Press plate structure for bonding equipment and bonding equipment

Abstract

The present application provides a pressure plate structure for a bonding device and a bonding device. The pressure plate structure includes a pressure plate and a crimping structure. The pressure plate is provided with a through hole. The crimping structure includes at least a first pressure pin assembly and a second pressure pin assembly. The first pressure pin assembly includes a first fixing portion and at least two first pressure pins connected thereto. The first fixing portion is connected to the pressure plate. The first pressure pin includes a first crimping portion away from the first fixing portion. The first crimping portion extends into the through hole. The second pressure pin assembly includes a second fixing portion and at least two second pressure pins connected thereto. The second fixing portion is located on a side of the first fixing portion facing away from the pressure plate and is connected to the pressure plate. The second pressure pin includes a second crimping portion away from the second fixing portion, and the second crimping portion extends into the through hole. The end faces of the first crimping portion and the second crimping portion are located in the same plane. At least one second pressure pin is provided between two adjacent first pressure pins. The distance between the first crimping portion and the first fixing portion is smaller than the distance between the second crimping portion and the first fixing portion.

Description

Technical Field

[0001] The present application relates to the field of semiconductor technology, and in particular to a pressure plate structure for a bonding device and a bonding device. Background Art

[0002] In common semiconductor packaging technologies, such as chip packaging processes, the chip is first mounted on a lead frame, and then a bonding device is used to connect the two ends of the bonding wire to the pins of the chip and the lead frame respectively.

[0003] The bonding equipment includes a pressure plate structure, which includes a pressure plate and multiple pressure pins. One end of the pressure pin is connected to the pressure plate, and the other end is used to abut against the lead frame to fix the lead frame. When multiple pressure pins are installed on the pressure plate in existing pressure plate structures, the end faces of the pressure pins that abut against the lead frame are prone to not being on the same plane. This results in uneven force on the lead frame, affecting the bonding quality between the bonding wire and the chip, and thus the quality of the product. Summary of the Invention

[0004] Embodiments of the present application provide a pressure plate structure for a bonding device and a bonding device.

[0005] A first aspect of an embodiment of the present application provides a pressure plate structure for a bonding device, the pressure plate structure comprising:

[0006] A pressing plate, provided with a through hole for exposing the structure to be bonded;

[0007] The crimping structure includes at least a first crimping needle assembly and a second crimping needle assembly; the first crimping needle assembly includes a first fixing portion and at least two first crimping needles connected to the first fixing portion; the first fixing portion is connected to the pressing plate; the first crimping needle includes a first crimping portion away from the first fixing portion, and the first crimping portion extends into the through hole; the second crimping needle assembly includes a second fixing portion and at least two second crimping needles connected to the second fixing portion; the second fixing portion is located on the side of the first fixing portion away from the pressing plate and is connected to the pressing plate; the second crimping needle includes a second crimping portion away from the second fixing portion, and the second crimping portion extends into the through hole; the end face of the first crimping portion and the end face of the second crimping portion are both used to abut against the structure to be bonded and are located in the same plane; the at least two first crimping needles and the at least two second crimping needles are arranged in the same direction, and at least one second crimping needle is provided between two adjacent first crimping needles; in a direction parallel to the surface of the pressing plate facing the first fixing portion, the distance between the first crimping portion and the first fixing portion is smaller than the distance between the second crimping portion and the first fixing portion.

[0008] In one embodiment, the first pressing needle also includes a first connecting portion connected to the first fixing portion, and the end of the first connecting portion facing away from the first fixing portion is connected to the first crimping portion; the extension direction of the orthographic projection of the first connecting portion on the plane where the surface of the pressing plate is located and the extension direction of the orthographic projection of the first crimping portion on the plane where the surface of the pressing plate is located are the same.

[0009] In one embodiment, the second pressing needle also includes a second connecting portion connected to the second fixing portion, and the end of the second connecting portion facing away from the second fixing portion is connected to the second crimping portion; the angle between the extension direction of the orthographic projection of the second connecting portion on the plane where the surface of the pressing plate is located and the extension direction of the orthographic projection of the second crimping portion on the plane where the surface of the pressing plate is located is in the range of 20° to 40°.

