An optical receiver, an optical receiving module and an electronic device

By designing the front and sides of the photosensitive chip in the infrared receiver to be photosensitive surfaces and converging light through the lens, the problem of low reception sensitivity of the infrared receiver in the non-directional direction is solved, and the light reception angle is expanded and the sensitivity is improved.

CN119029063BActive Publication Date: 2025-08-05HARBIN HEG TECHNOLOGY DEVELOPMENT LTD CO +1
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Patent Information

Application Number
CN202411141536.5
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2024-08-19
Publication Date
2025-08-05
Estimated Expiration
2044-08-19

AI Technical Summary

Technical Problem

The infrared receiver has low reception sensitivity in the non-directional direction, which affects the remote control effect.

Method used

The front and sides of the photosensitive chip are designed to be photosensitive surfaces, and light is concentrated through the lens, so that light can be incident on the front and sides of the photosensitive chip, expanding the light receiving angle.

Benefits of technology

Improves the light reception sensitivity of the infrared receiver and improves the remote control effect.

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Abstract

The present invention discloses a light receiver, a light receiving module and an electronic device, comprising a photosensitive chip and a packaging colloid, wherein the photosensitive chip is packaged inside the packaging colloid, and the packaging colloid comprises at least a first lens located on the front side of the packaging colloid and a second lens located on the side side of the packaging colloid, wherein the first lens covers the front side of the photosensitive chip, and is used to converge light and make the converged light incident on the front side of the photosensitive chip, and the second lens covers the side side of the photosensitive chip, and is used to converge light and make the converged light incident on the side side of the photosensitive chip, and both the front side and the side side of the photosensitive chip are photosensitive surfaces, thereby enabling not only the front side of the photosensitive chip to receive light through the first lens, but also the side side of the photosensitive chip to receive light through the second lens, thereby expanding the light receiving angle of light receivers such as infrared receivers, and thereby improving the receiving sensitivity of the light receiver.
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Description

Technical Field

[0001] The present invention relates to the technical field of optical devices, and in particular to an optical receiver, an optical receiving module and an electronic device. Background Art

[0002] Infrared receivers are essential components for infrared remote control and are widely used in smart devices like televisions, air conditioners, and electric meters. However, if a TV or electric meter with an infrared receiver is mounted high up, then when a remote control with an infrared transmitter sends an infrared light signal to the receiver, the infrared light signal's outgoing or incoming direction won't be directly aligned with the receiver's sensing surface. This results in low sensitivity, or even the inability to receive infrared light at all, severely impacting the remote control of the TV or electric meter. Summary of the Invention

[0003] The invention discloses a light receiver, a light receiving module and an electronic device, so as to improve the receiving sensitivity of an infrared receiver.

[0004] In the first aspect, the present invention discloses a light receiver, comprising: a photosensitive chip; a packaging body, wherein the photosensitive chip is encapsulated inside the packaging body; the packaging body comprises at least a first lens located on the front side of the packaging body and a second lens located on the side side of the packaging body; the first lens covers the front side of the photosensitive chip, and the first lens is used to converge light and make the converged light incident on at least the front side of the photosensitive chip; the second lens covers the side side of the photosensitive chip, and the second lens is used to converge light and make the converged light incident on at least the side side of the photosensitive chip; the front side of the photosensitive chip and the side side of the photosensitive chip are both photosensitive surfaces.

[0005] In some embodiments, the encapsulation body includes a first second lens located on the first side of the encapsulation body and a second second lens located on the second side of the encapsulation body; the first second lens and the second second lens cover the first side and the second side of the photosensitive chip respectively, the first second lens is used to converge light and make the converged light incident on at least the first side of the photosensitive chip, and the second second lens is used to converge light and make the converged light incident on at least the second side of the photosensitive chip; the first side of the encapsulation body and the first side of the photosensitive chip are the same side surface, the second side of the encapsulation body and the second side of the photosensitive chip are the same side surface, and the second side of the encapsulation body is the surface opposite to the first side of the encapsulation body.

[0006] In some embodiments, the encapsulation body further includes a third second lens located on the third side of the encapsulation body; the third second lens covers the third side of the photosensitive chip, and the third second lens is used to converge light and make the converged light at least incident on the third side of the photosensitive chip; the third side of the encapsulation body and the third side of the photosensitive chip are the same side surface, and the third side of the encapsulation body is arranged adjacent to the second side and the first side of the encapsulation body.

[0007] In some embodiments, the first lens includes a spherical lens, the second lens includes a nose bridge lens, and the nose bridge lens includes a cylindrical lens and a spherical lens located on top of the cylindrical lens.

