An automated test system for MCU and DSP first sample verification

Abstract

The present invention relates to the field of automated testing technology, and in particular to an MCU, DSP first sample verification automated testing system and method, comprising a main control unit, for receiving a program issued by a console module and loading and storing it, ensuring the correct reception and storage of a test program; a connection module, for performing digital signal switching or analog signal switching; a console module, for exchanging data with a main control and a test unit through the connection module, controlling the switch of a power supply module, and reading current data; setting waveform measurement parameters, obtaining waveform data, and summarizing, calculating, processing, and storing it; a test unit, providing test points for high-precision measurement, generating sine, square wave, and pulse signals with adjustable amplitude and frequency, superimposing them into a DC voltage, and testing the output waveform of the superimposed AC signal. The present invention improves the automation level of first sample verification after chip tape-out, increases the number of first sample verifications, and shortens the time of first sample verification.

Description

Technical Field

[0001] The present invention relates to the technical field of automated testing, and in particular to an automated testing system and method for first sample verification of an MCU or a DSP. Background Art

[0002] In the current development process of microcontroller units (MCU) and digital signal processors (DSP) chips, the first sample verification stage faces a significant challenge, which is the lack of a platform designed specifically for automated testing. Traditional automated testing platforms often cannot meet the specific needs of the first sample verification stage, resulting in many problems in the testing process not being discovered and solved in a timely manner.

[0003] To solve this problem, we have developed an automated test system specifically for the first sample verification of MCU and DSP chips. The purpose of developing this system is to significantly increase the number of tests in the first sample verification phase, thereby improving the test coverage. In this way, we hope to more comprehensively detect various problems that may arise in the design and manufacturing process of MCU and DSP chips, ensuring that these problems can be discovered and resolved in advance before the product is officially launched on the market.

[0004] By implementing automated testing, we can not only improve test efficiency and reduce labor costs, but also ensure the consistency and repeatability of the test process. This will help improve the quality and reliability of chips, and ultimately provide users with more stable and high-performance products. In addition, by discovering potential problems early, we can also shorten the R&D cycle and speed up the time to market, thereby gaining a favorable position in the fierce market competition. Summary of the invention

[0005] In view of the deficiencies in the prior art, the present invention discloses an MCU and DSP first sample verification automatic test system and method, which are used to solve the above problems.

[0006] The present invention is achieved through the following technical solutions:

[0007] In a first aspect, the present invention provides an MCU, DSP first sample verification automatic test system, comprising

[0008] The main control unit is used to receive the program sent by the console module and load it into storage. The main control unit ensures the correct reception and storage of the test program through data interaction with the console module;

[0009] A connection module, used for digital signal switching or analog signal switching;

[0010] The console module exchanges data with the main control and test units through the connection module, controls the switch of the power module, and reads the current data; sets the waveform measurement parameters, obtains the waveform data, and summarizes, calculates, processes and stores it;

[0011] The test unit provides test points for high-precision measurement, generates sine, square and pulse signals with adjustable amplitude and frequency, superimposes them into the DC voltage, and tests the output waveform of the superimposed AC signal. The oscilloscope is used to obtain the detailed parameters of the waveform, including peak value, effective value, frequency and waveform distortion, to verify the superposition effect and signal quality of the signal and ensure the accuracy of the test results.

[0012] Furthermore, the connection module includes a switching module and a direct connection module. The switching module is responsible for the digital signal switching between the main control module and the test unit, the analog signal switching between the test unit and the analog measurement module, and the analog signal switching between the test unit and the signal generating module; the direct connection module is used for direct signal connection between the main control module and the module under test.

[0013] Furthermore, it includes a test auxiliary module, which is in the form of a sampling fixture and is placed on a three-temperature sorting machine to make corresponding boards according to different chips and packaging forms; wherein the three-temperature sorting machine automatically switches the test chip and classifies the chip according to the test results.

[0014] Furthermore, the power supply module includes a power supply module and a power supply control module, the power supply module is used for direct current power supply of the system, and the power supply control module is used for controlling the on and off of the power supply tracks of the test unit and the adapter module and the track selection.

