Encapsulated phased array antenna

Abstract

The present application provides an encapsulated phased array antenna, which relates to the field of wireless communication. The encapsulated phased array antenna provided by the present application includes a hybrid motherboard; an encapsulated antenna array, which includes a plurality of encapsulated antenna modules and is installed on the hybrid motherboard. The plurality of encapsulated antenna modules are distributed in a spiral trajectory, and each of the plurality of encapsulated antenna modules rotates along the tangent or approximate tangent direction of the spiral trajectory at the corresponding position. In the present application, the encapsulated antenna array is distributed on the hybrid motherboard in a spiral trajectory with an irregular arrangement form, reducing the periodicity of the arrangement of the encapsulated antenna modules and the dependence of the encapsulated antenna array on frequency, dissipating the parasitic radiation energy that is likely to generate grating lobes at different angles and in different spaces, and suppressing the grating lobe phenomenon. Each encapsulated antenna module rotates according to the tangent or approximate tangent direction of the spiral trajectory at the corresponding position, so as to improve the circular polarization purity of the radiation pattern between the plurality of encapsulated antenna modules.

Description

Technical Field

[0001] This application relates to the field of wireless communication, and particularly to an encapsulated phased array antenna. Background Art

[0002] An antenna in package (referred to as AiP) is a technology that integrates an antenna and a chip in a package based on packaging materials and processes to achieve system-level wireless functions.

[0003] The small module or package size in AiP can provide better flexibility, scalability, and conformal effect on the surface of curved carriers for different array surface sizes. However, the inevitable gaps in the discrete arrangement of the antenna aperture will deteriorate the radiation performance of the phased array antenna, which is manifested in the appearance of some subarray grating lobes. Compared with the ideal equally spaced array grating, due to the existence of the interval inside the package or the interval between multiple package components, an unconventional sampling of the antenna aperture is generated, and the performance shows as the distortion of the radiation pattern. Thus, it can be known that the above-mentioned gaps lead to more common defects in the antenna aperture, and further lead to serious spectral ambiguity. At the same time, the abnormal grating lobes caused by the above-mentioned gaps will affect the level value in the adjacent main lobe region. In addition to the influence of these gaps on achieving efficient radiation and wide-angle scanning, the increase in the size of components or packages is also likely to cause structural thermal response problems.

[0004] In a phased array antenna based on the AiP architecture, regular arrays arranged in a rectangular grid or a triangular grid can be used to arrange the radiating antenna elements on the array surface, as Figure 1 and Figure 2 shown. The antenna AiP is placed on the antenna mother board through a ball grid array package (Ball Grid Array, referred to as BGA), and is connected to the electronic circuit in the antenna mother board through an interface. Gaps are reserved between the AiPs to meet the requirements of the electrical installation process and eliminate assembly stress, such as the gaps 1 and 2 shown in Figure 1 . Moreover, since the AiP has a height comparable to the working wavelength after combining with the BGA, the gaps formed by the arrangement of the AiPs have a certain radiation ability. The gaps with radiation performance also form periodic radiation gaps as the AiPs are periodically arranged in the array surface. The radiation fields generated by the periodic radiation gaps in the array can interfere in space, forming lobes corresponding to the distribution of the radiation gaps.

[0005] Figure 3Anomaly and schematic diagram of the grid arrangement period of antenna elements in the AiP application are given. The application of the grid lines between the internal elements of the AiP will affect the periodic arrangement between the internal elements of the AiP. When the AiP is arranged to form an antenna array surface, due to the requirements of the electrical installation process and the elimination of inter-array stress, a certain gap is also required to be reserved between the AiPs, which will also affect the original required periodic arrangement in the antenna array surface, disrupt the original continuous periodic antenna array surface arrangement, and then affect its radiation characteristics, such as the sidelobe level and the sidelobe position, etc.