[0010] In one embodiment, two second pressing pins are provided between two adjacent first pressing pins, and from an end of the second pressing portion close to the second fixing portion to an end of the second pressing portion away from the second fixing portion, the second pressing portion is inclined toward the direction of the first pressing pin adjacent to the second pressing portion;

[0011] The structure to be bonded includes a plurality of portions to be crimped arranged in parallel, and the arrangement direction of the plurality of portions to be crimped is the same as the arrangement direction of the at least two first crimping pins; the second crimping portion and the adjacent first crimping portion are configured to crimp the same portion to be crimped, and the first crimping portion crimps the end of the portion to be crimped facing the first fixing portion, and the second crimping portion crimps one side edge of the portion to be crimped.

[0012] In one embodiment, in the crimping structure, in the arrangement direction of the first pressure pins, the two outermost pressure pins are both the first pressure pins; the pressing plate structure further includes two auxiliary crimping portions, the two auxiliary crimping portions are located on opposite sides of the through hole, and the auxiliary crimping portions include at least one third pressure pin;

[0013] The third pressing pin is connected to the pressing plate, and the third pressing pin includes a third crimping portion away from the pressing plate, the third crimping portion extends into the through hole, and the end face of the third crimping portion is used to abut against the structure to be bonded; the third crimping portion and the adjacent first crimping portion are configured to crimp the same portion to be crimped, and the third crimping portion crimps the outer edge of the portion to be crimped.

[0014] In one embodiment, the first pressing needle further includes a first connecting portion connected to the first fixing portion, an end of the first connecting portion facing away from the first fixing portion is connected to the first crimping portion; an angle between an extending direction of the first connecting portion and an extending direction of the first crimping portion is in a range of 50° to 70°; and / or,

[0015] The second pressing needle also includes a second connecting portion connected to the second fixing portion, and the end of the second connecting portion facing away from the second fixing portion is connected to the second crimping portion; the end of the second connecting portion facing away from the second fixing portion is connected to the second crimping portion; the angle between the extension direction of the second connecting portion and the extension direction of the second crimping portion is in the range of 50° to 70°.

[0016] In one embodiment, an area of ​​an end surface of the first crimping portion is larger than an area of ​​an end surface of the second crimping portion.

[0017] In one embodiment, the first pressure needle also includes a first connecting portion connected to the first fixing portion, and the end of the first connecting portion facing away from the first fixing portion is connected to the first crimping portion; the orthographic projection of the first connecting portion on the plane where the surface of the pressure plate is located is located between the orthographic projection of the first crimping portion on the plane where the surface of the pressure plate is located and the orthographic projection of the first fixing portion on the plane where the surface of the pressure plate is located.

[0018] In one embodiment, the second pressure needle also includes a second connecting portion connected to the second fixing portion, and the end of the second connecting portion facing away from the second fixing portion is connected to the second crimping portion; the orthographic projection of the second connecting portion on the plane where the surface of the pressure plate is located is located between the orthographic projection of the second crimping portion on the plane where the surface of the pressure plate is located and the orthographic projection of the second fixing portion on the plane where the surface of the pressure plate is located.

[0019] According to a second aspect of an embodiment of the present application, a bonding device is provided, which includes the above-mentioned pressure plate structure for the bonding device and a driving part; the driving part is configured to drive the bonding device to rise and fall.

[0020] The main technical effects achieved by the embodiments of the present application are:

[0021] The embodiments of the present application provide a pressure plate structure for a bonding device and a bonding device. The embodiments of the present application provide a pressure plate structure for a bonding device. The embodiments of the present application provide a pressure plate structure for a bonding device. Each first pressure pin of the first pressure pin assembly is connected to the first fixed part, and the end face of the first crimping part of each first pressure pin is located in the same plane. When installing and replacing the first pressure pin assembly, the end faces of the first crimping parts can be ensured to be located in the same plane; each second pressure pin of the second pressure pin assembly is connected to the second fixed part, and the end face of the second crimping part of each second pressure pin is located in the same plane. When installing and replacing the second pressure pin assembly, the end faces of the second crimping parts can be ensured to be located in the same plane. When installing the crimping structure, it is only necessary to adjust the positions of the first fixed part and the second fixed part, so that the end faces of the crimping parts are all in the same plane, which is convenient for operation and can make the force on the structure to be bonded uniform, which helps to improve the bonding quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 is a top view of a pressure plate structure provided by an exemplary embodiment of the present application;

[0023] Figure 2 is a partial structural side view of a pressure plate structure provided by an exemplary embodiment of the present application;

[0024] Figure 3 is a top view of a first pressure needle assembly provided by an exemplary embodiment of the present application;

[0025] Figure 4 is a side view of a first pressure needle assembly provided by an exemplary embodiment of the present application;

[0026] Figure 5 is a top view of a second pressure needle assembly provided by an exemplary embodiment of the present application;

[0027] Figure 6 It is a side view of a second pressure needle assembly provided by an exemplary embodiment of the present application. Specific embodiments

[0028] Exemplary embodiments will be described in detail herein, with examples illustrated in the accompanying drawings. In the following description, when referring to the drawings, identical numerals in different figures represent identical or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments are not intended to represent all embodiments consistent with the present application. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the present application, as detailed in the appended claims.

