Methods, devices, equipment and media for evaluating thermal shock insulation performance of polypropylene cables

Abstract

This application relates to a method, apparatus, computer equipment, computer-readable storage medium, and computer program product for evaluating the thermal shock insulation performance of polypropylene cables. The method includes: obtaining a cable slice of the polypropylene cable to be evaluated corresponding to a target insulation layer; the polypropylene cable includes a conductor layer and multiple insulation layers; simulating a preset short-circuit condition of the polypropylene cable to be evaluated to obtain the temperature distribution of the target insulation layer under the preset short-circuit condition; obtaining the thermal stress distribution of the target insulation layer under the preset short-circuit condition based on the temperature distribution; performing thermal shock treatment on the target insulation layer in the cable slice using a thermal shock system according to the temperature and thermal stress distributions; and conducting dielectric property tests on the thermally shock treated cable slice to obtain an insulation performance evaluation result for the target insulation layer of the cable slice. This method can evaluate the insulation performance of polypropylene cables after thermal shock, improving the accuracy of the evaluation.

Description

Technical Field

[0001] This application relates to the field of cable testing technology, and in particular to a method, apparatus, computer equipment, computer-readable storage medium, and computer program product for evaluating the thermal shock of polypropylene cables. Background Technology

[0002] With the continuous development of power cable technology, the requirements of power systems for power cable insulation materials are becoming increasingly stringent. Currently, polypropylene cables have become one of the new environmentally friendly power cable insulation material options to replace XLPE (Cross-Linked Polyethylene) insulation materials. However, as a thermoplastic material, polypropylene insulation materials exhibit significant differences in their structural and performance changes at high temperatures compared to conventional thermosetting insulation materials like XLPE. Therefore, the changes in the insulation performance of polypropylene insulation materials under thermal shock need to be studied. Summary of the Invention

[0003] Therefore, it is necessary to provide a method, apparatus, computer equipment, computer-readable storage medium, and computer program product for evaluating the thermal shock insulation performance of polypropylene cables, which can accurately obtain the evaluation results of the insulation performance of polypropylene cables after thermal shock, in order to address the above-mentioned technical problems.

[0004] In a first aspect, this application provides a method for evaluating the thermal shock insulation performance of polypropylene cables, including:

[0005] Obtain a cable slice of the polypropylene cable to be evaluated corresponding to the target insulation layer; the polypropylene cable includes a conductor layer and multiple insulation layers.

[0006] Based on the preset short-circuit conditions of the polypropylene cable to be evaluated, a simulation was performed to obtain the temperature distribution of the target insulation layer under the preset short-circuit conditions.

[0007] Based on the temperature distribution, the thermal stress distribution of the target insulation layer under the preset short-circuit condition is obtained;

[0008] Using a thermal shock system, the target insulation layer in the cable slice is subjected to thermal shock treatment according to the temperature distribution and the thermal stress distribution;

[0009] The dielectric properties of the cable slices after thermal shock treatment are tested to obtain the insulation performance evaluation results of the target insulation layer of the cable slices.

[0010] In one embodiment, the thermal shock system includes a temperature control module and a mechanical pressurization module;

[0011] The method of using a thermal shock system to perform thermal shock treatment on the target insulation layer in the cable slice according to the temperature distribution and the thermal stress distribution includes:

[0012] Using the temperature control module, the target insulation layer in the cable slice is heated according to the temperature distribution so that the current temperature of each part of the target insulation layer in the cable slice matches the temperature distribution.

[0013] Using the mechanical pressurization module, the target insulation layer in the cable slice is pressurized according to the thermal stress distribution so that the current stress at each part of the target insulation layer in the cable slice matches the thermal stress distribution.

[0014] In one embodiment, the step of simulating the temperature distribution of the target insulation layer under a preset short-circuit condition based on the polypropylene cable to be evaluated includes:

[0015] Based on the preset short-circuit condition of the polypropylene cable to be evaluated, the short-circuit current and short-circuit time matching the preset short-circuit condition are obtained. The short-circuit current, the short-circuit time, and the target insulation layer parameters of the cable slice are input into the simulation tool for simulation to obtain the temperature distribution of the target insulation layer under the preset short-circuit condition.

[0016] The step of obtaining the thermal stress distribution of the target insulation layer under the preset short-circuit condition based on the temperature distribution includes:

[0017] Based on the temperature distribution, the thermal expansion coefficient of the conductor layer, and the thermal expansion coefficient of the target insulation layer, the thermal stress distribution of the target insulation layer under the preset short-circuit condition is obtained.

[0018] In one embodiment, the target insulation layer parameters include the target insulation layer size and parameters related to the thermal conductivity of the target insulation layer;

[0019] The short-circuit current, the short-circuit time, and the target insulation layer parameters of the cable slice are input into a simulation tool for simulation to obtain the temperature distribution of the target insulation layer under the preset short-circuit condition, including:

[0020] The short-circuit current, the short-circuit time, and the target insulation layer parameters of the cable slice are input into a simulation tool. Using the simulation tool, based on the short-circuit current, the short-circuit time, the target insulation layer size, and parameters related to the thermal conductivity of the target insulation layer, the temperature change process of the polypropylene cable transferring heat to the target insulation layer after the conductor heats up under short-circuit conditions is simulated, and the temperature distribution of the target insulation layer under the preset short-circuit conditions is obtained.

[0021] In one embodiment, obtaining the thermal stress distribution of the target insulating layer under a preset short-circuit condition based on the temperature distribution, the thermal expansion coefficient corresponding to the conductor layer, and the thermal expansion coefficient corresponding to the target insulating layer includes:

[0022] For the interface between the conductor layer and the target insulating layer, based on the temperature change value of the interface between the conductor layer and the target insulating layer obtained from the temperature distribution, the corresponding thermal expansion coefficient, length, and Young's modulus of the conductor layer, and the corresponding thermal expansion coefficient, length, and Young's modulus of the target insulating layer, the length change value of the conductor layer and the target insulating layer is obtained; the sum of the length of the conductor layer and the length of the target insulating layer remains unchanged;

[0023] Based on the length change value, the thermal stress at the interface between the conductor layer and the target insulating layer is obtained;

[0024] Based on the thermal stress at the interface between the conductor and the target insulation layer, a finite element simulation analysis is performed to obtain the thermal stress distribution of the target insulation layer in the cable slice.

