Semiconductor device air pressure circulation detection apparatus
Patent Information
- Application Number
- CN202521927174.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-09-08
- Publication Date
- 2026-08-18
- Estimated Expiration
- 2035-09-08
AI Technical Summary
[0004]上述技术方案存在的技术问题是,该半导体器件检测装置只能针对半导体器件在单一环境下进行检测,不能模拟半导体器件在实际工作中气压变化的环境,进而无法测得实际工作环境下半导体器件的电气结构变化,其检测结果参考价值低
1、本申请中,通过控制单元对私服电钢的精准控制,实现待测件与检测探针之间的精准接触以及检测之后的平稳分离,避免检测探针与待测件之间的碰撞损伤。
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Figure CN224651483U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the technical field of semiconductor device fabrication, and in particular to a semiconductor device air pressure circulation detection device. Background Technology
[0002] With the development of semiconductor technology, semiconductor devices are being used more and more widely in various industries. However, the electrical performance of semiconductor devices is easily affected by atmospheric pressure, especially in special application scenarios such as aviation and deep sea, where semiconductors need to operate stably in environments with cyclical changes in atmospheric pressure.
[0003] Chinese patent document CN119619813A, entitled "Wafer Fixture and Wafer Aging Test Apparatus and Wafer Aging Test Method Thereof," discloses a wafer fixture, a wafer aging test apparatus, and a wafer aging test method thereof. The wafer fixture includes: a lower fixture for carrying a wafer; an upper fixture disposed above the lower fixture in a manner capable of engaging with the lower fixture; a sealing member disposed between the upper and lower fixtures and surrounding the wafer, wherein when the upper fixture engages with the lower fixture, the sealing member is pressed by the upper and lower fixtures in the vertical direction, thereby defining a sealed chamber for accommodating the wafer; and a second gas passage connected to the sealed chamber for providing protective gas to the sealed chamber.
[0004] The technical problem with the above-mentioned technical solution is that the semiconductor device detection device can only detect semiconductor devices in a single environment and cannot simulate the environment of air pressure changes in actual operation of semiconductor devices. Therefore, it cannot measure the changes in the electrical structure of semiconductor devices under actual working conditions, and its detection results have low reference value.
[0005] Therefore, this application provides an apparatus for testing semiconductor performance in a simulated air pressure cycling environment. Utility Model Content
[0006] In view of the shortcomings of the prior art described above, the purpose of this utility model is to provide a semiconductor device air pressure cycle testing device, which realizes precise control of the air pressure inside the chamber through an air pressure regulation module, better simulates the air pressure changes during actual use, and improves the accuracy and reliability of semiconductor performance testing results under air pressure cycle scenarios.
[0007] To achieve the above and other related objectives, this utility model provides the following technical solution: A semiconductor device air pressure cycle testing device includes: a housing, including a worktable and a shell covering the worktable; The detection assembly, which is set on the worktable for detecting the test piece, includes a transfer structure set on the worktable, a transfer stage set on the transfer structure for clamping and transferring the test piece, and a detection probe set on the upper end of the transfer stage that abuts against the test piece. The air pressure regulating module used to change the air pressure inside the box includes an air pump, a vacuum pump connected to the inside of the box, and a pressure sensor located inside the box for real-time monitoring of the air pressure inside the box. And a control unit that is electrically connected to the detection components and the air pressure regulation module.
[0008] To achieve the above technical solution, a multi-segment air pressure circulation environment is accurately generated inside the chamber using an air pressure circulation simulation testing device. This allows for precise testing of the electrical performance of semiconductor devices under set air pressure circulation conditions, solving the problem of insufficient accuracy of semiconductor testing under a single air pressure.
[0009] Furthermore, the detection assembly includes a mounting plate parallel to the transfer stage and a servo electric cylinder mounted on the mounting plate for driving the detection probe; the mounting plate has an opening corresponding to the transfer stage, and the end of the detection probe passes through the opening and abuts against the workpiece under test.
[0010] To achieve the above technical solution, the control unit sends a pulse signal to the servo cylinder, which drives the detection probe to move back and forth in the vertical direction, thereby achieving precise contact between the test piece and the detection probe and smooth separation after detection, avoiding collision damage between the detection probe and the test piece.
