Chip parameter fitting method and device, storage medium and electronic device

Abstract

The invention discloses a chip parameter fitting method and device, a storage medium and an electronic device, and relates to the technical field of vehicles. The method comprises the following steps: controlling a target chip to enter a driving working state; under the driving working state, performing parameter fitting on the target chip based on the test environment to obtain a chip driving performance curve, a chip parameter curve, a chip life curve, an initialization parameter, a first relation, a second relation, a third relation, a fourth relation, an operation condition, an operation environment model and an operation condition of the target chip; determining a target fitting parameter of the target chip based on the obtained information; and adjusting a driving parameter of a controller in the target vehicle based on the target fitting parameter. According to the invention, the technical problem that a driven system fails and cannot operate normally when driving parameters of a chip with relatively high driving precision change in the prior art is solved.

Description

Technical Field

[0001] The present invention relates to the field of vehicle technology, and in particular to a chip parameter fitting method, device, storage medium and electronic device. Background Art

[0002] In the chip field, it is crucial to make a relatively accurate fit of chip parameters to ensure that the chip performance is stable and reliable, meet the needs of various application scenarios, and thus enhance the chip's position in market competition.

[0003] Due to the relatively low technical level, some chip manufacturers may have problems such as non-standard production processes and lax quality control, which may lead to unstable chip performance or insufficient drive during long-term use. These problems may affect the normal operation of the equipment and even cause unnecessary troubles and losses to users. In response to the problem of insufficient chip drive, the existing drive implementation method does not consider the loss during use. For controllers with high drive accuracy requirements, once the drive parameters change, it will cause the drive system to malfunction, which will cause huge financial losses and safety hazards. Summary of the invention

[0004] The embodiments of the present invention provide a chip parameter fitting method, device, storage medium and electronic device to at least solve the technical problem in the related art that for chips with high driving precision, when the driving parameters change, the driven system will malfunction and fail to operate normally.

[0005] According to one embodiment of the present invention, a chip parameter fitting method is provided, comprising: controlling a target chip to enter a driving working state, wherein the driving working state is used to drive a target load to work; in the driving working state, performing parameter fitting on the target chip based on a test environment to obtain a chip driving performance curve of the target chip, a chip parameter curve of the target chip, a chip life curve of the target chip, initialization parameters, a first relationship, a second relationship, a third relationship, a fourth relationship, an operating condition of the target chip, an operating environment model of the target chip, and an operating condition of the target chip, wherein the initialization parameters include an impedance and a voltage drop of the target chip, the first relationship is used to represent the relationship between the test time and the chip life of the target chip, the second relationship is used to represent the test temperature, the chip life, and the operating conditions of the target chip. the relationship between life and impedance, the third relationship is used to represent the relationship between test temperature, chip life and voltage drop, and the fourth relationship is used to represent the relationship between test temperature, chip life and current error; based on the chip driving performance curve, the chip parameter curve, the chip life curve, the initialization parameters, the first relationship, the second relationship, the third relationship, the fourth relationship, the operating conditions of the target chip, the operating environment model of the target chip and the operating conditions of the target chip, the target fitting parameters are determined, wherein the target fitting parameters are used to represent the impedance and voltage drop of the target chip throughout its life cycle; based on the target fitting parameters, the driving parameters of the controller in the target vehicle are adjusted, wherein the target vehicle is equipped with the target chip, and the controller is used to monitor and control the operating status of the engine and transmission system.

[0006] Optionally, parameter fitting is performed on the target chip based on the test environment to obtain a chip driving performance curve, a chip parameter curve and a chip life curve of the target chip, including: under a first test environment, recording an ideal current waveform of the target chip based on a certification load box, wherein the first test environment includes an endurance test environment and a full-life high-temperature test environment; recording an actual current waveform of the target chip based on a current sensor; and determining a chip driving performance curve, a chip parameter curve and a chip life curve based on the ideal current waveform and the actual current waveform.

[0007] Optionally, performing parameter fitting on the target chip based on the test environment to obtain initialization parameters includes: in a second test environment, initializing the impedance and voltage drop of the target chip within a preset time period based on the chip production line equipment to obtain the initialization parameters, wherein the second test environment includes a normal temperature short-term test environment and a high temperature short-term test environment, and the preset time period is used to represent the time period between a first moment when the target chip starts working for the first time and a second moment after the target chip starts working.

[0008] Optionally, parameter fitting is performed on the target chip based on the test environment to obtain the first relationship, including: under a third test environment, determining the first relationship based on a preset life function and a preset durability acceleration function, wherein the third test environment includes a high temperature test environment and a temperature durability test environment, the preset life function is used to derive the test time based on a preset acceleration factor and the life of the vehicle, and the preset durability acceleration function is used to derive the chip life based on the preset acceleration factor and the test time.

[0009] Optionally, performing parameter fitting on the target chip based on the test environment to obtain the second relationship, the third relationship and the fourth relationship includes: obtaining first impact information of the temperature impact factor and second impact information of the life impact factor under the fourth test environment, wherein the fourth test environment is used to represent any test environment in the design certification process; and determining the second relationship, the third relationship and the fourth relationship based on the first impact information and the second impact information.

[0010] Optionally, parameters of the target chip are fitted based on the test environment to obtain the operating conditions of the target chip, the operating environment model of the target chip and the operating conditions of the target chip, including: under the fifth test environment, determining the operating conditions of the target chip based on the operating environment and operating conditions of the target vehicle; constructing the operating environment model of the target chip based on the operating environment model of the target vehicle; and determining the operating conditions of the target chip based on the operating conditions of the target vehicle.

[0011] Optionally, determining the operating condition of the target chip based on the operating environment and operating condition of the target vehicle includes: determining the operating state of a controller in the target vehicle based on the operating environment and operating condition of the target vehicle; determining the conduction state of a transistor in the target chip based on the operating state of the controller; and obtaining the operating condition of the target chip based on the conduction state of the transistor.

[0012] Optionally, determining the operating conditions of the target chip based on the operating conditions of the target vehicle includes: determining the operating conditions of the controller based on the operating conditions of the target vehicle and the position of the controller; determining the operating conditions of the target chip based on the operating conditions of the controller, the packaging form of the target chip and the sealing conditions of the controller.

[0013] Optionally, the target chip is electrically connected to the power tube, the power tube is electrically connected to the sampler, the sampler is electrically connected to the actuator, the power tube is used to control the current conduction state of the target chip, the sampler is used to collect the current output by the power tube, and the actuator is used to control the fuel injection amount of the injection circuit. The method also includes: obtaining a target current output by the power tube based on the sampler, wherein the target current is the current output by the target chip through the power tube; controlling the actuator to adjust the fuel injection amount of the injection circuit based on the target current, wherein the injection circuit is used to inject fuel to the target vehicle.

[0014] According to one embodiment of the present invention, a chip parameter fitting device is also provided, including: a control module, used to control the target chip to enter a driving working state, wherein the driving working state is used to drive the target load to work; a fitting module, used to perform parameter fitting on the target chip based on the test environment in the driving working state, to obtain a chip driving performance curve of the target chip, a chip parameter curve of the target chip, a chip life curve of the target chip, initialization parameters, a first relationship, a second relationship, a third relationship, a fourth relationship, an operating condition of the target chip, an operating environment model of the target chip and an operating condition of the target chip, wherein the initialization parameters include the impedance and voltage drop of the target chip, the first relationship is used to represent the relationship between the test time and the chip life of the target chip, the second relationship is used to represent the test temperature, the chip The relationship between life and impedance, the third relationship is used to represent the relationship between test temperature, chip life and voltage drop, and the fourth relationship is used to represent the relationship between test temperature, chip life and current error; a determination module is used to determine the target fitting parameters of the target chip based on the chip driving performance curve, chip parameter curve, chip life curve, initialization parameters, the first relationship, the second relationship, the third relationship, the fourth relationship, the operating conditions of the target chip, the operating environment model of the target chip and the operating conditions of the target chip, wherein the target fitting parameters are used to represent the impedance and voltage drop of the target chip throughout its life cycle; an adjustment module is used to adjust the driving parameters of the controller in the target vehicle based on the target fitting parameters, wherein the target vehicle is equipped with the target chip, and the controller is used to monitor and control the operating status of the engine and transmission system.

[0015] Optionally, the fitting module is also used to record the ideal current waveform of the target chip under a first test environment based on a certification load box, wherein the first test environment includes an endurance test environment and a full-life high-temperature test environment; record the actual current waveform of the target chip based on a current sensor; and determine a chip driving performance curve, a chip parameter curve and a chip life curve based on the ideal current waveform and the actual current waveform.

[0016] Optionally, the fitting module is also used to initialize the impedance and voltage drop of the target chip within a preset time period based on the chip production line equipment in a second test environment to obtain initialization parameters, wherein the second test environment includes a normal temperature short-term test environment and a high temperature short-term test environment, and the preset time period is used to represent the time period between a first moment when the target chip starts working for the first time and a second moment after the target chip starts working.

[0017] Optionally, the fitting module is also used to determine the first relationship based on a preset life function and a preset durability acceleration function under a third test environment, wherein the third test environment includes a high temperature test environment and a temperature durability test environment, the preset life function is used to derive the test time based on a preset acceleration factor and the life of the vehicle, and the preset durability acceleration function is used to derive the chip life based on the preset acceleration factor and the test time.

