A computer case convenient for heat dissipation and intelligent heat dissipation method for the computer case

Abstract

The present invention relates to the technical field of computer cases, and discloses a computer case that is easy to dissipate heat and an intelligent heat dissipation method for the computer case. The computer case includes a casing, a gear plate, a transmission slot, a connecting rod and a baffle. A first motor is installed at the rear of the mounting frame through a tripod. The rotor of the first motor is coaxially connected with a gear, and the gear is meshed with the gear plate. The heat dissipation method includes: S1 data collection and monitoring; S2 data analysis and evaluation; S3 intelligent heat dissipation strategy adjustment; S4 dynamic monitoring and feedback; S5 energy saving and fault warning. The computer case, through the first motor, ultimately drives the synchronous contraction and expansion of the plug shaft and the connecting rod, effectively prevents dust from entering the interior of the case, and cleans the dust attached to the surface of the heat sink; the heat dissipation method, through data collection and real-time analysis, dynamically adjusts the heat dissipation strategy, can also dynamically adjust the energy consumption of the heat dissipation equipment according to actual needs, and monitors the working status of the heat dissipation equipment in real time.

Description

Technical Field

[0001] The invention relates to the technical field of computer cases, in particular to a computer case which is convenient for heat dissipation. Background Art

[0002] The computer case is the outer shell used to place and fix the various hardware components inside the computer. It not only provides physical protection from dust and external impact, but also acts as an electromagnetic interference (EMI) shield, helping to maintain the stability and performance of the system. The design and construction of the case has a significant impact on the heat dissipation performance, expandability and overall aesthetics of the computer.

[0003] A common computer case includes a casing (usually made of steel plates, galvanized plates, aluminum plates, aluminum-magnesium alloys or plastics to protect internal components), a bracket (used to fix the power supply, motherboard, drive and cooling fan, etc.) and a panel (containing various switches, indicator lights and interfaces, such as USB ports, audio input and output, etc.). In order to facilitate heat dissipation, heat dissipation slots are opened on the surface of the case to facilitate the discharge of heat from inside the case.

[0004] However, in this method, since the heat sinks are composed of multiple groups, dust will adhere to the inside of the heat sinks during long-term air convection, thereby blocking the heat sinks, affecting the quality of air convection, and causing the heat dissipation performance of the computer case to decrease. In addition, since the heat sinks are open, dust can also enter the case through the heat sinks when not in use, affecting the quality of the case. At the same time, the heat dissipation of computer cases in the prior art is mostly passive heat dissipation, and the heat dissipation strategy cannot be intelligently adjusted according to the working environment, resulting in low heat dissipation efficiency and waste of energy, and cannot meet the working requirements of the computer case. Therefore, a computer case that is easy to dissipate heat and an intelligent heat dissipation method for the computer case are proposed. Summary of the invention

[0005] 1. Technical issues to be solved

[0006] In view of the deficiencies in the prior art, the present invention provides a computer case that is easy to dissipate heat and an intelligent heat dissipation method for the computer case, so as to solve the problem that dust will adhere to the inside of the heat dissipation slot during long-term air convection, thereby clogging the heat dissipation slot and affecting the quality of air convection. At the same time, the heat dissipation of the computer case in the prior art is mostly passive heat dissipation, and the heat dissipation strategy cannot be intelligently adjusted according to the working environment, resulting in low heat dissipation efficiency and waste of energy. Technical problems.

[0007] (II) Technical solution

[0008] To achieve the above-mentioned purpose, the present invention provides the following technical solution: a computer case that is convenient for heat dissipation, comprising:

[0009] The casing has an assembly plate installed on the left side of the casing, and heat sinks are inserted on both the front and rear sides of the casing. A mounting plate is welded on the middle of the front side of the heat sink, and a mounting frame is connected to the middle position of the front of the mounting plate;

[0010] The toothed disc is mounted at the front middle position of the mounting frame through a bearing, a transmission groove is opened in the inner circumference of the toothed disc, a connecting rod is inserted in the inner part of the mounting frame, and the outer ends of the connecting rods are connected to baffles;

[0011] The plug shaft is installed on the front inner side of the connecting rod, and the front end of the plug shaft passes through the interior of the transmission groove. The rear part of the mounting frame is installed with a first motor through a tripod. The rotor of the first motor is coaxially connected with a gear, and the gear is meshed with a gear disc.

