Integrated circuit chip pin shaping fixture

Abstract

The present invention provides a pin shaping fixture for an integrated circuit chip. The integrated circuit chip pin shaping fixture comprises: a first body having a first cavity, a first loading part detachably arranged in the first cavity, and a second body. The first loading part has at least one second cavity. The integrated circuit chip pin shaping fixture in the present application has a simple structure and is easy to operate, which solves the problem of non-coplanarity of the pins of ceramic packaged integrated circuit chips, and performs pin shaping in batches, so that the appearance quality of the integrated circuit chips meets user requirements. In addition, the integrated circuit chip pin shaping fixture of the present application has high efficiency in pin shaping and significant effect of pin shaping. During the pin shaping process of the integrated circuit chip pin shaping fixture, the convex surface of the integrated circuit chip is close to the bottom surface of the second cavity, which can ensure that the integrated circuit chip body is not scratched during the shaping process and does not cause secondary damage to the integrated circuit chip, and can also quickly and efficiently achieve the shaping of the chip pins.

Description

Technical Field

[0001] The invention relates to the field of integrated circuit packaging, in particular to an integrated circuit chip pin shaping fixture. Background Art

[0002] In the field of integrated circuit packaging, the pins of integrated circuit packaging products may be deformed to varying degrees during different production process steps, resulting in irregular pin shapes or pin welding surfaces not being on the same plane. During product use, the coplanarity of the welding leads does not meet the requirements, resulting in quality problems such as welding failure or cold welding. The pin coplanarity problem has led to multiple returns, with large batches and large quantities.

[0003] In the traditional solution, in order to meet the coplanarity requirements of the pins of integrated circuit packaging products, inspectors need to use packaging tools such as flat-nose pliers to manually shape the pins, and use glass plates to observe and inspect based on experience. Due to the large number of batches and quantities of integrated circuit packaging products, and the tight rework time, the flat-nose pliers shaping method cannot complete the inspection task on time, and it is also difficult to shape the pins to the flatness required by the user. In order to ensure the delivery deadline, overtime shaping and packaging are required. In addition, the manual shaping and visual observation method also has disadvantages. There is no unified standard, there are differences in judgment, and long-term inspections are bound to result in errors and omissions. Summary of the invention

[0004] The purpose of the present invention is to provide an integrated circuit chip pin shaping fixture, which can save time and labor, and can completely solve the problem of pin coplanarity shaping, thereby greatly improving work efficiency.

[0005] The integrated circuit chip pin shaping fixture provided by the present application can improve the appearance quality of integrated circuit chip products. In addition, the integrated circuit chip pin shaping fixture provided by the present application can meet the coplanar shaping of ceramic flat and ceramic surface mount bent lead series packaging products.

[0006] An integrated circuit chip pin shaping fixture, comprising:

[0007] A first body having a first cavity;

[0008] a first loading portion, used for loading integrated circuit chips, the first loading portion being detachably disposed in the first cavity; when the first loading portion is installed in the first cavity, the top surface of the first body is flush with the top surface of the first loading portion;

[0009] A second body is rotatably connected to the first body, and a surface of the second body in contact with the first body is a plane;

[0010] The integrated circuit chip includes a package having an internal circuit and pins for connecting to a peripheral circuit; the first loading part has at least one second cavity, the package of the integrated circuit chip is located in the second cavity, the pins of the integrated circuit chip are located in a non-cavity portion of the first loading part, and the convex surface of the integrated circuit chip is close to the bottom surface of the second cavity, and the patch surface of the integrated circuit chip is close to the bottom surface of the second body;

[0011] The integrated circuit chip pin shaping fixture has the following working states:

[0012] No-load closed state: the first body and the second body are stacked, and the second body has flat contact surfaces with the first body and the first loading portion respectively;

[0013] No-load open state: the first body and the second body have a first angle, 10°≤the first angle≤150°, and the first loading part can be drawn out of the first body;

[0014] Chip installation state: the first loading part is extracted from the first body, and one or more integrated circuit chips are installed in the first loading part by manual or machine operation;

[0015] Full load closed state: the bottom surface of the second body is in direct contact with the pins of the integrated circuit chip, so as to flatten the pins of the integrated circuit chip.

[0016] In one embodiment, the first cavity is a cavity with three-sided cavity walls, and the first loading part is pushed into or removed from a side of the first cavity without cavity walls;

[0017] Two mutually parallel inner cavity walls of the first cavity match the outer side surface of the first loading portion, so that the first loading portion can freely enter and exit the first cavity.

[0018] In one embodiment, the integrated circuit chip is FP, CFP, SOP, CSOP, the chip length in the pin arrangement direction of the integrated circuit chip is a first length L1, the chip length in the pin extension direction of the integrated circuit chip is a second length L2, and the length of the pin of the integrated circuit chip beyond the chip is L3;

[0019] The length of the second cavity in the first loading portion is Lc, Lc>m*L1, m is a proportionality coefficient, and the value of m is a positive integer;

[0020] The width of the second cavity in the first loading portion is W, L2≤W≤L2+0.05mm;

[0021] The thickness of the integrated circuit chip is TH1, the depth of the second cavity is D1, and TH1<D1.

