Display module and display device

Abstract

This application discloses a display module and a display device. The display module includes a display panel and a protective layer continuously laid on the non-display side of the display panel. The protective layer includes a light-transmitting area, which is correspondingly disposed with respect to a first marked area on the display panel to expose the first marked area. The display module of this application can protect the display panel using the continuously laid protective layer and expose the first marked area through the light-transmitting area on the protective layer corresponding to the first marked area, thereby improving the anti-static capability of the display module while enabling the determination of the location of the first marked area.

Description

Technical Field

[0001] This disclosure generally relates to the field of display device technology, and more specifically to a display module and a display device. Background Technology

[0002] Currently, the bezel width of the display panel inside the display module can be shortened using PAD bending technology. Specifically, alignment in PAD bending can be achieved by setting corresponding marks on the display panel (i.e., the Panel layer) and the panel bezel (i.e., the Pad area).

[0003] To achieve the alignment of the markings between the display panel and the panel bezel, a slotted design is required in the panel protective layer (i.e., the SCF layer) to expose the markings on the display panel. However, the slotted design of the panel protective layer can easily expose the internal wiring of the display panel, resulting in electrostatic discharge and circuit burnout.

[0004] Therefore, the poor anti-static capability of display modules has become an urgent problem to be solved. Summary of the Invention

[0005] In view of the above-mentioned defects or deficiencies in the prior art, it is desirable to provide a display module and display device that can protect the display panel by means of a continuously laid protective layer, and expose the first marking area by means of a light-transmitting area on the protective layer corresponding to the first marking area, so as to improve the antistatic capability of the display module while being able to determine the position of the first marking area.

[0006] According to a first aspect of this application, a display module is provided, comprising: a display panel and a protective layer continuously laid on the non-display side of the display panel;

[0007] The protective layer includes a light-transmitting area, which is correspondingly disposed to the first marking area of ​​the display panel to expose the first marking area.

[0008] In one possible example, the protective layer includes a first film layer and a second film layer stacked together. The area of ​​the first film layer near the display panel and corresponding to the first marked area is a cut-out area. The second film layer is continuously laid on the side of the first film layer away from the display panel, and the area corresponding to the first marked area is a light-transmitting area.

[0009] In one possible example, the protective layer includes a first film layer and a second film layer stacked together, the first film layer being continuously laid on the side close to the display panel, and the second film layer being continuously laid on the side of the first film layer away from the display panel; the first film layer and the second film layer are light-transmitting areas in the regions corresponding to the first marked area.

[0010] In one possible example, the second film layer further includes a conductive material disposed in a region other than the light-transmitting region.

[0011] In one possible example, the conductive material is copper foil.

[0012] In one possible example, the area of ​​the second film layer other than the light-transmitting area is a light-transmitting film layer.

[0013] In one possible example, the first membrane layer is made of foam.

[0014] In one possible example, the area of ​​the first film layer other than the light-transmitting area is a light-transmitting film layer.

[0015] In one possible example, the light-transmitting region is a film made of at least one of silica gel, aluminum oxynitride, and indium tin oxide.

[0016] In one possible example, the display module also includes a panel border;

[0017] The panel border includes a second marking area to fold the panel border based on the alignment of the first marking area and the second marking area.

[0018] According to a second aspect of this application, a display device is provided, which includes the display module of the first aspect.

[0019] Compared to existing display modules that cut grooves in the protective layer of the display panel to expose the marked areas, the display module and display device provided in this application can, on the one hand, protect the display panel by continuously laying a protective layer on the non-display side of the display panel, thereby avoiding electrostatic shock and circuit burnout caused by exposed internal circuits; on the other hand, the specific location of the marked areas can be intuitively determined by light-transmitting areas on the protective layer corresponding to the marked areas of the display panel, thereby improving the anti-static capability of the display module while determining the location of the marked areas of the display panel.

[0020] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0021] Other features, objects, and advantages of this application will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings:

[0022] Figure 1 This is a schematic diagram of the folding of the display module 10 of this application;

[0023] Figure 2 A cross-sectional schematic diagram of the display module 10 provided in an embodiment of this application;

[0024] Figure 3 One of the cross-sectional schematic diagrams of the display module 20 provided in the embodiments of this application;

[0025] Figure 4 A second cross-sectional schematic diagram of the display module 20 provided in the embodiments of this application;

[0026] Figure 5 The third cross-sectional schematic diagram of the display module 20 provided in the embodiments of this application;

[0027] Figure 6 A schematic flowchart illustrating one of the methods for manufacturing the display module 20 provided in this application embodiment;

[0028] Figure 7 A schematic diagram illustrating one of the methods for manufacturing the display module 20 provided in this application embodiment;

[0029] Figure 8 Fourth cross-sectional schematic diagram of the display module 20 provided in the embodiments of this application;

[0030] Figure 9 This is a schematic flowchart of a second method for preparing the display module 20 provided in this application embodiment;

