Silicon wafer positioning mechanism and silicon wafer processing equipment

Abstract

The present application relates to a silicon wafer positioning mechanism and silicon wafer processing equipment, including a base and a cover body, the base having a bearing surface, the bearing surface being provided with a stacking position for stacking at least two silicon wafers, and the bearing surface being provided with an assembly groove; the cover body being detachably provided on the base and being provided with an assembly part and a pressing part, the assembly part being able to be assembled with the assembly groove to form a negative pressure space, the base being further provided with an air hole, the air hole being used to connect the negative pressure space with a negative pressure device, the cover body being provided with an operation window, the operation window being provided corresponding to the stacking position, and the pressing part being used to press the silicon wafer at the top layer in the stacking position. Compared with the conventional technology, the above-mentioned silicon wafer positioning mechanism generates suction on the cover body through the negative pressure environment in the negative pressure space, so that the pressing part on the cover body can evenly press the silicon wafer at the stacking position, and will not cause excessive extrusion to the silicon wafer and damage the silicon wafer, thereby improving the manufacturing yield of the semiconductor chip.

Description

Technical Field

[0001] The present application relates to the technical field of micro-nano processing, and in particular to a silicon wafer positioning mechanism and silicon wafer processing equipment. Background Art

[0002] With the rapid development of technologies such as smartphones and the Internet of Things, the semiconductor industry has become one of the most competitive industries in the world. In the manufacturing process of semiconductor chips, it is necessary to align and position multi-layer silicon wafers or other substrates to replicate and transfer the micro-nano structures on the silicon wafers or substrates to the silicon wafers in contact with them.

[0003] In traditional technology, it is usually necessary to use tools such as suction cups to adsorb silicon wafers, and use three-dimensional precision translation stages and microscopes to achieve alignment and pressing of multi-layer silicon wafers. However, due to operational errors, the silicon wafers may be over-squeezed and damaged during the pressing process, resulting in a low yield rate in semiconductor chip manufacturing. Summary of the invention

[0004] Based on this, it is necessary to provide a silicon wafer positioning mechanism and silicon wafer processing equipment to address the problem of silicon wafer damage caused by excessive extrusion, which leads to low yield rate of semiconductor chips.

[0005] The technical solution is as follows:

[0006] One embodiment provides a silicon wafer positioning mechanism, comprising:

[0007] A base, the base having a carrying surface, the carrying surface being provided with a stacking position for stacking at least two silicon wafers, the carrying surface being provided with an assembly groove; and

[0008] A cover body, wherein the cover body is detachably mounted on the base and is provided with an assembly part and a pressing part, wherein the assembly part can be assembled with the assembly groove to form a negative pressure space, and the base is also provided with an air hole, wherein the air hole is used to connect the negative pressure space with the negative pressure device, and the cover body is provided with an operation window, wherein the operation window is arranged corresponding to the stacking position, and the pressing part is used to press the silicon wafer located at the top layer in the stacking position.

[0009] When the above-mentioned silicon wafer positioning mechanism is used, the cover body is first removed from the base, at least two silicon wafers are stacked in the stacking position of the bearing surface of the base, and then the assembly part of the cover body is assembled with the assembly groove of the bearing surface, so that the pressing part on the cover body is pressed against the silicon wafer on the top of the stacking position. At this time, the negative pressure device sucks away the gas in the negative pressure space through the air holes to form a negative pressure in the negative pressure space. Under the action of the negative pressure environment in the negative pressure space, the assembly part is firmly adsorbed in the assembly groove, so that the pressing part on the cover body can firmly press the silicon wafer in the stacking position to achieve the positioning of the silicon wafer, and then the silicon wafer is subsequently processed through the operation window; compared with the traditional technology, the above-mentioned silicon wafer positioning mechanism generates suction on the cover body through the negative pressure environment in the negative pressure space, so that the pressing part on the cover body can evenly press the silicon wafer in the stacking position, and will not cause excessive squeezing to the silicon wafer and damage the silicon wafer, thereby improving the manufacturing yield of semiconductor chips.

[0010] In one of the embodiments, the assembly groove is arranged around the circumference of the stacking position, and the assembly portion includes an annular protrusion, which is arranged around the circumference of the operation window. The annular protrusion can be assembled with the assembly groove to form the negative pressure space.

