Cylindrical rotating multi-path laser beam machining method

Abstract

The application discloses a cylindrical rotation multi-path laser beam processing method and relates to the technical field of cylindrical surface processing. The processing method comprises the following steps: S1, adjusting the light path of a laser; S2, marking points or lines on the surface of a polyurethane cylinder through laser light emission, and driving the laser to offset through a marking control system; S3, moving the laser to the focal point position of the polyurethane cylinder, marking and slotting through laser light emission, and rotating the polyurethane cylinder simultaneously for one circle, wherein the adjustment of the laser light path position is completed when the line width of laser marking and slotting is the same as the line width of polyurethane cylinder rotation; and S4, adjusting the parameters of the marking control system, and reaching the processing slotting position of the laser, and processing the polyurethane cylinder through laser light emission. The application provides a cylindrical rotation multi-path laser beam processing method, laser processing polyurethane cylinders, limited production cost change, significantly improving production efficiency, and reducing production cost.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of cylindrical surface processing, in particular to a cylindrical rotation multi-path laser beam processing method. BACKGROUND

[0002] Polyurethane (PU), also known as polyurethane, is a high molecular compound composed of polyisocyanate and polyhydroxy polymer. Polyurethane is an excellent material with high strength, wear resistance and compression resistance. The polyurethane cylinder is a workpiece to be processed by laser processing (slotting). The current slotting equipment is a lathe, which requires tools, cutting fluid and other consumables during use, increasing the cost of enterprises, and at the current stage, the battery sheet is becoming thinner and thinner, and the lathe has been unable to meet the trend of thinning of the battery sheet.

[0003] Therefore, there is an urgent need for a cylindrical rotation multi-path laser beam processing method with low learning cost, simple operation, higher processing efficiency and faster slotting speed than lathe processing.

[0004] Compared with planar processing, cylindrical processing mainly involves curved surface processing, which requires precise control of laser focal length to avoid problems such as focus misadjustment. Compared with traditional processing lathe processing, cylindrical laser processing has higher precision, more stringent processing requirements, high processing efficiency, and does not require replacement of tools and other auxiliary tools. Although the initial investment is large, considering its high precision, high efficiency, subsequent processing procedures and costs, it has high cost-effectiveness in the long run.

[0005] However, cylindrical laser processing technology still faces some challenges in practical application, such as: 1. How to maintain groove uniformity and stability during laser curved surface processing and rotation processing;

[0006] 2. Planar processing is mostly static processing, curved surface processing requires mechanical cooperation and rotation processing, which is more difficult to process; 3. Cylindrical slotting processing, the distance between grooves is microns, which requires a stable site, level, equipment mechanical structure, etc.

[0007] 4. Control of laser focal point is particularly important during curved surface processing, as the change of focal point directly affects groove depth, angle, top width and bottom width due to the characteristics of curved surface processing;

[0008] 5. During curved surface processing, the stability of the laser system must be ensured to avoid processing errors caused by vibration or unstable laser beam, which requires high precision and high stability of the processing equipment;

[0009] 6. Laser processing places certain requirements on the surface of the cylinder being processed. The cylinder must maintain a flat surface to avoid unevenness. The surface should be smooth, free of slag and defects to meet the processing requirements. Summary of the Invention

[0010] To solve the above-mentioned technical problems, this invention provides a method for machining a cylindrical polyurethane cylinder using a rotating multi-beam laser. This method requires the laser to be used in conjunction with a marking control system to adjust the laser's Y and X axes for vertical and horizontal offsets. This allows the two laser beams from lasers L1 and L2 to be combined on the surface of the workpiece (polyurethane cylinder). The most concentrated point of the laser beams (focal point) is then located, and the polyurethane cylinder is grooved during machining. Specifically, the method includes the following technical solutions:

[0011] A method for machining a cylindrical object using a rotating multi-beam laser is provided, comprising the following steps:

[0012] S1. Adjust the optical path of the laser, wherein the laser includes an L1 laser and an L2 laser, and the optical paths of the L1 laser and the L2 laser belong to the same parallel line;

[0013] S2. Using laser light, dots or lines are made on the surface of the polyurethane cylinder. Observe and take pictures with a magnifying glass, and measure the distance between the dots or lines made by the L1 laser and the L2 laser. If there is a deviation, drive the laser to shift up and down and left and right along the Y and X axes of the laser through the marking control system.

