High-performance heat dissipation device for industrial computer and industrial computer

Abstract

The invention discloses a high-performance heat dissipation device for an industrial computer and the industrial computer, and relates to the field of industrial computer technology, including: a high-efficiency heat dissipation ceramic sheet group, which is installed on the inner bottom side of a machine body and is used to quickly dissipate the heat generated inside the machine body. Through the cooperation of a fixed-point dynamic heat conduction and heat dissipation component, an operation frame plate drives a heat conduction frame and a semiconductor contact end to extend and retract, thereby achieving precise contact with a heat source point, achieving stability and reliability of the industrial computer when running under high load, and ensuring optimization of the heat dissipation effect. At the same time, under the cooperation of a dynamic protection component, a magnetic field is generated by an electromagnetic coil, and magnetic flow particles are controlled to form a specific arrangement in a circulating coolant flow pipe, thereby enhancing the shielding effect of electromagnetic signals. Through the dynamic adjustment of a rotating electromagnetic protection arc plate and the control of the magnetic flow particles, dynamic protection against external electromagnetic signals is achieved, thereby ensuring the stability and reliability of the industrial computer in a high electromagnetic interference environment.

Description

Technical Field

[0001] The present invention relates to the technical field of industrial computers, and in particular to a high-performance heat dissipation device for an industrial computer and an industrial computer. Background Art

[0002] With the continuous development of the industrial control industry, the application of industrial computers in the industry is becoming more and more common. With the extensive use of industrial computers, the market demand for industrial computers equipped with independent graphics cards is also increasing, which has greatly promoted the demand for box computers with independent graphics cards installed in the industrial control industry. However, after the box computer is equipped with an independent graphics card, the CPU (Central Processing Unit) and GPU (Graphics Processing Unit) will generate a lot of heat, so how to deal with the heat dissipation problem of CPUs and GPUs with different power consumption becomes the key to this application.

[0003] However, in the prior art, for products that need to install CPUs and GPUs with different power consumption at the same time, the heat is usually dissipated by air cooling or liquid cooling in industrial computers. However, this results in that the temperature of the large environment is mostly adjusted for heat dissipation during heat dissipation, and the CPUs and GPUs with different power consumption are continuously in a heating working state, so that the temperatures of heat sources generated at different positions of the CPUs and GPUs with different power consumption are different when they are working, which will cause the heat dissipation of the CPUs and GPUs with different power consumption to be unable to be unified with the heat dissipation of the large environment, and thus the heat dissipation performance and service life cannot effectively meet the operating requirements of the industrial computer. Therefore, it is necessary to propose a high-performance heat dissipation device and industrial computer for industrial computers. Summary of the invention

[0004] The purpose of the present invention is to provide a high-performance heat dissipation device for an industrial computer and an industrial computer, so as to solve the problem proposed in the above background technology that for products that need to install CPUs and GPUs with different power consumption at the same time, the heat is conventionally dissipated by air cooling or liquid cooling in the industrial computer, but as a result, when dissipating heat, the temperature of the large environment is mostly adjusted for heat dissipation, and the CPUs and GPUs with different power consumption are continuously in a heating working state, so that when the CPUs and GPUs with different power consumption are operating, the temperatures of the heat sources generated at different positions are different, which will cause the heat dissipation of the CPUs and GPUs with different power consumption to be unable to be unified with the heat dissipation of the large environment, and further the heat dissipation performance and service life cannot effectively meet the operating requirements of the industrial computer.

[0005] To achieve the above object, the present invention provides the following technical solution: a high-performance heat dissipation device for an industrial computer, comprising:

[0006] High-efficiency heat dissipation ceramic sheet group, which is installed on the bottom side of the body, is used to quickly dissipate the heat generated inside the body to ensure the stability and reliability of the body when running under high load;

[0007] The top semiconductor cooling plate is installed inside the top of the machine body and is used to quickly dissipate the heat generated inside the machine body through the cooperation of the semiconductor cooling plate and two sets of heat dissipation axial flow fans;

[0008] A fixed-point dynamic heat conduction and heat dissipation component is installed on the protective plates fastened to the left and right sides of the body, and a plurality of position slots are evenly spaced on the surface of the protective plates, which are used to dynamically form a fixed-point heat conduction and heat dissipation operation according to the temperature variable area change of the heat source point inside the body;

[0009] High-precision temperature detection sensors are installed in an array on the side of the heat source point of the body to monitor the temperature changes of the body in real time and feed back to the fixed-point dynamic heat conduction and heat dissipation components to enable them to operate in time.