[0029] The terms used in this application are for the purpose of describing specific embodiments only and are not intended to limit this application. As used in this application and the appended claims, the singular forms "a," "an," "the," and "the" are intended to include the plural forms, unless the context clearly indicates otherwise. It should also be understood that the term "and / or" as used herein refers to and encompasses any and all possible combinations of one or more of the associated listed items.

[0030] It should be understood that although the terms first, second, third, etc. may be used in this application to describe various information, such information should not be limited to these terms. These terms are only used to distinguish information of the same type from each other. For example, without departing from the scope of this application, first information may also be referred to as second information, and similarly, second information may also be referred to as first information. Depending on the context, the word "if" as used herein may be interpreted as "at the time of" or "when" or "in response to determining".

[0031] The following embodiments of the present application are described in detail with reference to the accompanying drawings. In the absence of conflict, the following embodiments and features therein may be combined with each other.

[0032] The embodiment of the present application provides a pressure plate structure for a bonding device. Figure 1 As shown, the pressing plate structure for bonding equipment includes a pressing plate 10 and a pressing structure 20 .

[0033] The pressing plate 10 is provided with a through hole 101, and the through hole 101 is used to expose the structure to be bonded 30. The pressing structure 20 includes at least a first pressing needle assembly 21 and a second pressing needle assembly 22. Figures 2 to 6As shown, the first pressure needle assembly 21 includes a first fixing portion 211 and at least two first pressure needles 212 connected to the first fixing portion 211. The first fixing portion 211 is connected to the pressure plate 10. The first pressure needle 212 includes a first crimping portion 213 away from the first fixing portion 211, and the first crimping portion 213 extends into the through hole 101. The second pressure needle assembly 22 includes a second fixing portion 221 and at least two second pressure needles 222 connected to the second fixing portion 221. The second fixing portion 221 is located on the side of the first fixing portion 211 away from the pressure plate 10, and is connected to the pressure plate 10. The second pressure needle 222 includes a second crimping portion 223 away from the second fixing portion 221, and the second crimping portion 223 extends into the through hole 101. The end face of the first crimping portion 213 and the end face of the second crimping portion 223 are both used to abut against the structure to be bonded 30, and are located in the same plane. The at least two first pressing pins 212 and the at least two second pressing pins 222 are arranged in the same direction, and at least one second pressing pin 222 is provided between two adjacent first pressing pins 212. In a direction parallel to the surface of the pressing plate 10 facing the first fixing portion 211, the distance between the first crimping portion 213 and the first fixing portion 211 is smaller than the distance between the second crimping portion 223 and the first fixing portion 211.

[0034] The embodiment of the present application provides a pressure plate structure for a bonding device, in which each first pressure pin of the first pressure pin assembly is connected to the first fixing part, and the end face of the first crimping part of each first pressure pin is located in the same plane. When installing and replacing the first pressure pin assembly, the end faces of each first crimping part can be ensured to be located in the same plane; each second pressure pin of the second pressure pin assembly is connected to the second fixing part, and the end face of the second crimping part of each second pressure pin is located in the same plane. When installing and replacing the second pressure pin assembly, the end faces of each second crimping part can be ensured to be located in the same plane; when installing the crimping structure, it is only necessary to adjust the positions of the first fixing part and the second fixing part, so that the end faces of each crimping part can be located in the same plane, which is convenient for operation and can make the force on the structure to be bonded uniform, which helps to improve the bonding quality; because the first fixing part of the first pressure pin assembly is located between the second fixing part of the second pressure pin assembly and the pressure plate, and when the pressure plate is facing the first fixing part The distance between the first crimping part and the first fixing part in the direction parallel to the surface is smaller than the distance between the second crimping part and the first fixing part, then the height of the part of the second pressure pin located between the second crimping part and the second fixing part is greater than the part of the first pressure pin located between the first crimping part and the first fixing part, which can prevent the first pressure pin and the second pressure pin from contacting and affecting their pressing force on the structure to be bonded; at least one of the second pressure pins is provided between two adjacent first pressure pins, then the adjacent first pressure pins and the second pressure pins can apply force to different areas of the structure to be bonded, which helps to make the structure to be bonded more firmly fixed; the crimping structure includes at least a first pressure pin assembly and a second pressure pin assembly, then when a pressure pin is damaged, only the pressure pin assembly where the pressure pin is located needs to be replaced, which helps to reduce the maintenance cost of the pressure plate structure; and pressure pins with the same parameters such as height and size are connected to the same fixing part, which also helps to reduce the preparation cost and difficulty of the pressure pin assembly.

