Probe Device, Testing Device and Testing Method for Batch Testing of Components

Abstract

The present invention relates to the technical field of electronic component testing, in particular to a probe device, a testing device and a testing method for batch testing of components. Among them, the probe device includes a PCB circuit board and a plurality of metal probes. A plurality of testing units are arranged on the PCB circuit board in a matrix array distribution. One end of each metal probe is connected to the testing unit, and the other end is connected to the component to be tested. Among them, the testing unit includes an LED driving unit, a fuse and a DC power supply. The output end of the LED driving unit is connected to the component to be tested through the metal probe, and its input end is connected to the output end of the DC power supply through the fuse. The present invention can simultaneously batch detect the electronic components to be tested and improve the testing efficiency.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic component testing, and particularly to a probe device, a testing device and a testing method for batch testing of components. Background Art

[0002] Wafer-level component testing is a key step in the semiconductor manufacturing process. After the wafer is processed, a highly integrated probe device is used to accurately inject the electrical signals of a precision tester onto the electrodes of each component on the wafer surface to activate the components to the powered-on working state. Subsequently, the tester accurately captures and analyzes key electrical performance parameters such as current and voltage generated by the components in the working state, and compares and analyzes them with the preset judgment criteria based on strict process specifications. This process aims to accurately distinguish the qualified components with performance indicators meeting the standards from the unqualified ones.

[0003] The efficient execution of this testing process depends on the close cooperation between the tester and the Probe machine. The test probe card is the link between the tester and the Probe machine. The tester is responsible for sending electrical signals to the metal electrodes of the components on the wafer under test through the test probe card, receiving the electrical signals of the components through the test probe card, judging the electrical signals and storing data.

[0004] As the physical basis of the testing platform, the Probe machine needs to maintain a real-time and stable communication connection with the tester to accurately control the wafer position and firmly support the test probe card. The overall efficiency of wafer testing is directly restricted by the parallel testing ability of the test probe card (i.e., the number of components that can be measured simultaneously) and the index speed of the Probe machine. The parallel testing ability of the test probe card is restricted by the number of signal channels provided by the tester, and these channels directly determine the maximum number of components that can be tested simultaneously.

[0005] Taking a wafer containing 50,000 components as an example, if the tester can only monitor the current and other parameters of 32 components simultaneously in a single operation, then about 1500 or more incremental testing and judgment processes will be required to complete the full-wafer testing. To improve the testing efficiency, traditional methods tend to expand the number of signal channels by increasing the number of resource boards in the tester, which poses a challenge to cost control. The disadvantages of the existing wafer-level component testing technology are summarized as follows:

[0006] First, low testing efficiency: Since the number of components that can be monitored simultaneously by the tester in a single operation is limited (such as 32 in the above example), for wafers with a large number of components, a large number of iterative testing and judgment processes are required, resulting in low overall testing efficiency and increasing the production cycle and cost.

[0007] Second, low resource utilization rate: During the testing process, some signal channels of the testing machine may be idle during certain time periods, failing to fully utilize all available resources, which further reduces the testing efficiency.

[0008] Third, high equipment investment and operating costs: To improve the testing efficiency, traditional methods rely on increasing the number of resource boards inside the testing machine to expand the number of signal channels. However, this approach not only increases the initial investment cost of the equipment but may also lead to an increase in subsequent operating costs, including expenses for maintenance, upgrades, and component replacements. Summary of the Invention

[0009] For this reason, the technical problem to be solved by the present invention is to overcome the problems in the prior art that the testing device is complicated by increasing the number of resource boards inside the testing machine to expand the number of signal channels, and the excessive number of iterations in the determination process results in low testing efficiency. The present invention provides a probe device, a testing device, and a testing method for batch testing of components. The probe device includes:

[0010] A PCB circuit board, on which a plurality of testing units are arranged in a matrix array;

[0011] And a plurality of metal probes, one end of each metal probe is connected to the testing unit, and the other end is connected to the component to be tested;

[0012] Wherein, the testing unit includes an LED driving unit, a fuse, and a DC power supply. The output end of the LED driving unit is connected to the component to be tested through the metal probe, and its input end is connected to the output end of the DC power supply through the fuse.