[0011] In one embodiment, the assembly groove is provided with a first groove section and a second groove section, the first groove section and the second groove section are arranged in sequence along the depth direction of the assembly groove, the groove width of the first groove section is set to a first width, the groove width of the second groove section is set to a second width, the first width is greater than the second width, the first groove section is used to accommodate the annular protrusion, and the air hole is connected to the second groove section.

[0012] In one of the embodiments, the silicon wafer positioning mechanism further includes a first sealing ring, which is disposed on the inner side wall of the first groove section and can abut against the outer side wall of the annular protrusion.

[0013] In one of the embodiments, the silicon wafer positioning mechanism further includes a second sealing ring, which is disposed on the outer side wall of the first groove section and can abut against the inner side wall of the annular protrusion.

[0014] In one embodiment, at least two air holes are provided, and all of the air holes are arranged at intervals along the circumference of the second slot segment.

[0015] In one of the embodiments, the pressing portion includes a pressing block, which is disposed on a side wall of the operation window, and the pressing block is used to press the silicon wafer located at the uppermost layer of the stacking position.

[0016] In one embodiment, at least two pressing blocks are provided, and all the pressing blocks are arranged at intervals along the circumference of the operating window.

[0017] In one embodiment, a limiting groove is provided on a side of the base facing away from the bearing surface, and a limiting notch is provided on a side wall of the limiting groove. The silicon wafer positioning mechanism also includes a supporting component, and the supporting component is provided with a limiting column. A limiting protrusion is provided on the side wall of the limiting column. The limiting column can enter the limiting groove and assemble the limiting protrusion with the limiting notch.

[0018] Another embodiment provides a silicon wafer processing device, which includes the silicon wafer positioning mechanism as described above. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0020] FIG. 1 is a schematic diagram of the overall structure of a silicon wafer positioning mechanism in one embodiment of the present application.

[0021] FIG. 2 is a schematic diagram of the AA section in FIG. 1 .

[0022] FIG. 3 is an exploded view of a silicon wafer positioning mechanism in an embodiment of the present application.

[0023] FIG. 4 is an exploded view of the silicon wafer positioning mechanism from another angle in one embodiment of the present application.

[0024] Notes on the attached drawings:

[0025] 100, base; 110, bearing surface; 111, stacking position; 120, assembly groove; 121, first groove section; 122, second groove section; 123, negative pressure space; 130, air hole; 140, limiting groove; 141, limiting notch; 200, cover; 210, assembly part; 211, annular protrusion; 220, pressing part; 221, pressing block; 230, operation window; 300, silicon wafer; 400, supporting component; 410, limiting column; 411, limiting protrusion. DETAILED DESCRIPTION

[0026] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.

[0027] In the description of the present application, it should be understood that if the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, the orientation or position relationship indicated by these terms is based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0028] In addition, if the terms "first" or "second" appear, these terms are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of this application, if the term "plurality" appears, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0029] In this application, unless otherwise clearly specified and limited, if the terms "installed", "connected", "connected", "fixed" and the like appear, these terms should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integrated connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0030] In the present application, unless otherwise clearly specified and limited, if there is a description that a first feature is "above" or "below" a second feature, etc., or similar descriptions appear, it may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "above" and "above" the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. The first feature being "below", "below" and "below" the second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0031] It should be noted that if an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. If an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. If any, the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in this application are for illustrative purposes only and do not represent the only implementation method.

[0032] Please refer to Figures 1 to 4. An embodiment of the present application provides a silicon wafer positioning mechanism, including a base 100 and a cover body 200. The base 100 has a carrying surface 110, and the carrying surface 110 is provided with a stacking position 111 for stacking at least two silicon wafers 300. The carrying surface 110 is provided with an assembly groove 120; the cover body 200 is detachably arranged on the base 100 and is provided with an assembly part 210 and a pressing part 220. The assembly part 210 can be assembled with the assembly groove 120 to form a negative pressure space 123. The base 100 is also provided with an air hole 130, and the air hole 130 is used to connect the negative pressure space 123 with the negative pressure device. The cover body 200 is provided with an operation window 230, and the operation window 230 is arranged corresponding to the stacking position 111. The pressing part 220 is used to press the uppermost silicon wafer 300 located in the stacking position 111.

