A device for continuously discharging sewage water by using boiler waste heat
By using semiconductor cooling chips and heat exchange boxes in the continuous wastewater discharge device for boiler waste heat, the problem of unutilized heat in boiler waste water is solved, realizing the recovery of wastewater heat and saving boiler fuel, reducing production costs and environmental pollution.
Patent Information
- Application Number
- CN202310620971.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2023-05-29
- Publication Date
- 2026-01-27
- Estimated Expiration
- 2043-05-29
AI Technical Summary
In existing technologies, the waste water after boilers produce steam still contains a large amount of unused heat, and the heat is not recovered during wastewater treatment, leading to environmental pollution and resource waste.
Design a device for continuously discharging wastewater using boiler waste heat. Heat exchange is achieved through a semiconductor refrigeration chip and a heat exchange box. The refrigeration components transfer the heat from the wastewater to the boiler water, reducing the fuel consumption for boiler heating to produce steam.
This approach enables the effective utilization of wastewater heat, reduces boiler fuel consumption, lowers production costs, and minimizes environmental pollution.
Smart Images

Figure CN119038637B_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of boiler heating technology, and more specifically, to a device for continuously discharging wastewater using boiler waste heat. Background Technology
[0002] A boiler is an energy converter that uses the heat energy released from fuel combustion to heat water or other fluids to a certain temperature. The hot water and steam produced by boilers are resources in the industrial sector, especially steam. Currently, in factories with high steam demand, using boilers to produce steam is the relatively lowest-cost method. However, the remaining hot water after the boiler produces steam still contains a significant amount of heat, but there is still a certain heat difference compared to the hot water used to produce steam.
[0003] Industrial wastewater from chemical processes needs to be treated before it can be discharged. However, current emission standards only apply to the chemical indicators of the discharged water. The discharged water still contains a large amount of heat, and discharging it without treating the heat will pollute the environment. Conventional wastewater heat treatment devices will only waste the heat in the wastewater. Summary of the Invention
[0004] The present invention provides a device for continuously discharging wastewater using boiler waste heat, the purpose of which is to: treat the heat in the wastewater while using the heat in the wastewater to fill the heat difference between the residual water after boiler combustion and the water used in the boiler.
[0005] The embodiments of the present invention are achieved through the following technical solutions:
[0006] A device for continuously discharging wastewater using boiler waste heat includes a boiler and a wastewater treatment tank. A heat exchange box is installed on the wastewater treatment tank. The boiler is connected to the heat exchange box via a pipe, and the other end of the heat exchange box is connected back to the boiler via a pipe. A refrigeration component is installed on the side wall of the wastewater treatment tank. One side of the refrigeration component is connected to the inside of the wastewater treatment tank, and the other side of the refrigeration component is connected to the inside of the heat exchange box.
[0007] Furthermore, the cooling assembly includes a semiconductor cooling chip, one end of which passes through the sidewall of the wastewater treatment tank.
[0008] Furthermore, a cylindrical outer shell is fitted around the semiconductor cooling chip, and metal heat-conducting plates are installed at both ends of the cylindrical outer shell. Two metal heat-conducting plates are respectively connected to the two ends of the semiconductor cooling chip, and a sealing ring is provided at the connection between the outer edge of the metal heat-conducting plate and the cylindrical outer shell.
[0009] Furthermore, a sludge flash tank is connected between the boiler and the sewage treatment tank.
[0010] Furthermore, the lower outer wall of the sewage treatment tank is a heat-conducting plate, and a first temperature sensor and a second temperature sensor are installed in the sewage treatment tank and the heat exchange box, respectively. An adjustable heat insulation component is installed at the heat-conducting plate.
[0011] Furthermore, the heat insulation component includes an openable vacuum heat insulation panel, with a hydraulic rod installed at the openable end of the vacuum heat insulation panel. One end of the hydraulic rod is hinged to the vacuum heat insulation panel, and the other end of the hydraulic rod is hinged to the heat exchange box.
[0012] Furthermore, a coarse filter screen is slidably connected inside the sewage treatment tank, and a drive motor and guide rail are installed on the sewage treatment tank. A screw is connected to the output end of the drive motor, and the screw is threadedly connected to the coarse filter screen. The edge of the coarse filter screen is provided with a notch that is slidably connected to the guide rail.
[0013] Furthermore, a cleaning assembly is provided above the sewage treatment tank. The cleaning assembly includes two sets of suction heads, which are respectively located on both sides of the output end of the drive motor. The suction heads are connected through suction pipes, and electric push rods are installed on the suction heads.