[0006] Since the excitation field of this radiation gap is obtained by coupling with the main excitation field of the AiP and is a parasitic excitation, the radiation field of the radiation gap can be considered as parasitic radiation, and the corresponding spatial lobe can be considered as a parasitic sidelobe relative to the main radiation lobe of the main excitation field. For example Figure 3 As shown, radiation with an amplitude of λ0 / 4 is generated at both gap 1 and gap 2, where λ0 is the operating wavelength. The existence of this parasitic sidelobe will disrupt the original radiation lobe of the AiP antenna array, causing the radiation performance of the phased array antenna to deviate from the original preset antenna performance, manifested as an increase in the antenna sidelobe level, etc., resulting in a reduction in the anti-interference ability and radiation efficiency of the antenna. Summary of the Invention

[0007] Based on this, the present application provides a packaged phased array antenna, which can destroy the periodicity of the radiation gap, dissipate the energy belonging to the parasitic sidelobe in different spatial domains without generating superposition enhancement, thereby suppressing the parasitic sidelobe phenomenon and improving the antenna performance.

[0008] The packaged phased array antenna provided by the present application includes:

[0009] Hybrid motherboard;

[0010] Packaged antenna array, including:

[0011] A plurality of packaged antenna modules, installed on the hybrid motherboard, the plurality of packaged antenna modules are distributed in a spiral trajectory, and each of the plurality of packaged antenna modules rotates along the tangent or approximate tangent direction of the spiral trajectory at the corresponding position.

[0012] Optionally, the spiral trajectory is an Archimedean spiral curve.

[0013] Optionally, the plurality of packaged antenna modules start from the geometric center of the target array surface to be formed and are arranged equidistantly along the spiral trajectory.

[0014] Optionally, each of the plurality of packaged antenna modules includes:

[0015] Chip packaging layer, installed on the hybrid motherboard;

[0016] The antenna radiation layer is connected to the chip packaging layer, and the surface of the antenna radiation layer has radiation antenna units.

[0017] Optionally, the surface of the chip packaging layer has a BGA solder ball array, and the chip packaging layer is connected to the hybrid motherboard through the BGA solder ball array.

[0018] Optionally, the hybrid motherboard is a multi-layer PCB hybrid board.

[0019] Optionally, a feeding RF network, a power supply network, and a beam control line network are installed in the hybrid motherboard.

[0020] Optionally, multiple packaged antenna modules are distributed on the surface of the hybrid motherboard to form multiple spiral trajectories, and the multiple spiral trajectories are rotationally symmetric about the geometric center of the target array surface to be formed, and the multiple spiral trajectories do not intersect each other.

[0021] Optionally, the polar coordinate formula of the spiral trajectory is:

[0022]

[0023] where r is the polar radius of any point on the spiral trajectory, a is the distance between the starting point of the spiral trajectory and the polar coordinate center, b is the control dimension parameter for controlling the pitch between the spiral lines, and θ is the polar angle of any point;

[0024] The position point coordinates of the packaged antenna module are:

[0025]

[0026]

[0027]

[0028] where is the abscissa of the corresponding packaged antenna module, is the ordinate of the corresponding packaged antenna module, is the polar angle of the corresponding packaged antenna module, is the polar radius of the corresponding packaged antenna module, is the sequence number of the packaged antenna module on the spiral trajectory, and increases sequentially as the polar radius increases, and N is the total number of packaged antenna modules on the spiral trajectory.

[0029] Optionally, the distance between two adjacent packaged antenna modules on the spiral trajectory

[0030]

[0031]

[0032] Among them, and are respectively the abscissas of two adjacent packaged antenna modules, and are respectively the ordinates of two adjacent packaged antenna modules, is the sequence number of the packaged antenna module on the spiral trajectory, and increases sequentially as the polar radius increases, and N is the total number of packaged antenna modules on the spiral trajectory.

[0033] Optionally, the tangential direction angle for any one packaged antenna module to rotate along the tangent or approximate tangent direction of the spiral trajectory is:

[0034]

[0035] Among them, and are respectively the abscissas of two adjacent packaged antenna modules, and are respectively the ordinates of two adjacent packaged antenna modules, is the sequence number of the packaged antenna module on the spiral trajectory, and increases sequentially as the polar radius increases, and N is the total number of packaged antenna modules on the spiral trajectory.

