fixedly connected to the bottom of the electric slider, a flower basket is clamped on the clamping assemblies, a conveyor belt is arranged at one end of the top of the bottom shell, a plurality of cleaning troughs are opened on the top of the bottom shell, the cleaning troughs are located at the end of the bottom shell away from the conveyor belt, a pressurized fan is arranged on the top of the bottom shell, the output end of the pressurized fan is connected to a spray water tank, the output end of the pressurized fan is connected to an air duct through the spray water tank, and the end of the air duct away from the spray water tank is located directly above the conveyor belt.

[0007] Preferably, side panels are fixedly connected to both sides of the bottom shell, a top plate is arranged directly above the bottom shell, the tops of the two side panels are fixedly connected to the two side wall panels at the bottom of the top plate respectively, a slide groove is opened at the bottom center of the top plate, the electric slide rail is slidably connected in the slide groove, and the booster fan is fixedly connected at the top center of the top plate.

[0008] Preferably, both sides of the pressurized fan are connected with an L-shaped tube, and the end of the L-shaped tube away from the pressurized fan is connected with a spray water tank. The two spray water tanks are respectively fixedly connected to the top of the opposite sides of the two side plates. A rectangular tube for adding spray water is provided at the center of the spray water tank, and a plug is provided on the top of the rectangular tube. A pressure plate is slidably connected to the inside of the spray water tank, and the pressure plate is slidably sleeved with the rectangular tube.

[0009] Preferably, one side of the top of the spray water tank is connected to an air duct, and the end of the air duct away from the spray water tank guides the conveyor belt, a vertical pipe is opened on the side of the bottom of the spray water tank close to the side panel, a limit rod is provided on the inner wall of the spray water tank, the vertical pipe is located below the limit rod, the end of the vertical pipe away from the spray water tank is connected to a horizontal pipe, the horizontal pipe is opened inside the side panel, the horizontal pipe is connected to a plurality of nozzles, the nozzles are arranged on the side opposite to the two side panels and the nozzles guide the cleaning tank.

[0010] Preferably, a groove is formed at one end of the bottom shell, and the conveyor belt is arranged on the top of the groove. A water-absorbing sponge is fixedly connected to the side wall panel of the groove, and the top of the water-absorbing sponge abuts against the lower belt surface of the conveyor belt. A wastewater guide plate is also fixedly connected to the side wall panel of the groove, and the wastewater guide plate is located directly below the water-absorbing sponge. A scraper is fixedly connected to the end of the groove away from the cleaning tank, and the scraper abuts against the belt surface of the conveyor belt and is located below the conveyor belt.

[0011] Preferably, the clamping assembly includes an electric telescopic rod fixedly connected to the bottom of the electric slider, the end of the electric telescopic rod away from the electric slider is fixedly connected to a U-shaped rod, the electric telescopic rod is fixedly connected to the middle section of the U-shaped rod, both ends of the U-shaped rod are equipped with a rotating cylinder, a T-shaped gripper is fixedly connected to the rotating shaft of the rotating cylinder, and an arc-shaped depression is provided at the end of the gripper away from the rotating cylinder.

[0012] Preferably, the tops of the two side wall panels of the flower basket are fixedly connected with U-shaped brackets, the middle section of the U-shaped brackets are movably engaged with the gripper, a plurality of placement grooves are provided at the bottom of the flower basket, a rectangular through hole for drainage is provided at the bottom of the placement grooves, legs are provided at the bottom of the flower basket, and pads are provided at the bottom of the cleaning grooves, which are movably engaged with the legs.

[0013] Preferably, multiple wafer slots for clamping wafers are provided on both sides of the placement groove, and the wafer slots on two adjacent placement grooves are staggered. Active rollers and driven rollers are rotatably connected to the top sides of the placement groove. The active roller is fixedly connected to a waterproof motor. The waterproof motor is fixedly connected to one side of the flower basket. A waterproof contact switch is provided at the bottom of the leg, and the waterproof contact switch is electrically connected to the waterproof motor.

