A semiconductor wafer slicing device

Abstract

The present invention provides a semiconductor wafer slicing device, which relates to the technical field of wafer silicon wafers. It includes a support frame, on which there is a cutting mechanism for facilitating the slicing of silicon rods, an adjusting mechanism for facilitating the adjustment of the cutting mechanism, and a collecting mechanism for facilitating the collection of the sliced silicon wafers after cutting. The cutting mechanism includes a first driving roller, a fixed circular plate, a diamond cutting wire, and a cylinder. The adjusting mechanism includes a bottom plate, a rotating shaft, and an adjusting plate. The collecting mechanism includes a placement plate. By setting the adjustable fixed circular plate in cooperation with the wire groove, before cutting, the distance between each diamond cutting wire can be adjusted according to the cutting requirements. Since the cutting of silicon rods is usually used in large-scale production, the diamond cutting wires with adjustable distances can adapt to silicon rods of different diameters and lengths, and the distance between the diamond cutting wires can be flexibly adjusted according to the diameter of the silicon rod and the cutting requirements.

Description

Technical Field

[0001] The present invention belongs to the technical field of wafer silicon wafers, and more specifically, particularly relates to a semiconductor wafer silicon wafer slicing device. Background Art

[0002] Cutting a silicon rod into wafer silicon wafers is a key processing step in the semiconductor industry. Wafer silicon wafers are the basic materials for manufacturing semiconductor devices, and are usually used to produce integrated circuits (ICs) and other semiconductor devices. Generally, the silicon rod is placed on a cutting machine and cut using a diamond wire.

[0003] Chinese Patent Publication No.: CN116587451A, a semiconductor wafer material processing device and method. In the present invention, by installing a motor to rotate, the installation gear can be rotated. Through the transmission of the toothed belt, the transmission gear can drive two installation threaded rods to rotate, so that the moving plate drives the semiconductor wafer material to move and is cut by the wire cutting machine body. When the semiconductor wafer material is cut to a suitable position, the connecting motor is turned on, and the connecting motor drives the connecting gear to rotate. Through the meshing of the connecting gear and the connecting toothed ring, the connecting toothed ring can drive the limiting plate to rotate, which can facilitate the user to quickly collect the semiconductor wafer material.

[0004] The existing silicon rods have the following disadvantages when performing slicing and cutting:

[0005] 1. When the existing silicon rods are sliced and cut, it is not convenient to adjust the wire distance between the diamond wires, resulting in that it can only be adapted to cut silicon wafers with a single thickness, and the adaptability is low. As a semiconductor material, silicon rods usually require high precision during cutting, and the inconveniently adjustable wire distance will cause certain limitations when slicing the silicon rods.

[0006] 2. After the existing silicon rods are sliced and cut, a separated collection device is usually not provided, and the silicon wafers are usually collected in contact with each other. This may cause the silicon wafers to contact and rub against each other, resulting in surface scratches, abrasions or other forms of damage to the silicon wafers, affecting the quality and usability of the silicon wafers.

[0007] Therefore, in view of this, research and improvement are carried out on the existing structure and deficiencies, and a semiconductor wafer silicon wafer slicing device is provided in order to achieve a more practical value purpose. Summary of the Invention

[0008] In order to solve the above technical problems, the present invention provides a semiconductor wafer silicon wafer slicing device to solve the above problems.