[0035] In one embodiment, the bonding device where the pressure plate structure is located further includes a driving part, a welding head, a moving part and a bearing part. Figure 1 As shown, the structure to be bonded 30 is placed on the carrier 60. The carrier 60 can be fixed to the movable portion via a connector 70. After the movable portion drives the carrier 60 to a set position, the driving portion drives the pressure plate structure downward to approach the structure to be bonded 30, and the through-hole of the pressure plate 10 exposes the structure to be bonded 30. The welding head then bonds the bonding wire to the structure to be bonded 30. After bonding is completed, the driving portion drives the pressure plate structure upward to move away from the structure to be bonded 30, and the movable portion drives the structure to be bonded away from the set position.

[0036] In one embodiment, the structure to be bonded 30 includes a plurality of portions to be crimped 31 arranged in parallel, and the arrangement direction of the plurality of portions to be crimped 31 is the same as the arrangement direction of the at least two first pressing pins 212. The first pressing portion 213 of the adjacent first pressing pins 212 and the second pressing portion 223 of the adjacent second pressing pins 222 abut against the same portion to be crimped 31. The pressing plate structure can abut against at least a portion of the portion to be crimped 31 of the structure to be bonded 30, that is, it can at least fix at least a portion of the portion to be crimped 31 of the structure to be bonded 30, so that these fixed portions to be crimped 31 can be bonded to the bonding wire. Figure 1 In the illustrated embodiment, the structure to be bonded 30 includes six portions to be pressed 31 , three of which are fixed by the pressing plate structure, and the other three portions to be pressed 31 of the structure to be bonded 30 can be bonded in the next bonding process.

[0037] In one embodiment, the crimping structure may further include other pressing pin assemblies, for example, a third pressing pin assembly, which may include a fixing portion and a pressing pin connected to the fixing portion. The fixing portion may be located on a side of the second fixing portion away from the pressing plate.

[0038] In one embodiment, the structure to be bonded 30 includes a lead frame and a chip mounted on the lead frame, the lead frame includes a plurality of base islands arranged in parallel, and the chip is mounted on the base islands. Figure 1 As shown, the base island is the portion to be pressed 31, and the chip 32 is mounted on the portion to be pressed 31. The lead frame further includes a plurality of pins 33 located on one side of the portion to be pressed 31, and the pins 33 are connected to the portion to be pressed 31.

[0039] In one embodiment, Figure 1 and Figure 2 As shown, the first fixing portion 211 and the second fixing portion 221 are both provided with connecting holes, the pressing plate 10 is provided with an opening connected to the connecting hole, and the connecting member 50 passes through the connecting hole and enters the opening, thereby connecting the first fixing portion 211 and the second fixing portion 221 to the pressing plate. Compared with the solution in which a single pressing pin is connected to the pressing plate through a connecting member, in the embodiment of the present application, since the area of ​​the first fixing portion 211 and the second fixing portion 221 is larger, a larger-sized connecting portion can be used. In the process of switching between the contact state and the separation state of the first pressing pin and the second pressing pin and the structure to be bonded 30, the large-sized connecting member is not easy to loosen, and the first pressing pin and the second pressing pin are not easy to deviate, which can avoid the first pressing pin or the second pressing pin from deviating and damaging the structure to be bonded or failing to effectively fix the part to be crimped. The connecting member 50 can be a bolt.

[0040] In one embodiment, Figure 1 and Figure 2As shown, the area of ​​the first fixing portion 211 is larger than the area of ​​the second fixing portion 221, and the orthographic projection of the second fixing portion 221 on the plane where the surface of the first fixing portion 211 lies entirely on the first fixing portion 211. The connecting member 50 can sequentially pass through the connecting holes of the first fixing portion 211 and the connecting holes of the second fixing portion 221 and enter the opening of the pressing plate 10.

