An air-bridge array, method of manufacturing the same, and superconducting quantum device

Abstract

The application discloses an air bridge array, a manufacturing method thereof and a superconducting quantum device, and belongs to the field of superconducting circuits. The method rotates the target element around a first direction perpendicular to the surface of the mask pattern layer, deposits a first plating film material along a second direction, forms a reinforcing film layer on the side of each bridge deck support located in the deposition window, and forms a reinforcing support for the connection of the bridge deck formed by the plating film material on the bridge deck support based on the reinforcing film layer formed by the plating film material in the deposition window, so that the stability of the air bridge can be improved, and collapse caused by insufficient support strength of the bridge pier to the bridge deck can be prevented.

Description

Technical Field

[0001] This application belongs to the field of superconducting circuits, especially the field of superconducting quantum computing technology. In particular, this application relates to an air bridge array, its manufacturing method, and a superconducting quantum device. Background Technology

[0002] As the size of components integrated on quantum chips continues to shrink and their integration density continues to increase, the wiring strategy for quantum chips has become a critical issue. Air bridges, as suspended structures capable of connecting two or more devices, offer an option for achieving flexible wiring.

[0003] However, for array structures that include multiple air bridges, it is often difficult to perform deposition processes simultaneously to form an air bridge array with high structural stability because the extension directions of each air bridge are different. Invention Content

[0004] This application provides an air bridge array, its manufacturing method, and a superconducting quantum device, which can improve the stability of each air bridge and prevent the bridge piers from collapsing due to insufficient support strength to the bridge deck.

[0005] One embodiment of this application provides a method for manufacturing an air bridge array, including:

[0006] A mask pattern layer with multiple air bridge pattern units is formed on a target element. Each air bridge pattern unit includes two deposition windows that expose portions of the target element and a bridge support portion located between the two deposition windows. At least three deposition windows are non-collinearly distributed.

[0007] While rotating the target element about a first direction perpendicular to the surface of the mask pattern layer, a first coating material is deposited along a second direction inclined relative to the first direction to form a reinforcing film layer on the side of each of the bridge deck supports located within the deposition window;

[0008] A second coating material is deposited on the front surface of the bridge deck support opposite to the target element and on the exposed surface of the target element located within the deposition window, to form a first film layer on the front surface and a second film layer on the exposed surface, wherein both the first and second film layers are connected to the reinforcing film layer; and,

[0009] The first and second membrane layers are patterned to form an air bridge.

[0010] In some embodiments of the manufacturing method described above, a second coating material deposited on the front surface of the bridge deck support opposite to the target element and a second coating material deposited on the exposed surface of the target element located within the deposition window form an interconnect, such that the first film layer and the second film layer are interconnected and cover the reinforcing film layer.

[0011] In some embodiments of the manufacturing method described above, the sides of the bridge deck support located within the deposition window are all arc-shaped surfaces.

[0012] The manufacturing method described above, in some embodiments, further includes at least one of the following conditions:

[0013] The angle between the second direction and the first direction is 30° to 60°;

[0014] The direction in which the second coating material is deposited is the first direction;

[0015] The tangent at the junction of the side surface and the front surface makes an angle of 70° to 90° with the second direction;

[0016] The angle between the side surface and the surface of the target element is 30° to 50°.

[0017] In some embodiments of the manufacturing method described above, the step of patterning the first and second film layers to form an air bridge includes:

[0018] The first and second membrane layers define the portions for forming the air bridge, and a protective layer is formed to cover the portions.

[0019] Etching is used to disconnect the first and second film layers located outside the area covered by the protective layer from the portion.

[0020] In some embodiments of the manufacturing method described above, the mask pattern layer and / or the protective layer comprise photoresist.

[0021] In some embodiments of the manufacturing method described above, the first coating material and the second coating material comprise superconducting materials.

[0022] In some embodiments of the manufacturing method described above, the superconducting material comprises aluminum.

[0023] In some embodiments of the manufacturing method described above, the hardness of the first coating material is greater than that of the second coating material.

[0024] In some embodiments of the manufacturing method described above, the first coating material includes niobium, and the second coating material includes aluminum.

[0025] Another embodiment of this application provides an air bridge array including multiple air bridges, each air bridge including a bridge deck, piers and a reinforcing membrane layer. The piers are formed on both sides of the bridge deck and are connected to the bridge deck. The reinforcing membrane layer is connected to both the piers and the bridge deck, and at least three piers are non-collinearly distributed.