[0009] A semiconductor wafer slicing device, comprising a support frame, on which there is a cutting mechanism for facilitating slicing of silicon rods, an adjusting mechanism for facilitating adjustment of the cutting mechanism, and a collecting mechanism for facilitating collection of the sliced wafers. The cutting mechanism includes a first driving roller, a fixed circular plate, a diamond cutting wire, and a cylinder. The adjusting mechanism includes a bottom plate, a rotating shaft, and an adjusting plate. The collecting mechanism includes a placement plate. The number of support frames is four, and the upper ends of each support frame are fixedly installed with the same top plate. The cylinder is fixedly installed at the lower end of the top plate. The bottom plate is fixedly installed between the four support frames. A cylindrical groove is penetrated and opened at the upper end of the bottom plate. The rotating shaft is rotatably installed on the inner side wall of the cylindrical groove. A C-shaped plate is fixedly installed between two support frames. The first driving roller is fixedly installed at the side end of the C-shaped plate. A second driving roller is also fixedly installed at the side end of the C-shaped plate. The number of fixed circular plates is at least two, and there are two sets of fixed circular plates symmetrically arranged. The number of adjusting plates is two. At least two separating plates are fixedly installed at the upper end of the placement plate. The same side plate is fixedly installed between every two support frames. Moving grooves are penetrated and opened at the side ends of the two side plates. Adjusting grooves are penetrated and opened at the lower ends of the two side plates. A cross bar is fixedly installed between every two support frames. At least two fixing plates are fixedly installed at the upper end of the bottom plate. The same round rod is penetrated and rotatably installed between every two fixing plates. First bevel gears are fixedly installed at the circumferential ends of the two round rods. Second bevel gears are also fixedly installed at the circumferential ends of the two round rods. A cylindrical groove is penetrated and opened at the upper end of the bottom plate. At least two slot holes are also penetrated and opened at the upper end of the bottom plate. The included angle between each two slot holes is five degrees. A third bevel gear is fixedly installed at the upper end of the rotating shaft. The third bevel gear meshes with the two first bevel gears. A pull plate is arranged at the lower end of the rotating shaft. A first telescopic rod is fixedly installed between the pull plate and the rotating shaft. A spring is also fixedly installed between the pull plate and the rotating shaft. Two limiting rods are fixedly installed at the upper end of the pull plate. The first telescopic rod is located inside the spring. The limiting rods slide inside the slot holes. At least two diamond cutting wires are sleeved on the circumferential ends of the first driving roller and the second driving roller. A fixed shaft is fixedly installed between the fixed circular plate on one side of the C-shaped plate and the C-shaped plate. A second telescopic rod is fixedly installed between each two fixed circular plates. A wire groove is opened at the side end of each fixed circular plate. A rotating disk is rotatably installed on the inner side wall of each wire groove. Each diamond cutting wire is located inside the wire groove. A C-shaped rod is fixedly installed at the side end of each fixed circular plate. A circular groove is penetrated and opened at the side end of each C-shaped rod. Each C-shaped rod is slidably installed on the two cross bars through the circular groove. An adjusting rod is also fixedly installed at the side end of the C-shaped rod. At least two adjusting grooves are penetrated and opened at the side end of the adjusting plate. Each adjusting rod is located inside the adjusting groove.L-shaped ejector rods are fixedly installed at the upper ends of the two adjusting plates. The two L-shaped ejector rods are slidably installed on the inner side walls of the movable grooves. Thread grooves are formed through the upper ends of the two L-shaped ejector rods. A threaded rod is rotatably installed on the inner side wall of the adjusting groove. The threaded rod is threadedly and rotatably installed on the inner side wall of the thread groove. Fourth conical teeth are fixedly installed at the circumferential ends of the two threaded rods. The two fourth conical teeth are respectively engaged with the two second conical teeth. The thread directions of the threaded rods on both sides are opposite. Each adjusting groove is inclined.

[0010] Preferably, a clamping arm is fixedly installed at the lower end of the cylinder. Connecting rods are fixedly installed at the side ends of each support frame. The same metal support rod is fixedly installed between every two connecting rods.

[0011] Preferably, placing grooves are formed at the upper ends of the two metal support rods. V-shaped grooves are formed at the side ends of each separating plate. Two connecting plates are fixedly installed at the lower end of the placing plate. Magnets are fixedly installed at the lower ends of the two connecting plates. Arc-shaped baffles are fixedly installed at the side ends of the two connecting plates.

[0012] Compared with the prior art, the present invention has the following beneficial effects:

[0013] In the present invention, by providing the adjustable fixed circular plate in cooperation with the wire groove, the distance between each diamond cutting wire can be adjusted according to the cutting requirements before cutting. Since the silicon rod cutting is usually used in large-scale production, the diamond cutting wire with adjustable distance can adapt to silicon rods of different diameters and lengths, and the distance between the diamond cutting wires can be flexibly adjusted according to the diameter of the silicon rod and the cutting requirements, so as to achieve precise cutting. Moreover, as the silicon rod is a semiconductor material, high precision is usually required during cutting. The diamond cutting wire with adjustable distance can improve the cutting precision and efficiency and reduce the waste during the cutting process.

