Chip resistor dispensing device

Abstract

The present invention provides a chip resistor dispensing device, which includes: a product conveying line, a dispensing table, a feeding mechanism and a fastening assembly. The product conveying line includes a track, a push cylinder and a plurality of loading jigs tightly together, the loading jig is provided with a center hole, the center hole is used to accommodate the chip resistor, the edge of the center hole is provided with a plurality of positioning strips, the push cylinder is used to push the loading jig to slide along the track, so that the loading jig is translated toward the dispensing table; the dispensing table is provided with a bracket, a liquid storage cylinder and a dispensing needle, the dispensing needle is provided on the liquid storage cylinder and the dispensing needle is arranged toward the track; the amount of thermal conductive glue is accurately controlled by the dispensing needle to avoid the instability of the bonding between the heat sink and the chip resistor due to too little thermal conductive glue; the excessive amount of thermal conductive glue is prevented from forming a bulge on the side of the product, and the probability of defects caused by the amount of thermal conductive glue is reduced; the dispensing and bonding processes are automated, which is conducive to improving product production efficiency.

Description

Technical Field

[0001] The invention relates to a chip resistor dispensing device, in particular to a chip resistor dispensing device. Background Art

[0002] High-power chip alloy resistors generate a lot of heat in actual applications. To maintain their normal operation, a heat sink needs to be added to assist in heat dissipation. In order to improve product production efficiency, the heat sink is generally bonded to the surface of the chip alloy resistor using thermal conductive adhesive.

[0003] like Figure 1 The chip resistor 20 shown has a heat sink 30 bonded to its outer wall, and the heat sink 30 includes a heat conducting portion 31 bonded to the chip resistor 20 and a plurality of heat dissipating fins 32 distributed at intervals. When assembling the resistor product, it is necessary to apply a thermal conductive adhesive to the upper end surface of the chip resistor 20, and then bond the heat conducting portion 31 of the heat sink 30 to it.

[0004] When workers assemble the product according to the above process, the extrusion amount of thermal conductive adhesive is unstable, especially when the thermal conductive adhesive is too little, the connection between the chip resistor 20 and the heat sink 30 is easy to loosen, and because the thermal conductive adhesive is not fully spread on the surface of the chip resistor 20, the thermal conductivity is weak, affecting the heat dissipation effect of the product.

[0005] Therefore, how to provide a chip resistor dispensing device to automatically complete the coating operation of the thermal conductive adhesive and avoid product defects caused by the amount of thermal conductive adhesive is a problem that needs to be solved. Summary of the invention

[0006] The purpose of the present invention is to overcome the deficiencies in the prior art and provide a chip resistor dispensing device to replace workers in automatic dispensing, accurately control the amount of thermal conductive glue used, and reduce the defect rate caused by the dispensing process.

[0007] The objective of the present invention is achieved through the following technical solutions:

[0008] A chip resistor dispensing device, comprising: a product conveying line, a dispensing table, a feeding mechanism and a fastening assembly;

[0009] The product conveying line includes a track, a push cylinder and a plurality of loading jigs closely attached together, the loading jig is provided with a center hole, the center hole is used to accommodate a chip resistor, a plurality of positioning strips are provided at the edge of the center hole, and the push cylinder is used to push the loading jig to slide along the track so that the loading jig is translated toward the dispensing station;

[0010] The dispensing table is provided with a bracket, a liquid storage cylinder and a dispensing needle, wherein the dispensing needle is arranged on the liquid storage cylinder and the dispensing needle is arranged toward the track;

[0011] The loading mechanism is used to place the heat sink on the surface of the chip resistor;

[0012] The fastening assembly is used to press the heat sink.

[0013] In one of the embodiments, the track includes two frames arranged opposite to each other, the frames are provided with limiting edges, and the limiting edges are in contact with the upper end surface of the loading fixture.

[0014] In one of the embodiments, the product conveyor line also includes a floating slider, a avoidance groove is provided at the bottom of the loading jig, the floating slider passes through the center hole and extends into the avoidance groove; a groove is provided in the track, a guide bar is provided in the groove, the length of the guide bar is less than the length of the groove, the guide bar is located on the side of the groove close to the pushing cylinder, and when the loading jig slides along the track, the bottom of the floating slider is in contact with the guide bar or the groove.

[0015] In one embodiment, two ends of the guide strip are provided with inclined surfaces.

