Flip test seat for chips with same pin spacing and various specifications

Abstract

The invention provides a flip test seat with same pin spacing for chips of various specifications, and relates to the technical field of chip test.The flip test seat comprises a base, a mounting groove is formed in the top surface of the base, a third operation panel is fixedly mounted on the inner bottom surface of the mounting groove, and a second operation panel is arranged above the third operation panel; the second operation panel is in plug-in fit with the third operation panel, a first operation table is fixedly mounted on the top surface of the second operation panel, a chip groove is formed in the top surface of the first operation table, a plurality of chip detection rods are fixedly mounted among the first operation table, the second operation panel and the third operation panel, and the chip detection rods are located in the chip groove. The servo motor is started, the output shaft drives the second bevel gear to rotate, the second bevel gear is meshed with the first bevel gear to drive the threaded rod to rotate, the sliding block on the outer side wall of the threaded rod moves along the rod body, the sliding block on the other side synchronously slides along the first sliding rod, and the mounting rod and the top cover are driven to integrally ascend and descend to be close to the top face of the base.

Description

Technical Field

[0001] This invention belongs to the field of chip testing technology, and more specifically, it relates to a flip-type test socket for chips of various specifications with the same pin spacing. Background Technology

[0002] A flip-type chip test socket is a precision connection device used in the chip (integrated circuit IC) testing process. Its core function is to achieve a temporary and reliable electrical connection between the chip and the test equipment (such as a test instrument, probe station, aging test system, etc.) without damaging the chip pins or pads, thereby detecting and verifying the chip's electrical performance, functional integrity, stability and other indicators.

[0003] A flip-type test socket for various chip specifications with the same pin spacing has been found to have at least the following technical problems: In chip manufacturing and quality inspection, flip-type test sockets, as core auxiliary equipment for chip electrical performance testing, are widely used in scenarios involving the testing of chips of various specifications with the same pin spacing but different sizes and pin counts. However, traditional test sockets often have fixed chip placement areas and probe layouts, only suitable for chips of a single size and pin count. When testing chips of different specifications with the same pin spacing, the entire test socket needs to be frequently replaced. This not only increases equipment procurement costs and inventory pressure but also prolongs the testing cycle due to cumbersome changeover operations, reducing production efficiency. Furthermore, the problem of insufficient chip fixing and positioning accuracy is also significant. One notable drawback is that some test sockets rely solely on the weight of the flip cover to achieve chip-probe contact, lacking active clamping and height adjustment structures. This can easily lead to poor contact between the pins and probes due to chip misalignment or uneven pressing force, thus affecting the accuracy of the test data. Traditional test sockets also have shortcomings in terms of temperature control. During circuit testing, the chip generates heat due to power loss. Especially in long-term or high-load testing scenarios, heat accumulation can easily cause the chip temperature to rise abnormally. Since traditional test sockets do not have an effective heat dissipation or temperature control system, this not only affects the stability of the test results but may also damage the chip due to high temperature. Summary of the Invention

[0004] To address the aforementioned technical problems, this invention provides a flip-type test socket for chips of various specifications with the same pin spacing. This solves the problem in chip manufacturing and quality inspection, where the flip-type test socket, as a core auxiliary device for chip electrical performance testing, is widely used in scenarios involving chips with the same pin spacing but different sizes and pin counts. However, traditional test sockets often have fixed chip placement areas and probe layouts, only suitable for chips of a single size and pin count. When testing chips of different specifications with the same pin spacing, the entire test socket needs to be frequently replaced. This not only increases equipment procurement costs and inventory pressure but also prolongs the testing cycle and reduces production efficiency due to cumbersome changeover operations. In addition, the problem of insufficient chip fixing and positioning accuracy is also quite prominent. Some test sockets rely solely on the weight of the flip cover to achieve contact between the chip and the probe, lacking active clamping and height adjustment structures. This can easily lead to poor contact between the pins and the probe due to chip misalignment or uneven pressing force, thus affecting the accuracy of the test data. Traditional test sockets also have shortcomings in terms of temperature control. During circuit testing, the chip generates heat due to power loss. Especially in long-term or high-load testing scenarios, heat accumulation can easily lead to abnormally high chip temperatures. Since traditional test sockets do not have an effective heat dissipation or temperature control system, this not only affects the stability of the test results but may also damage the chip due to high temperatures.