[0014] S3. Move the laser along the Y-axis to the focal point of the polyurethane cylinder. The L1 and L2 lasers emit light to mark and groove. The laser begins to move along the X-axis while the polyurethane cylinder rotates one revolution. The laser moves 3-5mm along the X-axis. Then, use a microscope to observe and measure the line width of the marking and grooving by the L1 and L2 lasers. When the line width of the marking and grooving by the L1 and L2 lasers is the same as the line width of the polyurethane cylinder after rotation, the adjustment of the optical path position of the L1 and L2 lasers is complete.

[0015] S4. Adjust the parameters of the marking control system to confirm that the L1 laser and L2 laser have reached the processing slot position, and that the L1 laser and L2 laser emit light and contact the surface of the polyurethane cylinder to process the polyurethane cylinder.

[0016] Preferably, in step S1, multiple beams of light are concentrated by means of hardware DOE, focusing lens, beam expander, galvanometer, and beam splitter, thereby adjusting the optical path of the laser.

[0017] Preferably, in step S1, a frequency doubling plate is used for observation to ensure that the optical paths of L1 and L2 lasers are on the same parallel line.

[0018] Preferably, the laser is arranged on a base, the base is arranged on a lead screw, and the base is in sliding connection with the lead screw.

[0019] Preferably, the X axis of the laser is horizontal, and the Y axis of the laser is vertical.

[0020] Further, in step S4, the marking speed of the marking control system is 100-10000 mm / s, the jumping speed is 100-10000 mm / s, the frequency is 10-3000 khz, the marking, turning, and jumping delay is 0-100 mu s, the on and off light delay is 100-1000 mu s, and the marking number is 1-100 times.

[0021] Further, in step S1, the laser is one of an ultraviolet laser, a green laser, an infrared laser, and a CO2 laser.

[0022] Further, in step S1, the power of the laser is 10-100 kHz.

[0023] Further, before step S1, there is a step of correcting the marking coordinate system, which is to change the X and Y axis coordinate system of the L1 and L2 lasers through the marking control system.

[0024] Preferably, the correction of the marking coordinate system is to draw a "plus" on the marking control system, mark up and down and left and right, emit light from the L1 laser, mark on the surface of an aluminum plate or photo paper, observe the marked pattern with the naked eye, for example, if the coordinate system direction is incorrect, change the X and Y axis coordinate system through the marking control system, emit light and mark again, and so on, and the L2 laser is the same.

[0025] Further, before step S1, there is a step of adjusting the marking range, which is to adjust the correction accuracy of the L1 and L2 lasers to within ±1 um through the marking control system.

[0026] Preferably, the adjustment of the marking range is to draw a 20*20 standard square on the marking control system, emit light from the L1 laser to mark on an aluminum plate or photo paper, measure the diagonal size of the four sides using a vernier caliper or a two-dimensional meter, compare the measured size with the actual value, input the measured size into the corresponding position of the marking control system, mark again if the marked pattern is not the drawn 20*20 square, and so on, until the correction accuracy is within ±1 um, and the L2 laser is the same.

[0027] Further, in step S2, the polyurethane cylinder is provided with mechanical thimbles at both ends.

[0028] Further, in step S3, the motor drives the polyurethane cylinder to rotate, and the rotating speed of the motor is 100-20000 mm / s.

[0029] Preferably, the focal point position is the position where the laser beam has the highest light energy density and the laser power is most concentrated on the workpiece.

[0030] Further, in step S4, the L1 laser and the L2 laser emit light at the same time and simultaneously contact the surface of the polyurethane cylinder.

[0031] In the simultaneous light emission mode, the L1 laser and the L2 laser emit light synchronously, and the L1 laser and the L2 laser work synchronously to process and groove the surface of the polyurethane cylinder according to the preset process parameters of the marking control system. The starting and stopping of the L1 laser and the L2 laser are accurately controlled by the marking control system, so that the two lasers can be accurately processed.

[0032] Further, in step S4, the L1 laser and the L2 laser emit light in a staggered manner. The L1 laser processes the polyurethane cylinder through the upper computer operating system, and then the L2 laser processes the polyurethane cylinder through the upper computer operating system. The above steps are repeated to complete the processing of the polyurethane cylinder.

[0033] In the staggered light emission mode, the L1 laser and the L2 laser emit light alternately, and the two lasers work alternately. The L1 laser completes part of the groove processing, and then the L2 laser completes the remaining processing, and so on, to complete the processing of the entire cylinder. This mode can reduce the load of continuous work of the laser to a certain extent, while ensuring the processing efficiency and processing time.

