Silicon wafer cleaning basket

Abstract

The utility model relates to the technical field of silicon wafer cleaning, in particular to a silicon wafer cleaning flower basket which comprises two supporting side plates, two supporting bottom plates, two connecting plates and a plurality of supporting strips, the two supporting side plates are oppositely arranged in parallel, the supporting bottom plates are arranged at the bottoms of the supporting side plates respectively, and the connecting plates are connected with the supporting strips. The connecting plates are connected between the two supporting side plates, the two ends, opposite to each other, of the supporting side plates are each provided with one connecting plate, the supporting strips are connected to the supporting side plates, the multiple supporting strips are evenly distributed in the length direction of the supporting side plates, protrusions are integrally formed on the supporting strips, and the protrusions are arranged on the supporting side plates. The protrusions are located on the opposite surfaces of the two supporting strips, the protrusions are arranged in a semi-cylindrical shape, the multiple protrusions are evenly distributed in the length direction of the supporting side plate, and an elastic buffer layer is arranged between every two adjacent supporting strips. According to the invention, the problem that the production efficiency and the product quality are affected due to the fact that the silicon wafers are adhered to the flower basket is solved.

Description

Technical Field

[0001] This utility model relates to the field of silicon wafer cleaning technology, and in particular to a silicon wafer cleaning basket. Background Technology

[0002] Silicon wafers are the fundamental material in semiconductor manufacturing. They are thin slices cut from high-purity silicon and used to manufacture integrated circuits, solar cells, and other electronic devices. Silicon wafer cleaning is a critical step in the semiconductor manufacturing process, essential for ensuring the purity of the wafer surface and the success of subsequent processes. The cleaning process aims to remove contaminants from the silicon wafer surface, including organic matter, inorganic salts, metal ions, particles, and other impurities. Regardless of the method used, silicon wafer cleaning requires inserting the wafers into a deformation-resistant and chemically resistant basket. This basket ensures that each wafer is evenly separated for cleaning. As silicon wafers on the market become increasingly thinner, wafer sticking can occur when the wafer thickness is small, severely impacting production efficiency and product quality. Utility Model Content

[0003] In order to improve the problem of silicon wafers sticking to the basket, which affects production efficiency and product quality, this application provides a silicon wafer cleaning basket.

[0004] The silicon wafer cleaning basket provided in this application adopts the following technical solution:

[0005] A silicon wafer cleaning basket includes two supporting side plates, two supporting bottom plates, two connecting plates, and several supporting strips. The two supporting side plates are arranged parallel to each other. Each supporting bottom plate has a support at the bottom of one of the supporting side plates. The connecting plates are connected between the two supporting side plates and have a support at each of the opposite ends of the supporting side plates. The supporting strips are connected to the supporting side plates and are evenly distributed along the length of the supporting side plates. Each supporting strip has an integrally formed protrusion located on the opposite surface of the two supporting strips. The protrusion is semi-cylindrical and is evenly distributed along the length of the supporting side plates. An elastic buffer layer is provided between adjacent supporting strips.

[0006] Preferably, the support bar has a cleaning groove that penetrates two opposite surfaces of the support bar, the cleaning groove is inclined, and a plurality of cleaning grooves are evenly distributed along the length of the support bar.

[0007] Preferably, the elastic buffer layer is made of polyetheretherketone (PEEK) material, with a thickness of 0.3-0.8 mm, an elastic modulus of 3.2-3.5 GPa, an elongation at break of 50-80%, and a temperature resistance range of -200℃ to +250℃.

[0008] Preferably, the surface of the protrusion is coated with a diamond-like coating with a thickness of 100-200 nm.

[0009] Preferably, the connecting plate has a through hole that penetrates two opposite surfaces of the connecting plate and is located at the center of the connecting plate.

[0010] Preferably, the spacing between adjacent protrusions is 5 times the thickness of the silicon wafer.

[0011] Preferably, a support beam is connected to the connecting plate, the support beam is located between the two connecting plates, and the support beam is arranged along the length direction of the support side plate.

[0012] In summary, this application includes the following beneficial technical effects:

[0013] This utility model provides a silicon wafer cleaning basket. By setting protrusions on the support bars, the contact area between the basket and the silicon wafer is reduced through discontinuous contact. This increases the cleaning area while ensuring the clamping effect. The surface of the protrusions is coated with a diamond-like carbon coating, which improves the adhesion between the silicon wafer and the basket and enhances the wear resistance of the protrusions, preventing damage to the silicon wafer due to wear of the protrusions. Furthermore, the elastic buffer layer set between adjacent support bars can absorb some of the thermal stress through elastic deformation during high-temperature cleaning, improving the situation of microcracks in the silicon wafer. Thus, it achieves the effect of improving the problem of silicon wafer sticking to the basket, which affects production efficiency and product quality. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the structure of the silicon wafer cleaning basket in the embodiments of this application;

[0015] Figure 2 yes Figure 1 Enlarged view of point A in the middle;

[0016] Figure 3 This is a top view of the silicon wafer cleaning basket in an embodiment of this application.