[0011] Furthermore, the servo electric cylinder is connected to the control unit by an electrical signal. The stroke accuracy of the servo electric cylinder is ±0.01mm, and the movement speed is 0.1~10mm / s.
[0012] To achieve the above technical solution, the stable clamping of the test piece by the transfer stage and the high-precision driving of the detection probe by the servo electric cylinder are used to realize the precise contact between the test piece and the detection probe.
[0013] Furthermore, the transfer stage is made of ceramic, and several drive units are installed on the side away from the detection probe. The output end of the drive unit is connected to a gripper; the gripper passes through the transfer stage to hold the side of the test piece.
[0014] The above technical solution enables the grippers to penetrate the transfer stage and hold the workpiece under test, and to flexibly hold it according to the size and type of the workpiece under test, thereby achieving precise radial and peripheral positioning of the workpiece under test.
[0015] Furthermore, the transfer structure includes a transverse guide rail on the worktable, a sliding plate slidably mounted on the transverse guide rail, and a lead screw arranged along the length of the sliding plate; the transfer table and the lead screw are connected by a threaded transmission.
[0016] The above technical solution is achieved by using transverse guide rails and sliding plates that are slidably connected to each other, along with a lead screw on the sliding plate, which enables flexible and precise positioning of the transfer stage within a limited space.
[0017] Furthermore, the workbench is equipped with an air inlet connected to an air pump and an exhaust port connected to a vacuum pump.
[0018] The above technical solution enables the air pump and vacuum pump to be connected to the inside of the housing.
[0019] Furthermore, the control unit controls the vacuum pump or air pump to operate based on the air pressure parameters transmitted by the pressure sensor, so that the air pressure inside the chamber changes according to a preset curve; the air pressure adjustment range inside the chamber is 10kPa~101kPa.
[0020] To achieve the above technical solution, the vacuum pump and the air pump work together in coordination by setting the parameters of the control unit, so as to accurately control the air pressure inside the chamber and better simulate the actual use environment.
[0021] Furthermore, the control unit includes a built-in programmable controller and an interactive screen, which is used to set air pressure circulation parameters, control the motion parameters of the detection probe, and display the electrical performance data of the tested device.
[0022] To achieve the above technical solution, the built-in programmable controller and interactive screen in the control unit facilitate technicians in inputting air pressure transformation parameters and probe motion parameters into the control unit. On the other hand, it also facilitates technicians in observing changes in the electrical performance data of the device under test at various stages.
[0023] Furthermore, the casing is made of stainless steel, and its inner wall is coated with an anti-corrosion coating.
[0024] The above technical solution effectively increases the air pressure sealing and corrosion resistance of the enclosure.
[0025] As described above, the semiconductor device air pressure circulation detection device of this utility model has the following beneficial effects: 1. In this application, the precise control of the servo switch by the control unit enables precise contact between the test piece and the test probe, as well as smooth separation after testing, thus avoiding collision damage between the test probe and the test piece.
[0026] 2. In this application, a multi-segment air pressure circulation environment is accurately generated in the chamber by using an air pressure circulation simulation testing device. This allows for accurate testing of the electrical performance of semiconductor devices under set air pressure circulation conditions, solving the problem of insufficient semiconductor testing accuracy in a single air pressure testing environment. Attached Figure Description
[0027] Figure 1 The diagram shown is a structural schematic of a semiconductor device air pressure circulation detection device according to this utility model.
[0028] Figure 2 The diagram shown is an internal structure schematic of a semiconductor device air pressure circulation detection device according to this utility model.
[0029] Figure 3 The diagram shown is a schematic representation of the internal structure of the detection component in this invention.
[0030] Figure 4 The image shown is a bottom view of the transfer stage in this invention.
[0031] Figure 5 The diagram shown is a schematic representation of the internal structure of the cabinet in this utility model.
[0032] The components include: 1. Housing; 11. Workbench; 111. Air inlet; 112. Exhaust outlet; 12. Shell; 2. Detection components; 21. Transfer structure; 211. Transverse guide rail; 212. Sliding plate; 213. Lead screw; 22. Transfer stage; 221. Drive unit; 222. Gripper; 223. Strip-shaped limiting groove; 224. Connecting block; 23. Detection probe; 24. Mounting plate; 241. Opening; 25. Servo electric cylinder; 3. Air pressure regulation module; 31. Air pump; 32. Vacuum pump; 33. Pressure sensor; 4. Control unit; 41. Interactive screen; 5. Cabinet. Detailed Implementation
[0033] The following specific embodiments illustrate the implementation of this utility model. Those skilled in the art can easily understand other advantages and effects of this utility model from the content disclosed in this specification.