[0005] A flip-type test socket for chips of various specifications with the same pin spacing, comprising: The base has a mounting groove on its top surface. A third operating plate is fixedly installed on the bottom surface of the mounting groove. A second operating plate is positioned above the third operating plate and is inserted into the third operating plate. A first operating platform is fixedly installed on the top surface of the second operating plate. A chip slot is formed on the top surface of the first operating platform. Multiple chip detection rods are fixedly installed between the first operating platform, the second operating plate, and the third operating plate. The multiple chip detection rods are located within the chip slot. A pipe groove is formed inside the second operating plate. A flow distribution pipe is fixedly installed within the pipe groove and is located around the multiple chip detection rods. Two mounting brackets are fixedly installed on one side of the top surface of the base, and a common mounting rod is movably installed between the two mounting brackets. A top cover is fixedly installed on the outer side wall of the mounting rod. An adjustment assembly, which is mounted on two mounting brackets and is used to adjust the height of the top cover; A water delivery assembly is mounted on the top cover.

[0006] Preferably, the adjustment assembly includes two first mounting seats, which are respectively fixedly mounted on the top side of two mounting brackets. A second mounting seat is fixedly mounted on the bottom side of each of the two mounting brackets. A first sliding rod is fixedly mounted between one of the first mounting seats and one of the second mounting seats. A threaded rod is rotatably mounted between the other first mounting seat and the other second mounting seat. Sliders are rotatably mounted at both ends of the mounting rod. The inner sidewall of one slider is slidably connected to the outer sidewall of the first sliding rod, and the inner sidewall of the other slider is threadedly connected to the outer sidewall of the threaded rod.

[0007] Preferably, the adjustment assembly further includes a first bevel gear, which is rotatably mounted on the bottom surface of another second mounting base. The top end of the first bevel gear is fixedly connected to the bottom end of the threaded rod. A mounting clip is provided below the first bevel gear, and the outer side wall of the mounting clip is fixedly connected to the outer side wall of the base. A second bevel gear is rotatably mounted on one side of the mounting clip, and the second bevel gear meshes with the first bevel gear. A servo motor is fixedly mounted on the bottom surface of the mounting clip, and one end of the output shaft of the servo motor is fixedly connected to one end of the second bevel gear.

[0008] Preferably, the water supply assembly includes an inlet pipe, which is fixedly installed at one end of a branch pipe, and an outlet pipe is fixedly installed at the other end of the branch pipe. The inlet pipe and the outlet pipe are located on opposite sides of the top surface of the base. Semi-circular protective plates are fixedly installed on both sides of the top cover. A pumping pipe is fixedly installed inside one of the semi-circular protective plates, and the bottom end of the pumping pipe is inserted into the top end of the outlet pipe. A water inlet pipe is fixedly installed inside the other semi-circular protective plate, and the bottom end of the water inlet pipe is inserted into the top end of the inlet pipe.

[0009] Preferably, the water delivery assembly further includes a pump, which is fixedly installed inside the top cover. A storage box is provided on one side of the pump, and the bottom surface of the storage box is fixedly connected to the inner bottom surface of the top cover. A common flow pipe is fixedly installed between the pump and the storage box. One end of the water pumping pipe passes through one side of the top cover and is fixedly connected to one side of the pump. One end of the water supply pipe passes through the other side of the top cover and is fixedly connected to one side of the storage box.

[0010] Preferably, a plurality of condensing plates are fixedly installed on the inner side wall of the storage box, a top plate is fixedly installed on the top surface of the top cover, a micro condenser is fixedly installed on the top surface of the top plate, the micro condenser is located above the storage box, and the micro condenser is electrically connected to the plurality of condensing plates respectively.

[0011] Preferably, a fixing plate is fixedly installed on the bottom surface of the top cover, and two third mounting seats are fixedly installed on the bottom surface of the fixing plate. A second slide rod is fixedly installed between the two third mounting seats. Two clamping plates are fixedly installed on the outer side wall of the second slide rod. The two clamping plates are symmetrically arranged, and a double-headed electric push rod is arranged between the two clamping plates. The outer side wall of the double-headed electric push rod is fixedly connected to the bottom surface of the fixing plate, and the two ends of the double-headed electric push rod are respectively fixedly connected to one side of the two clamping plates.

[0012] Preferably, the outer side wall of the top cover is provided with a first slot, in which a buckle is rotatably installed; the base is provided with a second slot at a position corresponding to the first slot, in which a limit rod is fixedly installed; and the buckle engages with the limit rod.

[0013] Preferably, the surface of the chip slot and the surfaces of the two clamping plates are provided with anti-slip textures.

