Display modules and display devices

Abstract

This application provides a display module and a display device. The display module includes: a flexible circuit board, which includes a first pin and a first positioning portion, the first positioning portion and the first pin being located on the same side; a flip-chip film, which includes a second pin and a second positioning portion, the second positioning portion and the second pin being located on the same side, and the second positioning portion and the second pin being located on the side opposite to the flexible circuit board; the second positioning portion and the first positioning portion cooperate to fix the bonding position of the flip-chip film and the flexible circuit board, and the second pin and the first pin are electrically connected. This application, through mechanical positioning, can reliably position the flip-chip film and the flexible circuit board, avoiding misalignment during the bonding process, thus ensuring reliable bonding and electrical connection between the flip-chip film and the flexible circuit board.

Description

Technical Field

[0001] This invention generally relates to the field of display technology, and more specifically to a display module and a display device. Background Technology

[0002] In the manufacturing process of display devices, the chip-on-film (COF) bonding process is a crucial step in the production of display modules. Based on the current integrated FPC (flexible printed circuit board) design, the COF bonding process typically involves first bonding the COF to the panel, then bonding the TFOG (Terminal For Flexible On Glass) of the integrated FPC to the panel to further integrate the FPC and the panel, forming a more complete electrical connection system. Finally, the COF is bonded to the FOF (Flexible On Flexible) of the integrated FPC to achieve the electrical connection between the COF and the FPC.

[0003] However, due to the issues with integrated FPC, the connection between the FPC and COF requires manual alignment using a semi-automatic machine. Since the COF process cannot be perforated, the alignment between the COF and FPC can only be done manually by visual inspection. This manual alignment is not only inaccurate, but also fails to produce pre-curing of ACF (anisotropic conductive adhesive layer) during operator pressing, resulting in low adhesion between the aligned FPC and COF. When the pressure head is pressed down, secondary misalignment occurs, leading to misalignment of the COF and FPC bond and resulting in defective products. Summary of the Invention

[0004] In view of the above-mentioned defects or deficiencies in the prior art, it is desirable to provide a display module and display device that can reliably position the flip-chip film and the flexible circuit board through mechanical positioning, avoid misalignment during the bonding process of the flip-chip film and the flexible circuit board, and enable reliable bonding of the flip-chip film and the flexible circuit board to achieve electrical connection.

[0005] In a first aspect, the present invention provides a display module, comprising:

[0006] A flexible circuit board, comprising a first pin and a first positioning portion, wherein the first positioning portion and the first pin are located on the same side;

[0007] A flip-chip film, comprising a second pin and a second positioning portion, wherein the second positioning portion and the second pin are located on the same side, and the second positioning portion and the second pin are located on the side of the flip-chip film opposite to the flexible circuit board;

[0008] The second positioning part cooperates with the first positioning part to fix the bonding position of the flip-chip film and the flexible circuit, and the second pin and the first pin are electrically connected.

[0009] As an optional solution, the flexible circuit board includes a first substrate, a first positioning part and a first pin disposed on the first substrate; the flip-chip film includes a second substrate, a second positioning part and a second pin disposed on the second substrate.

[0010] As an optional solution, the first positioning part includes a groove formed from the surface of the first substrate toward the opposite side of the flip-chip film, and the second positioning part includes a boss formed from the second substrate toward the flexible circuit board. The groove and the boss are in a concave-convex fit, and the bonding position between the flip-chip film and the flexible circuit board is fixed.

[0011] As an optional solution, the thickness of the boss is greater than or equal to the sum of the thicknesses of the first pin and the second pin, and less than the sum of the thicknesses of the first pin, the second pin, and the first substrate;

[0012] The groove has a depth greater than 0 and does not penetrate the first substrate.

[0013] As an optional solution, the thickness of the first pin is the same as the thickness of the second pin.

[0014] The thickness of the first substrate is greater than the thickness of the first pin, the thickness of the boss is greater than or equal to twice the thickness of the second pin and less than three times the thickness of the second pin, and correspondingly, the groove depth is greater than 0 and less than or equal to the thickness of the first pin.

[0015] As an alternative, the boss is formed by coating a conductive material onto the surface of the second substrate, and the conductive material is made of the same material as the second pin.

[0016] Preferably, the conductive material includes copper.

[0017] As an alternative, the groove is located in the edge region of the first substrate, and the groove has an opening in the bonding direction of the first pin and the second pin; correspondingly, the boss is located on one side of the second pin and in the region close to the edge of the first substrate.

[0018] As an optional solution, a first alignment pin is also provided on the first substrate, and a second alignment pin is also provided on the second substrate, the position of the second alignment pin corresponding to the position of the first alignment pin;

[0019] The first alignment pin and the second alignment pin each include a first region and a second region extending along two different directions, wherein the extension direction of the first region or the extension direction of the second region is the same as the bonding direction of the first pin and the second pin.

[0020] The first alignment pin is recessed in the direction away from the flip-chip film to form a groove;

[0021] The second alignment pin protrudes towards the flexible circuit board to form a boss.