[0010] Preferably, the fixed-point dynamic heat conduction and heat dissipation component includes:

[0011] A transverse hinge guide rail, a side frame, an electric rotating joint, a support shaft joint arm and a stress sensor, wherein the side frame is fastened to the left and right ends of the transverse hinge guide rail, the electric rotating joint is installed on the side end of the side frame, the support shaft joint arm is fastened to the bottom of the side frame, and is used to support the transverse hinge guide rail and the related structures it carries, the stress sensor is installed on the frame surface of the support shaft joint arm, the side of the electric rotating joint is hinged with a motor drive seat, and the output end of the motor drive seat is connected to a first transmission arm.

[0012] Preferably, the side end of the first transmission arm is hinged to the second transmission arm, and the side end of the second transmission arm is rotatably connected to a rotating carrier body, a clearance groove is opened on the surface of the rotating carrier body, the bottom end of the rotating carrier body is hinged to a swivel shaft, and a rotating motor is installed inside the top end of the rotating carrier body.

[0013] Preferably, the side end of the rotating motor is connected to an engaging rotating rod, and the engaging rotating rod is used to engage with multiple groups of position slots. The side of the transverse hinge guide rail is slidably connected to a position calibration sliding seat, and the side end of the position calibration sliding seat is installed with a rotating motor box. The side end of the rotating motor box is fastened with a pneumatic drive slot frame, and the side end of the pneumatic drive slot frame is connected to a scissor-type extension frame.

[0014] Preferably, the side end of the scissor-type extension frame is fastened to a working frame plate, and a rack end and a sliding groove rail are respectively installed on the side end surface of the working frame plate, and the side ends of the rack end and the sliding groove rail are meshed and connected with an extension frame, and a small driving motor is installed on the side end surface of the extension frame, and the side end of the small driving motor is connected to a rack chain rail structure.

[0015] Preferably, the side end of the extension frame is fastened with a heat-conducting frame, the side end of the heat-conducting frame is installed with a semiconductor contact terminal, and the heat-conducting frame is connected through a high heat-conducting transmission tube and a high-efficiency heat-dissipating ceramic plate group.

[0016] Preferably, a heat dissipation fan is arranged at the inner bottom end of the body, a heat dissipation frame is installed at the top end of the body, the two groups of heat dissipation axial flow fans are installed on the surface of the heat dissipation frame, and a heat dissipation mesh is opened on the front end surface of the heat dissipation frame.

[0017] Another object of the present invention is to provide an industrial computer, including a dynamic protection component, a movable adjustment wheel structure, a side protection shell and a front rail door. The dynamic protection component is installed on the outer peripheral side of the body, and is used to dynamically adjust the protection angle according to the emission direction of the external electromagnetic influence signal wave. The movable adjustment wheel structure is installed at the bottom of the body, and the side protection shell is installed at the left and right ends of the body to protect the fixed-point dynamic heat conduction and heat dissipation components. The front rail door is hingedly installed on the side of the body.

[0018] Preferably, the dynamic protection component includes:

[0019] A top annular guide frame, a bottom annular guide rail and a rotating electromagnetic protection arc plate, an electromagnetic signal detection sensor is installed on the side of the top annular guide frame, the top and bottom of the rotating electromagnetic protection arc plate are slidably connected inside the top annular guide frame and the bottom annular guide rail through an edge-connected L sliding frame, flow slot frames are arranged on the four ends of the circumference of the body, the circumference of the flow slot frame is connected to a circulating coolant flow pipe, the side of the circulating coolant flow pipe is connected to a circulating pump pipe, and the interior of the circulating coolant flow pipe is filled with magnetic flow particles through the top injection end.

[0020] Preferably, an electromagnetic coil control structure is installed inside the circulation slot frame, and the electromagnetic coil control structure is used to control the arrangement of the magnetic flow particles in the circulating coolant flow pipe.

[0021] Compared with the prior art, the present invention has the following beneficial effects:

[0022] 1. In the present invention, with the cooperation of the fixed-point dynamic heat-conducting and heat-dissipating component, a high-precision temperature detection sensor is used to monitor the temperature changes of the heat sources of the CPU and GPU with different power consumption inside the body in real time, and the data is fed back to the external PLC controller. At the same time, the stress sensor monitors the stress changes on the support shaft section arm frame in real time, and feeds back the data to the external PLC controller, so that the stress sensor can dynamically adjust the supporting strength of the support shaft section arm frame when the support shaft section arm frame is operating, so that the support shaft section arm frame can effectively support the fixed-point dynamic heat-conducting and heat-dissipating component, and ensure that the fixed-point dynamic heat-conducting and heat-dissipating component can be opened according to the positions of multiple groups of position slots, and dynamically adjusted at both ends of the body. After that, the external PLC controller controls the position calibration sliding seat to drive the rotating motor box to slide along the horizontal hinge guide rail according to the data of the temperature sensor and the stress sensor to achieve preliminary position calibration. At the same time, the external PLC controller controls the electric rotating joint to drive the motor drive seat to rotate, and drives the first transmission arm frame and the second transmission arm frame to drive the motor drive seat to rotate. The rotating support frame rotates, and the rotating support frame drives the engaging rotating rod to rotate through the rotating motor, and engages with multiple sets of position slots to achieve dynamic position adjustment, and then with the cooperation of the rotating motor box, the pneumatic drive slot frame drives the scissor-type extension frame and the related structures it carries to perform rotation stunts, and the pneumatic drive drives the scissor-type extension frame to extend and retract, drive the working frame plate to extend and retract, and make the working frame plate drive the heat-conducting frame and the semiconductor contact end to extend and retract, so as to achieve precise contact with the heat source point, and according to the relevant positions of the CPU and GPU, the external PLC controller drives the rack chain rail structure on the extension frame to move by driving the small motor, and engages with the toothed end and the sliding groove rail, so that the extension frame is located on the surface of the working frame plate for sliding adjustment, so as to achieve precise positioning of the heat-conducting frame and the semiconductor contact end, and at the same time, through the cooperation of the high-efficiency heat dissipation ceramic plate group and the top semiconductor cooling plate, it forms a coordinated operation with the fixed-point dynamic heat-conducting and heat-dissipating components, so as to achieve the stability and reliability of the industrial computer when running under high load, and ensure the optimization of the heat dissipation effect.

[0023] 2. In the present invention, the electromagnetic signal detection sensor detects the emission direction of the external electromagnetic signal in real time with the cooperation of the dynamic protection component, and feeds back the data to the external PLC controller. The external PLC controller drives the top annular guide rail frame according to the data of the electromagnetic signal detection sensor to make the rotating electromagnetic protection arc plate slide synchronously on the track of the bottom annular guide rail, and adjusts the rotating electromagnetic protection arc plate to a suitable angle to cope with electromagnetic interference from different directions. Then, the magnetic flow particles are injected into the circulating coolant flow pipe, so that the electromagnetic coil control structure generates a magnetic field through the electromagnetic coil according to the instruction issued by the external PLC controller, controls the magnetic flow particles to form a specific arrangement in the circulating coolant flow pipe, and enhances the shielding effect of the electromagnetic signal. At the same time, the circulating pump pipe is started to drive the magnetic flow particles to flow in the circulating coolant flow pipe to ensure the uniform distribution of the magnetic flow particles. The flowing magnetic flow particles further enhance the shielding effect of the electromagnetic signal, and then through the dynamic adjustment of the rotating electromagnetic protection arc plate and the control of the magnetic flow particles, the dynamic protection of the external electromagnetic signal is realized, so that the stability and reliability of the industrial computer are ensured in a high electromagnetic interference environment. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 This is a schematic diagram of the main structure of a high-performance heat dissipation device for an industrial computer according to the present invention;

[0025] Figure 2 It is a schematic structural diagram of a high-performance heat dissipation device for an industrial computer from a side view according to the present invention;

[0026] Figure 3 It is a structural schematic diagram of a dynamic protection component in an industrial computer of the present invention;

[0027] Figure 4 In an industrial control computer of the present invention Figure 3 A schematic diagram of the enlarged structure at point A;

[0028] Figure 5 It is a schematic diagram of the installation position structure of a fixed-point dynamic heat conduction and heat dissipation component in a high-performance heat dissipation device for an industrial computer of the present invention;

[0029] Figure 6 This is a schematic diagram of the separation structure of a body in a high-performance heat dissipation device for an industrial computer of the present invention;

[0030] Figure 7 This is a schematic diagram of the internal structure of a body in a high-performance heat dissipation device for an industrial computer of the present invention;

[0031] Figure 8 It is a structural schematic diagram of a fixed-point dynamic heat conduction and heat dissipation component in a high-performance heat dissipation device for an industrial computer of the present invention;

[0032] Fig. 9A high-performance heat dissipation device for an industrial computer according to the present invention Figure 8 A schematic diagram of the enlarged structure at B;

[0033] Fig.10 It is a partial structural schematic diagram of a fixed-point dynamic heat conduction and heat dissipation component in a high-performance heat dissipation device for an industrial computer of the present invention;

[0034] Fig.11 This is a schematic structural diagram of part of a fixed-point dynamic heat-conducting heat-dissipating component in a high-performance heat-dissipating device for an industrial computer according to the present invention from another angle.