[0022] In one embodiment, the integrated circuit chip is an integrated circuit chip packaged in QFP, ‌LQFP, or PQFP;

[0023] The second cavity is a plurality of hollow grooves arranged at intervals, the side length of the hollow groove is a1, the side length of the integrated circuit chip is a, and a≤a1≤(1+15%)*a.

[0024] In one embodiment, the integrated circuit chip is an integrated circuit chip packaged in QFP, ‌LQFP, or PQFP;

[0025] The second cavity is a hollow groove;

[0026] The integrated circuit chip pin shaping fixture also includes:

[0027] A rotating adsorbent, which is disposed on the first body and can leak out of the second cavity, and is used for adsorbing and rotating the integrated circuit chip;

[0028] The integrated circuit chip pin shaping fixture comprises the following steps in the process of implementing the integrated circuit chip pin shaping:

[0029] First no-load open state: the rotating adsorption body rises to a position higher than the top surface of the first loading portion;

[0030] First chip mounting state: after the rotating adsorbent adsorbs the integrated circuit chip, it descends to a position lower than the top surface of the first loading portion to place the integrated circuit chip on the first loading portion, the convex surface of the integrated circuit chip is located in the second cavity, and at least two rows of pins of the integrated circuit chip are in contact with the non-cavity portion of the first loading portion;

[0031] First full-load closed state: the bottom surface of the second body is in direct contact with the pins of the integrated circuit chip, and is used to flatten at least two rows of pins of the integrated circuit chip;

[0032] Second no-load open state: the rotating adsorption body rises to a position higher than the top surface of the first loading portion;

[0033] The second chip mounting state: after the rotating adsorbent adsorbs the integrated circuit chip, it rotates 90 degrees clockwise or counterclockwise, and the rotating adsorbent adsorbs the integrated circuit chip after adsorbing and rotating to a level lower than the top surface of the first loading part, so as to place the integrated circuit chip on the first loading part, and the convex surface of the integrated circuit chip is located in the second cavity, and at least two rows of pins of the integrated circuit chip are in contact with the non-cavity part of the first loading part; in this state, among the at least two rows of pins in contact with the non-cavity part of the first loading part, at least one row is the pin that has not been flattened in the first full-load closed state;

[0034] Second full-load closing state: the bottom surface of the second body is in direct contact with the pins of the integrated circuit chip, so as to flatten at least two columns of pins of the integrated circuit chip.

[0035] In one embodiment, the rotating adsorption body comprises:

[0036] A first driver, providing power in a first direction, for realizing the rising and falling of the integrated circuit chip;

[0037] a second driver, providing a rotational force for rotating the integrated circuit chip clockwise or counterclockwise, and

[0038] An adsorption structure, one end of which is connected to the first driver and the second driver respectively, and the other end of which is connected to the integrated circuit chip.

[0039] In one embodiment, the integrated circuit chip pin shaping fixture further comprises:

[0040] a handle, disposed on the first body; and

[0041] The base is arranged on a surface of the second body away from the first body. The handle and the base are made of a material with greater mass. The handle is used to control the opening and closing angle of the first body.

[0042] In one embodiment, the first body and the second body are connected via a shaft connection or a hinge.

[0043] In one embodiment, the first body, the first loading portion and the second body are made of polypropylene material.

[0044] In one embodiment, the integrated circuit chip is a ceramic packaged integrated circuit chip, and the ceramic packaged integrated circuit chip includes FP, CFP, SOP, CSOP, QFP, ‌LQFP, and PQFP packaging forms.

[0045] The present invention has at least the following advantages or beneficial effects:

[0046] 1. The integrated circuit chip pin shaping fixture provided in the present application has a simple structure and is easy to operate. It can solve the problem of non-coplanar pins of ceramic packaged integrated circuit chips, and perform integrated circuit chip pin shaping in batches, so that the appearance quality of the integrated circuit chips meets user requirements. Compared with manual operation, the integrated circuit chip pin shaping fixture has high efficiency in pin shaping and significant pin shaping effect. In addition, during the pin shaping process of the integrated circuit chip pin shaping fixture, the convex surface of the integrated circuit chip is close to the bottom surface of the second cavity, which can ensure that the integrated circuit chip body is not scratched during the shaping process and will not cause secondary damage to the integrated circuit chip, and can quickly and efficiently achieve the shaping of the chip pins.

[0047] 2. The overall structural dimensions of the integrated circuit chip pin shaping fixture provided in the present application can be specially designed according to the structural dimensions of the integrated circuit chip, the shape of the first loading part can also be set by itself, and the number of second cavities in the first loading part can also be specifically designed according to the number of integrated circuit chips that need to be shaped.