[0018] Optionally, the fitting module is also used to obtain first impact information of the temperature impact factor and second impact information of the life impact factor under a fourth test environment, wherein the fourth test environment is used to represent any test environment in the design certification process; and determine the second relationship, the third relationship and the fourth relationship based on the first impact information and the second impact information.

[0019] Optionally, the fitting module is also used to determine the operating conditions of the target chip based on the operating environment and operating conditions of the target vehicle under the fifth test environment; construct an operating environment model of the target chip based on the operating environment model of the target vehicle; and determine the operating conditions of the target chip based on the operating conditions of the target vehicle.

[0020] According to one embodiment of the present invention, a computer-readable storage medium is provided, in which a computer program is stored, wherein the computer program is configured to execute any of the above chip parameter fitting methods when running on a computer or a processor.

[0021] According to one embodiment of the present invention, there is also provided an electronic device, including a memory and a processor, wherein a computer program is stored in the memory, and the processor is configured to run the computer program to execute any of the chip parameter fitting methods described above.

[0022] According to one embodiment of the present invention, a computer program product is provided, including a computer program, and when the computer program is executed by a processor, the chip parameter fitting method described in any one of the above items is implemented.

[0023] In an embodiment of the present invention, a target chip is controlled to enter a driving working state, wherein the driving working state is used to drive a target load to work; in the driving working state, parameters of the target chip are fitted based on a test environment to obtain a chip driving performance curve of the target chip, a chip parameter curve of the target chip, a chip life curve of the target chip, initialization parameters, a first relationship, a second relationship, a third relationship, a fourth relationship, an operating condition of the target chip, an operating environment model of the target chip, and an operating condition of the target chip, wherein the initialization parameters include an impedance and a voltage drop of the target chip, a first relationship is used to represent a relationship between a test time and a chip life of the target chip, a second relationship is used to represent a relationship between a test temperature, a chip life, and an impedance, a third relationship is used to represent a relationship between a test temperature, a chip life, and a voltage drop, and a fourth relationship is used to represent a relationship between a test temperature, a chip life, and a current error; based on chip driving The target fitting parameters of the target chip are determined by the performance curve, chip parameter curve, chip life curve, initialization parameters, the first relationship, the second relationship, the third relationship, the fourth relationship, the operating conditions of the target chip, the operating environment model of the target chip and the operating conditions of the target chip, wherein the target fitting parameters are used to represent the impedance and voltage drop of the target chip throughout its life cycle; the driving parameters of the controller in the target vehicle are adjusted based on the target fitting parameters, wherein the target vehicle is equipped with a target chip, and the controller is used to monitor and control the operating status of the engine and transmission system, thereby achieving the purpose of parameter fitting for automotive-grade chips with high driving accuracy using the method of calibrating the full life cycle parameters by design certification, thereby achieving the technical effects of loss repair and data fitting, and further solving the technical problem in the related technology that for chips with high driving accuracy, when the driving parameters change, the driven system will fail and cannot operate normally. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] The drawings described herein are used to provide a further understanding of the present invention and constitute a part of this application. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation of the present invention. In the drawings:

[0025] Figure 1 is a flow chart of a chip parameter fitting method according to one embodiment of the present invention;

[0026] Figure 2 is a schematic diagram of a method for designing authentication matching data according to one embodiment of the present invention;

[0027] Figure 3 is a schematic diagram of a method for calculating EOL initial data according to one embodiment of the present invention;

[0028] Figure 4 is a schematic diagram of a life recording method according to one embodiment of the present invention;

[0029] Figure 5 is a schematic diagram of a parameter fitting implementation method according to one embodiment of the present invention;

[0030] Figure 6 is a schematic diagram of a method for combining vehicle operating conditions and semiconductor physics according to one embodiment of the present invention;

[0031] Figure 7 is a schematic diagram of a method for implementing a fuel injection waveform using an analog circuit according to one embodiment of the present invention;

[0032] Figure 8 is a structural block diagram of a chip parameter fitting device according to one embodiment of the present invention. DETAILED DESCRIPTION

[0033] To facilitate understanding, some descriptions of concepts related to the embodiments of the present invention are exemplarily provided for reference.

[0034] As shown below:

[0035] Life cycle parameter fitting method: A statistical method for estimating life cycle parameters. Life cycle parameters usually refer to various parameters related to the life cycle of a product, service or system, such as lifespan, failure rate, maintenance cost, etc. The main steps of the life cycle parameter fitting method include data collection, model selection, parameter estimation and model validation.

[0036] Drive current: refers to the current used to control the operation of motors or other electrical equipment. The magnitude and direction of the drive current can affect the operating speed, direction and other parameters of the equipment. In industrial production, the drive current is usually adjusted and controlled by devices such as inverters, drivers or controllers. By adjusting the magnitude and direction of the drive current, precise control of the equipment can be achieved, improving production efficiency and performance.

[0037] Insufficient drive: usually refers to the inability of a motor or engine to provide sufficient power or torque to drive a mechanical device or vehicle during operation. For example, it may be caused by excessive load on the mechanical device or vehicle, insufficient power supply, transmission system failure, or motor / engine performance problems. Methods for solving the insufficient drive problem include increasing power supply, optimizing the transmission system, repairing the motor / engine, and reducing the load, etc., which are not limited here.

[0038] Driver parameters: Refers to the configuration information and settings used to control and manage hardware devices in a computer system. Including but not limited to the device's operating mode, speed, voltage, power consumption and other parameters. Driver parameters can be configured and adjusted through the operating system or application to ensure that the hardware device can work properly and perform at its best.

[0039] Automotive-grade chips: integrated circuit chips specially designed for automotive applications. These chips usually have higher reliability, stronger anti-interference ability and wider operating temperature range to meet the stringent requirements of the automotive working environment. Automotive-grade chips are usually used in automotive electronic systems, such as engine control units (ECUs), in-vehicle entertainment systems, driver assistance systems, etc. These chips can improve automotive performance, safety and convenience, while also helping to reduce energy consumption and emissions.

[0040] The drift problem of automotive-grade chip parameters during the life cycle refers to the gradual change of chip performance parameters due to environmental changes, workload changes and other factors during the use of the car. This drift may cause chip performance to degrade and affect the normal operation of the car system. Therefore, when designing automotive-grade chips, it is necessary to consider the drift problem during the life cycle and take appropriate measures to reduce the impact of drift on system performance.

[0041] In order to enable those skilled in the art to better understand the scheme of the present invention, the technical scheme in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.

[0042] It should be noted that the terms "first", "second", etc. in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein. In the description of this embodiment, unless otherwise specified, the meaning of "multiple" is two or more. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device comprising a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0043] According to one embodiment of the present invention, an embodiment of a chip parameter fitting method is provided. It should be noted that the steps shown in the flowchart of the accompanying drawings can be executed in a computer system such as a set of computer executable instructions, and although a logical order is shown in the flowchart, in some cases, the steps shown or described can be executed in an order different from that shown here.

[0044] The method embodiment can be executed in an electronic device including a memory and a processor, a similar control device or a system. Taking an electronic device as an example, the electronic device may include one or more processors and a memory for storing data. Optionally, the electronic device may also include a communication device and a display device for communication functions. It can be understood by a person of ordinary skill in the art that the above structural description is only illustrative and does not limit the structure of the above electronic device. For example, the electronic device may also include more or fewer components than the above structural description, or have a configuration different from the above structural description.

[0045] The processor may include one or more processing units. For example, the processor may include a central processing unit (CPU), a graphics processing unit (GPU), a digital signal processing (DSP) chip, a microcontroller unit (MCU), a programmable logic device (field-programmable gate array, FPGA), a neural network processor (NPU), a tensor processing unit (TPU), an artificial intelligence (AI) type processor, and the like. Among them, different processing units may be independent components or integrated in one or more processors. In some instances, the electronic device may also include one or more processors.

[0046] The memory can be used to store computer programs, such as storing the computer program corresponding to the chip parameter fitting method in the embodiment of the present invention, and the processor implements the above-mentioned chip parameter fitting method by running the computer program stored in the memory. The memory may include a high-speed random access memory, and may also include a non-volatile memory, such as one or more magnetic storage devices, flash memory, or other non-volatile solid-state memory. In some instances, the memory may further include a memory remotely arranged relative to the processor, and these remote memories can be connected to the electronic device via a network. Examples of the above-mentioned network include, but are not limited to, the Internet, an intranet, a local area network, a mobile communication network, and combinations thereof.

[0047] The communication device is used to receive or send data via a network. The specific example of the above network may include a wireless network provided by a communication provider of the mobile terminal. In one example, the communication device includes a network adapter (network interface controller, NIC), which can be connected to other network devices through a base station so as to communicate with the Internet. In one example, the communication device can be a radio frequency (RF) module, which is used to communicate with the Internet wirelessly.