[0008] In some embodiments, the first lens includes a nose bridge lens, and the second lens includes a nose bridge lens; the nose bridge lens includes a cylindrical lens and a spherical lens located on top of the cylindrical lens.

[0009] In some embodiments, the first lens completely covers the front surface of the encapsulant, and the second lens completely covers the side surface of the encapsulant; or, the first lens partially covers the front surface of the encapsulant, and the second lens completely covers the side surface of the encapsulant and partially covers the front surface of the encapsulant.

[0010] In some embodiments, the optical receiver also includes a lead frame, which includes at least a supporting portion, a shielding portion and a plurality of pin portions; the photosensitive chip is fixed to the supporting portion and electrically connected to the plurality of pin portions; the supporting portion is encapsulated inside the encapsulation body, and the plurality of pin portions are led out from the fourth side of the encapsulation body; the fourth side of the encapsulation body is arranged opposite to the third side of the encapsulation body; the shielding portion is bent from the third side of the encapsulation body to the front of the encapsulation body, and the area of the shielding portion corresponding to the first lens or the second lens has a light-transmitting hole, and the light-transmitting hole is used to transmit the light converged by the first lens or the second lens to the photosensitive chip.

[0011] In some embodiments, the light receiver comprises an infrared light receiver.

[0012] In a second aspect, the present invention discloses an optical receiving module, comprising a PCB board and an optical receiver as described in any one of the above items, wherein the pins of the optical receiver are electrically connected to the PCB board.

[0013] In a third aspect, the present invention discloses an electronic device comprising the light receiving module as described above.

[0014] The light receiver, light receiving module and electronic device disclosed in the present invention include a photosensitive chip and a packaging colloid, wherein the photosensitive chip is packaged inside the packaging colloid, and the packaging colloid includes at least a first lens located on the front of the packaging colloid and a second lens located on the side of the packaging colloid, wherein the first lens covers the front of the photosensitive chip, and is used to converge light and make the converged light incident on the front of the photosensitive chip, and the second lens covers the side of the photosensitive chip, and is used to converge light and make the converged light incident on the side of the photosensitive chip, and the front and side of the photosensitive chip are both photosensitive surfaces, so that not only the front of the photosensitive chip can receive light through the first lens, but also the side of the photosensitive chip can receive light through the second lens, thereby expanding the light receiving angle of light receivers such as infrared receivers, thereby improving the receiving sensitivity of the light receiver, and thereby improving the remote control effect of electrical appliances such as televisions or electric meters. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the background technology, the drawings required for use in the embodiments of the present invention or the background technology will be described below.

[0016] Figure 1 This is a schematic diagram of the structure of a traditional infrared receiver.

[0017] Figure 2 The figure is a schematic structural diagram of an optical receiver disclosed in an embodiment of the present invention.

[0018] Figure 3 This is a schematic structural diagram of another optical receiver disclosed in an embodiment of the present invention.

[0019] Figure 4 This is a schematic structural diagram of another optical receiver disclosed in an embodiment of the present invention.

[0020] Figure 5 This is a schematic structural diagram of another optical receiver disclosed in an embodiment of the present invention.

[0021] Figure 6 This is a schematic structural diagram of another optical receiver disclosed in an embodiment of the present invention.

[0022] Figure 7 This is a schematic structural diagram of another optical receiver disclosed in an embodiment of the present invention.

[0023] Figure 8 The figure is a curve diagram showing the relationship between the light signal receiving angle and receiving sensitivity of a traditional infrared light receiver.

[0024] Figure 9 FIG. 4 is a graph showing the relationship between the optical signal receiving angle and the receiving sensitivity of the optical receiver in an embodiment of the present invention. DETAILED DESCRIPTION

[0025] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0026] like Figure 1 As shown, Figure 1 This is a schematic diagram of the structure of a traditional infrared receiver, which includes a photosensitive chip (not shown in the figure) and an encapsulation body 1 that encapsulates the photosensitive chip. The photosensitive chip only has a photosensitive surface on the front side, and the portion of the encapsulation body 1 that covers the front side of the photosensitive chip has a lens 10. The lens 10 is used to converge the received infrared light signal to the front side of the photosensitive chip so that the front side of the photosensitive chip receives the infrared light signal and the photosensitive chip performs corresponding signal processing operations in response to the infrared light signal.