[0048] 3. The integrated circuit chip pin shaping fixture provided in the present application can also be provided with a rotating adsorbent for integrated circuit chips with pins on four sides of the package body, so that one group of pins can be shaped first, and then another group of pins can be shaped.

[0049] 4. The integrated circuit chip pin shaping fixture provided in the present application, the handle and the base cooperate so that the integrated circuit chip pin shaping fixture will not flip or tilt when in the unloaded open state even without manual assistance. In addition, the base may also include a lap portion (not shown) for carrying the first body when the integrated circuit chip pin shaping fixture is in the unloaded open state and the chip installation state.

[0050] 5. The integrated circuit chip pin shaping fixture provided in this application can meet the coplanar pin shaping needs of semiconductor integrated circuits with 8 leads, 14 leads, 16 leads, 18 leads, 20 leads, 24 leads, ceramic flat, ceramic surface mount bent leads, and series packaged integrated circuits, and can fully meet the pin coplanarity shaping needs during the integrated circuit production process.

[0051] 6. The integrated circuit chip pin shaping fixture provided in this application, through the development of a non-coplanar shaping fixture for ceramic packaged integrated circuit chip pins, fundamentally solves the shaping problem of non-coplanar pins of ceramic packaged integrated circuit products, and realizes the batch coplanar shaping of ceramic packaged integrated circuit chip pins, thereby improving work efficiency, making operation faster and more convenient, avoiding the problem of product appearance misinspection, and ensuring that product quality meets customer needs.

[0052] 7. In this application, since the surface of the ceramic packaged integrated circuit is gold-plated, it is easy to be scratched and the pins are easy to deform. Therefore, anti-static materials, more specifically polypropylene materials, are selected to ensure that the product is not scratched during the shaping process, causing secondary damage. BRIEF DESCRIPTION OF THE DRAWINGS

[0053] In order to more clearly illustrate the specific implementation methods of the present invention or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0054] Figure 1 A first diagram of an integrated circuit chip lead shaping fixture provided by a first embodiment of the present invention;

[0055] Figure 2 A second diagram of the integrated circuit chip lead shaping fixture provided by the first embodiment of the present invention;

[0056] Figure 3 The third figure - side view of the integrated circuit chip lead shaping fixture provided by the first embodiment of the present invention;

[0057] Figure 4 FIG4 is a top view of the integrated circuit chip lead shaping fixture provided by the first embodiment of the present invention;

[0058] Figure 5 A first diagram of an integrated circuit chip lead shaping fixture provided by a second embodiment of the present invention;

[0059] Figure 6 A second diagram of the integrated circuit chip lead shaping fixture provided by the second embodiment of the present invention;

[0060] Figure 7 A first diagram of an integrated circuit chip lead shaping fixture provided by a third embodiment of the present invention;

[0061] Figure 8 A second diagram of an integrated circuit chip lead shaping fixture provided by a third embodiment of the present invention;

[0062] Fig. 9 A third diagram of an integrated circuit chip lead shaping fixture provided by a third embodiment of the present invention;

[0063] Fig.10 FIG4 is a fourth diagram of an integrated circuit chip lead shaping fixture provided by a third embodiment of the present invention;

[0064] Fig.11FIG5 is a fifth diagram of an integrated circuit chip lead shaping fixture provided by a third embodiment of the present invention;

[0065] Fig.12 A top view of the first loading portion after loading the integrated circuit chip provided by the fourth embodiment of the present invention;

[0066] Fig.13 A top view of the first loading unit after loading the integrated circuit chip provided by the fifth embodiment of the present invention;

[0067] Fig.14 A top view of the first loading portion after loading the integrated circuit chip provided by the sixth embodiment of the present invention;

[0068] Fig.15 A top view of a first chip mounted state after the first loading portion is loaded with an integrated circuit chip according to a seventh embodiment of the present invention;

[0069] Fig.16 A top view of a second chip mounted state after the first loading portion is loaded with an integrated circuit chip according to a seventh embodiment of the present invention.

[0070] icon:

[0071] Integrated circuit chip pin shaping fixture 100:

[0072] The first body 10, the base 10a, has a first cavity 11, a first loading portion 12, a second cavity 12a, a push-pull assembly 12b, a second body 20, and a handle 20a.

[0073] Integrated circuit chip 200: package body 210, pins 220. DETAILED DESCRIPTION

[0074] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings here can be arranged and designed in various different configurations.

[0075] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the invention claimed for protection, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0076] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0077] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inside", "outside", etc. indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, or the positions or positional relationships in which the product of the invention is usually placed when in use. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific position, be constructed and operated in a specific position, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", "third", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.