[0025] In one embodiment, the step of performing dielectric property testing on the thermally shocked cable slice to obtain an insulation performance evaluation result for the target insulation layer of the cable slice includes:

[0026] The cable slices after thermal shock treatment are subjected to breakdown field strength test, conductivity current test, space charge distribution test, and trap distribution test. Based on the test results of each test, the insulation performance evaluation results of the target insulation layer of the cable slices are obtained.

[0027] Secondly, this application also provides a device for evaluating the thermal shock insulation performance of polypropylene cables, comprising:

[0028] A cable slice acquisition module is used to acquire cable slices of a polypropylene cable to be evaluated corresponding to the target insulation layer; the polypropylene cable includes a conductor layer and multiple insulation layers.

[0029] The simulation data calculation module is used to perform simulation based on the preset short-circuit condition of the polypropylene cable to be evaluated, and to obtain the temperature distribution of the target insulation layer under the preset short-circuit condition; it is also used to obtain the thermal stress distribution of the target insulation layer under the preset short-circuit condition based on the temperature distribution.

[0030] A thermal shock treatment module is used to perform thermal shock treatment on the target insulation layer in the cable slice according to the temperature distribution and the thermal stress distribution using a thermal shock system.

[0031] An insulation performance evaluation module is used to perform dielectric performance testing on the cable slices after thermal shock treatment, and obtain insulation performance evaluation results for the target insulation layer of the cable slices.

[0032] Thirdly, this application also provides a computer device, including a memory and a processor, wherein the memory stores a computer program, and the processor executes the computer program to implement the steps of the method described in the first aspect.

[0033] Fourthly, this application also provides a computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, implements the steps of the method described in the first aspect.

[0034] Fifthly, this application also provides a computer program product, including a computer program that, when executed by a processor, implements the steps of the method described in the first aspect.

[0035] The aforementioned method, apparatus, computer equipment, computer-readable storage medium, and computer program product for evaluating the thermal shock insulation performance of polypropylene cables involve obtaining a cable slice corresponding to the target insulation layer of the polypropylene cable to be evaluated; the polypropylene cable includes a conductor layer and multiple insulation layers; simulation is performed based on a preset short-circuit condition of the polypropylene cable to be evaluated to obtain the temperature distribution of the target insulation layer under the preset short-circuit condition; then, based on the temperature distribution, the thermal stress distribution of the target insulation layer under the preset short-circuit condition is obtained; then, a thermal shock system is used to perform thermal shock treatment on the target insulation layer in the cable slice according to the temperature distribution and thermal stress distribution; finally, the dielectric properties of the thermally shock treated cable slice are tested to obtain the insulation performance evaluation result of the target insulation layer of the cable slice. In this application, by performing simulation analysis on cable slices of the polypropylene cable to be evaluated, and then combining the simulation analysis results with thermal shock treatment of the cable slices, the actual working environment of the target insulation layer of the polypropylene cable to be evaluated under preset short-circuit conditions can be accurately simulated. Then, dielectric performance testing is performed on the target insulation layer under the simulated actual working environment to evaluate the change in insulation performance of the target insulation layer of the cable slice after thermal shock. This can improve the accuracy of the insulation performance evaluation results of the target insulation layer of the cable slice after thermal shock. In this way, accurate insulation performance evaluation results can ensure that the cable has good insulation characteristics in actual use and reduce the safety risks caused by insulation failure. Attached Figure Description

[0036] To more clearly illustrate the technical solutions in the embodiments of this application or related technologies, the drawings used in the description of the embodiments of this application or related technologies will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0037] Figure 1 This is a diagram illustrating the application environment of a method for evaluating the thermal shock insulation performance of polypropylene cables in one embodiment.

[0038] Figure 2 This is a flowchart illustrating a method for evaluating the thermal shock insulation performance of polypropylene cables in one embodiment.

[0039] Figure 3 This is a schematic diagram of the process of subjecting the target insulating layer to thermal shock in one embodiment;

[0040] Figure 4 This is a schematic diagram of a mathematical model of the thermal stress interaction between the conductor layer and the target insulating layer in one embodiment;

[0041] Figure 5 This is a flowchart illustrating a method for evaluating the thermal shock insulation performance of polypropylene cables in another embodiment.

[0042] Figure 6 A schematic diagram showing the details of COMSOL modeling in a method for evaluating the thermal shock insulation performance of polypropylene cables in one embodiment;

[0043] Figure 7 This is a schematic diagram of the structure of a typical cable in one embodiment;

[0044] Figure 8 This is a schematic diagram of the internal temperature field distribution of a cable during a short circuit, obtained by COMSOL modeling and calculation in one embodiment.

[0045] Figure 9 This is a schematic diagram of the internal thermal stress distribution of a cable during a short circuit, obtained through finite element simulation analysis in one embodiment.

[0046] Figure 10 This is a schematic diagram of the thermal shock system in one embodiment;

[0047] Figure 11 This is a structural block diagram of a polypropylene cable thermal shock insulation performance evaluation device in another embodiment;

[0048] Figure 12 This is an internal structural diagram of a computer device in one embodiment. Detailed Implementation

[0049] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0050] The method for evaluating the thermal shock insulation performance of polypropylene cables provided in this application embodiment can be applied to, for example... Figure 1 In the application environment shown, server 102 communicates with thermal shock system 104 via a network and controls the thermal shock system 104. Server 102 acquires a cable slice corresponding to the target insulation layer of the polypropylene cable to be evaluated; the polypropylene cable includes a conductor layer and multiple insulation layers; server 102 performs simulation based on a preset short-circuit condition of the polypropylene cable to be evaluated, and obtains the temperature distribution of the target insulation layer under the preset short-circuit condition; server 102 obtains the thermal stress distribution of the target insulation layer under the preset short-circuit condition based on the temperature distribution; server 102 uses thermal shock system 104 to perform thermal shock treatment on the target insulation layer in the cable slice according to the temperature distribution and thermal stress distribution; server 102 performs dielectric performance testing on the thermally shock treated cable slice to obtain the insulation performance evaluation result of the target insulation layer of the cable slice.

[0051] In one exemplary embodiment, such as Figure 2 As shown, a method for evaluating the thermal shock insulation performance of polypropylene cables is provided, which can be applied to... Figure 1 Taking the server in the example, the explanation includes the following steps S202 to S206. Wherein:

[0052] Step S202: Obtain a cable slice of the polypropylene cable to be evaluated corresponding to the target insulation layer.