[0022] As an optional solution, the first positioning part includes a first positioning ear and a first positioning hole formed on the first positioning ear. The first positioning ear is located on at least one side of the first base along the first direction, and the first positioning ear extends from the edge of the first base in a direction away from the first base.

[0023] The second positioning part includes a second positioning ear and a second positioning hole formed on the second positioning ear. The second positioning ear is located on at least one side of the second base along the first direction. The second positioning ear extends from the edge of the second base in a direction away from the second base. The first direction is perpendicular to the bonding direction of the first pin and the second pin.

[0024] In the direction perpendicular to the surface of the flip-chip film, the orthographic projections of the first positioning hole and the second positioning hole completely overlap.

[0025] As an alternative, the orthographic projections of the first positioning ear and the second positioning ear completely overlap in a direction perpendicular to the surface of the flip-chip film.

[0026] In a second aspect, the present invention provides a display device, including the display module of the first aspect.

[0027] The display module of the present invention, by setting a first positioning part on a flexible circuit board and a second positioning part on a flip-chip film, with the first and second positioning parts cooperating, allows the operator to fix the bonding position of the flip-chip film and the flexible circuit board by cooperating the first and second positioning parts during the bonding process of the flexible circuit board and the flip-chip film, without the need for manual alignment, and without causing misalignment between the flip-chip film and the flexible circuit board. This helps to avoid misalignment between the second pin of the flip-chip film and the first pin of the flexible circuit board, ensuring that the second pin of the flip-chip film and the first pin of the flexible circuit board have sufficient contact surface, thereby ensuring reliable electrical connection between the second pin of the flip-chip film and the first pin of the flexible circuit board, and improving the product yield of the display device. Attached Figure Description

[0028] Other features, objectives, and advantages of this application will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings:

[0029] Figure 1 This is a schematic diagram of the display module structure of this application;

[0030] Figure 2 This is a front structural diagram of the bonding position between a flip-chip film and a flexible circuit board in the display module of this application;

[0031] Figure 3 This is a front structural diagram of another bonding position between the flip-chip film and the flexible circuit board in the display module of this application;

[0032] Figure 4 for Figure 2 A schematic diagram of the cross-sectional structure;

[0033] Figure 5 for Figure 3 A schematic diagram of the cross-sectional structure;

[0034] Figure 6 This is a front structural diagram of another bonding position between a flip-chip film and a flexible circuit board in the display module of this application.

[0035] In the picture,

[0036] 100. Display module;

[0037] 10. Flexible circuit board; 11. First substrate; 12. First pin; 13. Conductive layer; 14. Protective layer; 15. Groove; 16. First alignment pin.

[0038] 20. Flip film 20; 21. Second substrate; 22. Second pin; 23. Boss; 24. Second alignment pin; 25. Second positioning ear; 26. Second positioning hole.

[0039] 30. Panel. Detailed Implementation

[0040] The present application will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, only the parts relevant to the invention are shown in the accompanying drawings.

[0041] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. This application will now be described in detail with reference to the accompanying drawings and embodiments.

[0042] Embodiments of this application provide a display module 100, such as Figure 1-6 As shown, it includes:

[0043] The flexible circuit board 10 includes a first pin 12 and a first positioning part, the first positioning part and the first pin 12 are located on the same side;

[0044] The flip-chip film 20 includes a second pin 22 and a second positioning part. The second positioning part and the second pin 22 are located on the same side, and the second positioning part and the second pin 22 are located on the side of the flip-chip film 20 opposite to the flexible circuit board 10.

[0045] The second positioning part cooperates with the first positioning part to fix the bonding position of the flip-chip film 20 and the flexible circuit, and the second pin 22 and the first pin 12 are electrically connected.

[0046] It should be noted that the flexible printed circuit board (FPC) 10 is mainly used as a bridge to connect the display panel 30 with the driver motherboard or other components, ensuring the normal display and function realization of the display panel 30.

[0047] COF bonding technology refers to integrating the IC chip onto the FPC and then bending it under the display panel 30. This integrates the screen's IC chip onto a flexible PCB board and bends it under the screen, which helps to achieve a narrow bezel on the display panel 30, thereby increasing the screen-to-body ratio and improving the user experience of the display panel 30.

[0048] Based on the integrated FPC in related technologies, in the COF bonding process, the COF is usually first bonded to the panel, and then the TFOG (Terminal For Flexible On Glass) position of the integrated FPC is bonded to the panel to further integrate the FPC and the panel to form a more complete electrical connection system. Finally, the COF is bonded to the FOF (Flexible On Flexible) position of the integrated FPC to achieve the electrical connection between the COF and the FPC.

[0049] It is understood that in the embodiments of this application, the first pin 12 and the second pin 22 are mainly used to realize the electrical connection between the flip-chip film 20 and the flexible circuit board 10. The first pin 12 and the second pin 22 are usually made of conductive copper. The first pin 12 is used to realize the signal transmission between the flexible circuit board 10 and the flip-chip film 20, and the second pin 22 is used to transmit the signal of the chip on the flip-chip film 20 to the flexible circuit board 10, thereby ensuring that the entire display module can reliably realize the display function.