[0035] In the figure: 1, machine body; 2, dynamic protection assembly; 201, top annular guide rail frame; 202, bottom annular guide rail; 203, circulating coolant flow pipe; 204, circulation slot frame; 205, rotating electromagnetic protection arc plate; 206, circulating pump pipe; 207, electromagnetic coil control structure; 3, heat dissipation mesh; 4, heat dissipation frame; 5, heat dissipation axial flow fan; 6, movable adjustment wheel structure; 7, front rail door; 8, high-efficiency heat dissipation ceramic plate group; 9, side protection shell; 10, protection plate; 11, fixed-point dynamic heat conduction and heat dissipation assembly; 110, horizontal hinge guide rail; 111, position calibration sliding seat; 112, electric rotating joint; 113, support shaft joint arm; 114, stress sensor; 115, rotating Motor box; 116, motor drive seat; 117, first transmission arm; 118, second transmission arm; 119, rotating support frame; 1190, give way groove; 1191, swivel shaft; 1192, rotating motor; 1193, engaging rotating rod; 1194, pneumatic drive slot frame; 1195, scissor-type extension frame; 1196, working frame plate; 1197, toothed end; 1198, sliding groove rail; 1199, extension plate frame; 1110, heat conduction frame; 1111, semiconductor contact end; 1112, driving small motor; 1113, rack chain rail structure; 12, top semiconductor cooling plate; 13, heat dissipation fan; 14, position notch; 15, high-precision temperature detection sensor. DETAILED DESCRIPTION

[0036] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the implementation regulations described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0037] In the present invention, reference is made to Figure 1-Figure 11 Shown: A high-performance heat dissipation device for an industrial computer, comprising:

[0038] An efficient heat dissipation ceramic sheet group 8 is installed on the inner bottom side of the body 1 to quickly dissipate the heat generated inside the body 1 to ensure the stability and reliability of the body 1 when running under high load;

[0039] A top semiconductor cooling plate 12 is installed inside the top of the body 1 and is used to quickly dissipate the heat generated inside the body 1 through the cooperation of the semiconductor cooling plate 12 and two sets of heat dissipation axial flow fans 5;

[0040] A fixed-point dynamic heat conduction and heat dissipation component 11 is installed on the protective plate 10 that is fastened to the left and right sides of the body 1, and a plurality of position slots 14 are evenly spaced on the surface of the protective plate 10, which are used to dynamically form a fixed-point heat conduction and heat dissipation operation according to the temperature variable area change of the heat source point inside the body 1;

[0041] The high-precision temperature detection sensors 15 are installed in an array on the side of the heat source point of the body 1 to monitor the temperature change of the body 1 in real time and feed back to the fixed-point dynamic heat conduction and heat dissipation component 11 to enable it to operate in time.

[0042] In the first invention, according to Figure 5-Figure 11 As shown, the fixed-point dynamic heat conduction and heat dissipation component 11 includes:

[0043] The transverse hinge guide rail 110, the side frame, the electric rotating joint 112, the support shaft joint arm 113 and the stress sensor 114, the side frame is fastened to the left and right ends of the transverse hinge guide rail 110, the electric rotating joint 112 is installed on the side end of the side frame, the support shaft joint arm 113 is fastened to the bottom of the side frame, and is used to support the transverse hinge guide rail 110 and the related structures it carries, the stress sensor 114 is installed on the frame surface of the support shaft joint arm 113, the side of the electric rotating joint 112 is hinged with a motor drive seat 116, and the output end of the motor drive seat 116 is connected to the first transmission arm 117.

[0044] The side end of the first transmission arm 117 is hinged to the second transmission arm 118, and the side end of the second transmission arm 118 is rotatably connected to a rotating carrier body 119. A clearance groove 1190 is opened on the surface of the rotating carrier body 119, and a swivel shaft 1191 is hinged at the bottom end of the rotating carrier body 119. A rotating motor 1192 is installed inside the top end of the rotating carrier body 119.

[0045] The side end of the rotating motor 1192 is connected to an engaging rotating rod 1193, which is used to engage with multiple sets of position slots 14. The side of the transverse hinge guide rail 110 is slidably connected to a position calibration sliding seat 111. The side end of the position calibration sliding seat 111 is installed with a rotating motor box 115. The side end of the rotating motor box 115 is fastened with a pneumatic drive slot frame 1194. The side end of the pneumatic drive slot frame 1194 is connected to a scissor-type extension frame 1195.