[0014] In the present invention, by providing the cooperation of the pulling plate, the limiting rod and the slot, after the distance between the diamond cutting wires is adjusted, the rotating shaft can be positioned by inserting the limiting rod on the pulling plate into each slot, and then each diamond cutting wire can be positioned, ensuring that each diamond cutting wire can ensure a stable position and angle when entering and leaving the cutting, making the cutting position accurate and the cutting wire straight, thereby improving the cutting precision and quality and preventing the diamond cutting wire from shifting or shaking during the cutting process, resulting in inaccurate cutting.

[0015] In the present invention, by providing a placement plate and a separation plate in cooperation, after slicing and cutting silicon wafers, each silicon wafer can be collected, and each silicon wafer is separately stored in a V-shaped groove. Since silicon wafers are semiconductor materials, their purity and surface state have an important impact on the performance of devices. The silicon wafers do not contact and rub against each other, avoiding possible surface contamination caused by friction, which affects the quality and performance of the cut silicon wafers, and also avoiding scratches, abrasions or other forms of damage caused by mutual contact and friction, which affect the quality and usability of the silicon wafers.

[0016] In the present invention, by providing two arc-shaped baffles, since the cut silicon wafers are circular, they may roll under force when stored in the V-shaped groove. By setting two arc-shaped baffles to protect the silicon wafers, the situation where the silicon wafers may roll and fall is avoided. At the same time, the arc-shaped baffles are set in an arc shape to adapt to the circular shape of the silicon wafers, avoiding rigid contact caused by the rolling of the silicon wafers and damaging the silicon wafers, and having a good protection effect.

[0017] In the present invention, by providing a connecting plate, a magnetic block and a placement groove in cooperation, when collecting a batch of silicon wafers, the magnetic block on the connecting plate can be taken away from the placement groove by taking the placement plate for centralized collection, and the collection is fast. At the same time, the placement plate is fixed by the magnetic block adsorbed and fixed in the placement groove, ensuring the stability of the separation plate on the placement plate when collecting silicon wafers. Description of the Drawings

[0018] Figure 1 is a schematic diagram of the overall structure of the support frame of the present invention;

[0019] Figure 2 is a schematic diagram of the overall structure of the placement plate of the present invention;

[0020] Figure 3 is a schematic diagram of the overall structure of the clamping arm of the present invention;

[0021] Figure 4 is a schematic diagram of the overall structure of the bottom plate of the present invention;

[0022] Figure 5 is a schematic diagram of the overall structure of the rotating shaft of the present invention;

[0023] Figure 6 is a schematic diagram of the overall structure of the C-shaped plate of the present invention;

[0024] Figure 7 is a schematic diagram of the overall structure of the adjusting plate of the present invention;

[0025] Figure 8 is a schematic diagram of the overall structure of the fixed circular plate of the present invention.

[0026] In the figure, the correspondence between the component names and the drawing numbers is as follows: 1. Support frame; 11. Side plate; 12. Movable groove; 13. Top plate; 14. C-shaped plate; 15. Cross bar; 2. Bottom plate; 21. Fixed plate; 22. Round rod; 23. First bevel gear; 24. Second bevel gear; 25. Cylindrical groove; 26. Slot; 3. Rotating shaft; 31. Third bevel gear; 32. Pulling plate; 33. Limiting rod; 34. Spring; 35. First telescopic rod; 4. First driving roller; 41. Second driving roller; 42. Diamond cutting wire; 5. Fixed round plate; 51. Fixed shaft; 52. Second telescopic rod; 53. Wire groove; 54. Rotating disk; 55. C-shaped rod; 56. Adjusting rod; 57. Round groove; 6. Adjusting plate; 61. Adjusting groove; 62. L-shaped top rod; 63. Threaded groove; 64. Threaded rod; 65. Fourth bevel gear; 7. Cylinder; 71. Clamping arm; 8. Placing plate; 81. Separation plate; 82. V-shaped groove; 83. Arc-shaped baffle; 84. Connecting plate; 85. Magnet; 86. Connecting rod; 87. Metal support rod; 88. Placing groove. Detailed implementation manners

[0027] The following further describes in detail the implementation manners of the present invention in conjunction with the drawings and embodiments. The following embodiments are used to illustrate the present invention, but cannot be used to limit the scope of the present invention.