[0036] The packaged phased array antenna provided by this application distributes the packaged antenna array on the hybrid motherboard in a non-regular arranged spiral trajectory, reducing the periodicity of the arrangement of the packaged antenna modules and the dependence of the packaged antenna array on frequency, dissipating the parasitic radiation energy that is prone to generating grating lobes at different angles and in different spaces, without obvious spatial superposition enhancement, so as to break through the theoretically highest frequency determined by the grating lobe constraint conditions, eliminate the limitation of the grating lobe effect on the broadband or dual-frequency working performance of the phased array antenna, and suppress the grating lobe phenomenon. By distributing multiple packaged antenna modules along the spiral trajectory, and each packaged antenna module rotates according to the tangent or approximate tangent direction of the spiral trajectory at the corresponding position, the circular polarization purity of the radiation pattern between multiple packaged antenna modules is improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] In order to more clearly illustrate the technical solutions in the embodiments of this application, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the drawings in the following description are only some embodiments of this application. For those of ordinary skill in the art, other drawings can also be obtained based on these drawings without exceeding the scope required to be protected by this application.

[0038] Figure 1It is a schematic structural diagram of an existing packaged antenna;

[0039] Figure 2 It is a schematic diagram of the formation of grating lobes due to gaps in an existing packaged antenna;

[0040] Figure 3 It is a schematic diagram of abnormal grating arrangement period in an existing packaged antenna;

[0041] Figure 4 It is a schematic structural diagram of the packaged phased array antenna provided by the present application;

[0042] Figure 5 It is a schematic structural diagram of the packaged antenna module in the packaged phased array antenna provided by the present application;

[0043] Figure 6 It is a schematic structural diagram of the packaged antenna module in the packaged phased array antenna provided by the present application from another angle;

[0044] Figure 7 It is a schematic diagram of the production of the helix trajectory of the packaged phased array antenna provided by the present application;

[0045] Figure 8 It is a schematic diagram of the distribution of the packaged antenna array in Embodiment 1 of the packaged phased array antenna provided by the present application;

[0046] Figure 9 It is the radiation pattern of Embodiment 1 of the packaged phased array antenna provided by the present application at a working frequency of 20.2 GHz;

[0047] Figure 10 It is a schematic diagram of the distribution of the packaged antenna array in Embodiment 2 of the packaged phased array antenna provided by the present application;

[0048] Figure 11 It is the radiation pattern of Embodiment 2 of the packaged phased array antenna provided by the present application at a working frequency of 17.7 GHz;

[0049] Figure 12 It is the radiation pattern of Embodiment 2 of the packaged phased array antenna provided by the present application at a working frequency of 31 GHz;

[0050] Figure 13 It is the radiation pattern of Embodiment 2 of the packaged phased array antenna provided by the present application at a working frequency of 60 GHz.

[0051] Explanation of reference numerals: 1. Hybrid mother board; 2. Packaged antenna array; 21. Packaged antenna module; 211. Chip packaging layer; 212. Antenna radiation layer; 213. Radiation antenna unit; 214. BGA solder ball array. Detailed implementation manners

[0052] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part rather than all of the embodiments of the present application. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present application without creative efforts shall fall within the protection scope of the present application.

[0053] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. They are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present application. In addition, the terms "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first", "second", etc. may explicitly or implicitly include one or more of the described features. In the description of the present application, "a plurality" means two or more unless otherwise specifically defined.

[0054] In the description of the present application, it should be noted that unless otherwise clearly defined and limited, the terms "mounted", "connected" and "coupled" shall be construed in a broad sense. For example, it may be a fixed connection, a detachable connection or an integral connection; it may be a mechanical connection, an electrical connection or a connection capable of mutual communication; it may be directly connected or indirectly connected through an intermediate medium, and it may be the internal communication of two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.

[0055] In the present application, unless otherwise clearly defined and limited, the fact that the first feature is "on" or "under" the second feature may include the direct contact between the first and second features, or may include the situation where the first and second features are not in direct contact but in contact through other features therebetween. Moreover, the fact that the first feature is "above", "over" and "on" the second feature includes that the first feature is directly above and obliquely above the second feature, or simply means that the horizontal height of the first feature is higher than that of the second feature. The fact that the first feature is "under", "beneath" and "under" the second feature includes that the first feature is directly below and obliquely below the second feature, or simply means that the horizontal height of the first feature is lower than that of the second feature.