[0014] Preferably, the wafer slots on both sides of the top of the placement groove are provided with guide grooves on the opposite sides thereof, and a plurality of rollers are rotatably installed in the guide grooves.

[0015] Preferably, a placing table is fixedly connected to the bottom of one end of the bottom shell away from the conveyor belt, and the flower basket is placed on the placing table.

[0016] Beneficial effects of the present invention:

[0017] 1. The cleaning effect of the cleaning tank on the wafer is promoted by spraying water; in the process of moving the flower basket from one cleaning tank to another, the surface of the wafer can also be effectively cleaned. The ultrasonic device at the bottom of the cleaning tank can be used to clean the wafer efficiently multiple times, ensuring the cleaning efficiency and quality of the wafer.

[0018] 2. Through the setting of waterproof motor, the wafer can be effectively rotated on the flower basket. When air-drying, the contact area between the wafer and the air duct is increased, and the drying efficiency of the wafer is accelerated. When cleaning, the active roller drives the wafer to rotate on the flower basket, which promotes the cleaning efficiency of the cleaning tank for the wafer and prevents the occurrence of cleaning blind spots on the wafer.

[0019] 3. The rectangular through holes can effectively reduce the possibility of the flower basket carrying a large amount of cleaning liquid when it is taken out of the cleaning tank, so that the cleaning liquid can return to the cleaning tank through the rectangular through holes. On the other hand, when the flower basket is placed on the conveyor belt, the gas can directly act on the wafer through the air duct, ensuring the circulation of air around the wafer and promoting the drying of the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to facilitate understanding by those skilled in the art, the present invention is further described below with reference to the accompanying drawings.

[0021] Figure 1 It is a schematic diagram of the overall structure of the present invention.

[0022] Figure 2 It is a schematic diagram of the overall structure of the present invention from another perspective.

[0023] Figure 3 It is a schematic cross-sectional view of the structure of the spray water tank of the present invention.

[0024] Figure 4 It is a schematic cross-sectional view of the transverse structure of the base of the present invention.

[0025] Figure 5 It is a schematic cross-sectional view of the longitudinal structure of the base of the present invention.

[0026] Figure 6 It is a schematic structural diagram of the clamping assembly of the present invention.

[0027] Figure 7 It is a schematic top view of the structure of the clamping assembly of the present invention.

[0028] Figure 8It is a structural schematic diagram of the flower basket of the present invention.

[0029] Fig. 9 It is a structural schematic diagram of the wafer slot of the present invention.

[0030] In the figure: 1. side panel; 2. spray water tank; 3. top panel; 4. air duct; 5. pressurized fan; 6. L-shaped pipe; 7. embolism; 8. electric slider; 9. nozzle; 10. electric telescopic rod; 11. U-shaped rod; 12. placement table; 13. cleaning tank; 14. bottom shell; 15. flower basket; 16. U-shaped bracket; 17. support leg; 18. conveyor belt; 19. groove; 20. pressure plate; 21. rectangular tube; 22. limit rod; 23. vertical pipe; 24. wastewater guide plate; 25. scraper; 26. water-absorbing sponge; 27. pad; 28. gripper; 29. ​​wafer slot; 30. waterproof motor; 31. rotating cylinder; 32. rectangular through hole; 33. active roller; 34. driven roller; 35. placement slot; 36. roller. DETAILED DESCRIPTION