[0012] Preferably, the mounting frame is in the shape of a pentagon, the rear side of the baffle is paved with first bristles, and the front end of the insertion shaft is coaxially installed with a limit plate, which improves the stability of the connecting rod and the insertion shaft during movement.

[0013] Preferably, through holes are provided inside the mounting plate at positions corresponding to the first motor, and the first motor is connected to the power supply inside the casing through the through holes and wires, which facilitates assembly.

[0014] Preferably, a mounting seat is installed on the top of the casing, a second motor is inserted into the mounting seat, a rotor of the second motor is coaxially connected to a turntable, and a swing arm is connected to the lower left side of the mounting seat through a bearing.

[0015] Preferably, a second brush is laid on the right side of the swing arm, and a heat dissipation net is installed at the inner middle position of the assembly plate and the corresponding position of the swing arm. A through groove is opened on the inner upper side of the swing arm, and a driving rod is inserted into the through groove. The right end of the driving rod is connected to the left side of the turntable, and the turntable and the driving rod can be driven to rotate by the second motor, thereby driving the swing arm to swing back and forth left and right, which facilitates the cleaning of dust attached to the surface of the heat dissipation net, avoids dust clogging the mesh holes, and improves the quality of heat dissipation.

[0016] Preferably, a data acquisition module and an intelligent control circuit are also installed inside the casing, the first motor and the second motor are connected to the data acquisition module through the intelligent control circuit, the intelligent control circuit is also linked to the computer motherboard, the mesh holes of the heat dissipation net on the right side of the swing arm and the heat dissipation net inside the assembly plate are staggered, which facilitates the shielding of the heat dissipation net inside the assembly plate through the heat dissipation net on the surface of the swing arm when not in use.

[0017] An intelligent heat dissipation method for a computer case, comprising the above-mentioned computer case that is convenient for heat dissipation, and the intelligent heat dissipation method comprises the following steps:

[0018] S1 data collection and monitoring:

[0019] The data acquisition module installed inside the computer case collects the operating data of key components inside the case in real time;

[0020] S2 Data Analysis and Evaluation:

[0021] The collected data is input into the intelligent control circuit, and the data is processed and analyzed using the preset algorithms and models to evaluate the heat dissipation demand inside the chassis and the temperature change trend in the future. Based on the analysis results, it is determined whether the current heat dissipation strategy needs to be adjusted;

[0022] S3 intelligent cooling strategy adjustment:

[0023] Based on the results of data analysis and evaluation, the intelligent control circuit automatically adjusts the cooling strategy within the chassis;

[0024] S4 dynamic monitoring and feedback:

[0025] Continuously monitor the temperature changes inside the chassis and the working status of the cooling equipment, dynamically adjust the cooling strategy according to the real-time situation, and feed back the monitoring results to the intelligent control circuit to further optimize the cooling effect;

[0026] S5 energy saving and fault warning:

[0027] Under the premise of keeping the internal temperature of the chassis stable, the intelligent control circuit automatically adjusts the energy consumption of the cooling device to achieve energy saving. When a failure of the cooling device is detected or the internal temperature of the chassis rises abnormally, the intelligent control circuit controls the external alarm module to automatically sound an alarm and take corresponding emergency measures to ensure the safety of the computer hardware.

[0028] Preferably, the data acquisition module in step S1 data acquisition and monitoring includes a temperature sensor and a data detection module linked to the computer motherboard, and the data acquisition module is installed beside the CPU, graphics card, hard disk and motherboard installation position in the chassis;

[0029] The temperature collection content of the data acquisition module includes but is not limited to CPU temperature, graphics card temperature, hard disk temperature, motherboard temperature and ambient temperature inside the chassis. The data collection content of the data acquisition module includes but is not limited to the current CPU usage rate and memory occupancy rate, so as to evaluate the current load situation and monitor the operating status of the computer.