[0078] In addition, the terms "horizontal", "vertical" and the like do not mean that the components are required to be absolutely horizontal or suspended, but can be slightly tilted. For example, "horizontal" only means that its direction is more horizontal than "vertical", and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0079] In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0080] See also Figures 1 to 11 The present application provides an integrated circuit chip pin shaping fixture 100, wherein Figure 1-Figure 4 is a schematic diagram of the first embodiment, Figure 5-Figure 6 is a schematic diagram of a second embodiment, Figure 7-Figure 11 1 is a schematic diagram of the third embodiment. The integrated circuit chip pin shaping fixture 100 comprises: a first body 10 having a first cavity 11, a second body 20 and a first loading portion 12. The first and second embodiments are applied to an integrated circuit chip 200 having pins 220 on both sides of a package body 210 (for the specific structure of the integrated circuit chip 200, please refer to Figures 12 to 16 ), and in the first and second embodiments, only one second cavity 12a is provided in the first loading portion 12. The third embodiment is applied to an integrated circuit chip 200 having pins 220 on four sides of a package body 210, and in the third embodiment, three second cavities 12a are provided in the first loading portion 12. Figure 1-Figure 4 The illustrated first embodiment does not include the base 10a. Figure 5-Figure 6 The illustrated second embodiment includes a base 10a.

[0081] The first cavity 11 in the first body 10 may be a cavity having four side walls and one bottom wall. The first cavity 11 may also be a cavity having three side walls and one bottom wall, similar to a drawer-type cavity.

[0082] The first loading part 12 is used to load the integrated circuit chip 200. The first loading part 12 is detachably arranged in the first cavity 11. When the first loading part 12 is installed in the first cavity 11, the top surface of the first body 10 is flush with the top surface of the first loading part 12. A handle can be provided on the outer side wall of the first loading part 12 to facilitate the first loading part 12 to be pulled out from the first cavity 11. The first loading part 12 can have one or more second cavities 12a. The second cavity 12a can be a cavity with four side walls and a bottom wall. The second cavity 12a can also be a cavity with three side walls and a bottom wall, similar to a drawer-type cavity. In addition, the shape of the second cavity 12a is variable, such as a cavity in the shape of a cube, or a cavity in the shape of a cuboid. For example, the second cavity 12a can be set to a 3*3 cavity array. In some embodiments, a push-pull assembly 12b is provided at the pull-out end of the first loading part 12 to facilitate the placement of the first loading part 12 in the first cavity 11.

[0083] The second body 20 is rotatably connected to the first body 10, and the surface of the second body 20 in contact with the first body 10 is a plane. The integrated circuit chip 200 includes a package body 210 having an internal circuit and pins 220 for connecting with a peripheral circuit. The first loading part 12 has at least one second cavity 12a, the package body 210 of the integrated circuit chip 200 is located in the second cavity 12a, the pins 220 of the integrated circuit chip 200 are located in the non-cavity part of the first loading part 12, and the convex surface of the integrated circuit chip 200 is close to the bottom surface of the second cavity 12a, and the patch surface of the integrated circuit chip 200 is close to the bottom surface of the second body 20. That is, the chip body of the integrated circuit chip 200 is placed in the second cavity 12a, and the chip body of the integrated circuit chip 200 protrudes downward, that is, the integrated circuit chip 200 is inverted in the second cavity 12a, which can protect the surface gold plating of the integrated circuit chip 200, avoid scratches on the surface of the integrated circuit chip 200, and also avoid deformation caused by excessive pressure between the first body 10 and the second body 20.

[0084] The integrated circuit chip pin shaping fixture 100 has the following working states:

[0085] No-load closed state: the first body 10 and the second body 20 are stacked, and the second body 20 has flat contact surfaces with the first body 10 and the first loading portion 12. The bottom surface of the second body 20 contacts the top surface of the first body 10 and the top surface of the first loading portion 12 respectively.

[0086] No-load open state: the first body 10 and the second body 20 have a first angle, 10°≤first angle≤150°, and the first loading part 12 can be pulled out from the first body 10. The size of the first angle depends on the size, shape and installation method of the first loading part 12. When the volume of the first loading part 12 is large and needs to be installed vertically, the first loading part 12 needs to be opened at a large angle. It should be noted that 10°≤first angle≤150° is only a solution used in some embodiments of the present application. In other embodiments, the first angle can be larger, for example, the first angle can be 180°, 240°, 270° or larger.

[0087] Chip installation state: the first loading part 12 is extracted from the first body 10, and one or more integrated circuit chips 200 are installed in the first loading part 12 by manual or machine operation. The package body 210 of the integrated circuit chip 200 is located in the second cavity 12a, the pins 220 of the integrated circuit chip 200 are located in the non-cavity part of the first loading part 12, and the convex surface of the integrated circuit chip 200 is close to the bottom surface of the second cavity 12a, and the patch surface of the integrated circuit chip 200 is close to the bottom surface of the second body 20.