[0041] In one embodiment, Figure 1 As shown, the first fixing portion 211 and the second fixing portion 221 are all located on the pressing plate 10. In this way, the first fixing portion 211 and the second fixing portion 221 do not occupy the through hole 101, which helps to increase the movement space of the welding head.

[0042] In one embodiment, Figure 3 and Figure 4 As shown, the first pressing pin 212 further includes a first connecting portion 214 connected to the first fixing portion 211. The end of the first connecting portion 214 facing away from the first fixing portion 211 is connected to the first crimping portion 213. The first connecting portion 214 can increase the distance between the first crimping portion 213 and the first fixing portion 211, allowing the first crimping portion 213 to extend into the through hole 101. In some embodiments, the first pressing pin 212 and the first fixing portion 211 are integrally formed.

[0043] In one embodiment, Figure 3 As shown, the extension direction of the orthographic projection of the first connecting portion 214 on the plane where the surface of the pressing plate 10 is located is the same as the extension direction of the orthographic projection of the first crimping portion 213 on the plane where the surface of the pressing plate 10 is located. With such an arrangement, after the end face of the first crimping portion 213 contacts the structure to be bonded 30, the force applied by the first connecting portion 214 to the first crimping portion 213 almost entirely acts on the structure to be bonded 30, without generating force components in other directions, which helps to increase the pressing force of the first crimping portion 213 on the structure to be bonded 30, and fixes the structure to be bonded 30 more firmly. It should be noted that in the embodiment of the present application, the surface of the pressing plate refers to the surface of the pressing plate facing the first fixing portion.

[0044] In one embodiment, Figure 3 As shown, the orthographic projection of the first connecting portion 214 on the plane of the surface of the pressing plate 10 is located between the orthographic projection of the first crimping portion 213 on the plane of the surface of the pressing plate 10 and the orthographic projection of the first fixing portion 211 on the plane of the surface of the pressing plate 10. With this arrangement, the first pressing pin 212 does not occupy the movement space of the welding head, which can prevent the welding head from contacting the first pressing pin 212 during movement.

[0045] In one embodiment, Figure 4As shown, the angle between the extension direction of the first connecting portion 214 and the extension direction of the first crimping portion 213 is β, and the range of β is 50° to 70°. After testing, when the range of β is 50° to 70°, the first crimping portion 213 can have a greater pressing force on the bonding portion, and the first pressing pin 212 is not prone to breakage. In some embodiments, β can be 50°, 55°,

[0046]

[0047] In one embodiment, Figure 5 and Figure 6 As shown, the second pressing pin 222 further includes a second connecting portion 224 connected to the second fixing portion 221. The end of the second connecting portion 224 facing away from the second fixing portion 221 is connected to the second crimping portion 223. The second connecting portion 224 can increase the distance between the second crimping portion 223 and the second fixing portion 221, allowing the second crimping portion 223 to extend into the through hole 101. In some embodiments, the second pressing pin 222 and the second fixing portion 221 are integrally formed.

[0048] In one embodiment, Figure 2 As shown, the height of the second connecting portion 224 is greater than the height of the first connecting portion 214. Since, on the plane where the surface of the pressing plate 10 is located, the distance between the first crimping portion 213 and the first fixing portion 211 is smaller than the distance between the second crimping portion 223 and the first fixing portion 211, and the height of the second crimping portion 223 is greater than the height of the first connecting portion 214, the second connecting portion 224 and the first connecting portion 214 will not come into contact, thereby preventing the contact between the two from affecting the force acting on the structure to be bonded 30.

[0049] In one embodiment, Figure 5 As shown, the angle between the extension direction of the orthographic projection of the second connecting portion 224 on the plane where the surface of the pressing plate 10 is located and the extension direction of the orthographic projection of the second crimping portion 223 on the plane where the surface of the pressing plate 10 is located is α, and the range of α is 20° to 40°. Such a setting can avoid α being too large, which will cause the second crimping portion 223 to occupy a large space in the horizontal direction and easily come into contact with the welding head, thereby affecting the movement of the welding head; it can also avoid α being too large, which will cause the second pressing needle 222 to break easily when it abuts against the structure to be bonded 30; at the same time, it can avoid α being too small, which will cause the second crimping portion 223 to exert a small pressure on the bonding structure 30, which is not conducive to the fixing of the bonding structure by the pressing plate structure. In some embodiments, α can be 20°, 25°, 30°, 35°, 40°, etc. Preferably, α is 30°.