[0056] Reference Figure 4, the encapsulated phased array antenna provided by this application includes a hybrid motherboard 1 and an encapsulated antenna array 2. Among them, the encapsulated antenna array 2 includes a plurality of encapsulated antenna modules 21, and the plurality of encapsulated antenna modules 21 are installed on the hybrid motherboard 1. The plurality of encapsulated antenna modules 21 are distributed in a spiral trajectory, and each of the plurality of encapsulated antenna modules 21 rotates along the tangent or approximate tangent direction of the spiral trajectory at the corresponding position.

[0057] The encapsulated antenna array 2 is distributed on the hybrid motherboard 1 in a spiral trajectory with an irregular arrangement pattern, reducing the periodicity of the arrangement of the encapsulated antenna modules 21 and the dependence of the encapsulated antenna array 2 on frequency, so that the parasitic radiation energy that will cause the grating lobe phenomenon is dissipated at different angles and in space, without obvious superposition enhancement in space, so as to break through the theoretically highest frequency determined by the grating lobe constraint conditions, eliminate the limitation of the grating lobe effect on the broadband or dual-frequency working performance of the phased array antenna, and suppress the grating lobe phenomenon. By distributing the plurality of encapsulated antenna modules 21 along the spiral trajectory, and each encapsulated antenna module 21 rotates according to the tangent or approximate tangent direction of the spiral trajectory at the corresponding position, in the way of cross-polarization cancellation, the circular polarization purity of the radiation pattern of the encapsulated antenna array 2 is improved. The modularization of the encapsulated antenna module 21 reduces the manufacturing cost and improves the flexibility.

[0058] The encapsulated antenna array 2 has an irregular arrangement pattern. For example, the spiral trajectory of the encapsulated antenna array 2 can change from dense to sparse from the geometric center of the target array surface to be formed to the surrounding, so that the density between the plurality of encapsulated antenna modules 21 at the center is large, and from the center to the edge direction, the density of the encapsulated antenna modules 21 gradually becomes smaller. Thus, the sidelobe characteristics of the radiation pattern are improved by spatial taper, so that the antenna has a higher power conversion efficiency. Since the parasitic radiation energy of the encapsulated phased array antenna of this application can be dissipated at different angles and in space without obvious superposition enhancement, a larger spacing between the encapsulated antenna modules 21 can be used to increase the antenna aperture, so as to improve the beam angle resolution or mutual coupling suppression.

[0059] As an optional implementation manner, the spiral trajectory is an Archimedean spiral curve.

[0060] As an optional implementation manner, the plurality of encapsulated antenna modules 21 are arranged at equal distances along the spiral trajectory starting from the geometric center of the target array surface to be formed.

[0061] Reference Figure 5 , as an optional implementation manner, each of the plurality of encapsulated antenna modules 21 includes a chip encapsulation layer 211 and an antenna radiation layer 212. Among them, the chip encapsulation layer 211 is installed on the hybrid motherboard 1. The antenna radiation layer 212 is connected to the chip encapsulation layer 211, and the surface of the antenna radiation layer 212 has radiation antenna elements 213.

[0062] The antenna radiation layer 212 is used to accommodate the radiation antenna units 213. The number of radiation antenna units 213 can be multiple. The antenna radiation layer 212 and the multiple radiation antenna units 213 form an AiP radiation part, and the multi-channel transmitting frequency band radiation-phase multifunctional chip is encapsulated through the chip encapsulation layer 211.

[0063] For example, the number of radiation antenna units 213 is 4, and a 4-channel transmitting frequency band radiation-phase multifunctional chip is adopted. The 4 radiation antenna units 213 are arranged in a 2×2 rectangular array form with the geometric center of the antenna radiation layer 212 as the symmetry center. The 4-channel transmitting frequency band radiation-phase multifunctional chip is encapsulated through the chip encapsulation layer 211, and is encapsulated together with the radiation antenna units 213 and the antenna radiation layer 212.