[0034] Please see Figure 1-5 It should be understood that the structures, proportions, sizes, etc., illustrated in the accompanying drawings are merely for illustrative purposes to aid those skilled in the art and are not intended to limit the scope of this invention. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in proportions, or adjustments to size, without affecting the effectiveness and purpose of this invention, should still fall within the scope of the disclosed technical content. Furthermore, the terms "upper," "lower," "left," "right," "middle," and "one" used in this specification are merely for clarity and not intended to limit the scope of this invention. Changes or adjustments to their relative relationships, without substantially altering the technical content, should also be considered within the scope of this invention.
[0035] Please see Figures 1 to 5This utility model provides a semiconductor device air pressure cycle detection device, including a housing 1, a detection component 2 disposed in the housing 1, an air pressure regulating module 3, and a control unit 4 electrically connected to the detection component 2 and the air pressure regulating module 3.
[0036] The housing 1 includes a workbench 11 and a housing 12 covering the workbench 11. The detection assembly 2, located on the workbench 11, is used to detect the workpiece under test. It includes a transfer mechanism on the workbench 11, a transfer stage 22 on the transfer structure 21 for clamping and transferring the workpiece under test, and a detection probe 23 located above the transfer stage 22 with its end abutting against the workpiece under test. Preferably, a seal is provided at the connection between the housing 12 and the workbench 11 to enhance the sealing at the connection and ensure a smooth detection process.
[0037] Furthermore, the air pressure regulation module 3 includes an air pump 31 and a vacuum pump 32 connected inside the housing 1, as well as a pressure sensor 33 located inside the housing 1 for real-time detection of the air pressure inside the housing 1.
[0038] Furthermore, the control unit 4 is electrically connected to the gas regulation module of the detection unit. The control unit 4 sends electrical signals to the air pump 31 and the vacuum pump 32 based on the pressure parameters inside the housing 1 transmitted from the pressure sensor 33, in order to decrease or increase the air pressure inside the housing 1.
[0039] Once the device under test (DUT) and the detection probe 23 establish stable contact, the detection probe 23 acts as a "signal bridge" to transmit electrical signals between the testing equipment and the DUT, simulating the electrical environment of the DUT during actual operation and triggering the electrical response of the DUT.
[0040] By using a pneumatic circulation simulation testing device, a multi-segment pneumatic circulation environment is accurately generated within chamber 1. This allows for precise testing of the electrical performance of semiconductor devices under set pneumatic circulation conditions, solving the problem of insufficient accuracy in semiconductor testing under a single pneumatic pressure testing environment.
[0041] Please continue reading. Figures 2 to 3 The detection component 2 includes a mounting plate 24 disposed parallel above the transfer stage 22 and a servo electric cylinder 25 disposed on the mounting plate 24 for driving the detection probe 23.
[0042] Specifically, the mounting plate 24 has an opening 241 corresponding to the transfer stage 22. Driven by the servo cylinder 25, the end of the detection probe 23 passes through the opening 241 to contact or move away from the test piece.
[0043] In this configuration, a servo cylinder 25 and a detection probe 23 are configured in a one-to-one correspondence. The control unit 4 sends pulse signals to the servo cylinder 25, which drives the detection probe 23 to reciprocate vertically. This achieves precise contact between the workpiece under test and the detection probe 23, as well as smooth separation after testing, avoiding collision damage between the detection probe 23 and the workpiece under test. Preferably, the stroke accuracy of the servo cylinder 25 is ±0.01mm, and the movement speed is 0.1~10mm / s.
[0044] In this embodiment, the stable clamping of the test piece by the transfer stage 22 and the high-precision driving of the detection probe 23 by the servo electric cylinder 25 achieve precise contact between the test piece and the detection probe 23.
[0045] Please continue reading. Figures 3 to 4 The transfer stage 22 is a ceramic structure, and several drive units 221 are installed on the side away from the detection probe 23. The output end of the drive unit 221 is connected to a gripper 222. The gripper 222 passes through the transfer stage 22 from the bottom to the top to hold the side of the test piece, so as to achieve precise radial positioning of the test piece.