[0031] The technical solution of the present invention will be clearly and completely described below in conjunction with the embodiments. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0032] See also Figure 1-9 As shown, an intelligent tank cleaning device for semiconductor wafer processing includes a bottom shell 14, an electric slider 8 is slidably installed on the top of the bottom shell 14, a plurality of clamping components are fixedly connected to the bottom of the electric slider 8, a flower basket 15 is clamped on the clamping component, a conveyor belt 18 is arranged at one end of the top of the bottom shell 14, a plurality of cleaning tanks 13 are opened on the top of the bottom shell 14, the cleaning tanks 13 are located at one end of the bottom shell 14 away from the conveyor belt 18, a pressurized fan 5 is arranged on the top of the bottom shell 14, the output end of the pressurized fan 5 is connected to the spray water tank 2, the output end of the pressurized fan 5 is connected to the air duct 4 through the spray water tank 2, and the end of the air duct 4 away from the spray water tank 2 is located directly above the conveyor belt 18. The electric slider 8 moves in a reciprocating manner. After the electric slider 8 places the flower basket 15 in the cleaning tank 13, the rotating cylinder 31 rotates to separate the clamping connection between the U-shaped bracket 16 and the gripper 28, and then the electric telescopic rod 10 contracts. After the electric telescopic rod 10 contracts, the electric slider 8 moves to the initial position. This technology is a prior art and will not be disclosed in detail here. The cleaning tank 13 uses ultrasonic cleaning to effectively clean the wafer. An ultrasonic device is provided in the cleaning tank 13. This technology is a prior art and will not be disclosed in detail here. A drain port for discharging waste liquid is provided at the bottom of the cleaning tank 13.

[0033] As a technical optimization solution of the present invention, the two sides of the bottom shell 14 are fixedly connected with the side panels 1, and the top plate 3 is arranged directly above the bottom shell 14. The tops of the two side panels 1 are respectively fixedly connected with the two side wall panels of the bottom of the top plate 3. A slide groove is provided at the bottom center of the top plate 3, and the electric slide rail is slidably connected in the slide groove. The pressurizing fan 5 is fixedly connected at the top center of the top plate 3. The output end of the pressurizing fan 5 is provided with two air outlets, and the two air outlets are respectively connected with the L-shaped pipe 6, so that the pressurizing fan 5 can effectively pressurize the two spray water tanks 2.

[0034] As a technical optimization solution of the present invention, both sides of the pressurized fan 5 are connected with L-shaped tubes 6, and one end of the L-shaped tube 6 away from the pressurized fan 5 is connected with the spray water tank 2. The two spray water tanks 2 are fixedly connected to the top of the opposite side of the two side plates 1, and a rectangular tube 21 for adding spray water is provided at the center of the spray water tank 2. The top of the rectangular tube 21 is provided with an embolism 7. The inside of the spray water tank 2 is slidably connected with a pressing plate 20, and the pressing plate 20 is slidably sleeved with the rectangular tube 21. On the one hand, the rectangular tube 21 can replenish the spray water in the spray water tank 2, and on the other hand, in the process of the pressurized fan 5 pressurizing the spray water tank 2, the pressing plate 20 is effectively guided to prevent the pressing plate 20 from tilting and deviating during the descent process.

[0035] As a technical optimization solution of the present invention, one side of the top of the spray water tank 2 is connected with an air duct 4, and one end of the air duct 4 away from the spray water tank 2 guides the conveyor belt 18. A vertical pipe 23 is provided on the side of the bottom of the spray water tank 2 close to the side plate 1. A limit rod 22 is provided on the inner wall of the spray water tank 2. The vertical pipe 23 is located below the limit rod 22. One end of the vertical pipe 23 away from the spray water tank 2 is connected with a horizontal pipe, which is provided inside the side plate 1. The horizontal pipe is connected with a plurality of nozzles 9, which are provided on the opposite side of the two side plates 1 and guide the nozzles 9 to the cleaning tank 13. The setting of the limit rod 22 can effectively prevent the sliding connection between the pressing plate 20 and the rectangular tube 21 from being separated, and can also effectively prevent the pressing plate 20 from moving below the vertical pipe 23.

[0036] As a technical optimization solution of the present invention, a groove 19 is opened at one end of the bottom shell 14, and the conveyor belt 18 is arranged on the top of the groove 19. A water-absorbing sponge 26 is fixedly connected to the side wall panel of the groove 19, and the top of the water-absorbing sponge 26 abuts against the lower belt surface of the conveyor belt 18. A wastewater guide plate 24 is also fixedly connected to the side wall panel of the groove 19, and the wastewater guide plate 24 is located directly below the water-absorbing sponge 26. A scraper 25 is fixedly connected to the end of the groove 19 away from the cleaning tank 13, and the scraper 25 abuts against the belt surface of the conveyor belt 18 and is located below the conveyor belt 18. The coordinated use of the absorbent sponge 26 and the wastewater guide plate 24 not only promotes the drying efficiency of the conveyor belt 18, but also enables the wastewater guide plate 24 to effectively discharge the wastewater dripping from the conveyor belt 18 after the belt surface of the conveyor belt 18 is wiped by the absorbent sponge 26; it also effectively ensures the water absorption efficiency of the absorbent sponge 26, and the wastewater guide plate 24 can also effectively guide the wastewater dripping from the absorbent sponge 26.