[0050] The first positioning part and the second positioning part cooperate with each other to fix the bonding position of the flip-chip film 20 and the flexible circuit board 10. This ensures that after the second pin 22 of the flip-chip film 20 is inserted into the first pin 12 of the flexible circuit board 10, the second pin 22 of the flip-chip film 20 or the first pin 12 of the flexible circuit board 10 will not move or deviate in other directions. This ensures that the first pin 12 and the second pin 22 have sufficient contact area, thereby achieving a reliable electrical connection between the flip-chip film 20 and the flexible circuit board 10.

[0051] It is also understood that the first positioning part and the second positioning part can adopt any kind of matching method, such as, but not limited to, concave-convex matching, snap-fit ​​and latching matching, etc. For example, one of the first positioning part and the second positioning part can be a groove and the other can be a protrusion. The protrusion and the groove match, and the bonding position of the flip-chip film 20 and the flexible circuit board 10 is fixed. As another example, one of the first positioning part and the second positioning part can be snap-fit ​​(for example, the snap-fit ​​can be a hanging ear provided on the edge of the flip-chip film 20 or the flexible circuit board 10), and the other is a latching position (correspondingly, the latching position can be the side wall edge of the flip-chip film 20 or the flexible circuit board 10). The hanging ear is hung on the edge of the flip-chip film 20 or the flexible circuit board 10, and the bonding position of the flip-chip film 20 and the flexible circuit board 10 is fixed.

[0052] In this design, the first positioning part and the first pin 12 of the flexible circuit board 10 are located on the same side, and the second positioning part and the second pin 22 of the flip-chip film 20 are located on the same side. This facilitates the alignment of the first pin 12 and the second pin 22 through the cooperation of the first positioning part and the second positioning part. There is no need for manual observation. When the first positioning part and the second positioning part are in cooperation, the first pin 12 and the second pin 22 are aligned. In this way, the first pin 12 and the second pin 22 are plugged in and the bonding position of the flip-chip film 20 and the flexible circuit board 10 is fixed. There will be no movement or misalignment between the first pin 12 and the second pin 22, thus achieving a reliable electrical connection between the flip-chip film 20 and the flexible circuit board 10.

[0053] The display module of this application solves the problems of low efficiency, poor accuracy, and misalignment caused by manual alignment during the bonding process of the flip-chip film 20 and the flexible circuit board 10 in the prior art. The display module of this application, by providing a first positioning part on the flexible circuit board 10 and a second positioning part on the flip-chip film 20, allows the operator to fix the bonding position of the flip-chip film 20 and the flexible circuit board 10 during the bonding process by coordinating the first and second positioning parts. This eliminates the need for manual alignment and prevents misalignment between the flip-chip film 20 and the flexible circuit board 10. This helps avoid misalignment between the second pin 22 of the flip-chip film 20 and the first pin 12 of the flexible circuit board 10, ensuring sufficient contact surface between them and guaranteeing a reliable electrical connection, thereby improving the product yield of the display device.

[0054] In some embodiments, the flexible circuit board 10 includes a first substrate 11, a first positioning portion and a first pin 12 disposed on the first substrate 11; the flip-chip film 20 includes a second substrate 21, a second positioning portion and a second pin 22 disposed on the second substrate 21.

[0055] Understandably, the first substrate 11 is the basic material layer of the flexible circuit board 10, usually made of polymer materials such as polyimide (PI), which has excellent mechanical properties and chemical stability. It is mainly used to provide basic mechanical support and stability, ensuring the integrity and reliability of the entire flexible circuit board 10 structure; the first positioning part and the first pin 12 are each disposed on one side of the first substrate 11 (specifically, the side facing the flip-chip film 20);

[0056] The second substrate 21 is the base material layer of the flip-chip film 20, which mainly serves as the carrier of the chip, providing electrical connection and mechanical support; the second positioning part and the second pin 22 are respectively disposed on one side of the second substrate 21 (specifically, the side facing the flexible circuit board 10).

[0057] In some other embodiments, the flexible circuit board 10 further includes a conductive layer 13 and a protective layer 14 stacked on the side of the first substrate 11 away from the first pin 12; wherein, the conductive layer 13 is mainly used to lay various conductive lines, etc., and is responsible for signal transmission; the protective layer 14 covers the side of the conductive layer 13 away from the first substrate 11, and is usually made of one or more layers of insulating material, and is used to protect the internal circuits and wires from the influence of the external environment.

[0058] As a feasible approach, such as Figure 2 and 4 As shown, the first positioning part includes a groove 15 formed from the surface of the first substrate 11 toward the opposite side of the flip-chip film 20, and the second positioning part includes a boss 23 formed from the second substrate 21 toward the flexible circuit board 10. The groove 15 and the boss 23 are in a concave-convex fit, and the bonding position between the flip-chip film 20 and the flexible circuit board 10 is fixed.