[0046] The side end of the scissor-type extension frame 1195 is fastened to the working frame plate 1196, and the side end surfaces of the working frame plate 1196 are respectively installed with a rack end 1197 and a sliding groove rail 1198. The side ends of the rack end 1197 and the sliding groove rail 1198 are meshed and connected with an extension frame 1199. A small driving motor 1112 is installed on the side end surface of the extension frame 1199, and the side end of the small driving motor 1112 is connected with a rack chain rail structure 1113.

[0047] The side end of the extension frame 1199 is fastened with a heat-conducting frame 1110 , and the side end of the heat-conducting frame 1110 is installed with a semiconductor contact terminal 1111 . The heat-conducting frame 1110 is connected via a high-heat-conductivity transmission tube and an efficient heat-dissipating ceramic sheet group 8 .

[0048] A heat dissipation fan 13 is arranged at the inner bottom of the body 1, a heat dissipation frame 4 is installed at the top of the body 1, two groups of heat dissipation axial flow fans 5 are installed on the surface of the heat dissipation frame 4, and a heat dissipation mesh 3 is opened on the front end surface of the heat dissipation frame 4.

[0049] In a specific solution, before the machine body 1 operates, the fixed-point dynamic heat conduction and heat dissipation assembly 11 is installed at the left and right ends of the machine body 1, and the engaging rotating rod 1193 and the plurality of position slots 14 are engaged, so that the fixed-point dynamic heat conduction and heat dissipation assembly 11 forms an operation pre-preparation stage, and then the high-precision temperature detection sensor 15 is used to monitor the temperature changes of the heat sources of the CPU and GPU with different power consumption inside the machine body 1 in real time, and the data is fed back to the external PLC controller, and at the same time, the stress sensor 114 monitors the stress changes on the support shaft section arm frame 113 in real time, and the data is fed back to the external PLC controller, so that the stress sensor 114 is on the support shaft section arm frame 11 During operation, the support strength of the support shaft arm 113 can be dynamically adjusted, so that the support shaft arm 113 can effectively support the fixed-point dynamic heat conduction and heat dissipation component 11, and ensure that the fixed-point dynamic heat conduction and heat dissipation component 11 can be opened according to the positions of the multiple groups of position slots 14, and dynamically adjusted at both ends of the body 1. Then, the external PLC controller controls the position calibration sliding seat 111 to drive the rotating motor box 115 to slide along the transverse hinge guide rail 110 according to the data of the temperature sensor 15 and the stress sensor 114, so as to achieve preliminary position calibration. At the same time, the external PLC controller controls the electric rotating joint 112 to drive the motor driving seat 116 to rotate, and the first The transmission arm 117 and the second transmission arm 118 drive the rotating carrier body 119 to rotate, and the rotating carrier body 119 drives the engaging rod 1193 to rotate through the rotating motor 1192, and forms an engagement with multiple sets of position slots 14 to achieve dynamic position adjustment. Then, with the cooperation of the rotating motor box 115, the pneumatic drive slot frame 1194 drives the scissor-type extension frame 1195 and the related structures it carries to perform rotation stunts, and the pneumatic drive drives the scissor-type extension frame 1195 to extend and retract, and drives the operating frame plate 1196 to extend and retract, so that the operating frame plate 1196 drives the heat-conducting frame 1110 and the semiconductor contact end 1111 to extend and retract, so as to achieve precise contact with the heat source point. And according to the relative positions of the CPU and GPU, the external PLC controller drives the small motor 1112 to drive the rack chain track structure 1113 on the extension frame 1199 to move, engage with the toothed end 1197 and the sliding groove 1198, so that the extension frame 1199 is located on the surface of the working frame 1196 for sliding adjustment, thereby realizing the precise positioning of the heat conducting frame 1110 and the semiconductor contact end 1111. At the same time, through the cooperation of the high-efficiency heat dissipation ceramic plate group 8 and the top semiconductor cooling plate 12, a coordinated operation is formed with the fixed-point dynamic heat conduction and heat dissipation component 11, so as to realize the stability and reliability of the industrial computer when running under high load, and ensure the optimization of the heat dissipation effect.