[0031] Figure 10 A schematic diagram illustrating the second method for preparing the display module 20 provided in this application embodiment;

[0032] Figure 11 Fifth cross-sectional schematic diagram of the display module 20 provided in the embodiments of this application;

[0033] Figure 12 Sixth cross-sectional schematic diagram of the display module 20 provided in the embodiments of this application;

[0034] Figure 13 This is a schematic flowchart of a third method for preparing the display module 20 provided in this application embodiment;

[0035] Figure 14 A schematic diagram illustrating the third method for preparing the display module 20 provided in this application embodiment;

[0036] Figure 15 Seventh cross-sectional schematic diagram of the display module 20 provided in the embodiments of this application;

[0037] Figure 16 A schematic flowchart illustrating a fourth method for preparing the display module 20 provided in this application embodiment;

[0038] Figure 17 A schematic diagram illustrating the fourth method for preparing the display module 20 provided in this application embodiment;

[0039] Figure 18 A schematic flowchart illustrating the fifth method for preparing the display module 20 provided in this application embodiment;

[0040] Figure 19 A schematic diagram of the fifth method for preparing the display module 20 provided in this application embodiment;

[0041] Figure 20 This is a folding schematic diagram of the display module 20 provided in an embodiment of this application;

[0042] In the above image:

[0043] 10 - Conventional display module; 11 - Display panel; 111 - T-shaped mark on the lower edge of display panel 11; 12 - Panel edge; 121 - Cross-shaped mark in area of ​​panel edge 12; 13 - Panel protective layer; 131 - Notch in panel protective layer 13; 132 - Notch corresponding to opening 112; 20 - Display module; 21 - Display panel; 22 - Panel protective layer; 221 - Light-transmitting area; 222 - First marking area; 401 - Cut-out area; 701 - Foam; 702 - Silicone gel; 801 - Conductive area; 1001 - Copper foil; 1002 - Indium tin oxide; 1901 - Aluminum oxynitride; 23 - Panel edge of display module 20; 231 - Second marking area. Detailed Implementation

[0044] The present application will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, only the parts relevant to the invention are shown in the accompanying drawings.

[0045] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. The present application will now be described in detail with reference to the accompanying drawings and embodiments. Furthermore, the term "and / or" in this document is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. The terms "first" and "second," etc., in the specification and claims of the embodiments of this application are used to distinguish different objects, not to describe a specific order of objects.

[0046] In one embodiment, the bezel width of the display panel inside the display module can be shortened using a PAD bending process. Specifically, different marks can be designed at preset positions on the display panel (i.e., the Panel layer) and the panel bezel (i.e., the Pad area) to align the display panel and the panel bezel, thereby achieving PAD bending of the display module. For example, T-shaped / diamond-shaped marks can be designed at the bottom bezel of the display panel, and cross-shaped marks can be designed in the panel bezel area.

[0047] For example, Figure 1 This is a folding schematic diagram of the display module 10 provided in the embodiments of this application, as shown below. Figure 1 As shown, the alignment of the display module 10 during the PAD Bending process can be achieved by the correspondence between the T-shaped mark 111 set on the lower edge of the display panel 11 and the cross-shaped mark 121 set in the area of ​​the panel edge 12.

[0048] In order to determine the position of the mark 111 set on the display panel 11, it is necessary to perform a slot design on the panel protective layer (i.e., SCF layer) of the display panel 11 to expose the mark 111 set on the display panel 11; wherein, the panel protective layer can be designed with a circular transition slot or a square slot.

[0049] Specifically, Figure 2 This is a cross-sectional schematic diagram of the display module 10 provided in the embodiments of this application, as shown below. Figure 2 As shown, a square groove design can be made in the panel protective layer 13 to form the notch 131 in the panel protective layer 13. Correspondingly, refer to Figure 1 On one side of the panel protective layer 13 of the display panel 11, there is a notch 131 corresponding to the mark 111, so that the T-shaped mark 111 is exposed through the notch 131.

[0050] It should be noted that since the display module 10 can be used to form a display device with camera function, the display panel 11 also has an opening 112 at the corresponding camera position, and therefore the panel protective layer 13 also has a notch 132 corresponding to the opening 112.

[0051] However, the slotted design of the panel protective layer 13 has two main drawbacks. First, it easily exposes the internal wiring of the display panel 11, leading to electrostatic discharge (ESD) and circuit burnout. Second, the opening 112 at the camera location on the display panel 11 is prone to ion migration within the polarizer under high temperature and humidity conditions, causing corrosion of the frame near the opening 112, which in turn leads to delamination and black spots on the display panel 11. Therefore, the poor anti-static capability of the display module 10 provided in this embodiment is a problem that urgently needs to be addressed.