[0026] Another embodiment of this application provides a superconducting quantum device, including an air bridge array manufactured by the method described above, or an air bridge array as described above.

[0027] Compared with existing related technologies, this application achieves the following: First, a mask patterning layer with multiple air bridge patterning units is formed on the target element. Each air bridge patterning unit includes two deposition windows exposing portions of the target element and a bridge support portion located between the two deposition windows. At least two air bridge patterning units have the characteristic of "non-collinear distribution of deposition windows". Then, while rotating the target element around a first direction perpendicular to the surface of the mask patterning layer, a first coating material is deposited along a second direction to form a reinforcing film layer on the side of each bridge support portion located within the deposition window. Next, a second coating material is deposited on the front surface of the bridge support portion away from the substrate and on the surface of the target element located within the deposition window, and interconnected with the reinforcing film layer. Finally, patterning is performed to form air bridges, achieving the simultaneous fabrication of multiple air bridges.

[0028] The solution provided in this application involves rotating the target element around a first direction perpendicular to the surface of the mask pattern layer while depositing a first coating material along a second direction. This single deposition process forms a reinforcing film layer on the sides of each bridge deck support located within the deposition window. Furthermore, the connection between the bridge piers formed by the coating material within the deposition window and the bridge deck formed by the coating material on the bridge deck support is reinforced by this reinforcing film layer, thereby improving the structural stability of the air bridge and preventing deformation or collapse due to insufficient support strength of the bridge piers. Attached Figure Description

[0029] Figure 1 A schematic diagram illustrating an air bridge manufacturing method according to an embodiment of this application;

[0030] Figure 2 A flowchart illustrating an embodiment of the air bridge manufacturing method provided in this application;

[0031] Figures 3A to 3C A schematic diagram illustrating the manufacturing of an air bridge according to one embodiment of this application;

[0032] Figure 4 This is a schematic diagram of the structure of an air bridge provided in one embodiment of this application;

[0033] Figure 5 This is a schematic diagram illustrating a coating material provided in one embodiment of this application.

[0034] Explanation of reference numerals in the attached figures:

[0035] 1-Substrate,

[0036] 2-Superconducting layer, 21-First grounding layer, 22-Second grounding layer

[0037] 3-Mask pattern layer, 30-Air bridge pattern unit, 31-Bridge deck support, 32-Pier limiting part, 33-First deposition window, 34-Second deposition window

[0038] 4-Air bridge, 41-Bridge pier, 42-Bridge deck, 43-Reinforcing membrane layer

[0039] 5-Protective layer. Detailed Implementation

[0040] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the various embodiments of this application will be described in detail below with reference to the accompanying drawings. However, those skilled in the art will understand that many technical details have been provided in the various embodiments of this application to help readers better understand this application. However, the technical solutions claimed in this application can be implemented even without these technical details and various changes and modifications based on the following embodiments. The division of the various embodiments below is for the convenience of description and should not constitute any limitation on the specific implementation of this application. The various embodiments can be combined with and referenced by each other without contradiction.

[0041] It should be noted that the terms "comprising" and "having" and any variations thereof in the specification, claims and accompanying drawings of this application are intended to cover non-exclusive inclusion. For example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units that are explicitly listed, but may include other steps or units that are not explicitly listed or that are inherent to such process, method, product or device.

[0042] Additionally, it should be understood that when a layer (or film), region, pattern, or structure is referred to as being "on" a substrate, layer (or film), region, and / or pattern, it can be located directly on another layer or substrate, and / or intercalation layers may also be present. Furthermore, it should be understood that when a layer is referred to as being "under" another layer, it can be located directly under that layer, and / or one or more intercalation layers may also be present. Additionally, references to "on" and "under" the layers may be made based on the accompanying drawings.

[0043] For example, in a superconducting quantum chip, both the superconducting qubit circuit readout cavity and the qubit control signal line are coplanar waveguide transmission lines. The interruption of the ground plane by this transmission line causes a potential difference between the ground planes on both sides of the transmission line when a signal is input to the quantum chip, thereby exciting parasitic slot line modes and affecting the coherence of the qubits. With the large-scale increase in the number of qubits, this effect becomes increasingly prominent, severely limiting design work such as wiring. To solve this problem, it is necessary to eliminate the potential difference between the ground planes on both sides of the transmission line to eliminate the influence of potential inequality on decoherence time. An air bridge, as a suspended structure capable of connecting two or more devices, can connect the segmented ground planes on a two-dimensional plane. In specific implementations, it is not limited to this; an air bridge can be used to connect any two parts.