[0088] Full load closed state: the bottom surface of the second body 20 is in direct contact with the pins 220 of the integrated circuit chip 200 , so as to flatten the pins 220 of the integrated circuit chip 200 .

[0089] The integrated circuit chip pin shaping fixture 100 provided in this embodiment has a simple structure and is easy to operate. It can solve the problem that the pins 220 of the ceramic packaged integrated circuit chip 200 are not coplanar, and the integrated circuit chip pins are shaped in batches, so that the appearance quality of the integrated circuit chip 200 meets the user's requirements. In addition, compared with manual operation, the efficiency of shaping the pins 220 of the integrated circuit chip pin shaping fixture 100 is high, and the effect of shaping the pins 220 is significant. In addition, during the shaping process of the pins 220 of the integrated circuit chip pin shaping fixture 100, the convex surface of the integrated circuit chip 200 is close to the bottom surface of the second cavity 12a, which can ensure that the integrated circuit chip 200 body is not scratched during the shaping process, and will not cause secondary damage to the integrated circuit chip 200, and can quickly and efficiently achieve the shaping of the chip pins 220.

[0090] The integrated circuit chip pin shaping fixture 100 provided in the present application can meet the coplanarity shaping of pins 220 of semiconductor integrated circuits with 8 leads, 14 leads, 16 leads, 18 leads, 20 leads, and 24 leads of ceramic flat, ceramic surface-mount bent leads, and series packaged integrated circuits, and can fully meet the coplanarity shaping requirements of pins 220 during the integrated circuit production process.

[0091] In the present application, by developing a non-coplanar shaping fixture for the pins of ceramic packaged integrated circuit chips, the problem of non-coplanar shaping of the pins 220 of ceramic packaged integrated circuit products is fundamentally solved, and batch shaping of the coplanar pins of ceramic packaged integrated circuit chips is achieved, which improves work efficiency, makes operation faster and more convenient, avoids the problem of incorrect or missed inspection of product appearance, and ensures that product quality meets customer needs.

[0092] In one embodiment, the first cavity 11 is a cavity with three walls, and the first loading part 12 is pushed in or removed from the side of the first cavity 11 without the wall. The two inner walls of the first cavity 11 parallel to each other match the outer side of the first loading part 12, so that the first loading part 12 can freely enter and exit the first cavity 11.

[0093] In this embodiment, the first cavity 11 is configured to have a structure with three side walls, and the structural dimensions of the first loading portion 12 can effectively control the opening and closing angle of the first body 10. That is, when the first body 10 is opened at a small angle, the first loading portion 12 in the first cavity 11 can be pushed in or removed.

[0094] See also Fig.12 and Fig.13 In one embodiment, the integrated circuit chip 200 is a CSOP package chip and an F package chip, for example, the integrated circuit chip 200 can be set to FP, CFP, SOP or CSOP. The chip length in the arrangement direction of the pins 220 of the integrated circuit chip 200 is a first length L1, the chip length in the extension direction of the pins 220 of the integrated circuit chip 200 is a second length L2, and the length of the pins 220 of the integrated circuit chip 200 beyond the chip is L3.

[0095] The length of the first loading part 12 is L0, and the length of the second cavity 12a is Lc, Lc>m*L1, m is the proportional coefficient, and the value of m is a positive integer. The width of the second cavity 12a in the first loading part 12 is W, L2≤W≤L2+0.05mm. The thickness of the integrated circuit chip 200 is TH1, and the depth of the second cavity 12a is D1, TH1<D1. The second cavity 12a can be set as a U-shaped groove or a hollow groove. The length Lc of the second cavity 12a can be equal to L0, or the length Lc of the second cavity 12a is less than L0 but greater than the length of L1. The multiple integrated circuit chips 200 loaded into the second cavity 12a of the first loading part 12 can be tightly connected or have a certain gap.

[0096] In this embodiment, a design scheme for the specific relationship between the first loading portion 12 and the second cavity 12a for CSOP packaged chips and F packaged chips is provided. In the connection relationship between the first loading portion 12 and the second cavity 12a provided in this embodiment, it can be applicable to FP, CFP, SOP or CSOP packaged chips, and can realize the shaping of their pins 220.

[0097] See also Fig.14 In one embodiment, the integrated circuit chip 200 is an integrated circuit chip 200 packaged in a QFP package. For example, the integrated circuit chip 200 can be configured as a QFP, an LQFP, or a PQFP.

[0098] The second cavity 12a is a plurality of hollow grooves arranged at intervals, the side length of the hollow groove is a1, the side length of the integrated circuit chip 200 is a, a≤a1≤(1+15%)*a, which can ensure that most of the length of the pin 220 is mounted on the first loading part 12.

[0099] In this embodiment, a matching first loading part 12 is provided according to the model characteristics of the integrated circuit chip 200 , and the pins 220 of the integrated circuit chips 200 of different models can be reshaped by simply replacing the structure of the first loading part 12 .