[0048] The display device may be, for example, a touch screen type liquid crystal display (LCD) and a touch display (also referred to as a "touch screen" or a "touch display screen"). The liquid crystal display may enable a user to interact with a user interface of the mobile terminal. In some embodiments, the mobile terminal has a graphical user interface (GUI), and a user may interact with the GUI by finger contact and / or gestures on a touch-sensitive surface, wherein the human-computer interaction functions here may optionally include the following interactions: creating web pages, drawing, word processing, making electronic documents, games, video conferencing, instant messaging, sending and receiving emails, call interfaces, playing digital videos, playing digital music and / or web browsing, etc. The executable instructions for executing the above human-computer interaction functions are configured / stored in a computer program product or a readable storage medium executable by one or more processors.

[0049] In this embodiment, a chip parameter fitting method running on an electronic device is provided. Figure 1 is a flow chart of a chip parameter fitting method according to one embodiment of the present invention. Figure 1 As shown, the process includes the following steps:

[0050] Step S10, controlling the target chip to enter a driving working state, wherein the driving working state is used to drive the target load to work;

[0051] In the embodiment of the present invention, the target chip can be understood as a driver chip. The driver chip in the present invention is an automotive-grade chip, which can be understood as a microprocessor chip for controlling and monitoring various systems of a vehicle.

[0052] The target load can be understood as a driving load, that is, a load that needs to be driven by the target chip. For example, the driving load may include various motors, sensors, and actuators. The driving chip can control the motor of the car, the sensor of the chassis system of the car, and the actuator of the body stability system.

[0053] The driving working state can be understood as the state of the target chip when it is working normally, that is, the state of the target chip driving the target load to work. When the target chip is in the driving working state, the target chip will perform the corresponding tasks according to the preset program and algorithm, and drive the corresponding driving load to work, thereby ensuring the performance and safety of the car.

[0054] Controlling the target chip to enter the driving working state can be understood as enabling the target chip to start executing its designed function through specific signals or commands, that is, starting to receive external input signals and output corresponding results, and driving the target load to work.

[0055] In the embodiment of the present invention, the target chip is controlled to enter the driving working state so that the target chip drives the target load, thereby reasonably controlling the working state of the target load and reducing faults and errors caused by unstable working state.

[0056] Step S11, in a driving working state, performing parameter fitting on a target chip based on a test environment to obtain a chip driving performance curve of the target chip, a chip parameter curve of the target chip, a chip life curve of the target chip, initialization parameters, a first relationship, a second relationship, a third relationship, a fourth relationship, an operating condition of the target chip, an operating environment model of the target chip, and an operating condition of the target chip, wherein the initialization parameters include impedance and voltage drop of the target chip, the first relationship is used to represent the relationship between the test time and the chip life of the target chip, the second relationship is used to represent the relationship between the test temperature, the chip life, and the impedance, the third relationship is used to represent the relationship between the test temperature, the chip life, and the voltage drop, and the fourth relationship is used to represent the relationship between the test temperature, the chip life, and the current error;

[0057] In the embodiment of the present invention, the test environment can be understood as the specific environmental conditions in which the chip parameter fitting experiment is performed, including factors such as temperature, humidity, and air pressure, which are not limited here. These environmental conditions may affect the experimental results, so the test environment needs to be controlled and recorded when performing the parameter fitting experiment.

[0058] The chip drive performance curve can be understood as a graph of the performance that the target chip can provide under different working conditions. Exemplarily, these working conditions may include factors such as operating frequency, voltage, temperature, etc., which are not limited here. Generally speaking, as the operating frequency increases, the performance of the chip will improve, but it will also be accompanied by increased power consumption and increased temperature. Therefore, the chip drive performance curve usually shows a trend that the performance increases with the increase of the operating frequency, but after a certain frequency point, the performance improvement will become smaller, or even performance degradation will occur. In practical applications, understanding the chip drive performance curve can help engineers choose appropriate working conditions to maximize the performance advantages of the chip and avoid performance degradation or instability.

[0059] The chip parameter curve can be understood as the curve relationship of the target chip's parameters as a certain variable changes within a certain range. For example, these parameters may include the chip's power consumption, performance, temperature, etc., which are not limited here. By drawing the chip parameter curve, users can better understand the performance characteristics of the chip.

[0060] The chip life curve can be understood as the curve of the service life of the target chip under different working conditions over time. This curve is usually a "counterclockwise" curve, that is, the reliability is high in the initial stage and gradually decreases over time. By analyzing the chip life curve, we can better understand the service life of the chip and formulate a more reasonable maintenance plan and usage strategy.

[0061] The initialization parameters include the impedance and voltage drop of the target chip, which can be understood as parameters obtained by initializing the impedance parameters and voltage drop parameters preset in the target chip.

[0062] The first relationship is used to represent the relationship between the test time and the chip life of the target chip. It can be understood that the first relationship plays an important role in the test of target chip parameter fitting. The service life of the chip can be determined based on the test time and the first relationship, thereby reducing the time and cost of the test.

[0063] The second relationship is used to represent the relationship between the test temperature, chip life and impedance. It can be understood that by understanding the relationship between the test temperature, chip life and impedance, the most suitable temperature range for the chip to work can be found, thereby improving the performance and stability of the chip.

[0064] The third relationship is used to express the relationship between the test temperature, chip life and voltage drop. It can be understood that by analyzing the relationship between the test temperature, life and voltage drop, we can have a more comprehensive understanding of the performance of the chip under different working conditions, and we can also determine the optimal operating temperature range and voltage drop range, which is conducive to formulating reasonable working conditions and improving the reliability and stability of the chip.

[0065] The fourth relationship is used to express the relationship between the test temperature, chip life and current error. It can be understood that by analyzing the fourth relationship, researchers can more accurately determine the chip life and current error at different temperatures, thereby improving the chip performance evaluation and life prediction capabilities.

[0066] The operating conditions of the target chip can be understood as the performance of the chip under specific environmental conditions, and under specific load and input conditions. Exemplarily, this includes the operating frequency, power consumption, temperature and other parameters of the chip, which are not limited here. By analyzing the operating conditions of the target chip, the performance characteristics of the chip can be better understood.

[0067] The operating environment model of the target chip can be understood as being used to represent different working conditions when the target chip actually works, so as to better understand the performance characteristics of the target chip in practical applications, and thus perform parameter fitting and optimization.

[0068] The operating conditions of the target chip can be understood as the operating conditions set according to the actual use and needs of the car. For example, these conditions may include operating temperature range, voltage requirements, performance indicators, etc., which are not limited here. The target chip needs to operate stably under these set conditions and be able to meet the requirements of the automobile system.

[0069] Performing parameter fitting on the target chip can be understood as analyzing and obtaining the voltage drop parameters and impedance parameters of the target chip under the current test environment when the target chip is in a normal working state, so as to better understand and control the performance of the chip. In an embodiment of the present invention, under the driving working state, the target chip is parameter fitted based on the existing test environment, so as to obtain the chip driving performance curve of the target chip, the chip parameter curve of the target chip, the chip life curve of the target chip, the initialization parameters, the first relationship, the second relationship, the third relationship, the fourth relationship, the operating condition of the target chip, the operating environment model of the target chip and the operating conditions of the target chip. The above information obtained by performing parameter fitting on the target chip can more accurately understand the performance curve, parameter curve and life curve of the target chip, which is helpful to test and analyze the life of the chip more quickly in subsequent experiments.

[0070] Step S12, determining target fitting parameters of the target chip based on the chip driving performance curve, the chip parameter curve, the chip life curve, the initialization parameters, the first relationship, the second relationship, the third relationship, the fourth relationship, the operating conditions of the target chip, the operating environment model of the target chip, and the operating conditions of the target chip, wherein the target fitting parameters are used to represent the impedance and voltage drop of the target chip over its entire life cycle;

[0071] The target fitting parameters can be understood as the impedance parameters and voltage drop parameters of the target chip in its entire life cycle obtained by analyzing and fitting the target chip's drive performance curve, parameter curve, life curve, initialization parameters, first relationship, second relationship, third relationship, fourth relationship, operating conditions, operating environment model, and operating conditions. The target fitting parameters can help determine the electrical performance of the target chip under different operating conditions and environments, and provide an important reference for system design and optimization.

[0072] In the embodiment of the present invention, the impedance parameters and voltage drop parameters of the target chip are determined based on the obtained chip driving performance curve, chip parameter curve, chip life curve, initialization parameters, first relationship, second relationship, third relationship, fourth relationship, operating conditions of the target chip, operating environment model of the target chip, and operating conditions of the target chip. By analyzing and fitting the above-mentioned various data, the target fitting parameters of the target chip, that is, the impedance parameters and voltage drop parameters of the target chip in the entire life cycle, can be more accurately determined to ensure that the chip achieves the expected performance in actual operation.

[0073] Step S13: adjusting the driving parameters of the controller in the target vehicle based on the target fitting parameters, wherein the target vehicle is equipped with a target chip, and the controller is used to monitor and control the operating status of the engine and the transmission system.

[0074] In the embodiment of the present invention, the target vehicle can be understood as a specific vehicle equipped with a target chip.

[0075] The driving parameters of the controller can be understood as the parameters used to adjust the controller to monitor and control the operating status of the engine and transmission system.

[0076] Adjusting the driving parameters of the controller in the target vehicle based on the target fitting parameters can be understood as adjusting the driving parameters of the target vehicle controller using the impedance parameters and voltage drop parameters of the obtained target chip, so as to better control the operating state of the target vehicle.