[0034] Preferably, in step S4, the L1 laser and the L2 laser need to be confirmed to be correct before emitting light in a staggered manner.

[0035] Compared with the prior art, the present application has the following advantages:

[0036] 1. Laser processing of polyurethane cylinders can change the limited production cost, significantly improve the production efficiency, and reduce the production cost.

[0037] 2. This laser processing method is a new type of non-contact processing, and the traditional lathe processing is a contact cutting processing, which cannot avoid the problem of heat accumulation and influence on the groove type. In addition, the traditional lathe processing needs cutting fluid to assist in cooling, so that the laser processing method of the present application can significantly reduce the cost by reducing the consumption of tools and cutting fluid.

[0038] 3. The laser processing process is local processing, and the heat affected zone of the non-laser irradiation part is small, and the thermal deformation of the polyurethane main roller is smaller.

[0039] 4. The shape, angle, and depth of cylindrical machining can be changed quickly. However, the cutting tools of traditional lathe machining need to be customized in advance, which takes a long time and is expensive. The tools cannot be put into production directly after the initial debugging. After the debugging is completed, new tools need to be used to start production.

[0040] 5. Compared with single-laser grooving technology, dual-laser technology significantly improves efficiency, produces a more rounded and full grooving effect with significantly reduced burrs, smooth and natural edge transitions, and obvious advantages in morphological effect.

[0041] 5. Simultaneous processing by multiple lasers can significantly shorten processing time. Through precise mechanical control, errors and defects in processing can be reduced, improving the accuracy and consistency of the groove shape. It can adapt to different sizes and different polyurethane coating ratios to meet different needs. Attached Figure Description

[0042] To more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the following description of the embodiments will be briefly introduced. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0043] Figure 1 These are schematic diagrams of the polyurethane cylinders in Embodiments 1 and 2 of the present invention;

[0044] Figure 2 These are schematic diagrams of the laser and polyurethane cylinder in Embodiments 1 and 2 of the present invention;

[0045] Figure 3 This is a top view of the laser and the polyurethane cylinder in Embodiments 1 and 2 of the present invention;

[0046] Figure 4 This is a schematic diagram of the cylindrical rotating multi-path laser beam processing method according to Embodiment 1 of the present invention;

[0047] Figure 5 This is a schematic diagram of the cylindrical rotating multi-path laser beam processing method according to Embodiment 1 of the present invention;

[0048] Figure 6 This is a schematic diagram of the surface structure of a polyurethane cylinder after processing by the cylindrical rotating multi-path laser beam processing method of Embodiment 1 of the present invention;

[0049] Figure 7 This is a schematic diagram of the cylindrical rotating multi-path laser beam processing method according to Embodiment 2 of the present invention;

[0050] Figure 8The schematic diagram of the polyurethane cylinder surface structure processed by the cylindrical rotation multi-laser beam processing method of the embodiment 2 of the present application.

[0051] The identification in the figure is explained as follows:

[0052] 1-polyurethane cylinder; 2-mechanical thimble; 3-laser; 4-L1 laser; 5-L2 laser. DETAILED DESCRIPTION

[0053] The technical solutions in the embodiments of the present application will be described clearly and completely below, obviously, the described embodiments are part of the embodiments of the present application, but not all the embodiments. Based on the embodiments in the present application, all the other embodiments obtained by the person of ordinary skill in the art without making creative efforts belong to the protection scope of the present application.

[0054] It should be understood that, when used in the present specification and the appended claims, the terms "comprise" and "include" indicate the existence of the described features, integers, steps, operations, elements, and / or components, but do not exclude one or more other features, integers, steps, operations, elements, components, and / or sets thereof.

[0055] It should also be understood that the terms used in the present specification of the present application are only for the purpose of describing specific embodiments and are not intended to limit the present application. As used in the present specification and the appended claims, the singular forms "a", "an" and "the" are intended to include the plural forms, unless the context clearly indicates otherwise.

[0056] It should be further understood that the term "and / or" used in the present specification and the appended claims means any combination of one or more of the associated listed items and all possible combinations, and includes these combinations.

[0057] In order to more fully understand the technical content of the present application, the technical solutions of the present application will be further introduced and explained below in combination with specific embodiments.

[0058] Among them, the embodiment of the present application is to concentrate multiple beams of light by the way of hardware DOE, focusing mirror, beam expander, galvanometer, and beam splitter, so as to adjust the optical path of the laser.

[0059] The laser of the embodiment of the present application is arranged on the base, the base is arranged on the lead screw, and the base is in sliding connection with the lead screw. The laser, the base and the lead screw constitute a laser module. The X axis of the laser is transverse, and the Y axis of the laser is vertical.