[0014] Preferably, the bottom surface of the base is provided with an anti-slip rubber pad.

[0015] Compared with the prior art, the present invention has the following beneficial effects: 1. This flip-type test fixture operates around chip adaptation, fixing and pressing, temperature control, and safety reset. First, the worker places the chip in the chip slot within the device. The core adaptation structure, consisting of a first operating platform, a second operating board, a third operating board, and chip detection rods, then functions. For chips with the same pin spacing but different sizes and pin numbers, the height and horizontal position of the first operating platform are adjusted through the interlocking of the second and third operating boards to match the chip slot size with the chip to be tested. Simultaneously, multiple chip detection rods are fixed between the three layers of boards and protrude from the chip slot, adapting to chips with different pin numbers at the same pin spacing, ensuring proper chip placement. After the chip is inserted, the pins make precise contact with the detection rod, and the anti-slip pads on the bottom of the base ensure the overall stability of the device. Once the chip is in place, the servo motor is activated, and the output shaft drives the second bevel gear to rotate. Because it meshes with the first bevel gear, it drives the threaded rod to rotate. The slider on the outer wall of the threaded rod moves along the rod, and the slider on the other side slides synchronously along the first slide rod, causing the mounting rod and the top cover to rise and fall to close to the top surface of the base. Then, the double-headed electric push rod inside the top cover is activated, pushing the two clamping plates to slide towards each other along the second slide rod. The chip is clamped by the anti-slip texture on the surface of the chip slot using the clamping plates. Finally, the buckle on the outside of the top cover is rotated to engage with the limit rod of the base, completing the closure and locking.

[0016] 2. During the chip's path testing, the chip detection rod connects to the circuit to begin performance testing. The water supply component simultaneously provides temperature control support. The coolant in the storage box is cooled by a micro condenser and maintained at a low temperature by a condenser plate. The pump draws coolant through the flow pipe and sends it to the distribution pipe in the second operating board through the water inlet pipe and the water outlet pipe. The distribution pipe surrounds the chip detection rod to absorb the heat generated during testing. The heat-exchanged liquid flows back to the storage box through the water outlet pipe and the water outlet pipe to form a closed-loop temperature control. After the test is completed, the system enters the reset stage. The buckle is rotated in the reverse direction to disengage from the limit rod. The servo motor reverses to drive the threaded rod to lift the top cover. The double-headed electric push rod retracts to release the chip from the clamping plate. After removing the chip, if other chip specifications need to be tested, the insertion positions of the second and third operating boards are adjusted and the chip detection rod layout is replaced to repeat the above process. Attached Figure Description

[0017] Figure 1 This is one of the overall structural schematic diagrams of the present invention; Figure 2 This is the second schematic diagram of the overall structure of the present invention; Figure 3 This is a schematic diagram of the overall unfolded structure of the present invention; Figure 4 This is a schematic diagram of the internal structure of the base of the present invention; Figure 5 This is a schematic diagram of the structure of the interlaced flow pipes inside the second operation panel of the present invention; Figure 6 This is a schematic diagram of the water delivery component structure of the present invention; Figure 7 This is a schematic diagram of the structure of the two clamping plates and the double-headed electric push rod of the present invention; Figure 8 This is the present invention. Figure 2 Enlarged structural diagram at point A in the middle; Figure 9 This is the present invention. Figure 6 Enlarged structural diagram at point B.

[0018] In the diagram, the correspondence between the component names and the attached drawing numbers is as follows: 1. Base; 2. Top cover; 3. Top plate; 4. Miniature condenser; 5. Mounting bracket; 6. First operating platform; 7. Limiting rod; 8. Second operating plate; 9. Third operating plate; 10. Chip detection rod; 11. Diverter pipe; 12. Water inlet pipe; 13. Water outlet pipe; 14. Pump; 15. Storage box; 16. Semi-circular protective plate; 17. Water inlet pipe; 18. Water outlet pipe; 19. First mounting base; 20. Mounting rod; 21. Slider; 22. First sliding rod; 23. Second mounting base; 24. Condensing plate; 25. Fixing plate; 26. Clamping plate; 27. Third mounting base; 28. Second sliding rod; 29. ​​Double-headed electric push rod; 30. Buckle; 31. Threaded rod; 32. First bevel gear; 33. Second bevel gear; 34. Mounting clamp; 35. Servo motor. Detailed Implementation

[0019] The embodiments of the present invention will be described in further detail below with reference to the accompanying drawings and examples. The following examples are for illustrative purposes only and should not be construed as limiting the scope of the invention.

