Single-package data storage device

Abstract

A data storage device includes a controller, one or more memory devices, and one or more passive components encapsulated in a single package. The controller, the memory device, and the passive component are directly mounted to a printed circuit board (PCB) of the data storage device. The location of the controller relative to the one or more memory devices enables the data storage device to use shorter signal traces. The shorter signal trace facilitates an increase in read and / or write speed of the data storage device as well as other benefits.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to U.S. Provisional Application No. 63 / 505,639, filed on June 1, 2023, and entitled “SINGLE PACKAGE DATA STORAGE DEVICE,” the disclosure of which is hereby incorporated by reference in its entirety. Background Art

[0003] More and more electronic devices use various data storage devices to process and store data. Specifically, solid-state drives (SSDs) are becoming increasingly popular. For example, when compared to traditional hard disk drives (HDDs), SDDs have better read and write speeds, are more reliable, and are more compact.

[0004] However, as the demand for SSDs has increased, so has the need for increased storage capacity and faster speeds. As higher capacity and faster SSDs have been produced, SSDs have become more complex. The more complex the SSD, the more expensive the manufacturing process becomes in terms of time and cost.

[0005] For example, a higher capacity SSD generally requires a higher capacity memory device. To accommodate a higher capacity memory device, the printed circuit board (PCB) of the SSD generally needs to have additional layers. As more layers are added to the PCB, additional vias are also added to the PCB and the trace routing becomes more complex. In addition, each component of the SSD (e.g., the controller and each memory device) may need to be tested individually.

[0006] Therefore, for data storage devices such as SSDs, achieving higher capacity and faster speed without increasing manufacturing complexity would be beneficial. Summary of the invention

[0007] The present application describes a data storage device having a controller, one or more memory devices, and one or more passive components integrated into a single package. The controller, one or more memory devices, and one or more passive components are mounted directly to the surface of a printed circuit board (PCB) of the data storage device. The one or more memory devices are connected to the controller in a communicative manner using signal traces associated with the PCB. Similarly, the controller is connected to a connector or interface of the PCB in a communicative manner using additional signal traces associated with the PCB. A molding compound is used to encapsulate the controller, one or more memory devices, and one or more passive components.

[0008] Because the controller and one or more memory devices are mounted directly to the surface of the same PCB, there is no need to use a ball grid array (BGA) and solder balls. In addition, the layout of the controller relative to the one or more memory devices improves the trace routing between the controller and the one or more memory devices. For example, when compared to current solutions, the layout of the controller relative to the one or more memory devices shortens the signal / communication path. The shorter signal / communication path facilitates increased read and / or write speeds of the data storage device.

[0009] Thus, the present application describes a data storage device including a printed circuit board (PCB). A controller is mounted directly to a surface of the PCB. A memory device is also mounted directly to the surface of the PCB and is coupled to signal traces associated with the PCB in a communicative manner. The signal traces form a communication path between the memory device and the controller. A cover encapsulates the controller and the memory device.

[0010] A method for assembling a data storage device is also described. In one example, the method includes coupling a controller to a surface of a printed circuit board (PCB). One or more passive components are also coupled to the surface of the PCB. A reflow soldering process is performed to secure the controller and the one or more passive components to the surface of the PCB. A memory device is disposed on the surface of the PCB. The memory device is electrically coupled to signal traces associated with the PCB. A single cover is formed around the controller, the one or more passive components, and the memory device.

[0011] The present application also describes a data storage device. In one example, the data storage device includes a printed circuit board (PCB). A first storage device is directly mounted to the surface of the PCB. The first storage device is connected to a first signal device associated with the PCB in a manner that can communicate. A second storage device is also directly mounted to the surface of the PCB. The second storage device is connected to a second signal device associated with the PCB in a manner that can communicate. A controller device is directly mounted to the surface of the PCB between the first storage device and the second storage device. The controller device is connected to the first storage device in a manner that can communicate using the first signal device, and is also connected to the second storage device in a manner that can communicate using the second signal device. A covering device encapsulates the first storage device, the second storage device, and the controller device.

[0012] This Summary is provided to introduce some concepts in a simplified form that are further described in the Detailed Description below. This Summary is not intended to identify key features or essential features of the claimed subject matter, nor is it intended to be used to limit the scope of the claimed subject matter. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Non-limiting and non-exhaustive examples are described with reference to the following figures.