[0077] In the embodiment of the present invention, the driving parameters of the controller in the target vehicle are adjusted based on the target fitting parameters, so that the vehicle can be made more stable and easy to control, the driving stability and safety performance of the vehicle can be improved, and the power output of the vehicle can be optimized, the acceleration performance and the power response speed can be improved, thereby increasing the service life of the target chip. When the driving parameters of the controller in the target vehicle change, the target vehicle will adjust the driving parameters of the controller in a timely manner according to the obtained target fitting parameters, thereby avoiding failures in the drive system and ensuring the driving safety of the target vehicle.

[0078] In the embodiment of the present invention, first, it is ensured that the target chip is in a normal driving state so that the operation of the target load can be reasonably and effectively controlled. By performing parameter fitting on the target chip, its performance and life curve data can be more accurately understood, so as to better test and analyze its life in practical applications. Then, the target fitting parameters of the target chip are determined based on these data to ensure that it can achieve the expected performance throughout its life cycle. Finally, the driving parameters of the controller in the vehicle are adjusted according to the target fitting parameters to improve the stability, safety and power output of the vehicle and extend the service life of the target chip.

[0079] Through the above steps, the target chip is controlled to enter a driving working state, wherein the driving working state is used to drive the target load to work. In the driving working state, the target chip is parameter-fitted based on the test environment to obtain a chip driving performance curve of the target chip, a chip parameter curve of the target chip, a chip life curve of the target chip, initialization parameters, a first relationship, a second relationship, a third relationship, a fourth relationship, an operating condition of the target chip, an operating environment model of the target chip, and an operating condition of the target chip, wherein the initialization parameters include the impedance and voltage drop of the target chip, the first relationship is used to represent the relationship between the test time and the chip life of the target chip, the second relationship is used to represent the relationship between the test temperature, the chip life and the impedance, and the third relationship is used to represent the relationship between the test temperature, the chip life and the impedance. The third relationship is used to represent the relationship between the test temperature, chip life and voltage drop, and the fourth relationship is used to represent the relationship between the test temperature, chip life and current error. The target fitting parameters of the target chip are determined based on the chip driving performance curve, chip parameter curve, chip life curve, initialization parameters, the first relationship, the second relationship, the third relationship, the fourth relationship, the operating conditions of the target chip, the operating environment model of the target chip and the operating conditions of the target chip, wherein the target fitting parameters are used to represent the impedance and voltage drop of the target chip in the entire life cycle, and the driving parameters of the controller in the target vehicle are adjusted based on the target fitting parameters, wherein the target vehicle is equipped with the target chip, and the controller is used to monitor and control the operating status of the engine and transmission system. The above method is adopted to fit the parameters of the automotive-grade chip by designing and calibrating the parameters of the entire life cycle in order to solve the drift problem of the parameters of the automotive-grade chip in the life cycle, so as to realize loss repair and data fitting, thereby solving the technical problem in the related art that when the driving parameters of the chip with high driving precision change, the driven system will fail and cannot operate normally.

[0080] Optionally, in step S11, performing parameter fitting on the target chip based on the test environment to obtain a chip driving performance curve of the target chip, a chip parameter curve of the target chip, and a chip life curve of the target chip may include the following execution steps:

[0081] Step S11 a, under a first test environment, recording an ideal current waveform of the target chip based on a certification load box, wherein the first test environment includes a durability test environment and a full-life high-temperature test environment;

[0082] Step S11 b, recording the actual current waveform of the target chip based on the current sensor;

[0083] Step S11c, determining a chip driving performance curve, a chip parameter curve, and a chip life curve based on the ideal current waveform and the actual current waveform.

[0084] In the embodiment of the present invention, the first test environment may be understood as a test environment for performing endurance tests and full-life high-temperature tests on a target chip, and may also include other test environments, which are not limited here.

[0085] The authentication load box can be understood as the main control part of the authentication load box, wherein the authentication load box can communicate with the target chip through the controller area network (CAN), and the target chip transmits the ideal current waveform to the authentication load box through CAN, so that the authentication load box records the ideal current waveform of the target chip. The authentication load box is also used to receive and record the actual current waveform of the target chip in the process of driving the target load.

[0086] The current sensor can be understood as a high-precision current sensor that is used to record the actual current waveform when the target chip drives the target load. The current sensor can monitor the current flow in the vehicle electrical system in real time, helping the vehicle system controller to detect current anomalies in a timely manner.

[0087] In the first test environment, the ideal current waveform of the target chip is recorded based on the certification load box. It can be understood that the current consumption and waveform changes of the target chip in the endurance test environment and the full-life high-temperature test environment are monitored and analyzed based on the certification load box, so as to timely discover and solve potential problems and ensure the reliability and stability of the chip.

[0088] Based on the current sensor recording the actual current waveform of the target chip, it can be understood that recording the actual current waveform of the target chip can help understand the current consumption of the target chip under different working conditions, so as to perform power consumption analysis and optimize the design.

[0089] The chip driving performance curve, chip parameter curve and chip life curve are determined based on the ideal current waveform and the actual current waveform. It can be understood that first, the current error of the target chip can be obtained according to the ideal current waveform and the actual current waveform, and then the driving performance curve, parameter curve and life curve of the target chip can be accurately and scientifically determined according to the current error waveform.

[0090] Figure 2 is a schematic diagram of a method for designing authentication matching data according to one embodiment of the present invention, such as Figure 2 As shown, the implementation process of the above steps S11a to S11c is comprehensively described. The design certification matching data system includes a target chip, a target load, a current sensor, and a certification load box. Since the life loss of the target chip will cause the driving function and driving waveform parameters of the target vehicle controller to change during the design certification, it is necessary to correct the life loss of the target chip through software.

[0091] For example, for proportional valve drive and injection drive with high load accuracy requirements, in order to avoid the design parameter error caused by the life loss of the target chip, during the design certification, it is possible to choose to control the target chip to enter the driving working state under the test environment of the endurance test and the full-life high-temperature test, so that the target chip drives the target load to work, and the working state of the target load is controlled and monitored by the target chip. At the same time, the target chip and the certification load box communicate through CAN, and the target chip transmits the ideal current waveform to the certification load box through CAN, so that the certification load box records the ideal current waveform of the target chip. In addition, when the target chip drives the target load to work, the current sensor will record the actual current waveform of the target chip and transmit the actual current waveform to the certification load box, so that the certification load box can be analyzed based on the ideal current waveform and the actual current waveform to obtain the chip driving performance curve, chip parameter curve and chip life curve of the target chip, and then timely correct the error caused by parameter changes in the target vehicle controller during use according to the obtained chip driving performance curve, chip parameter curve and chip life curve.

[0092] In an embodiment of the present invention, under a first test environment, based on recording the ideal current waveform of the target chip by a certification load box, by recording the ideal current waveform of the target chip, the current waveform of the target chip under different working environments can be analyzed and compared, so as to better understand the working state and performance of the chip, and improve the stability and reliability of the chip. Based on the current sensor recording the actual current waveform of the target chip, by recording the actual current waveform of the target chip by the current sensor, the working state and performance of the target device can be monitored in real time, and abnormal conditions can be discovered and handled in time. Based on the ideal current waveform and the actual current waveform, the chip driving performance curve, the chip parameter curve and the chip life curve are determined. By analyzing the current waveform, the performance and parameters of the chip can be better understood, so that the life of the chip can be predicted, and it is also helpful to formulate a reasonable maintenance plan and extend the service life of the chip.

[0093] Optionally, in step S11, performing parameter fitting on the target chip based on the test environment to obtain the initialization parameters may include the following execution steps:

[0094] Step S11d, in a second test environment, the impedance and voltage drop of the target chip are initialized within a preset time period based on the chip production line equipment to obtain initialization parameters, wherein the second test environment includes a normal temperature short-term test environment and a high temperature short-term test environment, and the preset time period is used to represent the time period between the first moment when the target chip starts working for the first time and the second moment after the target chip starts working.

[0095] In the embodiment of the present invention, the second test environment may be understood as a test environment for performing short-term tests on the target chip at room temperature and high temperature, and may also include other test environments, which are not limited here.

[0096] Chip production line equipment can be understood as chip end-of-life (EOL) equipment, which is mainly used to calculate waveforms and initial values ​​and record current.

[0097] The preset time period can be understood as the time period between the first moment when the target chip starts working for the first time and the second moment after starting working. Exemplarily, the preset time period can be 2 minutes, that is, the time interval between the first moment and the second moment can be 2 minutes, which is not limited here.

[0098] In the second test environment, the impedance and voltage drop of the target chip are initialized within a preset time period based on the chip production line equipment to obtain the initialization parameters. It can be understood that in the normal temperature short-term test environment and the high temperature short-term test environment, the impedance parameters and voltage drop parameters of the target chip are initialized in the time period between the first moment when the target chip starts working for the first time and the second moment after the target chip starts working, thereby obtaining the initialization parameters of the target chip. By obtaining the initialization parameters, accurate basic data can be provided for subsequent testing and debugging work.