[0028] Please refer to Figures 1-8, the present invention provides a technical solution, a semiconductor wafer slicing device, which includes a support frame 1. A cutting mechanism for facilitating slicing of silicon rods is provided on the support frame 1. An adjusting mechanism for facilitating adjustment of the cutting mechanism is provided on the support frame 1. A collecting mechanism for facilitating collection of the sliced wafers is provided on the support frame 1. The cutting mechanism includes a first driving roller 4, a fixed circular plate 5, a diamond cutting wire 42 and a cylinder 7. The adjusting mechanism includes a bottom plate 2, a rotating shaft 3 and an adjusting plate 6. The collecting mechanism includes a placing plate 8. The number of support frames 1 is four. The upper end of each support frame 1 is fixedly installed with the same top plate 13. The cylinder 7 is fixedly installed at the lower end of the top plate 13. The bottom plate 2 is fixedly installed between the four support frames 1. A cylindrical groove 25 is formed through the upper end of the bottom plate 2. The rotating shaft 3 is rotatably installed on the inner side wall of the cylindrical groove 25. A C-shaped plate 14 is fixedly installed between two support frames 1. The first driving roller 4 is fixedly installed at the side end of the C-shaped plate 14. A second driving roller 41 is also fixedly installed at the side end of the C-shaped plate 14. The number of fixed circular plates 5 is at least two. There are two groups of fixed circular plates 5 arranged symmetrically. The number of adjusting plates 6 is two. At least two separating plates 81 are fixedly installed at the upper end of the placing plate 8. The same side plate 11 is fixedly installed between every two support frames 1. Activity grooves 12 are formed through the side ends of the two side plates 11. Adjusting grooves 61 are formed through the lower ends of the two side plates 11. A cross bar 15 is fixedly installed between every two support frames 1. At least two fixing plates 21 are fixedly installed at the upper end of the bottom plate 2. The same round rod 22 is rotatably installed through between every two fixing plates 21. First bevel gears 23 are fixedly installed at the circumferential ends of the two round rods 22. Second bevel gears 24 are also fixedly installed at the circumferential ends of the two round rods 22. The user can rotate the pulling plate 32 forward or backward. The rotation of the pulling plate 32 drives the rotating shaft 3 to rotate through the first telescopic rod 35. The rotation of the rotating shaft 3 drives the third bevel gear 31 to rotate. The third bevel gear 31 meshes with the two first bevel gears 23. The rotation of the third bevel gear 31 drives the two first bevel gears 23 to rotate. The rotation of the two first bevel gears 23 drives the round rods 22 on both sides to rotate. The rotation of the two round rods 22 drives the two second bevel gears 24 to rotate;

[0029] A cylindrical groove 25 is formed through the upper end of the bottom plate 2, and at least two slots 26 are also formed through the upper end of the bottom plate 2. The included angle between each slot 26 is five degrees. A third conical gear 31 is fixedly installed at the upper end of the rotating shaft 3. The third conical gear 31 meshes with two first conical gears 23. A pull plate 32 is provided at the lower end of the rotating shaft 3. A first telescopic rod 35 is fixedly installed between the pull plate 32 and the rotating shaft 3. A spring 34 is also fixedly installed between the pull plate 32 and the rotating shaft 3. Two limiting rods 33 are fixedly installed at the upper end of the pull plate 32. The first telescopic rod 35 is located inside the inner side wall of the spring 34. The limiting rods 33 slide on the inner side wall of the slot 26. The user can pull the pull plate 32 downward. When the pull plate 32 moves downward, it drives the limiting rods 33 to move downward. At this time, the spring 34 and the first telescopic rod 35 are stretched. After the pull plate 32 moves downward and drives the limiting rods 33 to leave the inner side wall of the slot 26;