[0020] Please see Figures 1-9 This invention provides a flip-type test socket for chips of various specifications with the same pin spacing, comprising: The base 1 has a mounting groove on its top surface. A third operating plate 9 is fixedly installed inside the bottom surface of the mounting groove. A second operating plate 8 is positioned above the third operating plate 9 and is inserted into the third operating plate 9. A first operating platform 6 is fixedly installed on the top surface of the second operating plate 8. A chip slot is formed on the top surface of the first operating platform 6. Multiple chip detection rods 10 are fixedly installed between the first operating platform 6, the second operating plate 8, and the third operating plate 9. The multiple chip detection rods 10 are located in the chip slot. A pipe groove is formed inside the second operating plate 8. A flow distribution pipe 11 is fixedly installed in the pipe groove and is located around the multiple chip detection rods 10. Two mounting brackets 5 are fixedly installed on one side of the top surface of the base 1. A single mounting rod 20 is movably installed between the two mounting brackets 5. A top cover 2 is fixedly installed on the outer wall of the mounting rod 20. An adjustment component is set on the two mounting brackets 5 and is used to adjust the height of the top cover 2. A water supply component is set on the top cover 2.

[0021] The flip-top test fixture operates around chip adaptation, fixing and pressing, temperature control, and safety reset. First, the worker places the chip in the chip slot within the device. The core adaptation structure, consisting of a first operating platform 6, a second operating board 8, a third operating board 9, and chip detection rods 10, then functions. For chips with the same pin spacing but different sizes and pin numbers, the height and horizontal position of the first operating platform 6 are adjusted by the insertion and cooperation of the second operating board 8 and the third operating board 9, ensuring the chip slot matches the size of the chip to be tested. Simultaneously, multiple chip detection rods 10 are fixed between the three layers of boards and exposed. Within the chip slot, chips with different pin counts at the same spacing are accommodated, ensuring precise contact between the pins and the detection rod after the chip is placed. The anti-slip pads on the bottom of the base 1 ensure the overall stability of the device. Once the chip is in place, the servo motor 35 is activated, and the output shaft drives the second bevel gear 33 to rotate. Because it meshes with the first bevel gear 32, it drives the threaded rod 31 to rotate. The slider 21 on the outer wall of the threaded rod 31 moves along the rod, and the slider 21 on the other side slides synchronously along the first sliding rod 22, causing the mounting rod 20 and the top cover 2 to rise and fall together until they are close to the top surface of the base 1. Then, the double-headed electric push rod 29 inside the top cover 2 is activated. The two clamping plates 26 are pushed to slide towards each other along the second slide bar 28. The clamping plates 26 clamp the chip with the anti-slip texture on the chip slot surface. Finally, the buckle 30 on the outside of the top cover 2 is rotated to engage with the limiting rod 7 on the base 1 to complete the closure and locking. When the chip is being tested for connectivity, the chip testing rod 10 connects the circuit to start the performance test. The water supply assembly provides temperature control support at the same time. The coolant in the storage box 15 is cooled by the micro condenser 4 and then kept at a low temperature by the condenser plate 24. The pump 14 draws coolant through the flow pipe and sends it to the diversion pipe in the second operation plate 8 through the water supply pipe 17 and the water inlet pipe 12. The through pipe 11 and the branch pipe 11 surround the chip detection rod 10 to absorb the heat generated during detection. The liquid after heat exchange flows back to the storage box 15 through the outlet pipe 13 and the pumping pipe 18 to form a closed-loop temperature control. After the detection is completed, it enters the reset stage. The buckle 30 is rotated in the reverse direction to disengage from the limit rod 7. The servo motor 35 reverses to drive the threaded rod 31 to lift the top cover 2. The double-headed electric push rod 29 retracts to release the chip from the clamping plate 26. After the chip is removed, if other specifications of chips need to be detected, the insertion positions of the second operation plate 8 and the third operation plate 9 are adjusted and the layout of the chip detection rod 10 is replaced to repeat the above process.

[0022] This invention provides a flip-type test socket for chips of various specifications with the same pin spacing. In addition to the above-mentioned technical solution, it also has the following technical features.