[0059] In this embodiment, by creating a groove 15 on the surface of the first substrate 11 and setting a boss 23 on the second substrate 21, the processing method is simple and avoids the need to dig grooves or holes on the first substrate 11 of the flip-chip film 20. This helps to ensure the structural integrity of the flip-chip film 20 and the reliable signal transmission. The combination of the groove 15 and the boss 23 results in a simple and reliable structure that is easy to disassemble. At the same time, it can reliably fix the bonding position of the flip-chip film 20 and the flexible circuit board 10 without the need for manual observation of the alignment of the first pin 12 and the second pin 22. It also ensures that after the first pin 12 and the second pin 22 are plugged in, there will be no movement or misalignment, thereby improving the product yield.

[0060] In some embodiments, the thickness of the boss 23 is greater than or equal to the sum of the thicknesses of the first pin 12 and the second pin 22, and less than the sum of the thicknesses of the first pin 12, the second pin 22, and the first base 11.

[0061] The groove 15 has a depth greater than 0 and does not penetrate the first substrate 11.

[0062] It should be noted that the thickness of the boss 23 refers to the dimension of the boss 23 in its extending direction (e.g., Figure 4 (in the X direction); the groove depth of groove 15 refers to the dimension of groove 15 in its extending direction or the distance from the opening of groove 15 to the bottom of groove (e.g., Figure 4 The thickness of the first pin 12 refers to the dimension of the first pin 12 along the direction away from the first substrate 11 (e.g., the dimension in the X direction); Figure 4 (in the X direction); the thickness of the second substrate 21 refers to the dimension of the second pin 22 along the direction away from the second substrate 21 (e.g., the X direction); Figure 4 (in the X direction); the thickness of the first substrate 11 refers to the dimension of the first substrate 11 in the direction perpendicular to the plane of the second substrate 21 (e.g., the X direction); Figure 4 (in the X direction).

[0063] In this embodiment, the thickness of the boss 23 serves two purposes: firstly, it ensures reliable electrical contact between the first pin 12 and the second pin 22, preventing the formation of a gap between them; secondly, the thickness of the boss 23 facilitates reliable engagement with the groove 15, fixing the bonding position of the flip-chip film 20 and the flexible circuit board 10; and thirdly, the depth of the groove 15 ensures that no gap is formed between the first pin 12 and the second pin 22 after engagement with the boss 23, and also prevents the groove 15 from penetrating the first substrate 11, thus avoiding damage to or impact on the conductive layer 13.

[0064] Understandably, when the thickness of the boss 23 is equal to the sum of the thicknesses of the first pin 12 and the second pin 22, the convex surface of the boss 23 is in contact with the surface of the first substrate 11, which can reliably achieve the alignment of the flip-chip film 20 and the flexible circuit board 10, and at this time, the first pin 12 and the second pin 22 are properly engaged. When the thickness of the boss 23 is greater than the sum of the thicknesses of the first pin 12 and the second pin 22, the boss 23 extends into the groove 15 and engages with the groove 15, thereby fixing the bonding position of the flip-chip film 20 and the flexible circuit board 10. After the first pin 12 and the second pin 22 are engaged, they will not move or deviate.

[0065] In a preferred embodiment, the thickness of the first pin 12 is the same as the thickness of the second pin 22.

[0066] The thickness of the first substrate 11 is greater than the thickness of the first pin 12, the thickness of the boss 23 is greater than or equal to twice the thickness of the second pin 22 and less than three times the thickness of the second pin 22, and correspondingly, the groove depth of the groove 15 is greater than 0 and less than or equal to the thickness of the first pin 12.

[0067] In this embodiment, the thickness of the boss 23 and the depth of the groove 15 are conducive to the reliable cooperation between the boss 23 and the groove 15, realizing the positioning and fixing of the bonding position of the flip-chip film 20 and the flexible circuit board 10, while ensuring the electrical connection of the first pin 12 and the second pin 22 without deviation.

[0068] As an implementation method, the boss 23 is formed by coating the surface of the second substrate 21 with a conductive material, the conductive material being the same material as the second pin 22.

[0069] In this embodiment, the formation of the boss 23 is simple in terms of processing technology, which helps to reduce processing costs, and at the same time does not affect the electrical connection between the second pin 22 and the first pin 12.

[0070] In a preferred embodiment, the conductive material includes copper.

[0071] In this embodiment, copper is chosen as the conductive material because the raw material is readily available and easy to process.

[0072] As a feasible approach, such as Figure 2 and 4 As shown, the groove 15 is located in the edge region of the first base 11, and the groove 15 has an opening in the bonding direction of the first pin 12 and the second pin 22; correspondingly, the boss 23 is located on one side of the second pin 22 and in the region close to the edge of the first base 11.

[0073] It should be noted that the edge region of the first substrate 11 refers to the area of ​​the first substrate 11 facing the surface of the flip-chip film 20 and close to the flip-chip film 20. In actual processing, the edge region of the first substrate 11 can also be above the first pin 12 (e.g., Figure 4 Above in the Y direction); and, the groove 15 is in the bonding direction of the first pin 12 and the second pin 22 (e.g., above the Y direction); Figure 4 An opening is formed in the Y direction of the groove 15, that is, one side wall of the groove 15 penetrates the side wall of the first substrate 11. Thus, as the flip-chip film 20 moves down, the groove 15 engages with the boss 23, and the second pin 22 of the flip-chip film 20 is inserted into the first pin 12 of the flexible circuit board 10. Correspondingly, the boss 23 is located in the area close to the edge of the first substrate 11, which is conducive to the engagement of the boss 23 and the groove 15.