[0027] When using a remote control with an infrared transmitter to transmit infrared light signals to an appliance with an infrared receiver, the infrared receiver can only receive the infrared light signals if the remote control is facing the infrared receiver's sensing surface, i.e., the front of the photosensitive chip. However, if the appliance, such as a television or electric meter, with an infrared receiver is mounted high, then when the remote control with an infrared transmitter transmits infrared light signals to the infrared receiver, the outgoing or incoming direction of the infrared light signals will not face the infrared receiver's sensing surface, i.e., the front of the photosensitive chip. This will result in a weak infrared light signal received by the infrared receiver, or even the infrared receiver may not receive the infrared light signal at all. This results in poor infrared light signal reception sensitivity, seriously affecting the remote control effectiveness of the appliance, such as the television or electric meter, with an infrared receiver.

[0028] Based on this, the present invention discloses a light receiver, which expands the light receiving angle of light receivers such as infrared receivers and improves the receiving sensitivity of light signals such as infrared light signals by making the front and side surfaces of the photosensitive chip both photosensitive surfaces and allowing the front and side surfaces of the photosensitive chip to receive light through lenses.

[0029] As an optional implementation of the present disclosure, an embodiment of the present invention discloses an optical receiver, such as Figure 2 As shown, Figure 2 This is a schematic structural diagram of a light receiver disclosed in an embodiment of the present invention. The light receiver includes a photosensitive chip (not shown in the figure) and an encapsulation body 1. The photosensitive chip is encapsulated inside the encapsulation body 1, and the encapsulation body 1 includes at least a first lens 10 located on the front side of the encapsulation body 1 and a second lens 11 located on the side of the encapsulation body 1.

[0030] Among them, the first lens 10 covers the front of the photosensitive chip, and the first lens 10 is used to converge light and make the converged light incident on the front of the photosensitive chip. The second lens 11 covers the side of the photosensitive chip, and the second lens 11 is used to converge light and make the converged light incident on at least the side of the photosensitive chip. In addition, the front and side of the photosensitive chip are both photosensitive surfaces.

[0031] It should be noted that the optical receiver may also include a processing chip encapsulated in the encapsulation 1 and electrically connected to the photosensitive chip, which will not be described in detail. In addition, the optical receiver in the embodiment of the present invention may be an infrared light receiver, a visible light receiver, or an ultraviolet light receiver.

[0032] In the embodiment of the present invention, because the front and side surfaces of the photosensitive chip are both photosensitive surfaces, and the front of the photosensitive chip is covered with the first lens 10 and the side surface of the photosensitive chip is covered with the second lens 11, not only the front of the photosensitive chip can receive light through the first lens 10, but also the side surface of the photosensitive chip can receive light through the second lens 10, thereby improving the light receiving angle of light receivers such as infrared receivers, thereby improving the receiving sensitivity of light receivers, and thereby improving the remote control effect of electrical appliances such as televisions or electric meters.

[0033] In some embodiments of the present invention, Figure 2 As shown, the encapsulation body 1 includes a first second lens 11 located on the first side surface S1 of the encapsulation body 1 and a second second lens 11 located on the second side surface S2 of the encapsulation body 1. The first second lens 11 and the second second lens 11 cover the first side surface and the second side surface of the photosensitive chip respectively. The first second lens 11 is used to converge light and make the converged light incident on at least the first side surface of the photosensitive chip. The second second lens 11 is used to converge light and make the converged light incident on at least the second side surface of the photosensitive chip.

[0034] Among them, the first side surface S1 of the encapsulation body 1 and the first side surface of the photosensitive chip are the same side surface, the second side surface S2 of the encapsulation body 1 and the second side surface of the photosensitive chip are the same side surface, the second side surface S2 of the encapsulation body 1 is the surface opposite to the first side surface S1 of the encapsulation body 1, and the second side surface of the photosensitive chip and the first side surface of the photosensitive chip are both photosensitive surfaces.

[0035] In some embodiments, as Figure 2As shown, the optical receiver also includes a lead frame, which includes at least a supporting portion (not shown in the figure), a shielding portion (not shown in the figure) and a plurality of pin portions 12. The photosensitive chip is fixed to the supporting portion and electrically connected to the plurality of pin portions 12. The supporting portion is encapsulated inside the encapsulation body 1, and the plurality of pin portions 12 are led out from the fourth side surface S4 of the encapsulation body 1, wherein the fourth side surface S4 of the encapsulation body 1 is adjacent to the first side surface S1 of the encapsulation body 1 and the second side surface S2 of the encapsulation body 1, and the fourth side surface S4 of the encapsulation body 1 is opposite to the third side surface S3 of the encapsulation body 1.