[0015] Furthermore, the test unit includes an analog measurement module, a signal generation module, a signal injection module and a high-precision measurement module.

[0016] Furthermore, the analog measurement module is used to provide test points to the waveform measurement module and the high-precision measurement module;

[0017] The signal generation module is used to provide the module under test with sine, square, pulse amplitude and frequency adjustable signals, and also provide the module under test with high-precision DC voltage input;

[0018] A signal injection module is used to inject an AC signal into a DC voltage so that an AC signal with a certain amplitude and frequency is superimposed on the DC signal;

[0019] Waveform measurement module, testing the output waveform of the analog signal of the module under test;

[0020] High-precision measurement module, used for high-precision voltage test projects, measures the subtle voltage changes of the output voltage of the LDO inside the chip of the tested module at different temperature points.

[0021] Furthermore, the main control unit is responsible for controlling the power module, receiving and storing the program issued by the control console, realizing data communication with the control console, and is also responsible for resetting and loading programs of the chips in the adapter module and the module under test, as well as data interaction with the two modules; in addition, the main control unit interacts with the three-temperature sorting machine and performs data aggregation, calculation and processing.

[0022] Furthermore, the console module communicates with the main control unit, manages the switch of the power module, obtains current data; sets waveform measurement parameters and reads its data; obtains high-precision module data; exchanges information with the test unit, and completes data processing, storage and user interaction.

[0023] Furthermore, the system also includes a user interface for providing an intuitive operation interface and real-time data display. The user interface allows the user to set test parameters, start the test process, view test results, and perform data export operations; it also includes a data storage module for storing all data and test results during the test process; the data storage module can provide a large-capacity data storage space and support fast reading, writing and backup of data to ensure the integrity and long-term preservation of test data.

[0024] In a second aspect, the present invention provides an MCU and DSP first sample verification automated test method, the method using the MCU and DSP first sample verification automated test system described in the first aspect, comprising the following steps:

[0025] Prepare transfer modules and direct modules for dynamic switching connection of signals;

[0026] Connect the signal of the module under test to the main control module and the analog measurement module through the adapter module;

[0027] Use the main control module to download the test program to the module under test;

[0028] Switch signal channels through the adapter module to perform different tests;

[0029] Use the console module to send instructions to the module under test;

[0030] Read the data and waveform information of the module under test;

[0031] Verify the MCU and DSP chips in the module under test;

[0032] The main control module sends signals to the three-temperature sorting machine to replace and sort the chips;

[0033] Realize automated testing for first-sample chip verification.

[0034] The beneficial effects of the present invention are:

[0035] The present invention significantly improves test efficiency and coverage, ensuring that potential problems are discovered and resolved before the product is officially launched on the market; reduces labor costs through automated testing, ensuring the consistency and repeatability of the test process; improves chip quality and reliability, providing users with more stable and high-performance products; shortens the R&D cycle, accelerates product time to market, and enhances market competitiveness.

[0036] The present invention improves the automation level of the test process by automatically switching and classifying chips through a three-temperature sorting machine; accurately detects subtle changes in the LDO output voltage inside the chip through a high-precision measurement module; the user interface provides intuitive operation and real-time data display, which is convenient for user operation and data management; the data storage module ensures the integrity and long-term preservation of test data, and supports fast reading, writing and backup of data.

[0037] The MCU and DSP first sample verification automated test system and method of the present invention not only improves test efficiency and quality, but also significantly reduces R&D cost and time through automated means, providing strong technical support for chip manufacturers and ensuring product competitiveness in the market. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0039] Figure 1 It is a schematic diagram of an automated test system for the first sample verification of MCU and DSP;

[0040] Figure 2 It is a flow chart of the automated test method for first sample verification of MCU and DSP;

[0041] Figure 3 This is a test flow circuit diagram of the test items that require external measurement in this embodiment;

[0042] Figure 4 This is a test flow circuit diagram of a test item in this embodiment that does not require external measurement. DETAILED DESCRIPTION

[0043] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0044] In one embodiment, please refer to Figure 1 As shown, the present invention provides an MCU, DSP first sample verification automatic test system, including

[0045] The main control module, as the central hub of the entire system, undertakes multiple key functions. Specifically, the main responsibilities of the main control module include:

[0046] a) Control the power-on control module: The main control module is responsible for managing the power-on process of the entire system, ensuring that each module can start and run correctly in a predetermined order and time period.