[0033] When the above-mentioned silicon wafer positioning mechanism is used, the cover body 200 is first removed from the base 100, at least two silicon wafers 300 are stacked on the stacking position 111 of the bearing surface 110 of the base 100, and then the assembly part 210 of the cover body 200 is assembled with the assembly groove 120 of the bearing surface 110, so that the pressing part 220 on the cover body 200 presses against the uppermost silicon wafer 300 in the stacking position 111. At this time, the negative pressure device sucks away the gas in the negative pressure space 123 through the air hole 130 to form a negative pressure in the negative pressure space 123. Under the action of the negative pressure environment in the negative pressure space 123, the assembly part 210 is firmly It is firmly adsorbed in the assembly groove 120, so that the pressing part 220 on the cover body 200 can firmly press the silicon wafer 300 located at the stacking position 111 to achieve the positioning of the silicon wafer 300, and then the silicon wafer 300 is subsequently processed through the operation window 230; compared with the traditional technology, the above-mentioned silicon wafer positioning mechanism generates suction on the cover body 200 through the negative pressure environment in the negative pressure space 123, so that the pressing part 220 on the cover body 200 can evenly press the silicon wafer 300 at the stacking position 111, and will not cause excessive squeezing to the silicon wafer 300 and damage the silicon wafer 300, thereby improving the manufacturing yield of semiconductor chips.

[0034] For explanation, the silicon wafer 300 is used as a raw material for manufacturing semiconductor chips. When replicating micro-nano structures on the silicon wafer 300, it is necessary to stack the prepared silicon wafer 300 as a mask (hereinafter referred to as the mask silicon wafer) and the silicon wafer to be processed which is pre-evenly coated with photoresist. Through the photolithography process, a light source is used to penetrate the pattern defined on the mask silicon wafer, so as to replicate the pattern on the silicon wafer to be processed. In this process, it is necessary to ensure that there is no relative movement between the mask silicon wafer and the silicon wafer to be processed. In this application, the silicon wafer 300 located at the top of the stacking position 111 is used as the mask silicon wafer, and the silicon wafer 300 located below the mask silicon wafer is used as the silicon wafer to be processed. The pressing portion 220 of the cover body 200 can uniformly press the mask silicon wafer, so that there is no movement between the mask silicon wafer and the silicon wafer to be processed in the X-axis, Y-axis and Z-axis directions. The light source passes through the mask silicon wafer and the silicon wafer to be processed in turn through the operating window 230 to replicate the pattern on the mask silicon wafer onto the silicon wafer to be processed.

[0035] Furthermore, there may be multiple silicon wafers to be processed, and the multiple silicon wafers to be processed are located at the stacking position 111 and are stacked in sequence on the lower part of the film plate silicon wafer to form a stacking unit. When the number of silicon wafers to be processed is different, the height of the stacking unit formed by stacking the silicon wafers to be processed and the film plate silicon wafer is also different. In the conventional technology, when stacking units with different heights are pressed, there are often operational errors. For example, when a stacking unit with a relatively high height is pressed, the silicon wafer 300 in the stacking unit may be squeezed and damaged due to the excessive pressing stroke. When a stacking unit with a relatively low height is pressed, the silicon wafer 300 in the stacking unit may not be effectively positioned due to the excessive pressing stroke. position; in the present application, the suction force generated by the negative pressure space 123 enables the cover body 200 to move along the depth direction of the assembly groove 120. When the pressing portion 220 on the cover body 200 contacts the film plate silicon wafer at the top of the stacking position 111, the cover body 200 stops moving. It is highly flexible and can be applied to stacking units of different heights; that is, the silicon wafer positioning mechanism in the present application can adaptively adjust the pressing stroke of the pressing portion 220 according to the height of the stacking unit when pressing stacking units of different heights, so as to eliminate the operating errors in the traditional technology, and will not cause excessive squeezing to the silicon wafer 300 and damage the silicon wafer 300, thereby improving the manufacturing yield of semiconductor chips.

[0036] The silicon wafer positioning mechanism in this embodiment has a small overall size, is portable, occupies little space, has a low manufacturing cost and is easy to maintain later.

[0037] Please refer to FIG. 3 and FIG. 4 . In one embodiment, the assembly portion 210 is disposed on a surface of the cover 200 facing the base 100 .

[0038] Optionally, the pressing portion 220 may be disposed on a surface of the cover 200 away from the base 100 and extend to the operation window 230 , or may be directly disposed on a side wall of the operation window 230 , which is not specifically limited herein.

[0039] Optionally, the shape of the assembly groove 120 corresponds to the assembly part 210. For example, the assembly part 210 is a column protruding from the cover body 200, and the assembly groove 120 is a cylindrical groove; the assembly part 210 is an annular protrusion 211 protruding from the cover body 200, and the assembly groove 120 is an annular groove, which is not specifically limited here.