[0014] Figure 1 A conventional data storage device according to an example is shown;

[0015] Figure 2 A data storage device having a memory device and a controller integrated within a single package is shown according to one example.

[0016] FIG. 3A to FIG. 3E A method or process for manufacturing a data storage device according to one example is shown. DETAILED DESCRIPTION

[0017] In the following detailed description, reference is made to the accompanying drawings that form a part of the detailed description, and in the accompanying drawings, specific embodiments or examples are shown by way of illustration. These aspects may be combined, other aspects may be utilized, and the structure may be changed without departing from the present disclosure. Therefore, the following detailed description should not be considered to have a limiting meaning, and the scope of the present disclosure is defined by the appended claims and their equivalents.

[0018] The present application describes a data storage device in which a controller, one or more memory devices, and one or more passive components are encapsulated in a single package. Unlike current data storage devices in which the controller and memory devices are separately packaged and connected to a printed circuit board (PCB) of the data storage device using a ball grid array (BGA), the controller, one or more memory devices, and one or more passive components of the data storage device of the present disclosure are directly mounted to the PCB.

[0019] In addition, the layout of the controller relative to the one or more memory devices improves trace routing between the controller and the one or more memory devices when compared to current data storage devices. For example, the layout of the controller relative to the one or more memory devices shortens signal / communication paths when compared to current solutions. Shorter signal / communication paths facilitate increased read and / or write speeds of the data storage device.

[0020] In addition to the benefits listed above, shorter signal / communication paths may provide additional technical benefits including, but not limited to, reduced resistance, better signal transmission between the controller and the memory device, and / or lower overall operating temperature of the data storage device.

[0021] will be relative to Figures 1 to 3E These benefits and other examples are shown and described in more detail.

[0022] Figure 11 shows an existing data storage device 100 according to one example. The data storage device 100 may be a solid state drive (SSD) or an enterprise solid state drive (eSSD). Figure 1 In the example shown, the data storage device 100 has a memory device package 105 that is separate from a controller package 110 .

[0023] The memory device package 105 includes one or more NAND die stacks 120 mounted to a substrate 125. Bond wires 130 are used to communicatively couple the NAND die stacks 120 to signal traces 135 disposed within the substrate 125. The one or more NAND die stacks 120 and the bond wires 130 may be encapsulated by a cover 140. In one example, the cover 140 is a molding compound or other such material.

[0024] The memory device package 105 is mounted to a printed circuit board (PCB) 145 of the data storage device 100. In the example shown, the memory device package 105 is mounted to the PCB 145 using solder balls that are part of or otherwise form a ball grid array (BGA) 150 of the memory device package 105. One or more of the solder balls of the BGA 150 of the memory device package 105 are communicatively coupled to a first trace 155 (or a first set of traces) disposed within the PCB 145.

[0025] The controller device package 110 includes a controller 160. The controller 160 is mounted to a substrate 165 of the controller device package 110 using one or more bump pads and / or copper pillars 170. The one or more bump pads and / or copper pillars 170 are communicatively coupled to corresponding signal traces 175 within the substrate 165 of the controller device package 110. The controller 160 and the one or more bump pads and / or copper pillars 170 are encapsulated by a cover 180. In one example, the cover 180 is a molding compound or other such material.

[0026] The controller device package 110 is mounted to the PCB 145 of the data storage device 100 using solder balls that are part of or otherwise form a BGA 185 associated with the controller device package 110. One or more of the solder balls are communicatively coupled to a second trace 190 (or a second set of traces) disposed within the PCB 145.

[0027] For example, a first set of solder balls of a BGA 185 associated with a controller device package 110 is communicatively coupled to a first trace 155 (or a first set of traces). Thus, the first trace 155 is used to communicatively couple one or more NAND die stacks 120 of a memory device package 105 to a controller 160 of the controller package 110.

[0028] For example, and if Figure 1 As shown by the first type of shading in FIG. 1 , the NAND die stack 120 is coupled (via bonding wires 130) to a signal trace 135 disposed in the substrate 125 of the memory device package 105. The signal trace 135 is electrically coupled to one or more solder balls of a BGA 150 associated with the memory device package 105. The one or more solder balls of the BGA 150 associated with the memory device package 105 are also coupled in a communicative manner to a first signal trace 155 (or a first set of signal traces) disposed within the PCB 145 of the data storage device 100.