[0099] Figure 3 is a schematic diagram of a method for calculating EOL initial data according to one embodiment of the present invention. Figure 3 The implementation process of the above step S11d is comprehensively described as shown in FIG. 1. The EOL initial data calculation system includes EOL equipment (ie, chip production line equipment), target chip, target load, and current sensor.

[0100] Exemplarily, under normal temperature and high temperature short-term test environment, the target chip is controlled to enter the driving working state, so that the target chip drives the target load to work, and the working state of the target load is controlled and monitored by the target chip. A current sensor is used to record the actual current waveform of the target chip driving the target load during the working process, and an oscilloscope is used to display the actual current waveform of the target chip during the working process recorded by the current sensor. From the first moment when the target chip starts working for the first time, the impedance parameters and voltage drop parameters of the target chip are initialized within a test cycle of about 2 minutes using the EOL equipment and the initialization parameters of the processed target chip are recorded in the controller storage chip, and this initialization parameter is used as the state at zero kilometers.

[0101] In the embodiment of the present invention, in the second test environment, the impedance and voltage drop of the target chip are initialized within a preset time period based on the chip production line equipment to obtain the initialization parameters. By initializing the impedance and voltage drop of the target chip within the preset time period, the initial driving parameters of the target chip at zero kilometer can be accurately analyzed and obtained, so as to subsequently accurately control the impedance and voltage drop of the target chip.

[0102] Optionally, in step S11, performing parameter fitting on the target chip based on the test environment to obtain the first relationship may include the following execution steps:

[0103] Step S11e, under a third test environment, determining a first relationship based on a preset life function and a preset endurance acceleration function, wherein the third test environment includes a high temperature test environment and a temperature endurance test environment, the preset life function is used to derive the test time based on a preset acceleration factor and the vehicle life, and the preset endurance acceleration function is used to derive the chip life based on a preset acceleration factor and the test time.

[0104] In the embodiment of the present invention, the third test environment may be understood as a test environment for the target chip to undergo a high temperature test and a temperature endurance test, and may also include other test environments, which are not limited herein.

[0105] The preset life function and the preset endurance acceleration function can be understood as the life calculation formula and the endurance acceleration formula respectively, wherein the preset life function is used to deduce the test time based on the preset acceleration factor and the vehicle life, and the preset endurance acceleration function is used to deduce the chip life based on the preset acceleration factor and the test time. The preset acceleration factor can be understood as a factor used to accelerate the aging process of materials or equipment under experimental conditions in order to more quickly evaluate the life and performance. It can be seen that the relationship between the test time and the life can be inferred based on the preset life function and the preset endurance acceleration function.

[0106] Under the third test environment, the first relationship is determined based on the preset life function and the preset endurance acceleration function. This can be understood as, under the test environment of high temperature test and temperature endurance test, based on the preset acceleration factor, using the preset life function and the preset endurance acceleration function to reversely infer the relationship between test time and life. This can not only more accurately obtain the relationship between test time and life, but also save time and cost, and improve test efficiency and accuracy.

[0107] Figure 4 is a schematic diagram of a life recording method according to one embodiment of the present invention. Figure 4As shown, the implementation process of the above step S11e is comprehensively described, that is, the relationship between the test time and the life is reversed according to the life calculation formula and the durability acceleration formula. The life recording method involves three scenarios: certification scheme, certification process and vehicle operation. For example, in the test environment of high temperature test and temperature durability test, in the certification scheme design process, the test time can be derived according to the vehicle life and the preset acceleration factor, that is, the preset life function is determined. In the design and certification process, the life of the target chip can be derived according to the derived test time and the preset acceleration factor, that is, the preset durability acceleration function is determined. After determining the preset life function and the preset durability acceleration function, the parameter loss of the target chip can be directly calculated according to the operating time and the determined preset life function and preset durability acceleration function during the operation of the vehicle, thereby determining the first relationship between the test time and the chip life of the target chip.

[0108] In addition, the first relationship can be stored in the controller of the target vehicle, so that when the vehicle is actually running, the controller only needs to collect the actual running time for life calculation to obtain the parameter consumption of the target chip, and there is no need to convert the acceleration factor in the actual vehicle, thereby reducing the consumption of various resources when the entire vehicle is running.

[0109] In the embodiment of the present invention, under the third test environment, the first relationship is determined based on the preset life function and the preset endurance acceleration function. The first relationship is determined by the preset life function and the preset endurance acceleration function, so that the test time and chip life can be predicted more accurately, thereby improving the test efficiency, reducing the test time and cost, and better optimizing the test plan, reasonably arranging the test time and resources, and improving the accuracy and reliability of the test.

[0110] Optionally, in step S11, performing parameter fitting on the target chip based on the test environment to obtain the second relationship, the third relationship and the fourth relationship may include the following execution steps:

[0111] Step S11 f, obtaining first impact information of the temperature impact factor and second impact information of the life impact factor under a fourth test environment, wherein the fourth test environment is used to represent any test environment in the design certification process;

[0112] Step S11g: determining the second relationship, the third relationship and the fourth relationship based on the first impact information and the second impact information.

[0113] In the embodiment of the present invention, the fourth test environment can be understood as any test environment for design certification of the target chip, including but not limited to high temperature test, temperature endurance test, normal temperature short-term test, high temperature short-term test, etc., which are not limited here.

[0114] The first impact information of the temperature impact factor can be understood as the impact information of temperature on the impedance, voltage drop and current error of the target chip, and the second impact information of the life impact factor can be understood as the impact information of life on the impedance, voltage drop and current error of the target chip.

[0115] In the fourth test environment, the first influence information of the temperature influence factor and the second influence information of the life influence factor are obtained, and the second relationship, the third relationship and the fourth relationship are determined based on the first influence information and the second influence information. It can be understood that in any test environment such as high temperature test, temperature endurance test, normal temperature short-term test, high temperature short-term test, etc., the relationship between the test temperature, chip life and impedance, the relationship between the test temperature, chip life and voltage drop, and the relationship between the test temperature, chip life and current error are determined based on the temperature influence factor and the life influence factor.

[0116] Figure 5 is a schematic diagram of a parameter fitting implementation method according to one embodiment of the present invention, such as Figure 5 As shown, the implementation process of the above steps S11f to S11g is comprehensively described. Under the fourth experimental environment, first obtain the first influence information of the temperature influence factor and the second influence information of the life influence factor, and then analyze the data results of the driving parameter impedance, voltage drop and current error of the target chip as the temperature influence factor and the life influence factor change based on the first influence information and the second influence information, and generate a lookup table relationship between the temperature influence factor and the life influence factor and the driving parameter impedance, voltage drop and current error of the target chip. Finally, through the full life calibration process, the curve is made into three stable function relationships, and the main parameters of the function are recorded in the controller. Since the initialization data of the three function relationships will have slight differences due to the consistency of the target chip, through Figure 3 The EOL calibration can calibrate the initialization differences of the curve and the parameter differences of the function relationship to ensure consistency, thereby avoiding differences and ensuring consistency.

[0117] In the embodiment of the present invention, under the fourth test environment, the first influence information of the temperature influence factor and the second influence information of the life influence factor are obtained, and the second relationship, the third relationship and the fourth relationship are determined based on the first influence information and the second influence information. Determining the second relationship, the third relationship and the fourth relationship by obtaining the temperature influence factor and the life influence factor can not only help to better understand the influence of temperature and life on the target chip parameters, but also improve the accuracy and stability of chip parameter fitting, thereby extending the service life of the chip and reducing the failure rate.

[0118] Optionally, in step S11, performing parameter fitting on the target chip based on the test environment to obtain the operating condition of the target chip, the operating environment model of the target chip, and the operating condition of the target chip may include the following execution steps:

[0119] Step S11h, under the fifth test environment, determining the operating condition of the target chip based on the operating environment and operating condition of the target vehicle;

[0120] Step S11i, constructing an operating environment model of a target chip based on an operating environment model of a target vehicle;

[0121] Step S11j, determining the operating condition of the target chip based on the operating condition of the target vehicle.

[0122] In the embodiment of the present invention, the fifth test environment may be understood as a test environment for determining the operating condition of the target chip under the operating environment of the target vehicle.

[0123] Exemplarily, the operating environment and operating conditions of the target vehicle may include the operating conditions of the vehicle under different road conditions such as flat roads, uphill roads, downhill roads, and curves. The operating performance of the vehicle under different temperatures and humidities will also be different. The performance of the vehicle will also be different when the vehicle is empty, fully loaded, or overloaded, etc., which is not limited here.

[0124] In the fifth test environment, the operating conditions of the target chip are determined based on the operating environment and operating conditions of the target vehicle. It can be understood that when the vehicle is in various complex operating environments and operating conditions, the operating conditions of the target chip are also different. By simulating various complex operating environments and operating conditions, the stability and reliability of the target chip in different operating states are ensured.

[0125] Building the target chip's operating environment model based on the target vehicle's operating environment model can be understood as simulating the vehicle's actual operating environment. The data and feedback obtained can help better optimize the chip's design and parameter settings, improve its performance and power efficiency, and reduce the time and cost of debugging and optimization.

[0126] The operating conditions of the target chip are determined based on the operating conditions of the target vehicle. It can be understood that the operating conditions of the chip are closely related to the stability of the system. Determining the operating conditions of the chip based on the operating conditions of the target vehicle can improve the stability of the system and reduce the possibility of failure.