[0074] In this embodiment, the positions of the groove 15 and the boss 23 are beneficial for the bonding process of the flip-chip film 20 and the flexible circuit board 10, and for the reliable positioning of the bonding position of the flip-chip film 20 and the flexible circuit board 10. As the flip-chip film 20 moves, the boss 23 engages with the groove 15, and the first pin 12 and the second pin 22 are electrically connected. After the first pin 12 and the second pin 22 are inserted, they will not move or deviate.

[0075] For example, such as Figure 2 As shown in diagram 4, during the fabrication of the flexible circuit board 10, copper is coated at the FOF position of the flexible circuit board 10 to form the first pin 12. Then, the copper above the first pin 12 on the first substrate 11 is removed, and a groove 15 is formed on the first substrate 11. The groove 15 is recessed towards the interior of the first substrate 11, and the depth of the groove 15 in its extending direction is equal to the thickness of the first pin 12. The sidewall of the groove 15 penetrates the sidewall of the first substrate 11. The groove 15 has an opening towards the flip-chip film 20 and an opening along the bonding direction of the flip-chip film 20 and the flexible circuit (e.g., ...). Figure 2 (in the Y direction); copper is coated on the second substrate 21 to prepare the second pin 22, and copper is coated on the second substrate 21 above the second pin 22 to obtain the boss 23. The boss 23 protrudes in the direction away from the second substrate 21. The thickness of the boss 23 in its extension direction is about three times the thickness of the first pin 12. When the flip-chip film 20 and the flexible circuit board 10 are aligned, the operator only needs to slide the boss 23 of the flip-chip film 20 into the groove 15 on the flexible circuit board 10 to achieve the positioning and fixation of the flip-chip film 20 and the flexible circuit board 10, and the first pin 12 and the second pin 22 are electrically connected.

[0076] As a feasible approach, such as Figure 3 and 5 As shown, a first alignment pin 16 is also provided on the first base 11, and a second alignment pin 24 is also provided on the second base 21. The position of the second alignment pin 24 corresponds to the position of the first alignment pin 16.

[0077] The first alignment pin 16 and the second alignment pin 24 each include a first region and a second region extending along two different directions, wherein the extension direction of the first region or the extension direction of the second region is the same as the bonding direction of the first pin 12 and the second pin 22.

[0078] The first alignment pin 16 is recessed in the direction away from the flip-chip film 20 to form a groove 15;

[0079] The second alignment pin 24 protrudes towards the flexible circuit board 10 to form a boss 23.

[0080] Understandably, in related technologies, alignment is typically achieved by setting alignment pins, specifically a first alignment pin 16 on the first substrate 11 and a second alignment pin 24 on the second substrate 21. The operator observes the first alignment pin 16 and the second alignment pin 24 to align the flip-chip film 20 and the flexible circuit board 10. The first alignment pin 16 is located on the first pin 12 in the first direction (e.g., ...). Figure 3 The second alignment pin 24 is located on both sides of the second pin 22 in the first direction (e.g., in the X direction). Figure 3 The first alignment pin 16 includes at least a first region and a second region extending along two different directions, the extension direction of the first region or the extension direction of the second region being the bonding direction of the first pin 12 and the second pin 22 (e.g., the X direction in the X direction), the ... Figure 3 The first pin 12 and the second pin 22 are in the same direction (Y direction), which is conducive to the insertion and cooperation of the first pin 12 and the second pin 22. At the same time, it is conducive to fixing the flip-chip film 20 and the flexible circuit board 10, and avoiding the first pin 12 and the second pin 22 from moving or deviating.

[0081] In this embodiment, the first alignment pin 16 is recessed in the direction away from the flip-chip film 20 to form a groove 15, and the second alignment pin 24 is protruded in the direction close to the flexible circuit board 10 to form a boss 23. This is easy to process and does not require additional bosses and grooves on the first substrate 11 and the second substrate 21, which simplifies the structure and can reliably fix the bonding position of the flip-chip film 20 and the flexible circuit board 10, ensuring the electrical connection of the first pin 12 and the second pin 22.

[0082] For example, such as Figure 3 Or as shown in Figure 5, along the first direction on the first substrate 11 (e.g.) Figure 3 In the X direction, T-shaped first alignment pins 16 are provided on both sides of the first pin 12. After removing the copper from the first alignment pins 16, the first alignment pins 16 are recessed towards the first substrate 11 to form a T-shaped groove. The thickness of the T-shaped groove in its extending direction is equal to the thickness of the first pin 12; along the first direction (e.g., in the X direction), the second substrate 21 has T-shaped first alignment pins 16. Figure 3 In the X direction, T-shaped second alignment pins 24 are provided on both sides of the second pin 22. Copper is coated on the second alignment pins 24 to form a boss 23. The thickness of the boss 23 is three times the thickness of the first pin 12. When the flip-chip film 20 and the flexible circuit board 10 are aligned, the operator only needs to slide the second alignment pin 24 of the flip-chip film 20 into the first alignment pin 16 on the flexible circuit board 10 to achieve the positioning and fixation of the flip-chip film 20 and the flexible circuit board 10, and the electrical connection between the first pin 12 and the second pin 22 will not be misaligned.