[0013] In an embodiment of the present invention, the LED driving unit includes a first switch, a first branch, a second branch, and a light-emitting diode. The light-emitting diode is arranged on the first branch. The second branch is connected to the component to be tested. The first switch is respectively connected to the first branch and the second branch for controlling the on-off of the loop between the first branch and the DC power supply.

[0014] In an embodiment of the present invention, the first switch is a PMOS transistor Q1, and the S pole of the PMOS transistor Q1 is connected to the output interface of the DC power supply;

[0015] A first resistor R1 is further arranged on the first branch. The D pole of the PMOS transistor Q1 is connected to the first end of the first resistor R1. The second end of the first resistor R1 is connected to the positive pole of the light-emitting diode. The negative pole of the light-emitting diode is connected to the GND port of the DC power supply;

[0016] A second resistor R2 is provided on the second branch. The G pole of the PMOS transistor Q1 is connected to the first end of the second resistor R2. The second end of the second resistor R2 is connected to the first end of the device under test. The second end of the device under test is connected to the GND port of the DC power supply.

[0017] In an embodiment of the present invention, the LED driving unit further includes a voltage-dividing resistor R3. The S pole of the PMOS transistor Q1 and the first end of the voltage-dividing resistor R3 are both connected to the output interface of the DC power supply. Two branches are led out from the second end of the voltage-dividing resistor R3 and are respectively connected to the G pole of the PMOS transistor Q1 and the first end of the second resistor R2.

[0018] In an embodiment of the present invention, the second end of the second resistor R2 is connected to the metal probe.

[0019] In an embodiment of the present invention, the multiple test units are all connected in parallel, and the multiple metal probes are all connected in parallel.

[0020] In an embodiment of the present invention, the probe device further includes a probe card holder. The probe card holder is installed on the PCB circuit board, and the number can be configured as single or multiple;

[0021] When the number of the probe card holders is single, multiple mounting holes are provided on the probe card holder. The position distribution of the multiple mounting holes matches the overall matrix array distribution of the test units. The metal probe is arranged in the mounting hole and connected to the test unit;

[0022] When the number of the probe card holders is multiple, each probe card holder is only provided with one mounting hole. The probe card holders are increased or decreased according to the number of the test units. The multiple metal probes are successively installed in the mounting holes and connected to the test units.

[0023] The present invention also provides a device for batch testing components, including the probe device for batch testing components and a signal transceiver described above. The signal transmitting end of the signal transceiver is connected to the PCB circuit board, and the signal receiving end of the signal transceiver is connected to the metal probe; wherein, the signal transmitting end of the signal transceiver sends a test signal to the PCB circuit board, the test signal is transmitted by the PCB circuit board to the metal probe, and the metal probe transmits the test signal to the device under test; the signal receiving end of the signal transceiver forms a current signal loop through the metal probe.

[0024] Based on the same inventive concept, the present invention also provides a method for batch testing components. Using the device for batch testing components to conduct quality compliance testing on the device under test, the method includes the following steps:

[0025] S1: Obtain a first test result based on the light emission condition of the light-emitting diodes in the test unit;

[0026] S2: Based on the first test result, construct a data mapping table, where each cell in the data mapping table is used to store the position data and test result of the device under test.

[0027] In an embodiment of the present invention, in S1, the method for obtaining the first test result is as follows:

[0028] Obtain the current value of the current signal loop, and judge the magnitude relationship between the current value and a preset threshold: if the current value is greater than the preset threshold, the device under test is marked as a defective product, and its corresponding light-emitting diode is lit; otherwise, the device under test is marked as a qualified product, and its corresponding light-emitting diode is turned off;

[0029] Obtain the light emission results of the light-emitting diodes in all test units, and obtain the test results of the devices under test connected thereto according to the light emission results, that is, the first test result.

[0030] The above technical solution of the present invention has the following advantages compared with the prior art:

[0031] 1. Improved test efficiency: The LED matrix parallel test circuit truly realizes the simultaneous test of multiple devices under test, and the devices under test are independent of each other. Quick judgment can be completed through optical recognition.

[0032] 2. Reduced test cost: While improving the test efficiency, there is no need to additionally increase the number of test machine resource boards. The unit test time and the test cost per single product are greatly reduced.