[0016] In one of the embodiments, the guide strip and the groove are detachably connected.

[0017] In one of the embodiments, the thickness of the guide strip is greater than the depth of the groove.

[0018] In one embodiment, the thickness of the positioning strip is smaller than the thickness of the chip resistor.

[0019] In one of the embodiments, the feeding mechanism includes a vibration plate, a straight vibration guide rail, a drop tube and a material shifting cylinder located on the drop tube, the straight vibration guide rail drives the heat sinks to enter the drop tube one by one, the drop tube is arranged toward the track, and the material shifting cylinder is provided with a push plate and L-shaped external teeth, the L-shaped external teeth are rotatably arranged on the push plate, and a torsion spring is provided between the push plate and the L-shaped external teeth, and the L-shaped external teeth are provided with support feet.

[0020] In one of the embodiments, a latch is provided on the drop tube, the end of the latch extends into the inner cavity of the drop tube, and the latch is used to prevent the heat sink from falling.

[0021] In one of the embodiments, a slide is provided on the bracket.

[0022] The above chip resistor dispensing device has the following advantages:

[0023] 1. The amount of thermal conductive adhesive can be accurately controlled by the dispensing needle to avoid the instability of the bonding between the heat sink and the chip resistor due to too little thermal conductive adhesive, and the thermal conductive adhesive coating on the surface of the chip resistor can be more uniform, thereby improving the thermal conductivity effect.

[0024] 2. Automating the dispensing and bonding process is conducive to improving product production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments are briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without creative work.

[0026] Figure 1 It is a schematic diagram of the assembly of the chip resistor and the heat sink;

[0027] Figure 2 It is a structural schematic diagram of a chip resistor dispensing device;

[0028] Figure 3 It is a front view of the chip resistor dispensing device;

[0029] Figure 4 It is a schematic diagram of the cooperation between the floating slider and the guide bar;

[0030] Figure 5 is a cross-sectional schematic diagram of the feeding mechanism;

[0031] Figure 6 This is a schematic diagram of the disassembly of the loading fixture;

[0032] Figure 7 This is a diagram showing the matching state of the L-shaped external teeth and the heat sink inside the blanking tube;

[0033] Figure 8 It is a schematic diagram of the flipping of the L-shaped outer teeth when the material-discharging cylinder is retracted;

[0034] Fig. 9 It is a schematic diagram of the cooperation between the L-shaped outer teeth and the heat conduction part when the material discharging cylinder is extended.

[0035] Figure numerals: 10, chip resistor dispensing device; 100, product conveyor line; 110, track; 111, frame; 111a, limit edge; 112, groove; 113, guide strip; 113a, inclined surface; 120, push cylinder; 130, loading fixture; 131, center hole; 132, positioning strip; 133, avoidance groove; 140, floating slider; 200, dispensing table; 210, bracket; 211, slide table; 220, liquid storage cylinder; 230, dispensing needle; 300, feeding mechanism; 310, vibration plate; 320, straight vibration guide rail; 330, drop tube; 331, latch; 340, material dispensing cylinder; 341, push plate; 342, L-shaped external teeth; 342a, support foot; 400, fastening component. DETAILED DESCRIPTION

[0036] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present invention are given in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thoroughly understood.

[0037] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only and do not represent the only implementation method.

[0038] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0039] See also Figure 2 and Figure 3 The present invention provides a chip resistor dispensing device 10, which includes: a product conveying line 100, a dispensing station 200, a feeding mechanism 300 and a fastening assembly 400.

[0040] See also Figure 3 and Figure 6 The product conveyor line 100 includes a track 110, a pushing cylinder 120 and a plurality of loading jigs 130 that are closely attached to each other. The loading jig 130 is provided with a center hole 131, and the center hole 131 is used to accommodate the chip resistor 20. A plurality of positioning strips 132 are provided on the edge of the center hole 131. The pushing cylinder 120 is used to push the loading jig 130 to slide along the track 110 so that the loading jig 130 can be translated toward the dispensing station 200.

[0041] See also Figure 2 and Figure 3 A bracket 210 , a liquid storage cylinder 220 and a glue dispensing needle 230 are provided on the glue dispensing station 200 . The glue dispensing needle 230 is disposed on the liquid storage cylinder 220 and is disposed toward the track 110 .