[0029] The first trace 155 extends through the PCB 145 of the data storage device 100 and is communicatively coupled to one or more solder balls of a BGA 185 associated with the controller device package 110. As previously noted, the solder balls of the BGA 185 associated with the controller device package 110 are communicatively coupled to the signal trace 175 within the substrate 165 of the controller device package 110. The signal trace 175 is also communicatively coupled to the controller 160 of the controller device package 110.

[0030] A second set of solder balls of BGA 185 associated with controller device package 110 are communicatively coupled to second traces 190 (or a second set of traces) associated with PCB 145. In this example, second traces 190 are used to couple the controller to an interface (e.g., a connector) of data storage device 100.

[0031] One or more passive components 195 (eg, capacitors, resistors) may also be mounted on the surface of the PCB 145 of the data storage device 100. As shown, the one or more passive components 195 are not included within the memory device package 105 or the controller package 110.

[0032] Figure 1The data storage device 100 shown in FIG. 1 requires a PCB 145 having many layers. Some of these layers are required because the memory device package 105 is separate from the controller package 110. For example, because the memory device package 105 and the controller package 110 are associated with different BGAs, additional layers, vias, and traces are required. When additional layers, traces, and vias are added, trace routing becomes more difficult and more complicated.

[0033] Another disadvantage of the data storage device 100 is that the memory device package 105 is typically tested separately from the controller device package 110. The separate testing process may delay or slow down the production of the data storage device 100.

[0034] The use of solder balls and / or BGAs is another disadvantage of the data storage device 100. For example, whenever solder balls are used, there is a risk that air traps (e.g., solder voids) may form within the solder balls during the reflow soldering process. Solder voids reduce the reliability of the connections between the various components, which may adversely affect the performance of the data storage device 100.

[0035] Another disadvantage of the data storage device 100 is the total length of the traces within the PCB 145. As the length of the traces increases, the resistance increases, the signal transmission degrades and the operating temperature of the data storage device may increase. All of these factors may adversely affect the performance of the data storage device 100.

[0036] Figure 2 A data storage device 200 is shown having a memory device 205 and a controller 210 integrated within a single package 215 according to one example. The data storage device 200 may be an SSD, an eSSD, or another data storage device. As will be explained, the data storage device 200 solves the above problems with respect to Figure 1 Various disadvantages of the data storage device 100 are shown and described.

[0037] As previously noted, the data storage device 200 includes a memory device 205. Figure 2 In the example shown in , the data storage device 200 includes two memory devices 205, which are positioned on either side of the controller 210. In one example, each memory device 205 can be a stack of NAND memory dies. Although a stack of NAND memory dies is specifically mentioned, the memory devices 205 can be any volatile or non-volatile memory device.

[0038] Each memory device 205 is coupled to a surface of a printed circuit board (PCB) 220 of the data storage device 200. For example, each memory device 205 is directly coupled to the surface of the PCB 220. The memory device 205 may be coupled to the surface of the PCB 220 using any known surface mounting technology. However, the memory device 205 is coupled to the surface of the PCB 200 without using a BGA, a separate substrate, traces, etc. This is different from Figure 1 The memory device 120 of the data storage device 100 requires a separate substrate 125, signal traces 135, and BGA 150.

[0039] In one example, the bonding wires 225 communicatively couple the memory device 205 to a first signal trace 230 (or a first set of signal traces) associated with the PCB 220. Figure 2 As shown, the first signal trace 230 (shown by the first type of shading) electrically couples the memory device 205 to and / or communicatively couples it to the controller 210. For example, the first signal trace 230 may electrically couple the memory device 205 to and / or communicatively couple it to one or more connection points associated with the controller 210 (e.g., pads and / or posts for surface mounting or otherwise coupling the controller 210 to the PCB 220).

[0040] When set relative to Figure 1 The first signal trace 230 is substantially shorter when compared to the first trace 155 within the PCB 145 of the data storage device 100 shown and described, based on the location of each memory device 205 on the PCB 220 relative to the location of the controller 210. The shorter communication path between the controller 210 and the memory devices 205 improves the read and / or write speed of the data storage device 200, facilitates reduced resistance, enables better signal transmission between the controller 210 and the memory devices 205, and / or reduces the overall operating temperature of the data storage device 200.