[0083] As a feasible approach, such as Figure 6As shown, the first positioning part includes a first positioning ear (not shown in the figure) and a first positioning hole (not shown in the figure) formed on the first positioning ear. The first positioning ear is located on the first base 11 along a first direction (e.g., Figure 6 At least one side of the first positioning ear (in the X direction), the first positioning ear extends from the edge of the first base 11 toward a direction away from the first base 11 (e.g., in the X direction). Figure 6 (X-direction) extension settings;

[0084] The second positioning part includes a second positioning ear 25 and a second positioning hole 26 formed on the second positioning ear 25. The second positioning ear 25 is located on the second base 21 along a first direction (e.g., Figure 6 At least one side of the second positioning ear 25 in the X direction, from the edge of the second base 21 toward a direction away from the second base 21 (e.g., in the X direction). Figure 6 The X-direction extension setting in the first direction (e.g., the X-direction extension setting in the first direction) Figure 6 The X direction in the figure is perpendicular to the bonding direction of the first pin 12 and the second pin 22 (the Y direction in the figure);

[0085] In the direction perpendicular to the surface of the flip-chip film 20, the orthographic projection of the first positioning hole and the orthographic projection of the second positioning hole 26 completely overlap.

[0086] It should be noted that, in the actual processing, aligning the first positioning ear and the second positioning ear 25 can achieve pre-alignment of the flip-chip film 20 and the flexible circuit board 10. Then, aligning the first positioning hole and the second positioning hole 26, and passing the positioning post on the bonding device through the first positioning hole and the second positioning hole 26, can achieve the alignment of the flip-chip film 20 and the flexible circuit board 10, improve the alignment accuracy, and thus help improve the product yield of the display module.

[0087] The first positioning ear, the first positioning hole, the second positioning ear 25, and the second positioning hole 26 in this embodiment have a simple structure, are easy to process, will not interfere with the first pin 12 and the second pin 22, and can reliably realize the alignment of the flip-chip film 20 and the flexible circuit board 10, thereby improving the alignment accuracy.

[0088] In some embodiments, the orthographic projections of the first positioning ear and the second positioning ear 25 completely overlap in a direction perpendicular to the surface of the flip-chip film 20.

[0089] In this embodiment, the orthographic projection of the first positioning ear and the orthographic projection of the second positioning ear 25 completely overlap, which is beneficial to further improve the alignment accuracy of the flip-chip film 20 and the flexible circuit board 10.

[0090] In some embodiments, the display module further includes a panel 30, a flip-chip film 20, and a bonding contact pattern of the panel 30 to enable the display module to display a clear image.

[0091] Understandably, in order to improve the resolution of the panel 30, the linewidth of the flip-chip film 20 is usually reduced. While ensuring reliable contact between the pins on the flip-chip film 20 and the pins on the panel 30, the contact area between the pins on the flip-chip film 20 and the pins on the panel 30 is increased as much as possible. Consequently, the pin size on the flip-chip film 20 is generally larger. After the flip-chip film 20 and the panel 30 are electrically connected, the pins on the flip-chip film 20 have exposed areas that extend beyond the edge of the pins on the panel 30. The specific size of the exposed area is determined according to the actual bonding process. For example, the length of the exposed area can be 100μm-200μm.

[0092] Typically, the terminal area of ​​panel 30 is cut using a PAD cut process to form a cut edge. Due to the cutting process, carbonized debris is generated at the cut edge. During the assembly of panel 30, the exposed areas of the pins on the flip-chip film 20 overlap due to the carbonized debris, which can cause short circuits and defects such as dark lines. In the embodiments of this application, a first insulating protective layer is provided at the cut edge of panel 30 and / or a second insulating protective layer is provided at the exposed areas of the pins on the flip-chip film 20. This effectively isolates the exposed areas of the pins on the flip-chip film 20 from the cut edge of panel 30, thereby avoiding problems such as short circuits and dark lines, and improving the quality and yield of the display module.

[0093] In summary, the display module of this application, by providing a first positioning part on the flexible circuit board 10 and a second positioning part on the flip-chip film 20, with the first and second positioning parts cooperating, allows the operator to fix the bonding position of the flip-chip film 20 and the flexible circuit board 10 by cooperating the first and second positioning parts during the bonding process of the flexible circuit board 10 and the flip-chip film 20. This eliminates the need for manual alignment and prevents misalignment between the flip-chip film 20 and the flexible circuit board 10, thereby helping to avoid misalignment between the second pin 22 of the flip-chip film 20 and the first pin 12 of the flexible circuit board 10. This ensures that the second pin 22 of the flip-chip film 20 and the first pin 12 of the flexible circuit board 10 have sufficient contact surface, thereby ensuring a reliable electrical connection between the second pin 22 of the flip-chip film 20 and the first pin 12 of the flexible circuit board 10 and improving the product yield of the display device.