[0033] 3. Breakthrough of the resource quantity bottleneck of the test machine: Increasing the number of devices under test measured simultaneously no longer depends on the resource quantity of the test machine. The test machine only needs to provide a DC power supply, and the number of devices tested simultaneously can be increased through the design of the pin card. Description of the Drawings

[0034] In order to make the content of the present invention easier to be clearly understood, the following further details the present invention according to the specific embodiments of the present invention in conjunction with the drawings, where

[0035] Figure 1 is a schematic structural diagram of a probe device for batch testing of components provided in the embodiment of the present invention;

[0036] Figure 2 is Figure 1 the circuit schematic diagram of the test unit in

[0037] Figure 3It is a schematic structural diagram of a component batch testing device provided in an embodiment of the present invention;

[0038] Figure 4 It is a schematic flow diagram of a component batch testing method provided in an embodiment of the present invention;

[0039] Explanation of the reference numerals in the specification drawings: 1, PCB circuit board; 11, test unit; 111, LED driving unit; 112, fuse; 113, DC power supply; 2, metal probe; 3, probe socket; 31, mounting hole. Detailed implementation manners

[0040] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments, so that those skilled in the art can better understand the present invention and be able to implement it, but the specific embodiments cited are not intended to limit the present invention.

[0041] Embodiment 1

[0042] Referring to Figure 1 As shown, the present invention provides a probe device for component batch testing, including:

[0043] A PCB circuit board 1, on which a plurality of test units 11 are arranged in a matrix array;

[0044] And a plurality of metal probes 2, one end of each metal probe 2 is connected to the test unit 11, and the other end is connected to the component under test C1;

[0045] Wherein, the test unit 11 includes an LED driving unit 111, a fuse 112 and a DC power supply 113. The output end of the LED driving unit 111 is connected to the component under test C1 through the metal probe 2, and its input end is connected to the output end of the DC power supply 113 through the fuse 112. The fuse 112 melts itself to cut off the current when the current abnormally rises to a certain height and a certain heat, thereby playing a role in protecting the safe operation of the circuit.

[0046] From the above technical solutions, the probe device realizes efficient batch testing of components through a plurality of test units arranged in a matrix array on the PCB circuit board and using a plurality of metal probes to connect the components under test at the same time. This method greatly improves the testing efficiency and reduces the labor cost.

[0047] In this embodiment, since multiple test units 11 are distributed in a matrix array on the PCB board 1, similarly, the LED driving units 111 are arranged in a matrix distribution on the PCB board 1, mainly playing the following roles: (1) As an important part of the test circuit; (2) Provide a determination signal for whether the wafer-level capacitor product under test is qualified. Through the on / off changes of the LED matrix, the test results of each test point can be intuitively displayed, providing technical guidance for subsequent selection of yield or rejection of defective products.

[0048] Specifically, the LED driving unit 111 includes a first switch, a first branch, a second branch, and a light-emitting diode. The light-emitting diode is arranged on the first branch. The second branch is connected to the device under test C1. The first switch is respectively connected to the first branch and the second branch, and is used to control the on / off of the circuit between the first branch and the DC power supply 113.

[0049] Among them, the device under test C1 includes, but is not limited to, electronic devices such as resistors, capacitors, and inductors. As long as the electronic device has a vertical structure of an upper electrode and a lower electrode, it belongs to the category of the device under test C1.

[0050] As Figure 2 shown, if the device under test C1 is a wafer-level capacitor device, and if it is necessary to test whether its leakage current parameter at 100V voltage meets the product specifications. The multiple test units 11 are distributed in an n×n matrix array, so that (n×n) devices under test capacitors can be tested simultaneously at one time. Here, the value of n can be set according to the number of devices under test to be measured simultaneously.

[0051] The first switch is a PMOS transistor Q1, and its working principle is mainly based on the control effect of the gate-source voltage V GS . By changing the gate voltage, the conductive channel between the source (S pole) and the drain (D pole) is adjusted, thereby controlling the on / off of the current. The S pole of the PMOS transistor Q1 is connected to the output interface of the DC power supply 113.