[0023] The adjustment assembly includes two first mounting seats 19, which are fixedly mounted on the top side of two mounting brackets 5 respectively. A second mounting seat 23 is fixedly mounted on the bottom side of each of the two mounting brackets 5. A first slide rod 22 is fixedly mounted between one of the first mounting seats 19 and one of the second mounting seats 23. A threaded rod 31 is rotatably mounted between the other first mounting seat 19 and the other second mounting seat 23. Slider 21 is rotatably mounted at both ends of the mounting rod 20. The inner wall of one slider 21 is slidably connected to the outer wall of the first slide rod 22, and the inner wall of the other slider 21 is threadedly connected to the outer wall of the threaded rod 31.

[0024] When the threaded rod 31 rotates, one of the sliders 21 slides and the first slider 22, which acts as a limit, will move the other slider 21 in a straight line along the threaded rod 31, thereby driving the mounting rod 20 to adjust its height. By controlling the rotation direction and number of rotations of the threaded rod 31, the height of the mounting rod 20 can be precisely controlled to meet the height requirements of the detection rod when testing chips of different specifications, thereby ensuring that the chip detection rod 10 can be accurately aligned with the chip pins for path testing.

[0025] This invention provides a flip-type test socket for chips of various specifications with the same pin spacing. In addition to the above-mentioned technical solution, it also has the following technical features.

[0026] The adjustment assembly also includes a first bevel gear 32, which is rotatably mounted on the bottom surface of another second mounting base 23. The top end of the first bevel gear 32 is fixedly connected to the bottom end of the threaded rod 31. A mounting clip 34 is provided below the first bevel gear 32. The outer side wall of the mounting clip 34 is fixedly connected to the outer side wall of the base 1. A second bevel gear 33 is rotatably mounted on one side of the inner side of the mounting clip 34. The second bevel gear 33 meshes with the first bevel gear 32. A servo motor 35 is fixedly mounted on the inner bottom surface of the mounting clip 34. One end of the output shaft of the servo motor 35 is fixedly connected to one end of the second bevel gear 33.

[0027] When the servo motor 35 starts, its output shaft drives the second bevel gear 33 to rotate. Since the second bevel gear 33 meshes with the first bevel gear 32, the rotation of the second bevel gear 33 will drive the first bevel gear 32 to rotate synchronously. The top end of the first bevel gear 32 is fixedly connected to the bottom end of the threaded rod 31, so the rotation of the first bevel gear 32 will further drive the threaded rod 31 to rotate, ultimately realizing the lifting and lowering adjustment of the mounting rod 20. By controlling the rotation direction and speed of the servo motor 35, the lifting height and speed of the mounting rod 20 can be precisely controlled, thereby meeting the requirements of different specification chip testing for detection rod height and testing efficiency.

[0028] This invention provides a flip-type test socket for chips of various specifications with the same pin spacing. In addition to the above-mentioned technical solution, it also has the following technical features.

[0029] The water supply assembly includes an inlet pipe 12, which is fixedly installed at one end of a branch pipe 11. An outlet pipe 13 is fixedly installed at the other end of the branch pipe 11. The inlet pipe 12 and the outlet pipe 13 are located on the top surface of the base 1 on both sides. Semicircular protective plates 16 are fixedly installed on both sides of the top cover 2. A water suction pipe 18 is fixedly installed inside one of the semicircular protective plates 16. The bottom end of the water suction pipe 18 is inserted into the top end of the outlet pipe 13. A water injection pipe 17 is fixedly installed inside the other semicircular protective plate 16. The bottom end of the water injection pipe 17 is inserted into the top end of the inlet pipe 12.

[0030] This design allows cooling water to circulate continuously and stably within the test socket, effectively removing the heat generated during chip testing and ensuring that the chip is tested in a suitable temperature environment, thus improving the accuracy and stability of the test.

[0031] This invention provides a flip-type test socket for chips of various specifications with the same pin spacing. In addition to the above-mentioned technical solution, it also has the following technical features.

[0032] The water supply assembly also includes a pump 14, which is fixedly installed inside the top cover 2. A storage box 15 is provided on one side of the pump 14. The bottom surface of the storage box 15 is fixedly connected to the inner bottom surface of the top cover 2. The same flow pipe is fixedly installed between the pump 14 and the storage box 15. One end of the water pumping pipe 18 passes through one side of the top cover 2 and is fixedly connected to one side of the pump 14. One end of the water supply pipe 17 passes through the other side of the top cover 2 and is fixedly connected to one side of the storage box 15.