[0050] In one embodiment, Figure 6As shown, the angle between the extension direction of the second connecting portion 224 and the extension direction of the second crimping portion 223 is γ, and the range of γ is 50° to 70°. After testing, when the range of β is 50° to 70°, the second crimping portion 223 can exert a greater pressing force on the bonding portion, and the second pressing pin 222 is not prone to breakage. In some embodiments, γ can be 50°, 55°, 60°, 65°, 70°, etc. Preferably, γ is 60°.

[0051] In one embodiment, Figure 5 As shown, the orthographic projection of the second connecting portion 224 on the plane on which the surface of the pressing plate 10 lies is located between the orthographic projection of the second crimping portion 223 on the plane on which the surface of the pressing plate 10 lies and the orthographic projection of the second fixing portion 221 on the plane on which the surface of the pressing plate 10 lies. With this arrangement, the second pressing pin 222 does not occupy the movement space of the welding head, thus preventing the welding head from contacting the second pressing pin 222 during movement.

[0052] In one embodiment, the area of ​​the end surface of the first crimping portion 213 is larger than the area of ​​the end surface of the second crimping portion 223. The area of ​​the end portion of the portion to be crimped 31 of the structure to be bonded 30 that can abut against the first crimping portion 213 is larger than the area of ​​the side portion that can abut against the first crimping portion 213. Providing a larger area of ​​the end surface of the first crimping portion 213 than the end surface of the second crimping portion 223 increases the contact area between the first crimping portion 213 and the portion to be crimped 31, thereby improving the fixing effect of the crimping structure on the structure to be bonded.

[0053] In one embodiment, Figure 1As shown, two second pressing pins 222 are provided between two adjacent first pressing pins 212. From the end of the second pressing portion 223 close to the second fixing portion 221 to the end of the second pressing portion 223 facing away from the second fixing portion 221, the second pressing portion 223 extends toward the first pressing pin 212 adjacent to the second pressing portion 223. The second pressing portion 223 and the adjacent first pressing portion 213 are configured to press the same portion to be press-connected 31, with the first pressing portion 213 pressing the end of the portion to be press-connected 31 facing the first fixing portion 211, and the second pressing portion 223 pressing a side edge of the portion to be press-connected. With such arrangement, multiple positions of the part to be crimped abut against the pressing needles, which can make the part to be crimped more firmly fixed; and except for the two first pressing needles 212 located on the outermost sides, a second pressing needle 222 is provided on both sides of the other first pressing needles 212, and the first pressing needle 212 and the second pressing needles 222 located on both sides thereof abut against the same part to be crimped 31, and the second pressing needles 222 on both sides press against the opposite side edges of the part to be crimped 31, so that the side edges of the part to be crimped 31 are subjected to uniform force, thereby avoiding the part to be crimped 31 from tilting due to different forces on both sides and affecting the bonding quality.

[0054] In one embodiment, Figure 1 As shown, in the crimping structure, in the arrangement direction of the first press pins 212, the two outermost press pins are both the first press pins 212. The pressing plate structure also includes two auxiliary crimping parts 40, and the two auxiliary crimping parts 40 are located on opposite sides of the through hole 101, and the auxiliary crimping parts 40 include at least one third press pin 401. The third press pin 401 is connected to the pressing plate 10, and the third press pin 401 includes a third crimping part 42 away from the pressing plate 10, and the third crimping part 42 extends into the through hole 101, and the end face of the third crimping part 42 is used to abut against the structure to be bonded 30. The extension direction of the third press pin 401 can be the same as the arrangement direction of the first press pin 212 in the first press pin assembly 21.

[0055] In one embodiment, Figure 1 As shown, the third pressing pin 401 further includes a third fixing portion 41 and a third connecting portion 43. The third fixing portion 41 is connected to the pressing plate 10, and one end of the third connecting portion 43 is connected to the third fixing portion 41, while the end of the third connecting portion 43 facing away from the third fixing portion 41 is connected to the third crimping portion 42. The third connecting portion 43 increases the distance between the third crimping portion 42 and the third fixing portion 41, thereby allowing the third crimping portion 42 to extend into the through hole 101. In some embodiments, the third pressing pin 401 is integrally formed.

[0056] In one embodiment, Figure 1As shown, the third crimping portion 42 and the adjacent first crimping portion 213 are configured to crimp the same portion to be crimped 31, and the third crimping portion 42 crimps the outer edge of the portion to be crimped 31. In this configuration, the outermost first crimping portion 213, an adjacent second crimping portion 223, and the adjacent third crimping portion 42 abut against the same portion to be crimped 31, and the second crimping portion 223 and the third crimping portion 42 respectively press against the opposite side edges of the portion to be crimped 31, so that the two side edges of the portion to be crimped 31 are subjected to uniform force, thereby preventing the portion to be crimped 31 from tilting due to different forces on both sides, which affects the bonding quality.