[0052] Based on this, this application proposes a display module that can protect the display panel by using a continuously laid protective layer, and expose the first marking area through a light-transmitting area on the protective layer that corresponds to the first marking area, so as to improve the antistatic capability of the display module while being able to determine the position of the first marking area.

[0053] In one embodiment of this application, a display module 20 is provided. Figure 3 This is one of the cross-sectional schematic diagrams of the display module 20 provided in the embodiments of this application, such as... Figure 3 As shown, the display module 20 includes a display panel 21 and a protective layer 22 continuously laid on the non-display side of the display panel 21.

[0054] Specifically, the protective layer 22 includes a light-transmitting area 221, which is correspondingly disposed with the first marking area 211 of the display panel 21 to expose the first marking area 211.

[0055] In this embodiment, a continuously laid protective layer 22 can be used to protect the display panel 21 to avoid exposing the internal circuitry of the display panel 21.

[0056] For example, the protective layer 22 can be continuously laid on one side of the display panel 21 by correspondingly setting at least one film layer of the protective layer 22 with the display panel 21.

[0057] For example, when the protective layer 22 includes a first film layer 222 and a second film layer 223, the first film layer 222 can be continuously laid on the non-display side of the display panel 21, and the second film layer 223 can be continuously laid on the side of the first film layer 222 away from the display panel 21.

[0058] Optionally, when the protective layer 22 includes a first film layer 222 and a second film layer 223, the second film layer 223 can be continuously laid on the side of the first film layer 222 away from the display panel 21 and is correspondingly set with the display panel 21.

[0059] It should be noted that the above-mentioned film layer and the display panel 21 are configured to correspond to each other, which can be understood as the orthographic projection pattern of the film layer and the orthographic projection pattern of the display panel 21 overlapping, that is, the shape and area of ​​the film layer are consistent with the shape and area of ​​the display panel 21.

[0060] In this embodiment of the application, without slotting the protective layer 22 (i.e., the protective layer 22 is laid continuously), the first marking area 222 of the display panel 21 can be exposed through the light-transmitting area 221, so as to achieve the marking alignment of the display panel 21 while avoiding the exposure of the internal circuits of the display panel 21.

[0061] In one possible implementation, at least a portion of the protective layer 22 can be prepared using a light-transmitting material, such that the protective layer 22 includes a light-transmitting region 221.

[0062] For example, the light-transmitting area 221 of the protective layer 22 can be configured to correspond to the first marking area 211 of the display panel 21. The first marking area 211 is provided with markings, such as T-shaped or diamond-shaped markings.

[0063] Specifically, the marks set in the first marking area 211 can be used to align the display module 20 during the PAD Bending process (i.e., to align it with the marks on the panel bezel of the display module 20 during the PAD Bending process).

[0064] It should be noted that the above-mentioned display module 20 can be used to construct a display device. For example, the display device can be a terminal device that includes the display module 20. Therefore, the first marking area 211 can also be the area of ​​the terminal device used for camera recording. That is, the first marking area 211 can also include camera hole markings.

[0065] For example, a transparent film layer can be prepared using a light-transmitting material to form a protective layer 22 based on the transparent film layer. Specifically, the light-transmitting material can be at least one of silica gel, aluminum oxynitride (i.e., transparent aluminum), or indium tin oxide (i.e., ITO).

[0066] Optionally, the entire film layer can be prepared using a non-transparent material, and the area corresponding to the first marked area 211 in the entire film layer can be removed based on the first marked area 211 to prepare the area using a transparent material, thereby forming a protective layer 22 containing a transparent area 221 provided corresponding to the first marked area 211.

[0067] Compared to the existing display module 10, which has slots cut into the protective layer of the display panel to expose the marked area of ​​the display panel, the display module 20 provided in this application embodiment can, on the one hand, protect the display panel 21 by continuously laying a protective layer 22 on the non-display side of the display panel 21, thereby avoiding electrostatic shock and circuit burnout caused by exposed internal circuits of the display panel 21; on the other hand, the specific location of the first marked area 211 can be directly determined by the light-transmitting area 221 provided on the protective layer 22 corresponding to the first marked area 211 of the display panel 21, thereby improving the anti-static capability of the display module 20 while determining the location of the first marked area 211 of the display panel 21.

[0068] In another embodiment of this application, a specific distribution of the protective layer 22 is also provided. For example, the protective layer 22 includes a first film layer 222 and a second film layer 223 stacked together. The area of ​​the first film layer 222 near the display panel 21 and corresponding to the first marking area 211 is a cut-out area. The second film layer 223 is continuously laid on the side of the first film layer 222 away from the display panel 21, and the area corresponding to the first marking area 211 is a light-transmitting area 221.

[0069] In this embodiment, the display panel 21 can be protected by a second film layer 223 continuously laid in the display panel protective layer 22, and the first marking area 211 can be exposed by the cooperation between the hollowed-out area of ​​the first film layer 222 corresponding to the first marking area 211 and the light-transmitting area 221 on the second film layer 223.