[0064] As an optional implementation manner, the surface of the chip encapsulation layer 211 has a BGA solder ball array 214, and the chip encapsulation layer 211 is connected to the hybrid motherboard 1 through the BGA solder ball array 214.

[0065] As an optional implementation manner, the hybrid motherboard 1 is a multi-layer PCB hybrid board.

[0066] As an optional implementation manner, a feeding RF network, a power supply network, and a beam control line network are installed in the hybrid motherboard 1.

[0067] An external RF interface, a power supply interface, and a beam control interface can also be correspondingly arranged on the surface of the hybrid motherboard 1. Among them, the position of the external RF interface corresponds to the arrangement position of the radiation antenna units 213 and is connected to the feeding RF network. The power supply interface and the beam control interface are respectively connected to the power supply network and the beam control line network. Multi-beam formation is realized through the feeding RF network, and the encapsulated antenna module 21 is powered and controlled through the power supply network and the beam control line network respectively.

[0068] As an optional implementation manner, multiple encapsulated antenna modules 21 are distributed on the surface of the hybrid motherboard 1 to form multiple spiral line trajectories. The multiple spiral line trajectories are rotationally symmetric around the geometric center of the target array surface to be formed, and the multiple spiral line trajectories do not intersect each other.

[0069] As an optional implementation manner, the polar coordinate formula of the spiral line trajectory is:

[0070]

[0071] where r is the polar radius of any point on the semi-spiral line trajectory, a is the distance between the starting point of the spiral line trajectory and the pole of the polar coordinate system, b is the control dimension parameter for controlling the pitch between the spiral lines, and θ is the polar angle of any point;

[0072] The position coordinate points of the encapsulated antenna module 21 are:

[0073]

[0074]

[0075]

[0076] Among them, is the abscissa of the corresponding packaged antenna module 21, is the ordinate of the corresponding packaged antenna module 21, is the polar angle of the corresponding packaged antenna module 21, is the polar radius of the corresponding packaged antenna module, is the sequence number of the packaged antenna module 21 on the spiral trajectory, and increases sequentially as the polar radius increases, and N is the total number of packaged antenna modules 21 on the spiral trajectory.

[0077] As an optional implementation manner, the distance [[ID=:27]] between two adjacent packaged antenna modules 21 on the spiral trajectory

[0078]

[0079]

[0080] Among them, and are the abscissas of two adjacent packaged antenna modules 21 respectively, and are the ordinates of two adjacent packaged antenna modules 21 respectively, is the sequence number of the packaged antenna module 21 on the spiral trajectory, and increases sequentially as the polar radius increases, and N is the total number of packaged antenna modules 21 on the spiral trajectory.

[0081] As an optional implementation manner, the tangential direction angle at which any packaged antenna module 21 rotates along the tangent or approximate tangent direction of the spiral trajectory

[0082]

[0083] Among them, and are the abscissas of two adjacent packaged antenna modules 21 respectively, and are the ordinates of two adjacent packaged antenna modules 21 respectively, is the sequence number of the packaged antenna module 21 on the spiral trajectory, and Increase sequentially as the polar radius increases, where N is the total number of encapsulated antenna modules 21 on the spiral trajectory.

[0084] In some embodiments, the encapsulated phased array antenna of the present application is applied in the Ka band, covering a working frequency of 17.7 - 20.2 GHz. Multiple encapsulated antenna modules 21 are irregularly distributed in a spiral trajectory on the hybrid motherboard 1. For example, as Figure 8 shown, multiple encapsulated antenna modules 21 are respectively distributed along 6 spiral trajectories, and the encapsulated antenna array 2 is formed by the encapsulated antenna modules 21 distributed along the 6 spiral trajectories. And each spiral trajectory conforms to the Archimedes spiral curve. And the encapsulated antenna array 2 meets the requirements of the AiP process and the BGA ball mounting process. The radiating antenna element 213 in the encapsulated antenna module 21 can be a microstrip antenna. Each encapsulated antenna module 21 rotates according to the tangent or approximate tangent direction of the spiral trajectory at its location, and enables the encapsulated antenna module 21 to achieve wide-angle scanning of the radiation beam. From Figure 9 it can be known that in the working frequency of 20.2 GHz of the encapsulated phased array antenna in this embodiment, the corresponding antenna gain is 28.7 dBi. And the sidelobe suppression characteristic is good, the main lobe of the antenna beam has good circular polarization purity, and the in-band axial ratio is less than 2 dB. Since the irregular spiral trajectory array arrangement of the encapsulated antenna array 2 realizes the suppression of grating lobes, the parasitic radiation at the gaps can still be dissipated in different spaces without superposition interference enhancement during large-angle scanning of the beam, thus suppressing the generation of grating lobes.