[0037] As a technical optimization solution of the present invention, the clamping assembly includes an electric telescopic rod 10 fixedly connected to the bottom of the electric slider 8, the end of the electric telescopic rod 10 away from the electric slider 8 is fixedly connected to a U-shaped rod 11, the electric telescopic rod 10 is fixedly connected to the middle section of the U-shaped rod 11, both ends of the U-shaped rod 11 are installed with a rotating cylinder 31, the rotating shaft of the rotating cylinder 31 is fixedly connected with a T-shaped gripper 28, and the end of the gripper 28 away from the rotating cylinder 31 is provided with an arc-shaped depression. The opening of the U-shaped rod 11 is away from the electric telescopic rod 10, and a rotating groove for the rotation of the gripper 28 is provided at the center of the end of the U-shaped rod 11, and the rotating cylinder 31 is installed in the rotating groove, and the vertical end of the gripper 28 rotates in the rotating groove, and the vertical end of the gripper 28 is fixedly sleeved on the rotating shaft of the rotating cylinder 31.

[0038] As a technical optimization solution of the present invention, the tops of the two side wall panels of the flower basket 15 are fixedly connected with U-shaped brackets 16, and the middle section of the U-shaped bracket 16 is movably connected with the gripper 28. The bottom of the flower basket 15 is provided with a plurality of placement grooves 35, and the bottom of the placement grooves 35 is provided with rectangular through holes 32 for drainage. The bottom of the flower basket 15 is provided with legs 17, and the bottom of the cleaning tank 13 is provided with pads 27, which are movably abutted against the legs 17. The setting of the pads 27, on the one hand, can effectively block between the bottom of the cleaning tank 13 and the flower basket 15, and prevent the vibration layer from falling off due to the direct contact between the flower basket 15 and the bottom of the cleaning tank 13. On the other hand, the pads 27 can also effectively trigger the waterproof contact switch at the bottom of the legs 17, and effectively control the waterproof motor 30 to work.

[0039] As a technical optimization solution of the present invention, a plurality of wafer slots 29 for clamping wafers are arranged on both sides of the placement groove 35, and the wafer slots 29 on two adjacent placement grooves 35 are arranged in a staggered manner. Active rollers 33 and driven rollers 34 are rotatably connected to the top sides of the placement groove 35, and the active roller 33 is fixedly connected to a waterproof motor 30, which is fixedly connected to one side of the flower basket 15. A waterproof contact switch is arranged at the bottom of the leg 17, and the waterproof contact switch is electrically connected to the waterproof motor 30. The arrangement of the active roller 33 and the driven roller 34 can effectively support the bottom of the wafer on the one hand, and can also effectively promote the rotation of the wafer on the other hand, thereby improving the cleaning efficiency of the wafer.

[0040] As a technical optimization solution of the present invention, the wafer slots 29 on both sides of the top of the placement groove 35 are provided with guide grooves on the opposite sides, and multiple rollers 36 are rotatably installed in the guide grooves. The setting of the rollers 36 can effectively ensure the vertical angle of the wafer on the one hand, and can also effectively reduce the contact area between the wafer and the wafer slot 29 on the other hand.

[0041] As a technical optimization solution of the present invention, a placement table 12 is fixedly connected to the bottom of one end of the bottom shell 14 away from the conveyor belt 18, and the flower basket 15 is placed on the placement table 12. The placement table 12 is provided with a positioning groove for placing the flower basket 15, which can facilitate technicians to place wafers on the one hand, and can also effectively facilitate the positioning of the flower basket 15 on the other hand, so that the gripper 28 can accurately grab the flower basket 15.