[0070] For example, Figure 4 This is a second cross-sectional schematic diagram of the display module 20 provided in the embodiments of this application, as shown below. Figure 4 As shown, the first film layer 222 of the protective layer 22 near the display panel 21 includes a cutout area 401 corresponding to the first marking area 211. The second film layer 223 of the protective layer 22, which is continuously laid on the side of the first film layer 222 away from the display panel 21, includes a light-transmitting area 221 corresponding to the cutout area 401 (i.e., the first marking area 211). The first marking area 211 may include a T-shaped marking area of ​​the display panel 21 and a preset imaging area.

[0071] In one possible implementation, the area of ​​the second film layer 223 other than the light-transmitting area 221 can be a light-transmitting film layer.

[0072] For example, the second film layer 223 can be a single, transparent film layer made of a light-transmitting material. For instance, Figure 5 This is the third cross-sectional schematic diagram of the display module 20 provided in the embodiments of this application, as shown below. Figure 5 As shown, the second film layer 223 can be a whole transparent film layer made of at least one of the light-transmitting materials selected from silicon gel, aluminum oxynitride, or indium tin oxide, wherein the area in the second film layer 223 corresponding to the hollowed-out area 401 of the first film layer 222 is the light-transmitting area 221.

[0073] Specifically, when the first film layer 222 of the protective layer 22 in the display module 20 is made of foam and the second film layer 223 is a solid layer of silicone gel, the process flow diagram for preparing the display module 20 is as follows: Figure 6 As shown, the method includes the following steps:

[0074] Step 601: Based on the orthographic projection shape of the display panel 21 and the position of the first marking area 211 in the display panel 21, a foam of a preset thickness is prepared as a first film layer 222.

[0075] For example, Figure 7 This is a schematic diagram of one of the preparation methods provided in the embodiments of this application, such as... Figure 7 As shown in (a), the foam 701 can be made into a shape that is consistent with the orthographic projection shape of the display panel 21.

[0076] For example, such as Figure 7 As shown in (b), based on the position of the first marked area 211 in the display panel 21, the foam 701 at the corresponding position of the first marked area 211 can be removed to form the first film layer 222. The preset thickness range of the foam 701 can be 0.1mm to 0.5mm, for example, it can be 0.14mm, 0.16mm or 0.18mm.

[0077] For example, foam 701 can be made into a shape that matches the orthographic projection shape of display panel 21 by cutting foam 701.

[0078] It should be noted that, taking the T-shaped mark or the camera hole mark set on the display panel 21 as the center, the area extending outward by 0.6mm can be the specific location of the first mark area 211 in the display panel 21. Here, there is no specific limitation on the outward dimension of the mark center.

[0079] Step 602: Based on the orthographic projection shape of the display panel 21, a second film layer 223 is prepared using silicone gel.

[0080] For example, such as Figure 7 As shown in (c), a single transparent film layer with the same shape as the orthographic projection of the display panel 21 can be fabricated using silicone gel 702 to complete the preparation of the second film layer 223. The thickness of the silicone gel 702 can be in the range of 0.1 mm to 0.5 mm, for example, 0.125 mm or 0.135 mm.

[0081] Step 603: Prepare a protective layer 22 using the first film layer 222 and the second film layer 223.

[0082] For example, such as Figure 7 As shown in (d), the second film layer 223 is attached to one side of the first film layer 222 to complete the preparation of the protective layer 22.

[0083] Step 604: Set the protective layer 22 on one side of the display panel 21 to complete the preparation of the display module 20.

[0084] For example, such as Figure 7As shown in (e), the protective layer 22 can be attached to the non-display side of the display panel 21 so that the first marking area 211 of the display panel 21 can be exposed through the light-transmitting area 221 on the protective layer 22, thereby completing the fabrication of the display module 20.

[0085] In this embodiment, the protective layer 22 is formed by stacking foam 701 and silicone gel 702, which can reduce the difficulty and cost of preparing the protective layer 22 while realizing the design of the light-transmitting area 221 in the protective layer 22.

[0086] In one possible implementation, the second film layer 223 further includes a conductive material disposed in a region other than the light-transmitting region 221.

[0087] In this embodiment, the conductive material in the second film layer 223 can be used to achieve the conductive and thermal conductivity functions of the protective layer 22.

[0088] For example, the second film layer 223 can be composed of both a light-transmitting material and a conductive material. For instance, Figure 8 This is the fourth cross-sectional schematic diagram of the display module 20 provided in the embodiments of this application, as shown below. Figure 8 As shown, the region in the second film layer 223 corresponding to the first marked region 211 can be a light-transmitting region 221 made of a light-transmitting material, and the region in the second film layer 223 other than the light-transmitting region 221 can be a conductive region 801 made of a conductive material. The light-transmitting material can be, for example, silicon gel, aluminum oxynitride, or indium tin oxide, and the conductive material can be, for example, copper foil.