[0042] The loading mechanism 300 is used to place the heat sink 30 on the surface of the chip resistor 20;

[0043] The fastening assembly 400 is used to press the heat sink 30 .

[0044] See also Figure 3 It should be noted that the dispensing station 200 , the feeding mechanism 300 and the fastening assembly 400 are sequentially arranged along the extension direction of the track 110 .

[0045] See also Figure 2 , Figure 3 and Figure 6 The working principle of the chip resistor dispensing device 10 is as follows:

[0046] The processed chip resistor 20 is placed in the central hole 131 of the loading jig 130 , with one chip resistor 20 stacked on each loading jig 130 , and the positioning strip 132 contacts the side of the chip resistor 20 to provide positioning;

[0047] The output end of the push cylinder 120 extends out, pushes the carrier jig 130 forward along the track 110 and then retracts. When one of the carrier jigs 130 in the track 110 moves below the dispensing needle 230, the dispensing needle 230 starts to extrude the thermal conductive glue toward the chip resistor 20 in the carrier jig 130, and the bracket 210 drives the liquid storage cylinder 220 to translate, so that the dispensing needle 230 coats the thermal conductive glue on the surface of the chip resistor 20, completing the dispensing operation;

[0048] At the same time, after the push cylinder 120 is retracted, a gap is generated between the output end of the push cylinder 120 and the material carrier 130 in the track 110, and a new material carrier 130 is filled into the gap by the conveyor belt upstream of the dispensing device. In this way, when the output end of the push cylinder 120 is extended again, all the material carriers 130 in the track 110 can be pushed forward once, so that the material carrier 130 that has completed the dispensing operation is moved to the loading mechanism 300, and the next material carrier 130 is pushed to the dispensing station 200 to prepare for the next dispensing operation, thereby pushing the material carrier 130 to intermittently advance along the track 110, so that the material carrier 130 enters the working range of the dispensing station 200, the loading mechanism 300 and the fastening assembly 400 in turn;

[0049] After the dispensing operation is completed, the feeding mechanism 300 places the heat sink 30 on the chip resistor 20 ; and then the fastening assembly 400 presses the heat sink fin 32 so that the heat conducting portion 31 and the surface of the chip resistor 20 are in close contact.

[0050] Among them, the liquid storage cylinder 220 is connected to an external air pump (not shown in the figure), and the air pump injects pressurized air into the liquid storage cylinder 220. The opening and closing of the glue dispensing needle 230 is controlled by the control console (not shown in the figure). When the glue dispensing needle 230 is opened, the thermal conductive glue in the liquid storage cylinder 220 will be squeezed out from the glue dispensing needle 230 under the pressure of pressurized air. Therefore, by controlling the opening time of the glue dispensing needle 230, the extrusion amount of the thermal conductive glue can be accurately controlled.

[0051] See also Figure 2 and Figure 3 Preferably, a slide 211 is provided on the bracket 210. When the dispensing needle 230 extrude the thermal conductive adhesive, the slide 211 drives the liquid storage cylinder 220 to translate, so that the dispensing needle 230 moves along the surface of the chip resistor 20, and then the thermal conductive adhesive is coated on the surface of the chip resistor 20.

[0052] The liquid storage cylinder 220 and the dispensing needle 230 cooperate to accurately control the extrusion amount of the thermal conductive adhesive, so that the amount of adhesive discharged each time is consistent and controllable, ensuring that the heat sink 30 is firmly bonded and that the thermal conductive adhesive can be well spread on the surface of the chip resistor 20, thereby improving the heat dissipation capacity of the product.

[0053] It should be noted that the above scheme solves the problem of unstable extrusion of thermal conductive adhesive, and avoids the problem that the heat sink 30 is not firmly bonded due to too little thermal conductive adhesive, and the thermal conductive adhesive does not cover the chip resistor 20. However, when bonding the heat sink 30 to the chip resistor 20, it is necessary to apply pressure to the heat sink 30 through the fastening component 400. When the thermal conductive adhesive between the heat conductive part 31 and the chip resistor 20 is squeezed, it will overflow from the junction of the heat sink 30 and the chip resistor 20. These extruded thermal conductive adhesives solidify on the side of the product to form bulges, affecting the appearance and size of the product, resulting in the product being unable to be installed normally. It needs to be scraped off before shipment, and the products with abnormal appearance are sorted out through CCD detection, and then the cured thermal conductive adhesive on the outer wall is trimmed. This process not only increases the manufacturing cost of the equipment, but also increases the production process of the chip resistor; at the same time, the overflowing thermal conductive adhesive easily bonds the chip resistor 20 with other surrounding objects, resulting in the inability to cut materials normally.