[0014] Furthermore, the wastewater treatment tank is provided with a wastewater inlet and a chemical inlet on both sides of its upper end, and the wastewater inlet and the chemical inlet are located below the cleaning component.
[0015] The technical solutions of the embodiments of the present invention have at least the following advantages and beneficial effects:
[0016] By exchanging heat between the wastewater treatment tank and the heat exchange box, and using refrigeration components to transfer heat from the low-heat zone to the high-heat zone until the wastewater reaches the discharge standard at the required temperature, the transferred heat is transferred to the circulating water in the heat exchange box, which can reduce heat consumption during the boiler heating and steam production process. Attached Figure Description
[0017] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.
[0018] Figure 1 This is a schematic diagram of the structure of the present invention;
[0019] Figure 2 for Figure 1 Enlarged image A;
[0020] Figure 3 Top view of the wastewater treatment tank and heat exchange tubes;
[0021] Figure 4 This is a cross-sectional view of the refrigeration component.
[0022] Icons: 1-Boiler, 2-Sewage flash tank, 3-Sewage treatment tank, 4-Heat exchange box, 5-Refrigeration component, 51-Semiconductor cooling chip, 52-Cylindrical outer shell, 53-Metal heat-conducting plate, 54-Sealing ring, 6-First temperature sensor, 7-Second temperature sensor, 8-Hydraulic rod, 9-Vacuum insulation plate, 10-Coarse filter screen, 11-Slide rail, 12-Dust suction head, 13-Electric push rod, 14-Dust suction pipe, 15-Sewage inlet, chemical inlet. Detailed Implementation
[0023] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. The components of the embodiments of the present invention described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.
[0024] Example 1
[0025] A device for continuously discharging wastewater using waste heat from a boiler 1 includes a boiler 1 and a wastewater treatment tank 3. The boiler 1 has a first steam port at its upper end and a first drain port at its bottom. The first drain port of the boiler 1 is connected to a wastewater flash evaporator 2 via a pipe. The wastewater flash evaporator 2 has a second steam port at its upper end and a second drain port at its lower end. The second steam port is connected to a low-pressure steam network for steam storage. Heat exchange boxes 4 are installed on both sides of the wastewater treatment tank 3. The upper end of the heat exchange box 4 is connected to the second drain port of the wastewater flash evaporator, and the lower end of the heat exchange box 4 is connected to the boiler 1 via a pipe, circulating the heat-exchanged water back into the boiler 1.
[0026] The heat exchange box 4 is attached to the lower half of the sewage treatment tank 3. A refrigeration assembly 5 is installed at the connection between the sewage treatment tank 3 and the heat exchange box 4. A first temperature sensor 6 is installed inside the sewage treatment tank 3, and a second temperature sensor 7 is installed inside the heat exchange box 4. The refrigeration assembly 5 includes a semiconductor cooling chip 51. A cylindrical outer shell 52 is fitted around the semiconductor cooling chip 51. Metal heat-conducting plates 53 are installed at both ends of the cylindrical outer shell 52. Two metal heat-conducting plates 53 are respectively connected to the two ends of the semiconductor cooling chip 51. A sealing ring 54 is provided at the connection between the outer edge of the metal heat-conducting plate 53 and the cylindrical outer shell 52. The semiconductor cooling chip 51 is isolated from the industrial sewage in the sewage treatment tank 3 and the water in the heat exchange box 4 through the sealing structure formed by the PVC cylindrical outer shell 52 and the metal heat-conducting plates 53, thus preventing corrosion of the semiconductor cooling chip 51 during the heat exchange process. The metal heat exchange plate on one side of the thermoelectric cooler 51 passes through the wastewater treatment tank 3 and contacts the interior of the tank 3, while the metal heat exchange plate on the other side of the thermoelectric cooler 51 contacts the interior of the heat exchanger. The thermoelectric cooler 51 is connected to a power source and a switch via wires, which pass through the inner wall of the wastewater treatment tank 3 and connect to an external power source.