[0033] During the chip's path detection, the chip detection rod 10 connects the circuit to begin performance testing. Simultaneously, the water supply component provides temperature control support. The coolant in the storage box 15 is cooled by the micro condenser 4 and then kept at a low temperature by the condenser plate 24. The pump 14 draws coolant through the flow pipe and sends it to the branch flow pipe 11 in the second operation plate 8 through the water inlet pipe 17 and the water outlet pipe 12. The branch flow pipe 11 surrounds the chip detection rod 10 to absorb the heat generated during detection. The liquid after heat exchange flows back to the storage box 15 through the water outlet pipe 13 and the water pumping pipe 18 to form a closed-loop temperature control.

[0034] This invention provides a flip-type test socket for chips of various specifications with the same pin spacing. In addition to the above-mentioned technical solution, it also has the following technical features.

[0035] Multiple condensing plates 24 are fixedly installed on the inner side wall of the storage box 15, and a top plate 3 is fixedly installed on the top surface of the top cover 2. A micro condenser 4 is fixedly installed on the top surface of the top plate 3. The micro condenser 4 is located above the storage box 15 and is electrically connected to the multiple condensing plates 24 respectively.

[0036] Multiple condenser plates 24 are evenly distributed on the inner wall of the storage box 15, which can more efficiently cool the coolant and ensure that the coolant maintains a low temperature during circulation, thereby providing stable and reliable temperature control support for chip testing.

[0037] This invention provides a flip-type test socket for chips of various specifications with the same pin spacing. In addition to the above-mentioned technical solution, it also has the following technical features.

[0038] A fixing plate 25 is fixedly installed on the bottom surface of the top cover 2. Two third mounting seats 27 are fixedly installed on the bottom surface of the fixing plate 25. A second slide rod 28 is fixedly installed between the two third mounting seats 27. Two clamping plates 26 are fixedly installed on the outer side wall of the second slide rod 28. The two clamping plates 26 are symmetrically arranged. A double-headed electric push rod 29 is arranged between the two clamping plates 26. The outer side wall of the double-headed electric push rod 29 is fixedly connected to the bottom surface of the fixing plate 25. The two ends of the double-headed electric push rod 29 are respectively fixedly connected to one side of the two clamping plates 26.

[0039] When the top cover 2 and the second operating plate 8 are closed, the two clamping plates 26 can accurately clamp the chip under the action of the double-headed electric push rod 29, ensuring that the chip is in a stable position during the detection process and will not shake or shift, thereby ensuring the accuracy and reliability of the detection results.

[0040] This invention provides a flip-type test socket for chips of various specifications with the same pin spacing. In addition to the above-mentioned technical solution, it also has the following technical features.

[0041] The outer side wall of the top cover 2 is provided with a first slot, and a buckle 30 is rotatably installed in the first slot. The base 1 is provided with a second slot at a position corresponding to the first slot, and a limit rod 7 is fixedly installed in the second slot. The buckle 30 and the limit rod 7 are engaged.

[0042] When the top cover 2 and the base 1 are closed, the buckle 30 can rotate around the rotation point in the first slot and accurately engage with the limiting rod 7 in the second slot. Through the engagement of the buckle 30 and the limiting rod 7, the top cover 2 and the base 1 can be firmly connected together, preventing the top cover 2 from accidentally opening during the chip testing process and affecting the testing process, thus further improving the stability and reliability of the chip testing process.

[0043] This invention provides a flip-type test socket for chips of various specifications with the same pin spacing. In addition to the above-mentioned technical solution, it also has the following technical features.

[0044] The surface of the chip slot and the surfaces of the two clamping plates 26 are both provided with anti-slip texture.

[0045] The anti-slip texture effectively increases the friction between the chip and the clamping plate 26. During chip testing, even if there is some external interference, the chip can be stably placed in the chip slot and the accuracy of the test will not be affected by slippage.

[0046] This invention provides a flip-type test socket for chips of various specifications with the same pin spacing. In addition to the above-mentioned technical solution, it also has the following technical features.

[0047] The bottom surface of base 1 is equipped with an anti-slip rubber pad.

[0048] The anti-slip pads enhance the friction between the base 1 and the placement surface, ensuring the test stand is placed stably and preventing slippage or shaking from affecting the accuracy of chip detection.