[0017] Explanation of reference numerals in the attached drawings: 100, supporting side plate; 110, slot; 200, supporting base plate; 300, connecting plate; 310, through hole; 320, supporting crossbeam; 400, supporting strip; 410, protrusion; 420, cleaning channel; 500, elastic buffer layer. Detailed Implementation

[0018] To enable those skilled in the art to better understand the present invention, the solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the protection scope of the present invention.

[0019] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation or specific orientation structure and operation, and therefore should not be construed as a limitation of this utility model; the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. In addition, unless otherwise explicitly specified and limited, the terms "installed," "connected," and "linked" should be interpreted broadly, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. For those skilled in the art, the specific meaning of the above terms in this utility model can be understood according to the specific circumstances.

[0020] This application discloses a silicon wafer cleaning basket. (Refer to...) Figure 1 , Figure 2 and Figure 3The silicon wafer cleaning basket includes two supporting side plates 100, two supporting base plates 200, two connecting plates 300, and several supporting strips 400. The two supporting side plates 100 are arranged parallel to each other. Each supporting base plate 200 is located at the bottom of one of the supporting side plates 100 and is perpendicular to the supporting side plates 100. Connecting plates 300 are connected between the two supporting side plates 100 and are located at opposite ends of each supporting side plate 100. Support strips 400 are connected to the supporting side plates 100 and extend along the length of each supporting side plate 100. Several support bars 400 are evenly arranged in the direction of degree. A protrusion 410 is integrally formed on the support bar 400. The protrusion 410 is located on the opposite surface of the two support bars 400. The protrusion 410 is semi-cylindrical. Several protrusions 410 are evenly arranged along the length of the support side plate 100. The spacing between adjacent protrusions 410 is 5 times the thickness of the silicon wafer. An elastic buffer layer 500 is provided between adjacent support bars 400. The specific connection method is plug-in. The cross-section of the elastic buffer layer 500 is T-shaped. A slot 110 is provided on the support side plate 100 for the elastic buffer layer 500 to be inserted.

[0021] A cleaning channel 420 is provided on the support bar 400. The cleaning channel 420 passes through two opposite surfaces of the support bar 400. The cleaning channel 420 is inclined and several cleaning channels 420 are evenly distributed along the length of the support bar 400. By setting the cleaning channel 420, the obstruction of the silicon wafer by the support bar 400 is reduced, and the contact area between the cleaning liquid and the silicon wafer is increased, thereby improving the cleaning efficiency.

[0022] The elastic buffer layer 500 is made of polyetheretherketone (PEEK), with a thickness of 0.3-0.8 mm, an elastic modulus of 3.2-3.5 GPa, an elongation at break of 50-80%, and a temperature resistance range of -200℃ to +250℃.

[0023] The elastic modulus of the elastic buffer layer 500 (3.2-3.5GPa) is between the elastic modulus of the silicon wafer (160GPa) and the dynamic pressure of the cleaning fluid (0.1-0.5MPa), forming an impedance matching layer. Through finite element analysis, the buffer layer can increase the amplitude attenuation coefficient to 0.85 (0.6 for traditional structures) and reduce the vibration amplitude from ±0.3mm to ±0.15mm.

[0024] The coefficient of thermal expansion of the elastic buffer layer 500 (4.7× / ℃) is significantly different from that of silicon (2.6× / ℃). During high-temperature cleaning (80-100℃), it absorbs more than 80% of the thermal stress through elastic deformation, thus preventing microcracks in the silicon wafer.

[0025] The elastic buffer layer 500 has an elongation at break (50-80%), which allows it to withstand more than 10 cycles of load, extending its lifespan by 3 times compared to traditional PP materials.

[0026] The surface of bump 410 is coated with a diamond-like carbon coating by physical vapor deposition (PVD) with a thickness of 100-200nm, a surface energy of <25mN / m, and a coefficient of friction of <0.1. By coating the surface of bump 410 with a diamond-like carbon coating, the adhesion between the silicon wafer and the basket is improved, while the wear resistance of bump 410 is also improved, thus avoiding damage to the silicon wafer caused by the wear of bump 410.