[0030] Preferably, the heat dissipation strategy adjustment methods in step S3 dynamic monitoring and feedback and S4 dynamic monitoring and feedback include but are not limited to:

[0031] Adjust the fan speed:

[0032] According to the internal temperature and load of the chassis, the speed of the CPU cooling fan or graphics card cooling fan connected to the computer motherboard is automatically adjusted to maintain the internal temperature of the chassis within a reasonable range;

[0033] To activate or deactivate auxiliary cooling devices:

[0034] The auxiliary heat dissipation device is a cleaning device on the heat dissipation plate, such as the toothed disc, baffle and bristle structure, top-mounted swing arm and heat dissipation net of the present invention, which automatically activates or shuts down the relevant equipment as needed to enhance the heat dissipation effect;

[0035] Adjust the airflow path:

[0036] By controlling the swing angle and speed of the swing arm, the air flow channel inside the chassis can be adjusted to make the air flow smoother and improve the heat dissipation efficiency.

[0037] Preferably, the operation of automatically adjusting the energy consumption of the heat dissipation device to achieve energy saving effect in step S5 of energy saving and fault warning includes the following aspects:

[0038] Dynamically adjust fan speed:

[0039] The intelligent control circuit dynamically adjusts the fan speed according to the internal temperature of the chassis, the load conditions and the preset energy consumption optimization algorithm;

[0040] When the temperature is low or the load is low, reduce the speed of the CPU cooling fan or graphics card cooling fan connected to the computer motherboard to reduce energy consumption. When the temperature rises or the load increases, increase the fan speed to meet the cooling needs while ensuring that the energy consumption is within a reasonable range;

[0041] Intelligent sleep and wake-up:

[0042] At non-essential moments, such as when the computer is in standby or hibernation mode, the intelligent control circuit will automatically reduce or shut down the power consumption of some cooling devices, such as reducing the fan speed to the lowest level or directly shutting down the fan to reduce unnecessary energy consumption. When the computer is detected to be active again, it will automatically wake up and adjust the cooling device to the appropriate working state.

[0043] The operations of taking corresponding emergency measures in step S5 energy saving and fault warning include the following aspects:

[0044] High temperature alarm and automatic shutdown:

[0045] When the intelligent control circuit detects that the temperature inside the chassis has abnormally risen to a dangerous level, it will immediately issue a high temperature alarm to alert the user. At the same time, the system will automatically shut down the computer power supply or start the safe shutdown program according to the preset safety strategy to prevent hardware damage due to overheating;

[0046] Fault detection and isolation:

[0047] The intelligent control circuit has a fault detection function and can monitor the working status of the cooling device in real time. Once a fault is found in the cooling device, such as fan stoppage, heat sink blockage, etc., the system will immediately issue a fault alarm and try to cut off the power supply of the faulty device for isolation to prevent the fault from expanding and affecting other hardware.

[0048] Data backup and recovery:

[0049] In emergency situations, the system can also automatically trigger the data backup program to quickly save important data to a safe location, while providing a simple data recovery mechanism to quickly restore the computer to normal working state after troubleshooting;

[0050] User Notification and Remote Monitoring:

[0051] The intelligent control circuit has a built-in communication terminal that supports sending alarm notifications to users via SMS, email or mobile phone APP, ensuring that users can promptly understand abnormal conditions of the chassis. In addition, the intelligent control circuit also has a built-in networking terminal that can be linked with the user's mobile phone to achieve remote monitoring function. Users can remotely view the real-time status of the chassis through the network and perform necessary operations.

[0052] (III) Beneficial effects

[0053] Compared with the prior art, the present invention provides a computer case that is easy to dissipate heat and has the following beneficial effects:

[0054] 1. The computer case that is easy to dissipate heat can rotate the gear by the first motor, so that the gear plate can rotate, and the plug shaft and the connecting rod can be pushed to expand synchronously under the restriction of the transmission groove, so that the baffle can be driven to expand outward when the computer is turned on, so that the heat sink can dissipate heat normally, and when the computer is turned off, the baffle is driven to close to cover the heat sink, which can not only effectively prevent dust from entering the inside of the case and reduce dust accumulation, but also because the back side of the baffle is paved with the first brush, the dust attached to the surface of the heat sink can be cleaned during the opening and closing process, so as to maintain the circulation quality of the heat sink, ensure that the heat can be quickly dissipated, and improve the heat dissipation quality of the case when it is used;