[0049] Working principle: This flip-top test fixture operates around chip adaptation, fixing and pressing, temperature control, and safety reset. First, the worker places the chip in the chip slot within the device. The core adaptation structure, consisting of a first operating platform 6, a second operating board 8, a third operating board 9, and chip detection rods 10, then comes into play. For chips with the same pin spacing but different sizes and pin numbers, the height and horizontal position of the first operating platform 6 are adjusted by the insertion and cooperation of the second operating board 8 and the third operating board 9, ensuring that the chip slot matches the size of the chip to be tested. Simultaneously, multiple chip detection rods 10 are fixed between the three layers of boards and protrude from the chip slot, adapting to chips with different pin numbers but the same pin spacing, ensuring precise contact between the chip pins and the detection rods after placement. The anti-slip rubber pad on the bottom of the base 1 ensures the overall stability of the device. After the chip is placed in place, the servo motor 35 is started, and the output shaft drives the second bevel gear 33 to rotate. Because it meshes with the first bevel gear 32, it drives the threaded rod 31 to rotate. The slider 21 on the outer wall of the threaded rod 31 moves along the rod body, and the slider 21 on the other side slides synchronously along the first slide bar 22, which drives the mounting rod 20 and the top cover 2 to rise and fall together to be close to the top surface of the base 1. Then, the double-headed electric push rod 29 inside the top cover 2 is started, pushing the two clamping plates 26 to slide towards each other along the second slide bar 28. The chip is clamped by the anti-slip texture of the clamping plates 26 and the chip slot surface. Finally, the buckle 30 on the outside of the top cover 2 is rotated to engage with the limiting rod 7 of the base 1 to complete the closing and locking.

[0050] When performing a circuit test on the chip, the chip detection rod 10 connects to the circuit to begin performance testing. The water supply component provides temperature control support simultaneously. The coolant in the storage box 15 is cooled by the micro condenser 4 and then kept at a low temperature by the condenser plate 24. The pump 14 draws coolant through the flow pipe and sends it to the branch flow pipe 11 in the second operation board 8 through the water inlet pipe 17 and the water outlet pipe 12. The branch flow pipe 11 surrounds the chip detection rod 10 to absorb the heat generated during testing. The liquid after heat exchange flows back to the storage box 15 through the water outlet pipe 13 and the water inlet pipe 18 to form a closed-loop temperature control. After the test is completed, the reset stage begins. The buckle 30 is rotated in the reverse direction to disengage from the limit rod 7. The servo motor 35 reverses and drives the threaded rod 31 to lift the top cover 2. The double-headed electric push rod 29 retracts to release the chip from the clamping plate 26. After removing the chip, if other specifications of chips need to be tested, the insertion positions of the second operation board 8 and the third operation board 9 are adjusted and the layout of the chip detection rod 10 is replaced to repeat the above process.

[0051] The embodiments of the present invention are given for illustrative and descriptive purposes only, and are not intended to be exhaustive or to limit the invention to the forms disclosed. Many modifications and variations will be apparent to those skilled in the art. The embodiments were chosen and described in order to better illustrate the principles and practical application of the invention, and to enable those skilled in the art to understand the invention and to design various embodiments with various modifications suitable for a particular purpose.

Claims

1. A flip-type test socket for chips of various specifications with the same pin spacing, characterized in that, include: The base (1) has an installation groove on its top surface. A third operating plate (9) is fixedly installed on the bottom surface of the installation groove. A second operating plate (8) is provided above the third operating plate (9). The second operating plate (8) and the third operating plate (9) are plugged into each other. A first operating table (6) is fixedly installed on the top surface of the second operating plate (8). A chip slot is provided on the top surface of the first operating table (6). Multiple chip detection rods (10) are fixedly installed between the first operating table (6), the second operating plate (8) and the third operating plate (9). The multiple chip detection rods (10) are located in the chip slot. A pipe slot is provided inside the second operating plate (8). A flow distribution pipe (11) is fixedly installed in the pipe slot. The flow distribution pipe (11) is located around the multiple chip detection rods (10). Two mounting brackets (5) are fixedly installed on one side of the top surface of the base (1). The same mounting rod (20) is movably installed between the two mounting brackets (5). A top cover (2) is fixedly installed on the outer side wall of the mounting rod (20). An adjustment assembly is provided on two mounting brackets (5) and is used to adjust the height of the top cover (2); Water delivery assembly, which is mounted on the top cover (2).

2. The flip-type test socket for chips of various specifications with the same pin spacing as described in claim 1, characterized in that, The adjustment assembly includes two first mounting seats (19), which are fixedly mounted on the top side of two mounting brackets (5) respectively. A second mounting seat (23) is fixedly mounted on the bottom side of each of the two mounting brackets (5). A first slide rod (22) is fixedly mounted between one of the first mounting seats (19) and one of the second mounting seats (23). A threaded rod (31) is rotatably mounted between the other first mounting seat (19) and the other second mounting seat (23). Sliders (21) are rotatably mounted at both ends of the mounting rod (20). The inner wall of one slider (21) is slidably connected to the outer wall of the first slide rod (22), and the inner wall of the other slider (21) is threadedly connected to the outer wall of the threaded rod (31).