[0089] Specifically, when the material of the first film layer 222 of the protective layer 22 in the display module 20 is foam, the material of the light-transmitting area 221 in the second film layer 223 is indium tin oxide, and the material of the conductive area in the second film layer 223 is copper foil, the process diagram for manufacturing the display module 20 is as follows: Figure 9 As shown, the method includes the following steps:

[0090] Step 901: The foam of a preset thickness is bonded to the copper foil, and the bonded foam and copper foil are made into a shape that matches the orthographic projection shape of the display panel 21.

[0091] For example, Figure 10 This is a schematic diagram of the second preparation method provided in the embodiments of this application, as shown below. Figure 10As shown in (a), foam 701 of a preset thickness can be bonded to copper foil 1001, and the shapes of foam 701 and copper foil 1001 in the bonded state can be cut into the orthographic projection shape of display panel 21. The preset thickness of foam 701 can be 0.1mm to 0.5mm, for example, 0.14mm, 0.16mm or 0.18mm, and the preset thickness of copper foil 1001 can be 0.01mm to 0.1mm, for example, 0.025mm, 0.035mm or 0.05mm.

[0092] For example, the foam 701 and copper foil 1001 in the above-mentioned bonded state can be cut into a shape that is 0.3mm or 0.27mm smaller than the orthographic projection shape of the display panel 21, without any specific limitation.

[0093] Step 902: Based on the position of the first marked area 211 in the display panel 21, the first film layer 222 and the second film layer 223 are prepared using foam and copper foil that have the same orthographic projection shape as the display panel 21 in step 901.

[0094] For example, the material in the area corresponding to the first marked area 211 in the foam that is consistent with the orthographic projection shape of the display panel 21 can be removed to complete the preparation of the first film layer 222.

[0095] For example, material in the area corresponding to the first marked area 211 of the copper foil that is consistent with the orthographic projection shape of the display panel 21 can be removed, and light-transmitting material can be prepared in the area corresponding to the first marked area 211 to form the second film layer 223.

[0096] Specifically, a light-transmitting material can be deposited on one side of the first film layer 222 (i.e., the side of the foam) and in the area corresponding to the first marking area 211. The light-transmitting material can be indium tin oxide, and the thickness of the light-transmitting material can be 0.01 mm.

[0097] For example, such as Figure 10 As shown in (b), the material in the foam 701 and the copper foil 1001 corresponding to the first marking area 211 can be removed, and an indium tin oxide 1002 film can be deposited on one side of the foam 701 in the area corresponding to the first marking area 211, thereby forming a first film layer 222 and a second film layer 223.

[0098] It should be noted that since foam 701 and copper foil 1001 are already in a bonded state in step 901, the first film layer 222 and the second film layer 223 are also in a bonded state when the preparation is completed.

[0099] Step 903: The protective layer 22 formed by the first film layer 222 and the second film layer 223 is disposed on one side of the display panel 21 to complete the preparation of the display module 20.

[0100] For example, such as Figure 10 As shown in (c), the protective layer 22 can be attached to the non-display side of the display panel 21 so that the first marking area 211 of the display panel 21 can be exposed through the light-transmitting area 221 on the protective layer 22, thereby completing the fabrication of the display module 20.

[0101] In this embodiment, a local ITO coating is performed on the commonly used stack of foam and copper foil to form a protective layer 22, thereby reducing the difficulty of preparing the protective layer 22 while realizing the design of the light-transmitting area 221 in the protective layer 22.

[0102] In another embodiment of this application, another specific distribution of the protective layer 22 is provided. For example, the protective layer 22 includes a first film layer 222 and a second film layer 223 stacked together. The first film layer 222 is continuously laid on the side close to the display panel 21, and the second film layer 223 is continuously laid on the side of the first film layer 222 away from the display panel 21. The first film layer 222 and the second film layer 223 each have a light-transmitting area 221 corresponding to the first marked area 211.

[0103] In this embodiment, the display panel 21 can be protected by the first film layer 222 and the second film layer 223 continuously laid in the display panel protective layer 22, and the first marking area 211 can be exposed by the light-transmitting area 221 in the first film layer 222 and the second film layer 223 corresponding to the first marking area 211.

[0104] For example, Figure 11 This is the fifth cross-sectional schematic diagram of the display module 20 provided in the embodiments of this application, as shown below. Figure 11 As shown, both the first film layer 222 and the second film layer 223 include a light-transmitting area 221 corresponding to the first marking area 211. The first marking area 211 may include a T-shaped marking area of ​​the display panel 21 and a preset camera area.

[0105] In one possible implementation, the areas of the first film layer 222 and the second film layer 223 other than the light-transmitting area 221 can be light-transmitting film layers.