[0044] However, in current related technologies, when fabricating air bridges on thin film devices on substrates, a metal deposition process is often performed directly on the target device using a mask pattern layer to form the air bridge pattern. The air bridge obtained by this manufacturing process includes two piers and a bridge deck located on the two piers. The connection stability between the bridge deck and the piers affects the performance of the air bridge, and the structural stability is closely related to the film thickness at the connection.

[0045] Generally, multiple air bridges are arranged along the extension direction of the transmission line to connect the grounding layers on both sides of the transmission line. However, due to the large number of transmission lines involved in quantum chips, and the flexible arrangement and extension direction of each transmission line, the extension direction of the air bridges (which can be understood as the direction in which the piers of the air bridge are connected) is not entirely consistent. For air bridge array structures, there are often multiple air bridges with different extension directions. However, it is difficult to ensure the uniformity of the film formation when the coating material is deposited in the same direction. Air bridges with thinner film thickness are prone to collapse and deformation due to their own stress. Therefore, current related technologies are unable to form air bridge arrays with high structural stability in a simultaneous deposition process.

[0046] To address this, this application provides an air bridge array, its manufacturing method, and a superconducting quantum device, which can simultaneously fabricate multi-air bridge structures with high structural stability. This solves the problem in related technologies where it is often difficult to simultaneously perform deposition processes to form air bridge arrays with high stability due to the different extension directions of each air bridge.

[0047] Figure 1 This is a schematic diagram of an air bridge manufacturing method provided in one embodiment of this application.

[0048] Figure 2 A flowchart illustrating an embodiment of the air bridge manufacturing method provided in this application.

[0049] Figures 3A to 3C This is a schematic diagram illustrating an embodiment of the air bridge manufacturing method provided in this application.

[0050] Figure 4 This is a schematic diagram of the structure of an air bridge provided in one embodiment of this application.

[0051] Figure 5 This is a schematic diagram illustrating a coating material provided in one embodiment of this application.

[0052] Figures 3A to 3C , Figure 4 and Figure 5 by Figure 1 The Aa section of the air bridge graphic unit 30 is shown in the diagram.

[0053] Combination Figure 1 , Figure 2 and Figures 3A to 3C As shown in the embodiment of this application, a method for manufacturing an air bridge array is provided. The air bridge array includes multiple air bridges with different extension directions. The manufacturing method includes the following steps S100 to S400:

[0054] S100: A mask pattern layer 3 with multiple air bridge pattern units 30 is formed on the target element. Each air bridge pattern unit 30 includes two deposition windows (such as a first deposition window 33 and a second deposition window 34) exposing portions of the target element, and a bridge support portion 31 located between the two deposition windows. At least three deposition windows are non-collinearly distributed, meaning that at least two air bridge pattern units 30 in this array structure have the characteristic of "non-collinearly distributed deposition windows." It should be noted that the target element can be formed on the substrate 1, and a portion of the target element is connected using air bridges. For example,... Figure 3A As shown, a superconducting layer 2 is formed on the substrate 1. The superconducting layer 2 is divided by the central conductor of the coplanar wave transmission line to form a first ground layer 21 and a second ground layer 22. A portion of the first ground layer 21 and the second ground layer 22 is exposed by an air bridge pattern unit 30 (with a first deposition window 33 and a second deposition window 34). This portion is the exposed surface of the target element and needs to be connected by an air bridge. For example, the mask pattern layer 3 can be a photoresist with a specific shape structure after exposure and development. In specific implementation, it is not limited to this. As long as the formed air bridge pattern unit 30 can expose the area to be connected through the deposition window, it is acceptable. For example, the deposition window can be determined by the space defined by two parts of photoresist, such as by the bridge support part 31 and the pier limiting part 32.