[0047] b) Receive programs sent by the console module and load them into storage: The main control module can receive program instructions from the console module and store these instructions in the internal memory for subsequent execution and calling.

[0048] c) Data interaction with the console module: Frequent data exchange between the main control module and the console module ensures that the console can monitor the system status in real time and make corresponding adjustments and controls as needed.

[0049] d) Reset control of the chip in the adapter module: The main control module is responsible for resetting the chip in the adapter module to ensure that the chip can be restarted when needed and resume normal working state.

[0050] e) Program loading into the chip in the adapter module: The main control module is also responsible for loading the program code into the chip in the adapter module so that the chip can perform specific tasks and functions.

[0051] f) Data interaction with the adapter module: Data is exchanged between the main control module and the adapter module to monitor and adjust the working status of the adapter module in real time to ensure the accuracy and efficiency of data transmission.

[0052] g) Reset control of the chip in the module under test: The main control module also has the ability to reset the chip in the module under test so as to initialize the chip during the test to ensure the accuracy and reliability of the test.

[0053] h) Program loading into the chip within the module under test: The main control module is responsible for loading the test program into the chip within the module under test, so that the chip can perform the predetermined test tasks in the test environment.

[0054] i) Data interaction with the module under test: Data is exchanged between the main control module and the module under test to monitor the working status of the module under test in real time and perform corresponding analysis and processing based on the test results.

[0055] j) Data interaction with the three-temperature sorting machine: The main control module also interacts with the three-temperature sorting machine to ensure that the sorting machine can perform precise temperature control and sorting operations according to the instructions of the main control module.

[0056] k) Data aggregation, calculation and processing: The main control module has powerful data processing capabilities and can aggregate, calculate and process various collected data to generate valuable analysis results to provide support for system optimization and decision-making.

[0057] The main function of the transfer module is to realize the digital signal transfer between the main control module and the module under test. At the same time, it is also responsible for the analog signal transfer between the module under test and the analog measurement module, and the analog signal transfer between the module under test and the signal generation module. Through these transfer functions, it is ensured that the signals between the modules can be smoothly transmitted and processed.

[0058] Direct connection module, when the signal between the main control module and the module under test does not need to be transferred, the direct connection module comes in handy. This module provides a direct connection method, allowing the signal to be transmitted in the shortest path, thereby reducing signal loss and delay, and improving the overall performance of the system.

[0059] The module under test, which is usually in the form of a sampling fixture, is placed on the three-temperature sorter. According to different chip types and packaging forms, corresponding boards can be designed and manufactured to meet different test requirements. The three-temperature sorter has the function of automatically switching test chips and can classify chips according to test results, thereby improving test efficiency and accuracy.

[0060] The power module is mainly responsible for providing DC power to the entire system. It supports a variety of common supply voltages, including DC 5V, DC 3.3V, DC 1.8V, and DC 1.2V. Through these different voltage outputs, the power module can meet the power supply requirements of each module in the system.

[0061] The power control module is mainly responsible for controlling the on / off of the power rails of the tested module and the adapter module, as well as the rail selection. Through precise power management, it ensures that each module can obtain a stable power supply when needed, and can cut off the power supply in time when not needed, so as to save energy and extend the service life of the equipment.

[0062] Analog measurement module, the main function of this module is to provide the required test points for the waveform measurement module and the high-precision measurement module. It can provide accurate analog signals to ensure that the waveform measurement module can accurately measure the output waveform of the module under test, and it can also provide necessary signal support for the high-precision measurement module.