[0060] The correction marking coordinate system is drawn on the marking control system, a "+" is drawn, up, down, left and right are marked, L1 laser light is emitted, and marking is performed on the surface of an aluminum plate or photo paper, the marked pattern is observed, for example, the coordinate system direction is incorrect, the X and Y axis coordinate system is changed through the marking control system, and the laser light is emitted and marked again, and the like, and the L2 laser is the same.

[0061] The focal point is the position where the laser beam has the highest light energy density and the most concentrated laser power.

[0062] Embodiment

[0063] As shown in Figures 1-3 , Figure 1 is a structure diagram of a polyurethane cylinder in embodiment 1 and embodiment 2 of the application; Figure 2 is a structure diagram of a laser and a polyurethane cylinder in embodiment 1 and embodiment 2 of the application; Figure 3 is a top view diagram of a laser and a polyurethane cylinder in embodiment 1 and embodiment 2 of the application.

[0064] Embodiment 1

[0065] A cylindrical rotation multi-path laser beam processing method, comprising the following steps:

[0066] S1. adjusting the light path of a laser (infrared laser, power is 50 kHz), the laser comprising an L1 laser and an L2 laser, the light paths of the L1 laser and the L2 laser are on the same parallel line (confirmed by using a frequency doubler);

[0067] S2. emitting light through the laser, and marking points or lines on the surface of a polyurethane cylinder, observing and taking pictures using a magnifying glass, and measuring the distance between the points or lines marked by the L1 laser and the L2 laser, if there is a deviation, driving the laser to shift up and down and left and right along the Y and X axes of the laser through the marking control system; wherein the polyurethane cylinder is provided with mechanical thimbles at both ends.

[0068] S3. Move the laser along the Y axis of the laser to the focus point of the polyurethane cylinder, and perform marking and slotting with L1 and L2 lasers. Then, start moving the laser along the X axis, and rotate the polyurethane cylinder for one revolution at the same time. The rotation of the polyurethane cylinder is driven by a motor, and the rotation speed of the motor is 10000 mm / s. Then, move the laser along the X axis by 3 mm, and observe and measure the line width of the marking and slotting performed by L1 and L2 lasers using a microscope. When the line width of the marking and slotting performed by L1 and L2 lasers is the same as the line width of the rotation of the polyurethane cylinder, the adjustment of the position of the light path of L1 and L2 lasers is completed.

[0069] S4. Adjust the parameters of the marking control system (the marking speed of the marking control system is 5000 mm / s, the jump speed is 5000 mm / s, the frequency is 1500 khz, the marking, turning, and jump delay is 50 μs, the on and off light delay is 500 μs, and the marking number is 50 times), and confirm that L1 and L2 lasers reach the processing slotting position. L1 and L2 lasers emit light at the same time and synchronously contact the surface of the polyurethane cylinder, and the polyurethane cylinder is processed.

[0070] Before step S1, the steps of correcting the marking coordinate system and adjusting the marking range are further included. The correction of the marking coordinate system is to change the X and Y axis coordinate systems of L1 and L2 lasers through the marking control system. The adjustment of the marking range is to adjust the correction accuracy of L1 and L2 lasers to be within ±1 um through the marking control system.

[0071] Since the embodiment 1 adopts the mode of simultaneous light emission of L1 and L2 lasers, the mode of simultaneous light emission of L1 and L2 lasers is synchronous light emission slotting. L1 and L2 lasers work synchronously, and according to the preset process parameters of the marking control system, the polyurethane cylinder surface is processed and slotted. The starting and stopping of L1 and L2 lasers are accurately controlled through the marking control system, and the accurate processing of the two lasers is realized.

[0072] In the embodiment, step S1 further includes providing a device for processing a polyurethane cylinder by rotating a plurality of laser beams. The device includes a processing piece, specifically a polyurethane cylinder 1, and mechanical thimbles 2 arranged at both ends of the polyurethane cylinder 1. The device further includes lasers 3, which include L1 and L2 lasers 4 and 5, and the L1 and L2 lasers 4 and 5 are electrically connected through a marking control system. Figure 4 The processing schematic diagram of the polyurethane cylinder by rotating a plurality of laser beams according to the embodiment 1 of the present application is shown in FIG. 1. Figure 5 The processing schematic diagram of the polyurethane cylinder by rotating a plurality of laser beams according to the embodiment 1 of the present application is shown in FIG. 1. Figure 6 The surface structure schematic diagram of the polyurethane cylinder after processing according to the embodiment 1 of the present application is shown in FIG. 3. Figure 6It can be seen that the slot formed by the cylindrical rotation multi-laser beam processing method of embodiment 1 is a V-shaped slot.