[0042] When the present invention is in use, the wafer is placed in the wafer slot 29, and then the flower basket 15 after placement is placed on the placement table 12, and then the flower basket 15 is effectively clamped by the clamping assembly, and then the electric telescopic rod 10 is extended to make the rotating cylinder 31 drive the gripper 28 to effectively grab the U-shaped bracket 16, and after the gripper 28 grabs the U-shaped bracket 16, the electric telescopic rod 10 contracts, so that the flower basket 15 is effectively lifted, and after the flower basket 15 is lifted, it will be driven to the top of the cleaning tank 13 by the electric slider 8, and then the electric telescopic rod 10 is extended to place the flower basket 15 on the pad 27 in the cleaning tank 13, and then the rotating cylinder 31 rotates to separate the gripper 28 from the U-shaped bracket 16, and the electric telescopic rod 10 is then contracted, and after the electric telescopic rod 10 is contracted, the electric slider 8 will return to the initial position. By setting the clamping assembly and the electric slide block 8 , the flower basket 15 will pass through the multiple cleaning tanks 13 in sequence, and after the flower basket 15 leaves the cleaning tank 13 , the clamping assembly and the electric slide block 8 place the flower basket 15 on the conveyor belt 18 .

[0043] During the operation of the electric slider 8, the pressure fan 5 will pressurize the spray water tank 2 through the L-shaped tube 6, so that the pressure plate 20 moves downward, so that the pressure plate 20 squeezes the pre-placed spray water in the spray water tank 2, and then the spray water enters the horizontal tube through the vertical tube 23, and then sprays on the top of the cleaning tank 13 through the horizontal tube and the nozzle 9. In the process of the flower basket 15 moving from one cleaning tank 13 to another cleaning tank 13, the surface of the wafer can be effectively cleaned, and the cleaning effect of the cleaning tank 13 on the wafer is effectively promoted by the spraying of the spray water. The waste liquid after the spray water is sprayed can also be discharged through the sewage outlet at the bottom of the cleaning tank 13. When the flower basket 15 contacts the pad 27, after the waterproof contact switch at the bottom of the leg 17 contacts the pad 27, the pressure applied by the flower basket 15 to the pad 27 through the leg 17 will act in reverse on the leg 17, thereby squeezing the waterproof contact switch at the bottom of the leg 17. After the waterproof contact switch is squeezed, the waterproof motor 30 will work, thereby enabling the waterproof motor 30 to drive the active roller 33 to rotate effectively, thereby enabling the active roller 33 to drive the wafer to rotate on the flower basket 15, thereby promoting the cleaning efficiency of the cleaning tank 13 for the wafer and preventing the occurrence of cleaning blind spots on the wafer.

[0044] When the pressurized fan 5 pressurizes the spray water tank 2 through the pressure plate 20, the air duct 4 located above the pressure plate 20 will discharge the excess gas from the spray water tank 2, and the gas will be blown above the conveyor belt 18 through the air duct 4, so that the flower basket 15 transported to the conveyor belt 18 can be effectively dried. When the legs 17 at the bottom of the flower basket 15 are in contact with the conveyor belt 18, the waterproof motor 30 will also be turned on, so that the active roller 33 can be effectively rotated, and then the wafer can be effectively rotated on the flower basket 15, thereby increasing the contact area between the wafer and the air duct 4 and accelerating the drying efficiency of the wafer.

[0045] After the flower basket 15 is taken out from the cleaning tank 13, it will carry a small amount of cleaning liquid. The cleaning liquid will fall on the conveyor belt 18 as the flower basket 15 is placed on the conveyor belt 18. As the conveyor belt 18 rotates, the scraper 25 abuts against the conveyor belt 18 so that the scraper 25 scrapes off most of the cleaning liquid on the conveyor belt 18, effectively ensuring the drying of the conveyor belt 18. The absorbent sponge 26 located below the conveyor belt 18 will also effectively absorb the cleaning liquid remaining on the conveyor belt 18. In this process, after the absorbent sponge 26 absorbs a large amount of water on the conveyor belt 18, the waste water in the absorbent sponge 26 will drip onto the waste water guide plate 24, and then the waste water dripping from the absorbent sponge 26 will be guided to the outside of the bottom shell 14 through the waste water guide plate 24, preventing the waste water from accumulating under the conveyor belt 18, thereby resulting in the waste water being unable to be effectively and timely cleaned up, causing the wafer to be contaminated by the waste water, thereby greatly improving the safety of the wafer after cleaning.