[0027] Boiler 1 provides steam in stages. When boiler 1 stops working, the water temperature inside boiler 1 gradually decreases. The cooled water is then transported through pipelines to the wastewater flash tank 2. The high-pressure saturated water enters the low-pressure container, and due to the sudden pressure drop, it turns into steam and water. The steam is incorporated into the low-pressure steam network, while the water enters the heat exchange box 4 through the second drain outlet for heat exchange. The heat exchange process is monitored by the first temperature sensor 6 in the wastewater treatment tank 3 and the second temperature sensor 7 in the heat exchange box 4, which transmit the data to the corresponding controllers. The controllers are connected to the circuit of the semiconductor cooling chip 51. When the wastewater temperature is higher than the water temperature in the heat exchange box 4, the semiconductor cooling chip 51 does not work. The wastewater treatment tank 3 and the heat exchange box 4 are naturally heated by the heat conduction plate of the wastewater treatment tank 3. When the temperature inside the wastewater treatment tank 3 is close to the temperature inside the heat exchange box 4, or when the temperature inside the wastewater treatment tank 3 is only slightly higher than the temperature inside the heat exchange box 4, the pneumatic semiconductor cooling chip 51 performs active heat exchange between the wastewater treatment tank 3 and the heat exchange box 4 until the temperature of the wastewater reaches the discharge standard and is discharged from the bottom valve of the wastewater treatment tank 3. The water in the heat exchange box 4 is the water after the boiler 1 has been used and the blowdown flash tank 2 has been worked. The temperature is low, and a lot of fuel is required to circulate it back into the boiler 1. The heat in the sewage treatment tank 3 is transferred to the heat exchange box 4 by the semiconductor cooling chip 51. Although the cooling efficiency of the semiconductor cooling chip 51 is between 50% and 60%, the heating efficiency is greater than 100% (the semiconductor cooling chip 51 dissipates heat on its own when it is powered on, and the entire semiconductor cooling chip 51 is located in the heat exchange box 4). For the circulating water of the boiler 1 in the heat exchange box 4, a lot of heat is accumulated. When it is circulated back into the boiler 1 for heating, the required fuel heat decreases and the heating time is shortened.
[0028] An adjustable heat insulation component is installed at the heat-conducting plate. The heat insulation component includes an openable vacuum heat insulation plate 9. A hydraulic rod 8 is installed at the openable end of the vacuum heat insulation plate 9. One end of the hydraulic rod 8 is hinged to the vacuum heat insulation plate 9, and the other end is hinged to the heat exchange box 4. The drive end of the hydraulic rod 8 is connected to a controller connected to the first temperature sensor 6 and the second temperature sensor 7 via wiring. When the wastewater treatment tank 3 and the heat exchange box 4 are in a natural heat exchange state, the vacuum heat insulation plate 9 unfolds, utilizing the heat-conducting plate for heat exchange. When the wastewater treatment tank 3 and the heat exchange box 4 are in an active heat exchange state, the hydraulic rod 8 drives the vacuum heat insulation plate 9 to close, covering one side of the heat-conducting plate, preventing heat from the heat exchange box 4 from automatically transferring to the wastewater treatment tank 3 when the temperature difference between the two sides of the heat-conducting plate is too large.
[0029] A coarse filter screen 10 is slidably connected inside the wastewater treatment tank 3. A drive motor and guide rail are installed on the wastewater treatment tank 3. A screw is connected to the output end of the drive motor, and the screw is threadedly connected to the coarse filter screen 10. The edge of the coarse filter screen 10 has a notch for slidable connection with the guide rail. A cleaning assembly is installed above the wastewater treatment tank 3. The cleaning assembly includes two sets of suction heads 12, which are respectively located on both sides of the output end of the drive motor. The suction heads 12 are connected through a suction pipe 14, and an electric push rod 13 is installed on the suction head 12. A wastewater inlet 15 and a chemical inlet are respectively provided on both sides of the upper end of the wastewater treatment tank 3. The wastewater inlet 15 and the chemical inlet are located below the cleaning assembly.
[0030] Before being discharged, chemical wastewater contains many large solid particles. A coarse filter 10 is used to lift and separate these particles, which are then moved to the top of the wastewater treatment tank 3. A suction head 12, controlled by an electric actuator 13, is used to clean the wastewater. After the coarse filter 10 separates the solid particles, flocculants and other wastewater treatment agents are added for further treatment. The treated wastewater is then discharged through a lower valve.
[0031] The above are merely preferred embodiments of the present invention and are not intended to limit the present invention. Various modifications and variations can be made to the present invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.
