Hard chip processing method and hard chip

Abstract

The application relates to a hard chip processing method and a hard chip, and the processing method comprises the following steps: preparing a silicon wafer template through gluing, photoetching and developing processes; pouring an intermediate template through the silicon wafer template; performing a hardening process on the intermediate template; and performing multiple hot-pressing transfer printing on the processed intermediate template and hard plastic, so as to process the hard chip. The preparation period from the photoetching template to the hot-pressing multiple transfer printing is about two weeks, which greatly shortens the development period. Meanwhile, one silicon wafer template can pour multiple intermediate templates, and one intermediate template can be subjected to hot-pressing transfer printing on hard plastic for multiple times, so that multiple transfer printing of structures is finally formed, and the development cost is effectively reduced.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of microfluidic chip, in particular to a hard chip processing method and a hard chip. BACKGROUND

[0002] Single molecule detection technology is a biomedical detection technology that has developed rapidly in recent years, which can realize high-sensitivity and high-resolution detection and analysis of single molecules of biological molecules or chemical molecules.

[0003] Most of the single molecule or in vitro detection research projects are limited to using PDMS as a carrier for detection, but small batch testing or special needs require hard materials as chip carriers to meet application testing requirements. Generally, hard chip preparation requires mold injection, but the development cycle of precision injection mold is very long, short 3-5 months, long 1 year and very high cost; in addition, precision injection molding is difficult to achieve below 10um and has low yield.

[0004] Therefore, the prior art still needs to be improved and developed. SUMMARY

[0005] Therefore, the present application provides a hard chip processing method and a hard chip, which can effectively shorten the development cycle and reduce the development cost.

[0006] In order to achieve the above purpose, the embodiment of the present application provides a hard chip processing method, which comprises:

[0007] A silicon wafer template is prepared by gluing, photoetching and developing processes;

[0008] An intermediate template is cast by the silicon wafer template;

[0009] The intermediate template is subjected to mold hardening treatment;

[0010] The treated intermediate template is subjected to multiple heat pressing transfer with hard plastic to process a hard chip.

[0011] Preferably, the step of casting the intermediate template by the silicon wafer template comprises the following steps:

[0012] The silicon wafer template is subjected to surface hydrophobic treatment;

[0013] The PDMS is cast to the silicon wafer template to obtain the intermediate template.

[0014] Preferably, the polymer and silica gel are cast on the intermediate template to obtain a second intermediate template after mold pouring.

[0015] Preferably, the ratio of A glue to B glue in the PDMS is 10:1.

[0016] Preferably, the hardening treatment of the intermediate template comprises the following steps:

[0017] The intermediate template is surface treated by plating or PVD, CVD coating to make the surface smooth and easy to demould;

[0018] The intermediate template is overall hardened by heating, ultraviolet irradiation, and reagent soaking to significantly increase the overall hardness and toughness of the intermediate template;

[0019] The intermediate template is surface treated by plasma to introduce different functional groups to change the surface properties and improve the surface properties and replication effect of the intermediate template.

[0020] Preferably, the processed intermediate template is subjected to multiple thermal transfer printing with hard plastic to process the hard chip, comprising the following steps:

[0021] The hard plastic is subjected to alcohol ultrasonic cleaning to form a structure in which the intermediate template and the hard plastic are in close contact, and the hard plastic can replicate various precise structures on the intermediate template;

[0022] The intermediate template and the hard plastic are subjected to thermal transfer printing under specific temperature, vacuum degree, pressure range, and time, and the intermediate template and the hard plastic are subjected to multiple thermal transfer printing to form multiple transfer printing of structures, thereby processing the hard chip.

[0023] Preferably, the hard plastic is PMMA, COC, or PS.

[0024] Preferably, the concentration of the alcohol is 50%-70%.

[0025] Preferably, the temperature is 135℃, the pressure is 0.25mpa, and the time is 10min.

[0026] The application also provides a hard chip manufactured by the hard chip processing method.

[0027] The hard chip processing method provided by the application has the following advantages and beneficial effects:

[0028] The development cycle is greatly shortened from about two weeks for the preparation cycle of the lithography template to the thermal transfer printing of multiple structures, and meanwhile, one silicon wafer template can cast multiple intermediate templates, and one intermediate template can be subjected to multiple thermal transfer printing with hard plastic to form multiple transfer printing of structures, thereby effectively reducing the development cost. BRIEF DESCRIPTION OF DRAWINGS

[0029] Figure 1 Figure 1 is a flowchart of the hard chip processing method according to Embodiment 1 of the application.