[0052] A first resistor R1 is also arranged on the first branch. The D pole of the PMOS transistor Q1 is connected to the first end of the first resistor R1. The second end of the first resistor R1 is connected to the positive electrode of the light-emitting diode. The negative electrode of the light-emitting diode is connected to the GND port of the DC power supply 113;

[0053] A second resistor R2 is arranged on the second branch. The G pole of the PMOS transistor Q1 is connected to the first end of the second resistor R2. The second end of the second resistor R2 is connected to the first end of the device under test C1. The second end of the device under test C1 is connected to the GND port of the DC power supply 113.

[0054] In this embodiment, the LED driving unit 111 further includes a voltage dividing resistor R3. The S pole of the PMOS transistor Q1 and the first end of the voltage dividing resistor R3 are both connected to the output interface of the DC power supply 113. Two branches are led out from the second end of the voltage dividing resistor R3 and are respectively connected to the G pole of the PMOS transistor Q1 and the first end of the second resistor R2.

[0055] The first resistor R1, the second resistor R2 and the voltage dividing resistor R3 mainly play the roles of voltage division and circuit protection in the test circuit. The second resistor R2 plays a role in protecting the PMOS transistor Q1. When the device under test C1 breaks down, the voltage division effect of the second resistor R2 makes the V of the PMOS transistor Q1 GS within the safe operating range of the device.

[0056] Assume that the resistance value of the first resistor R1 is 150 KΩ, the resistance value of the second resistor R2 is 1 MΩ, and R3 = 4860 Ω. When the device under test C1 is determined to be a defective product, that is, its leakage current is greater than 10 μA, the voltage dividing resistor R3 bears a voltage of 1.5 V. At this time, there is a negative voltage difference V of 1.5 V between the G pole and the S pole of the PMOS transistor Q1 GS , and the negative voltage difference exceeds the conduction threshold voltage. The PMOS transistor Q1 is in the conduction state, and a P-type inversion layer, that is, a hole enrichment region, will be formed on the surface of the N-type silicon substrate under the G pole. This hole enrichment region connects the S pole and the D pole to form a current channel. At this time, the current flows from the S pole to the D pole, and the light-emitting diode LED is lit. During the process of the light-emitting diode LED being lit, the first resistor R1 plays a role in preventing excessive current from passing through the light-emitting diode LED and causing damage. Its resistance value can be calculated by the following formula:

[0057]

[0058] where V supply represents the supply voltage, V F represents the forward voltage drop of the light-emitting diode LED, and I F represents the normal operating current of the light-emitting diode LED.

[0059] When the device under test C1 is determined to be a qualified product, that is, its leakage current does not exceed 10 μA, there is a negative voltage difference V of 1.5 V between the G pole and the S pole of the PMOS transistor Q1 GS does not exceed the conduction threshold voltage. The PMOS transistor Q1 is in the cut-off state, and no current passes through the first branch where the light-emitting diode LED is located. Therefore, the light-emitting diode LED is not lit.

[0060] In this embodiment, the second end of the second resistor R2 is connected to the metal probe 2, and the device under test C1 is connected through the metal probe 2.

[0061] Furthermore, the probe device further includes a probe socket 3, which is installed on the PCB circuit board 1, and the number thereof can be configured as single or multiple.

[0062] When the number of the probe sockets 3 is single, a plurality of mounting holes 31 are provided on the probe socket 3, and the position distribution of the plurality of mounting holes 31 should match the overall matrix array distribution of the test units 11, and the metal probes 2 are arranged in the mounting holes 31 and connected to the test units 11.

[0063] When the number of the probe sockets 3 is multiple, each probe socket 3 is only provided with one mounting hole 31. Therefore, the number of the probe sockets 3 can be increased or decreased according to the number of the test units 11, without considering the overall matrix array distribution of the test units 11. The plurality of metal probes 2 are successively arranged in the mounting holes 31 and connected to the test units 11 to ensure that each metal probe 2 can be independently connected to the corresponding test unit 11.