[0127] In the embodiment of the present invention, under the fifth test environment, the operating conditions of the target chip are determined based on the operating environment and operating conditions of the target vehicle, the operating environment model of the target chip is constructed based on the operating environment model of the target vehicle, and the operating conditions of the target chip are determined based on the operating conditions of the target vehicle. By adopting a combination of vehicle operating conditions and semiconductor physics, the actual operating environment and operating conditions of the target vehicle can be simulated more accurately, thereby obtaining a more realistic and reliable parameter fitting result.

[0128] Optionally, in step S11h, determining the operating condition of the target chip based on the operating environment and operating condition of the target vehicle may include the following execution steps:

[0129] Step S11 h1, determining the operating state of the controller in the target vehicle based on the operating environment and operating conditions of the target vehicle;

[0130] Step S11 h2, determining the conduction state of the transistor in the target chip based on the operating state of the controller;

[0131] Step S11 h3, obtaining the operating condition of the target chip based on the conduction state of the transistor.

[0132] Determining the operating status of the controller in the target vehicle based on the operating environment and operating conditions of the target vehicle can improve the stability and controllability of the vehicle, reduce the probability of accidents, and improve driving safety.

[0133] The conduction state of the transistor in the target chip is determined based on the operating state of the controller. It can be understood that determining the conduction state of the transistor in the target chip can help monitor and control the current flow in the circuit in real time, thereby effectively protecting the components and equipment in the circuit and improving the stability and reliability of the circuit.

[0134] The operating condition of the target chip is obtained based on the conduction state of the transistor. It can be understood that by monitoring and controlling the conduction state of the transistor and then obtaining the operating condition of the target chip, the safety of the system can be improved and the occurrence of overload, short circuit and other problems can be prevented.

[0135] In an embodiment of the present invention, the operating state of the controller in the target vehicle is determined based on the operating environment and operating conditions of the target vehicle. By determining the operating environment and operating conditions of the target vehicle, the actual operating conditions of the vehicle can be more accurately understood, which helps to determine the actual needs of the target chip. The conduction state of the transistor in the target chip is determined based on the operating state of the controller. The conduction state of the transistor in the target chip is determined according to the operating state of the controller, which can more accurately control the working state of the chip and avoid unnecessary energy consumption and loss. The operating conditions of the target chip are obtained based on the conduction state of the transistor. According to the obtained operating conditions of the target chip, the actual working conditions of the chip can be more intuitively understood, which helps to discover and solve problems in a timely manner.

[0136] Optionally, in step S11 h1, determining the operating state of the controller in the target vehicle based on the operating environment and operating conditions of the target vehicle, and determining the operating condition of the target chip based on the operating condition of the target vehicle may include the following execution steps:

[0137] Step S11 h11, determining the operating condition of the controller based on the operating condition of the target vehicle and the position of the controller;

[0138] Steps S11 to S12: determining the operating condition of the target chip based on the operating condition of the controller, the packaging form of the target chip, and the sealing condition of the controller.

[0139] Determining the operating condition of the controller based on the operating condition of the target vehicle and the position of the controller can be understood as determining the operating condition of the controller according to the actual operating condition of the vehicle and the position of the controller, which can more accurately control the driving of the vehicle and improve the performance and safety of the vehicle.

[0140] The operating conditions of the target chip are determined based on the operating conditions of the controller, the packaging form of the target chip and the sealing conditions of the controller. It can be understood that determining the operating conditions of the target chip by the operating conditions of the controller and the packaging form of the target chip can ensure that the system operates in a suitable environment and avoid overheating or unstable operation of the target chip due to improper environmental conditions.

[0141] Figure 6 is a schematic diagram of a method for combining vehicle operating conditions and semiconductor physics according to one embodiment of the present invention, such as Figure 6As shown, the implementation process of the above-mentioned steps S11 h to S11 j is comprehensively described. Under the fifth test environment, the operating environment and operating conditions of the whole vehicle (i.e., the target vehicle) are first decomposed to the triode inside the target chip, that is, according to the operating states such as the stationary, starting, 40 km / h, 80 km / h and 120 km / h of the whole vehicle, they are decomposed to the controller and the target chip. Then the operating state of the controller is decomposed so that the internal triode of the target chip is in an on or off state, thereby determining the operating condition of the target chip. At the same time, the temperature parameters, humidity parameters, and vibration parameters of the target vehicle can be transferred to the target chip to form an operating environment model of the target chip. In addition, the operating conditions of the target vehicle can be combined with the controller layout position to obtain the operating conditions of the controller, and then the controller operating conditions can be combined with the target chip packaging and the controller sealing conditions to obtain the operating conditions of the target chip.

[0142] In the embodiment of the present invention, the operating condition of the controller is determined based on the operating condition of the target vehicle and the position of the controller, which can ensure that the operating state of the controller at different positions meets the requirements of the target vehicle and improve the stability and reliability of the system. The operating condition of the target chip is determined based on the operating condition of the controller, the packaging form of the target chip and the sealing condition of the controller. According to the operating condition of the target chip, the working state of the target chip can be further optimized, the performance and life of the target chip can be improved, and the failure rate and maintenance cost of the target chip can be reduced.

[0143] Optionally, the target chip is electrically connected to the power tube, the power tube is electrically connected to the sampler, the sampler is electrically connected to the actuator, the power tube is used to control the current conduction state of the target chip, the sampler is used to collect the current output by the power tube, and the actuator is used to control the injection amount of the injection circuit. The chip parameter fitting method may also include the following execution steps:

[0144] Step S14, obtaining a target current output by the power tube based on the sampler, wherein the target current is a current output by the target chip through the power tube;

[0145] Step S15, controlling the actuator to adjust the fuel injection amount of the fuel injection circuit based on the target current, wherein the fuel injection circuit is used to inject fuel to the target vehicle.

[0146] In the embodiments of the present invention, the power tube can be understood as an electronic device for controlling the switching state of current or voltage. The sampler can be understood as a device for collecting signal samples, usually used to measure or monitor the current or voltage in the circuit. The actuator can be understood as a device for performing a specific task, usually to achieve a certain effect based on an input signal or a control signal. The injection circuit can be understood as a circuit for controlling the engine injection system, usually used to control the operation of gasoline or diesel injectors to adjust the fuel supply of the engine.

[0147] Based on the target current output by the power tube obtained by the sampler, it can be understood that the sampler can monitor the target current output by the power tube in real time, detect current anomalies or fluctuations in time, and ensure the stability and safety of system operation. In addition, the sampler can also transmit the target current output by the power tube to the actuator, so that the actuator adjusts the injection amount of the injection circuit according to the target current.

[0148] The actuator is controlled to adjust the fuel injection amount of the fuel injection circuit based on the target current. It can be understood that the actuator can be controlled to accurately control the fuel injection amount of the fuel injection circuit to the target vehicle based on the acquired target current.

[0149] Figure 7 is a schematic diagram of a fuel injection simulation circuit according to one embodiment of the present invention, such as Figure 7 As shown, the implementation process of the above steps S14 to S15 is comprehensively described. The fuel injection simulation circuit includes a vehicle control unit (Microcontroller Unit, MCU), a general timer module (Genera l Timer Module, GTM), a fast analog-to-digital converter acquisition module (Fast Analog-to-Digital Converter, FADC), a boost circuit, a pre-drive circuit (i.e., a target chip), a power tube, a sampling module (i.e., a sampler) and an actuator module (i.e., an actuator).

[0150] It should be noted that Figure 7 The target chip carried by the pre-drive circuit is a chip that performs full life cycle parameter fitting according to the chip parameter fitting proposed in the present invention. That is, the present invention also provides a method for realizing an injection circuit using a target chip with full life cycle parameter fitting, which solves the technical problems of the injection drive chip.

[0151] Exemplarily, the boost circuit is first controlled to boost voltage through the pulse width modulation (PWM) function of the GTM module in the MCU, and the high voltage is transmitted to the pre-drive circuit. Then the current in the pre-drive circuit is controlled through the power tube, and the sampling module samples the target current output by the power tube, and feeds the target current back to the FADC module. At the same time, the sampling module also transmits the target current to the actuator, so that the actuator adjusts the injection amount of the injection circuit based on the target current and injects fuel to the target vehicle. After receiving the target current, the FADC module also sends the target current to the GTM module to determine the frequency and duty cycle of the boost circuit and the pre-drive circuit.

[0152] The above method can achieve accurate control of the target vehicle's fuel injection amount, improve fuel efficiency, reduce tail gas emissions, reduce vehicle pollutant emissions, and benefit environmental protection. At the same time, by real-time monitoring of the target current and adjusting the fuel injection amount, the vehicle's fuel economy can be improved and fuel costs can be saved. In addition, the method can also improve the vehicle's performance and make the engine run more smoothly and efficiently.

[0153] Through the description of the above implementation methods, those skilled in the art can clearly understand that the method according to the above embodiment can be implemented by means of software plus a necessary general hardware platform, and of course can also be implemented by hardware, but in many cases the former is a better implementation method. Based on such an understanding, the technical solution of the present invention, or the part that contributes to the prior art, can be embodied in the form of a software product, which is stored in a storage medium (such as ROM / RAM, a magnetic disk, or an optical disk), and includes a number of instructions for enabling a terminal device (which can be a mobile phone, a computer, a server, or a network device, etc.) to execute the methods described in each embodiment of the present invention.