[0053] The polypropylene cable includes a conductor layer and multiple insulation layers; the target insulation layer can refer to the insulation layer among the multiple insulation layers of the polypropylene cable that is being evaluated; the cable slice can refer to cutting a section from the cable using precision cutting equipment and then slicing it into thin slices to ensure that each slice contains the complete insulation layer structure. For example, a ring cable slicing device can be used to slice the cable. The cable slice of the polypropylene cable to be evaluated corresponding to the target insulation layer can be a circular slice containing the conductor layer and multiple insulation layers, or it can be a ring slice containing only the target insulation layer.

[0054] For example, the server controls a ring cable slicing device to slice the polypropylene cable to be evaluated, obtaining cable slices of the polypropylene cable to be evaluated corresponding to the target insulation layer.

[0055] Step S204: Based on the preset short-circuit conditions of the polypropylene cable to be evaluated, a simulation is performed to obtain the temperature distribution of the target insulation layer under the preset short-circuit conditions.

[0056] The preset short-circuit condition can refer to the pre-defined short-circuit conditions for polypropylene cables, such as short-circuit time, short-circuit current, and short-circuit type. The temperature distribution can refer to the specific temperature distribution diagram of the target insulation layer in the cable slice under the preset short-circuit condition.

[0057] For example, the server obtains the simulation settings corresponding to the preset short-circuit conditions of the polypropylene cable to be evaluated, and then performs simulation according to the set simulation conditions to obtain the specific temperature distribution of the target insulation layer after receiving the heat transferred from the conductor layer under the preset short-circuit conditions after the conductor layer in the polypropylene cable to be evaluated is heated due to a short circuit.

[0058] Step S206: Based on the temperature distribution, obtain the thermal stress distribution of the target insulation layer under the preset short-circuit condition.

[0059] Among them, thermal stress distribution can refer to the specific distribution of thermal stress generated by the thermal expansion of the target insulation layer after receiving heat transferred from the conductor layer under short-circuit conditions.

[0060] For example, the server calculates the thermal stress distribution of the target insulation layer under the preset short-circuit condition based on the temperature distribution of the target insulation layer under the preset short-circuit condition and the effect of the overall thermal expansion of the polypropylene cable to be evaluated.

[0061] Step S208: Using a thermal shock system, the target insulation layer in the cable slice is subjected to thermal shock treatment according to the temperature distribution and thermal stress distribution.

[0062] Among them, the thermal shock system can refer to the system used to simulate the temperature change and thermal stress change of a cable under a preset short-circuit condition.

[0063] For example, the server uses a thermal shock system to perform thermal shock treatment on the target insulation layer in the cable slice to simulate the temperature change and thermal stress change of the target insulation layer in the cable slice under a preset short circuit condition, so that the target insulation layer matches the temperature distribution and thermal stress distribution obtained by simulation.

[0064] Step S210: Perform dielectric performance testing on the cable slices after thermal shock treatment to obtain the insulation performance evaluation results of the target insulation layer for the cable slices.

[0065] Dielectric performance testing can refer to a series of tests performed on cable slices to obtain corresponding dielectric performance parameters, such as dielectric constant, dielectric loss, and breakdown voltage.

[0066] For example, the server performs dielectric performance tests on the cable slices after thermal shock treatment, analyzes the test data, evaluates the change in dielectric performance of the target insulation layer after thermal shock, and compares its current insulation capacity with safety standards to obtain the insulation performance evaluation results of the target insulation layer of the cable slices.

[0067] In the aforementioned method for evaluating the thermal shock insulation performance of polypropylene cables, simulation analysis is performed on cable slices of the polypropylene cable to be evaluated. The cable slices are then subjected to thermal shock treatment based on the simulation analysis results. This accurately simulates the actual working environment of the target insulation layer of the polypropylene cable under preset short-circuit conditions. Dielectric performance testing is then conducted on the target insulation layer in the simulated working environment to evaluate the change in insulation performance of the target insulation layer after thermal shock. This improves the accuracy of the insulation performance evaluation results obtained after thermal shock, thereby ensuring that the cable possesses good insulation characteristics in actual use and reducing safety risks caused by insulation failure.

[0068] In one exemplary embodiment, the thermal shock system includes a temperature control module and a mechanical pressurization module; such as Figure 3 As shown, step S208 above includes the following steps:

[0069] Step S302: Using the temperature control module, heat the target insulation layer in the cable slice according to the temperature distribution so that the current temperature of each part of the target insulation layer in the cable slice matches the temperature distribution.

[0070] Step S304: Using the mechanical pressurization module, pressurize the target insulation layer in the cable slice according to the thermal stress distribution so that the current stress at each part of the target insulation layer in the cable slice matches the thermal stress distribution.

[0071] The temperature control module can be used to control the temperature of the cable slices; the mechanical pressurization module can be used to pressurize the cable slices.

[0072] For example, the server uses the temperature control module in the thermal shock system to heat the target insulation layer in the cable slice according to the temperature distribution. Then, the temperature control module continuously monitors and adjusts the current temperature of each part of the target insulation layer, so that the current temperature of each part of the target insulation layer in the cable slice matches the temperature distribution. The server uses the mechanical pressurization module in the thermal shock system to pressurize the target insulation layer in the cable slice according to the thermal stress distribution. Then, the mechanical pressurization module continuously monitors and adjusts the current stress of each part of the target insulation layer, so that the current stress of each part of the target insulation layer in the cable slice matches the thermal stress distribution.

[0073] In this embodiment, the temperature control module can heat the target insulation layer according to the temperature distribution, so that the current temperature of each part of the target insulation layer is consistent with the temperature distribution. The mechanical pressurization module can pressurize the target insulation layer according to the thermal stress distribution, so that the current stress of each part of the target insulation layer is consistent with the thermal stress distribution. This can realistically simulate the working state of the target insulation layer in the cable slice under the preset short-circuit condition, and can more effectively evaluate the insulation performance of the cable insulation layer under actual operating conditions.

[0074] In an exemplary embodiment, step S204 may include: obtaining the short-circuit current and short-circuit time that match the preset short-circuit conditions of the polypropylene cable to be evaluated, inputting the short-circuit current, short-circuit time and target insulation layer parameters of the cable slice into a simulation tool for simulation, and obtaining the temperature distribution of the target insulation layer under the preset short-circuit conditions.

[0075] Among them, the target insulation layer parameters can refer to parameters related to the material properties of the target insulation layer, such as thermal conductivity, specific heat capacity, etc.

[0076] For example, the server obtains the short-circuit current and short-circuit time that match the preset short-circuit conditions of the polypropylene cable to be evaluated. The short-circuit current, short-circuit time, and target insulation layer parameters of the cable slice are input into the simulation tool. The server models the target insulation layer parameters and sets other initial conditions. The server performs simulation based on the short-circuit current and short-circuit time to simulate the thermal behavior of the conductor layer in the polypropylene cable to be evaluated transferring heat to the target insulation layer after the conductor layer heats up due to the short circuit. Finally, the temperature distribution of the target insulation layer under the preset short-circuit conditions is obtained.