[0054] See also Figure 5 and Figure 7 To solve the above problem, the track 110 includes two frames 111 arranged opposite to each other, and a limiting edge 111a is provided on the frame 111. The limiting edge 111a is fitted with the upper end surface of the carrier jig 130, so that the carrier jig 130 and the track 110 are fitted together to prevent the carrier jig 130 from separating from the track 110.

[0055] See also Figure 3 and Figure 4The product conveyor line 100 also includes a floating slider 140. A avoidance groove 133 is opened at the bottom of the loading fixture 130. The center hole 131 is connected to the avoidance groove 133. The floating slider 140 passes through the center hole 131 and extends into the avoidance groove 133. The chip resistor 20 is placed on the upper end surface of the floating slider 140.

[0056] A groove 112 is opened in the track 110, and a guide bar 113 is provided in the groove 112. The length of the guide bar 113 is smaller than the length of the groove 112. The guide bar 113 is located on the side of the groove 112 close to the pushing cylinder 120. When the carrier fixture 130 slides along the track 110, the bottom of the floating slider 140 is in contact with the guide bar 113 or in contact with the groove 112.

[0057] After the material carrier 130 enters the position of the track 110 , it contacts the frame 111 , and the limiting edge 111 a buckles the upper end surface of the material carrier 130 , so that the material carrier 130 will not jump when moving along the track 110 .

[0058] The principle of removing the overflowed thermal conductive adhesive during the dispensing process is as follows:

[0059] See also Figure 3 and Figure 4 When the loading jig 130 moves forward along the track 110, the avoidance groove 133 at the bottom of the loading jig 130 passes through the guide bar 113, and the floating slider 140 is fitted with the guide bar 113 and is lifted up by the guide bar 113, so that the chip resistor 20 placed on the floating slider 140 rises. Lifting the chip resistor 20 can shorten the distance between the surface of the chip resistor 20 and the dispensing needle 230, so that the dispensing needle 230 can coat the thermal conductive glue on the surface of the chip resistor 20; preferably, the guide bar 113 extends from at least the dispensing table 200 to the loading mechanism 300, ensuring that the floating slider 140 is always in a lifted state during the sliding process of the loading jig 130 from the dispensing table 200 to the loading mechanism 300, which is convenient for dispensing and placing the heat sink 30.

[0060] Since the length of the guide bar 113 is shorter than the length of the groove 112, when the material carrier 130 leaves the guide bar 113, the floating slider 140 descends and contacts the bottom of the groove 112. At this time, the chip resistor 20 on the floating slider 140 descends, so that the junction between the chip resistor 20 and the heat sink 30 moves to the bottom of the positioning bar 132. At the same time, the fastening component 400 applies pressure to make the heat sink 30 and the chip resistor 20 close to each other.

[0061] The carrier jig 130 continues to move forward, the heat sink 30 leaves the groove 112 and contacts the track 110 , the floating slider 140 rises again and returns to its initial height, the chip resistor 20 rises accordingly, and the interface between the chip resistor 20 and the heat sink 30 moves to above the positioning bar 132 .

[0062] It can be seen that when the bottom of the floating slider 140 contacts the guide strip 113 , the chip resistor 20 rises, shortening the distance between the chip resistor 20 and the glue dispensing needle 230 to facilitate the coating of thermal conductive glue, and raising the chip resistor 20 to assist the loading mechanism 300 to place the heat sink 30 .

[0063] It should be noted that when the bottom of the floating slider 140 contacts the groove 112, the chip resistor 20 descends, causing the interface between the chip resistor 20 and the heat sink 30 to sink into the center hole 131 and be wrapped by the hole wall of the center hole 131. Sealing this position can reduce the amount of thermal conductive adhesive overflowing when the fastening assembly 400 presses the heat sink 30.