Claims
1. A device for continuously discharging wastewater using boiler waste heat, characterized in that: The system includes a boiler (1) and a sewage treatment tank (3). A heat exchange box (4) is installed on the sewage treatment tank (3). The boiler (1) is connected to the heat exchange box (4) through a pipe. The other end of the heat exchange box (4) is connected back to the boiler (1) through a pipe. A refrigeration component (5) is installed on the side wall of the sewage treatment tank (3). One side of the refrigeration component (5) is connected to the sewage treatment tank (3), and the other side of the refrigeration component (5) is connected to the heat exchange box (4). The refrigeration assembly (5) includes a semiconductor refrigeration chip (51), one end of which passes through the side wall of the sewage treatment tank (3); The semiconductor cooling chip (51) is fitted with a cylindrical shell (52) on its outer side. Metal heat-conducting plates (53) are installed at both ends of the cylindrical shell (52). The two metal heat-conducting plates (53) are respectively connected to the two ends of the semiconductor cooling chip (51). A sealing ring (54) is provided at the connection between the outer edge of the metal heat-conducting plate (53) and the cylindrical shell (52). The lower outer wall of the sewage treatment tank (3) is a heat-conducting plate. A first temperature sensor (6) and a second temperature sensor (7) are installed in the sewage treatment tank (3) and the heat exchange box (4), respectively. An adjustable heat insulation component is installed at the heat-conducting plate. The heat insulation assembly includes a closable vacuum heat insulation plate (9), and a hydraulic rod (8) is installed at the closing end of the vacuum heat insulation plate (9). One end of the hydraulic rod (8) is hinged to the vacuum heat insulation plate (9), and the other end of the hydraulic rod (8) is hinged to the heat exchange box (4). The heat exchange process is judged by the first temperature sensor (6) in the sewage treatment tank (3) and the second temperature sensor (7) in the heat exchange box (4), and the data is transmitted to the corresponding controller. The controller is connected to the circuit of the semiconductor cooling chip (51). When the sewage temperature is higher than the water temperature in the heat exchange box (4), the semiconductor cooling chip (51) does not work, and the sewage treatment tank (3) and the heat exchange box (4) use the heat conduction plate of the sewage treatment tank (3) for natural heat exchange. When the temperature in the sewage treatment tank (3) is close to the temperature in the heat exchange box (4) or the temperature in the sewage treatment tank (3) is lower than the temperature in the heat exchange box (4), the semiconductor cooling chip (51) is activated to carry out active heat exchange between the sewage treatment tank (3) and the heat exchange box (4) until the sewage temperature reaches the discharge standard and is discharged from the bottom valve of the sewage treatment tank (3). The driving end of the hydraulic rod (8) is connected to the controller connected to the first temperature sensor (6) and the second temperature sensor (7) via a line. When the sewage treatment tank (3) and the heat exchange box (4) are in a natural heat exchange state, the vacuum insulation plate (9) unfolds and uses the heat conduction plate for heat exchange. When the sewage treatment tank (3) and the heat exchange box (4) are in an active heat exchange state, the hydraulic rod (8) drives the vacuum insulation plate (9) to close and cover one side of the heat conduction plate to prevent the heat in the heat exchange box (4) from being automatically conducted to the sewage treatment tank (3) when the temperature difference between the two sides of the heat conduction plate is too large.
2. The device for continuously discharging wastewater using boiler waste heat according to claim 1, characterized in that: A wastewater flash tank (2) is connected between the boiler (1) and the wastewater treatment tank (3).
3. The device for continuously discharging wastewater using boiler waste heat according to claim 1, characterized in that: The sewage treatment tank (3) is slidably connected to a coarse filter screen (10). A drive motor and a guide rail are installed on the sewage treatment tank (3). A screw is connected to the output end of the drive motor. The screw is threadedly connected to the coarse filter screen (10). The edge of the coarse filter screen (10) is provided with a notch that is slidably connected to the guide rail.
4. The device for continuously discharging wastewater using boiler waste heat according to claim 3, characterized in that: A cleaning assembly is provided above the sewage treatment tank (3). The cleaning assembly includes two sets of suction heads (12). The two sets of suction heads (12) are respectively located on both sides of the output end of the drive motor. The suction heads (12) are connected through suction pipes (14). An electric push rod (13) is installed on the suction head (12).
5. The device for continuously discharging wastewater using boiler waste heat according to claim 4, characterized in that: The wastewater treatment tank (3) is provided with a wastewater inlet (15) and a chemical inlet on both sides of the upper end, and the wastewater inlet (15) and the chemical inlet are located below the cleaning component.
Citation Information
Patent Citations
Boiler blow -off waste heat recovery device
CN208620618U
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CN213953731U