[0077] Step S206 above may include: obtaining the thermal stress distribution of the target insulation layer under a preset short-circuit condition based on the temperature distribution, the thermal expansion coefficient of the conductor layer and the thermal expansion coefficient of the target insulation layer.

[0078] The coefficient of thermal expansion can be a parameter that characterizes the expansion or contraction properties of the material.

[0079] For example, the server obtains the thermal expansion coefficients of the conductor layer and the target insulation layer, and then determines the specific temperature of each location of the target insulation layer based on the temperature distribution. Then, it calculates the thermal stress at a certain location based on the thermal expansion coefficients of the conductor layer and the target insulation layer. After multiple calculations, the thermal stress distribution of the target insulation layer under the preset short-circuit condition can be obtained.

[0080] In this embodiment, by inputting parameters such as short-circuit current and short-circuit time, and combining them with the material properties of the target insulation layer in the cable slice, the temperature distribution of the target insulation layer under a preset short-circuit condition can be accurately simulated. After obtaining the temperature distribution, the thermal stress distribution of the target insulation layer can be calculated by combining the thermal expansion coefficients of the conductor layer and the target insulation layer, which can provide a reliable data basis for subsequent evaluation, thereby improving the reliability of the evaluation.

[0081] In an exemplary embodiment, the target insulation layer parameters include the target insulation layer size and parameters related to the thermal conductivity of the target insulation layer; the target insulation layer parameters, including short-circuit current, short-circuit time, and cable slice parameters, are input into a simulation tool for simulation to obtain the temperature distribution of the target insulation layer under a preset short-circuit condition, which may include:

[0082] Input the short-circuit current, short-circuit time, and target insulation layer parameters of the cable slice into the simulation tool. Using the simulation tool, based on the short-circuit current, short-circuit time, target insulation layer size, and parameters related to the thermal conductivity of the target insulation layer, simulate the temperature change process of the polypropylene cable transferring heat to the target insulation layer after the conductor heats up under short-circuit conditions, and obtain the temperature distribution of the target insulation layer under the preset short-circuit conditions.

[0083] The target insulation layer size can refer to the dimensional data of the target insulation layer in the cable slice, such as the radius and width of the target insulation layer. Parameters related to the thermal conductivity of the target insulation layer can refer to parameters such as thermal conductivity, specific heat capacity, and density.

[0084] For example, the server inputs the short-circuit current, short-circuit time, and target insulation layer parameters of the cable slice into the simulation tool, uses the simulation tool to build a model corresponding to the cable slice, and then, based on the short-circuit current, short-circuit time, target insulation layer size, and parameters related to the thermal conductivity of the target insulation layer, simulates the temperature change process of the polypropylene cable transferring heat to the target insulation layer after the conductor heats up under short-circuit conditions, and obtains the temperature distribution of the target insulation layer under the preset short-circuit conditions.

[0085] In this embodiment, by inputting the short-circuit current, short-circuit time, and target insulation layer parameters of the cable slice into the simulation tool, the simulation tool simulates the temperature change process of the polypropylene cable transferring heat to the target insulation layer after the conductor heats up under short-circuit conditions, based on the short-circuit current, short-circuit time, target insulation layer size, and parameters related to the thermal conductivity of the target insulation layer. This yields the temperature distribution of the target insulation layer under the preset short-circuit conditions, allowing for a comprehensive and detailed simulation of the temperature change process of the target insulation layer under the preset short-circuit conditions, thus improving the accuracy of the data provided for subsequent evaluation.

[0086] In an exemplary embodiment, obtaining the thermal stress distribution of the target insulation layer under a preset short-circuit condition based on the temperature distribution, the thermal expansion coefficient corresponding to the conductor layer, and the thermal expansion coefficient corresponding to the target insulation layer may include the following steps:

[0087] Step S41: For the interface between the conductor layer and the target insulation layer, based on the temperature change value of the interface between the conductor layer and the target insulation layer obtained from the temperature distribution, the corresponding thermal expansion coefficient, length and Young's modulus of the conductor layer, and the corresponding thermal expansion coefficient, length and Young's modulus of the target insulation layer, the length change value of the conductor layer and the target insulation layer is obtained; the sum of the length of the conductor layer and the length of the target insulation layer remains unchanged.

[0088] Step S42: Based on the length change value, obtain the thermal stress at the interface between the conductor layer and the target insulation layer.

[0089] Step S43: Based on the thermal stress at the interface between the conductor and the target insulation layer, perform finite element simulation analysis to obtain the thermal stress distribution of the target insulation layer in the cable slice.

[0090] The temperature change value can be the numerical value of the temperature change that occurs at the interface between the conductor layer and the target insulation layer before and after a short circuit; the length can be the length of the conductor layer or the target insulation layer in its respective radial direction. The length change value can be the length of the conductor layer or the target insulation layer that changes in the radial direction due to thermal expansion. The statement that the sum of the conductor layer length and the target insulation layer length remains constant can mean that, assuming the cable is constrained, the overall shape of the cable composed of the conductor layer and the target insulation layer does not change, so the sum of the conductor layer length and the target insulation layer length remains constant.

[0091] For example, the server calculates the length change of the conductor layer and the target insulating layer at the interface between the conductor layer and the target insulating layer based on the temperature change value of the interface obtained from the temperature distribution, the thermal expansion coefficient, length, and Young's modulus of the conductor layer, and the thermal expansion coefficient, length, and Young's modulus of the target insulating layer. The specific calculation process can be as follows:

[0092] First, the parameters obtained for the interface between the conductor layer and the target insulating layer are shown in Table 1:

[0093] Table 1

[0094]

[0095] according to Figure 4 The mathematical model shown yields the total strain: ,in, For total strain, For elastic strain, For thermal strain, we can obtain ,in, It is elastic stress, and because the interfacial pressure between the conductor layer and the target insulating layer is equal at the interface, it is the elastic stress of the conductor layer. Elastic stress of the target insulation layer Equal, that is ,in, The Young's modulus of the conductor layer. For the elastic strain of the conductor layer, The Young's modulus of the target insulation layer. The elastic strain of the target insulation layer.