[0030] At least two diamond cutting wires 42 are sleeved on the circumferential ends of the first driving roller 4 and the second driving roller 41. A fixed shaft 51 is fixedly installed between the fixed circular plate 5 on one side of the C-shaped plate 14 and the C-shaped plate 14. A second telescopic rod 52 is fixedly installed between each fixed circular plate 5. A wire groove 53 is formed at the side end of each fixed circular plate 5. A rotating disk 54 is rotatably installed on the inner side wall of each wire groove 53. Each diamond cutting wire 42 is located on the inner side wall of the wire groove 53. A C-shaped rod 55 is fixedly installed at the side end of each fixed circular plate 5. A circular groove 57 is formed through the side end of each C-shaped rod 55. Each C-shaped rod 55 is slidably installed on two cross bars 15 through the circular groove 57. An adjusting rod 56 is also fixedly installed at the side end of the C-shaped rod 55. At least two adjusting grooves 61 are formed through the side end of the adjusting plate 6. Each adjusting rod 56 is located on the inner side wall of the adjusting groove 61. When the adjusting rod 56 moves, it will drive the C-shaped rod 55 to move. The C-shaped rod 55 slides on the cross bar 15 through the circular groove 57. When the C-shaped rod 55 moves, it drives the fixed circular plates 5 to approach or move away from each other. At this time, each second telescopic rod 52 extends or contracts. When the fixed circular plate 5 moves, it drives each diamond cutting wire 42 to move through the C-shaped rod 55. The fixed circular plates 5 on both sides will move synchronously, thereby adjusting the distance between the diamond cutting wires 42 at the cutting position to an appropriate width. After the adjustment is completed, the user can stop rotating the pull plate 32. The user can release the pull plate 32. The spring 34 will pull the pull plate 32 upward. When the pull plate 32 moves upward, it will drive the limiting rods 33 to enter the slot 26 again to limit the rotating shaft 3, ensuring the stability of the distance between the diamond cutting wires 42 during cutting;

[0031] L-shaped ejector rods 62 are fixedly installed at the upper ends of both adjusting plates 6. Both L-shaped ejector rods 62 are slidably installed on the inner sidewalls of the movable grooves 12. Thread grooves 63 are formed through the upper ends of both L-shaped ejector rods 62. A threaded rod 64 is rotatably installed on the inner sidewall of the adjusting groove 61. The threaded rod 64 is threadedly rotatably installed on the inner sidewall of the thread groove 63. Fourth conical teeth 65 are fixedly installed at the circumferential ends of both threaded rods 64. The two fourth conical teeth 65 are respectively meshed with the two second conical teeth 24. The thread directions of the threaded rods 64 on both sides are opposite. Each adjusting groove 61 is inclined. The rotation of the second conical tooth 24 will drive the fourth conical teeth 65 on both sides to rotate. The rotation of the fourth conical teeth 65 on both sides will drive the threaded rod 64 to rotate. The forward or reverse rotation of the two threaded rods 64 will drive the L-shaped ejector rod 62 to move upward or downward through the thread groove 63. Since each adjusting groove 61 on the L-shaped ejector rod 62 is inclined, when the adjusting groove 61 moves, it will drive each adjusting rod 56 to move closer to or away from each other through the adjusting groove 61;

[0032] A clamping arm 71 is fixedly installed at the lower end of the cylinder 7. Connecting rods 86 are fixedly installed at the side ends of each support frame 1. The same metal support rod 87 is fixedly installed between every two connecting rods 86. Placing grooves 88 are formed at the upper ends of both metal support rods 87. V-shaped grooves 82 are formed at the side ends of each separating plate 81. Two connecting plates 84 are fixedly installed at the lower end of the placing plate 8. Magnets 85 are fixedly installed at the lower ends of both connecting plates 84. Arc-shaped baffles 83 are fixedly installed at the side ends of both connecting plates 84. The cut silicon wafers continue to move downward. After the silicon wafers come into contact with the ends of the separating plates 81, they will gradually enter the inner sidewalls of the V-shaped grooves 82. The shape of each V-shaped groove 82 can well adapt to the thickness of the silicon wafers after cutting and slicing. Each sliced silicon wafer is collected in the separating plate 81, so that the sliced silicon wafers do not contact each other. After the silicon rods of a batch are sliced and cut, the user can lift the connecting plate 84 to drive the magnet 85 out of the placing groove 88 to collect the silicon wafers on the placing plate 8.