[0055] 2. The intelligent heat dissipation method of the computer case, through data collection and real-time analysis, the intelligent control system can respond to the temperature changes and load conditions inside the case, dynamically adjust the heat dissipation strategy, ensure that the temperature of each key component inside the case is always kept within a reasonable range, effectively prevent performance degradation or hardware damage caused by overheating, thereby extending the service life of the computer;

[0056] While maintaining efficient heat dissipation, the intelligent control system can also dynamically adjust the energy consumption of the heat dissipation equipment according to actual needs;

[0057] The intelligent control system can monitor the working status of the cooling equipment in real time. Once an abnormality or failure is detected, the system will immediately issue an alarm and take corresponding emergency measures, greatly improving the reliability and stability of computer use. BRIEF DESCRIPTION OF THE DRAWINGS

[0058] Figure 1 It is a schematic diagram of the structure of the present invention;

[0059] Figure 2 This is a schematic diagram of the heat sink and baffle structure of the present invention;

[0060] Figure 3 This is a schematic diagram of the heat sink and mounting plate structure of the present invention;

[0061] Figure 4 This is a schematic diagram of the structure of the mounting plate and the mounting frame of the present invention;

[0062] Figure 5 This is a schematic diagram of the toothed disc structure of the present invention;

[0063] Figure 6 This is a schematic diagram of the connecting rod and plug-in shaft structure of the present invention;

[0064] Figure 7 It is a schematic diagram of the internal structure of the mounting base of the present invention.

[0065] In the figure: 1. casing; 2. assembly plate; 3. heat dissipation net; 4. heat dissipation plate; 5. mounting plate; 6. mounting frame; 7. gear plate; 8. first motor; 9. gear; 10. transmission groove; 11. connecting rod; 12. plug shaft; 13. limit plate; 14. baffle; 15. through hole; 16. mounting seat; 17. second motor; 18. turntable; 19. swing arm; 20. through groove; 21. driving rod. DETAILED DESCRIPTION

[0066] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0067] The present invention provides a technical solution, a computer case that is convenient for heat dissipation, comprising a case 1, an assembly plate 2, a heat dissipation net 3, a heat dissipation plate 4, a mounting sheet 5, a mounting frame 6, a toothed disc 7, a first motor 8, a gear 9, a transmission groove 10, a connecting rod 11, an insertion shaft 12, a limit plate 13, a baffle 14, a through hole 15, a mounting seat 16, a second motor 17, a rotating disc 18, a swing arm 19, a through groove 20 and a driving rod 21:

[0068] See also Figure 1 , the left side of the housing 1 is provided with a mounting plate 2, see Figure 2 , heat sinks 4 are installed on both the front and rear sides of the housing 1, see Figure 3 , the middle part of the front side of the heat sink 4 is welded with a mounting plate 5, please refer to Figure 4 , the front middle position of the mounting plate 5 is connected with a mounting frame 6;

[0069] The toothed disc 7 is mounted at the front center of the mounting frame 6 through a bearing, see Figure 5 The inner circumference of the toothed disc 7 is provided with a transmission groove 10, see Figure 6 A connecting rod 11 is inserted into the interior of the mounting frame 6, and the outer ends of the connecting rods 11 are connected to baffles 14;

[0070] The plug shaft 12 is installed on the front inner side of the connecting rod 11, and the front end of the plug shaft 12 passes through the interior of the transmission groove 10. Figure 4 , a first motor 8 is installed at the rear of the mounting frame 6 through a tripod, a gear 9 is coaxially connected to the rotor of the first motor 8, and the gear 9 is meshed with the toothed disc 7, the mounting frame 6 is in the shape of a pentagon, a first bristle is laid on the rear side of the baffle 14, a limit disc 13 is coaxially installed at the front end of the plug shaft 12, a through hole 15 is opened at the position corresponding to the first motor 8 inside the mounting plate 5, the first motor 8 is connected to the power supply inside the casing 1 through the through hole 15 and the wire, and the gear 9 is driven to rotate by the first motor 8, so that the toothed disc 7 can rotate, and the limit of the transmission groove 10 The control pushes the plug shaft 12 and the connecting rod 11 to expand synchronously, and then the baffle 14 can be driven to expand outward when the computer is turned on, so that the heat sink 4 can dissipate heat normally. When the computer is turned off, the baffle 14 is driven to close to cover the heat sink 4, which can not only effectively prevent dust from entering the inside of the chassis and reduce dust accumulation, but also because the back side of the baffle 14 is paved with a first brush, the dust attached to the surface of the heat sink 4 can be cleaned during the opening and closing process to maintain the circulation quality of the heat sink 4, ensure that the heat can be quickly dissipated, and improve the heat dissipation quality of the chassis when it is used;