[0057] In one embodiment, Figure 1 As shown, the pressure plate structure also includes a crimping assembly 80, and the crimping assembly 80 includes a plurality of fourth pressure pins 801. The fourth pressure pin 801 is crimped with the pin 33. Since the pin 33 is connected to the portion to be crimped 31, the fourth pressure pin 812 applies a force to the portion to be crimped 31 by applying a force to the pin 33, so that the force on the portion to be crimped 31 is uniform, thereby preventing the portion to be crimped 31 from tilting. In some embodiments, one of the fourth pressure pins 811 in the crimping assembly 80 is located on the same side of the through hole 101 as the third pressure pin 401, and the remaining fourth pressure pins 812 and the crimping structure 20 are located on opposite sides of the through hole 101.

[0058] In one embodiment, the material of the first pressing needle 212 and the second pressing needle 222 can be tungsten steel. In this way, the first pressing needle 212 and the second pressing needle 222 have good strength and toughness and are not prone to breakage.

[0059] The present application also provides a bonding device. The bonding device includes the pressure plate structure for bonding devices described in any of the above embodiments, a driving unit, and a welding head. The driving unit is configured to drive the pressure plate structure to rise and fall.

[0060] In one embodiment, the bonding device further includes a base, the pressure plate is mounted on the base, the driving unit drives the base to move up and down, and the base then drives the pressure plate structure to move up and down.

[0061] In one embodiment, the driving portion may be a motor.

[0062] In one embodiment, the bonding device further includes a moving portion, and the moving portion is configured to drive the device to be bonded to move so that the device to be bonded moves below the pressure plate structure.

[0063] In one embodiment, the bonding device further comprises a slide rail, and the moving part can move along the slide rail. The base can be arranged on both sides of the slide rail.

[0064] It should be noted that in the accompanying drawings, the sizes of layers and regions may be exaggerated for clarity of illustration. It will also be understood that when an element or layer is referred to as being "on" another element or layer, it may be directly on the other element, or there may be an intermediate layer. In addition, it will be understood that when an element or layer is referred to as being "under" another element or layer, it may be directly under the other element, or there may be more than one intermediate layer or element. In addition, it will also be understood that when a layer or element is referred to as being "between" two layers or elements, it may be the only layer between the two layers or elements, or there may also be more than one intermediate layer or element. Similar reference numerals throughout the text indicate similar elements.

[0065] Those skilled in the art will readily appreciate other embodiments of the present application after considering the specification and practicing the contents disclosed herein. This application is intended to cover any variations, uses, or adaptations of the present application that follow the general principles of this application and include common knowledge or customary techniques in the art not disclosed herein. The description and examples are to be considered as exemplary only, and the true scope and spirit of the present application are indicated by the following claims.

[0066] It should be understood that the present application is not limited to the exact structures described above and shown in the drawings, and that various modifications and changes may be made without departing from the scope thereof. The scope of the present application is limited only by the appended claims.

Claims

1. A pressure plate structure for a bonding device, characterized in that: The pressure plate structure comprises: A pressing plate, provided with a through hole for exposing the structure to be bonded; The crimping structure includes at least a first crimping needle assembly and a second crimping needle assembly; the first crimping needle assembly includes a first fixing portion and at least two first crimping needles connected to the first fixing portion; the first fixing portion is connected to the pressing plate; the first crimping needle includes a first crimping portion away from the first fixing portion, and the first crimping portion extends into the through hole; the second crimping needle assembly includes a second fixing portion and at least two second crimping needles connected to the second fixing portion; the second fixing portion is located on the side of the first fixing portion away from the pressing plate and is connected to the pressing plate; the second crimping needle includes a second crimping portion away from the second fixing portion, and the second crimping portion extends into the through hole; the end face of the first crimping portion and the end face of the second crimping portion are both used to abut against the structure to be bonded and are located in the same plane; the at least two first crimping needles and the at least two second crimping needles are arranged in the same direction, and at least one second crimping needle is provided between two adjacent first crimping needles; in a direction parallel to the surface of the pressing plate facing the first fixing portion, the distance between the first crimping portion and the first fixing portion is smaller than the distance between the second crimping portion and the first fixing portion.