[0050] The other structures of the present invention are the same as those of the first invention. On the basis of the first invention, a technical means for dynamic protection of the body 1 is added. Figure 1-Figure 6As shown, it includes a dynamic protection component 2, a movable adjustment wheel structure 6, a side protection shell 9 and a front rail door 7. The dynamic protection component 2 is installed on the outer peripheral side of the body 1, and is used to dynamically adjust the protection angle according to the emission direction of the external electromagnetic influence signal wave. The movable adjustment wheel structure 6 is installed at the bottom of the body 1, and the side protection shell 9 is installed at the left and right ends of the body 1 to protect the fixed-point dynamic heat conduction and heat dissipation component 11. The front rail door 7 is hingedly installed on the side of the body 1.

[0051] Dynamic protection component 2 includes:

[0052] A top annular guide rail frame 201, a bottom annular guide rail 202 and a rotating electromagnetic protection arc plate 205, an electromagnetic signal detection sensor is installed on the side of the top annular guide rail frame 201, the top and bottom of the rotating electromagnetic protection arc plate 205 are slidably connected inside the top annular guide rail frame 201 and the bottom annular guide rail 202 through an edge-connected L sliding frame, and circulation slot frames 204 are arranged on the four ends of the peripheral side of the body 1, the peripheral side of the circulation slot frame 204 is connected to a circulating coolant flow pipe 203, the side of the circulating coolant flow pipe 203 is connected to a circulating pump pipe 206, and the interior of the circulating coolant flow pipe 203 is filled with magnetic flow particles through the top injection end.

[0053] An electromagnetic coil control structure 207 is installed inside the circulation slot frame 204 . The electromagnetic coil control structure 207 is used to control the arrangement of magnetic flow particles in the circulating coolant flow pipe 203 .

[0054] In a specific solution, the electromagnetic signal detection sensor detects the emission direction of the external electromagnetic signal in real time and feeds back the data to the external PLC controller. The external PLC controller drives the top annular guide rail frame 201 according to the data of the electromagnetic signal detection sensor to make the rotating electromagnetic protection arc plate 205 slide synchronously on the track of the bottom annular guide rail 202, adjust the rotating electromagnetic protection arc plate 205 to a suitable angle to cope with electromagnetic interference from different directions, and then inject magnetic flow particles into the circulating coolant flow pipe 203, so that the electromagnetic coil control structure 207 is controlled according to the external PLC controller. The instructions sent by the controller generate a magnetic field through the electromagnetic coil, controlling the magnetic flow particles to form a specific arrangement in the circulating coolant flow pipe 203, thereby enhancing the shielding effect on the electromagnetic signal. At the same time, the circulating pump pipe 206 is started to drive the magnetic flow particles to flow in the circulating coolant flow pipe 203, ensuring the uniform distribution of the magnetic flow particles. The flowing magnetic flow particles further enhance the shielding effect on the electromagnetic signal, and then through the dynamic adjustment of the rotating electromagnetic protection arc plate 205 and the control of the magnetic flow particles, dynamic protection against external electromagnetic signals is achieved, thereby ensuring the stability and reliability of the industrial computer in a high electromagnetic interference environment.

[0055] The wiring diagram of the electromagnetic coil control structure 207, stress sensor 114, rotating motor box 115, motor drive seat 116, rotating motor 1192, driving small motor 1112, high-precision temperature detection sensor 15 and electromagnetic signal detection sensor in the present invention is common knowledge in the field, and its working principle is a well-known technology. The model is selected according to the actual use. Therefore, the control method and wiring arrangement of the electromagnetic coil control structure 207, stress sensor 114, rotating motor box 115, motor drive seat 116, rotating motor 1192, driving small motor 1112, high-precision temperature detection sensor 15 and electromagnetic signal detection sensor will no longer be explained in detail.