[0033] Working principle:

[0034] First step, when the user slices the silicon rod, the distance between each diamond cutting wire 42 can be adjusted according to the thickness requirement of the silicon rod slicing. The user can drive the adjustment plates 6 on both sides to move by rotating the rotating shaft 3 for adjustment. After adjustment, the silicon rod can be fixed on the clamping arm 71. Then, start the first driving roller 4 and the second driving roller 41. The start of the first driving roller 4 and the second driving roller 41 drives each diamond cutting wire 42 to rotate at high speed. At this time, start the air cylinder 7 to drive the clamping arm 71 to move downward, and then drive the silicon rod on the clamping arm 71 to move downward to slice the silicon rod. The sliced silicon wafers will fall into the V-shaped grooves 82 on each separation plate 81, and the sliced silicon wafers can be collected;

[0035] Second step, when the user cuts the silicon rod, the distance between each diamond cutting wire 42 can be adjusted first according to the thickness requirement during the processing of the silicon rod, so as to cut silicon wafers with appropriate thickness. The user can pull the pull plate 32 downward. The downward movement of the pull plate 32 drives the limiting rod 33 to move downward. At this time, the spring 34 and the first telescopic rod 35 are stretched. After the pull plate 32 moves downward and the limiting rod 33 leaves the inner wall of the slot 26, the user can rotate the pull plate 32 forward or backward. The rotation of the pull plate 32 drives the rotating shaft 3 to rotate through the first telescopic rod 35. The rotation of the rotating shaft 3 drives the third conical tooth 31 to rotate. The third conical tooth 31 meshes with both first conical teeth 23. The rotation of the third conical tooth 31 drives both first conical teeth 23 to rotate. The rotation of both first conical teeth 23 drives the round rods 22 on both sides to rotate. The rotation of both round rods 22 drives both second conical teeth 24 to rotate. The rotation of the second conical teeth 24 drives the fourth conical teeth 65 on both sides to rotate. The rotation of the fourth conical teeth 65 on both sides drives the threaded rod 64 to rotate. The forward or reverse rotation of the two threaded rods 64 drives the L-shaped ejector rod 62 to move upward or downward through the thread groove 63. Since each adjustment groove 61 on the L-shaped ejector rod 62 is inclined, when the adjustment groove 61 moves, it drives each adjustment rod 56 to move closer or farther away from each other through the adjustment groove 61. The movement of the adjustment rod 56 drives the C-shaped rod 55 to move. The C-shaped rod 55 slides on the cross bar 15 through the round groove 57. The movement of the C-shaped rod 55 drives the fixed circular plates 5 to move closer or farther away from each other. At this time, each second telescopic rod 52 extends or contracts. The movement of the fixed circular plates 5 drives each diamond cutting wire 42 to move through the C-shaped rod 55. The fixed circular plates 5 on both sides move synchronously, and then adjust the distance between the diamond cutting wires 42 at the cutting position to an appropriate width. After the adjustment is completed, the user can stop rotating the pull plate 32. The user can release the pull plate 32, and the spring 34 will pull the pull plate 32 upward. The upward movement of the pull plate 32 will drive the limiting rod 33 to enter the slot 26 again to limit the rotating shaft 3, ensuring the stability of the distance between the diamond cutting wires 42 during cutting;

[0036] By setting the adjustable fixed circular plate 5 in cooperation with the wire groove 53, the device can adjust the spacing between each diamond cutting wire 42 according to the cutting requirements before cutting. Since silicon rod cutting is usually used in mass production, the diamond cutting wire 42 with adjustable spacing can adapt to silicon rods of different diameters and lengths. The spacing between the diamond cutting wires 42 can be flexibly adjusted according to the diameter of the silicon rod and the cutting requirements, so as to achieve precise cutting. And since the silicon rod is a semiconductor material, high precision is usually required during cutting. The diamond cutting wire 42 with adjustable spacing can improve the cutting precision and efficiency, and reduce waste during the cutting process;

[0037] By setting the pull plate 32, the limit rod 33 and the slot 26 in cooperation, after the spacing of the diamond cutting wire 42 is adjusted, the limit rod 33 on the pull plate 32 can be inserted into each slot 26 to position the rotating shaft 3, and then position each diamond cutting wire 42, ensuring that each diamond cutting wire 42 can maintain a stable position and angle when entering and exiting the cutting, making the cutting position accurate and the cutting wire straight, thereby improving the cutting precision and quality, and preventing the diamond cutting wire 42 from shifting or shaking during the cutting process, resulting in inaccurate cutting;