[0071] See also Figure 1 The top of the housing 1 is provided with a mounting seat 16, see Figure 7A second motor 17 is inserted into the mounting seat 16, and the rotor of the second motor 17 is coaxially connected to a turntable 18. A swing arm 19 is connected to the lower left part of the mounting seat 16 through a bearing, and a second brush is laid on the right side of the swing arm 19. A heat dissipation net 3 is installed at the middle position of the inner part of the assembly plate 2 and the corresponding position of the swing arm 19. A through groove 20 is opened on the upper side of the inner part of the swing arm 19, and a driving rod 21 is inserted into the through groove 20. The right end of the driving rod 21 is connected to the left side of the turntable 18. A data acquisition module and an intelligent control circuit are also installed in the casing 1. The first motor 8 and the second motor The first motor 8 and the second motor 17 are connected to the data acquisition module through the intelligent control circuit, the first motor 8 and the second motor 17 are connected to the data acquisition module inside the casing 1 through the intelligent control circuit, and the intelligent control circuit is also linked to the computer motherboard. The heat dissipation net 3 on the right side of the swing arm 19 and the mesh holes of the heat dissipation net 3 inside the assembly plate 2 are staggered with each other. The second motor 17 can drive the rotation of the turntable 18 and the driving rod 21, thereby driving the swing arm 19 to swing back and forth, which is convenient for cleaning the dust attached to the surface of the heat dissipation net 3, avoiding dust clogging the mesh holes, and improving the quality of heat dissipation.

[0072] The technical solution drives the gear 9 to rotate through the first motor 8, so that the toothed disc 7 can rotate, and promotes the synchronous contraction and expansion of the plug shaft 12 and the connecting rod 11 under the restriction of the transmission groove 10, so that the baffle 14 can be driven to expand outward when the computer is turned on, so that the heat sink 4 can dissipate heat normally, and when the computer is turned off, the baffle 14 is driven to close to cover the heat sink 4, which can not only effectively prevent dust from entering the interior of the chassis and reduce dust accumulation, but also because the back side of the baffle 14 is paved with the first bristles, the dust attached to the surface of the heat sink 4 can be cleaned during the opening and closing process to maintain the circulation quality of the heat sink 4, ensure that the heat can be quickly dissipated, and improve the heat dissipation quality when the chassis is used. At the same time, the second motor 17 can drive the rotation of the turntable 18 and the driving rod 21, so that the swing arm 19 can be driven to swing back and forth, which is convenient for cleaning the dust attached to the surface of the heat sink 3, avoiding dust clogging the mesh, and improving the heat dissipation quality.

[0073] The present invention also provides an intelligent heat dissipation method for a computer case, which is applicable to the above-mentioned computer case that is easy to dissipate heat, and realizes efficient heat dissipation and energy consumption management through intelligent means. The specific steps are as follows:

[0074] S1 data collection and monitoring:

[0075] Utilize the data acquisition module in the chassis (including temperature sensors and data detection modules linked to the motherboard) to collect the temperature and computer load data of the CPU, graphics card, hard disk, motherboard and the environment inside the chassis, such as CPU usage and memory occupancy, in real time.

[0076] S2 Data Analysis and Evaluation:

[0077] The collected data is input into the intelligent control circuit, and the heat dissipation demand and future temperature trend are evaluated through the preset algorithm to determine whether the heat dissipation strategy needs to be adjusted.