[0036] In addition, the shielding portion bends from the third side surface S3 of the encapsulant 1 to the front surface of the encapsulant 1. The shielding portion is used to shield the photosensitive chip from interference from external signals. The area of the shielding portion corresponding to the first lens 10 has a light-transmitting hole, which is used to transmit the light converged by the first lens 10 to the front surface of the photosensitive chip. Of course, in other embodiments, the shielding portion can also cover the side surface of the encapsulant 1. Similarly, the area of the shielding portion corresponding to the second lens 11 also has a light-transmitting hole, so that the light converged by the second lens 11 is transmitted to the side surface of the photosensitive chip through the light-transmitting hole.

[0037] It is understandable that, when the plurality of pin portions 12 are extended from the fourth side surface S4 of the encapsulation body 1, it is not convenient to set the second lens 11 on the fourth side surface S4 of the encapsulation body 1. When the shielding portion is bent from the third side surface S3 of the encapsulation body 1 to the front surface of the encapsulation body 1, it is also not convenient to set the second lens 11 on the third side surface S3 of the encapsulation body 1.

[0038] However, the present invention is not limited thereto, and in other embodiments, the second lens 11 may also be provided on the third side surface S3 of the encapsulant 1. Figure 3 As shown, Figure 3 This is a schematic structural diagram of another optical receiver disclosed in an embodiment of the present invention, in which the encapsulation body 1 further includes a third second lens 11 located on the third side surface S3 of the encapsulation body 1. The third second lens 11 covers the third side surface of the photosensitive chip, and the third second lens 11 is used to converge light and allow the converged light to at least be incident on the third side surface of the photosensitive chip. The third side surface S3 of the encapsulation body 1 and the third side surface of the photosensitive chip are the same side surface, and the third side surface S3 of the encapsulation body 1 is adjacent to the second side surface S2 and the first side surface S1 of the encapsulation body 1. Of course, the present invention is not limited to this. In other embodiments, the encapsulation body 1 may also include only one second lens 11 located on one side surface of the encapsulation body 1, which will not be described in detail here.

[0039] In some embodiments of the present invention, Figure 2 and Figure 3As shown, the first lens 10 is a spherical lens, and the second lens 11 is a nose bridge lens. Of course, the present invention is not limited to this. In other embodiments, such as Figure 4 and Figure 5 As shown, Figure 4 FIG. 1 is a schematic structural diagram of another optical receiver disclosed in an embodiment of the present invention. Figure 5 This is a schematic diagram of the structure of another optical receiver disclosed in an embodiment of the present invention. The first lens 10 can also be a nose-bridge-shaped lens, and the second lens 11 can also be a nose-bridge-shaped lens. In other embodiments, the first lens 10 can also be a spherical lens, and the second lens 11 can also be a spherical lens. These are not further described here.

[0040] It should be noted that if Figure 4 and Figure 5 As shown, the nose bridge lens includes a cylindrical lens 110 and a spherical lens 111 located on top of the cylindrical lens 110. It is understood that the shape of the lens in the embodiment of the present invention can be set according to needs and is not limited thereto.

[0041] In some embodiments of the present invention, Figure 4 and Figure 5 As shown, the first lens 10 completely covers the front surface of the encapsulant 1, and the second lens 11 completely covers the side surface of the encapsulant 1. Of course, the present invention is not limited to this. In other embodiments, such as Figure 6 and Figure 7 As shown, Figure 6 FIG. 1 is a schematic structural diagram of another optical receiver disclosed in an embodiment of the present invention. Figure 7 This is a structural schematic diagram of another optical receiver disclosed in an embodiment of the present invention, in which the first lens 10 partially covers the front of the encapsulation body 1, and the second lens 11 completely covers the side of the encapsulation body 1 and partially covers the front of the encapsulation body 1, so that part of the light converged by the second lens 11 is incident on the side of the photosensitive chip and part of the light is incident on the front of the photosensitive chip, so that the second lens 11 is the main lens for converging light.

[0042] It is understandable that the shape and size of the first lens 10 and the second lens 11 can be set according to needs, and the present invention is not limited to this. However, it is necessary to ensure that the optical center of the first lens 10 is set corresponding to the front of the photosensitive chip so that the light converged by the first lens 10 can be incident on the front of the photosensitive chip, and the optical center of any second lens 11 is set corresponding to a side surface of the photosensitive chip so that the light converged by any second lens 11 can be incident on a side surface of the photosensitive chip.

[0043] like Figure 8 and Figure 9 As shown, Figure 8This is a graph showing the relationship between the optical signal receiving angle and receiving sensitivity of a traditional infrared light receiver. Figure 9 is a graph showing the relationship between the optical signal receiving angle and the receiving sensitivity of the optical receiver in the embodiment of the present invention. It can be seen that the optical receiver in the embodiment of the present invention has a higher receiving sensitivity at the same receiving angle.