[0038] In the third step, after the adjustment of the diamond cutting wire 42 is completed, the user can fix the silicon rod on the clamping arm 71, start the first driving roller 4 and the second driving roller 41. The start of the first driving roller 4 and the second driving roller 41 will drive the diamond cutting wire 42 to rotate at high speed. At this time, only the cylinder 7 can be started to drive the silicon rod on the clamping arm 71 to move downward. After the silicon rod receives the diamond cutting wire 42 rotating at high speed, it will be cut. The cut silicon wafers continue to move downward. After the silicon wafers contact the end of the separation plate 81, they will gradually enter the inner side wall of the V-shaped groove 82. The shape of each V-shaped groove 82 can well adapt to the thickness of the silicon wafers after cutting and splitting. Each split silicon wafer is collected in the separation plate 81, so that the split silicon wafers do not contact each other. After a batch of silicon rods are cut and split, the user can lift the connecting plate 84 to drive the magnet 85 away from the placement groove 88 to collect the silicon wafers on the placement plate 8;

[0039] By setting the placement plate 8 and the separation plate 81 in cooperation, after the silicon wafers are cut and split, each silicon wafer can be collected, and each silicon wafer is separately stored in the V-shaped groove 82. Since the silicon wafer is a semiconductor material, its purity and surface state have an important impact on the device performance. The silicon wafers do not contact and rub against each other, avoiding possible surface contamination caused by friction, which affects the quality and performance of the cut silicon wafers, and avoiding scratches, abrasions or other forms of damage caused by mutual contact and friction, which affects the quality and usability of the silicon wafers;

[0040] The device is provided with two arc-shaped baffles 83. Since the cut silicon wafers are circular, they may roll under force when stored in the V-shaped groove 82. By providing two arc-shaped baffles 83, the silicon wafers are protected to avoid the situation where the silicon wafers may roll and fall. At the same time, the arc-shaped baffles 83 are set to be arc-shaped, which can adapt to the circular shape of the silicon wafers and avoid damage to the silicon wafers caused by rigid contact during rolling. The protection effect is good.

[0041] The device is provided with a connecting plate 84, a magnet 85 and a placement groove 88 in cooperation. When collecting a batch of silicon wafers, the magnet 85 on the connecting plate 84 can be taken away from the placement groove 88 by taking the placement plate 8 for centralized collection, and the collection is fast. At the same time, the placement plate 8 is fixed by the adsorption of the magnet 85 in the placement groove 88, ensuring the stability of the separation plate 81 on the placement plate 8 during the collection of silicon wafers.

[0042] The embodiments of the present invention are given for purposes of illustration and description, and are not exhaustive or limit the invention to the disclosed form. Many modifications and variations are obvious to those of ordinary skill in the art. The embodiments are chosen and described in order to better illustrate the principles and practical applications of the present invention, and to enable those of ordinary skill in the art to understand the present invention and design various embodiments with various modifications suitable for specific purposes.