[0106] For example, the first film layer 222 and the second film layer 223 can each be a single, transparent film layer made of a light-transmitting material. For example, Figure 12 This is the sixth cross-sectional schematic diagram of the display module 20 provided in the embodiments of this application, as shown below. Figure 12As shown, the first film layer 222 and the second film layer 223 can be a whole transparent film layer made of at least one of the light-transmitting materials selected from silicon gel, aluminum oxynitride or indium tin oxide, wherein the area in the first film layer 222 and the second film layer 223 corresponding to the first marked area 211 is the light-transmitting area 221.

[0107] It should be noted that the light-transmitting materials used to prepare the first film layer 222 and the second film layer 223 can be the same or different, and no specific restrictions are imposed here.

[0108] Specifically, when the first film layer 222 of the protective layer 22 in the display module 20 is a solid layer of silicone gel and the second film layer 223 is a solid layer of indium tin oxide, the process flow diagram for fabricating the display module 20 is as follows: Figure 13 As shown, the method includes the following steps:

[0109] Step 1301: Design an indium tin oxide coating on one side of the silicon gel of a preset thickness.

[0110] For example, an indium tin oxide (ITO) coating can be applied to the entire surface of a silicone gel of a preset thickness. The preset thickness of the silicone gel can be in the range of 0.1 mm to 0.5 mm, for example, 0.125 mm or 0.135 mm, and the ITO coating thickness can be 0.01 mm.

[0111] It should be noted that the aforementioned indium tin oxide can be used to support the display panel 21. Therefore, the thickness of the indium tin oxide coating is sufficient to ensure the support of the display panel 21, and no specific restrictions are imposed here.

[0112] For example, Figure 14 This is a schematic diagram of the third preparation method provided in the embodiments of this application, as shown below. Figure 14 As shown in (a), a silicone gel 702 of a preset thickness can be selected first; as Figure 14 As shown in (b), silicon gel 702 can be coated with indium tin oxide 1002.

[0113] Step 1302: The silicon gel after indium tin oxide coating is made into a shape consistent with the orthographic projection shape of the display panel 21 to form a protective layer 22, and the protective layer 22 is placed on one side of the display panel 21 to complete the preparation of the display module 20.

[0114] For example, the coated silicone gel can be cut into a shape that matches the orthographic projection shape of the display panel 21 to form a protective layer 22 formed by indium tin oxide and silicone gel.

[0115] For example, the protective layer 22 can be attached to the non-display side of the display panel 21 so that the first marking area 211 of the display panel 21 can be exposed through the light-transmitting area 221 on the protective layer 22, thereby completing the fabrication of the display module 20.

[0116] For example, such as Figure 14 As shown in (c), the cut silicone gel 702 and indium tin oxide 1002 can be bonded to the non-display side of the display panel 21 to complete the fabrication of the display module 20.

[0117] In this embodiment, the protective layer 22 of the display panel 21 can be formed by ITO coating on one side of the silicone gel, thereby improving the flatness of the protective layer 22 and facilitating the fabrication of the display module 20 while realizing the design of the light-transmitting area 221 in the protective layer 22.

[0118] In one possible implementation, the area of ​​the first film layer 222 other than the light-transmitting area 221 can be a light-transmitting film layer, and the area of ​​the second film layer 223 other than the light-transmitting area 221 can be provided with a conductive material.

[0119] In this embodiment, the conductive material in the second film layer 223 can be used to achieve the conductive and thermal conductivity functions of the protective layer 22.

[0120] For example, the first film layer 222 can be a single transparent film layer made of a light-transmitting material, and the second film layer 223 can be composed of both a light-transmitting material and a conductive material. For example, Figure 15 This is the seventh cross-sectional schematic diagram of the display module 20 provided in the embodiments of this application, as shown below. Figure 15 As shown, the first film layer 222 can be a single transparent film layer made of at least one of the light-transmitting materials selected from silica gel, aluminum oxynitride, or indium tin oxide. The area in the second film layer 223 corresponding to the first marked area 211 can be a light-transmitting area 221 made of at least one of the light-transmitting materials selected from silica gel, aluminum oxynitride, or indium tin oxide. The area in the second film layer 223 other than the light-transmitting area 221 can be a conductive area 801 made of a conductive material. The area in the first film layer 222 corresponding to the first marked area 211 is the light-transmitting area 221.

[0121] It should be noted that the light-transmitting materials used to prepare the light-transmitting regions 221 in the first film layer 222 and the second film layer 223 can be the same or different, and no specific restrictions are imposed here.

[0122] Specifically, when the first film layer 222 of the protective layer 22 in the display module 20 is a solid layer of silicone gel, the material of the light-transmitting area 221 in the second film layer 223 is indium tin oxide, and the material of the conductive area in the second film layer 223 is copper foil, the process diagram for fabricating the display module 20 is as follows: Figure 16 As shown, the method includes the following steps:

[0123] Step 1601: Adhere the silicone gel of a preset thickness to the copper foil, and shape the adhered silicone gel and copper foil into a shape consistent with the orthographic projection shape of the display panel 21.