[0046] The wastewater guide plate 24 effectively guides the wastewater absorbed by the absorbent sponge 26 from the conveyor belt 18. At the same time, the wastewater guide plate 24 is placed under the conveyor belt 18, so that after the absorbent sponge 26 effectively wipes the conveyor belt 18, the conveyor belt 18 can be effectively kept dry, preventing the drying efficiency of the wafer from being reduced due to the moisture of the conveyor belt 18, promoting the drying of the wafer while effectively ensuring the quality of the wafer, and greatly improving the cleaning efficiency of the wafer.

[0047] In the process of the active roller 33 driving the wafer to rotate, the two sides of the edge of the wafer will rotate in the wafer slot 29, and the wafer will rotate relative to the roller 36, which greatly improves the rotation efficiency of the wafer, thereby effectively ensuring the cleaning efficiency of the cleaning tank 13 for the wafer and the air duct 4 for the wafer drying efficiency, greatly improving the cleaning quality of the wafer. Secondly, through the setting of the rectangular through hole 32, on the one hand, it can effectively reduce the possibility of the flower basket 15 carrying a large amount of cleaning liquid when it is taken out of the cleaning tank 13, so that the cleaning liquid can return to the cleaning tank 13 through the rectangular through hole 32. On the other hand, it can also ensure the ventilation efficiency of the side of the wafer when the flower basket 15 is placed on the conveyor belt 18, further ensuring the drying efficiency of the wafer.

[0048] The preferred embodiments of the present invention disclosed above are only used to help illustrate the present invention. The preferred embodiments do not describe all the details in detail, nor do they limit the invention to the specific implementation methods described. Obviously, many modifications and changes can be made according to the content of this specification. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the present invention, so that those skilled in the art can understand and use the present invention well. The present invention is limited only by the claims and their full scope and equivalents.

Claims

1. An intelligent tank cleaning device for semiconductor wafer processing, comprising a bottom shell (14), characterized in that: An electric slider (8) is slidably mounted above the bottom shell (14), a plurality of clamping assemblies are fixedly connected to the bottom of the electric slider (8), a flower basket (15) is clamped on the clamping assemblies, a conveyor belt (18) is arranged at one end of the top of the bottom shell (14), a plurality of cleaning troughs (13) are opened at the top of the bottom shell (14), the cleaning troughs (13) are located at the end of the bottom shell (14) away from the conveyor belt (18), a pressurized fan (5) is arranged at the top of the bottom shell (14), the output end of the pressurized fan (5) is connected to a spray water tank (2), the output end of the pressurized fan (5) is connected to an air duct (4) through the spray water tank (2), and the end of the air duct (4) away from the spray water tank (2) is located directly above the conveyor belt (18); The bottom shell (14) is fixedly connected to side panels (1) on both sides, a top plate (3) is arranged directly above the bottom shell (14), the tops of the two side panels (1) are respectively fixedly connected to the two side wall panels at the bottom of the top plate (3), a slide groove is provided at the bottom center of the top plate (3), an electric slide rail is slidably connected in the slide groove, and a pressurized fan (5) is fixedly connected at the top center of the top plate (3); Both sides of the pressurizing fan (5) are connected to an L-shaped tube (6), one end of the L-shaped tube (6) away from the pressurizing fan (5) is connected to the spray water tank (2), the two spray water tanks (2) are respectively fixedly connected to the top of the opposite sides of the two side plates (1), a rectangular tube (21) for adding spray water is arranged at the center of the spray water tank (2), a plug (7) is arranged at the top of the rectangular tube (21), a pressure plate (20) is slidably connected to the inside of the spray water tank (2), and the pressure plate (20) and the rectangular tube (21) are slidably sleeved; The top side of the spray water tank (2) is connected to an air duct (4), the air duct (4) is located above the pressure plate (20), and one end of the air duct (4) away from the spray water tank (2) guides the conveyor belt (18). A vertical pipe (23) is opened on the side of the bottom of the spray water tank (2) close to the side plate (1). A limit rod (22) is arranged on the inner wall of the spray water tank (2), and the vertical pipe (23) is located below the limit rod (22). One end of the vertical pipe (23) away from the spray water tank (2) is connected to a horizontal pipe, and the horizontal pipe is opened inside the side plate (1). The horizontal pipe is connected to a plurality of nozzles (9), and the nozzles (9) are arranged on the side opposite to the two side plates (1) and the nozzles (9) guide the cleaning tank (13).