[0055] S200: While rotating the target element about a first direction perpendicular to the surface of the mask pattern layer 3, a first coating material is deposited along a second direction inclined relative to the first direction to form a reinforcing film layer 43 on the side of each bridge deck support 31 located within the deposition window. Combined with... Figure 1 As shown, this step involves performing deposition while rotating the target element (e.g., by rotating the substrate about a first direction as an axis). This ensures that the sides of the bridge support 31 located within the non-collinearly distributed deposition windows can receive the deposited material, thereby achieving material deposition on each side of the bridge support 31. In particular, a reinforcing film 43 formed by depositing coating material can be deposited in the area near the front surface of this side, thereby ensuring the thickness of the coating through any air bridge pattern unit 30 to enhance the structural stability of the air bridge 4.

[0056] S300, on the front surface of the bridge deck support 31 opposite to the target element (i.e., as shown in the image) Figures 3A to 3C The top surface furthest from the target element (which is in the same plane) and the exposed surface of the target element located within the deposition window are deposited with a second coating material to form a first film layer on the positive surface and a second film layer on the exposed surface, and both the first and second film layers are connected to the reinforcing film layer 43.

[0057] S400, Pattern the first and second membrane layers to form an air bridge, referencing... Figure 3C and Figure 4 As shown, the air bridge includes piers 41 formed within the deposition window, a bridge deck 41 formed on the front surface of the bridge deck support 31, and a reinforcing film layer 43 (located on the inner side of the diagram) covered by the bridge deck 41 and piers 42. To obtain an air bridge independent of the mask pattern layer, in practice, the bridge deck support 31, the pier limiting portion 32, and the first and second coating materials located on the pier limiting portion 32 can also be removed.

[0058] Based on steps S100 to S400, the solution provided in this application first forms a reinforcing film layer 43 (e.g., by directionally depositing coating material on the side of the bridge deck support 31 of each air bridge graphic unit 30 during rotation) Figure 3B and 3C(As shown), then a second coating material is deposited on the front surface of the bridge deck support 31 and the exposed surface of the target element to form a first film layer and a second film layer, respectively. Then, a pattern is formed to obtain an air bridge, achieving the purpose of simultaneously manufacturing multiple air bridges. In addition, since the solution provided in this application rotates the target element in the plane around a first direction perpendicular to the surface of the mask pattern layer 3 while depositing the first coating material along the second direction, a reinforcement film layer 43 can be formed on the side of each bridge deck support 31 in a single deposition. The bridge piers 41 formed by the coating material in the deposition window are reinforced and strengthened on the bridge deck 42 formed by the coating material on the bridge deck support 31, thereby improving the structural stability of the air bridge 4 and preventing the bridge piers 41 from collapsing due to insufficient support strength of the bridge deck 42.

[0059] In implementing this embodiment, the deposition of the second coating material can be restricted, such that the second coating material deposited on the front surface of the bridge deck support 31 away from the target element and the second coating material deposited on the exposed surface of the target element within the deposition window form an interconnection, ensuring that the first film layer and the second film layer are interconnected (i.e., the first film layer and the second film layer are integrally deposited) and cover the reinforcing film layer 43. In some embodiments, the second coating material deposited on the front surface of the bridge deck support 31 away from the target element covers a portion of the reinforcing film layer 43, and the second coating material deposited on the surface of the target element within the deposition window covers the remaining portion of the reinforcing film layer 43. As a reinforcing structure, the reinforcing film layer 43 strengthens the structural stability of the connection between the bridge deck 42 (formed on the front surface of the bridge deck support 31) and the pier 41 (formed within the deposition window, i.e., within the first deposition window 33 and the second deposition window 34).

[0060] Reference Figure 4 and combined Figures 3A to 3C As shown, in some embodiments of this application, to improve the stability of the bridge pier 41 supporting the bridge deck 42, the sides of the bridge deck support 31 located within the deposition window are all arc-shaped. Compared to depositing coating material on steep sides, the film layer formed on the arc-shaped surface has the characteristics of thicker thickness, higher support strength, and relatively lower stress in the arc-shaped structure.

[0061] In one example, combining Figure 3A The tangent at the bottom of the side of the bridge support 31 shown has an angle of 30° to 50° with respect to the superconducting layer 2 on the substrate 1, such as 30°, 33°, 42°, 45°, 47°, and 50°. This angle represents the angle between the side and the surface of the superconducting layer 2. The angle formed by each side and the surface of the target element satisfies the aforementioned conditions.