[0046] Specifically, the transfer stage 22 has several strip-shaped limiting grooves 223. The grippers 222 are at least partially accommodated within these grooves and, driven by the drive unit 221, reciprocate along the opening direction of the grooves 223 to move closer to or further away from the side of the workpiece under test. Each gripper 222 is connected to the output of a single drive unit 221, ensuring that the grippers 222 can firmly hold the workpiece even if its size changes. Preferably, the drive unit 221 is a servo motor.
[0047] Please continue reading. Figure 3 The transfer structure 21 includes a transverse guide rail 211 mounted on the worktable 11, a sliding plate 212 slidably mounted on the transverse guide rail 211, and a lead screw 213 arranged along the length of the sliding plate 212. A connecting block 224 is also provided on the side of the transfer table 22 away from the detection probe 23. The connecting block 224 has a threaded hole, and a sliding connection between the transfer table 22 and the sliding plate 212 is achieved through the threaded transmission connection between the connecting block 224 and the lead screw 213.
[0048] Since the size, pins and pad positions of the test device are different, the position between the test device and the test probe 23 needs to be constantly adjusted. Although the position between the two can be changed by disassembling the test probe 23, the disassembly and reinstallation steps are too cumbersome. Therefore, by using the transverse guide rail 211 and the sliding plate 212 that are slidably connected to each other, plus the lead screw 213 on the sliding plate 212, the transfer stage 22 can be flexibly and accurately positioned in a limited space.
[0049] Preferably, the transverse guide rail 211 and the sliding plate 212 are arranged perpendicularly to each other, and the detection probe 23 is moved in the vertical direction to realize the relative movement between the test piece and the inspection probe on the "XYZ" axis, thereby improving the applicability and versatility of the detection component 2.
[0050] Please continue reading. Figure 2 and Figure 5 The workbench 11 has an air inlet 111 connected to the air pump 31 and an exhaust port 112 connected to the vacuum pump 32. Preferably, a cabinet 5 is also provided below the workbench 11, and the air pump 31 and the vacuum pump 32 are located in the cabinet 5 and are connected to the inside of the cabinet 1 through the air inlet 111 and the exhaust port 112, respectively.
[0051] The control unit 4 controls the vacuum pump 32 or the air pump 31 to work according to the air pressure parameters transmitted by the pressure sensor 33, so that the air pressure inside the chamber 1 changes according to the preset curve.
[0052] Specifically, the control unit 4 controls the start / stop and power of the vacuum pump 32 and the air pump 31 to make the air pressure inside the chamber change cyclically according to a preset curve. The air pressure adjustment range inside the chamber 1 is 10kPa to 101kPa. In this embodiment, "reducing pressure to 50kPa → holding pressure for 5 minutes → increasing pressure to 101kPa → holding pressure for 5 minutes" constitutes one cycle, and the number of cycles is adjustable.
[0053] It should be noted that the control unit 4 includes a built-in programmable controller and an interactive screen 41. The interactive screen 41 is used to set air pressure circulation parameters, control the motion parameters of the detection probe 23, and display the electrical performance data of the device under test. Through the settings of the programmable controller and the interactive screen 41 in the control unit 4, technicians can easily input air pressure change parameters and motion parameters of the detection probe 23 into the control unit 4; on the other hand, technicians can easily observe the changes in the electrical performance data of the device under test at various stages.
[0054] In addition, in this embodiment, the housing 12 is made of stainless steel, and its inner wall is provided with an anti-corrosion coating. Preferably, the inner wall of the housing 12 is coated with a polytetrafluoroethylene anti-corrosion coating to improve the air pressure sealing inside the box 1 and the corrosion resistance of the housing 12.