3. The flip-type test socket for chips of various specifications with the same pin spacing as described in claim 2, characterized in that, The adjustment assembly also includes a first bevel gear (32), which is rotatably mounted on the bottom surface of another second mounting base (23). The top end of the first bevel gear (32) is fixedly connected to the bottom end of the threaded rod (31). A mounting clip (34) is provided below the first bevel gear (32). The outer side wall of the mounting clip (34) is fixedly connected to the outer side wall of the base (1). A second bevel gear (33) is rotatably mounted on one side of the inner side of the mounting clip (34). The second bevel gear (33) meshes with the first bevel gear (32). A servo motor (35) is fixedly mounted on the inner bottom surface of the mounting clip (34). One end of the output shaft of the servo motor (35) is fixedly connected to one end of the second bevel gear (33).

4. The flip-type test socket for chips of various specifications with the same pin spacing as described in claim 1, characterized in that, The water supply assembly includes an inlet pipe (12), which is fixedly installed at one end of a branch pipe (11). An outlet pipe (13) is fixedly installed at the other end of the branch pipe (11). The inlet pipe (12) and the outlet pipe (13) are located on the top surface of the base (1) on both sides. Semicircular protective plates (16) are fixedly installed on both sides of the top cover (2). A pumping pipe (18) is fixedly installed inside one of the semicircular protective plates (16). The bottom end of the pumping pipe (18) is inserted into the top end of the outlet pipe (13). A water injection pipe (17) is fixedly installed inside the other semicircular protective plate (16). The bottom end of the water injection pipe (17) is inserted into the top end of the inlet pipe (12).

5. The flip-type test socket for chips of various specifications with the same pin spacing as described in claim 4, characterized in that, The water delivery assembly also includes a pump (14), which is fixedly installed inside the top cover (2). A storage box (15) is provided on one side of the pump (14). The bottom surface of the storage box (15) is fixedly connected to the inner bottom surface of the top cover (2). The pump (14) and the storage box (15) are fixedly connected to the same flow pipe. One end of the water pump (18) passes through one side of the top cover (2) and is fixedly connected to one side of the pump (14). One end of the water supply pipe (17) passes through the other side of the top cover (2) and is fixedly connected to one side of the storage box (15).

6. The flip-type test socket for chips of various specifications with the same pin spacing as described in claim 5, characterized in that, Multiple condensing plates (24) are fixedly installed on the inner side wall of the storage box (15), and a top plate (3) is fixedly installed on the top surface of the top cover (2). A micro condenser (4) is fixedly installed on the top surface of the top plate (3). The micro condenser (4) is located above the storage box (15), and the micro condenser (4) is electrically connected to the multiple condensing plates (24) respectively.

7. The flip-type test socket for chips of various specifications with the same pin spacing as described in claim 1, characterized in that, A fixing plate (25) is fixedly installed on the bottom surface of the top cover (2). Two third mounting seats (27) are fixedly installed on the bottom surface of the fixing plate (25). A second slide rod (28) is fixedly installed between the two third mounting seats (27). Two clamping plates (26) are fixedly installed on the outer side wall of the second slide rod (28). The two clamping plates (26) are symmetrically arranged. A double-headed electric push rod (29) is arranged between the two clamping plates (26). The outer side wall of the double-headed electric push rod (29) is fixedly connected to the bottom surface of the fixing plate (25). The two ends of the double-headed electric push rod (29) are fixedly connected to one side of the two clamping plates (26) respectively.

8. The flip-type test socket for chips of various specifications with the same pin spacing as described in claim 1, characterized in that, The outer side wall of the top cover (2) is provided with a first slot, and a buckle (30) is rotatably installed in the first slot. The base (1) is provided with a second slot at a position corresponding to the first slot. A limit rod (7) is fixedly installed in the second slot, and the buckle (30) and the limit rod (7) are engaged.

9. A flip-type test socket for chips of various specifications with the same pin spacing as described in claim 1, characterized in that, The surface of the chip slot and the surfaces of the two clamping plates (26) are both provided with anti-slip textures.

10. A flip-type test socket for chips of various specifications with the same pin spacing as described in claim 1, characterized in that, The bottom surface of the base (1) is provided with an anti-slip rubber pad.

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