[0030] Figure 2 Flow chart of the second embodiment of the hard chip processing method of the present application. DETAILED DESCRIPTION

[0031] For the purpose of promoting the understanding of the present application, the present application will be more fully described by reference to the following drawings. The preferred embodiments of the present application are shown in the drawings. However, the present application can be realized in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete. It is noted that like reference numerals refer to like elements throughout the specification.

[0032] It is to be noted that when an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements can be present. As used herein the term "mounting" and like terms are used for illustrative purposes only.

[0033] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description of the application herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0034] In the first embodiment, as shown in Figure 1 a hard chip processing method is provided, which comprises:

[0035] S10, a required wafer template is prepared by gluing, photoetching and developing processes;

[0036] S11, surface hydrophobic treatment is performed on the wafer template;

[0037] S12, PDMS casting is performed on the wafer template (wherein the ratio of A glue to B glue is = 10:1) with a thickness of 5mm to obtain an intermediate template;

[0038] S13, high-temperature hardening (150℃ / 12h) and reagent treatment are performed on the intermediate template;

[0039] S14, the intermediate template after hardening is frontally attached to the surface-treated hard plastic PMMA;

[0040] S15, the combined template after attachment is placed in a hot-pressing device for hot pressing (temperature is 135℃, pressure is 0.25mpa, time is 10min);

[0041] S16, the sample after hot pressing is placed on a heat-conducting low heat insulation plate for natural cooling.

[0042] In embodiment two, as shown in Figure 2 A hard chip processing method is provided, comprising:

[0043] S17, a required silicon wafer template is prepared through gluing, photoetching and developing processes;

[0044] S18, surface hydrophobic treatment is performed on the silicon wafer template;

[0045] S19, PDMS casting is performed on the silicon wafer template (wherein the ratio of A glue to B glue is = 10:1) 5mm thick, to obtain a PDMS mold;

[0046] S20, a polymer, silica gel is cast on the PDMS mold to obtain an intermediate template;

[0047] S21, surface hardening treatment is performed on the intermediate template;

[0048] S22, the intermediate template after hardening is attached to the surface treated hard plastic PMMA;

[0049] S23, the combined template after attachment is placed in a hot pressing device for hot pressing (temperature is 135℃, pressure is 0.25mpa, time is 10min);

[0050] S24, the sample after hot pressing is placed on a heat-conducting low heat insulation plate for natural cooling.

[0051] The silicon wafer template prepared through the photoetching process has a precision of 0.1-10um, and can achieve high precision. Through precise photoetching preparation, high-precision patterning can be achieved.

[0052] Of course, the hard plastic can also be COC, PS.

[0053] In specific implementation, the hardening treatment of the intermediate template includes the following steps:

[0054] The intermediate template is surface treated through plating mode or PVD, CVD coating, so that the surface is smooth, easy to demold, and resistant to subsequent processes;

[0055] The intermediate template is overall hardened using heating, ultraviolet irradiation, and reagent soaking, so that the overall hardness of the intermediate template is significantly increased, the material is more flexible, is not easily damaged, and the service life is improved to 200% of the original;

[0056] The intermediate template is surface treated using plasma mode, different functional groups are introduced to change the surface properties of the intermediate template, improve the surface properties of the intermediate template, and improve the replication effect of the intermediate template.

[0057] The intermediate template is treated to increase its hardness, elasticity and toughness, so as to increase the service life of the intermediate template and the replication effect.

[0058] In the implementation, the treated intermediate template is subjected to multiple hot-pressing transfer printing with the hard plastic to process the hard chip, including the following steps:

[0059] The hard plastic is subjected to alcohol (alcohol concentration: 50%-70%) ultrasonic cleaning, so that the intermediate template and the hard plastic form a structure of close contact, and the hard plastic can replicate various precise structures on the intermediate template.

[0060] The intermediate template and the hard plastic are subjected to hot-pressing transfer printing under specific temperature, vacuum degree, pressure range and time, and the intermediate template and the hard plastic are subjected to multiple hot-pressing transfer printing, so as to finally form structure multiple transfer printing and process the hard chip.