[0063] Signal generation module: This module is responsible for providing various adjustable signals to the module under test, including sine waves, square waves, pulses and other signals with different amplitudes and frequencies. In addition, it can also provide high-precision DC voltage input to meet the needs of the module under test in different test scenarios.

[0064] Signal injection module, the main function of this module is to inject AC signal into DC voltage, so as to superimpose AC signal of certain amplitude and frequency on DC signal. This signal injection technology is very useful in the process of testing and debugging, and can simulate the signal interference in the actual working environment, so as to evaluate the performance of the module under test in a complex signal environment.

[0065] Waveform measurement module, which is responsible for testing the analog signal output waveform of the module under test. Two oscilloscopes are integrated inside the module, which can monitor and analyze multiple signals in real time at the same time. Through accurate waveform measurement, the signal quality of the module under test can be evaluated to ensure that it meets the design specifications and performance requirements.

[0066] High-precision measurement module, which is mainly responsible for executing high-precision voltage test items. It can measure the subtle voltage changes of the output voltage of the LDO inside the chip of the tested module at different temperature points. In order to ensure the accuracy of the measurement results, the measurement accuracy of this module must reach at least six and a half digits to meet the needs of high-precision testing.

[0067] The console module is equivalent to the central nervous system of the entire system and controls most modules. Its main functions include:

[0068] a) Data interaction with the main control module: The console module is responsible for real-time data exchange with the main control module to ensure that all parts of the system can work together to achieve efficient information transmission and processing.

[0069] b) Control the power on and off of the power module: The console module has the ability to control the power module and can power on and off the power supply as needed to ensure the normal operation and energy-saving management of the system. At the same time, it can also read the current data on the power rail in real time, monitor the power status, and ensure the stability and safety of the system.

[0070] c) Control the waveform measurement module: The console module is responsible for setting various parameters of the waveform measurement module to meet different measurement requirements. In addition, it can also read the data collected by the waveform measurement module for further analysis and processing to meet the needs of accurate measurement.

[0071] d) Control high-precision modules: The console module has the ability to read the measurement data of the high-precision modules and can obtain various measurement values ​​collected by the high-precision modules to provide support for precise control and data analysis of the system.

[0072] e) Data interaction with the module under test: The console module can interact with the module under test, obtain the status and data of the module under test in real time, and provide important information for system monitoring and analysis.

[0073] f) Data aggregation, calculation, processing and storage: The console module has powerful data processing capabilities and can aggregate, calculate and process various collected data, and then store the processing results to provide support for subsequent analysis and decision-making.

[0074] g) Human-computer interaction: The console module is also responsible for interaction with the user, providing a friendly operating interface so that the user can easily perform operations such as system settings, parameter adjustments, and data viewing, thereby improving the system's usability and user experience.

[0075] In one embodiment, it includes a user interface for providing an intuitive operation interface and real-time data display. The user interface allows the user to set test parameters, start the test process, view test results, and perform data export operations; it also includes a data storage module for storing all data and test results during the test process; the data storage module can provide a large-capacity data storage space and support fast reading, writing and backup of data to ensure the integrity and long-term preservation of test data.

[0076] In one embodiment, the main control module adopts TMS32F28379DBGA337. As shown in Table 1, the dual-core chip is better at concurrent control processing, has more general IOs, and is more convenient for digital signal processing.

[0077] Table 1 Main control module functions and parameters

[0078]

[0079] The digital part of the adapter module uses an FPGA chip, and the analog part uses an analog switch.

[0080] The direct connection module mainly includes the JTAG connection and the connection between the ADC channel and the signal of the module under test.

[0081] The module under test, here the target chip is the AVP32F0049 chip.

[0082] The power module uses a 3-channel DC power supply and can be digitally programmed and controlled and data read via RS232.

[0083] The power control module uses NMOS to control the power rail switch. The specific method is as follows:

[0084] The analog measurement module mainly provides test points for the waveform measurement module and the high-precision measurement module.

[0085] Here, a signal source is used to generate sinusoidal signals, and a 16DAC is used to generate a DC signal.