[0064] Furthermore, positioning pins and screw holes are provided on the probe socket 3. The positioning pins are inserted into the corresponding positioning holes on the PCB circuit board 1, and screws, nuts, etc. are used to lock the probe socket 3 and the PCB circuit board 1. The probe socket 3 also functions to fix the metal probes 2, so that during the test, one end of the metal probe 2 contacts the metal contact points on the PCB circuit board 1, and the other end of the metal probe 2 contacts the component electrodes on the wafer to be tested.

[0065] Furthermore, the plurality of test units 11 and the plurality of metal probes 2 are both connected in parallel, and the designs of the test units 11 and the probe sockets 3 are relatively independent, which is convenient for maintenance and replacement during the test process, reducing the maintenance cost and time. In addition, the test needles used for the metal probes 2 are not limited to probe types such as spring needles and non-elastic needles.

[0066] Embodiment 2

[0067] The present invention also provides a device for batch testing components, as Figure 3 shown. The testing device includes the probe device for batch testing components described in Embodiment 1 and a signal transceiver. The signal transmitting end of the signal transceiver is connected to the PCB circuit board 1, and the signal receiving end of the signal transceiver is connected to the metal probe 2. Among them, the specific structure of the probe device for batch testing components has been introduced in detail in Embodiment 1 and will not be elaborated here.

[0068] The signal transmitting end of the signal transceiver sends a test signal to the PCB circuit board 1, and the test signal is transmitted by the PCB circuit board 1 to the metal probe 2, and the metal probe 2 transmits the test signal to the device under test C1; the signal receiving end of the signal transceiver forms a current signal loop through the metal probe 2 or other channels of the test platform.

[0069] The device for batch testing of components combines a signal transceiver to achieve automatic sending and receiving of test signals, as well as automatic recording and mapping of test results. This intelligent testing process reduces errors caused by manual operation and improves the accuracy and reliability of testing.

[0070] Embodiment III

[0071] The present invention also provides a method for batch testing of components, using the device for batch testing of components described in Embodiment II to perform quality compliance testing on the device under test. As Figure 4 shown, the testing method includes the following steps:

[0072] S1: Based on the lighting condition of the light-emitting diode LED in the testing unit 11, obtain a first test result;

[0073] S2: Based on the first test result, construct a data mapping table mapping, and each cell in the data mapping table mapping is used to store the position data and test result of the device under test C1.

[0074] In summary, the method for batch testing of components visually displays the test results of the device under test through the lighting and extinguishing of the light-emitting diode LED. This method makes the test results clear at a glance, facilitating the quick identification and positioning of defective products; by constructing a data mapping table mapping to record the position data and test results of each device under test, centralized management and quick query of test data are realized, and this data management method facilitates subsequent data analysis and quality traceability.

[0075] Further, in step S1 of this embodiment, the method for obtaining the first test result is as follows:

[0076] The signal transmitting end of the signal transceiver sends a test signal to the PCB circuit board 1, and the test signal is transmitted by the PCB circuit board 1 to the metal probe 2, and the metal probe 2 transmits the test signal to the device under test C1;

[0077] The signal receiving end of the signal transceiver forms a current signal loop through the metal probe 2 or other channels of the test platform;

[0078] Obtain the current value of the current signal loop, and judge the magnitude relationship between the current value and a preset threshold value (10 μA): If the current value is greater than 10 μA, at this time, the negative voltage difference V between the G pole and the S pole of the PMOS transistor Q1 in the LED driving unit 111 GS exceeds the conduction threshold voltage, and the PMOS transistor Q1 is in the conduction state, and the current flows from the S pole to the D pole, so that the light-emitting diode LED is lit, and at the same time, the device under test C1 is marked as a defective product; otherwise, the negative voltage difference V between the G pole and the S pole of the PMOS transistor Q1 GS does not exceed the conduction threshold voltage, the PMOS transistor Q1 is in the cut-off state, so no current flows from the S pole to the D pole, the light-emitting diode LED is turned off, and at the same time, the device under test C1 is marked as a qualified product;

[0079] Use a camera to take pictures and record the lighting results of all the light-emitting diodes LED in the test unit 11, and obtain the test results of the device under test C1 connected correspondingly according to the lighting results, that is, the first test result.

[0080] Obviously, the above embodiments are only examples for clear illustration and are not limitations on the implementation manners. For those of ordinary skill in the art, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to enumerate all the implementation manners here. And the obvious changes or modifications derived therefrom are still within the protection scope of the present invention.