[0073] Embodiment 2

[0074] A cylindrical rotation multi-laser beam processing method, comprising the following steps:

[0075] S1. Adjusting the light path of the laser (infrared laser, power 50 kHz), the laser comprising L1 laser and L2 laser, the light paths of L1 laser and L2 laser belonging to the same parallel line (confirmed by using a frequency doubling sheet to observe);

[0076] S2. Forming dots or lines on the surface of the polyurethane cylinder by the light emitted by the laser, observing and taking photos by using a magnifying glass, measuring the distance between the dots or lines formed by the light emitted by L1 laser and L2 laser, if there is a deviation, driving the laser to move up and down and left and right along the Y and X axes of the laser through the marking control system; wherein, mechanical thimbles are arranged at both ends of the polyurethane cylinder;

[0077] S3. Moving the laser along the Y axis of the laser to the focal point position of the polyurethane cylinder, marking and slotting by the light emitted by L1 and L2 lasers, starting to move the laser along the X axis, rotating the polyurethane cylinder at the same time, rotating the polyurethane cylinder by using a motor, the rotation speed of the motor being 10000 mm / s, moving the laser along the X axis by 3 mm, then observing and measuring the line width of the marking and slotting by L1 and L2 lasers by using a microscope, when the line width of the marking and slotting by L1 and L2 lasers is the same as the line width of the rotation of the polyurethane cylinder, completing the adjustment of the light path position of L1 and L2 lasers;

[0078] S4. Adjusting the parameters of the marking control system (the marking speed of the marking control system being 5000 mm / s, the jump speed being 5000 mm / s, the frequency being 1500 kHz, the marking, turning and jump delay being 50 μs, the on and off light delay being 500 μs, the marking times being 50 times), confirming that L1 laser and L2 laser reach the processing slotting position, the light emitted by L1 laser and L2 laser contacting the surface of the polyurethane cylinder, and processing the polyurethane cylinder. Wherein, L1 laser and L2 laser emit light in a staggered manner, L1 laser processes the polyurethane cylinder by using the upper computer operating system, L2 laser processes the polyurethane cylinder by using the upper computer operating system after L1 laser is processed, repeating the above steps to complete the processing of the polyurethane cylinder. Before L1 laser and L2 laser emit light in a staggered manner, the light path and focal point need to be confirmed to be correct.

[0079] Before step S1, further comprising the steps of correcting the marking coordinate system and adjusting the marking range; the correction of the marking coordinate system is to change the X, Y axis coordinate system of the L1 laser and the L2 laser through the marking control system; the adjustment of the marking range is to adjust the correction accuracy of the L1 laser and the L2 laser to be within ±1 um through the marking control system.

[0080] Since the embodiment 2 adopts the light-emitting mode of the L1 laser and the L2 laser being misaligned, the L1 laser and the L2 laser are misaligned in the form of alternating slotting splicing; the two lasers work alternately, the L1 laser completes partial slotting processing, and the L2 laser then completes the remaining processing, and so on, to complete the processing of the entire cylinder; in this way, the load of continuous work of the laser can be reduced to a certain extent, and the processing efficiency and the processing time are ensured.

[0081] In the embodiment, step S1 further comprises providing a device for cylinder rotation multi-path laser beam processing, which comprises a workpiece, specifically a polyurethane cylinder 1, and mechanical thimbles 2 arranged at both ends of the polyurethane cylinder 1; and further comprises a laser 3, wherein the laser 3 comprises an L1 laser 4 and an L2 laser 5, and the L1 laser 4 and the L2 laser 5 are electrically connected to an upper computer operating system through a marking control system. Figure 7 The figure is a processing schematic diagram of the cylinder rotation multi-path laser beam processing method of the embodiment 2 of the present application; Figure 8 The figure is a surface structure schematic diagram of the polyurethane cylinder after the processing of the cylinder rotation multi-path laser beam processing method of the embodiment 2 of the present application. Figure 8 It can be seen that the slotting of the cylinder rotation multi-path laser beam processing method of the embodiment 2 of the present application is in the form of a U-shaped slot.