[0056] The method of using and working principle of the device: First, before the machine body 1 is operated, the fixed-point dynamic heat-conducting and heat-dissipating component 11 is installed on the left and right ends of the machine body 1, and the engaging rotating rod 1193 and the multiple sets of position slots 14 are engaged, so that the fixed-point dynamic heat-conducting and heat-dissipating component 11 forms an operation pre-preparation stage, and then the high-precision temperature detection sensor 15 is used to monitor the temperature changes of the heat sources of the CPU and GPU with different power consumption inside the machine body 1 in real time, and the data is fed back to the external PLC controller. At the same time, the stress sensor 114 monitors the stress changes on the support shaft arm frame 113 in real time, and the data is fed back to the external PLC controller, so that the stress sensor 114 can dynamically adjust the support strength of the support shaft arm frame 113 when the support shaft arm frame 113 is operating. , so that the support shaft arm 113 can effectively support the fixed-point dynamic heat-conducting and heat-dissipating component 11, and ensure that the fixed-point dynamic heat-conducting and heat-dissipating component 11 can be opened according to the positions of the multiple groups of position slots 14, and dynamically adjusted at both ends of the body 1. Then, the external PLC controller controls the position calibration sliding seat 111 to drive the rotating motor box 115 to slide along the transverse hinge guide rail 110 according to the data of the temperature sensor 15 and the stress sensor 114, so as to achieve preliminary position calibration. At the same time, the external PLC controller controls the electric rotating joint 112 to drive the motor driving seat 116 to rotate, and drives the rotating bearing frame 119 to rotate through the first transmission arm 117 and the second transmission arm 118. The rotating bearing frame 119 drives the engaging rotating frame 119 through the rotating motor 1192 The rod 1193 rotates and engages with the multiple groups of position slots 14 to achieve dynamic position adjustment. Then, with the cooperation of the rotating motor box 115, the pneumatic drive slot frame 1194 drives the scissor-type extension frame 1195 and the related structures it carries to perform rotation stunts, and the pneumatic drive drives the scissor-type extension frame 1195 to extend and retract, driving the operating frame 1196 to extend and retract, so that the operating frame 1196 drives the heat-conducting frame 1110 and the semiconductor contact end 1111 to extend and retract, so as to achieve precise contact with the heat source point, and according to the relevant positions of the CPU and GPU, the external PLC controller drives the rack chain track structure 1113 on the extension frame 1199 to move by driving the small motor 1112, and engages with the toothed end 1197 and the sliding slot rail 1198, so as to make The extension frame 1199 is located on the surface of the working frame plate 1196 for sliding adjustment to achieve precise positioning of the heat-conducting frame 1110 and the semiconductor contact terminal 1111. At the same time, through the cooperation of the high-efficiency heat-dissipating ceramic plate group 8 and the top semiconductor cooling plate 12, it forms a coordinated operation with the fixed-point dynamic heat-conducting and heat-dissipating component 11 to achieve the stability and reliability of the industrial computer when running under high load, ensure the optimization of the heat dissipation effect, and enable the electromagnetic signal detection sensor to detect the emission direction of the external electromagnetic signal in real time, and feed back the data to the external PLC controller. The external PLC controller drives the top annular guide rail frame 201 according to the data of the electromagnetic signal detection sensor, so that the rotating electromagnetic protection arc plate 205 is located on the track of the bottom annular guide rail 202 to slide synchronously.Adjust the rotating electromagnetic protection arc plate 205 to a suitable angle to cope with electromagnetic interference from different directions, then inject the magnetic flow particles into the circulating coolant flow pipe 203, so that the electromagnetic coil control structure 207 generates a magnetic field through the electromagnetic coil according to the instructions issued by the external PLC controller, and controls the magnetic flow particles to form a specific arrangement in the circulating coolant flow pipe 203 to enhance the shielding effect of electromagnetic signals. At the same time, the circulating pump pipe 206 is started to drive the magnetic flow particles to flow in the circulating coolant flow pipe 203 to ensure the uniform distribution of the magnetic flow particles. The flowing magnetic flow particles further enhance the shielding effect of electromagnetic signals, and then through the dynamic adjustment of the rotating electromagnetic protection arc plate 205 and the control of the magnetic flow particles, dynamic protection against external electromagnetic signals is achieved, so that the stability and reliability of the industrial computer are ensured in a high electromagnetic interference environment.