[0055] The implementation principle of the semiconductor device air pressure cycle testing device of this utility model is as follows: A technician places the test piece onto the ceramic transfer stage 22 through the side door of the housing 1. The drive unit 221 drives the gripper 222 to precisely position the test piece circumferentially and moves it inward using the transfer structure 21. Then, the movement parameters of the detection probe 23 are set through the interactive screen 41, ensuring the test piece and the detection probe 23 are in a suitable position. The side door of the housing 1 is closed, and the air pressure cycle parameters, including low pressure, high pressure data, holding time, and number of cycles, are set through the interactive screen 41. The control unit 4 controls the air pressure adjustment module. 3. During operation, vacuum pump 32 evacuates and depressurizes, while air pump 31 replenishes and pressurizes. Sensors are used to detect pressure changes inside chamber 1 in real time and provide feedback to control unit 4 and interactive screen 41. When the cycle ends or the detection conditions are met during the cycle, control unit 4 sends a point signal to servo cylinder 25 to drive detection probe 23 to descend and make precise contact with the test piece. Control unit 4 collects current, voltage, and capacitance signals to complete the detection action and generate IV curve or CV curve. Subsequently, detection probe 23 rises, transfer structure 21 moves transfer stage 22 out, and technicians remove the test piece, completing one detection cycle.
[0056] The above embodiments are merely illustrative of the principles and effects of this utility model and are not intended to limit the scope of this utility model. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of this utility model. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in this utility model should still be covered by the claims of this utility model.
Claims
1. A semiconductor device air pressure circulation detection device, characterized in that, include: The box (1) includes a workbench (11) and a shell (12) covering the workbench (11). The detection assembly (2) is set on the worktable (11) for detecting the test piece, including a transfer structure (21) set on the worktable (11), a transfer stage (22) set on the transfer structure (21) for clamping and transferring the test piece, and a detection probe (23) set above the transfer stage (22) with its end abutting against the test piece. The air pressure regulating module (3) used to change the air pressure inside the box (1) includes an air pump (31) and a vacuum pump (32) connected inside the box (1) and a pressure sensor (33) installed inside the box (1) for real-time monitoring of the air pressure inside the box (1). And a control unit (4) that is electrically connected to the detection component (2) and the air pressure regulation module (3).
2. The semiconductor device air pressure circulation detection device according to claim 1, characterized in that, The detection assembly (2) includes a mounting plate (24) parallel to the transfer stage (22) and a servo electric cylinder (25) on the mounting plate (24) for driving the detection probe (23); the mounting plate (24) has an opening (241) corresponding to the transfer stage (22), and the end of the detection probe (23) passes through the opening (241) and abuts against the test piece.
3. The semiconductor device air pressure circulation detection device according to claim 2, characterized in that... The servo electric cylinder (25) is connected to the control unit (4) by an electrical signal. The stroke accuracy of the servo electric cylinder (25) is ±0.01mm, and the movement speed is 0.1~10mm / s.
4. The semiconductor device air pressure circulation detection device according to claim 1, characterized in that, The transfer stage (22) is made of ceramic material, and several drive units (221) are installed on the side away from the detection probe (23). The output end of the drive unit (221) is connected to a gripper (222). The gripper (222) passes through the transfer stage (22) to hold the side of the test piece.
5. The semiconductor device air pressure circulation detection device according to claim 1, characterized in that, The transfer structure (21) includes a transverse guide rail (211) on the worktable (11), a sliding plate (212) slidably disposed on the transverse guide rail (211), and a lead screw (213) disposed along the length of the sliding plate (212); the transfer table (22) is threadedly connected to the lead screw (213).
6. The semiconductor device air pressure circulation detection device according to claim 1, characterized in that, The workbench (11) is provided with an air inlet (111) connected to the air pump (31) and an exhaust port (112) connected to the vacuum pump (32).
7. The semiconductor device air pressure circulation detection device according to claim 1, characterized in that, The control unit (4) controls the vacuum pump (32) or the air pump (31) to work according to the air pressure parameters transmitted by the pressure sensor (33), so that the air pressure inside the box (1) changes according to the preset curve; the air pressure adjustment range inside the box (1) is 10kPa to 101kPa.
8. The semiconductor device air pressure circulation detection device according to claim 1, characterized in that, The control unit (4) includes a built-in programmable controller and an interactive screen (41). The interactive screen (41) is used to set the air pressure circulation parameters, control the motion parameters of the detection probe (23), and display the electrical performance data of the tested component.
9. The semiconductor device air pressure circulation detection device according to claim 1, characterized in that, The housing (12) is made of stainless steel and has an anti-corrosion coating on its inner wall.
Citation Information
Patent Citations
Wafer clamp, wafer aging test device with wafer clamp and wafer aging test method
CN119619813A