2. The pressure plate structure for bonding equipment according to claim 1, characterized in that: The first pressing needle also includes a first connecting portion connected to the first fixing portion, and the end of the first connecting portion facing away from the first fixing portion is connected to the first crimping portion; the extension direction of the orthographic projection of the first connecting portion on the plane where the surface of the pressing plate is located and the extension direction of the orthographic projection of the first crimping portion on the plane where the surface of the pressing plate is located are the same.

3. The pressure plate structure for bonding equipment according to claim 1, characterized in that: The second pressing needle also includes a second connecting portion connected to the second fixing portion, and the end of the second connecting portion facing away from the second fixing portion is connected to the second crimping portion; the angle between the extension direction of the orthographic projection of the second connecting portion on the plane where the surface of the pressing plate is located and the extension direction of the orthographic projection of the second crimping portion on the plane where the surface of the pressing plate is located is in the range of 20° to 40°.

4. The pressure plate structure for bonding equipment according to claim 1, characterized in that: Two second pressing pins are provided between two adjacent first pressing pins, and from the end of the second pressing portion close to the second fixing portion to the end of the second pressing portion away from the second fixing portion, the second pressing portion is inclined toward the direction of the first pressing pin adjacent to the second pressing portion; The structure to be bonded includes a plurality of portions to be crimped arranged in parallel, and the arrangement direction of the plurality of portions to be crimped is the same as the arrangement direction of the at least two first crimping pins; the second crimping portion and the adjacent first crimping portion are configured to crimp the same portion to be crimped, and the first crimping portion crimps the end of the portion to be crimped facing the first fixing portion, and the second crimping portion crimps one side edge of the portion to be crimped.

5. The pressure plate structure for bonding equipment according to claim 4, characterized in that: In the crimping structure, in the arrangement direction of the first pressure pins, the two outermost pressure pins are both the first pressure pins; the pressing plate structure further includes two auxiliary crimping portions, the two auxiliary crimping portions are located on opposite sides of the through hole, and the auxiliary crimping portions include at least one third pressure pin; The third pressing pin is connected to the pressing plate, and the third pressing pin includes a third crimping portion away from the pressing plate, the third crimping portion extends into the through hole, and the end face of the third crimping portion is used to abut against the structure to be bonded; the third crimping portion and the adjacent first crimping portion are configured to crimp the same portion to be crimped, and the third crimping portion crimps the outer edge of the portion to be crimped.

6. The pressure plate structure for bonding equipment according to claim 1, characterized in that: The first pressing needle further includes a first connecting portion connected to the first fixing portion, an end of the first connecting portion facing away from the first fixing portion is connected to the first crimping portion; an angle between an extending direction of the first connecting portion and an extending direction of the first crimping portion is in a range of 50° to 70°; and / or, The second pressing needle also includes a second connecting portion connected to the second fixing portion, and the end of the second connecting portion facing away from the second fixing portion is connected to the second crimping portion; the end of the second connecting portion facing away from the second fixing portion is connected to the second crimping portion; the angle between the extension direction of the second connecting portion and the extension direction of the second crimping portion is in the range of 50° to 70°.

7. The pressure plate structure for bonding equipment according to claim 1, characterized in that: An area of ​​an end surface of the first pressing portion is larger than an area of ​​an end surface of the second pressing portion.

8. The pressure plate structure for bonding equipment according to claim 1, characterized in that: The first pressure needle also includes a first connecting portion connected to the first fixing portion, and the end of the first connecting portion facing away from the first fixing portion is connected to the first crimping portion; the orthographic projection of the first connecting portion on the plane where the surface of the pressure plate is located is located between the orthographic projection of the first crimping portion on the plane where the surface of the pressure plate is located and the orthographic projection of the first fixing portion on the plane where the surface of the pressure plate is located.

9. The pressure plate structure for bonding equipment according to claim 1, characterized in that: The second pressure needle also includes a second connecting portion connected to the second fixing portion, and the end of the second connecting portion facing away from the second fixing portion is connected to the second crimping portion; the orthographic projection of the second connecting portion on the plane where the surface of the pressure plate is located is located between the orthographic projection of the second crimping portion on the plane where the surface of the pressure plate is located and the orthographic projection of the second fixing portion on the plane where the surface of the pressure plate is located.

10. A bonding device, characterized in that: The bonding device comprises the pressure plate structure for bonding device and a driving part according to any one of claims 1 to 9; the driving part is configured to drive the bonding device to rise and fall.

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