[0040] Furthermore, in other feasible embodiments, at least two assembly parts 210 and assembly grooves 120 are provided and arranged in one-to-one correspondence, and all the assembly parts 210 are arranged at intervals along the circumference of the cover body 200 to make the pressing stroke of the cover body 200 more uniform.

[0041] For example, the negative pressure device includes an external vacuum pump and a stop valve (not shown in the figure). The external vacuum pump is connected to the air hole 130 through the stop valve. The opening and closing of the stop valve is used to control the external vacuum pump to suck air through the air hole 130, and the implementation cost is low.

[0042] Please refer to Figures 3 and 4. In one embodiment, the assembly groove 120 is arranged around the circumference of the stacking position 111. The assembly portion 210 includes an annular protrusion 211, which is arranged around the circumference of the operating window 230. The annular protrusion 211 can be assembled with the assembly groove 120 to form a negative pressure space 123.

[0043] The annular protrusion 211 can be assembled with the assembly groove 120 arranged circumferentially along the stacking position 111 to form an annular negative pressure space 123. When the negative pressure device sucks away the gas in the annular negative pressure space 123 through the air hole 130, the annular negative pressure space 123 can make the cover body 200 move more evenly in the depth direction of the assembly groove 120, avoiding the phenomenon that one side of the cover body 200 moves while the other side does not move, thereby causing uneven stress on the silicon wafer 300, thereby enabling the pressing portion 220 on the cover body 200 to more evenly press the silicon wafer 300 at the stacking position 111.

[0044] Specifically, referring to FIG. 3 and FIG. 4 , the shape of the cover 200 and the base 100 are both roughly cylindrical, the assembly groove 120 is arranged around the circumference of the stacking position 111 to form a circular groove, and the annular protrusion 211 matches the shape of the circular groove.

[0045] Please refer to Figure 2. In one embodiment, the assembly groove 120 is provided with a first groove section 121 and a second groove section 122. The first groove section 121 and the second groove section 122 are arranged in sequence along the depth direction of the assembly groove 120. The groove width of the first groove section 121 is set to a first width (i.e., width B in Figure 2), and the groove width of the second groove section 122 is set to a second width (i.e., width C in Figure 2). The first width is greater than the second width. The first groove section 121 is used to accommodate the annular protrusion 211, and the air hole 130 is connected to the second groove section 122.

[0046] When the annular protrusion 211 is assembled with the assembly groove 120, the first groove section 121 accommodates the annular protrusion 211. Since the groove width of the first groove section 121 is greater than the groove width of the second groove section 122, the connection between the second groove section 122 and the first groove section 121 can limit the annular protrusion 211 to restrict the annular protrusion 211 from entering the second groove section 122. Such a configuration can, on the one hand, prevent the annular protrusion 211 from excessively moving along the depth direction of the assembly groove 120 and causing extrusion damage to the silicon wafer 300. On the other hand, it can also prevent the annular protrusion 211 from entering the second groove section 122 and blocking the air hole 130 connected to the second groove section 122, thereby affecting the negative pressure effect formed in the negative pressure space 123.

[0047] As a further explanation, since the width of the first groove section 121 is greater than that of the second groove section 122, a limiting step is provided at the connection between the first groove section 121 and the second groove section 122 and is arranged toward the first groove section 121. The limiting step can resist the annular protrusion 211 and limit the annular protrusion 211 from entering the second groove section 122. At this time, the annular protrusion 211 and the second groove section 122 are surrounded to form a negative pressure space 123. The negative pressure device absorbs the gas in the negative pressure space 123 through the air hole 130, and firmly adsorbs the annular protrusion 211 in the first groove section 121, thereby achieving compression of the silicon wafer 300.

[0048] Specifically, the ring width of the annular protrusion 211 (ie, the difference between the outer diameter and the inner diameter of the annular protrusion 211 ) is greater than the second width and matches the first width.

[0049] In one embodiment, the silicon wafer positioning mechanism further includes a first sealing ring (not shown in the figure), which is disposed on the inner wall of the first groove section 121 and can abut against the outer wall of the annular protrusion 211 .

[0050] The first sealing ring can prevent gas from entering and exiting the negative pressure space 123 from between the inner wall of the first groove section 121 and the outer wall of the annular protrusion 211, thereby improving the sealing performance of the negative pressure space 123 and the reliability of the negative pressure environment formed.