2. The intelligent tank cleaning device for semiconductor wafer processing according to claim 1, characterized in that: A groove (19) is formed at one end of the bottom shell (14), and the conveyor belt (18) is arranged at the top of the groove (19). A water-absorbing sponge (26) is fixedly connected to the side wall of the groove (19), and the top of the water-absorbing sponge (26) abuts against the lower belt surface of the conveyor belt (18). A wastewater guide plate (24) is also fixedly connected to the side wall of the groove (19), and the wastewater guide plate (24) is located directly below the water-absorbing sponge (26). A scraper (25) is fixedly connected to the end of the groove (19) away from the cleaning tank (13), and the scraper (25) abuts against the belt surface of the conveyor belt (18) and is located below the conveyor belt (18).

3. The intelligent tank cleaning device for semiconductor wafer processing according to claim 1, characterized in that: The clamping assembly comprises an electric telescopic rod (10) fixedly connected to the bottom of the electric slider (8); one end of the electric telescopic rod (10) away from the electric slider (8) is fixedly connected to a U-shaped rod (11); the electric telescopic rod (10) is fixedly connected to the middle section of the U-shaped rod (11); both ends of the U-shaped rod (11) are equipped with a rotating cylinder (31); a T-shaped gripper (28) is fixedly connected to the rotating shaft of the rotating cylinder (31); and an arc-shaped recess is provided at one end of the gripper (28) away from the rotating cylinder (31).

4. The intelligent tank cleaning device for semiconductor wafer processing according to claim 3, characterized in that: The tops of the two side wall panels of the flower basket (15) are fixedly connected with U-shaped brackets (16), and the middle section of the U-shaped bracket (16) is movably engaged with the gripper (28). The bottom of the flower basket (15) is provided with a plurality of placement grooves (35), and the bottoms of the placement grooves (35) are provided with rectangular through holes (32) for drainage. The bottom of the flower basket (15) is provided with supporting legs (17), and the bottom of the cleaning groove (13) is provided with pads (27), and the pads (27) are movably abutted against the supporting legs (17).

5. The intelligent tank cleaning device for semiconductor wafer processing according to claim 4, characterized in that: A plurality of wafer slots (29) for clamping wafers are arranged on both sides of the placement groove (35), and the wafer slots (29) on two adjacent placement grooves (35) are arranged in a staggered manner. Active rollers (33) and driven rollers (34) are rotatably connected to the top sides of the placement groove (35), and the active roller (33) is fixedly connected to a waterproof motor (30). The waterproof motor (30) is fixedly connected to one side of the flower basket (15). A waterproof contact switch is arranged at the bottom of the support leg (17), and the waterproof contact switch is electrically connected to the waterproof motor (30).

6. The intelligent tank cleaning device for semiconductor wafer processing according to claim 5, characterized in that: The wafer slots (29) on both sides of the top of the placement groove (35) are provided with guide grooves on the opposite sides thereof, and a plurality of rollers (36) are rotatably installed in the guide grooves.

7. The intelligent tank cleaning device for semiconductor wafer processing according to claim 1, characterized in that: A placement table (12) is fixedly connected to the bottom of one end of the bottom shell (14) away from the conveyor belt (18), and the flower basket (15) is placed on the placement table (12).

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