[0062] In one example, combining Figure 1 and Figure 3B As shown, the angle between the second direction and the first direction is 30° to 60°, and the angle between the direction of depositing the second coating material and the first direction is 30° to 60°, such as 30°, 33°, 42°, 45°, 47°, 50°, 55°, 58°, and 60°.

[0063] In one example, when depositing the second coating material, it can be in a direction tilted relative to the first direction (e.g., Figure 1 The third-direction deposition shown is performed while rotating the target element about a first direction perpendicular to the surface of the mask pattern layer. In another example, to reduce the rotation operation, a second coating material can also be deposited in the first direction, such as... Figure 3B The third direction shown is perpendicular to the surface of the mask pattern layer 3.

[0064] Reference Figure 4 and combined Figures 3A to 3C As shown, in order to increase the thickness of the reinforcing membrane layer 43 to increase the stability of the connection between the pier 41 and the bridge deck 42, in one embodiment of this application, the tangent at the connection between the side of the bridge deck support 31 and the positive surface (as shown) Figure 3B The angle between the dotted line shown and the second direction is 70° to 90°, such as 70°, 72°, 76°, 79°, 83°, 86°, 89°, and 90°. These angles can be obtained by tilting the sample to be coated in the coating chamber of the evaporation equipment. Depositing the coating material at different angles ensures that the film thickness at each position of the air bridge 4 is not too thin.

[0065] Figure 5 This is a schematic diagram illustrating a coating material provided in one embodiment of this application.

[0066] In some embodiments of this application, the method further includes a step of patterning the deposited first and second coating materials to form an air bridge, such as: determining the region where the air bridge 4 to be formed is located, and forming a protective layer 5 in the region; etching to disconnect the first and second coating materials outside the area covered by the protective layer 5 from the first and second coating materials within the area covered by the protective layer 5. Specifically, patterning the first and second films to form an air bridge includes: determining portions of the first and second films for forming the air bridge, and forming a protective layer to cover the portions; etching to disconnect the first and second films located outside the area covered by the protective layer from the portions. In one embodiment, the protective layer 5 includes photoresist.

[0067] In some embodiments of this application, the first and second coating materials include superconducting materials. The superconducting material can be formed from superconducting materials that exhibit superconducting properties at temperatures equal to or below the critical temperature, such as approximately 10-100 millikrvin (mK) or approximately 4K, such as aluminum, niobium, tantalum, or titanium nitride, etc. In specific implementations, these are not limited to these types; any material exhibiting superconducting properties at temperatures equal to or below the critical temperature can be used for coating material deposition. In one example, the first coating material has a higher hardness than the second coating material. For example, the first coating material includes niobium, and the second coating material includes aluminum. In one embodiment, the first coating material includes a non-superconducting material, the second coating material includes a superconducting material, and the first coating material has a higher hardness than the second coating material, so that the reinforcing film layer formed by the first coating material promotes the stability of the overall air bridge structure.

[0068] Reference Figure 4 As shown, one embodiment of this application provides an air bridge array, comprising: multiple air bridges 4, each air bridge 4 including piers 41, a bridge deck 42, and a reinforcing membrane layer 43. The piers 41 are formed on both sides of the bridge deck 42 and are connected to the bridge deck 42. The reinforcing membrane layer 43 is connected to both the piers 41 and the bridge deck 42. At least three piers are non-collinearly distributed (i.e., at least two air bridges 4, where at least one pier 41 is not collinear with the other piers 41). Exemplarily, the reinforcing membrane layer 43 is formed at the connection point between the bridge deck 41 and the piers 42. Exemplarily, the piers 41 are formed on the portion of the superconducting layer 2 to be connected (first grounding layer 21 and second grounding layer 22) and are both connected to the bridge deck 41; and the reinforcing membrane layer 43 is formed at the connection point between the bridge deck 42 and the piers 41 and is connected to both the piers 41 and the bridge deck 42. In one embodiment, the bridge deck 41 and the pier 42 at least partially cover the reinforcing membrane layer 43. Exemplarily, in some embodiments, the bridge deck 42 covers a portion of the reinforcing membrane layer 43, and the pier 41 covers the remaining portion of the reinforcing membrane layer 43. In one example, after the bridge deck 42 and the pier 41 are joined to form an integral structure, this integral structure completely covers the reinforcing membrane layer 43. In one example, the air bridge array is manufactured according to the method described in the above embodiments, depositing a first coating material and a second coating material using a mask patterning layer according to the embodiments described above. Each air bridge patterning unit 30 can define an air bridge 4. In one example, the membrane thickness of the bridge deck 41 is less than the membrane thickness elsewhere on the air bridge 4. In one example, the hardness of the first coating material is greater than that of the second coating material, and the first coating material may include niobium, while the second coating material may include aluminum.