[0064] Furthermore, after the loading fixture 130 leaves the position of the groove 112, the floating slider 140 is reset to make the junction between the chip resistor 20 and the heat sink 30 rise. During this process, a small amount of thermal conductive adhesive that overflows due to the pressure on the heat sink 30 will be smoothed and scraped off by the hole wall of the center hole 131, which can prevent the thermal conductive adhesive from forming a bulge on the side of the product after curing. After the floating slider 140 is reset, the junction between the chip resistor 20 and the heat sink 30 is located above the positioning bar 132, ensuring that the positioning bar 132 will not be bonded to the chip resistor 20.

[0065] On the other hand, after the junction between the chip resistor 20 and the heat sink 30 is sunk, the positioning strip 132 contacts the outer wall of the heat sink 30, providing positioning for the heat sink 30, which can prevent the heat sink 30 from being laterally displaced during the pressing process of the fastening component 400, thereby keeping the heat sink 30 and the chip resistor 20 aligned after bonding, thereby improving the bonding quality of the product.

[0066] It should be emphasized that the cooperation of the floating slider 140, the guide bar 113, and the groove 112 can automatically realize the lifting and lowering action of the chip resistor 20 during the translation of the carrier fixture 130, and this process only requires the pushing cylinder 120 to provide power to move the carrier fixture 130 forward, and no additional power accessories are required, which reduces the equipment manufacturing cost, has a simple structure, and is convenient for later maintenance.

[0067] See also Figure 3 and Figure 4 Preferably, both ends of the guide bar 113 are provided with inclined surfaces 113 a so that the floating slider 140 can smoothly enter and leave the guide bar 113 .

[0068] Preferably, the guide bar 113 is detachably connected to the groove 112, and the thickness of the guide bar 113 is greater than the depth of the groove 112. When producing chip resistors 20 of different specifications, the guide bar 113 of corresponding thickness can be replaced to improve the universality of the device.

[0069] Preferably, the thickness of the positioning strip 132 is smaller than the thickness of the chip resistor.

[0070] See also Figure 2 , Figure 5 and Figure 8 In one embodiment, the feeding mechanism 300 includes a vibration plate 310, a straight vibration guide rail 320, a material drop tube 330 and a material shifting cylinder 340 located on the material drop tube 330. The straight vibration guide rail 320 drives the heat sinks to enter the material drop tube 330 one by one. The material drop tube 330 is arranged toward the track 110. A push plate 341 and an L-shaped outer tooth 342 are provided on the material shifting cylinder 340. The L-shaped outer tooth 342 is rotatably arranged on the push plate 341, and a torsion spring (not shown) is provided between the push plate 341 and the L-shaped outer tooth 342. The L-shaped outer tooth 342 is provided with a support foot 342a. The support foot 342a provides a limit for limiting the rotation amplitude of the L-shaped outer tooth 342. When the support foot 342a is in contact with the push plate 341, the L-shaped outer tooth 342 cannot continue to rotate.

[0071] A latch 331 is provided on the drop tube 330 , and the end of the latch 331 extends into the inner cavity of the drop tube 330 . The latch 331 is used to prevent the heat sink from falling.

[0072] An opening is formed on one side of the drop pipe 330 close to the rail 110 .

[0073] See also Figures 7 to 9 , the working principle of the feeding mechanism 300 is as follows:

[0074] The vibration plate 310 and the straight vibration guide rail 320 cooperate to transport the heat sink 30 to the position of the drop tube 330. The drop tube 330 is open at both ends, and the drop tube 330 is vertically arranged above the track 110. The heat sink 30 enters from the upper end of the drop tube 330 and slides down along the inner wall of the drop tube 330 until the heat conducting part 31 abuts against the pin 331. The subsequent falling heat sinks 30 are stacked together, and the pin 331 contacts the bottom heat sink 30 to provide resistance to prevent it from falling. At this time, the L-shaped external teeth 342 contact the bottom of the heat conducting part 31 of the heat sink 30, and the auxiliary pin 331 supports these stacked heat sinks 30.

[0075] See also Figure 8 When the heat sink 30 needs to be placed on the chip resistor 20, the output end of the material-dispensing cylinder 340 begins to retract, and at this time, the push plate 341 rises, and the L-shaped outer teeth 342 rise with the push plate 341, and also overcome the elastic force of the torsion spring to flip, and after the material-dispensing cylinder 340 retracts, it moves to the top of the heat-conducting part 31, and the L-shaped outer teeth 342 are reset under the action of the torsion spring;

[0076] See also Fig. 9Then, the output end of the material-moving cylinder 340 begins to extend, and the L-shaped outer tooth 342 descends with the push plate 341. When it contacts the upper end of the heat-conducting part 31, it applies a thrust to the heat-conducting part 31, so that it overcomes the resistance of the latch 331 and thus detaches from the drop tube 330, and finally falls onto the loading fixture 130 to fit the chip resistor 20.