[0044] As an optional implementation of the contents disclosed in the present invention, an embodiment of the present invention discloses an optical receiving module, which includes a PCB board and an optical receiver disclosed in any of the above embodiments, wherein the pin portion of the optical receiver is electrically connected to the PCB board.

[0045] As an optional implementation of the present disclosure, an embodiment of the present disclosure discloses an electronic device including the light receiving module disclosed in the above embodiment. The electronic device can be used in smart home applications such as smartphones, tablet computers, and smart TVs.

[0046] The technical features of the above embodiments can be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0047] The above embodiments merely represent several implementation methods of this specification. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention. It should be noted that a person of ordinary skill in the art may make various modifications and improvements without departing from the scope of this specification, and these modifications and improvements fall within the scope of protection of this specification. Therefore, the scope of protection of the patent in this specification shall be subject to the appended claims.

Claims

1. An optical receiver, characterized in that include: Photosensitive chip; Encapsulation colloid; The photosensitive chip is encapsulated in the encapsulation body; the encapsulation body comprises at least a first lens located on the front of the encapsulation body and a second lens located on the side of the encapsulation body; the first lens and the second lens are arranged adjacent to each other; The first lens covers the front surface of the photosensitive chip, and the first lens is used to converge light and make the converged light incident on at least the front surface of the photosensitive chip; The second lens covers the side surface of the photosensitive chip, and is used to converge light and make the converged light incident on at least the side surface of the photosensitive chip; the front surface of the photosensitive chip and the side surface of the photosensitive chip are both photosensitive surfaces; The encapsulating body includes a first second lens located on a first side surface of the encapsulating body, a second second lens located on a second side surface of the encapsulating body, and a third second lens located on a third side surface of the encapsulating body; The first second lens, the second second lens and the third second lens respectively cover the first side surface, the second side surface and the third side surface of the photosensitive chip, the first second lens is used to converge light and make the converged light incident on at least the first side surface of the photosensitive chip, the second second lens is used to converge light and make the converged light incident on at least the second side surface of the photosensitive chip, and the third second lens is used to converge light and make the converged light incident on at least the third side surface of the photosensitive chip; The first side surface of the encapsulation body is the same side surface as the first side surface of the photosensitive chip, the second side surface of the encapsulation body is the same side surface as the second side surface of the photosensitive chip, the third side surface of the encapsulation body is the same side surface as the third side surface of the photosensitive chip, the second side surface of the encapsulation body is the surface opposite to the first side surface of the encapsulation body, and the third side surface of the encapsulation body is arranged adjacent to the second side surface and the first side surface of the encapsulation body.

2. The optical receiver according to claim 1, wherein The first lens includes a spherical lens, and the second lens includes a nose bridge lens; the nose bridge lens includes a cylindrical lens and a spherical lens located on the top of the cylindrical lens.

3. The optical receiver according to claim 1, wherein The first lens includes a nose bridge-shaped lens, and the second lens includes a nose bridge-shaped lens; the nose bridge-shaped lens includes a cylindrical lens and a spherical lens located on the top of the cylindrical lens.

4. The optical receiver according to claim 3, wherein The first lens completely covers the front of the encapsulant, and the second lens completely covers the side of the encapsulant; or, the first lens partially covers the front of the encapsulant, and the second lens completely covers the side of the encapsulant and partially covers the front of the encapsulant.

5. The optical receiver according to claim 1, wherein The optical receiver further comprises a lead frame, the lead frame comprising at least a supporting portion, a shielding portion and a plurality of pin portions; The photosensitive chip is fixed to the support portion and electrically connected to the plurality of pin portions; the support portion is encapsulated inside the encapsulation body, and the plurality of pin portions are led out from the fourth side surface of the encapsulation body; the fourth side surface of the encapsulation body is arranged opposite to the third side surface of the encapsulation body; The shielding part is bent from the third side surface of the encapsulation body to the front surface of the encapsulation body. The area of the shielding part corresponding to the first lens or the second lens has a light-transmitting hole, and the light-transmitting hole is used to transmit the light converged by the first lens or the second lens to the photosensitive chip.

6. The optical receiver according to claim 1, wherein The light receiver includes an infrared light receiver.

7. A light receiving module, characterized in that: The optical receiver comprises a PCB board and the optical receiver according to any one of claims 1 to 6, wherein the pins of the optical receiver are electrically connected to the PCB board.

8. An electronic device, characterized in that: Includes the light receiving module according to claim 7.

Citation Information

Patent Citations

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