[0051] In one embodiment, the silicon wafer positioning mechanism further includes a second sealing ring (not shown in the figure), which is disposed on the outer side wall of the first groove section 121 and can abut against the inner side wall of the annular protrusion 211 .

[0052] The second sealing ring can prevent gas from entering and exiting the negative pressure space 123 from between the outer wall of the first groove section 121 and the inner wall of the annular protrusion 211, thereby improving the sealing of the negative pressure space 123 and the reliability of the negative pressure environment formed.

[0053] In a preferred embodiment of the present application, the first sealing ring and the second sealing ring can be simultaneously disposed in the assembly groove 120 to further improve the sealing performance of the negative pressure space 123 .

[0054] For example, the first sealing ring and the second sealing ring are made of rubber.

[0055] In one embodiment, at least two air holes 130 are provided, and all the air holes 130 are arranged at intervals along the circumference of the second slot segment 122 .

[0056] Such a configuration can suction air at least at two positions in the negative pressure space 123, thereby forming a more uniform negative pressure environment in the negative pressure space 123, thereby uniformly adsorbing the assembly part 210, so that the pressing part 220 on the cover body 200 can uniformly press the silicon wafer 300 to prevent damage to the silicon wafer 300.

[0057] Please refer to FIG. 1 and FIG. 2 . In one embodiment, the air hole 130 is formed on the side wall of the base 100 and communicates with the second groove section 122 . In other embodiments, the air hole 130 may also be formed on the bottom wall of the base 100 , which will not be described in detail here.

[0058] Please refer to FIGS. 1 to 4 . In one embodiment, the pressing portion 220 includes a pressing block 221 . The pressing block 221 is disposed on a side wall of the operation window 230 . The pressing block 221 is used to press the silicon wafer 300 at the uppermost layer of the stacking position 111 .

[0059] The pressing block 221 disposed on the side wall of the operating window 230 can not only reliably press the silicon wafer 300 located at the top of the stacking position 111 , but also will not affect subsequent processes of the silicon wafer 300 through the operating window 230 .

[0060] Please refer to FIG. 1 to FIG. 4 . In one embodiment, at least two pressing blocks 221 are provided, and all the pressing blocks 221 are arranged at intervals along the circumference of the operation window 230 .

[0061] At least two pressing blocks 221 are arranged at intervals along the circumference of the operating window 230 to more reliably and evenly press the silicon wafer 300 circumferentially without excessively squeezing and damaging the silicon wafer 300 , thereby improving the manufacturing yield of semiconductor chips.

[0062] Please refer to Figures 3 and 4. In one embodiment, a limiting groove 140 is provided on the side of the base 100 facing away from the bearing surface 110, and a limiting notch 141 is provided on the side wall of the limiting groove 140. The silicon wafer positioning mechanism also includes a supporting component 400, and the supporting component 400 is provided with a limiting column 410. The side wall of the limiting column 410 is provided with a limiting protrusion 411. The limiting column 410 can enter the limiting groove 140 and make the limiting protrusion 411 assembled with the limiting notch 141.

[0063] The limiting column 410 of the supporting component 400 can be assembled with the limiting groove 140 on the side of the base 100 facing away from the bearing surface 110, and the limiting protrusion 411 on the side wall of the limiting column 410 can be assembled with the limiting notch 141 on the side wall of the limiting groove 140 to prevent the base 100 from rotating relative to the supporting component 400 and affecting the replication of the pattern on the silicon wafer 300.

[0064] Another embodiment of the present application provides a silicon wafer 300 processing device, including a silicon wafer positioning mechanism as described in any of the above embodiments.

[0065] When the above-mentioned silicon wafer 300 processing equipment is used, the cover body 200 is first removed from the base 100, at least two silicon wafers 300 are stacked on the stacking position 111 of the bearing surface 110 of the base 100, and then the assembly part 210 of the cover body 200 is assembled with the assembly groove 120 of the bearing surface 110, so that the pressing part 220 on the cover body 200 presses against the uppermost silicon wafer 300 in the stacking position 111. At this time, the negative pressure device sucks away the gas in the negative pressure space 123 through the air hole 130 to form a negative pressure in the negative pressure space 123. Under the action of the negative pressure environment in the negative pressure space 123, the assembly part 210 is It is firmly adsorbed in the assembly groove 120, so that the pressing part 220 on the cover body 200 can firmly press the silicon wafer 300 located at the stacking position 111 to achieve the positioning of the silicon wafer 300, and then the silicon wafer 300 is subsequently processed through the operation window 230; compared with the traditional technology, the above-mentioned silicon wafer positioning mechanism generates suction on the cover body 200 through the negative pressure environment in the negative pressure space 123, so that the pressing part 220 on the cover body 200 can evenly press the silicon wafer 300 at the stacking position 111, and will not cause excessive squeezing to the silicon wafer 300 and damage the silicon wafer 300, thereby improving the manufacturing yield of semiconductor chips.