[0096] From the above formula, we know that elastic strain equals total strain minus thermal strain. Therefore, based on the above formula, we can further derive... ,in, This refers to the length of the conductor layer. This refers to the coefficient of thermal expansion of the conductor layer. This refers to the length of the target insulation layer. This refers to the coefficient of thermal expansion of the target insulating layer. This refers to the change in length of the conductor layer and the target insulating layer. This refers to the temperature change at the interface between the conductor layer and the target insulating layer; substituting the corresponding parameters from Table 1 into the above formula, the solution can be obtained. Substituting the change in length back into the formula yields... Therefore, the thermal stress at the interface between the conductor layer and the target insulating layer is: Finally, based on the thermal stress at the interface between the conductor and the target insulation layer, finite element simulation analysis was performed to obtain the thermal stress distribution of the target insulation layer in the cable slice.

[0097] In this embodiment, by combining the temperature change data of the conductor layer and the target insulation layer, and considering material properties such as thermal expansion coefficient, length and Young's modulus, a more accurate thermal stress calculation is performed. This can reflect the mechanical interaction between the two materials due to temperature changes. Then, finite element simulation analysis is performed to conduct a detailed evaluation of the specific thermal stress distribution of the target insulation layer in the cable slice. Subsequently, based on the specific thermal stress distribution, a subsequent evaluation is conducted, improving the accuracy of the subsequent evaluation.

[0098] In an exemplary embodiment, step 210 may specifically include: performing breakdown field strength test, conductivity current test, space charge distribution test and trap distribution test on the thermally shock treated cable slice, and obtaining the insulation performance evaluation result of the target insulation layer of the cable slice based on the test results corresponding to each test.

[0099] For example, after thermal shock treatment, the server performs a series of dielectric performance tests on the target insulation layer, which may include: a) Breakdown field strength test: determining the insulation material's ability to withstand voltage, identifying its breakdown strength under specific conditions, and judging its electrical stability. b) Conductivity current test: measuring the conductivity current of the insulation layer, evaluating the leakage characteristics of the insulation material, and reflecting the insulation state of the insulation layer during application. c) Space charge distribution test: analyzing the space charge distribution in the insulation material, revealing the impact of charge accumulation on insulation performance, and helping to understand the material's behavior under long-term voltage. d) Trap distribution test: studying the trap characteristics within the material, revealing its impact on charge movement and electric field effects, and thus comprehensively evaluating the insulation performance. Finally, based on the test results corresponding to each test, the insulation performance evaluation result for the target insulation layer of the cable slice is obtained.

[0100] In this embodiment, by performing breakdown field strength testing, conductivity current testing, space charge distribution testing, and trap distribution testing on the cable slices after thermal shock treatment, the dielectric properties of the target insulation layer can be comprehensively evaluated, and a comprehensive insulation performance evaluation result can be obtained, ensuring reliability and safety under various electrical conditions and environmental changes.

[0101] In an exemplary application example, a method for evaluating the thermal shock insulation performance of polypropylene cables is provided. A ring cable slicing device is used to cut samples of different thicknesses along the circumferential direction of the cable. A computing system (server) is then used to calculate the specific environmental conditions at a certain location on the cable insulation under various short-circuit faults. A thermal shock system is then used to simulate the external stress affecting the insulation material of the power cable under short-circuit faults. A dielectric performance testing and evaluation system is used to test and evaluate the various performance parameters of the insulation material after thermal shock.

[0102] During long-term operation, due to conductor heating and ambient heat, the insulation material of power cables generally operates within a certain temperature range. According to national and IEC standards, the maximum operating temperature of XLPE power cables is generally [missing information]. XLPE has a lower maximum temperature than polypropylene (PP). It is generally believed that the maximum operating temperature of polypropylene power cables is... Therefore, PP cables have the advantage of the highest operating temperature compared to XLPE cables, which is beneficial for increasing their current carrying capacity.

[0103] Due to factors such as severe weather, power cables may be subjected to short-circuit faults. During a short circuit, the sudden influx of large current rapidly heats the metallic conductor, causing it to rise to extremely high temperatures within a short period. This temperature also spreads to the surrounding area, beginning to affect nearby cable structures. According to IEC standards, XLPE power cables can withstand short-circuit faults for a maximum of [duration not specified]. The short-circuit current operates for a maximum of 5 seconds. Essentially, the short-circuit current only affects the innermost conductor of the power cable; heat is dissipated from the conductor to the surrounding area through thermal conduction. Therefore, the actual thermal shock to the outer insulation material needs to be calculated. Due to the presence of relay protection devices, the short-circuit current does not persist for a long time and is usually quickly disconnected.

[0104] Therefore, under short-circuit faults, the main impact on power cables is the effect of thermal shock caused by high temperature and short duration. In addition to high temperature, solid materials will also generate thermal strain during the heating process, and the resulting thermal stress cannot be ignored.

[0105] Polypropylene, as a thermoplastic material, exhibits different properties at high temperatures compared to the thermosetting material XLPE. Thermoplastic materials are more prone to melting and decomposition at high temperatures. Therefore, the extreme value standard for polypropylene cables under short-circuit high temperatures cannot simply refer to the existing standard for XLPE cables. Instead, it is necessary to evaluate the performance parameters of polypropylene cables under short-circuit fault thermal shock. The specific evaluation process is as follows:

[0106] like Figure 5 As shown in the figure, this illustrates the basic process of this example. To better reflect the actual situation of cables, the research object of this example is cable slicing. Using a ring cable slicing device, several polypropylene cable slices (corresponding to the cable slices of the target insulation layer) are cut from the polypropylene cable body (the polypropylene cable to be evaluated) at different installations or specific locations on the cable. This example will measure the maximum performance of cables under short-circuit faults as specified by IEC (International Electrotechnical Commission Standards) standards. The calculation is performed with a 5-second run as a condition (to obtain the corresponding short-circuit current and short-circuit time), and testers are also allowed to input the short-circuit current and time for personalized calculations. Then, the actual operating environment of the insulating material (target insulating layer) at that location is calculated through the calculation module, which can provide a basis for the thermal shock test system. Then, dielectric performance testing and evaluation are performed to obtain a performance evaluation report of the insulating material after thermal shock.

[0107] Because heat transfer within a cable is a slow process, the calculation module in this example will also simulate the actual temperature and stress levels at specific locations on the cable (i.e., the insulation material locations on the cable slices, i.e., the locations of different parts of the target insulation layer) under a specific short-circuit fault, based on the actual conditions of the cable slices. The transient process of a cable during a short-circuit fault: In the event of a cable short circuit, the conductor heats up, forming a heat source. This heat source begins to transfer between the conductor and insulation. Then, the short-circuit current is interrupted, the heat source disappears, heat dissipation begins, and finally, the cable returns to normal. However, unlike the slow temperature rise to a steady state under steady-state operating conditions, under a short-circuit fault, due to its high thermal conductivity, the entire conductor will be rapidly heated by the rapidly increasing short-circuit current. However, because the insulation material has poor thermal conductivity, the impact on the insulation material varies significantly at different locations during the entire short-circuit fault, thus requiring precise calculation.