[0041] The controller 210 is also mounted directly to the surface of the PCB 220. In one example, the controller 210 is mounted directly to the surface of the PCB 220 using surface mounting techniques and / or a reflow soldering process. For example, one or more pads (e.g., bump pads) and / or pillars 235 (e.g., copper pillars) may be used to surface mount the controller 210 to the PCB 220. Although pads and / or pillars 235 are specifically mentioned, other surface mounting techniques may also be used. However, in this example, the controller 210 is coupled to the surface of the PCB 220 without using a BGA, a separate substrate, traces, etc., which is different from Figure 1The controller 160 of the data storage device 100 requires a separate substrate 165, signal traces 175, and BGA 185.

[0042] In one example, the first subset of pads and / or posts 235 is used to electrically couple the controller 210 to and / or communicatively couple to the memory device 205. The second subset of pads and / or posts 235 can be electrically coupled to and / or communicatively couple to a second signal trace 240 (or a second set of signal traces) associated with the PCB 220. The second signal trace 240 can be used to communicatively couple the controller 210 to an interface 245 of the data storage device 200. In one example, the interface 245 can be a pin of a connector (e.g., an edge connector) extending from the PCB 220. For schematic illustration, the connection paths between the controller 210, the second signal trace 240, and the interface 245 are shown with a second type of shading (e.g., when compared to the first type of shading shown relative to the first signal trace 230).

[0043] In one example, due to the location of the controller 210 on the PCB 220, the length of the second signal trace 240 (or the second set of signal traces) may be shorter than that of the second signal trace 240 relative to the PCB 220. Figure 1 The length of the second trace 190 associated with the PCB 145 of the data storage device 100 is shown and described. In one example, a shorter communication path between the controller 210 and the interface 245 improves the read and / or write speed of the data storage device 200, causes a reduction in resistance, enables better signal transmission between the controller 210 and the interface 245, and / or reduces the overall operating temperature of the data storage device 200.

[0044] The data storage device 200 also includes one or more passive components 250. The one or more passive components 250 may be capacitors, resistors, or other electronic components. The one or more passive components 250 are also mounted on the surface of the PCB 220. In one example, the one or more passive components 250 are mounted to the surface of the PCB 220 using a reflow soldering process. The reflow soldering process used to mount the one or more passive components 250 on the PCB 220 may be the same as the reflow soldering process used to electrically couple the controller 210 to and / or communicatively couple to the PCB 220.

[0045] The data storage device 200 also includes a cover 255. In one example, the cover is a molding compound or other material. The molding compound can be any suitable molding compound (e.g., epoxy molding compound). In one example, the molding material can have heat dissipation properties. The cover 255 can encapsulate the memory device 205, the controller 210, the bonding wires 225, and / or one or more passive components 250.

[0046] FIG. 3A to FIG. 3E A method or process 300 for manufacturing a data storage device according to one example is shown. In one example, with respect to FIG. 3A to FIG. 3E The method or process 300 shown and described may be used to manufacture a device with respect to Figure 2 Data storage device 200 is shown and described.

[0047] like Figure 3A As shown, the method or process 300 may begin when the controller 305 is mounted directly to the surface of a printed circuit board (PCB) 310. In one example, the controller 305 is mounted directly to the surface of the PCB 310 using one or more pads 315 (e.g., bump pads) and / or one or more pillars 320 (e.g., copper pillars).

[0048] In one example, one or more pads 315 and / or one or more posts 320 are used to form a communication path between a first signal trace 325 (or a first group of signal traces) disposed in or otherwise associated with the PCB 310 and a second signal trace 330 (or a second group of signal traces) disposed in or otherwise associated with the PCB 310. For example, a first subset of pads 315 and / or posts 320 may be used to form a first communication path between the controller 305 and the first signal trace 325 (or a first group of signal traces), and a second subset of pads 315 and / or posts 320 may be used to form a second communication path between the controller 305 and the second signal trace 330 (or a second group of signal traces).

[0049] Figure 3B Another step in the method or process 300 is shown in which one or more passive components 335 are surface mounted to the PCB 310. The one or more passive components may be surface mounted to the PCB using any suitable mounting technique. Once the passive components 335 and the controller have been surface mounted to the PCB 310, a reflow soldering process may be used to secure the controller 305 and the one or more passive components to the PCB 310. In one example, the one or more passive components 335 may be mounted to the PCB 310 before or after the controller 305.

[0050] Figure 3C305. Still another step in the method or process 300 is shown. In this example, one or more memory devices 340 are directly coupled to the surface of the PCB 310. In one example, one memory device 340 may be disposed on a first side of the controller 305, while another memory device 340 is positioned on a second side of the controller 305. Although two memory devices 340 are shown, additional memory devices 340 may be surface mounted to the PCB 310 on various sides of the controller 320.