[0086] Here, a PICOTEST J2120A signal injector is used to superimpose the AC signal onto the DC power supply.

[0087] One oscilloscope uses the MSO54 Tektronix four-channel oscilloscope, and the other uses the SDS6058 H10 Pro Dingyang 8-channel oscilloscope, both of which can be digitally programmed and data exchanged.

[0088] The six and a half digits are DMM6500, which is a German six and a half digits, and data exchange can be carried out via RS232.

[0089] The console module mainly uses a computer, and the human-computer interaction is implemented through the host computer interface. Here, QT is used for sampling.

[0090] This embodiment improves the automation level of first-sample verification after chip tape-out, increases the number of first-sample verifications, and shortens the time of first-sample verification.

[0091] In one embodiment, referring to Figure 2 As shown, an automated test method for first sample verification of an MCU or DSP is provided, comprising the following steps:

[0092] Prepare transfer modules and direct modules for dynamic switching connection of signals;

[0093] Connect the signal of the module under test to the main control module and the analog measurement module through the adapter module;

[0094] Use the main control module to download the test program to the module under test;

[0095] Switch signal channels through the adapter module to perform different tests;

[0096] Use the console module to send instructions to the module under test;

[0097] Read the data and waveform information of the module under test;

[0098] Verify the MCU and DSP chips in the module under test;

[0099] The main control module sends signals to the three-temperature sorting machine to replace and sort the chips;

[0100] Realize automated testing for first-sample chip verification.

[0101] In one embodiment, referring to Figure 3 As shown, the test items that require external measurement include the following steps:

[0102] The console chess piece issues test instructions;

[0103] The main control module loads the program into the chip of the chess block under test through the direct connection module. The main control communicates with the adapter module to establish the connection between the main control and the module under test;

[0104] The main control module communicates with the adapter module to build a connection between the analog measurement module and the module under test, and a connection between the module under test and the signal generation module;

[0105] The console block sets up the oscilloscope and six-and-a-half-digit parameters, and sends instructions to the main control module to start the test. The console block reads the test data through the main control module, and some test data is directly read through the module under test;

[0106] The console module captures oscilloscope waveforms and reads six-and-a-half-bit data;

[0107] After the test is completed, the main control module reads the test results through the direct connection module and sends them to the console module;

[0108] The console saves the data and sends a command to end the test.

[0109] In one embodiment, referring to Figure 4 As shown, the test items that do not require external measurements include the following steps:

[0110] The console module issues test instructions;

[0111] The main control module loads the program into the chip of the module under test through the direct connection module;

[0112] The main control and the adapter module communicate to establish the connection between the main control and the module under test;

[0113] The console reads the test data of the module under test through the main control module;

[0114] After the test is completed, the main control module reads the test results through the direct connection module and sends them to the console module;

[0115] The console saves the data and sends a command to end the test.

[0116] In summary, the present invention significantly improves test efficiency and coverage, ensuring that potential problems are discovered and resolved before the product is officially launched on the market; reduces labor costs through automated testing, ensuring the consistency and repeatability of the testing process; improves chip quality and reliability, providing users with more stable and high-performance products; shortens the R&D cycle, accelerates product time to market, and enhances market competitiveness.

[0117] The present invention improves the automation level of the test process by automatically switching and classifying chips through a three-temperature sorting machine; accurately detects subtle changes in the LDO output voltage inside the chip through a high-precision measurement module; the user interface provides intuitive operation and real-time data display, which is convenient for user operation and data management; the data storage module ensures the integrity and long-term preservation of test data, and supports fast reading, writing and backup of data.

[0118] The MCU and DSP first sample verification automated test system and method of the present invention not only improves test efficiency and quality, but also significantly reduces R&D cost and time through automated means, providing strong technical support for chip manufacturers and ensuring product competitiveness in the market.