[0124] For example, Figure 17 This is a schematic diagram of the fourth preparation method provided in the embodiments of this application, as shown below. Figure 17 As shown in (a), a silicone gel 702 of a preset thickness can be bonded to a copper foil 1001, and the shapes of the bonded silicone gel 702 and copper foil 1001 can be cut into the orthographic projection shape of the display panel 21. The preset thickness of the silicone gel 702 can be 0.1mm to 0.5mm, for example, 0.125mm or 0.135mm, and the preset thickness of the copper foil 1001 can be 0.01mm to 0.1mm, for example, 0.025mm, 0.035mm or 0.050mm.

[0125] For example, the silicone gel 702 and copper foil 1001 in the above-mentioned bonded state can be cut into a shape that is 0.3mm or 0.27mm smaller than the orthographic projection shape of the display panel 21, without any specific limitation.

[0126] Step 1602: Based on the position of the first marked area 211 in the display panel 21, a first film layer 222 is prepared using silicon gel that is consistent with the orthographic projection shape of the display panel 21 in step 1801, and a second film layer 223 is prepared using copper foil and indium tin oxide that are consistent with the orthographic projection shape of the display panel 21 in step 1801.

[0127] For example, a silicone gel that conforms to the orthographic projection shape of the display panel 21 can be used as the first film layer 222.

[0128] For example, material in the area corresponding to the first marked area 211 of the copper foil that is consistent with the orthographic projection shape of the display panel 21 can be removed, and light-transmitting material can be prepared in the area corresponding to the first marked area 211 to form the second film layer 223.

[0129] Specifically, a light-transmitting material can be deposited on one side of the first film layer 222 (i.e., the side of the silicone gel) and in the area corresponding to the first marking area 211. The light-transmitting material can be indium tin oxide, and the thickness of the light-transmitting material can be 0.010 mm.

[0130] For example, such as Figure 17 As shown in (b), the material in the copper foil 1001 corresponding to the first marking area 211 can be removed, and an indium tin oxide 1002 film can be deposited on one side of the silicon gel 702 in the area corresponding to the first marking area 211, thereby forming a first film layer 222 and a second film layer 223.

[0131] Step 1603: The protective layer 22 formed by the first film layer 222 and the second film layer 223 is disposed on one side of the display panel 21 to complete the preparation of the display module 20.

[0132] For example, such as Figure 17 As shown in (c), the protective layer 22 can be attached to the non-display side of the display panel 21 so that the first marking area 211 of the display panel 21 can be exposed through the light-transmitting area 221 on the protective layer 22, thereby completing the fabrication of the display module 20.

[0133] In this embodiment, a local ITO coating is applied to the stacked film of silicon gel and copper foil to form a protective layer 22, thereby achieving the design of the light-transmitting area 221 in the protective layer 22 without reducing the heat dissipation function of the protective layer 22 by utilizing the copper foil layer.

[0134] Specifically, when the first film layer 222 of the protective layer 22 in the display module 20 is a solid layer of silicone gel, the material of the light-transmitting area 221 in the second film layer 223 is aluminum oxynitride, and the material of the conductive area in the second film layer 223 is copper foil, the process diagram for manufacturing the display module 20 is as follows: Figure 18 As shown, the method includes the following steps:

[0135] Step 1801: Adhere the silicone gel of a preset thickness to the copper foil, and shape the adhered silicone gel and copper foil into a shape consistent with the orthographic projection shape of the display panel 21.

[0136] For example, Figure 19 This is a schematic diagram of the fifth preparation method provided in the embodiments of this application, as shown below. Figure 19 As shown in (a), a silicone gel 702 of a preset thickness can be bonded to a copper foil 1001, and the shapes of the bonded silicone gel 702 and copper foil 1001 can be cut into the orthographic projection shape of the display panel 21. The preset thickness of the silicone gel 702 can be 0.1mm to 0.5mm, for example, 0.125mm or 0.135mm, and the preset thickness of the copper foil 1001 can be 0.01mm to 0.1mm, for example, 0.025mm, 0.035mm or 0.05mm.

[0137] For example, the silicone gel 702 and copper foil 1001 in the above-mentioned bonded state can be cut into a shape that is 0.3mm or 0.27mm smaller than the orthographic projection shape of the display panel 21, without any specific limitation.

[0138] Step 1802: Based on the position of the first marked area 211 in the display panel 21, a first film layer 222 is prepared using silicone gel that has the same orthographic projection shape as the display panel 21 in step 1801, and a second film layer 223 is prepared using copper foil and aluminum oxynitride that have the same orthographic projection shape as the display panel 21 in step 1801.

[0139] For example, a silicone gel that conforms to the orthographic projection shape of the display panel 21 can be used as the first film layer 222.