[0051] like Figure 3D As shown, process 300 continues when each memory device 340 is electrically coupled to PCB 310 using bonding wires 345. For example, bonding wires 345 are used to electrically couple each memory device 340 to and / or communicatively couple to a first signal trace 325 (or first set of signal traces) associated with PCB 310.

[0052] like Figure 3E As shown, the process 300 continues with disposing a cover 350 on the data storage device. In one example, the cover 350 is a molding compound that surrounds or encapsulates the controller 305, the memory device 340, the bonding wires 345, and the one or more passive components 335.

[0053] Based on the various examples described herein, examples of the present disclosure describe a data storage device, which includes: a printed circuit board (PCB); a controller, which is directly mounted to the surface of the PCB; a memory device, which is directly mounted to the surface of the PCB and is connected to a signal trace associated with the PCB in a manner that can communicate, and the signal trace forms a communication path between the memory device and the controller; and a cover, which encapsulates the controller and the memory device. In one example, the data storage device also includes one or more passive components directly mounted to the surface of the PCB. In one example, one or more passive components are encapsulated by the cover. In one example, one or more passive components are directly mounted to the surface of the PCB using a reflow soldering process. In one example, the controller is directly mounted to the surface of the PCB using a reflow soldering process. In one example, the cover is a molding compound. In one example, the controller is connected to an interface of the data storage device in a manner that can communicate using another signal trace associated with the PCB. In one example, the memory device is a stacked NAND memory die. In one example, the memory device is a first memory device and the data storage device also includes a second memory device mounted directly to a surface of the PCB such that the first memory device is positioned on a first side of the controller and the second memory device is positioned on a second side of the controller.

[0054] In one example, the present application also describes a method for assembling a data storage device, the method comprising: coupling a controller to a surface of a printed circuit board (PCB); and coupling one or more passive components to the surface of the PCB; performing a reflow soldering process to fix the controller and the one or more passive components to the surface of the PCB; coupling a memory device to the surface of the PCB; electrically coupling the memory device to a signal trace associated with the PCB; and encapsulating the controller, the one or more passive components, and the memory device with a single cover. In one example, the signal trace couples the memory device to the controller in a manner that enables communication. In one example, the single cover is composed of a molding compound. In one example, one or more bump pads and one or more copper pillars are used to couple the controller to the surface of the PCB. In one example, the method includes coupling the controller to a connection interface disposed on the surface of the PCB in a manner that enables communication. In one example, the memory device is a stacked NAND memory die.

[0055] In yet another example, the present application describes a data storage device, the data storage device comprising: a printed circuit board (PCB); a first storage device, the first storage device being directly mounted to the surface of the PCB and being connected to a first signal device associated with the PCB in a communicative manner; a second storage device, the second storage device being directly mounted to the surface of the PCB and being connected to a second signal device associated with the PCB in a communicative manner; a controller device, the controller device being directly mounted to the surface of the PCB between the first storage device and the second storage device, and being connected to the first storage device in a communicative manner using the first signal device and being connected to the second storage device in a communicative manner using the second signal device; and a cover device, the cover device encapsulating the first storage device, the second storage device and the controller device. In one example, the first storage device and the second storage device are composed of NAND memory tube cores. In one example, the data storage device also includes one or more electronic components connected to the surface of the PCB, wherein the one or more components are encapsulated by the cover device. In one example, the controller device is connected to a connection device of the data storage device in a communicative manner. In one example, the controller device is directly mounted to the surface of the PCB using a reflow soldering process.

[0056] The description and illustration of one or more aspects provided in this disclosure are not intended to limit or restrict the scope of this disclosure in any way. The various aspects, examples, and details provided in this disclosure are considered to be sufficient to convey ownership and enable others to make and use the best way of the disclosed content protected by the claims.

[0057] The disclosure protected by the claims should not be understood as being limited to any aspect, example or detail provided in the disclosure. Whether the various features are shown and described in combination or individually, it is intended that the various features may be selectively rearranged, included or omitted to produce various embodiments having a particular set of features. Having provided the description and illustration of the present application, those skilled in the art may envision variations, modifications and substitutions that fall within the spirit of the broader aspects of the general inventive concept embodied in the present application and that do not depart from the broader scope of the disclosure protected by the claims.