[0085] In some embodiments, the encapsulated phased array antenna of the present application is applied in the Ka band, covering working frequencies of 17.7 - 20.2 GHz and 28.1 - 31.0 GHz. Multiple encapsulated antenna modules 21 are irregularly distributed in a spiral trajectory on the hybrid motherboard 1. For example, as Figure 10 shown, multiple encapsulated antenna modules 21 are respectively distributed along 2 spiral trajectories, and the encapsulated antenna array 2 is formed by the encapsulated antenna modules 21 distributed along the 2 spiral trajectories. And each spiral trajectory conforms to the Archimedes spiral curve. As Figure 11 and Figure 12It can be seen that at the operating frequencies of 17.7 GHz and 31 GHz, the corresponding antenna gains are 26.3 dBi and 27.1 dBi respectively, and the sidelobe suppression characteristics are good. Since the irregular array arrangement of this antenna realizes the suppression of grating lobes, although there are gaps between the AiPs (which is also a requirement of the implementation process), the parasitic radiation of the gaps can still be dissipated in different spaces during wide-angle beam scanning without superposition interference enhancement, thus realizing its good sidelobe characteristics. At the same time, although this array has a relatively large average spacing (greater than 6.5 mm), which is much larger than the requirement for the element spacing of grating lobe suppression in a rectangular grid array (less than 5.18 mm), it can still achieve wide-angle scanning of the radiation beam in such a large frequency range, and the suppression of grating lobes is realized through the spiral-shaped irregular array arrangement. Here, if the constraint of the radiation element on the bandwidth is removed, this spiral-shaped irregular array can operate at higher frequencies without being restricted by the traditional grating lobe suppression conditions, such as Figure 13 As shown, this array can still achieve wide-angle scanning of the radiation beam at 60 GHz without being significantly affected by grating lobes on the performance. Thus, in this example, through the spiral-shaped irregular array based on AiP, this phased array antenna has broadband or multi-band antenna performance.

[0086] In addition, taking the application of beam scanning of ±60° realized by the existing regular rectangular grid array as an example, if the element spacing is d, restricted by the grating lobe constraint conditions, the theoretical highest frequency that can meet the application requirements is:

[0087] [[ID=ID=11]]

[0088] where c is the speed of light. The lowest frequency of the phased array is restricted by the antenna element size and the mutual coupling characteristics in the array, so the lowest frequency is:

[0089]

[0090] Thus, the operating bandwidth of this phased array is:

[0091]

[0092] The corresponding theoretical relative bandwidth of the array is:

[0093]

[0094] Here, taking d = 6.5 mm as an example, the corresponding highest frequency , the lowest frequency , and it cannot achieve full coverage of the Ka band or coverage of the Ka satellite transceiver frequency bands (17.1~21.2 GHz and 28.1~31.0 GHz).

[0095] It can be seen therefrom that in the existing encapsulated phased array antenna, the lowest frequency is difficult to reduce due to the limitations of the antenna element form and the AiP process, and it is impossible to support a wider operating bandwidth or multi-band applications across frequency bands. Therefore, expanding the antenna bandwidth can only be achieved by breaking through the theoretical highest frequency determined by the grating lobe constraint conditions. The arrangement of the irregular encapsulated antenna array 2 adopted in this application can not only be used to eliminate the grating lobe effect of the gap of the AiP phased array antenna, but also utilize its irregularity to deserialize, so as to reduce the frequency dependence of the antenna array, which is called the frequency dependence elimination of the array antenna. The broadband or multi-band antenna performance is realized through the frequency dependence elimination of the array antenna, and at the same time, the wide-angle scanning of the radiation beam in a larger range is realized.

