MICRO-FABRICATED AIR BRIDGES FOR QUANTUM SWITCHES
Patent Information
- Authority / Receiving Office
- DE · DE
- Patent Type
- Patents
- Current Assignee / Owner
- INTERNATIONAL BUSINESS MACHINE CORPORATION
- Filing Date
- 2020-12-14
- Publication Date
- 2026-05-13
AI Technical Summary
Superconducting quantum processors face issues with parasitic slot-line modes in coplanar waveguides leading to signal loss and decoherence, which conventional airbridges fail to adequately address during fabrication.
A method for fabricating a bridge structure in a quantum mechanical device involves depositing a first superconducting material on a substrate, forming trenches to create insulated portions, and connecting these with a second superconducting material using a strip, followed by removing a sacrificial layer to form a bridge that electrically connects desired portions while isolating others, using materials like niobium or aluminum for the first superconducting material and titanium or titanium nitride for the sacrificial layer.
This approach effectively eliminates spurious modes in planar microwave circuits, reduces signal loss, and enhances yield by allowing different materials for the bridge structure, providing flexibility and reducing fabrication complexity.