[0100] See also Fig.15 and Fig.16 In one embodiment, the integrated circuit chip 200 is an integrated circuit chip 200 packaged in a QFP package. For example, the integrated circuit chip 200 can be configured as a QFP, an LQFP, or a PQFP.

[0101] The second cavity 12 a is a hollow groove, that is, the cavity bottom of the first cavity 11 in the first body 10 (that is, the top surface of the first body 10 at the cavity position) can leak out from the hollow groove of the second cavity 12 a of the first loading part 12 . Fig.15 and Fig.16In the embodiment, the first loading portion 12 is provided with three second cavities 12a, and the three second cavities 12a are all provided through the length (i.e., the cavities extend to the edge of the first loading portion 12). In other embodiments, the three second cavities 12a may also be provided so as not to extend to the edge of the first loading portion 12.

[0102] The integrated circuit chip pin shaping fixture 100 further includes a rotating adsorption body (not shown).

[0103] The rotating adsorbent is disposed on the first body 10 (at the bottom of the first cavity 11 ) and can leak out of the second cavity 12 a to adsorb and rotate the integrated circuit chip 200 .

[0104] The integrated circuit chip pin shaping fixture 100 includes the following usage states in the process of implementing the integrated circuit chip pin shaping:

[0105] First no-load open state: the rotating adsorption body rises to be higher than the top surface of the first loading part 12 .

[0106] First chip mounting state: after the rotating adsorbent adsorbs the integrated circuit chip 200, it descends to below the top surface of the first loading part 12 to place the integrated circuit chip 200 in the first loading part 12, the convex surface of the integrated circuit chip 200 is located in the second cavity 12a, and at least two rows of pins 220 of the integrated circuit chip 200 are in contact with the non-cavity part of the first loading part 12.

[0107] First full-load closing state: the bottom surface of the second body 20 is in direct contact with the pins 220 of the integrated circuit chip 200 , so as to flatten at least two columns of pins 220 of the integrated circuit chip 200 .

[0108] Second no-load open state: the rotating adsorption body rises to be higher than the top surface of the first loading part 12 .

[0109] Second chip mounting state: After the rotating adsorbent adsorbs the integrated circuit chip 200, it rotates 90° clockwise or counterclockwise, and the rotating adsorbent adsorbs the integrated circuit chip 200 and lowers it to below the top surface of the first loading part 12, so that the integrated circuit chip 200 is placed in the first loading part 12, and the convex surface of the integrated circuit chip 200 is located in the second cavity 12a, and at least two rows of pins 220 of the integrated circuit chip 200 are in contact with the non-cavity part of the first loading part 12. In this state, among the at least two rows of pins 220 in contact with the non-cavity part of the first loading part 12, at least one row is the pins 220 that are not flattened in the first full-load closed state.

[0110] Second full-load closing state: the bottom surface of the second body 20 is in direct contact with the pins 220 of the integrated circuit chip 200 , so as to flatten at least two columns of pins 220 of the integrated circuit chip 200 .

[0111] In this embodiment, a pin 220 shaping fixture for an integrated circuit chip 200 packaged in a QFP package is provided. The core improvement lies in the provision of a rotating adsorbent, one rotating adsorbent corresponds to one integrated circuit chip 200, and can shape the pins 220 of one set of opposite sides of the integrated circuit chip 200 before rotation, and shape the pins 220 of another set of opposite sides of the integrated circuit chip 200 after rotation.

[0112] In one embodiment, the rotating adsorption body includes: a first driver, a second driver and an adsorption structure.

[0113] The first driver provides power in a first direction for realizing the rise and fall of the integrated circuit chip 200. The first driver may be a cylinder having a contact surface with the integrated circuit chip 200 for moving the integrated circuit chip 200 upward or downward.

[0114] The second driver provides a rotational force for realizing clockwise or counterclockwise rotation of the integrated circuit chip 200. The second driver can be configured as a rotating shaft driven by a motor.

[0115] One end of the adsorption structure is connected to the first driver and the second driver respectively, and the other end of the adsorption structure is connected to the integrated circuit chip 200. The adsorption structure adsorbs the convex surface of the integrated circuit chip 200, and the integrated circuit chip 200 is lifted and lowered, and rotated clockwise or counterclockwise through the first driver and the second driver.

[0116] In this embodiment, a pin 220 shaping fixture for a QFP packaged integrated circuit chip 200 is provided. The specific structure of the rotating adsorbent is refined, and the rotating adsorbent provided in this embodiment can be more effectively applied to packaged chips suitable for QFP, ‌LQFP, and PQFP, and can achieve shaping of the pins 220 thereof.