[0078] S3 intelligent cooling strategy adjustment:

[0079] Adjust fan speed: Automatically adjust the CPU and graphics card fan speed according to temperature and load.

[0080] Activate / deactivate auxiliary cooling: such as heatsink cleaning device, swing arm and heat sink, which can be activated as needed to enhance heat dissipation.

[0081] Adjust airflow path: Optimize air flow inside the chassis with swing-arm control.

[0082] S4 dynamic monitoring and feedback:

[0083] Continuously monitor temperature changes and cooling device status, adjust strategies in real time and provide feedback to the control circuit to optimize cooling effects.

[0084] S5 energy saving and fault warning:

[0085] Energy saving: Dynamically adjust fan speed, reduce or turn off fan power consumption when not necessary; intelligent sleep and wake-up mechanism reduces standby energy consumption.

[0086] Fault warning: monitor the status of cooling equipment, issue an alarm when an abnormality occurs and try to isolate the faulty equipment; automatically shut down to protect the hardware when the temperature is high; support data backup and recovery to ensure data security; provide user notification and remote monitoring functions to respond to abnormal situations in a timely manner.

[0087] According to the intelligent heat dissipation method of the computer case disclosed in the above scheme, the following are specific application embodiments:

[0088] When the data acquisition module detects that the CPU temperature continues to rise, the intelligent control circuit first analyzes the current load situation and the working status of the cooling device;

[0089] If it is determined that the load is high and the heat dissipation device is working normally, the fan speed is automatically increased and the cleaning device on the heat dissipation plate is activated, such as by driving the gear disk to rotate through the first motor, driving the baffle and the bristles to clean the dust on the heat dissipation plate to enhance the heat dissipation effect;

[0090] If it is determined that the cooling device has failed or the temperature inside the chassis has abnormally risen to a dangerous level, an alarm will immediately sound and the computer power will be shut down to prevent hardware damage.

[0091] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0092] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A computer case that is easy to dissipate heat, characterized in that: include: The casing has an assembly plate installed on the left side of the casing, and heat sinks are inserted on both the front and rear sides of the casing. A mounting plate is welded on the middle of the front side of the heat sink, and a mounting frame is connected to the middle position of the front of the mounting plate; The toothed disc is mounted at the front middle position of the mounting frame through a bearing, a transmission groove is opened in the inner circumference of the toothed disc, a connecting rod is inserted in the inner part of the mounting frame, and the outer ends of the connecting rods are connected to baffles; The plug shaft is installed on the front inner side of the connecting rod, and the front end of the plug shaft passes through the inside of the transmission groove. The rear part of the mounting frame is installed with a first motor through a tripod, and the rotor of the first motor is coaxially connected with a gear, and the gear is meshed with the gear plate; The mounting frame is in the shape of a pentagon, the rear side of the baffle is paved with first bristles, and the front end of the insertion shaft is coaxially mounted with a limit plate; A mounting seat is installed on the top of the housing, a second motor is inserted inside the mounting seat, a rotor of the second motor is coaxially connected to a turntable, and a swing arm is connected to the lower left side of the mounting seat through a bearing; The right side of the swing arm is paved with second bristles, a heat dissipation net is installed at the middle position inside the assembly plate and the corresponding position of the swing arm, the mesh holes of the heat dissipation net on the right side of the swing arm and the heat dissipation net inside the assembly plate are staggered, a through groove is opened on the upper side of the inner part of the swing arm, and a driving rod is inserted into the through groove, and the right end of the driving rod is connected to the left side of the turntable; A data acquisition module and an intelligent control circuit are also installed inside the housing, and the first motor and the second motor are both connected to the data acquisition module through the intelligent control circuit.

2. A computer case for facilitating heat dissipation according to claim 1, characterized in that: Through holes are provided at positions inside the mounting plate corresponding to the first motor, and the first motor is connected to the power supply inside the casing through the through holes and wires.