[0108] This example uses COMSOL to calculate the short-circuit fault process, including a solid heat transfer module and a thermal strain module. This example employs a two-dimensional axisymmetric model, simplifying the model size while maximizing simulation accuracy. COMSOL modeling details are as follows... Figure 6 As shown, its structure reference Figure 7 The typical cable structure shown indicates that the cable slice position is the slice position in the main insulation layer. The slice depth is determined by the radius r4 to obtain the required cable slice.

[0109] The temperature field distribution inside the cable during the short circuit process, obtained through COMSOL modeling and calculation, is as follows: Figure 8 As shown, it can be seen that due to the limited thermal conductivity of the insulating material, only the insulating material in close contact with the conductor will be subjected to high temperature during the short circuit, while the remaining conductor will be subjected to limited effects.

[0110] Due to the thermal expansion and contraction effect of materials, insulation materials will undergo thermal strain under high temperatures. Assuming the cable is confined, this thermal strain will generate thermal stress acting on the insulation material. The calculation of thermal stress on the insulation material mainly utilizes the coefficient of thermal expansion. Assuming... Figure 4 The model shown The original length, For the Young's modulus of the two materials, Here is the coefficient of thermal expansion. With these parameters obtained, thermal stress can be calculated. Parameter selections are shown in Table 2 below. The calculation process is as follows.

[0111] Table 2

[0112]

[0113] Total strain: ,in, For total strain, For elastic strain, This is thermal strain.

[0114] Furthermore, we can obtain: ,in, This is elastic stress. Because the interfacial pressure between the conductor layer and the target insulating layer is equal at the interface, meaning the conductor layer... insulating layer of the target They are equal, therefore we can obtain ,in, The Young's modulus of the conductor layer. For the elastic strain of the conductor layer, The Young's modulus of the target insulation layer. The elastic strain of the target insulation layer.

[0115] Expanding the above equation further, we get: ,in, This refers to the length of the conductor layer. This refers to the coefficient of thermal expansion of the conductor layer. This refers to the length of the target insulation layer. This refers to the coefficient of thermal expansion of the target insulating layer. This refers to the change in length of the conductor layer and the target insulating layer. This refers to the temperature change at the interface between the conductor layer and the target insulating layer. The deformation can be calculated using the formula described above. Substituting the obtained deformation back into the above formula yields the stress. .

[0116] In summary, the thermal stress caused by thermal expansion at each point can be calculated using the above calculation principles. However, since the actual situation of cables is far more complex than this simple model, finite element simulation calculations are necessary. The calculation results are as follows: Figure 9 As shown. During a short circuit, the insulating material can be subjected to a stress of up to approximately 8 MPa.

[0117] After calculating the specific environmental conditions of the cable during the short circuit, the cable slice material was placed in a thermal shock test system for treatment. Figure 10 This example demonstrates the thermal shock system. The temperature control module includes an air-cooled structure, a eddy current heating device, an upper heating plate, and a lower heating plate. The mechanical pressurization module controls the pressurization of the upper and lower heating plates. The sample (cable slice) is placed at the cable slice location shown in the figure. In actual operation, the lower heating plate is maintained at the cable's operating temperature, which can generally be considered as... The upper heating plate is controlled by an eddy current heating device, which can rapidly heat up to the specified temperature. The temperature of the entire system is controlled by the eddy current device of the upper heating plate and the air cooling structure. The system shares data with the calculation module. When the test system receives temperature and stress information from the calculation module, the system controls the sample environment to the calculated environmental conditions of an actual short-circuit fault through the eddy current heating device, air cooling structure, and mechanical pressurization structure.

[0118] The thermally shock treated sample is placed in a dielectric performance testing system. Its insulation performance is comprehensively evaluated by testing parameters such as breakdown field strength, conductivity current, space charge distribution, and trap distribution. Specific evaluation methods have been extensively described in existing theories, and therefore will not be elaborated upon in this example.

[0119] In summary, considering the thermoplastic characteristics of polypropylene materials and the potential short-circuit faults that may occur in power cables during actual operation, this example proposes a thermal shock assessment method for AC polypropylene cables. It primarily focuses on the actual operating state and insulation performance degradation of power cables after a short-circuit fault. This example uses cable sections as the research object, employing COMSOL calculations to obtain the accurate operating state of the insulation material at different locations under a short-circuit fault. A thermal shock testing system accurately simulates the high temperature and thermal stress effects on the insulation material under actual operating conditions. Finally, a dielectric performance testing and evaluation module assesses the insulation state of the insulation material after thermal shock. This solution focuses on the actual operating conditions of cables and practical engineering problems, thus improving its practicality.

[0120] It should be understood that, although the various steps in the flowcharts involved in the various embodiments described above are displayed in sequence according to the instructions of the arrows, these steps are not necessarily executed in sequence in the order indicated by the arrows. Unless otherwise specified herein, there is no strict order restriction on the execution of these steps, and these steps can be executed in other orders. Moreover, at least a portion of the steps in the flowcharts involved in the various embodiments described above can include multiple steps or multiple stages, and these steps or stages are not necessarily executed and completed at the same time, but can be executed at different times, and the execution order of these steps or stages is not necessarily to be carried out in sequence, but can be executed in turn or alternately with other steps or at least a portion of steps or stages in other steps.

[0121] Based on the same inventive concept, this application also provides a polypropylene cable thermal shock insulation performance evaluation device for implementing the aforementioned method for evaluating the thermal shock insulation performance of polypropylene cables. The solution provided by this device is similar to the solution described in the above method. Therefore, the specific limitations of one or more embodiments of the polypropylene cable thermal shock insulation performance evaluation device provided below can be found in the limitations of the polypropylene cable thermal shock insulation performance evaluation method described above, and will not be repeated here.

[0122] In one exemplary embodiment, such as Figure 11 As shown, a device for evaluating the thermal shock insulation performance of polypropylene cables is provided, comprising: a cable slice acquisition module 901, a simulation data calculation module 902, a thermal shock treatment module 903, and an insulation performance evaluation module 904, wherein:

[0123] The cable slice acquisition module 901 is used to acquire cable slices of the polypropylene cable to be evaluated corresponding to the target insulation layer; the polypropylene cable includes a conductor layer and multiple insulation layers.