[0077] In the above process, the heat sink 30 at the bottom is pushed out by the L-shaped outer teeth 342, and the penultimate heat sink falls down under the action of gravity until it is blocked by the latch 331, preparing for the next heat sink 20 loading.

[0078] It should be noted that the L-shaped outer teeth 342, the push plate 341 and the torsion spring cooperate to form a ratchet-like structure. When the L-shaped outer teeth 342 are located at the lower side of the heat conducting part 31, the direction of the external force applied by the heat conducting part 31 to the L-shaped outer teeth 342 is downward. Therefore, when the material-discharging cylinder 340 retracts, the L-shaped outer teeth can flip over; when the L-shaped outer teeth 342 are located above the heat conducting part 31 and the material-discharging cylinder 340 extends, the direction of the external force applied by the heat conducting part 31 to the L-shaped outer teeth 342 is upward. The external force in this direction causes the support leg 342a to remain in contact with the push plate 341, so that the L-shaped outer teeth 342 cannot rotate. Therefore, the thrust of the push plate 341 when it descends is transmitted to the heat sink 30 through the L-shaped outer teeth 342, thereby pushing the heat sink 30 to break away from the latch 331 and fall.

[0079] The above-mentioned embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. A chip resistor dispensing device, used for bonding a heat sink to a chip resistor, characterized in that: include: Product conveyor lines, dispensing stations, loading mechanisms and fastening components; The product conveying line includes a track, a push cylinder and a plurality of loading jigs closely attached together, the loading jig is provided with a center hole, the center hole is used to accommodate a chip resistor, a plurality of positioning strips are provided at the edge of the center hole, and the push cylinder is used to push the loading jig to slide along the track so that the loading jig is translated toward the dispensing station; The dispensing table is provided with a bracket, a liquid storage cylinder and a dispensing needle, wherein the dispensing needle is arranged on the liquid storage cylinder and the dispensing needle is arranged toward the track; The loading mechanism is used to place the heat sink on the surface of the chip resistor; The fastening assembly is used to press the heat sink; The track includes two frames arranged opposite to each other, and a limiting edge is provided on the frame, and the limiting edge is in contact with the upper end surface of the carrier jig; the product conveyor line also includes a floating slider, and an avoidance groove is provided at the bottom of the carrier jig, and the floating slider passes through the center hole and extends into the avoidance groove; a groove is provided in the track, and a guide strip is provided in the groove, and the length of the guide strip is less than the length of the groove. The guide strip is located on the side of the groove close to the pushing cylinder, and when the carrier jig slides along the track, the bottom of the floating slider is in contact with the guide strip or the groove.

2. The chip resistor dispensing device according to claim 1, characterized in that: Both ends of the guide strip are provided with inclined surfaces.

3. The chip resistor dispensing device according to claim 1, characterized in that: The guide strip and the groove are detachably connected.

4. The chip resistor dispensing device according to claim 1, characterized in that: The thickness of the guide bar is greater than the depth of the groove.

5. The chip resistor dispensing device according to claim 1, characterized in that: The thickness of the positioning strip is smaller than the thickness of the chip resistor.

6. The chip resistor dispensing device according to claim 1, characterized in that: The feeding mechanism includes a vibration plate, a straight vibration guide rail, a drop tube and a material shifting cylinder located on the drop tube. The straight vibration guide rail drives the heat sinks to enter the drop tube one by one. The drop tube is arranged toward the track. A push plate and L-shaped external teeth are provided on the material shifting cylinder. The L-shaped external teeth are rotatably arranged on the push plate, and a torsion spring is provided between the push plate and the L-shaped external teeth. The L-shaped external teeth are provided with supporting feet.

7. The chip resistor dispensing device according to claim 6, characterized in that: The drop tube is provided with a latch, the end of which extends into the inner cavity of the drop tube, and the latch is used to prevent the heat sink from falling.

8. The chip resistor dispensing device according to claim 1, characterized in that: A sliding platform is arranged on the bracket.

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