[0096] The embodiments of the present application have been introduced in detail above. Specific examples are used in this article to elaborate on the principle and implementation manner of the present application. The description of the above embodiments is only used to help understand the method and its core idea of the present application. At the same time, any changes or deformations made by those skilled in the art based on the idea of the present application, within the specific implementation manner and application scope of the present application, all belong to the protection scope of the present application. In summary, the content of this specification should not be construed as a limitation to the present application.

Claims

1. An encapsulated phased array antenna, characterized in that, Comprising: Hybrid motherboard; Packaged antenna array, comprising: A plurality of packaged antenna modules mounted on the hybrid motherboard, the plurality of packaged antenna modules being distributed in a spiral trajectory, and each of the plurality of packaged antenna modules rotating along the tangent direction of the spiral trajectory at the corresponding position; from the center to the edge direction, the density of the packaged antenna modules gradually decreases; the spiral trajectory is an Archimedean spiral curve; The tangential direction angle of any one of the encapsulated antenna modules rotating along the tangent direction of the spiral trajectory is as follows: Wherein, and are respectively the abscissas of two adjacent ones of the encapsulated antenna modules, and are respectively the ordinates of two adjacent ones of the encapsulated antenna modules, is the sequence number of the encapsulated antenna module on the spiral trajectory, and increases sequentially as the polar radius increases, and N is the total number of the encapsulated antenna modules on the spiral trajectory.

2. The encapsulated phased array antenna according to claim 1, wherein Each of the plurality of packaged antenna modules includes: Chip packaging layer mounted on the hybrid motherboard; Antenna radiation layer connected to the chip packaging layer, the surface of the antenna radiation layer having radiation antenna elements.

3. The encapsulated phased array antenna according to claim 2, wherein, The surface of the chip packaging layer has a BGA solder ball array, and the chip packaging layer is connected to the hybrid motherboard through the BGA solder ball array.

4. The encapsulated phased array antenna according to claim 1, wherein The hybrid motherboard is a multi-layer PCB hybrid board.

5. The encapsulated phased array antenna according to claim 1, wherein A feed RF network, a power supply network and a beam control line network are installed in the hybrid motherboard.

6. The encapsulated phased array antenna according to claim 1, characterized in that, The plurality of packaged antenna modules are distributed on the surface of the hybrid motherboard to form a plurality of the spiral trajectories, the plurality of spiral trajectories being rotationally symmetric about the geometric center of the target array surface to be formed, and the plurality of spiral trajectories not intersecting each other.

7. The encapsulated phased array antenna according to claim 1, wherein, The polar coordinate formula of the spiral trajectory is: Wherein, r is the polar radius of any point on the spiral trajectory, a is the distance between the starting point of the spiral trajectory and the pole of the polar coordinate system, b is the control dimension parameter for controlling the pitch between the spiral lines, and θ is the polar angle of the any point; The position point coordinates of the encapsulated antenna module are as follows: Wherein, is the abscissa of the corresponding packaged antenna module, is the ordinate of the corresponding packaged antenna module, is the polar angle of the corresponding packaged antenna module, is the polar radius of the corresponding packaged antenna module, is the sequence number of the packaged antenna module on the spiral trajectory, and increases sequentially with the increase of the polar radius, and N is the total number of the packaged antenna modules on the spiral trajectory.

8. The encapsulated phased array antenna according to claim 1, characterized in that, The distance between two adjacent ones of the encapsulated antenna modules on the spiral trajectory is as follows: Wherein, and are respectively the abscissas of two adjacent ones of the encapsulated antenna modules, and are respectively the ordinates of two adjacent ones of the encapsulated antenna modules, is the sequence number of the encapsulated antenna module on the spiral trajectory, and increases sequentially as the polar radius increases, and N is the total number of the encapsulated antenna modules on the spiral trajectory.

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