[0082] Comparative example 1

[0083] The comparative example 1 is a cylinder rotation single-path laser beam processing method, which comprises the following steps:

[0084] 1. The mechanical thimbles are fixed at both sides of the polyurethane cylinder, the upper computer operating system is turned on, the laser is moved along the X axis of the laser to the processing slotting position (3 mm at the left or right side) of the polyurethane cylinder, and the laser is moved along the Y axis of the laser to the preset focal point position;

[0085] 2. The laser power is set to 70% (specifically, an infrared picosecond 100w laser is adopted), the polyurethane cylinder is rotated through a connecting shaft motor, the surface linear speed of the polyurethane cylinder is 5000 mm / s, the parameters of the marking control system are modified in cooperation with the upper computer operating system: the marking speed is 5000 mm / s, the jump speed is 5000 mm / s, the frequency is 1500 khz, the marking, turning and jump delay is 50 us, the on-off light delay is 500 us, and the marking times are 50;

[0086] 3. After the setting of the marking control system is completed, the laser is confirmed to have reached the processing slot position and the preset focus position in the X and Y axis directions through the host computer operating system, the connecting shaft motor is started to make the cylinder rotate, the laser emits light to mark, and the polyurethane cylinder is processed.

[0087] This scheme is the simplest scheme, only using laser focusing spot slotting, without changing the laser light path, this slotting scheme can process various groove types. However, this scheme has the following disadvantages: low processing efficiency.

[0088] The above is only a specific embodiment of the present application, but the protection scope of the present application is not limited thereto, any person skilled in the art can easily think of various equivalent modifications or replacements within the technical range disclosed by the present application, and these modifications or replacements should be covered within the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A cylindrical rotating multi-pass laser beam machining method, characterized by, It comprises the following steps: S1. Adjust the optical path of the laser, which comprises L1 laser and L2 laser, the optical path of L1 laser and L2 laser is parallel to each other; S2. Dot or line on the surface of the polyurethane cylinder by laser light, observe and take pictures using a magnifying glass, measure the distance between the dot or line of L1 laser and L2 laser light, if there is deviation, drive the laser to move up and down and left and right along the Y and X axes of the laser through the marking control system; S3. Move the laser along the Y axis of the laser to the focal point of the polyurethane cylinder, L1 and L2 laser light marking slot, the laser starts to move along the X axis, the polyurethane cylinder rotates at the same time, the laser moves 3-5mm along the X axis, then observe and measure the line width of L1 and L2 laser marking slot using a microscope, when the line width of L1 and L2 laser marking slot is the same as the line width of the polyurethane cylinder rotation, the adjustment of the position of L1 and L2 laser optical path is completed; S4. Adjust the parameters of the marking control system, confirm that L1 laser and L2 laser reach the processing slot, L1 laser and L2 laser light contact the surface of the polyurethane cylinder, and process the polyurethane cylinder; The marking speed of the marking control system is 5000mm / s, the jump speed is 5000mm / s, the frequency is 1500khz, the marking, turning and jump delay is 50μs, the on and off light delay is 500μs, and the marking times is 50 times.

2. The cylindrical rotating multipath laser beam machining method according to claim 1, wherein, In step S1, the laser is one of ultraviolet laser, green laser, infrared laser and CO2 laser.

3. The cylindrical rotating multipath laser beam machining method according to claim 1, wherein, Before step S1, it further comprises the step of correcting the marking coordinate system, which is to change the X and Y axis coordinate system of L1 laser and L2 laser through the marking control system.

4. The cylindrical rotating multipath laser beam machining method according to claim 1, wherein, Before step S1, it further comprises the step of adjusting the marking area, which is to adjust the correction accuracy of L1 laser and L2 laser to within ±1um through the marking control system.

5. The cylindrical rotating multipath laser beam machining method according to claim 1, wherein, In step S2, the polyurethane cylinder is provided with mechanical thimbles at both ends.

6. The cylindrical rotating multipath laser beam machining method according to claim 1, wherein, In step S3, the polyurethane cylinder is rotated by a motor, and the motor rotation speed is 100-20000mm / s.

7. The cylindrical rotating multipath laser beam machining method according to claim 1, wherein In step S4, L1 laser and L2 laser emit light at the same time and contact the surface of the polyurethane cylinder at the same time.

8. The cylindrical rotating multipath laser beam machining method according to claim 1, wherein, In step S4, L1 laser and L2 laser emit light in staggered positions, L1 laser processes the polyurethane cylinder through the host computer operating system, L2 laser processes the polyurethane cylinder after L1 laser processing, and the above steps are repeated to complete the processing of the polyurethane cylinder.

Images