[0058] The use of names such as "first," "second," and the like to refer to elements herein does not generally limit the number or order of those elements. Rather, these names can be used as a method of distinguishing two or more elements or instances of elements. Thus, reference to a first element and a second element does not mean that only two elements may be used, nor does it mean that the first element must precede the second element. Additionally, unless otherwise specified, a group of elements may include one or more elements.

[0059] A term of the form "at least one of A, B, or C" or "A, B, C, or any combination thereof" used in the specification or claims means "A or B or C or any combination of these elements." For example, this term may include A, or B, or C, or A and B, or A and C, or A and B and C, or 2A, or 2B, or 2C, or 2A and B, etc. As an additional example, "at least one of A, B, or C" is intended to cover A, B, C, AB, AC, BC, and ABC, and multiples of the same member. Similarly, "at least one of A, B, and C" is intended to cover A, B, C, AB, AC, BC, and ABC, and multiples of the same member.

[0060] Similarly, as used herein, a phrase referring to a list of items linked with "and / or" refers to any combination of items. As an example, "A and / or B" is intended to cover A alone, B alone, or A and B together. As another example, "A, B, and / or C" is intended to cover A alone, B alone, C alone, A and B together, A and C together, B and C together, or A, B, and C together.

Claims

1. A data storage device comprising: Printed circuit board (PCB); A controller, the controller being directly mounted on the surface of the PCB; a memory device mounted directly to the surface of the PCB and communicatively coupled to signal traces associated with the PCB, the signal traces forming a communication path between the memory device and the controller; as well as A cover encapsulates the controller and the memory device.

2. The data storage device of claim 1, further comprising one or more passive components mounted directly to the surface of the PCB.

3. The data storage device according to claim 2, wherein: The one or more passive components are encapsulated by the cover.

4. The data storage device according to claim 2, wherein: The one or more passive components are mounted directly to the surface of the PCB using a reflow soldering process.

5. The data storage device according to claim 1, wherein: The controller is mounted directly to the surface of the PCB using a reflow soldering process.

6. The data storage device according to claim 1, wherein: The cover is a molded compound.

7. The data storage device according to claim 1, wherein: The controller is communicatively coupled to an interface of the data storage device using another signal trace associated with the PCB.

8. The data storage device according to claim 1, wherein: The memory device is a stack of NAND memory dies.

9. The data storage device according to claim 1, wherein: The memory device is a first memory device, and wherein the data storage device further comprises a second memory device mounted directly to the surface of the PCB such that the first memory device is positioned on a first side of the controller and the second memory device is positioned on a second side of the controller.

10. A method for assembling a data storage device, comprising: coupling the controller to a surface of a printed circuit board (PCB); coupling one or more passive components to the surface of the PCB; performing a reflow soldering process to secure the controller and the one or more passive components to the surface of the PCB; coupling a memory device to the surface of the PCB; electrically coupling the memory device to signal traces associated with the PCB; as well as The controller, the one or more passive components, and the memory device are enclosed with a single cover.

11. The method according to claim 10, wherein: The signal traces communicatively couple the memory device to the controller.

12. The method according to claim 10, wherein: The single cover is formed from a molded plastic.

13. The method according to claim 10, wherein: The controller is coupled to the surface of the PCB using one or more bump pads and one or more copper pillars.

14. The method of claim 10, further comprising communicatively coupling the controller to a connection interface disposed on the surface of the PCB.

15. The method according to claim 10, wherein: The memory device is a stack of NAND memory dies.

16. A data storage device comprising: Printed circuit board (PCB); a first memory device mounted directly to a surface of the PCB and communicatively coupled to a first signaling device associated with the PCB; a second memory device mounted directly to the surface of the PCB and communicatively coupled to a second signaling device associated with the PCB; a controller device mounted directly to the surface of the PCB between the first storage device and the second storage device and coupled to the first storage device in a communicative manner using the first signal device and coupled to the second storage device in a communicative manner using the second signal device; as well as A cover device encloses the first storage device, the second storage device and the controller device.

17. The data storage device according to claim 16, wherein: The first storage device and the second storage device are formed of NAND memory dies.

18. The data storage device of claim 16, further comprising one or more electronic components coupled to the surface of the PCB, wherein: The one or more components are enclosed by the covering means.

19. The data storage device according to claim 16, wherein: The controller means is communicatively coupled to the connection means of the data storage device.

20. The data storage device of claim 16, wherein: The controller device is mounted directly to the surface of the PCB using a reflow soldering process.

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