[0119] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. An MCU and DSP first sample verification automated test system, characterized in that: include: The main control unit is used to receive the program sent by the console module and load it into storage. The main control unit ensures the correct reception and storage of the test program through data interaction with the console module; A connection module, used for digital signal switching or analog signal switching; The console module exchanges data with the main control and test units through the connection module, controls the switch of the power module, and reads the current data; Set waveform measurement parameters, obtain waveform data, and perform aggregation, calculation, processing, and storage; The test unit provides test points for high-precision measurement, generates sine, square and pulse signals with adjustable amplitude and frequency, superimposes them into DC voltage, and tests the output waveform of the superimposed AC signal. The oscilloscope is used to obtain the detailed parameters of the waveform, including peak value, effective value, frequency and waveform distortion, to verify the superposition effect and signal quality of the signal and ensure the accuracy of the test results. The test unit includes an analog measurement module, a signal generation module, a signal injection module and a high-precision measurement module; The analog measurement module is used to provide test points to the waveform measurement module and the high-precision measurement module; The signal generation module is used to provide the module under test with sine, square, pulse amplitude and frequency adjustable signals, and also provide the module under test with high-precision DC voltage input; A signal injection module is used to inject an AC signal into a DC voltage so that an AC signal with a certain amplitude and frequency is superimposed on the DC signal; Waveform measurement module, testing the output waveform of the analog signal of the module under test; High-precision measurement module, used for high-precision voltage test projects, measures the subtle voltage changes of the output voltage of the LDO inside the chip of the tested module at different temperature points.

2. The MCU and DSP first sample verification automatic test system according to claim 1, characterized in that: The connection module includes a switching module and a direct connection module. The switching module is responsible for the digital signal switching between the main control module and the test unit, the analog signal switching between the test unit and the analog measurement module, and the analog signal switching between the test unit and the signal generation module; the direct connection module is used for direct signal connection between the main control module and the module under test.

3. The MCU and DSP first sample verification automatic test system according to claim 1, characterized in that: It includes a test auxiliary module, which is in the form of a fixture and placed on a three-temperature sorting machine to make corresponding boards according to different chips and packaging forms; The three-temperature sorting machine automatically switches the test chips and classifies the chips according to the test results.

4. The MCU and DSP first sample verification automatic test system according to claim 1, characterized in that: The power supply module includes a power supply module and a power control module. The power supply module is used for direct current power supply of the system, and the power control module is used for controlling the on and off of the power supply tracks of the test unit and the adapter module and the track selection.

5. The MCU and DSP first sample verification automatic test system according to claim 1, characterized in that: The main control unit is responsible for controlling the power module, receiving and storing the program sent by the control console, realizing data communication with the control console, and is also responsible for resetting and loading programs of the chips in the adapter module and the module under test, as well as data interaction with these two modules; in addition, the main control unit interacts with the three-temperature sorting machine and performs data aggregation, calculation and processing.

6. The MCU and DSP first sample verification automatic test system according to claim 1, characterized in that: The console module communicates with the main control unit, manages the switch of the power module, obtains current data, sets waveform measurement parameters, and reads its data; Acquire high-precision module data; exchange information with the test unit to complete data processing, storage and user interaction.

7. The MCU and DSP first sample verification automatic test system according to claim 1, characterized in that: The system also includes a user interface for providing an intuitive operation interface and real-time data display, and the user interface allows the user to set test parameters, start the test process, view test results, and perform data export operations; It also includes a data storage module for storing all data and test results during the test; The data storage module can provide large-capacity data storage space and support fast data reading, writing and backup, ensuring the integrity and long-term preservation of test data.

8. An MCU, DSP first sample verification automated test method, the method using the MCU, DSP first sample verification automated test system according to any one of claims 1-7, characterized in that: The following steps are involved: Prepare transfer modules and direct modules for dynamic switching connection of signals; Connect the signal of the module under test to the main control module and the analog measurement module through the adapter module; Use the main control module to download the test program to the module under test; Switch signal channels through the adapter module to perform different tests; Use the console module to send instructions to the module under test; Read the data and waveform information of the module under test; Verify the MCU and DSP chips in the module under test; The main control module sends signals to the three-temperature sorting machine to replace and sort the chips; Realize automated testing for first-sample chip verification.

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