[0094] Furthermore, by setting the boss 23 and the groove 15, the structure is simple and easy to process. At the same time, there is no need to cut grooves or holes in the flip-chip film 20, ensuring that the structure of the flip-chip film 20 is not damaged. In addition, the size of the boss 23 and the groove 15 is conducive to the reliable cooperation between the boss 23 and the groove 15, realizing the positioning and fixation of the bonding position between the flip-chip film 20 and the flexible circuit board 10, which in turn helps to ensure the electrical connection of the first pin 12 and the second pin 22 without misalignment.

[0095] Secondly, the present invention provides a display device including the display module 100 of the first aspect. It is understood that this display device possesses all the features and advantages of the aforementioned display module, which will not be repeated here. In summary, this display device has high quality and yield, high display resolution, and can achieve an ultra-thin packaging structure.

[0096] It should be understood that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., used above to indicate orientation or positional relationships are based on the orientation or positional relationships shown in the accompanying drawings and are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the panel or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined with "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the invention, unless otherwise stated, "a plurality of" means two or more.

[0097] The above description is merely a preferred embodiment of this application and an explanation of the technical principles employed. Those skilled in the art should understand that the scope of the invention involved in this application is not limited to technical solutions formed by specific combinations of the above-described technical features, but should also cover other technical solutions formed by arbitrary combinations of the above-described technical features or their equivalents without departing from the inventive concept. For example, technical solutions formed by substituting the above features with (but not limited to) technical features with similar functions disclosed in this application.

Claims

1. A display module, characterized by The utility model relates to a flexible circuit board and a chip on film (COF) binding method, and relates to the technical field of flexible circuit board and chip on film (COF) binding. The utility model relates to a flexible circuit board and a chip on film (COF) binding method, and relates to the technical field of flexible circuit board and chip on film (COF) binding. The utility model relates to a flexible circuit board and a chip on film (COF) binding method, and relates to the technical field of flexible circuit board and chip on film (COF) binding. The utility model relates to a flexible circuit board and a chip on film (COF) binding method, and relates to the technical field of flexible circuit board and chip on film (COF) binding. The utility model relates to a flexible circuit board and a chip on film (COF) binding method, and relates to the technical field of flexible circuit board and chip on film (COF) binding. The utility model relates to a flexible circuit board and a chip on film (COF) binding method, and relates to the technical field of flexible circuit board and chip on film (COF) binding. The utility model relates to a flexible circuit board and a chip on film (COF) binding method, and relates to the technical field of flexible circuit board and chip on film (COF) binding. The utility model relates to a flexible circuit board and a chip on film (COF) binding method, and relates to the technical field of flexible circuit board and chip on film (COF) binding.

2. The display module of claim 1, wherein, The utility model relates to a flexible circuit board and a chip on film (COF) binding method, and relates to the technical field of flexible circuit board and chip on film (COF) binding. The utility model relates to a flexible circuit board and a chip on film (COF) binding method, and relates to the technical field of flexible circuit board and chip on film (COF) binding.

3. The display module of claim 1, wherein, The utility model relates to a flexible circuit board and a chip on film (COF) binding method, and relates to the technical field of flexible circuit board and chip on film (COF) binding.

4. The display module of claim 3, wherein, The utility model relates to a flexible circuit board and a chip on film (COF) binding method, and relates to the technical field of flexible circuit board and chip on film (COF) binding.

5. The display module of any of claims 1-4, wherein, The utility model relates to a flexible circuit board and a chip on film (COF) binding method, and relates to the technical field of flexible circuit board and chip on film (COF) binding.