[0154] In this embodiment, a chip parameter fitting device is also provided, which is used to implement the above embodiments and preferred implementation modes, and the descriptions that have been made will not be repeated. As used below, the term "module" can implement a combination of software and / or hardware of a predetermined function. Although the devices described in the following embodiments are preferably implemented in software, the implementation of hardware, or a combination of software and hardware, is also possible and conceivable.

[0155] Figure 8 is a structural block diagram of a chip parameter fitting device according to one embodiment of the present invention. Figure 8As shown, a chip parameter fitting device 800 is used as an example, and the device includes: a control module 801, which is used to control the target chip to enter a driving working state, wherein the driving working state is used to drive the target load to work; a fitting module 802, which is used to perform parameter fitting on the target chip based on the test environment in the driving working state, and obtain a chip driving performance curve of the target chip, a chip parameter curve of the target chip, a chip life curve of the target chip, initialization parameters, a first relationship, a second relationship, a third relationship, a fourth relationship, an operating condition of the target chip, an operating environment model of the target chip, and an operating condition of the target chip, wherein the initialization parameters include the impedance and voltage drop of the target chip, the first relationship is used to represent the relationship between the test time and the chip life of the target chip, and the second relationship is used to represent the test temperature, the chip life and impedance, the third relationship is used to represent the relationship between the test temperature, the chip life and the voltage drop, and the fourth relationship is used to represent the relationship between the test temperature, the chip life and the current error; a determination module 803 is used to determine the target fitting parameters of the target chip based on the chip driving performance curve, the chip parameter curve, the chip life curve, the initialization parameters, the first relationship, the second relationship, the third relationship, the fourth relationship, the operating conditions of the target chip, the operating environment model of the target chip and the operating conditions of the target chip, wherein the target fitting parameters are used to represent the impedance and voltage drop of the target chip throughout its life cycle; an adjustment module 804 is used to adjust the driving parameters of the controller in the target vehicle based on the target fitting parameters, wherein the target vehicle is equipped with the target chip, and the controller is used to monitor and control the operating status of the engine and the transmission system.

[0156] Optionally, the fitting module 801 is also used to record the ideal current waveform of the target chip under a first test environment based on a certification load box, wherein the first test environment includes an endurance test environment and a full-life high-temperature test environment; record the actual current waveform of the target chip based on a current sensor; and determine a chip driving performance curve, a chip parameter curve and a chip life curve based on the ideal current waveform and the actual current waveform.

[0157] Optionally, the fitting module 801 is also used to initialize the impedance and voltage drop of the target chip within a preset time period based on the chip production line equipment in a second test environment to obtain initialization parameters, wherein the second test environment includes a normal temperature short-term test environment and a high temperature short-term test environment, and the preset time period is used to represent the time period between a first moment when the target chip starts working for the first time and a second moment after the target chip starts working.

[0158] Optionally, the fitting module 801 is also used to determine the first relationship based on a preset life function and a preset durability acceleration function under a third test environment, wherein the third test environment includes a high temperature test environment and a temperature durability test environment, the preset life function is used to derive the test time based on a preset acceleration factor and the vehicle life, and the preset durability acceleration function is used to derive the chip life based on the preset acceleration factor and the test time.

[0159] Optionally, the fitting module 801 is also used to obtain first impact information of the temperature impact factor and second impact information of the life impact factor under a fourth test environment, wherein the fourth test environment is used to represent any test environment in the design certification process; and determine the second relationship, the third relationship and the fourth relationship based on the first impact information and the second impact information.

[0160] Optionally, the fitting module 801 is also used to determine the operating conditions of the target chip based on the operating environment and operating conditions of the target vehicle under the fifth test environment; construct an operating environment model of the target chip based on the operating environment model of the target vehicle; and determine the operating conditions of the target chip based on the operating conditions of the target vehicle.

[0161] It should be noted that the above modules can be implemented by software or hardware. For the latter, it can be implemented in the following ways, but not limited to: the above modules are all located in the same processor; or the above modules are located in different processors in any combination.

[0162] An embodiment of the present invention further provides a computer-readable storage medium, in which a computer program is stored. The computer program is configured to execute the steps of any of the above method embodiments when running on a computer or a processor.

[0163] Optionally, in this embodiment, the computer-readable storage medium may be configured to store a computer program for performing the following steps:

[0164] Step S10, controlling the target chip to enter a driving working state, wherein the driving working state is used to drive the target load to work;

[0165] Step S11, in a driving working state, performing parameter fitting on a target chip based on a test environment to obtain a chip driving performance curve of the target chip, a chip parameter curve of the target chip, a chip life curve of the target chip, initialization parameters, a first relationship, a second relationship, a third relationship, a fourth relationship, an operating condition of the target chip, an operating environment model of the target chip, and an operating condition of the target chip, wherein the initialization parameters include impedance and voltage drop of the target chip, the first relationship is used to represent the relationship between the test time and the chip life of the target chip, the second relationship is used to represent the relationship between the test temperature, the chip life, and the impedance, the third relationship is used to represent the relationship between the test temperature, the chip life, and the voltage drop, and the fourth relationship is used to represent the relationship between the test temperature, the chip life, and the current error;

[0166] Step S12, determining target fitting parameters of the target chip based on the chip driving performance curve, the chip parameter curve, the chip life curve, the initialization parameters, the first relationship, the second relationship, the third relationship, the fourth relationship, the operating conditions of the target chip, the operating environment model of the target chip, and the operating conditions of the target chip, wherein the target fitting parameters are used to represent the impedance and voltage drop of the target chip over its entire life cycle;

[0167] Step S13: adjusting the driving parameters of the controller in the target vehicle based on the target fitting parameters, wherein the target vehicle is equipped with a target chip, and the controller is used to monitor and control the operating status of the engine and the transmission system.

[0168] Optionally, in this embodiment, the above-mentioned computer-readable storage medium may include but is not limited to: a USB flash drive, a read-only memory (ROM), a random access memory (RAM), a mobile hard disk, a magnetic disk or an optical disk, and other media that can store computer programs.

[0169] An embodiment of the present invention further provides an electronic device, including a memory and a processor, wherein a computer program is stored in the memory, and the processor is configured to run the computer program to execute the steps in any one of the above method embodiments.

[0170] Optionally, in this embodiment, the processor in the electronic device may be configured to run a computer program to perform the following steps:

[0171] Step S10, controlling the target chip to enter a driving working state, wherein the driving working state is used to drive the target load to work;

[0172] Step S11, in a driving working state, performing parameter fitting on a target chip based on a test environment to obtain a chip driving performance curve of the target chip, a chip parameter curve of the target chip, a chip life curve of the target chip, initialization parameters, a first relationship, a second relationship, a third relationship, a fourth relationship, an operating condition of the target chip, an operating environment model of the target chip, and an operating condition of the target chip, wherein the initialization parameters include impedance and voltage drop of the target chip, the first relationship is used to represent the relationship between the test time and the chip life of the target chip, the second relationship is used to represent the relationship between the test temperature, the chip life, and the impedance, the third relationship is used to represent the relationship between the test temperature, the chip life, and the voltage drop, and the fourth relationship is used to represent the relationship between the test temperature, the chip life, and the current error;

[0173] Step S12, determining target fitting parameters of the target chip based on the chip driving performance curve, the chip parameter curve, the chip life curve, the initialization parameters, the first relationship, the second relationship, the third relationship, the fourth relationship, the operating conditions of the target chip, the operating environment model of the target chip, and the operating conditions of the target chip, wherein the target fitting parameters are used to represent the impedance and voltage drop of the target chip over its entire life cycle;

[0174] Step S13: adjusting the driving parameters of the controller in the target vehicle based on the target fitting parameters, wherein the target vehicle is equipped with a target chip, and the controller is used to monitor and control the operating status of the engine and the transmission system.

[0175] An embodiment of the present invention further provides a computer program product, including a computer program, which implements the steps in any of the above method embodiments when executed by a processor.

[0176] Optionally, in this embodiment, the computer program in the above computer program product may be configured to perform the following steps when executed by a processor:

[0177] Step S10, controlling the target chip to enter a driving working state, wherein the driving working state is used to drive the target load to work;

[0178] Step S11, in a driving working state, performing parameter fitting on a target chip based on a test environment to obtain a chip driving performance curve of the target chip, a chip parameter curve of the target chip, a chip life curve of the target chip, initialization parameters, a first relationship, a second relationship, a third relationship, a fourth relationship, an operating condition of the target chip, an operating environment model of the target chip, and an operating condition of the target chip, wherein the initialization parameters include impedance and voltage drop of the target chip, the first relationship is used to represent the relationship between the test time and the chip life of the target chip, the second relationship is used to represent the relationship between the test temperature, the chip life, and the impedance, the third relationship is used to represent the relationship between the test temperature, the chip life, and the voltage drop, and the fourth relationship is used to represent the relationship between the test temperature, the chip life, and the current error;

[0179] Step S12, determining target fitting parameters of the target chip based on the chip driving performance curve, the chip parameter curve, the chip life curve, the initialization parameters, the first relationship, the second relationship, the third relationship, the fourth relationship, the operating conditions of the target chip, the operating environment model of the target chip, and the operating conditions of the target chip, wherein the target fitting parameters are used to represent the impedance and voltage drop of the target chip over its entire life cycle;

[0180] Step S13: adjusting the driving parameters of the controller in the target vehicle based on the target fitting parameters, wherein the target vehicle is equipped with a target chip, and the controller is used to monitor and control the operating status of the engine and the transmission system.