[0124] The simulation data calculation module 902 is used to perform simulation based on the preset short-circuit conditions of the polypropylene cable to be evaluated, and to obtain the temperature distribution of the target insulation layer under the preset short-circuit conditions; it is also used to obtain the thermal stress distribution of the target insulation layer under the preset short-circuit conditions based on the temperature distribution.

[0125] The thermal shock treatment module 903 is used to perform thermal shock treatment on the target insulation layer in the cable slice according to the temperature distribution and thermal stress distribution using a thermal shock system.

[0126] The insulation performance evaluation module 904 is used to test the dielectric properties of the cable slices after thermal shock treatment and obtain the insulation performance evaluation results of the target insulation layer of the cable slices.

[0127] In an exemplary embodiment, the thermal shock system includes a temperature control module and a mechanical pressurization module; the aforementioned thermal shock treatment module 903 is further configured to use the temperature control module to heat the target insulation layer in the cable slice according to the temperature distribution, so that the current temperature of each part of the target insulation layer in the cable slice matches the temperature distribution; and to use the mechanical pressurization module to pressurize the target insulation layer in the cable slice according to the thermal stress distribution, so that the current stress of each part of the target insulation layer in the cable slice matches the thermal stress distribution.

[0128] In an exemplary embodiment, the simulation data calculation module 902 is further configured to obtain the short-circuit current and short-circuit time matching the preset short-circuit condition of the polypropylene cable to be evaluated, input the short-circuit current, short-circuit time, and target insulation layer parameters of the cable slice into the simulation tool for simulation, and obtain the temperature distribution of the target insulation layer under the preset short-circuit condition; the simulation data calculation module 902 is further configured to obtain the thermal stress distribution of the target insulation layer under the preset short-circuit condition based on the temperature distribution, the thermal expansion coefficient corresponding to the conductor layer, and the thermal expansion coefficient corresponding to the target insulation layer.

[0129] In an exemplary embodiment, the target insulation layer parameters include the target insulation layer size and parameters related to the thermal conductivity of the target insulation layer. The simulation data calculation module 902 is further used to input the short-circuit current, short-circuit time, and target insulation layer parameters of the cable slice into the simulation tool. Using the simulation tool, based on the short-circuit current, short-circuit time, target insulation layer size, and parameters related to the thermal conductivity of the target insulation layer, the temperature change process of the polypropylene cable transferring heat to the target insulation layer after the conductor heats up under short-circuit conditions is simulated, and the temperature distribution of the target insulation layer under the preset short-circuit conditions is obtained.

[0130] In an exemplary embodiment, the simulation data calculation module 902 is further configured to, for the interface between the conductor layer and the target insulation layer, obtain the length change value of the interface between the conductor layer and the target insulation layer based on the temperature change value of the interface between the conductor layer and the target insulation layer obtained from the temperature distribution, the thermal expansion coefficient, length and Young's modulus of the conductor layer, and the thermal expansion coefficient, length and Young's modulus of the target insulation layer; the sum of the length of the conductor layer and the length of the target insulation layer remains unchanged; the thermal stress of the interface between the conductor layer and the target insulation layer is obtained based on the length change value; and finite element simulation analysis is performed based on the thermal stress of the interface between the conductor layer and the target insulation layer to obtain the thermal stress distribution of the target insulation layer in the cable slice.

[0131] In an exemplary embodiment, the insulation performance evaluation module 904 is further configured to perform breakdown field strength test, electrical conductivity current test, space charge distribution test and trap distribution test on the cable slice after thermal shock treatment, and obtain the insulation performance evaluation result of the target insulation layer of the cable slice based on the test results corresponding to each test.

[0132] Each module in the aforementioned polypropylene cable thermal shock insulation performance evaluation device can be implemented entirely or partially through software, hardware, or a combination thereof. These modules can be embedded in the processor of a computer device in hardware form or independent of it, or stored in the memory of a computer device in software form, so that the processor can call and execute the corresponding operations of each module.

[0133] In one exemplary embodiment, a computer device is provided, which may be a server, and its internal structure diagram may be as follows: Figure 12 As shown, the computer device includes a processor, memory, input / output (I / O) interfaces, and a communication interface. The processor, memory, and I / O interfaces are connected via a system bus, and the communication interface is also connected to the system bus via the I / O interfaces. The processor provides computational and control capabilities. The memory includes non-volatile storage media and internal memory. The non-volatile storage media stores the operating system, computer programs, and databases. The internal memory provides the environment for the operation of the operating system and computer programs stored in the non-volatile storage media. The I / O interfaces are used for exchanging information between the processor and external devices. The communication interface is used for communication with external terminals via a network connection. When the computer program is executed by the processor, it implements a method for evaluating the thermal shock insulation performance of polypropylene cables.

[0134] Those skilled in the art will understand that Figure 12 The structure shown is merely a block diagram of a portion of the structure related to the present application and does not constitute a limitation on the computer device to which the present application is applied. Specific computer devices may include more or fewer components than those shown in the figure, or combine certain components, or have different component arrangements.

[0135] In one embodiment, a computer device is also provided, including a memory and a processor, wherein the memory stores a computer program, and the processor executes the computer program to implement the steps in the above method embodiments.

[0136] In one embodiment, a computer-readable storage medium is provided having a computer program stored thereon that, when executed by a processor, implements the steps in the above method embodiments.

[0137] In one embodiment, a computer program product is provided, including a computer program that, when executed by a processor, implements the steps in the above method embodiments.

[0138] Those skilled in the art will understand that all or part of the processes in the methods of the above embodiments can be implemented by a computer program instructing related hardware. The computer program can be stored in a non-volatile computer-readable storage medium, and when executed, it can include the processes of the embodiments of the above methods. Any references to memory, databases, or other media used in the embodiments provided in this application can include at least one of non-volatile memory and volatile memory. Non-volatile memory can include read-only memory (ROM), magnetic tape, floppy disk, flash memory, optical memory, high-density embedded non-volatile memory, resistive random access memory (ReRAM), magnetic random access memory (MRAM), ferroelectric random access memory (FRAM), phase change memory (PCM), graphene memory, etc. Volatile memory can include random access memory (RAM) or external cache memory, etc. By way of illustration and not limitation, RAM can take many forms, such as Static Random Access Memory (SRAM) or Dynamic Random Access Memory (DRAM). The databases involved in the embodiments provided in this application may include at least one type of relational database and non-relational database. Non-relational databases may include, but are not limited to, blockchain-based distributed databases. The processors involved in the embodiments provided in this application may be general-purpose processors, central processing units, graphics processing units, digital signal processors, programmable logic devices, quantum computing-based data processing logic devices, artificial intelligence (AI) processors, etc., and are not limited to these.