Claims

1. A semiconductor wafer slicing device, comprising a support frame (1), characterized in that: The support frame (1) is provided with a cutting mechanism for facilitating slicing of silicon rods, an adjusting mechanism for facilitating adjustment of the cutting mechanism, and a collecting mechanism for facilitating collection of the sliced silicon wafers after cutting; Among them, the cutting mechanism includes a first driving roller (4), a fixed circular plate (5), a diamond cutting wire (42), and a cylinder (7), the adjusting mechanism includes a bottom plate (2), a rotating shaft (3), and an adjusting plate (6), the collecting mechanism includes a placing plate (8), the number of the support frames (1) is four, the upper ends of each of the support frames (1) are fixedly installed with the same top plate (13), the cylinder (7) is fixedly installed at the lower end of the top plate (13), the bottom plate (2) is fixedly installed between the four support frames (1), a cylindrical groove (25) is penetrated and opened at the upper end of the bottom plate (2), the rotating shaft (3) is rotatably installed on the inner side wall of the cylindrical groove (25), a C-shaped plate (14) is fixedly installed between the two support frames (1), the first driving roller (4) is fixedly installed at the side end of the C-shaped plate (14), a second driving roller (41) is also fixedly installed at the side end of the C-shaped plate (14), the number of the fixed circular plates (5) is at least two, the fixed circular plates (5) are symmetrically provided with two groups, the number of the adjusting plates (6) is two, and at least two separating plates (81) are fixedly installed at the upper end of the placing plate (8); The same side plate (11) is fixedly installed between every two support frames (1), movable grooves (12) are penetrated and opened at the side ends of the two side plates (11), adjusting grooves (61) are penetrated and opened at the lower ends of the two side plates (11), a cross bar (15) is fixedly installed between every two support frames (1), at least two fixing plates (21) are fixedly installed at the upper end of the bottom plate (2), the same round bar (22) is penetrated and rotatably installed between every two fixing plates (21), first bevel gears (23) are fixedly installed at the circumferential ends of the two round bars (22), second bevel gears (24) are also fixedly installed at the circumferential ends of the two round bars (22), a cylindrical groove (25) is penetrated and opened at the upper end of the bottom plate (2), at least two slots (26) are penetrated and opened at the upper end of the bottom plate (2), and the included angle between every two slots (26) is five degrees; Among them, a third conical tooth (31) is fixedly installed at the upper end of the rotating shaft (3). The third conical tooth (31) meshes with two first conical teeth (23). A pull plate (32) is provided at the lower end of the rotating shaft (3). A first telescopic rod (35) is fixedly installed between the pull plate (32) and the rotating shaft (3). A spring (34) is also fixedly installed between the pull plate (32) and the rotating shaft (3). Two limiting rods (33) are fixedly installed at the upper end of the pull plate (32). The first telescopic rod (35) is located inside the inner side wall of the spring (34). The limiting rods (33) slide on the inner side wall of the slot (26). At least two diamond cutting wires (42) are sleeved on the circumferential ends of the first transmission roller (4) and the second transmission roller (41). A fixed shaft (51) is fixedly installed between the fixed circular plate (5) on one side of the C-shaped plate (14) and the C-shaped plate (14). A second telescopic rod (52) is fixedly installed between each pair of fixed circular plates (5). A wire groove (53) is formed at the side end of each fixed circular plate (5). A rotating disk (54) is rotatably installed on the inner side wall of each wire groove (53). Each diamond cutting wire (42) is located on the inner side wall of the wire groove (53). A C-shaped rod (55) is fixedly installed at the side end of each fixed circular plate (5). A circular groove (57) is formed through the side end of each C-shaped rod (55). Each C-shaped rod (55) is slidably installed on two cross bars (15) through the circular groove (57). An adjusting rod (56) is also fixedly installed at the side end of the C-shaped rod (55). At least two adjusting grooves (61) are formed through the side end of the adjusting plate (6). Each adjusting rod (56) is located on the inner side wall of the adjusting groove (61). L-shaped ejector rods (62) are fixedly installed at the upper ends of the two adjusting plates (6). The two L-shaped ejector rods (62) are slidably installed on the inner side wall of the movable groove (12). Thread grooves (63) are formed through the upper ends of the two L-shaped ejector rods (62); Among them, a threaded rod (64) is rotatably installed on the inner side wall of the adjusting groove (61). The threaded rod (64) is threadedly rotatably installed on the inner side wall of the thread groove (63). Fourth conical teeth (65) are fixedly installed at the circumferential ends of the two threaded rods (64). The two fourth conical teeth (65) respectively mesh with two second conical teeth (24). The thread directions of the threaded rods (64) on both sides are opposite. Each adjusting groove (61) is inclined; 2. The semiconductor wafer slicing device according to claim 1, wherein A clamping arm (71) is fixedly installed at the lower end of the air cylinder (7). A connecting rod (86) is fixedly installed at the side end of each support frame (1). A same metal support rod (87) is fixedly installed between every two connecting rods (86).

3. The semiconductor wafer slicing device according to claim 2, wherein The upper ends of the two metal support rods (87) are both provided with placing grooves (88), the side ends of each separating plate (81) are both provided with V-shaped grooves (82), the lower end of the placing plate (8) is fixedly installed with two connecting plates (84), and the lower ends of the two connecting plates (84) are both fixedly installed with magnetic blocks (85); Wherein, the side ends of the two connecting plates (84) are both fixedly installed with arc-shaped baffles (83).

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