[0027] The connecting plate 300 has a through hole 310 that penetrates two opposite surfaces of the connecting plate 300. The through hole 310 is located at the center of the connecting plate 300. By setting the through hole 310 on the connecting plate 300, on the one hand, the basket can reduce the obstruction of the silicon wafer, allowing the cleaning water to come into contact with the silicon wafer quickly, and on the other hand, the weight of the basket and the production cost can be reduced.

[0028] A support beam 320 is connected to the connecting plate 300. The support beam 320 is located between the two connecting plates 300 and is set along the length of the support side plate 100. The stability of the overall structure of the flower basket is improved by setting the support beam 320.

[0029] The implementation principle of a silicon wafer cleaning basket according to an embodiment of this application is as follows: When cleaning silicon wafers, the operator inserts the silicon wafer into the support strips 400 on the two support side plates 100 and clamps it between the opposite protrusions 410. The discontinuous contact of the protrusions 410 reduces the contact area between the basket and the silicon wafer, thereby increasing the cleaning area while ensuring the clamping effect. The silicon wafer is attached to the elastic buffer layer 500, which can absorb some of the thermal stress through elastic deformation during high-temperature cleaning, thus improving the situation of microcracks in the silicon wafer. Furthermore, the contact area between the cleaning fluid and the silicon wafer is increased through the through holes 310 on the connecting plate 300 and the cleaning grooves 420 on the support strips 400, thereby improving the cleaning effect.

[0030] Although preferred embodiments of the present invention have been described, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments as well as all changes and modifications falling within the scope of the present invention.

[0031] Obviously, those skilled in the art can make various modifications and variations to this utility model without departing from its spirit and scope. Therefore, if these modifications and variations fall within the scope of the claims of this utility model and their equivalents, this utility model also intends to include these modifications and variations.

[0032] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model in any way. Although the present utility model has been disclosed above with reference to a preferred embodiment, it is not intended to limit the present utility model. Any person skilled in the art can make some modifications or alterations to the above-disclosed technical content to create equivalent embodiments without departing from the scope of the present utility model's technical solution. Any simple modifications, equivalent substitutions, and improvements made to the above embodiments without departing from the scope of the present utility model's technical solution, based on the technical essence of the present utility model and within the spirit and principles of the present utility model, shall still fall within the protection scope of the present utility model's technical solution.

[0033] The above embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A silicon wafer cleaning basket, characterized in that: It includes two supporting side plates (100), two supporting base plates (200), two connecting plates (300), and several supporting strips (400). The two supporting side plates (100) are arranged parallel to each other. Each supporting base plate (200) is provided at the bottom of the supporting side plate (100). The connecting plates (300) are connected between the two supporting side plates (100) and are provided at opposite ends of the supporting side plates (100). The supporting strips (400) are connected to the supporting base plates (100). On the support side plate (100), a plurality of support bars (400) are evenly arranged along the length direction of the support side plate (100). A protrusion (410) is integrally formed on the support bar (400). The protrusion (410) is located on the opposite surface of two support bars (400). The protrusion (410) is semi-cylindrical. A plurality of protrusions (410) are evenly arranged along the length direction of the support side plate (100). An elastic buffer layer (500) is provided between adjacent support bars (400).

2. The silicon wafer cleaning basket according to claim 1, characterized in that: The support bar (400) is provided with a cleaning channel (420), which penetrates two opposite surfaces of the support bar (400). The cleaning channel (420) is inclined and a plurality of cleaning channels (420) are evenly arranged along the length of the support bar (400).

3. The silicon wafer cleaning basket according to claim 1, characterized in that: The elastic buffer layer (500) is made of polyetheretherketone (PEEK), with a thickness of 0.3-0.8 mm, an elastic modulus of 3.2-3.5 GPa, an elongation at break of 50-80%, and a temperature resistance range of -200℃ to +250℃.

4. The silicon wafer cleaning basket according to claim 1, characterized in that: The surface of the protrusion (410) is coated with a diamond-like coating with a thickness of 100-200 nm.

5. A silicon wafer cleaning basket according to claim 1, characterized in that: The connecting plate (300) has a through hole (310) that penetrates two opposite surfaces of the connecting plate (300) and is located at the center of the connecting plate (300).

6. The silicon wafer cleaning basket according to claim 1, characterized in that: The spacing between adjacent protrusions (410) is 5 times the thickness of the silicon wafer.

7. A silicon wafer cleaning basket according to claim 1, characterized in that: A support beam (320) is connected to the connecting plate (300). The support beam (320) is located between the two connecting plates (300) and is arranged along the length direction of the support side plate (100).

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