[0061] The core point of the intermediate template treatment is treatment by chemical plating film, physical plating film, surface chemical reagent treatment and surface physical group modification. The core point of the hot-pressing transfer printing process is preparation by specific temperature, vacuum degree, pressure and time.

[0062] The alcohol ultrasonic cleaning process for the hard plastic makes the intermediate template and the polymer form a structure of close contact, and the polymer can replicate various precise structures on the intermediate template.

[0063] One silicon wafer template can cast multiple intermediate templates, and one intermediate template can be subjected to hot-pressing transfer printing with the hard plastic multiple times to finally form structure multiple transfer printing.

[0064] The preparation cycle from the photolithography template to the hot-pressing multiple transfer printing is about two weeks, which can greatly shorten the sample preparation cycle and form the final low-cost, high-precision and multiple transfer printing chip.

[0065] The application also provides a hard chip manufactured by the hard chip processing method.

[0066] In summary, the hard chip processing method and the hard chip provided by the application are processed by the intermediate template treatment and the hot-pressing transfer printing process. The core point of the intermediate template treatment is treatment by chemical plating film, physical plating film, surface chemical reagent treatment and surface physical group modification. The core point of the hot-pressing transfer printing process is preparation by specific temperature, vacuum degree, pressure and time. The development cycle is greatly shortened from the photolithography template to the hot-pressing multiple transfer printing, which is about two weeks. Meanwhile, one silicon wafer template can cast multiple intermediate templates, and one intermediate template can be subjected to hot-pressing transfer printing with the hard plastic multiple times to finally form structure multiple transfer printing, which effectively reduces the development cost.

[0067] Any combination of the technical features in the above-described embodiments can be made. For the sake of brevity, the foregoing description is not intended to be exhaustive or to limit the scope of the application to the precise form disclosed. Modifications and alterations can occur to others upon reading the description. It is intended that the scope of the application be measured by the breadth of the appended claims rather than the particulars of the foregoing description.

[0068] The above-described embodiments are merely representative of several embodiments of the present application, which are described in a relatively specific and detailed manner. However, it should be noted that the present application is not limited to the above-described embodiments. Any person skilled in the art can make several modifications and improvements without departing from the concept of the present application. Therefore, the scope of the patent of the present application should be determined by the appended claims.

Claims

1. A hard chip processing method, characterized in that: The steps include: A silicon wafer template is prepared through coating, photolithography, and development processes; Casting an intermediate template through a silicon wafer template; Carry out hardening treatment on the middle template; The processed intermediate template is subjected to multiple hot pressing transfers with hard plastic to produce a hard chip; The hardening treatment of the intermediate template comprises the following steps: Treat the surface of the intermediate template by coating or PVD or CVD coating to make it smooth and easy to demould; The middle template is hardened as a whole by heating, ultraviolet irradiation and reagent immersion, which significantly increases the overall hardness of the middle template and makes the material more tough; The intermediate template is treated with plasma to introduce different functional groups to change its surface properties, thereby improving the surface properties of the intermediate template and enhancing the replication effect of the intermediate template. The hard plastic is PMMA, COC, or PS.

2. The hard chip processing method according to claim 1, characterized in that: The process of casting the intermediate template using the silicon wafer template comprises the following steps: Performing surface hydrophobic treatment on the silicon wafer template; The intermediate template is obtained by pouring PDMS onto the silicon wafer template.

3. The hard chip processing method according to claim 2, characterized in that: The ratio of A glue to B glue in the PDMS is 10:

1.

4. The hard chip processing method according to claim 1, characterized in that: The processed intermediate template is subjected to multiple hot pressing transfers with the hard plastic to produce a hard chip, which includes the following steps: Perform alcohol ultrasonic cleaning on the hard plastic to form a close contact structure between the intermediate template and the hard plastic, and enable the hard plastic to replicate various precise structures on the intermediate template; The intermediate template and the hard plastic are hot-pressed and transferred under specific temperature, vacuum degree, pressure range and time. The intermediate template and the hard plastic are hot-pressed and transferred multiple times to form a multiple transfer structure, thereby processing a hard chip.

5. The hard chip processing method according to claim 4, characterized in that: The concentration of the alcohol is 50%-70%.

6. The hard chip processing method according to claim 4, characterized in that: The temperature is 135° C., the pressure is 0.25 MPa and the time is 10 minutes.

7. A hard chip, characterized in that: The hard chip is manufactured by the hard chip processing method according to any one of claims 1 to 6.

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