6. The display module of any of claims 1-4, wherein, The utility model relates to a flexible circuit board and a chip on film (COF) binding method, and relates to the technical field of flexible circuit board and chip on film (COF) binding. The utility model relates to a flexible circuit board and a chip on film (COF) binding method, and relates to the technical field of flexible circuit board and chip on film (COF) binding. The utility model relates to a flexible circuit board and a chip on film (COF) binding method, and relates to the technical field of flexible circuit board and chip on film (COF) binding. The utility model relates to a flexible circuit board and a chip on film (COF) binding method, and relates to the technical field of flexible circuit board and chip on film (COF) binding. The utility model relates to a flexible circuit board and a chip on film (COF) binding method, and relates to the technical field of flexible circuit board and chip on film (COF) binding. The utility model relates to a flexible circuit board and a chip on film (COF) binding method, and relates to the technical field of flexible circuit board and chip on film (COF) binding. The utility model relates to a flexible circuit board and a chip on film (COF) binding method, and relates to the technical field of flexible circuit board and chip on film (COF) binding. The utility model relates to a flexible circuit board and a chip on film (COF) binding method, and relates to the technical field of flexible circuit board and chip on film (COF) binding. The utility model relates to a flexible circuit board and a chip on film (COF) binding method, and relates to the technical field of flexible circuit board and chip on film (COF) binding. The utility model relates to a flexible circuit board and a chip on film (COF) binding method, and relates to the technical field of flexible circuit board and chip on film (COF) binding. The utility model relates to a flexible circuit board and a chip on film (COF) binding method, and relates to the technical field of flexible circuit board and chip on film (COF) binding. The utility model relates to a flexible circuit board and a chip on film (COF) binding method, and relates to the technical field of flexible circuit board and chip on film (COF) binding. The utility model relates to a flexible circuit board and a chip on film (COF) binding method, and relates to the technical field of flexible circuit board and chip on film (COF) binding. The utility model relates to a flexible circuit board and a chip on film (COF) binding method, and relates to the technical field of flexible circuit board and chip on film (COF) binding. The utility model relates to a flexible circuit board and a chip on film (COF) binding method, and relates to the technical field of flexible circuit board and chip on film (COF) binding. The utility model relates to a flexible circuit board and a chip on film (COF) binding method, and relates to the technical field of flexible circuit board and chip on film (COF) binding. The utility model relates to a flexible circuit board and a chip on film (COF) binding method, and relates to the technical field of flexible circuit board and chip on film (COF) binding. The utility model relates to a flexible circuit board and a chip on film (COF) binding method, and relates to the technical field of flexible circuit board and chip on film (COF) binding. The utility model relates to a flexible circuit board and a chip on film (COF) binding method, and relates to the technical field of flexible circuit board and chip on film (COF) binding. The utility model relates to a flexible circuit board and a chip on film (COF) binding method, and relates to the technical field of flexible circuit board and chip on film (COF) binding. The utility model relates to a flexible circuit board and a chip on film (COF) binding method, and relates to the technical field of flexible circuit board and chip on film (COF) binding. The utility model relates to a flexible circuit board and a chip on film (COF) binding method, and relates to the technical field of flexible circuit board and chip on film (COF) binding. The utility model relates to a flexible circuit board and a chip on film (COF) binding method, and relates to the technical field of flexible circuit board and chip on film (COF) binding. The utility model relates to a flexible circuit board and a chip on film (COF) binding method, and relates to the technical field of flexible circuit board and chip on film (COF) binding. The utility model relates to a flexible circuit board and a chip on film (COF) binding method, and relates to the technical field of flexible circuit board and chip on film (COF) binding. The utility model relates to a flexible circuit board and a chip on film (COF) binding method, and relates to the technical field of flexible circuit board and chip on film (COF) binding. The utility model relates to a flexible circuit board and a chip on film (COF) binding method, and relates to the technical field of flexible circuit board and chip on film (COF) binding. The utility model relates to a flexible circuit board and a chip on film (COF) binding method, and relates to the technical field of flexible circuit board and chip on film (COF) binding. The utility model relates to a flexible circuit board and a chip on film (COF) binding method, and relates to the technical field of flexible circuit board and chip on film (COF) binding. The utility model relates to a flexible circuit board and a chip on film (COF) binding method, and relates to the technical field of flexible circuit board and chip on film (COF) binding. The utility model relates to a flexible circuit board and a chip on film (COF) binding method, and relates to the technical field of flexible circuit board and chip on film (COF) binding. The utility model relates to a flexible circuit board and a chip on film (COF) binding method, and relates to the technical field of flexible circuit board and chip on film (COF) binding. The utility model relates to a flexible circuit board and a chip on film (COF) binding method, and relates to the technical field of flexible circuit board and chip on film (COF) binding. The utility model relates to a flexible circuit board and a chip on film (COF) binding method, and relates to the technical field of flexible circuit board and chip on film (COF) binding. The utility model relates to a flexible circuit board and a chip on film (COF) binding method, and relates to the technical field of flexible circuit board and chip on film (COF) binding. The utility model relates to a flexible circuit board and a chip on film (COF) binding method, and relates to the technical field of flexible circuit board and chip on film (COF) binding. The utility model relates to a flexible circuit board and a chip on film (COF) binding method, and relates to the technical field of flexible circuit board and chip on film (COF) 7. The display module of claim 1, wherein, The first positioning part comprises a first positioning lug and a first positioning hole formed in the first positioning lug, the first positioning lug is located at at least one side of the first base body along a first direction, and the first positioning lug extends away from the first base body from an edge of the first base body; The second positioning part comprises a second positioning lug and a second positioning hole formed in the second positioning lug, the second positioning lug is located at at least one side of the second base body along the first direction, and the second positioning lug extends away from the second base body from an edge of the second base body, and the first direction is perpendicular to the binding direction of the first pin and the second pin; In a direction perpendicular to the surface of the chip on film, the orthographic projection of the first positioning hole and the orthographic projection of the second positioning hole completely overlap.

8. The display module of claim 7, wherein, In a direction perpendicular to the surface of the chip on film, the orthographic projection of the first positioning lug and the orthographic projection of the second positioning lug completely overlap.

9. A display device, characterized by The display module comprises the display module of claim 8.

Images