[0069] This application also provides a superconducting quantum device, which includes an air bridge array as described in the above air bridge array embodiment, or an air bridge array manufactured according to the method described in the above embodiment.

[0070] It should be noted that the above embodiments of superconducting quantum devices have the same beneficial effects as the above embodiments of the air bridge array manufacturing method, or have the same beneficial effects as the above embodiments of the air bridge array, and therefore will not be described in detail. For technical details not disclosed in the embodiments of the superconducting quantum devices of this application, those skilled in the art should refer to the description of the above manufacturing method for understanding; for the sake of brevity, they will not be repeated here.

[0071] Although embodiments of this application have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the claims and their equivalents.

[0072] The above description, based on the embodiments shown in the drawings, details the structure, features, and effects of this application. The above description is only a preferred embodiment of this application, but this application does not limit the scope of implementation to what is shown in the drawings. Any changes made in accordance with the concept of this application, or modifications to equivalent embodiments, that do not exceed the spirit covered by the specification and drawings, should be within the protection scope of this application.

Claims

1. A method of fabricating an air-bridge array, characterized by, include: A mask pattern layer with multiple air bridge pattern units is formed on a target element. Each air bridge pattern unit includes two deposition windows that expose portions of the target element and a bridge support portion located between the two deposition windows. At least three deposition windows are non-collinearly distributed. While rotating the target element about a first direction perpendicular to the surface of the mask pattern layer, a first coating material is deposited along a second direction inclined relative to the first direction to form a reinforcing film layer on the side of each of the bridge deck supports located within the deposition window; A second coating material is deposited on the front surface of the bridge deck support opposite to the target element and on the exposed surface of the target element located within the deposition window, to form a first film layer on the front surface and a second film layer on the exposed surface, wherein both the first and second film layers are connected to the reinforcing film layer; and, The first and second membrane layers are patterned to form an air bridge.

2. The production method according to claim 1, characterized by The second coating material deposited on the front surface of the bridge deck support opposite to the target element and the second coating material deposited on the exposed surface of the target element located within the deposition window form an interconnect, such that the first film layer and the second film layer are interconnected and cover the reinforcing film layer.

3. The production method according to claim 2, characterized by The sides of the bridge deck support located within the deposition window are all curved surfaces.

4. The production method according to any one of claims 1 to 3, characterized by, It also includes at least one of the following conditions: The angle between the second direction and the first direction is 30° to 60°; The direction in which the second coating material is deposited is the first direction; The tangent at the junction of the side surface and the front surface makes an angle of 70° to 90° with the second direction; The angle between the side surface and the surface of the target element is 30° to 50°.

5. The production method according to claim 1, characterized by The step of patterning the first and second film layers to form an air bridge includes: The first and second membrane layers define the portions for forming the air bridge, and a protective layer is formed to cover the portions. Etching is used to disconnect the first and second film layers located outside the area covered by the protective layer from the portion.

6. The production method according to claim 5, wherein The mask patterning layer and / or the protective layer include photoresist.

7. The production method according to claim 1, wherein The first coating material and the second coating material include superconducting materials.

8. The manufacturing method according to claim 7, wherein The superconducting material includes aluminum.

9. The production method according to claim 7, wherein The hardness of the first coating material is greater than that of the second coating material.

10. The manufacturing method according to claim 9, characterized in that, The first coating material includes niobium, and the second coating material includes aluminum.

11. An air bridge array, characterized in that, The system includes multiple air bridges, each air bridge comprising a bridge deck, piers, and a reinforcing membrane layer. The piers are formed on both sides of the bridge deck and are connected to the bridge deck. The reinforcing membrane layer is connected to both the piers and the bridge deck, and at least three piers are non-collinearly distributed. The reinforcing membrane layer is covered by the bridge deck and the piers.

12. A superconducting quantum device, characterized in that, Includes an air bridge array manufactured by the method according to any one of claims 1 to 10, or includes the air bridge array according to claim 11.

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