3. An intelligent heat dissipation method for a computer case, characterized in that: The intelligent heat dissipation method is applied to the computer case for facilitating heat dissipation as described in any one of claims 1-2, and the intelligent heat dissipation method comprises the following steps: S1 data collection and monitoring: The data acquisition module installed inside the computer case collects the operating data of key components inside the case in real time; S2 Data Analysis and Evaluation: The collected data is input into the intelligent control circuit, and the data is processed and analyzed using the preset algorithms and models to evaluate the heat dissipation demand inside the chassis and the temperature change trend in the future. Based on the analysis results, it is determined whether the current heat dissipation strategy needs to be adjusted; S3 intelligent cooling strategy adjustment: Based on the results of data analysis and evaluation, the intelligent control circuit automatically adjusts the cooling strategy within the chassis; S4 dynamic monitoring and feedback: Continuously monitor the temperature changes inside the chassis and the working status of the cooling equipment, dynamically adjust the cooling strategy according to the real-time situation, and feed back the monitoring results to the intelligent control circuit; S5 energy saving and fault warning: Under the premise of keeping the internal temperature of the chassis stable, the intelligent control circuit automatically adjusts the energy consumption of the heat dissipation device to achieve energy saving effect. When it detects that the heat dissipation device fails or the internal temperature of the chassis rises abnormally, the intelligent control circuit controls the external alarm module to automatically sound an alarm and take corresponding emergency measures; The heat dissipation strategy adjustment methods in the steps S3 dynamic monitoring and feedback and S4 dynamic monitoring and feedback include but are not limited to: Adjust the fan speed: Automatically adjust the speed of the CPU cooling fan or graphics card cooling fan connected to the computer motherboard according to the internal temperature and load of the chassis; To activate or deactivate auxiliary cooling devices: The auxiliary heat dissipation equipment is a cleaning device on the heat dissipation plate, which automatically activates or shuts down related equipment as needed; Adjust the airflow path: By controlling the swing angle and speed of the swing arm, the airflow channel inside the chassis can be adjusted; The operation of automatically adjusting the energy consumption of the heat dissipation device to achieve energy saving effect in step S5 of energy saving and fault warning includes the following aspects: Dynamically adjust fan speed: The intelligent control circuit dynamically adjusts the fan speed according to the internal temperature of the chassis, the load conditions and the preset energy consumption optimization algorithm; When the temperature is low or the load is low, the speed of the CPU cooling fan or graphics card cooling fan connected to the computer motherboard is reduced to reduce energy consumption. When the temperature rises or the load increases, the fan speed is increased to meet the cooling demand; Intelligent sleep and wake-up: When the computer is in standby or hibernation mode, the intelligent control circuit will automatically reduce or shut down the power consumption of some cooling devices to reduce unnecessary energy consumption. When the computer is detected to be active again, it will automatically wake up and adjust the cooling devices to the appropriate working state. The operation of taking corresponding emergency measures in step S5 of energy saving and fault warning includes the following aspects: High temperature alarm and automatic shutdown: When the intelligent control circuit detects that the temperature inside the chassis has abnormally risen to a dangerous level, it will immediately issue a high temperature alarm to alert the user. At the same time, the system will automatically shut down the computer power supply or start the safe shutdown procedure according to the preset safety strategy; Fault detection and isolation: The intelligent control circuit has a fault detection function and can monitor the working status of the heat dissipation equipment in real time. Once a fault is found in the heat dissipation equipment, the system will immediately issue a fault alarm and try to cut off the power supply of the faulty equipment for isolation. Data backup and recovery: In emergency situations, the system can also automatically trigger the data backup program to quickly save important data to a safe location; User Notification and Remote Monitoring: The intelligent control circuit has a built-in communication terminal, which supports sending alarm notifications to users via SMS, email or mobile phone APP. In addition, the intelligent control circuit also has a built-in networking terminal, which can be linked with the user's mobile phone to realize remote monitoring function.

4. The intelligent heat dissipation method for a computer case according to claim 3, characterized in that: The data acquisition module in the step S1 data acquisition and monitoring includes a temperature sensor and a data detection module linked to the computer motherboard, and the data acquisition module is installed beside the CPU, graphics card, hard disk and motherboard installation position in the chassis; The temperature collection content of the data collection module includes but is not limited to CPU temperature, graphics card temperature, hard disk temperature, motherboard temperature and ambient temperature inside the chassis. The data collection content of the data collection module includes but is not limited to the current CPU usage rate and memory occupancy rate.

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