[0117] In one embodiment, the integrated circuit chip pin shaping fixture 100 further includes: a base 10a and a handle 20a. The handle 20a is disposed on the second body 20. Specifically, the handle 20a may include a fixing portion and a handle portion. The fixing portion may be fixedly connected to the second body 20 by screws. The handle portion and the fixing portion may be integrally formed. The handle portion may be at a certain angle (e.g., 45° to 90°) to the large plane of the second body 20, so as to facilitate lifting the second body 20 by holding the handle 20a. The base 10a is disposed on the surface of the first body 10 away from the second body 20. The base 10a is disposed on the surface of the first body 10 where the first cavity 11 is not disposed. The handle 20a and the base 10a are made of a material with a larger mass, and the handle 20a is used to control the opening and closing angle of the first body 10. For example, the handle 20a and the base 10a may be made of a steel plate.

[0118] In this embodiment, the handle 20a and the base 10a cooperate to ensure that the integrated circuit chip pin shaping fixture 100 will not flip or tilt in the unloaded open state even without manual assistance. In addition, the base 10a may also include a lap portion (not shown) for carrying the first body 10 when the integrated circuit chip pin shaping fixture 100 is in the unloaded open state and the chip installation state.

[0119] In one embodiment, the first body 10 and the second body 20 are connected by a shaft connection or a hinge. The shaft connection or the hinge connection can connect the first body 10 and the second body 20 and allow them to rotate around a common axis. In this embodiment, the connection between the first body 10 and the second body 20 can be stable and reliable, easy to disassemble, and easy to assemble and maintain.

[0120] In one embodiment, the first body 10, the first loading portion 12 and the second body 20 in the integrated circuit chip pin shaping fixture 100 are made of polypropylene material, commonly known as PP board. PP board is a semi-crystalline material. PP board is harder and has a higher melting point.

[0121] In this embodiment, the materials of the first body 10, the first loading part 12 and the second body 20 are antistatic materials. The polypropylene material has a certain hardness, which makes it easier to shape into place in one go during the shaping process, effectively improving the shaping effect and improving the efficiency of shaping.

[0122] In this application, since the surface of the ceramic package integrated circuit is gold-plated, it is easy to be scratched and the pin 220 is easy to deform. Therefore, antistatic materials, more specifically polypropylene materials, are selected to ensure that the product is not scratched during the shaping process, causing secondary damage.

[0123] In one embodiment, the integrated circuit chip 200 that can be shaped by the integrated circuit chip pin shaping fixture 100 can be a ceramic packaged integrated circuit chip 200 or a plastic packaged integrated circuit chip 200. The integrated circuit chip 200 that can be shaped by the integrated circuit chip pin shaping fixture 100 includes FP, CFP, SOP, CSOP, QFP, ‌LQFP or PQFP packaging. Among them, FP is a ceramic flat package, CFP is a ceramic sealed flat package, SOP is a plastic dual row quart lead package, CSOP is a ceramic small outline package, QFP is a ceramic four-sided lead shoulder flat package, ‌LQFP is a thin four-sided lead shoulder flat package, and PQFP is a plastic four-sided lead flat package.

[0124] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. An integrated circuit chip pin shaping fixture, characterized in that: include: A first body (10) having a first cavity (11); a first loading portion (12) for loading integrated circuit chips, the first loading portion (12) being detachably arranged in the first cavity (11); when the first loading portion (12) is installed in the first cavity (11), the top surface of the first body (10) is flush with the top surface of the first loading portion (12); A second body (20) is rotatably connected to the first body (10), and a surface of the second body (20) in contact with the first body (10) is a plane; The integrated circuit chip comprises a package having an internal circuit and pins for connecting to a peripheral circuit; the first loading portion (12) has at least one second cavity (12a); the package of the integrated circuit chip is located in the second cavity (12a); the pins of the integrated circuit chip are located in a non-cavity portion of the first loading portion (12); the convex surface of the integrated circuit chip is close to the bottom surface of the second cavity (12a); and the patch surface of the integrated circuit chip is close to the bottom surface of the second body (20); The integrated circuit chip pin shaping fixture (100) has the following working states: No-load closed state: the first body (10) and the second body (20) are stacked, and the second body (20) has flat contact surfaces with the first body (10) and the first loading portion (12) respectively; No-load open state: the first body (10) and the second body (20) have a first angle, 10°≤the first angle≤150°, and the first loading portion (12) can be pulled out of the first body (10); Chip installation state: the first loading part (12) is extracted from the first body (10), and one or more integrated circuit chips are installed in the first loading part (12) by manual or machine operation; Full load closed state: the bottom surface of the second body (20) is in direct contact with the pins of the integrated circuit chip, and is used to flatten the pins of the integrated circuit chip; Wherein, the integrated circuit chip is a ceramic packaged integrated circuit chip, and the ceramic packaged integrated circuit chip includes a packaging form of FP, CFP, SOP, CSOP, QFP, ‌LQFP or PQFP; When the integrated circuit chip is an integrated circuit chip in a QFP, ‌LQFP, or PQFP package: the second cavity (12a) is a hollow groove; and the integrated circuit chip pin shaping fixture (100) further comprises: a rotating adsorbent, which is arranged on the first body (10) and can leak out from the second cavity (12a), and is used for adsorbing and rotating the integrated circuit chip; The rotating adsorbent comprises: A first driver, providing power in a first direction, for realizing the rising and falling of the integrated circuit chip; a second driver, providing a rotational force for rotating the integrated circuit chip clockwise or counterclockwise, and An adsorption structure, one end of which is connected to the first driver and the second driver respectively, and the other end of which is connected to the integrated circuit chip.