[0057] Although the present invention has been described in detail with reference to the aforementioned embodiments, it is still possible for those skilled in the art to modify the technical solutions described in the aforementioned embodiments, or to make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A high-performance heat dissipation device for an industrial computer, characterized in that: Included are: A high-efficiency heat dissipation ceramic sheet group (8) is mounted on the inner bottom side of the machine body (1) and is used to quickly dissipate the heat generated inside the machine body (1) to ensure the stability and reliability of the machine body (1) when running at high load; A top semiconductor cooling plate (12) is installed inside the top of the machine body (1) and is used to quickly dissipate heat generated inside the machine body (1) through the cooperation of the semiconductor cooling plate (12) and two sets of heat dissipation axial flow fans (5); A fixed-point dynamic heat conduction and heat dissipation component (11) is mounted on a protective plate (10) that is fastened to the left and right sides of the interior of the machine body (1), and a plurality of groups of position slots (14) are evenly spaced on the surface of the protective plate (10) for dynamically performing a fixed-point heat conduction and heat dissipation operation according to a temperature variable region change of a heat source point inside the machine body (1); High-precision temperature detection sensors (15) are installed in an array on the side of the heat source point of the machine body (1) to monitor the temperature change of the machine body (1) in real time and feed back to the fixed-point dynamic heat conduction and heat dissipation component (11) so that it can operate in time; The fixed-point dynamic heat conduction and heat dissipation component (11) comprises: A transverse hinge rail (110), a side frame, an electric rotating joint (112), a support shaft joint arm frame (113) and a stress sensor (114), wherein the side frame is fastened to the left and right ends of the transverse hinge rail (110), the electric rotating joint (112) is installed on the side end of the side frame, the support shaft joint arm frame (113) is fastened to the bottom of the side frame and is used to support the transverse hinge rail (110) and the related structure it carries, the stress sensor (114) is installed on the frame surface of the support shaft joint arm frame (113), the side of the electric rotating joint (112) is hinged with a motor drive seat (116), and the output end of the motor drive seat (116) is connected to a first transmission arm frame (117); The side end of the first transmission arm (117) is hingedly connected to the second transmission arm (118), the side end of the second transmission arm (118) is rotatably connected to a rotating support frame (119), a clearance groove (1190) is provided on the surface of the rotating support frame (119), a swivel shaft (1191) is hingedly connected to the bottom end of the rotating support frame (119), and a rotating motor (1192) is installed inside the top end of the rotating support frame (119); The side end of the rotary motor (1192) is connected to a locking rotating rod (1193), and the locking rotating rod (1193) is used to form a locking engagement with a plurality of position slots (14). The side of the transverse hinge guide rail (110) is slidably connected to a position calibration sliding seat (111), and the side end of the position calibration sliding seat (111) is installed with a rotary motor box (115), and the side end of the rotary motor box (115) is fastened with a pneumatic drive slot frame (1194), and the side end of the pneumatic drive slot frame (1194) is connected to a scissor-type extension frame (1195); The side end of the scissor-type extension frame (1195) is fastened to an operation frame plate (1196), and a toothed end (1197) and a sliding groove rail (1198) are respectively installed on the side end surface of the operation frame plate (1196). The side ends of the toothed end (1197) and the sliding groove rail (1198) are meshingly connected to an extension frame (1199), and a small driving motor (1112) is installed on the side end surface of the extension frame (1199), and the side end of the small driving motor (1112) is connected to a rack chain rail structure (1113); The side end of the extension frame (1199) is fastened with a heat-conducting frame (1110), the side end of the heat-conducting frame (1110) is installed with a semiconductor contact end (1111), and the heat-conducting frame (1110) is connected via a high-heat-conductivity transmission tube and a high-efficiency heat-dissipating ceramic sheet group (8).

2. The high-performance heat dissipation device for industrial computers according to claim 1, characterized in that: A heat dissipation fan (13) is arranged at the bottom end of the body (1), a heat dissipation frame (4) is installed at the top end of the body (1), the two groups of heat dissipation axial flow fans (5) are installed on the surface of the heat dissipation frame (4), and a heat dissipation mesh hole (3) is opened on the front end surface of the heat dissipation frame (4).

3. An industrial computer, characterized in that: The invention comprises a dynamic protection component (2), a movable adjustment wheel structure (6), a side protection shell (9) and a front rail door (7), wherein the dynamic protection component (2) is mounted on the outer peripheral side of the machine body (1) and is used to dynamically adjust the protection angle according to the emission direction of the external electromagnetic influence signal wave, the movable adjustment wheel structure (6) is mounted on the bottom of the machine body (1), the side protection shell (9) is mounted on the left and right ends of the machine body (1) and is used to protect the fixed-point dynamic heat conduction and heat dissipation component (11), and the front rail door (7) is hingedly mounted on the side of the machine body (1); The dynamic protection component (2) comprises: A top annular guide rail frame (201), a bottom annular guide rail (202) and a rotating electromagnetic protection arc plate (205); an electromagnetic signal detection sensor is installed on the side of the top annular guide rail frame (201); the top and bottom of the rotating electromagnetic protection arc plate (205) are slidably connected inside the top annular guide rail frame (201) and the bottom annular guide rail (202) through an edge-connected L sliding frame; a circulation slot frame (204) is arranged at four ends of the peripheral side of the body (1); a circulating coolant flow pipe (203) is connected to the peripheral side of the circulation slot frame (204); a circulating pump pipe (206) is connected to the side of the circulating coolant flow pipe (203); and the interior of the circulating coolant flow pipe (203) is filled with magnetic flow particles through the top injection end; An electromagnetic coil control structure (207) is installed inside the circulation slot frame (204), and the electromagnetic coil control structure (207) is used to control the arrangement of magnetic flow particles in the circulating coolant flow pipe (203).

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