[0181] Optionally, the specific examples in this embodiment may refer to the examples described in the above embodiments and optional implementation modes, and this embodiment will not be described in detail here.

[0182] The serial numbers of the above embodiments of the present invention are only for description and do not represent the advantages or disadvantages of the embodiments.

[0183] In the above embodiments of the present invention, the description of each embodiment has its own emphasis. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0184] In the several embodiments provided in this application, it should be understood that the disclosed technical content can be implemented in other ways. Among them, the device embodiments described above are only schematic. For example, the division of the units can be a logical function division. There may be other division methods in actual implementation. For example, multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some interfaces, indirect coupling or communication connection of units or modules, which can be electrical or other forms.

[0185] The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple units. Some or all of the units may be selected according to actual needs to achieve the purpose of the present embodiment.

[0186] In addition, each functional unit in each embodiment of the present invention may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit. The above-mentioned integrated unit may be implemented in the form of hardware or in the form of software functional units.

[0187] If the integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present invention, in essence, or the part that contributes to the prior art, or all or part of the technical solution can be embodied in the form of a software product, and the computer software product is stored in a storage medium, including a number of instructions for a computer device (which can be a personal computer, a server or a network device, etc.) to perform all or part of the steps of the method described in each embodiment of the present invention. The aforementioned storage medium includes: U disk, read-only memory (ROM), random access memory (RAM), mobile hard disk, disk or optical disk, etc., various media that can store program codes.

[0188] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principle of the present invention. These improvements and modifications should also be regarded as the scope of protection of the present invention.

Claims

1. A chip parameter fitting method, characterized in that: include: Controlling the target chip to enter a driving working state, wherein the driving working state is used to drive the target load to work; In the driving working state, parameters of the target chip are fitted based on the test environment to obtain a chip driving performance curve of the target chip, a chip parameter curve of the target chip, a chip life curve of the target chip, initialization parameters, a first relationship, a second relationship, a third relationship, a fourth relationship, an operating condition of the target chip, an operating environment model of the target chip, and an operating condition of the target chip, wherein the initialization parameters include an impedance and a voltage drop of the target chip, the first relationship is used to represent a relationship between a test time and a chip life of the target chip, the second relationship is used to represent a relationship between a test temperature, the chip life, and the impedance, the third relationship is used to represent a relationship between a test temperature, the chip life, and the voltage drop, and the fourth relationship is used to represent a relationship between a test temperature, the chip life, and a current error; Determining target fitting parameters of the target chip based on the chip driving performance curve, the chip parameter curve, the chip life curve, the initialization parameter, the first relationship, the second relationship, the third relationship, the fourth relationship, the operating condition of the target chip, the operating environment model of the target chip, and the operating condition of the target chip, wherein the target fitting parameters are used to represent the impedance and voltage drop of the target chip over its entire life cycle; The driving parameters of a controller in a target vehicle are adjusted based on the target fitting parameters, wherein the target vehicle is equipped with the target chip and the controller is used to monitor and control the operating status of an engine and a transmission system.

2. The method according to claim 1, characterized in that Performing parameter fitting on the target chip based on the test environment to obtain the chip driving performance curve of the target chip, the chip parameter curve of the target chip, and the chip life curve of the target chip includes: Under a first test environment, recording an ideal current waveform of the target chip based on a certification load box, wherein the first test environment includes a durability test environment and a full-life high-temperature test environment; Recording the actual current waveform of the target chip based on a current sensor; The chip driving performance curve, the chip parameter curve and the chip life curve are determined based on the ideal current waveform and the actual current waveform.

3. The method according to claim 1, characterized in that Performing parameter fitting on the target chip based on the test environment to obtain the initialization parameters includes: In a second test environment, the impedance and the voltage drop of the target chip are initialized within a preset time period based on chip production line equipment to obtain the initialization parameters, wherein the second test environment includes a normal temperature short-term test environment and a high temperature short-term test environment, and the preset time period is used to represent the time period between a first moment when the target chip starts working for the first time and a second moment after the target chip starts working.

4. The method according to claim 1, characterized in that Performing parameter fitting on the target chip based on the test environment to obtain the first relationship includes: Under a third test environment, a first relationship is determined based on a preset life function and a preset endurance acceleration function, wherein the third test environment includes a high temperature test environment and a temperature endurance test environment, the preset life function is used to derive the test time based on a preset acceleration factor and the life of the vehicle, and the preset endurance acceleration function is used to derive the chip life based on the preset acceleration factor and the test time.

5. The method according to claim 1, characterized in that: Performing parameter fitting on the target chip based on the test environment to obtain the second relationship, the third relationship, and the fourth relationship comprises: Under a fourth test environment, obtaining first impact information of a temperature impact factor and second impact information of a life impact factor, wherein the fourth test environment is used to represent any test environment in a design certification process; The second relationship, the third relationship, and the fourth relationship are determined based on the first influence information and the second influence information.

6. The method according to claim 1, characterized in that Performing parameter fitting on the target chip based on the test environment to obtain the operating condition of the target chip, the operating environment model of the target chip, and the operating condition of the target chip includes: Under a fifth test environment, determining an operating condition of the target chip based on an operating environment and an operating condition of the target vehicle; Constructing an operating environment model of the target chip based on the operating environment model of the target vehicle; An operating condition of the target chip is determined based on an operating condition of the target vehicle.

7. The method according to claim 6, characterized in that Determining the operating condition of the target chip based on the operating environment and operating condition of the target vehicle includes: Determining an operating state of a controller in the target vehicle based on an operating environment and operating conditions of the target vehicle; Determining the conduction state of the transistor in the target chip based on the operating state of the controller; The operating condition of the target chip is obtained based on the conduction state of the transistor.

8. The method according to claim 7, characterized in that Determining the operating condition of the target chip based on the operating condition of the target vehicle includes: determining an operating condition of the controller based on an operating condition of the target vehicle and a position of the controller; The operating condition of the target chip is determined based on the operating condition of the controller, the packaging form of the target chip, and the sealing condition of the controller.

9. The method according to any one of claims 1 to 8, characterized in that The target chip is electrically connected to the power tube, the power tube is electrically connected to the sampler, the sampler is electrically connected to the actuator, the power tube is used to control the current conduction state of the target chip, the sampler is used to collect the current output by the power tube, and the actuator is used to control the injection amount of the injection circuit. The method also includes: Acquiring a target current output by the power tube based on the sampler, wherein the target current is a current output by the target chip through the power tube; The actuator is controlled to adjust the fuel injection amount of the fuel injection circuit based on the target current, wherein the fuel injection circuit is used to inject fuel to the target vehicle.

10. A chip parameter fitting device, characterized in that: include: A control module, used to control the target chip to enter a driving working state, wherein the driving working state is used to drive the target load to work; A fitting module, used for performing parameter fitting on the target chip based on the test environment in the driving working state to obtain a chip driving performance curve of the target chip, a chip parameter curve of the target chip, a chip life curve of the target chip, an initialization parameter, a first relationship, a second relationship, a third relationship, a fourth relationship, an operating condition of the target chip, an operating environment model of the target chip and an operating condition of the target chip, wherein the initialization parameter includes an impedance and a voltage drop of the target chip, the first relationship is used to represent a relationship between a test time and a chip life of the target chip, the second relationship is used to represent a relationship between a test temperature, the chip life and the impedance, the third relationship is used to represent a relationship between a test temperature, the chip life and the voltage drop, and the fourth relationship is used to represent a relationship between a test temperature, the chip life and a current error; A determination module, configured to determine a target fitting parameter of the target chip based on the chip driving performance curve, the chip parameter curve, the chip life curve, the initialization parameter, the first relationship, the second relationship, the third relationship, the fourth relationship, the operating condition of the target chip, the operating environment model of the target chip, and the operating condition of the target chip, wherein the target fitting parameter is used to represent the impedance and voltage drop of the target chip over its entire life cycle; An adjustment module is used to adjust the driving parameters of a controller in a target vehicle based on the target fitting parameters, wherein the target vehicle is equipped with the target chip, and the controller is used to monitor and control the operating status of an engine and a transmission system.

11. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores a computer program, wherein the computer program is configured to execute the chip parameter fitting method described in any one of claims 1 to 9 when running on a computer or a processor.

12. An electronic device comprising a memory and a processor, characterized in that: The memory stores a computer program, and the processor is configured to run the computer program to execute the chip parameter fitting method described in any one of claims 1 to 9.

13. A computer program product, characterized in that The invention comprises a computer program, which implements the chip parameter fitting method described in any one of claims 1 to 9 when being executed by a processor.

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