2. The integrated circuit chip pin shaping fixture according to claim 1, characterized in that: The first cavity (11) is a cavity having three cavity walls, and the first loading part (12) is pushed into or removed from a side of the first cavity (11) where no cavity wall is provided; Two mutually parallel inner cavity walls of the first cavity (11) match the outer side surface of the first loading portion (12), so that the first loading portion (12) can freely enter and exit the first cavity (11).

3. The integrated circuit chip pin shaping fixture according to claim 1, characterized in that: The integrated circuit chip is FP, CFP, SOP, CSOP, the chip length in the pin arrangement direction of the integrated circuit chip is a first length L1, the chip length in the pin extension direction of the integrated circuit chip is a second length L2, and the length of the pin of the integrated circuit chip beyond the chip is L3; The length of the second cavity (12a) in the first loading portion (12) is Lc, Lc>m*L1, m is a proportionality coefficient, and the value of m is a positive integer; The width of the second cavity (12a) in the first loading portion (12) is W, L2≤W≤L2+0.05mm; The thickness of the integrated circuit chip is TH1, the depth of the second cavity (12a) is D1, and TH1<D1.

4. The integrated circuit chip pin shaping fixture according to claim 1, characterized in that: The integrated circuit chip is an integrated circuit chip packaged in QFP, ‌LQFP, or PQFP; The second cavity (12a) is a plurality of hollow grooves arranged at intervals, the side length of the hollow groove is a1, the side length of the integrated circuit chip is a, and a≤a1≤(1+15%)*a.

5. The integrated circuit chip lead shaping fixture according to claim 1, characterized in that: The integrated circuit chip is an integrated circuit chip packaged in QFP, ‌LQFP, or PQFP; The integrated circuit chip pin shaping fixture (100) comprises the following steps in the process of implementing the integrated circuit chip pin shaping: A first no-load open state: the rotating adsorption body rises to a level higher than the top surface of the first loading portion (12); First chip mounting state: after the rotating adsorbent adsorbs the integrated circuit chip, it descends to a level below the top surface of the first loading portion (12) to place the integrated circuit chip on the first loading portion (12), the convex surface of the integrated circuit chip is located in the second cavity (12a), and at least two rows of pins of the integrated circuit chip are in contact with the non-cavity portion of the first loading portion (12); First full-load closed state: the bottom surface of the second body (20) is in direct contact with the pins of the integrated circuit chip, and is used to flatten at least two rows of pins of the integrated circuit chip; A second no-load open state: the rotating adsorption body rises to a level higher than the top surface of the first loading portion (12); Second chip installation state: after the rotating adsorbent adsorbs the integrated circuit chip, it rotates 90 degrees clockwise or counterclockwise, and the rotating adsorbent adsorbs the integrated circuit chip after adsorbing and rotating, and the integrated circuit chip is lowered to a level below the top surface of the first loading part (12), so that the integrated circuit chip is placed in the first loading part (12), and the convex surface of the integrated circuit chip is located in the second cavity (12a), and at least two rows of pins of the integrated circuit chip are in contact with the non-cavity part of the first loading part (12); in this state, among the at least two rows of pins in contact with the non-cavity part of the first loading part (12), at least one row is the pin that has not been flattened in the first full-load closed state; Second full-load closed state: the bottom surface of the second body (20) is in direct contact with the pins of the integrated circuit chip, and is used to flatten at least two columns of pins of the integrated circuit chip.

6. The integrated circuit chip pin shaping fixture according to any one of claims 1 to 5, characterized in that: The integrated circuit chip pin shaping fixture (100) further comprises: a handle (20a) disposed on the first body (10); and The base (10a) is arranged on a surface of the second body (20) away from the first body (10); the handle (20a) and the base (10a) are made of a material with a higher mass; and the handle (20a) is used to control the opening and closing angle of the first body (10).

7. The integrated circuit chip pin shaping fixture according to any one of claims 1 to 5, characterized in that: The first body (10) and the second body (20) are connected via an axis connection or a hinge.

8. The integrated circuit chip pin shaping fixture according to any one of claims 1 to 5, characterized in that: The first body (10), the first loading portion (12) and the second body (20) are made of polypropylene material.

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