[0066] The technical features of the above embodiments may be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0067] The above embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent application shall be subject to the attached claims.

Claims

1. A silicon wafer positioning mechanism, characterized in that: include: A base, the base having a bearing surface, the bearing surface being provided with a stacking position for stacking at least two silicon wafers, the bearing surface being provided with an assembly groove, the assembly groove being arranged around the circumference of the stacking position; and The cover body is detachably mounted on the base and is provided with an assembly part and a pressing part, the assembly part can be assembled with the assembly groove to form a negative pressure space, the base is also provided with an air hole, the air hole is used to connect the negative pressure space with the negative pressure device, the cover body is provided with an operation window, the operation window is arranged corresponding to the stacking position, the pressing part is used to press the silicon wafer located at the top layer in the stacking position, the silicon wafer located at the top layer of the stacking position is a diaphragm plate silicon wafer, and the silicon wafer located below the diaphragm plate silicon wafer is a silicon wafer to be processed, the assembly part includes an annular protrusion, and the annular protrusion is arranged along the operation window. The window is circumferentially arranged, and the annular protrusion can be assembled with the assembly groove to form the negative pressure space. The silicon wafers to be processed are provided in plurality, and the plurality of silicon wafers to be processed are located in the stacking position and are stacked in sequence on the lower part of the membrane plate silicon wafer to form a stacking unit. The cover body moves along the depth direction of the assembly groove through the suction force generated by the negative pressure space. When the pressing part abuts against the membrane plate silicon wafer located at the uppermost part of the stacking position, the cover body stops moving to be suitable for the stacking units of different heights, and then the pressing stroke of the pressing part is adaptively adjusted according to the height of the stacking unit.

2. The silicon wafer positioning mechanism according to claim 1, characterized in that: The assembly portion is disposed on a surface of the cover body facing the base.

3. The silicon wafer positioning mechanism according to claim 1, characterized in that: The assembly groove is provided with a first groove section and a second groove section, and the first groove section and the second groove section are arranged in sequence along the depth direction of the assembly groove, and the groove width of the first groove section is set to a first width, and the groove width of the second groove section is set to a second width, and the first width is greater than the second width. The first groove section is used to accommodate the annular protrusion, and the air hole is connected to the second groove section.

4. The silicon wafer positioning mechanism according to claim 3, characterized in that: The silicon wafer positioning mechanism further includes a first sealing ring, which is arranged on the inner side wall of the first groove section and can abut against the outer side wall of the annular protrusion.

5. The silicon wafer positioning mechanism according to claim 3, characterized in that: The silicon wafer positioning mechanism further includes a second sealing ring, which is arranged on the outer side wall of the first groove section and can abut against the inner side wall of the annular protrusion.

6. The silicon wafer positioning mechanism according to claim 3, characterized in that: There are at least two air holes, and all of the air holes are arranged at intervals along the circumference of the second slot segment.

7. The silicon wafer positioning mechanism according to claim 1, characterized in that: The pressing portion includes a pressing block, which is disposed on a side wall of the operation window and is used for pressing the silicon wafer located at the uppermost layer of the stacking position.

8. The silicon wafer positioning mechanism according to claim 7, characterized in that: There are at least two pressing blocks, and all the pressing blocks are arranged at intervals along the circumference of the operating window.

9. The silicon wafer positioning mechanism according to claim 1, characterized in that: A limiting groove is provided on a side of the base facing away from the bearing surface, and a limiting notch is provided on a side wall of the limiting groove. The silicon wafer positioning mechanism also includes a supporting component, and the supporting component is provided with a limiting column. A limiting protrusion is provided on the side wall of the limiting column. The limiting column can enter the limiting groove and enable the limiting protrusion to be assembled with the limiting notch.

10. A silicon wafer processing device, characterized in that: The silicon wafer processing equipment comprises the silicon wafer positioning mechanism as described in any one of claims 1-9.

Images