[0140] For example, material in the area corresponding to the first marked area 211 of the copper foil that is consistent with the orthographic projection shape of the display panel 21 can be removed, and light-transmitting material can be prepared in the area corresponding to the first marked area 211 to form the second film layer 223.

[0141] Specifically, a light-transmitting material can be covered on one side of the first film layer 222 (i.e., the side of the silicone gel) and in the area corresponding to the first marking region 211. The light-transmitting material can be aluminum oxynitride, and its thickness can be 0.03 mm or 0.05 mm.

[0142] For example, such as Figure 19 As shown in (b), the material in the copper foil 1001 corresponding to the first marking area 211 can be removed, and aluminum oxynitride 1901 can be covered on one side of the silicone gel 702 in the area corresponding to the first marking area 211, thereby forming a first film layer 222 and a second film layer 223.

[0143] Step 1803: The protective layer 22 formed by the first film layer 222 and the second film layer 223 is disposed on one side of the display panel 21 to complete the preparation of the display module 20.

[0144] For example, such as Figure 19 As shown in (c), the protective layer 22 can be attached to the non-display side of the display panel 21 so that the first marking area 211 of the display panel 21 can be exposed through the light-transmitting area 221 on the protective layer 22, thereby completing the fabrication of the display module 20.

[0145] Compared to applying a local ITO coating to the stacked film of silicone gel and copper foil, this embodiment of the application applies a local transparent aluminum coating to the stacked film of silicone gel and copper foil to form a protective layer 22. This allows the design of the light-transmitting area 221 in the protective layer 22 to be achieved without reducing the heat dissipation function of the protective layer 22, and improves the support of the first marking area 221.

[0146] In another embodiment of this application, other structural distributions of the display module 20 are also provided. Exemplarily, the display module 20 further includes a panel bezel 23, wherein the panel bezel 23 includes a second marking region 231 to fold the panel bezel 23 based on the alignment of the first marking region 211 and the second marking region 231.

[0147] For example, Figure 20 This is a folding schematic diagram of the display module 20 provided in the embodiments of this application, as shown below. Figure 20 As shown, the first marking area 211 can be provided with a T-shaped mark, and the second marking area 231 can be a cross-shaped mark. Specifically, the folding of the panel border 23 can be achieved based on the alignment of the T-shaped mark and the cross-shaped mark.

[0148] In another embodiment of this application, a display device 30 is also described, which may include the display panel 20 described in the foregoing embodiments.

[0149] In one possible implementation, the display device 30 can be used to output image information. For example, the display device 30 can display text images by controlling semiconductor light-emitting diodes; for instance, the display device 30 can be an OLED display.

[0150] The above description is merely a preferred embodiment of this application and an explanation of the technical principles employed. Those skilled in the art should understand that the scope of disclosure in this application is not limited to technical solutions formed by specific combinations of the above-described technical features, but should also cover other technical solutions formed by arbitrary combinations of the above-described technical features or their equivalents without departing from the foregoing disclosed concept. For example, technical solutions formed by substituting the above features with (but not limited to) technical features with similar functions disclosed in this application.

Claims

1. A display module, characterized by The display module comprises a display panel and a protective layer continuously laid on a non-display side of the display panel. The protective layer comprises a light-transmitting region corresponding to the first mark region of the display panel to expose the first mark region.

2. The display module of claim 1, wherein, The protective layer comprises a first film layer and a second film layer arranged in a stack, the first film layer is close to the display panel and the region corresponding to the first mark region is a hollow region, and the second film layer is continuously laid on a side of the first film layer away from the display panel and the region corresponding to the first mark region is a light-transmitting region.

3. The display module of claim 1, wherein, The protective layer comprises a first film layer and a second film layer arranged in a stack, the first film layer is continuously laid on a side close to the display panel, and the second film layer is continuously laid on a side of the first film layer away from the display panel; the first film layer and the second film layer are respectively a light-transmitting region in the region corresponding to the first mark region.

4. The display module of claim 2 or 3, wherein, The second film layer further comprises a conductive material, and the conductive material is arranged in a region other than the light-transmitting region.

5. The display module of claim 4, wherein, The conductive material is a copper foil.

6. The display module of claim 2 or 3, wherein, The region other than the light-transmitting region of the second film layer is a light-transmitting film layer.

7. The display module of claim 2, wherein, The material of the first film layer is foam.

8. The display module of claim 3, wherein, The region other than the light-transmitting region of the first film layer is a light-transmitting film layer.

9. The display module of claim 1, wherein, The light-transmitting region is a film layer made of at least one of silicone gel, aluminum nitride oxide, and indium tin oxide.

10. The display module of claim 1, wherein, The display module further comprises a panel frame. The panel frame comprises a second mark region to fold the panel frame based on alignment of the first mark region and the second mark region.

11. A display device, characterized by comprising: The display module comprises any one of claims 1-10. The display module comprises any one of claims 1-10.

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