[0139] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this application.

[0140] The above-described embodiments merely represent several implementation methods of the present application. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the present application. It should be noted that a person of ordinary skill in the art may make various modifications and improvements without departing from the spirit of the present application, and these modifications and improvements fall within the scope of protection of the present application. Therefore, the scope of protection of the present application shall be determined by the appended claims.

Claims

1. A method for evaluating the thermal shock insulation performance of polypropylene cables, characterized in that, The method includes: Obtain a cable slice of the polypropylene cable to be evaluated corresponding to the target insulation layer; the polypropylene cable includes a conductor layer and multiple insulation layers. Based on the preset short-circuit conditions of the polypropylene cable to be evaluated, a simulation was performed to obtain the temperature distribution of the target insulation layer under the preset short-circuit conditions. Based on the temperature distribution, the thermal stress distribution of the target insulation layer under the preset short-circuit condition is obtained; Using a thermal shock system, the target insulation layer in the cable slice is subjected to thermal shock treatment according to the temperature distribution and the thermal stress distribution; The dielectric properties of the cable slices after thermal shock treatment are tested to obtain the insulation performance evaluation results of the target insulation layer of the cable slices.

2. The method according to claim 1, characterized in that, The thermal shock system includes a temperature control module and a mechanical pressurization module; The method of using a thermal shock system to perform thermal shock treatment on the target insulation layer in the cable slice according to the temperature distribution and the thermal stress distribution includes: Using the temperature control module, the target insulation layer in the cable slice is heated according to the temperature distribution so that the current temperature of each part of the target insulation layer in the cable slice matches the temperature distribution. Using the mechanical pressurization module, the target insulation layer in the cable slice is pressurized according to the thermal stress distribution so that the current stress at each part of the target insulation layer in the cable slice matches the thermal stress distribution.

3. The method according to claim 1, characterized in that, The step of simulating the temperature distribution of the target insulation layer under the preset short-circuit condition of the polypropylene cable to be evaluated includes: Based on the preset short-circuit condition of the polypropylene cable to be evaluated, the short-circuit current and short-circuit time matching the preset short-circuit condition are obtained. The short-circuit current, the short-circuit time, and the target insulation layer parameters of the cable slice are input into the simulation tool for simulation to obtain the temperature distribution of the target insulation layer under the preset short-circuit condition. The step of obtaining the thermal stress distribution of the target insulation layer under the preset short-circuit condition based on the temperature distribution includes: Based on the temperature distribution, the thermal expansion coefficient of the conductor layer, and the thermal expansion coefficient of the target insulation layer, the thermal stress distribution of the target insulation layer under the preset short-circuit condition is obtained.

4. The method according to claim 3, characterized in that, The target insulation layer parameters include the target insulation layer dimensions and parameters related to the thermal conductivity of the target insulation layer; The step of inputting the short-circuit current, the short-circuit time, and the target insulation layer parameters of the cable slice into a simulation tool for simulation to obtain the temperature distribution of the target insulation layer under the preset short-circuit condition includes: The short-circuit current, the short-circuit time, and the target insulation layer parameters of the cable slice are input into a simulation tool. Using the simulation tool, based on the short-circuit current, the short-circuit time, the target insulation layer size, and parameters related to the thermal conductivity of the target insulation layer, the temperature change process of the polypropylene cable transferring heat to the target insulation layer after the conductor heats up under short-circuit conditions is simulated, and the temperature distribution of the target insulation layer under the preset short-circuit conditions is obtained.

5. The method according to claim 3, characterized in that, The step of obtaining the thermal stress distribution of the target insulation layer under a preset short-circuit condition based on the temperature distribution, the thermal expansion coefficient corresponding to the conductor layer, and the thermal expansion coefficient corresponding to the target insulation layer includes: For the interface between the conductor layer and the target insulating layer, based on the temperature change value of the interface between the conductor layer and the target insulating layer obtained from the temperature distribution, the corresponding thermal expansion coefficient, length, and Young's modulus of the conductor layer, and the corresponding thermal expansion coefficient, length, and Young's modulus of the target insulating layer, the length change value of the conductor layer and the target insulating layer is obtained; the sum of the length of the conductor layer and the length of the target insulating layer remains unchanged; Based on the length change value, the thermal stress at the interface between the conductor layer and the target insulating layer is obtained; Based on the thermal stress at the interface between the conductor and the target insulation layer, a finite element simulation analysis is performed to obtain the thermal stress distribution of the target insulation layer in the cable slice.

6. The method according to claim 1, characterized in that, The step of performing dielectric property testing on the cable slices after thermal shock treatment to obtain insulation performance evaluation results for the target insulation layer of the cable slices includes: The cable slices after thermal shock treatment are subjected to breakdown field strength test, conductivity current test, space charge distribution test, and trap distribution test. Based on the test results of each test, the insulation performance evaluation results of the target insulation layer of the cable slices are obtained.

7. A device for evaluating the thermal shock insulation performance of polypropylene cables, characterized in that, The device includes: A cable slice acquisition module is used to acquire cable slices of a polypropylene cable to be evaluated corresponding to the target insulation layer; the polypropylene cable includes a conductor layer and multiple insulation layers. The simulation data calculation module is used to perform simulation based on the preset short-circuit condition of the polypropylene cable to be evaluated, and to obtain the temperature distribution of the target insulation layer under the preset short-circuit condition; it is also used to obtain the thermal stress distribution of the target insulation layer under the preset short-circuit condition based on the temperature distribution. A thermal shock treatment module is used to perform thermal shock treatment on the target insulation layer in the cable slice according to the temperature distribution and the thermal stress distribution using a thermal shock system. An insulation performance evaluation module is used to perform dielectric performance testing on the cable slices after thermal shock treatment, and obtain insulation performance evaluation results for the target insulation layer of the cable slices.

8. A computer device comprising a memory and a processor, wherein the memory stores a computer program, characterized in that, When the processor executes the computer program, it implements the steps of the method according to any one of claims 1 to 6.

9. A computer-readable storage medium having a computer program stored thereon, characterized in that, When the computer program is executed by a processor, it implements the steps of the method according to any one of claims 1 to 6.

10. A computer program product, comprising a computer program, characterized in that, When the computer program is executed by a processor, it implements the steps of the method according to any one of claims 1 to 6.

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