Claims

1. A batch testing device for components, characterized in that, Including: A probe device and a signal transceiver for batch testing of components. The probe device for batch testing of components includes a PCB circuit board and a plurality of metal probes. A plurality of test units are arranged in a matrix array on the PCB circuit board; one end of each metal probe is connected to the test unit, and the other end is connected to the component to be tested; Wherein, the test unit includes an LED driving unit, a fuse, and a DC power supply. The output end of the LED driving unit is connected to the component to be tested through the metal probe, and its input end is connected to the output end of the DC power supply through the fuse; The LED driving unit includes a first switch, a first branch, a second branch, and a light-emitting diode. The light-emitting diode is arranged on the first branch. The second branch is connected to the component to be tested. The first switch is respectively connected to the first branch and the second branch for controlling the on-off of the loop between the first branch and the DC power supply; The first switch is a PMOS transistor Q1. The S pole of the PMOS transistor Q1 is connected to the output interface of the DC power supply; A first resistor R1 is also arranged on the first branch. The D pole of the PMOS transistor Q1 is connected to the first end of the first resistor R1. The second end of the first resistor R1 is connected to the positive pole of the light-emitting diode. The negative pole of the light-emitting diode is connected to the GND port of the DC power supply; A second resistor R2 is arranged on the second branch. The G pole of the PMOS transistor Q1 is connected to the first end of the second resistor R2. The second end of the second resistor R2 is connected to the first end of the component to be tested. The second end of the component to be tested is connected to the GND port of the DC power supply; The LED driving unit also includes a voltage-dividing resistor R3. The S pole of the PMOS transistor Q1 and the first end of the voltage-dividing resistor R3 are both connected to the output interface of the DC power supply. The second end of the voltage-dividing resistor R3 leads out two branches, which are respectively connected to the G pole of the PMOS transistor Q1 and the first end of the second resistor R2; The signal transmitting end of the signal transceiver is connected to the PCB circuit board, and the signal receiving end of the signal transceiver is connected to the metal probe; Wherein, the signal transmitting end of the signal transceiver sends a test signal to the PCB circuit board. The test signal is transmitted by the PCB circuit board to the metal probe, and the metal probe transmits the test signal to the component to be tested; The signal receiving end of the signal transceiver forms a current signal loop through the metal probe.

2. The component batch testing device according to claim 1, wherein: The second end of the second resistor R2 is connected to the metal probe.

3. The component batch testing device according to claim 1, wherein: All the plurality of test units are connected in parallel, and all the plurality of metal probes are connected in parallel.

4. The component batch testing device according to claim 1, characterized in that: The probe device further includes a probe socket, which is installed on the PCB circuit board, and the number can be configured as single or multiple; When the number of the probe sockets is single, the probe socket is provided with a plurality of mounting holes. The position distribution of the plurality of mounting holes matches the overall matrix array distribution of the test units. The metal probes are arranged in the mounting holes and connected to the test units; When the number of the probe holders is multiple, each probe holder is only provided with one mounting hole. The probe holders are increased or decreased according to the number of the test units, and the multiple metal probes are sequentially mounted in the mounting holes to connect the test units.

5. A method for batch testing of components, which uses the component batch testing device according to any one of claims 1 to 4 to perform quality compliance testing on the components to be tested, characterized in that, The method comprises the following steps: S1: Obtain a first test result based on the light-emitting condition of the light-emitting diodes in the test units; S2: Construct a data mapping table based on the first test result. Each cell in the data mapping table is used to store the position data and the test result of the device under test.

6. The method for batch testing of components according to claim 5, wherein: In S1, the method for obtaining the first test result is as follows: Obtain the current value of the current signal loop, and judge the magnitude relationship between the current value and a preset threshold: if the current value is greater than the preset threshold, the device under test is marked as a defective product, and the corresponding light-emitting diode is lit; otherwise, the device under test is marked as a qualified product, and the corresponding light-emitting diode is turned off; Obtain the light-emitting results of the light-emitting diodes in all the test units, and obtain the test result of the device under test connected thereto according to the light-emitting results, i.e., the first test result.

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